JP3610749B2 - Semiconductor device package, manufacturing method thereof, and semiconductor device using the same - Google Patents

Semiconductor device package, manufacturing method thereof, and semiconductor device using the same Download PDF

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Publication number
JP3610749B2
JP3610749B2 JP33384197A JP33384197A JP3610749B2 JP 3610749 B2 JP3610749 B2 JP 3610749B2 JP 33384197 A JP33384197 A JP 33384197A JP 33384197 A JP33384197 A JP 33384197A JP 3610749 B2 JP3610749 B2 JP 3610749B2
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Prior art keywords
terminal
resin
semiconductor device
block body
package
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JP33384197A
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JPH11168168A (en
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伸 征矢野
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Fuji Electric Co Ltd
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Fuji Electric Device Technology Co Ltd
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Description

【０００１】
【発明の属する技術分野】
この発明は、パワートランジスタモジュールなどを対象とした半導体装置のパッケージ，およびその製作方法に関する。
【０００２】
【従来の技術】
まず、パワートランジスタモジュールを対象とした従来における半導体装置の組立構造を図３（ａ），（ｂ） に示す。図において、１は放熱用金属ベース板、２は金属ベース板１の上に搭載したパワー回路ブロック、３は制御回路ブロック、４が端子一体形のパッケージであり、パッケージ４を各回路ブロックを搭載した金属ベース板１の上に接着して図３（ｂ） の状態に組立て、さらにパッケージ４の内部に封止樹脂を充填した上で上蓋（図示せず）を装着して半導体装置の製品が完成する。
【０００３】
ここで、前記のパッケージ４は、樹脂成形品で作られた外囲樹脂ケース５の周縁部にパワー回路端子６，および制御信号用のコネクタ端子７を配備した端子一体形構造になる。また、制御信号用のコネクタ端子７は、図４（ａ） 〜（ｃ） で示すように、樹脂ブロック７ａに左右一列に並ぶ多数本のリードピン７ｂ，およびその左右両端に配したガイドピン（接続相手側のコネクタプラグを結合位置に案内するピン）７ｃをインサート成形して一体化した端子ブロック体として作られている。そして、このコネクタ端子７の樹脂ブロック体を外囲樹脂ケース１の周縁部に組み込むには、図３（ａ） のように別部品として製作した外囲樹脂ケース４の周縁凹所に嵌め込んで接着剤で固定するか、もしくは外囲樹脂ケース４を成形する際にその成形金型にパワー回路端子６と共に樹脂ブロック体をインサートして一体成形するようにしており、最近では後者の一体形成構造が多く採用されている。
【０００４】
【発明が解決しようとする課題】
前記構成のパッケージ４において、コネクタ端子７を製作するには、リードピン７ｂ，ガイドピン７ｃを樹脂ブロック７ａの成形金型にインサートした上で、金型に注型樹脂を注入して一体成形する。
ところで、前記のようなインサート成形法で一体成形したコネクタ端子７は、樹脂ブロック７ａを貫通して多数本の細いリードピン７ｂが引出してあることから、その成形工程で金型のピン引出し穴の隙間から注型樹脂が流れ出して固化し、リードピン７ｂの根元部分にバリが生成する。
【０００５】
そのために、コネクタ端子７の後処理工程として、樹脂ブロック体の成形後にバリ取り作業が必要となる。このバリ取り作業は通常はグラインダ，金ブラシなどを使った手作業で行っているが、リードピン７ａの配列ピッチは非常に小さく、かつリードピンは細線で曲がり易く、バリ取り作業中に工具がリードピン７ｂに当たってピンが折れ曲がるなど、製品の良品率が低下する。
【０００６】
この発明は上記の点に鑑みなされたものであり、その目的は前記課題を解決し、コネクタ端子の樹脂ブロック成形工程でバリの発生がなく、併せてコネクタ端子をパッケージの外囲樹脂ケースと一体堅固に組み込めるように改良した半導体装置のパッケージ，およびその製作方法を提供することにある。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、この発明によれば、外囲樹脂ケースの周縁部に主回路端子，および制御信号用のコネクタ端子を配した端子一体形構造になる半導体装置のパッケージであり、コネクタ端子が左右に並ぶリードピン，ガイドピンの相互間を樹脂ブロックで一体結合した端子ブロック体としてなり、該コネクタ端子の端子ブロック体を外囲樹脂ケースに一体結合して組立て構成したものにおいて、前記コネクタ端子の端子ブロック体がリードピン，ガイドピンを樹脂ブロックに形成したピン穴に圧入した構造になり、該端子ブロック体を外囲樹脂ケースに一体成形して組立て構成するものとする（請求項１）。
