JP3593509B2 - Mold temperature control device - Google Patents

Mold temperature control device Download PDF

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JP3593509B2
JP3593509B2 JP2001201287A JP2001201287A JP3593509B2 JP 3593509 B2 JP3593509 B2 JP 3593509B2 JP 2001201287 A JP2001201287 A JP 2001201287A JP 2001201287 A JP2001201287 A JP 2001201287A JP 3593509 B2 JP3593509 B2 JP 3593509B2
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mold
medium
temperature
cooling
coil
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JP2002079559A (en
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道也 柿沼
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道也 柿沼
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7368Heating or cooling of the mould combining a heating or cooling fluid and non-fluid means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7393Heating or cooling of the mould alternately heating and cooling

Description

【0001】
【発明の属する技術分野】
本発明は、金型を所定の成形温度にするための金型温度制御装置に係り、詳しくは、金型には媒体路と金型の温度を検出するセンサーを設け、金型の加温時には加熱源(ヒーター、電磁誘導加熱コイルなど)に電流を供給し、減温時には媒体路に冷却媒体を制御しながら供給し金型の成形温度を制御する金型温度制御装置に関するものである。
【0002】
【従来の技術】
金型を用いて所定の製品を成形する場合には、金型を所定の成形適温に保つことが必要であり、熱媒体油や冷却水等の媒体やヒーター等を用いて金型の温度調節を行っている。
従来の金型温度調節の方法には
(イ)加熱した媒体を金型内媒体路に供給し、金型の温度を制御するもの。(一般に使用されている媒体を用いた金型温度調節機)、
(ロ)冷却した媒体を金型媒体路に供給し、金型の温度を制御するもの。(チラー等)、
(ハ)カートリッジヒーターを金型に挿入し、金型を加温するもの。(ホットランナー形式等はこれにあらる)、
(ニ)平板状のヒーターを金型に装着し、金型を加温するもの。
(ホ)成形機付属の冷却水装置からの水を金型媒体路に供給して、金型の温度上昇を抑えるものがある。
【0003】
上記(イ)、(ロ)、(ハ)、(ニ)、(ホ)の温度調節方法の特徴は以下のとおりである。
(イ)の金型温度調節機は、金型媒体路に金型温度調節機の送、返媒用ホースを繋ぎ、温度を制御した媒体を供給して金型温度をコントロールするものであり、一般的に普及している金型温度調節機である。
この媒体使用の金型温度調節機は、媒体をヒーターで加熱し、冷却動作のときは媒体を水で冷却して金型に送る間接加熱、間接冷却であり、金型にヒーター等を装着して用いる直接加熱や、冷却水で減温する直接冷却より効率がわるい。
媒体に水を用いて長く使用しているとスケールが育成され付着する。熱交換率の低下、配管の閉塞等の原因になる。スケール噛み込みによるポンプインペラーの破損、配管内流路閉塞による水量ダウン等を起こすこともある。また、媒体収容容器にスラッジが溜まり、ときどき清掃の必要がある。
金型の交換で金型媒体路から送、返媒路を外すとき金型媒体路や金型温度調節機の送、返媒路ホースより残留媒体がこぼれ作業者の手に付着し、また成形機を汚し媒体が高温のときなどは危険であり、金型にヒーター等直接装着して用いる方法より効率がわるい。
【0004】
従来、金型温度制御に使われている金型加温用の金型温度調節機や、冷却用のチラー等は、媒体収容容器の中で媒体を加熱や冷却して、その媒体をポンプで金型に送り金型の温度を制御する。最低限、媒体収容容器とポンプを用いるため、ある程度の大きさをもつ機器になり、これが金型温度制御用機器として射出成形機とは別体として存在しているが、できれば簡単かつスリム化し成形機に組み込めればよい。
【0005】
また、金型温度調節機が金型を加温するときは、媒体をヒーターで加温し金型に送り出すが、金型への樹脂の注入により金型が金型温調機のセット温度より上昇しだしたときは、金型から戻ってくる媒体は金型を通過する祭に加温され媒体収容容器に戻ってくる。この媒体を水で冷却して再び金型に送り金型を成形適温に保っている。加温された媒体を冷却しながら金型温度調節機の媒体温度を保つことを、金型温度調節機の冷却動作と呼んでいる。この場合冷却動作をしないで、直接金型に冷却水などを供給できれば、エネルギーの無駄ずかいをなくし、不必要なコストを避けることができる、このタイプの金型温度調節機の改良点である。
【0006】
(ロ)は、成形サイクルをあげるために、金型を冷却し金型に注入された樹脂をはやく硬化させるときや、外観の「ヒケ」の防止などに用いる。(ハ)は、金型ランナー部にカートリッジヒーターを挿入し、ランナーを硬化させないランナーを省いたホットランナー形式や、金型の所望する位置にヒーターを挿入し必要な箇所の加温に用いることが出来る。
(ニ)は、金型に平板ヒーターを装着し金型加温用として使われる。(ホ)は、射出成形機に装着されている冷却水装置(ただの水口が集合したもの)から冷却水を金型に接続し、金型を減温するのみに用いる、成形加工中金型の温度上昇を抑えたいときに用いる、ごく普通の金型冷却方法である
【0007】
【発明が解決しようとする課題】
本発明は、かかる従来の金型温度制御方法に照らして新しい着想に基づいて創案されたものであって、第一の目的は金型温調機の冷却動作をなくすことである。第二の目的は金型を直接加熱、直接冷却することである。第三の目的は金型温度調節システムの簡素化にある。第四の目的は在来の金型を追加工することなく簡便な方法で金型温度制御が出来ることにある。
【0008】
【問題を解決するための手段】
かかる課題を達成するために本発明が採用した手段は、成形加工時に金型の温度を調節する金型温度制御装置において、該装置は、金型に設けた温度センサーと該金型の加熱源と、該金型に設けた金型媒体路に供給する媒体を制御する媒体制御バルブと、該温度センサーからの信号を受信して、該加熱源あるいは該媒体制御バルブを選択して電流を供給する制御部とを有し、金型の温度調節にあたり、加熱時には該加熱源に電流を供給し、冷却時には金型媒体路に冷却媒体を制御しながら供給して金型の温度を調節することを特徴とするものである。
【0009】
加熱時には金型に装着された加熱源(例えば、平板ヒーター、カートリッジヒーター等のヒーター、平板状電磁誘導加熱コイル、棒状電磁誘導加熱コイル等の電磁誘導加熱コイル)に電流や高周波電流を供給し、冷却時には加熱媒体路に冷却媒体を制御しながら供給し金型の温度を調節する。このように加熱時は加熱源が直接加熱、冷却時は水で直接冷却するので、エネルギーの無駄使いをすると共に不必要なコストが生じる冷却動作等を必要としない。該装置は媒体収容容器を持たなくてもよいので、機器のスリム化が可能であり制御部を成形機に取り付けてもよいし別体としてもよい。
【0010】
熱源は金型に設けてあり該金型媒体路は冷却媒体路であり、該加熱源は金型に形成された冷却媒体路内に設けてあり、該加熱源は取付部材を介して該金型に装着されており、該取付部材には冷却媒体路の一部を構成する貫設孔が貫設されており、好適には、該加熱源は媒体路内に延出する電磁誘導加熱コイルである。殆どの従来の金型に形成されている金型媒体路を利用して加熱源を装着することで、金型温度調節システムを簡素化することができ、在来の金型を追加工することなく簡便な方法で金型温度制御が出来る。また、電磁誘導加熱コイルの寸法や装着位置を選択することで、金型の所望部位を選択して加熱することが出来る。
【0011】
尚、前記の金型温度制御装置に、金型用媒体路装置を併設することも可能である該金型用媒体路装置については、特許2992934号に詳述されている。本発明に金型用媒体路装置を採用した一つの形態について、図4に基づいて説明する。送媒口31、少なくとも一つ以上の媒体入口(32a,32b)媒体排出口33を互いに流体連通してなる送媒用ブロックAと、返媒口34、少なくとも一つ以上の媒体出口(35a,35b)媒体排出口36を互いに流体連通してなる返媒用ブロックBと、該送媒口31と媒体路取付口13fとを流体連通連結する送媒路Cと、該返媒口34と金型媒体出口22cとを流体連通連結する返媒路Dとを有し、送媒用ブロックA返媒用ブロックBの少なくてもいずれか一方には圧縮空気入口38、39を設け、少なくとも一つの媒体入口(32a,32b)および媒体出口(35a,35b)を適宜選択した媒体源に連結するようにしたことを特徴とする金型用媒体路装置を併設してもよい。金型用媒体路装置を併設することにより金型媒体路の媒体抜きが自在に出来るので、金型交換のとき媒体がこぼれて機械やその周りを汚すことがなく作業環境が改善される。媒体の温度が高いときなどは、作業者の手に付着することがないので安心である。必要があれば他の金型温度調節機の媒体ホースを送媒用ブロックAの、媒体入口、返媒用ブロックBの、媒体出口に接続すれば、簡単に異なった媒体を供給し金型の温度調節をすることもできる。尚、金型媒体路装置を使用したものでは、金型と媒体路の接続にバルブ付きカプラ等を使用する必要がないので低い圧力で流量が充分流せる。メーカーのデータ‐では同じ流量を流す場合バルブ付きカプラとバルブのないカプラでは圧力差が約4倍にもなる。同じ圧力では流量は約倍という結果もある。
【0012】
【発明の実施の形態】
本発明の実施の形態を図面に基づいて説明する。図1は第1の実施の形態に係る金型温度制御装置のブロック図である。
成形金型22は通常、可動金型と固定金型とから構成されるが、便宜上、一つの金型のみを図示している。成形金型22には金型媒体路22aが貫設されており、金型媒体路22aの一端側が金型媒体入口22b,他端側が金型媒体出口22cとなっている。金型22に貫設された、媒体路22aの一端側の金型媒体入口22bには、金型用電磁誘導加熱コイル13Aが設けられている。金型用電磁誘導加熱コイル13Aの媒体路取付口13fと、他端側の金型媒体出口22cには冷却媒体源23が接続ホースを介して接続されている。
【0013】
金型22には金型の温度を検出する温度センサー12(センサーは非接触式でもよい)を設けてあり、その信号を受信する部分2が制御ボックス21に設けてある。金型22には加熱源(電磁誘導加熱コイル)13Aを装着してあり、それに高周波電流を供給する部分3が制御ボックス21に設けてある。金型媒体路22aに供給する冷却媒体は媒体制御バルブ15によって制御され、該バルブ15は金型22と冷却媒体源23を結ぶ媒体路の適切な部位に設けてある。制御ボックス21には、該バルブ15に電流を供給する部分5を有している。
【0014】
金型22に貫設されている金型媒体路22aの、一端の金型媒体入口22bには、金型用電磁誘導加熱コイル13Aのコイル部が金型媒体路の奥に向かって差し入れてある。コイル部と金型媒体路22aとは冷却水が流れるのに十分な隙間が確保されている。金型電磁誘導加熱コイル13Aは、金型媒体出口22c側に取り付けてもよい。又両端に取り付けてもよく、金型の加温のさせかたによる。
【0015】
図2に示すように、金型取付用電磁誘導加熱コイル13Aは、コイル線13cが巻かれたコイル芯13a、コイル保護の外枠13bと、コイル部を金型に取付けるための取付金具13dとからなる。コイル芯のコイルの巻き方は、取付金具13dは加熱の必要がないので、取付金具13dより少しはなれた箇所より、エナメル銅線(これに準ずる物でもよい)13cが密状に巻かれている。コイル部の長さは、金型媒体路22aの長さや金型22の加温のさせよう等、用途により、いろいろな長さのものがある。コイルの外側をコイルの保護のために外枠13bで覆ってある。コイル芯13a,外枠13bはPET等の樹脂で出来ている。外枠13bは非磁性ステンレス(18−8、18−10)材などを用いてもよい。金型に取付けるときは、金型媒体入口22bまたは金型媒体出口22cに取付ネジ13eで取付けるが複数の媒体路が設けてある場合は、必要な箇所に必要な個数取付ければよい。コイル部を金型媒体路に入れるように金型に取付けられた、金型用電磁誘導加熱コイル13Aのリード線に高周波電流を通電すると、コイルに近接した、媒体路に誘導される渦電流による金型自信の発熱を利用し金型を加温する。
尚、図2の例では、金型用誘導電磁加熱コイル13Aは、金型媒体入口22bに取り付けられ、加熱コイル13cのコイル線は金型媒体入口22bより入りコイル芯13aに巻かれ、金型媒体入口22bに戻ってきている。
別な方法としてコイル線13cは金型媒体入口22bより入り金型媒体出口22cに出るように、即ち金型媒体路22aを加熱コイルが貫通するようにしてもよい。
【0016】
金型用電磁誘導加熱コイル13Aの使用方法について説明する。通常成形金型22には、媒体路22aが貫設されており、その媒体路22aに冷却媒体源より冷却水を供給したり、金型温度調節機を用いて加熱媒体を供給したりして、金型22の温度を調節している場合、金型22の冷却と加熱に温度の異なった媒体を使用しているので、金型へ接続されている媒体路は繋ぎ変えをしている。
金型媒体路22aの媒体入口22b又は媒体出口22cなどに金型用電磁誘導加熱コイル13Aを設け、金型用電磁誘導加熱コイル13Aと制御ボックス21の高周波出力装置3とを接続する。金型用電磁誘導加熱コイル13Aの媒体路取付口13fと金型媒体出口22cに冷却媒体源23から媒体ホースを接続する。制御ボックス21の電源を入れ、制御ボックス21の温度調節器を成形適温にセットする。金型22が成形適温より低いときは、高周波電流が金型用電磁誘導加熱コイル13Aに流れ媒体路22a内に入れてあるコイルに高周波電流が流れる。コイルに近接した金型媒体路に誘導される渦電流による金型22自身の発熱を利用して金型22を加温する。成形適温になると電磁加熱コイル13Aに供給されている高周波電流は切れる。成形適温より上昇しだしたら、冷却媒体源23から冷却水が、金型用電磁誘導加熱コイル13Aの媒体取付口13fから金型媒体路22aに入り金型を冷却する。金型に装着されている媒体路の付け替えなしに金型の直接加温と直接冷却ができる。