【０００８】
そして、前記構成においては、コネクタ端子の樹脂ブロックに対して、その背面側に背抜き凹所を形成するのがよい（請求項２）。
また、前記構成のパッケージの製作方法として、この発明によれば、ピン穴を鋳抜きして所定の形状に成形した樹脂ブロックのピン穴にリードピン，ガイドピンを圧入したコネクタ端子の端子ブロック体を作り、該端子ブロック体を外囲樹脂ケースの成形金型にインサートして一体成形するものとする（請求項３）。
【０００９】
前記構成によれば、コネクタ端子の樹脂ブロックを成形（一次成形）する際には、金型にリードピン，ガイドピンをインサートせずに、ピン穴を鋳抜きするのでこの部分にバリの発生がなく、したがって従来構成のようなバリ取りの後処理工程が不要で製作の工数が低減する。また、コネクタ端子の樹脂ブロックを成形する際に、その背面側に背抜き凹所を形成しておくことにより、コネクタ端子を外囲樹脂ケースの金型にインサートして一体成形（二次成形）する過程で、外囲樹脂ケースの注型樹脂が背抜き凹所の内部を充填するので、それだけ外囲樹脂ケースとコネクタ端子の結合力が増して堅固な一体構造となる。
【００１０】
【発明の実施の形態】
以下、この発明の実施の形態を図１，および図２に示す実施例に基づいて説明する。なお、実施例の図中で図３，図４に対応する同一部材には同じ符号が付してある。
まず、図１（ａ） 〜（ｄ） に制御信号用コネクタ端子の構造を示す。このコネクタ端子７の端子ブロック体は、基本的に図４と同様に樹脂ブロック７ａにリードピン７ｂ，ガイドピン７ｃを保持した構成になるものであるが、ここで、リードピン７ｂ，ガイドピン７ｃは、図１（ｄ） で示すように樹脂ブロック７ａを上下方向に貫通して形成したピン穴７ｄに圧入した構成になる。すなわち、樹脂ブロック７ａを成形する際には、後からリードピン７ｂ，ガイドピン７ｃを圧入するピン穴７ｄを鋳抜きして所定の形状に成形（一次成形）する。この場合に、樹脂ブロック７ａの背面側には背抜き凹所７ｅを形成しておくものとする。そして、樹脂ブロック７ａのピン穴７ｄにリードピン７ｂ，ガイドピン７ｃを圧入してコネクタ端子７を組立た後、その端子ブロック体を図２（ａ），（ｂ） に示す外囲樹脂ケース５の成形工程で、その金型にパワー回路端子６とともにインサートして一体生成してパッケージ４を作製する。この成形工程では、金型にインサートした樹脂ブロック７ａの背抜き凹所７ｅ（図１参照）に樹脂ケース５の注型樹脂が入り込んで一体に生成されるようになる。
【００１１】
前記のように、コネクタ端子７の樹脂ブロック７ａに対してリードピン７ｂ，ガイドピン７ｃをピン穴７ｄに圧入して組立てた構成により、図４に示した従来構造で問題となっていた樹脂ブロック７ａの圧入したピンの根元にバリの発生することがなく、したがってバリ取りの後処理工程が不要である。また、コネクタ端子７の樹脂ブロック７ａに背抜き凹所７ｅを形成しておくことにより、コネクタ端子７を外囲樹脂ケース５の金型にインサートして一体成形（二次成形）する際に、外囲樹脂ケースの注型樹脂が背抜き凹所７ｅに入り込んでこの部分を埋めるので、それだけ外囲樹脂ケース５とコネクタ端子７の結合力が増して堅固な一体構造が得られる。
【００１２】
【発明の効果】
以上述べたように、この発明によれば、パッケージの外囲樹脂ケースに組み込むコネクタ端子について、その樹脂ブロックにリードピン，ガイドピンを圧入して端子ブロック体を構成したことにより、ピンの根元にバリの発生がなく、これにより従来のインサート成形法によるコネクタ端子と較べて、バリ取りの後処理作業が不要になって製作工数が低減するほか、バリ取り作業に伴うリードピンの曲がりなどの欠陥が発生するおそれがなくなって製品の良品率が向上する。
【００１３】
また、コネクタ端子の樹脂ブロックを成形する際に、その背面側に背抜き凹所を形成しておくことにより、コネクタ端子を外囲樹脂ケースと一体にインサート成形する際に、外囲樹脂ケースの注型樹脂が背抜き凹所の内部を充填するので、それだけ外囲樹脂ケースとコネクタ端子の結合力が増して堅固なパッケージ構造が得られる。
【図面の簡単な説明】
【図１】この発明のパッケージに採用するコネクタ端子の構成図であり、（ａ） は上面図、（ｂ） は正面図、（ｃ） は背面図、（ｄ） は断面拡大図
【図２】図１のコネクタ端子と一体成形したパッケージの構成図であり、（ａ） は上面図、（ｂ） は（ａ） 図における矢視Ｘ−Ｘ断面図
【図３】パワートランジスタを対象とした半導体装置の従来における組立構成図であり、（ａ） は分解斜視図、（ｂ） はパッケージに回路ブロックを内蔵した組立状態の斜視図
【図４】図３のパッケージに採用したコネクタ端子の構成図であり、（ａ） は上面図、（ｂ） は正面図、（ｃ） は断面図
【符号の説明】
４ パッケージ
５ 外囲樹脂ケース
６ パワー回路端子
７ 制御信号用コネクタ端子
７ａ 樹脂ブロック
７ｂ リードピン
７ｃ ガイドピン
７ｄ ピン穴
７ｅ 背抜き凹所[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package of a semiconductor device intended for a power transistor module and the like, and a manufacturing method thereof.
[0002]
[Prior art]