【0017】
金型温度調節の方法を、媒体を用いた金型温度調節機の使用から、直接冷却水で冷却する方法に変更する場合には、金型に接続されている媒体路の繋ぎ変えをする。金型媒体入口22bや金型媒体出口22cに、金型用電磁加熱コイル13A設けたものについては、加温時には、高周波電流を制御ボックス21の高周波出力部3より供給し、金型22を加温する。冷却時には、冷却水を金型用電磁誘導加熱コイル13Aの媒体路取付口13fに接続されている冷却水ホースより、供給し金型22を冷却する。媒体路の交換なしに冷却水を供給できる。金型用電磁誘導加熱コイル13Aを装着しているものでは、媒体ホースを交換することなしに、電磁誘導加熱コイル13Aに高周波電流を流すことによる直接加熱、冷却水による直接冷却ができ、エネルギーの有効利用ができる。
【0018】
成形時の金型温度を測るために温度センサー12が、金型22に設けられたセンサー差込穴に挿入されている。温度センサー12は制御ボックス21のセンサー入力部2に接続されている。この温度センサー12からの信号で、制御ボックス21内の、温度調節器6が作動し設定温度より低ければ、金型用電磁誘導加熱コイル13Aが入力されて金型22を加温し、高ければ媒体制御バルブ15、が入力されて金型22を冷却し金型を設定温度に保つ。冷却媒体をコントロールする媒体制御バルブ15は金型媒体入口22bと冷却媒体源23との間の適切な部位に設けられており、制御ボックス21内のバルブ出力部5と接続されている。媒体制御バルブ15を設けなくともよいがその場合は冷却媒体源のバルブ23aの操作で制御する。冷却媒体源は成形機付属の冷却水装置でもよい。
金型の冷却時、媒体制御バルブ15は弁の「開」「開」によって冷却水を制御しているが、弁の「開」 「閉」でなく弁が可変的に動き、弁の動く量により流量を制御する弁(例えば、ボール弁や止弁、バタフライ弁など)で冷却水の量を調節し金型に冷却水を供給し金型の温度を調節してもよくこのこの弁が自動弁であってもよい。
【0019】
金型を成形機に取付けるために、金型には合ボルト用の穴があいている。金型に温度センサーを取付ける場合、この穴を利用して取付けると便利である。測温体には、白金測温抵抗体、熱電対、サーミスタ等あるがステンレスの保護管付きのものがよい。簡単には、ボルトや合ボルトに測温体の通過する穴をあけ、それを合ボルト穴に入れ測温体を通す、これでも金型の測温はできる。ばねやネジを用いて測温体を金型に密着させればなおよい。
小さな金型には、固定側に合ボルトの穴があいていない金型もある。このような場合には、測温体を、マグネットを利用して金型に密着させて金型温度を計測することもある。
とくに、可動金型側にセンサーや金型用電磁誘導加熱コイル、媒体路を取付ける場合、これらには補償導線、電線、ホースが付いている。可動金型側は往復運動をしているので、これらがマシンボディ、タイバー、シューター等成形機周辺に、接触して損傷し危険が生じないよう、成形機可動盤などに、媒体路等保持具を使用して、媒体路等を、成形機周辺に接触しないように、規制した状態で予め装着しておけば損傷するようなことはない。
【0020】
このような装置の運転方法について説明すると、金型に加温も、冷却もしない状態で成形作業を開始し、作業を続行した場合、金型に注入される樹脂の熱で時間の経過とともに金型温度は上昇するが、その成形品に求められる最適な金型温度に、イ、達しない場合、ロ、達する場合、ハ、金型の温度が高くなりすぎる場合がある。
【0021】
イの、注入される樹脂の熱だけでは金型温度が成形適温に達しない場合は、ヒーターか金型温度調節機を用いて加温のみをすればよい。
ロの、金型温度が成形適温に達する場合は、成形作業の開始から金型への樹脂の注入により金型温度が適温になるまで金型を加温すればよく、適温に達したら加熱装置を切ればよい。
ハの、金型温度が高くなりすぎる場合は、成形作業を開始し、金型への樹脂の注入により金型の温度が上昇し適温にならまでは金型を加温すればよく、その後は冷却すればよい。
【0022】
ハの場合、一般的には、金型に媒体液使用の金型温度調節機を繋ぎ金型を加温する、金型が成形適温になったら成形作業を開始する。金型に注入される樹脂の熱で時間の経過とともに金型温度が上昇し、成形適温より上がりだすと、金型温度調節機は冷却動作に入り金型を冷やし金型の温度上昇を抑えて適温を保つ。
【0023】
金型温度調節機が金型を加温するときは、媒体収容容器の媒体をヒーターで加温し金型に送り出す、金型温度が成形適温より上昇しだすと、金型から戻ってくる媒体は金型を通過する祭、加温され媒体収容容器に戻ってくる、この媒体を水で冷却して再び金型に送り金型を成形適温に保っている。加温された媒体を冷却しながら金型温度調節機の媒体温度を保つことを、金型温度調節機の冷却動作と呼んでいる。
この間接冷却を使用する冷却動作は、エネルギーの無駄が大きく不必要な動作である。別な方法としては、この加温装置を止めて、冷却水を直接金型に接続すれば一番効率がよい。
【0024】
金型に繋いだ金型温度調節機の、ホースを外して冷却水のホースに繋ぎ換えれば良いわけだが、成形適温になって成形作業が順調なとき、作業を中断して金型に繋がれている、金型温度調節機のホースと冷却水のホースとの繋ぎ変えは、まず手間がかかってめんどう、金型温度が下がる、成形機加熱筒内樹脂の滞留など、成形作業の条件が変わり、成形作業の調子を狂わせる要員が多いので、普通ならばホースの繋ぎ変えはしないで、金型温度調節機の冷却動作にたよる。
【0025】
図3に示すように、制御ボックス21にはセンサー入力部2、温度調節器6、高周波出力装置3、バルブ出力リレー5を持つ。金型22の媒体入口22bに金型用電磁誘導加熱コイル13Aを取付け、金型用電磁誘導加熱コイル13Aの媒体路取付口13fには冷却源からの媒体ホースが媒体制御バルブ15を介して接続されている。金型媒体出口22cは冷却媒体源23の返媒口に接続されている。金型の温度測定にはセンサー12が金型に設けてある。冷却媒体源とは成形機付属の冷却水装置でもよい。
【0026】
このような装置の運転方法について説明すると、金型に加温も、冷却もしない状態で成形作業を開始し作業を続行した場合、金型に注入される樹脂の熱で時間の経過とともに金型温度は上昇するが、その成形品に求められる最適な金型温度に、イ、達しない場合、ロ、達する場合、ハ、金型の温度が高くなりすぎる場合がある。
具体的には、金型に注入される樹脂の熱で時間の経過とともに金型温度が上昇し、水冷却で成形適温が保てる場合について考える。はじめの金型温度10℃成形適温50℃金型を外部から加熱も冷却もしない状態で成形を続行した場合、注入される樹脂の熱で金型温度は70℃になる。
【0027】
制御ボックス21の電源スイッチ7aを入れると、温度調節器6も「ON」になる。高周波入力スイッチ3a、バルブ出力スイッチ5aを「ON」にする。金型温度調節器6に金型の成形適温50℃をセットする。作業開始時の金型温度は、温度調節器6にセットした温度より低く10℃なので、温度調節器6より金型加温の信号が出力されリレー3Aが励磁される。高周波装置3が作動し、金型媒体入口22cに取付けてある金型用電磁誘導加熱コイル13Aに、高周波電流が出力されて、金型媒体路22aに入れてあるコイル部が励磁され、それに近接している媒体路周辺から加温されだす、しだいに金型温度が上昇する。金型22に装着されている温度センサー12が、制御ボックス21のセンサー入力部2に信号を送り、その信号を温度調節器6が感知し設定した温度に到達したら、高周波電流の出力はカットされる。成形金型22が成形適温50℃に達したら成形作業を開始する。このまま成形作業を続行すると金型温度は70℃まで上昇するが、成形金型22が成形適温50℃より上昇すると温度センサー12が温度調節器6に信号を送る。その信号で温度調節器6が作動しバルブ出力リレー5が「ON」する。媒体制御バルブ15が開き冷却媒体源23から冷却媒体が金型用電磁誘導加熱コイル13Aの媒体路取付口13fより、金型媒体路22aに流れ金型22を冷やし成形金型22の成形適温を保つ仕組みに成っている。
【0028】
温度調節器6は、加熱冷却制御のタイプを使用している、金型の温度調節の精度により、調節感度やデットバンドの値は決定すればよい。温度調節器も加熱や冷却が管理できるものであればよい。温度調節器6が金型用電磁誘導加熱コイル13Aや媒体制御バルブ15の制御を管理する、制御方法も、この場合は、「ON」「OFF」動作で説明したが、時分割比例動作で行ってもよく、この制御方法の方が、金型温度のゆれが少なく正確に金型温度の管理が出来るが、金型温度の必要精度によりどちらかを選べばよい。金型用電磁加熱コイル13Aへ高周波電流を送る方法として、この場合は、周波数が固定した高周波電流を用い、この高周波電流を「ON」「OFF」して金型温度を制御する(この場合は、ヒーターに流す電流を「ON」「OFF」して温度を制御するのと同じ感じ)が、高周波電流を細かく「ON」「OFF」して高周波の出力を決めてもよく、出力の増減は「ON」幅の調整より決める。(この方法は電磁誘導加熱の調理器にも用いられており、「ON」幅の設定により出力が決まる)
【0043】
【発明の効果】
以上説明してきた本発明は特に以下に述べるような効果を奏する。
▲1▼直接加熱、直接冷却を用いることで、冷却動作をなくした。エネルギーの有効利用ができる。
▲2▼媒体収容容器をなくし、金型用電磁誘導加熱コイルなどの採用により、金型温度制御システムの簡素化が出来る。成形機に組み込むことができる。
▲3▼従来の金型を追加工することなく、金型媒体路に金型用電磁誘導加熱コイル等を装着する簡便な方法で、金型温度制御ができる。
【図面の簡単な説明】
【図1】第一の実施の形態に係る金型温度制御装置のブロック図である。
【図2】金型用電磁誘導加熱コイルの詳細図である。
【図3】制御ボックスにおける制御回路図である。
【図4】第一の実施の形態に金型媒体路装置を設けたものを示すブロック図である。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mold temperature control device for setting a mold to a predetermined molding temperature, and more specifically, a mold is provided with a sensor for detecting a medium path and a temperature of the mold, and when the mold is heated, The present invention relates to a mold temperature control device that supplies a current to a heating source (a heater, an electromagnetic induction heating coil, etc.) and controls a molding temperature of a mold by supplying a cooling medium to a medium path while controlling the temperature when the temperature is decreased.
[0002]
[Prior art]
When molding a predetermined product using a mold, it is necessary to maintain the mold at a predetermined appropriate temperature for molding, and the temperature of the mold is adjusted using a medium such as a heating medium oil or cooling water, a heater, or the like. It is carried out.
The conventional method of controlling the temperature of the mold involves (a) supplying a heated medium to a medium passage in the mold to control the temperature of the mold. (Mold temperature controller using commonly used media),
(B) A device for supplying a cooled medium to a mold medium path to control the temperature of the mold. (Such as chillers),
(C) Heating the mold by inserting the cartridge heater into the mold. (Hot runner format etc. appear here),
(D) A flat heater is mounted on a mold to heat the mold.
(E) There is a type in which water from a cooling water device attached to a molding machine is supplied to a mold medium path to suppress a rise in the temperature of the mold.
[0003]
The features of the temperature control methods (a), (b), (c), (d), and (e) are as follows.
The mold temperature controller (a) controls the mold temperature by connecting a hose for feeding and returning the mold temperature controller to a mold medium path and supplying a medium whose temperature is controlled, This is a widely used mold temperature controller.