First, an assembly structure of a conventional semiconductor device for a power transistor module is shown in FIGS. 3 (a) and 3 (b). In the figure, 1 is a heat dissipation metal base plate, 2 is a power circuit block mounted on the metal base plate 1, 3 is a control circuit block, 4 is a terminal integrated package, and the package 4 is mounted with each circuit block. 3B is assembled to the state shown in FIG. 3B, and the package 4 is filled with a sealing resin, and an upper lid (not shown) is mounted, so that a semiconductor device product is obtained. Complete.
[0003]
Here, the package 4 has a terminal-integrated structure in which the power circuit terminals 6 and the control signal connector terminals 7 are arranged on the periphery of the surrounding resin case 5 made of a resin molded product. Further, as shown in FIGS. 4A to 4C, the control signal connector terminal 7 includes a large number of lead pins 7b arranged in a line on the left and right sides of the resin block 7a, and guide pins (connections) on both left and right ends thereof. A terminal block body integrated with insert molding of a pin 7c for guiding the mating connector plug to the coupling position. In order to incorporate the resin block body of the connector terminal 7 into the peripheral portion of the outer resin case 1, it is fitted into the peripheral recess of the outer resin case 4 manufactured as a separate part as shown in FIG. When the outer resin case 4 is molded by fixing with an adhesive, the resin block body is inserted into the molding die together with the power circuit terminal 6 and integrally molded. Is often adopted.
[0004]
[Problems to be solved by the invention]
In order to manufacture the connector terminal 7 in the package 4 having the above-described configuration, the lead pin 7b and the guide pin 7c are inserted into the molding die of the resin block 7a, and then the casting resin is injected into the die and integrally molded.
By the way, the connector terminal 7 integrally molded by the insert molding method as described above has a large number of thin lead pins 7b drawn through the resin block 7a. The casting resin flows out from the resin and solidifies, and burrs are generated at the roots of the lead pins 7b.
[0005]
Therefore, a deburring operation is necessary after the molding of the resin block body as a post-processing step of the connector terminal 7. This deburring operation is normally performed manually using a grinder, a gold brush, etc., but the arrangement pitch of the lead pins 7a is very small, and the lead pins are easy to bend with a thin wire. The yield rate of the product decreases, for example, the pin bends when hit.