The mold temperature controller using this medium heats the medium with a heater, and in the cooling operation, it is indirect heating or indirect cooling, which cools the medium with water and sends it to the mold. Efficiency is lower than direct heating used for cooling or direct cooling using cooling water.
If the medium is used for a long time using water, the scale grows and adheres. This may cause a decrease in the heat exchange rate and blockage of the piping. The pump impeller may be damaged due to the scale biting, and the water flow may be reduced due to blockage of the flow path in the pipe. In addition, sludge accumulates in the medium container and needs to be cleaned occasionally.
When the mold is exchanged, the medium is sent from the mold medium path, and when the medium return path is removed, the mold medium path and the mold temperature controller are sent, and the residual medium spills from the medium return hose and adheres to the operator's hand, and is formed again. It is dangerous when the machine is soiled and the medium is hot, and the efficiency is lower than the method of directly mounting the heater or the like on the mold.
[0004]
Conventionally, a mold temperature controller for heating a mold, a chiller for cooling, and the like, which are used for mold temperature control, heat and cool a medium in a medium container, and pump the medium by a pump. Control the mold temperature by feeding the mold. At a minimum, the use of a medium storage container and a pump results in a device with a certain size, which exists as a mold temperature control device separately from the injection molding machine. It just needs to be built into the machine.
[0005]
Also, when the mold temperature controller warms the mold, the medium is heated by a heater and sent out to the mold, but the resin is injected into the mold, and the mold is heated from the set temperature of the mold temperature controller. When it starts to rise, the medium returning from the mold is heated during the festival passing through the mold and returns to the medium container. The medium is cooled with water and sent to the mold again to keep the mold at an appropriate molding temperature. Maintaining the medium temperature of the mold temperature controller while cooling the heated medium is called the cooling operation of the mold temperature controller. In this case, if cooling water or the like can be directly supplied to the mold without performing a cooling operation, it is an improvement of the mold temperature controller of this type that can eliminate waste of energy and avoid unnecessary costs. .
[0006]
The method (b) is used to cool the mold and quickly cure the resin injected into the mold to prevent a “sink” in the appearance in order to increase the molding cycle. (C) Inserting a cartridge heater into the mold runner part and omitting a runner that does not cure the runner, or using a heater in the desired position of the mold and heating it to the required location I can do it.
(D) is used for heating a mold by mounting a flat plate heater on the mold. (E) is a mold during molding, which is used only to reduce the temperature of the mold by connecting cooling water to the mold from a cooling water device (a collection of simple water ports) installed in the injection molding machine. it is used when it is desired to suppress the temperature rise of a ordinary mold cooling method.
[0007]
[Problems to be solved by the invention]
The present invention, which has been developed based on the new concept in light of the conventional mold temperature control method, the first objective is O and scores without cooling operation of the mold temperature controller. A second object is heated mold directly, a direct cooling to Rukoto. A third object is to simplify the mold temperature control system. A fourth object is to enable mold temperature control by a simple method without additional processing of a conventional mold.
[0008]
[Means to solve the problem]
Means adopted by the present invention to achieve this object is a mold temperature control device for adjusting the temperature of a mold during molding, wherein the device comprises a temperature sensor provided in the mold and a heating source for the mold. And a medium control valve for controlling a medium to be supplied to a mold medium passage provided in the mold, and receiving a signal from the temperature sensor to select the heating source or the medium control valve to supply current. And controlling the temperature of the mold by controlling the temperature of the mold by supplying an electric current to the heating source during heating, and by supplying a cooling medium to the mold medium path while controlling the temperature during cooling. It is characterized by the following.
[0009]
At the time of heating, a current or a high-frequency current is supplied to a heating source (for example, a heater such as a flat plate heater or a cartridge heater, an electromagnetic induction heating coil such as a flat electromagnetic induction heating coil or a rod-shaped electromagnetic induction heating coil) mounted on a mold, During cooling, the cooling medium is supplied to the heating medium path while being controlled, and the temperature of the mold is adjusted. As described above, since the heating source is directly heated at the time of heating and directly cooled with water at the time of cooling, there is no need for a cooling operation or the like that wastes energy and causes unnecessary cost. Since the device does not need to have a medium container, the device can be made slim, and the control unit may be attached to the molding machine or may be a separate unit.
[0010]
Pressurized heat source is provided with a mold, the mold media path is coolant passage, the pressurized heat source is provided with a cooling medium passage formed in the mold, the pressurized heat source via a mounting member The heating member is mounted on the mold, and the mounting member is provided with a through hole that forms a part of a cooling medium path. Preferably, the heating source is an electromagnetic induction extending into the medium path. It is a heating coil. By mounting a heating source using the mold medium path formed in most conventional molds, the mold temperature control system can be simplified, and conventional molds can be additionally processed. The mold temperature can be controlled by a simple and simple method. Also, by selecting the dimensions and mounting position of the electromagnetic induction heating coil, it is possible to select and heat a desired portion of the mold.
[0011]
It should be noted that a mold medium path device in which a mold medium path apparatus can be provided in addition to the mold temperature control apparatus is described in detail in Japanese Patent No. 2992934. One embodiment in which the mold medium path device is employed in the present invention will be described with reference to FIG . A medium-transmitting port A, a medium-transmitting block A in which at least one or more medium inlets (32a, 32b) and medium outlets 33 are in fluid communication with each other, a medium-returning port, and at least one or more medium outlets (35a, 35b) A medium return block B in which the medium discharge ports 36 are in fluid communication with each other, a medium supply path C in which the medium supply port 31 and the medium path attachment port 13f are fluidly connected, and And a return medium path D for fluid communication connection with the mold medium outlet 22c, and at least one of the return block B and the return block B is provided with a compressed air inlet 38, 39, and at least one A medium path device for a mold, characterized in that the medium inlets (32a, 32b) and the medium outlets (35a, 35b) are connected to an appropriately selected medium source, may be provided. By providing the mold medium path device in parallel, the medium can be freely removed from the mold medium path, so that when the mold is replaced, the medium is not spilled and the machine and its surroundings are not stained, thereby improving the working environment. When the temperature of the medium is high, it is safe because it does not adhere to the operator's hand. If necessary, another medium can be easily supplied by connecting the medium hose of another mold temperature controller to the medium sending block A, the medium inlet, the medium returning block B, and the medium outlet. You can also adjust the temperature. In the case of using the mold medium path device, it is not necessary to use a coupler with a valve or the like for connecting the mold and the medium path, so that a sufficient flow rate can be obtained at a low pressure. According to the manufacturer's data, when the same flow rate is used, the pressure difference between the coupler with valve and the coupler without valve is about 4 times. At the same pressure, the flow rate may be about double.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of the mold temperature control device according to the first embodiment.
The molding die 22 is usually composed of a movable die and a fixed die, but only one die is shown for convenience. A mold medium path 22a is formed through the molding die 22, and one end of the mold medium path 22a is a mold medium inlet 22b and the other end is a mold medium outlet 22c. A mold electromagnetic induction heating coil 13A is provided at a mold medium inlet 22b at one end of the medium path 22a penetrating the mold 22. A cooling medium source 23 is connected through a connection hose to the medium path mounting opening 13f of the electromagnetic induction heating coil 13A for the mold and the mold medium outlet 22c on the other end side.
[0013]
The mold 22 is provided with a temperature sensor 12 for detecting the temperature of the mold (the sensor may be a non-contact type), and a portion 2 for receiving the signal is provided in the control box 21. A heating source (electromagnetic induction heating coil) 13 </ b> A is mounted on the mold 22, and a portion 3 for supplying a high-frequency current thereto is provided in the control box 21. The cooling medium supplied to the mold medium path 22 a is controlled by a medium control valve 15, which is provided at an appropriate portion of a medium path connecting the mold 22 and the cooling medium source 23. The control box 21 has a portion 5 for supplying a current to the valve 15.
[0014]
The coil portion of the electromagnetic induction heating coil 13A for the mold is inserted into the mold medium inlet 22b at one end of the mold medium path 22a penetrating the mold 22 toward the back of the mold medium path. . A sufficient gap is provided between the coil portion and the mold medium path 22a for the cooling water to flow. The mold electromagnetic induction heating coil 13A may be attached to the mold medium outlet 22c side. It may be attached to both ends, depending on how the mold is heated.
[0015]
As shown in FIG. 2, the mold induction electromagnetic induction heating coil 13A includes a coil core 13a around which a coil wire 13c is wound, an outer frame 13b for protecting the coil, and a mounting bracket 13d for mounting the coil portion to the die. Consists of Regarding the winding method of the coil of the coil core, since the mounting bracket 13d does not need to be heated, the enameled copper wire (or a similar material) 13c is densely wound from a position slightly separated from the mounting bracket 13d. . The length of the coil portion has various lengths depending on the application such as the length of the mold medium path 22a and the purpose of heating the mold 22. The outside of the coil is covered with an outer frame 13b for protection of the coil. The coil core 13a and the outer frame 13b are made of a resin such as PET. The outer frame 13b may be made of non-magnetic stainless steel (18-8, 18-10). When attaching to a mold, the mold is attached to the mold medium inlet 22b or the mold medium outlet 22c with the attachment screw 13e. However, if a plurality of medium paths are provided, the necessary number may be attached to necessary places. When a high-frequency current is applied to the lead wire of the electromagnetic induction heating coil for mold 13A attached to the mold so that the coil portion is inserted into the mold medium path, an eddy current induced in the medium path close to the coil is generated. The mold is heated using the heat generated by the mold itself.
In the example shown in FIG. 2, the induction electromagnetic heating coil for mold 13A is attached to the mold medium inlet 22b, and the coil wire of the heating coil 13c is wound around the coil core 13a from the mold medium inlet 22b. It has returned to the medium inlet 22b.
As another method, the coil wire 13c may enter from the mold medium inlet 22b and exit to the mold medium outlet 22c, that is, the heating coil may pass through the mold medium path 22a.
[0016]
A method of using the electromagnetic induction heating coil for mold 13A will be described. A medium path 22a is provided through the normal molding die 22, and cooling water is supplied to the medium path 22a from a cooling medium source, or a heating medium is supplied using a mold temperature controller. When the temperature of the mold 22 is adjusted, a medium having a different temperature is used for cooling and heating the mold 22, so that the medium path connected to the mold is changed.
The electromagnetic induction heating coil for mold 13A is provided at the medium inlet 22b or the medium outlet 22c of the mold medium path 22a, and the high frequency output device 3 of the control box 21 is connected to the electromagnetic induction heating coil for mold 13A. A medium hose is connected from the cooling medium source 23 to the medium path mounting opening 13f and the mold medium outlet 22c of the electromagnetic induction heating coil 13A for the mold. The power of the control box 21 is turned on, and the temperature controller of the control box 21 is set to an appropriate molding temperature. When the temperature of the mold 22 is lower than the proper molding temperature, a high-frequency current flows through the electromagnetic induction heating coil 13A for the mold, and a high-frequency current flows through the coil placed in the medium path 22a. The mold 22 is heated by utilizing the heat generated by the mold 22 itself due to the eddy current induced in the mold medium path close to the coil. When the molding temperature becomes appropriate, the high-frequency current supplied to the electromagnetic heating coil 13A is cut off. When the temperature rises from the proper molding temperature, the cooling water from the cooling medium source 23 enters the mold medium passage 22a through the medium mounting opening 13f of the electromagnetic induction heating coil 13A for the mold to cool the mold. Direct heating and cooling of the mold can be performed without replacing the medium path mounted on the mold.
[0017]
When changing the method of mold temperature control from using a mold temperature controller using a medium to cooling directly with cooling water, the medium path connected to the mold is reconnected. In the case where the electromagnetic heating coil 13A for the mold is provided at the mold medium inlet 22b and the mold medium outlet 22c, a high-frequency current is supplied from the high-frequency output unit 3 of the control box 21 at the time of heating, and the mold 22 is heated. Warm up. During cooling, the mold 22 is cooled by supplying cooling water from a cooling water hose connected to the medium path mounting port 13f of the electromagnetic induction heating coil 13A for the mold. Cooling water can be supplied without replacing the medium path. In the case where the electromagnetic induction heating coil 13A for the mold is mounted, direct heating by flowing a high-frequency current to the electromagnetic induction heating coil 13A and direct cooling by cooling water can be performed without replacing the medium hose. It can be used effectively.
[0018]
A temperature sensor 12 is inserted into a sensor insertion hole provided in the mold 22 to measure a mold temperature during molding. The temperature sensor 12 is connected to the sensor input unit 2 of the control box 21. According to the signal from the temperature sensor 12, if the temperature controller 6 in the control box 21 is operated and the temperature is lower than the set temperature, the electromagnetic induction heating coil 13A for the mold is inputted to heat the mold 22; The medium control valve 15 is input to cool the mold 22 and keep the mold at a set temperature. The medium control valve 15 for controlling the cooling medium is provided at an appropriate position between the mold medium inlet 22b and the cooling medium source 23, and is connected to the valve output unit 5 in the control box 21. It is not necessary to provide the medium control valve 15, but in that case, control is performed by operating the valve 23a of the cooling medium source. The cooling medium source may be a cooling water device attached to the molding machine.