[0006]
The present invention has been made in view of the above points. The object of the present invention is to solve the above-described problems, and there is no generation of burrs in the resin block molding process of the connector terminal, and the connector terminal is integrated with the surrounding resin case of the package. An object of the present invention is to provide a package of a semiconductor device improved so that it can be firmly incorporated, and a manufacturing method thereof.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, there is provided a package of a semiconductor device having a terminal integrated structure in which a main circuit terminal and a connector terminal for a control signal are arranged on a peripheral portion of an outer resin case. A terminal block body in which terminals between the left and right lead pins and guide pins are integrally coupled by a resin block, and the terminal block body of the connector terminal is integrally coupled to an enclosing resin case. The terminal block body of the terminal has a structure in which a lead pin and a guide pin are press-fitted into a pin hole formed in the resin block, and the terminal block body is integrally formed and assembled in an outer resin case (claim 1). .
[0008]
And in the said structure, it is good to form a backside recess in the back side with respect to the resin block of a connector terminal (Claim 2).
In addition, according to the present invention as a method of manufacturing a package having the above-described structure, a terminal block body of a connector terminal in which a lead pin and a guide pin are press-fitted into a pin hole of a resin block formed by casting a pin hole into a predetermined shape. The terminal block body is inserted into a molding die of the surrounding resin case and integrally molded (claim 3).
[0009]
According to the above configuration, when the resin block of the connector terminal is molded (primary molding), the lead hole and the guide pin are not inserted into the mold, and the pin hole is cast, so that no burrs are generated at this portion. Therefore, the post-processing step of deburring as in the conventional configuration is unnecessary, and the number of manufacturing steps is reduced. Further, when forming the resin block of the connector terminal, a backside recess is formed on the back side thereof, so that the connector terminal is inserted into the outer resin case mold and integrally molded (secondary molding). In the process, the casting resin of the surrounding resin case fills the inside of the back recess, so that the coupling force between the surrounding resin case and the connector terminal is increased and a solid integrated structure is obtained.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below based on the examples shown in FIGS. In the drawings of the embodiment, the same members corresponding to those in FIGS. 3 and 4 are denoted by the same reference numerals.
First, FIGS. 1A to 1D show the structure of a control signal connector terminal. The terminal block body of the connector terminal 7 basically has a structure in which the lead pin 7b and the guide pin 7c are held on the resin block 7a as in FIG. 4, but here the lead pin 7b and the guide pin 7c are As shown in FIG. 1D, the resin block 7a is press-fitted into a pin hole 7d formed through the resin block 7a in the vertical direction. That is, when the resin block 7a is molded, the pin hole 7d into which the lead pin 7b and the guide pin 7c are press-fitted is cast out and molded into a predetermined shape (primary molding). In this case, a backside recess 7e is formed on the back side of the resin block 7a. Then, after the lead pins 7b and guide pins 7c are press-fitted into the pin holes 7d of the resin block 7a to assemble the connector terminals 7, the terminal block body of the outer resin case 5 shown in FIGS. In the molding process, the power circuit terminal 6 is inserted into the mold together with the die and integrally formed to produce the package 4. In this molding process, the casting resin of the resin case 5 enters into the backside recess 7e (see FIG. 1) of the resin block 7a inserted into the mold and is integrally generated.
[0011]
As described above, the resin block 7a, which has been a problem in the conventional structure shown in FIG. 4, is constructed by press-fitting the lead pin 7b and the guide pin 7c into the pin hole 7d with respect to the resin block 7a of the connector terminal 7. As a result, no burrs are generated at the base of the press-fitted pins, and therefore a post-processing step for deburring is unnecessary. Further, by forming a backside recess 7e in the resin block 7a of the connector terminal 7, when the connector terminal 7 is inserted into the mold of the outer resin case 5 and integrally molded (secondary molding), Since the casting resin of the surrounding resin case enters the backside recess 7e and fills this portion, the coupling force between the surrounding resin case 5 and the connector terminal 7 increases accordingly, and a solid integrated structure is obtained.
[0012]
【The invention's effect】
As described above, according to the present invention, the terminal block body is configured by press-fitting the lead pin and the guide pin into the resin block of the connector terminal incorporated in the outer resin case of the package. This eliminates the need for post-processing after deburring and reduces the number of manufacturing steps, as well as defects such as bending of lead pins associated with deburring. The percentage of non-defective products is improved.