During cooling of the mold, the medium control valve 15 controls the cooling water by opening and closing the valve, but the valve moves variably instead of opening and closing the valve, and the amount of movement of the valve The amount of cooling water is adjusted by a valve (for example, a ball valve, a stop valve, a butterfly valve, etc.) that controls the flow rate, and the cooling water is supplied to the mold to adjust the temperature of the mold. It may be a valve.
[0019]
In order to attach the mold to the molding machine, the mold has holes for dowel bolts. When attaching the temperature sensor to the mold, it is convenient to use this hole to attach. The temperature measuring element includes a platinum resistance temperature measuring element, a thermocouple, a thermistor, and the like, and preferably has a stainless steel protection tube. In a simple way, a hole through which a temperature measuring element passes is made in a bolt or a mating bolt, and the hole is inserted into the mating bolt hole, and the temperature measuring body is passed through. It is even better if the temperature measuring element is brought into close contact with the mold using a spring or a screw.
Some small molds do not have dowel bolt holes on the fixed side. In such a case, the temperature of the mold may be measured by bringing the temperature measuring element into close contact with the mold using a magnet.
In particular, when a sensor, an electromagnetic induction heating coil for a mold, and a medium path are mounted on the movable mold side, these are provided with compensating wires, electric wires, and hoses. The movable mold side reciprocates, so that these parts may contact the machine body, tie bar, shooter, and other peripheral parts of the molding machine to prevent damage and danger. If the media path is used in advance to prevent the media path or the like from being brought into contact with the periphery of the molding machine, the medium path is not damaged.
[0020]
The operation of such an apparatus will be described. The molding operation is started without heating or cooling the mold, and when the operation is continued, the mold is injected with time by the heat of the resin injected into the mold. Although the mold temperature rises, the temperature of the mold may become too high if the optimum mold temperature required for the molded article is not reached.
[0021]
If the mold temperature does not reach the proper molding temperature only by the heat of the injected resin, only the heating may be performed using a heater or a mold temperature controller.
B) If the mold temperature reaches the optimum molding temperature, the mold should be heated until the mold temperature reaches the appropriate temperature by injecting resin into the mold from the start of the molding operation. You can cut off.
If the mold temperature is too high, start the molding operation and heat the mold until the temperature of the mold rises to the appropriate temperature by injecting the resin into the mold, and then It may be cooled.
[0022]
In the case of (c), generally, a mold temperature controller using a medium liquid is connected to the mold and the mold is heated. When the mold has reached an appropriate molding temperature, the molding operation is started. When the temperature of the mold rises over time due to the heat of the resin injected into the mold and begins to rise above the optimum temperature for molding, the mold temperature controller enters the cooling operation to cool the mold and suppress the temperature rise of the mold. Maintain proper temperature.
[0023]
When the mold temperature controller heats the mold, the medium in the medium storage container is heated by a heater and sent out to the mold. When the mold temperature starts to rise above the appropriate molding temperature, the medium that returns from the mold is After passing through the mold, the medium is heated and returned to the medium storage container. The medium is cooled with water and sent to the mold again to keep the mold at an appropriate temperature for molding. Maintaining the medium temperature of the mold temperature controller while cooling the heated medium is called cooling operation of the mold temperature controller.
The cooling operation using this indirect cooling is an unnecessary operation that wastes a large amount of energy. Alternatively, it is most efficient to stop the heating device and connect the cooling water directly to the mold.
[0024]
It is only necessary to remove the hose of the mold temperature controller connected to the mold and replace it with the cooling water hose, but when the molding temperature is appropriate and the molding work is going well, the work is interrupted and connected to the mold. Changing the connection between the hose of the mold temperature controller and the cooling water hose is time-consuming and troublesome, the mold temperature drops, the resin stays inside the molding machine heating cylinder. However, since there are many workers who upset the molding work, normally the hoses are not reconnected and the cooling operation of the mold temperature controller is used.
[0025]
As shown in FIG. 3, the control box 21 has a sensor input unit 2, a temperature controller 6, a high-frequency output device 3, and a valve output relay 5. The electromagnetic induction heating coil 13A for the mold is attached to the medium inlet 22b of the mold 22, and a medium hose from a cooling source is connected to the medium path mounting port 13f of the electromagnetic induction heating coil 13A for the mold via the medium control valve 15. Have been. The mold medium outlet 22c is connected to a medium return port of the cooling medium source 23. For measuring the temperature of the mold, a sensor 12 is provided on the mold. The cooling medium source may be a cooling water device attached to the molding machine.
[0026]
The operation method of such an apparatus will be described. If the molding operation is started without heating or cooling the mold and the operation is continued, the mold is heated with time by the heat of the resin injected into the mold. Although the temperature rises, the temperature of the mold may be too high if the temperature reaches the optimum mold temperature required for the molded article.
Specifically, consider a case in which the temperature of the mold rises over time due to the heat of the resin injected into the mold, and an appropriate molding temperature can be maintained by water cooling. Initial mold temperature 10 ° C. Molding appropriate temperature 50 ° C. If molding is continued without externally heating or cooling the mold, the temperature of the mold becomes 70 ° C. due to the heat of the injected resin.
[0027]
When the power switch 7a of the control box 21 is turned on, the temperature controller 6 is also turned "ON". The high-frequency input switch 3a and the valve output switch 5a are turned "ON". An appropriate mold forming temperature of 50 ° C. is set in the mold temperature controller 6. Since the mold temperature at the start of the operation is 10 ° C. lower than the temperature set in the temperature controller 6, a signal for heating the mold is output from the temperature controller 6, and the relay 3A is excited. The high-frequency device 3 is operated, and a high-frequency current is output to the electromagnetic induction heating coil 13A for the mold attached to the mold medium inlet 22c to excite the coil portion placed in the mold medium path 22a, and the vicinity thereof is excited. The temperature of the mold is gradually increased from the vicinity of the medium path. When the temperature sensor 12 attached to the mold 22 sends a signal to the sensor input section 2 of the control box 21 and the signal reaches the temperature set by the temperature controller 6, the output of the high-frequency current is cut off. You. When the forming temperature of the forming mold 22 reaches 50 ° C., the forming operation is started. If the molding operation is continued as it is, the temperature of the mold rises to 70 ° C., but when the temperature of the mold 22 rises above 50 ° C., the temperature sensor 12 sends a signal to the temperature controller 6. The signal causes the temperature controller 6 to operate and the valve output relay 5 to be turned "ON". The medium control valve 15 is opened, and the cooling medium from the cooling medium source 23 flows through the medium path mounting opening 13f of the electromagnetic induction heating coil 13A for the mold to the mold medium path 22a, cools the mold 22, and sets the optimum temperature of the molding mold 22. It is a mechanism to keep.