[0013]
In addition, when molding the resin block of the connector terminal, a back-recessed recess is formed on the back side thereof, so that when the connector terminal is insert-molded integrally with the outer resin case, the outer resin case is injected. Since the mold resin fills the inside of the backside recess, the bonding force between the surrounding resin case and the connector terminal is increased, and a rigid package structure is obtained.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a connector terminal employed in a package of the present invention, (a) is a top view, (b) is a front view, (c) is a rear view, and (d) is an enlarged cross-sectional view. FIG. 3 is a structural view of a package integrally formed with the connector terminal of FIG. 1, wherein (a) is a top view, and (b) is a cross-sectional view taken along the line XX in FIG. 3 (a). FIG. 4 is a conventional assembly configuration diagram of a semiconductor device, where (a) is an exploded perspective view, and (b) is a perspective view of an assembly state in which a circuit block is built in the package. FIG. 4 is a configuration of a connector terminal employed in the package of FIG. (A) is a top view, (b) is a front view, and (c) is a cross-sectional view.
4 Package 5 Surrounding resin case 6 Power circuit terminal 7 Control signal connector terminal 7a Resin block 7b Lead pin 7c Guide pin 7d Pin hole 7e

Claims (4)

外囲樹脂ケースの周縁部に主回路端子，および制御信号用のコネクタ端子を配した端子一体形構造になる半導体装置であり、コネクタ端子が左右に並ぶリードピン，ガイドピンの相互間を樹脂ブロックで一体結合した端子ブロック体としてなり、該コネクタ端子の端子ブロック体を外囲樹脂ケースに一体結合して組立て構成したものにおいて、前記コネクタ端子の端子ブロック体がリードピン，ガイドピンを樹脂ブロックに形成したピン穴に圧入した構造になり、該端子ブロック体を外囲樹脂ケースに一体成形して組立てたことを特徴とする半導体装置のパッケージ。This is a semiconductor device with a terminal-integrated structure in which the main circuit terminals and control signal connector terminals are arranged on the periphery of the surrounding resin case. A resin block is used between the lead pins and guide pins where the connector terminals are arranged on the left and right. As a terminal block body integrally coupled, the terminal block body of the connector terminal is integrally coupled to an outer resin case and assembled, and the terminal block body of the connector terminal has a lead pin and a guide pin formed on a resin block. A package of a semiconductor device having a structure in which it is press-fitted into a pin hole, wherein the terminal block body is integrally molded in an outer resin case and assembled. 請求項１記載のパッケージにおいて、コネクタ端子の樹脂ブロックに対して、その背面側に背抜き凹所を形成したことを特徴とする半導体装置のパッケージ。2. The package of a semiconductor device according to claim 1, wherein a backside recess is formed on the back side of the resin block of the connector terminal. ピン穴を鋳抜きして所定の形状に成形した樹脂ブロックのピン穴にリードピン，ガイドピンを圧入したコネクタ端子の端子ブロック体を作り、該端子ブロック体を外囲樹脂ケースの成形金型にインサートして一体成形したことを特徴とする請求項１記載の半導体装置のパッケージの製作方法。Create a terminal block body of the connector terminal with lead pins and guide pins press-fitted into the pin hole of the resin block that has been molded into a predetermined shape by casting the pin hole, and insert the terminal block body into the molding die of the surrounding resin case 2. The method of manufacturing a package of a semiconductor device according to claim 1, wherein the package is integrally formed. 外囲樹脂ケースの周縁部に主回路端子，および制御信号用のコネクタ端子を配した端子一体形構造になる半導体装置において、In a semiconductor device having a terminal-integrated structure in which a main circuit terminal and a control signal connector terminal are arranged on the peripheral portion of the surrounding resin case,
コネクタ端子が左右に並ぶリードピン，ガイドピンの相互間を樹脂ブロックで一体結合した端子ブロック体としてなり、該コネクタ端子の端子ブロック体を外囲樹脂ケースに一体結合して組立て、前記コネクタ端子の端子ブロック体がリードピン，ガイドピンを樹脂ブロックに形成したピン穴に圧入した構造になり、該端子ブロック体を一体成形して組立てた外囲樹脂ケースを備えたことを特徴とする半導体装置。The terminal of the connector terminal is formed by integrally connecting the terminal block body of the connector terminal to the surrounding resin case as a terminal block body integrally joined with a resin block between the lead pins and the guide pins lined up on the left and right. A semiconductor device characterized in that a block body has a structure in which a lead pin and a guide pin are press-fitted into a pin hole formed in a resin block, and an outer resin case in which the terminal block body is integrally molded and assembled.
JP33384197A 1997-12-04 1997-12-04 Semiconductor device package, manufacturing method thereof, and semiconductor device using the same Expired - Lifetime JP3610749B2 (en)

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