[0028]
The temperature controller 6 uses a heating / cooling control type, and the adjustment sensitivity and the value of the dead band may be determined according to the accuracy of the temperature control of the mold. The temperature controller may be any device that can control heating and cooling. The control method in which the temperature controller 6 manages the control of the electromagnetic induction heating coil 13A for the mold and the medium control valve 15 is also described in this case by the "ON" and "OFF" operations. Although this control method can accurately control the mold temperature with less fluctuation of the mold temperature, either one may be selected according to the required accuracy of the mold temperature. As a method of sending a high-frequency current to the mold electromagnetic heating coil 13A, in this case, a high-frequency current having a fixed frequency is used, and the high-frequency current is turned “ON” and “OFF” to control the mold temperature (in this case, It is the same feeling as controlling the temperature by turning on and off the current flowing through the heater), but the high-frequency current may be finely turned on and off to determine the high-frequency output. Determined by adjusting the "ON" width. (This method is also used for cookers with electromagnetic induction heating, and the output is determined by setting the "ON" width.)
[0043]
【The invention's effect】
The present invention described above has the following effects, in particular.
{Circle around (1)} The cooling operation is eliminated by using direct heating and direct cooling. Energy can be used effectively.
{Circle over (2)} The mold temperature control system can be simplified by eliminating the medium container and adopting an electromagnetic induction heating coil for the mold. It can be incorporated into a molding machine.
{Circle around (3)} The mold temperature can be controlled by a simple method of mounting an electromagnetic induction heating coil for the mold on the mold medium path without additional processing of the conventional mold.
[Brief description of the drawings]
FIG. 1 is a block diagram of a mold temperature control device according to a first embodiment.
FIG. 2 is a detailed view of an electromagnetic induction heating coil for a mold.
FIG. 3 is a control circuit diagram in a control box.
FIG. 4 is a block diagram showing a mold medium path device provided in the first embodiment.

Claims (3)

成形加工時に金型の温度を調節する金型温度制御装置において、該装置は、(a)金型に設けた温度センサーと、(b)該金型の加熱源と、(c)該金型に設けた金型媒体路に供給する冷却媒体を制御する媒体制御バルブと、(d)該温度センサーからの信号を受信して、該加熱源あるいは該媒体制御バルブを選択して電流を供給する制御部とを有し、該加熱源は、取付部材を介して該加熱源が該冷却媒体路内に設けられるように該金型に装着され、該取付部材には該金型媒体路の一部を構成する貫通孔が貫設されており、金型の温度調節にあたり、加熱時には該加熱源に電流を供給し、冷却時には金型媒体路に冷却媒体を制御しながら供給して金型の温度を調節することを特徴とする金型用温度制御装置。In a mold temperature control device for adjusting the temperature of a mold during molding, the device includes (a) a temperature sensor provided in the mold, (b) a heating source for the mold, and (c) the mold. And (d) receiving a signal from the temperature sensor and selecting the heating source or the medium control valve to supply a current. And a control unit, wherein the heating source is mounted on the mold via an attachment member such that the heating source is provided in the cooling medium passage. A through-hole forming a part is formed through the hole, and in controlling the temperature of the mold, a current is supplied to the heating source during heating, and a cooling medium is supplied to the mold medium path while being controlled during cooling to control the temperature of the mold. A temperature control device for a mold, wherein the temperature is adjusted. 請求項において、該加熱源は媒体路内に延出する電磁誘導加熱コイルであることを特徴とする金型用温度制御装置。2. The mold temperature control device according to claim 1, wherein the heating source is an electromagnetic induction heating coil extending into the medium path. 金型媒体路を有する金型に取り付けるための金型取付用電磁誘導加熱コイルであって、該金型取付用電磁誘導加熱コイルは、コイル部と該コイル部を該金型に取り付けるための取付金具とを有しており、該加熱コイルは、該コイル部が該金型の金型媒体路内に延出するようにして該取付金具を介して該金型に装着され、該取付部材には媒体ホースが接続される媒体路取付口が形成されており、加熱時には該コイル部に電流が供給されることで金型を加熱し、冷却時には該金型媒体路に冷却媒体を供給できるように構成された金型取付用電磁誘導加熱コイル。A mold mounting electromagnetic induction heating coil for mounting to a mold having a mold medium path, wherein the mold mounting electromagnetic induction heating coil includes a coil portion and a mounting for mounting the coil portion to the mold. The heating coil is mounted on the mold via the mounting bracket such that the coil portion extends into a die medium path of the die, and the heating coil is attached to the mounting member. Is formed with a medium path mounting port to which a medium hose is connected, so that a current is supplied to the coil section during heating to heat the mold, and a cooling medium can be supplied to the mold medium path during cooling. An electromagnetic induction heating coil for mounting a mold.
JP2001201287A 2000-07-07 2001-07-02 Mold temperature control device Expired - Fee Related JP3593509B2 (en)

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JP2006001130A (en) * 2004-06-17 2006-01-05 Matsui Mfg Co Mold temperature regulating system
EP1800829A1 (en) * 2005-12-22 2007-06-27 Thermal Cyclic Technologies TCTech i Stockholm AB Injection mould with induction heating means and method of injection moulding including an induction heating step.
EP1800823A1 (en) * 2005-12-22 2007-06-27 Thermal Cyclic Technologies TCTech i Stockholm AB Injection mould with variable coolant flow rate, the corresponding method and injection mould with a venting ring
DE602005012525D1 (en) * 2005-12-22 2009-03-12 Thermal Cyclic Technologies Tc Injection mold with induction heating and injection molding with an induction heating step
JP4784948B2 (en) * 2006-03-03 2011-10-05 モルド−イノ カンパニー リミテッド Non-contact high frequency induction heating device for plastic injection nozzle
JP2008049373A (en) * 2006-08-25 2008-03-06 Aisan Ind Co Ltd Die heating method, die, induction heater, and its power source device
TWI389600B (en) 2008-12-19 2013-03-11 私立中原大學 Coaxial cooling and rapid conductive coil construction and molds with cobalt cooling and rapid conductive coil construction
JP5243362B2 (en) * 2009-07-17 2013-07-24 株式会社ホンダロック Mold heating / cooling structure
DK2726263T3 (en) 2011-06-28 2018-05-07 Tctech Sweden Ab Device and method for heating a mold or tool
MX2018000041A (en) 2015-06-26 2018-03-12 Procter & Gamble Glossy container.

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