JP3538747B2 - Terminal fitting - Google Patents
Terminal fittingInfo
- Publication number
- JP3538747B2 JP3538747B2 JP01452598A JP1452598A JP3538747B2 JP 3538747 B2 JP3538747 B2 JP 3538747B2 JP 01452598 A JP01452598 A JP 01452598A JP 1452598 A JP1452598 A JP 1452598A JP 3538747 B2 JP3538747 B2 JP 3538747B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal fitting
- tin plating
- plating layer
- alloying
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板用コネクタ用
の端子金具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal fitting for a board connector.
【０００２】[0002]
【従来の技術】基板用コネクタに用いられる端子金具
は、黄銅からなり、回路基板に固定されるコネクタハウ
ジングに嵌通して取り付けられる。端子金具のコネクタ
ハウジングのフード部内に突出する一端部は相手側端子
金具との接触部とされているとともに、コネクタハウジ
ング外へ突出した他端部は回路基板への取付部とされて
いる。接触部は相手側端子金具と弾性的に接触し、取付
部は回路基板のスルーホールに貫通されて半田付けによ
り固定される。2. Description of the Related Art A terminal fitting used for a board connector is made of brass and is fitted and attached to a connector housing fixed to a circuit board. One end of the terminal fitting protruding into the hood portion of the connector housing is a contact part with the mating terminal fitting, and the other end protruding outside the connector housing is a mounting part to the circuit board. The contact portion elastically contacts the mating terminal fitting, and the mounting portion is penetrated through a through hole of the circuit board and fixed by soldering.
【０００３】かかる端子金具の表面には錫メッキが施さ
れている。端子金具同士の接触部では錫メッキにより端
子金具相互の密着性が高くなってその接触面間への酸素
の進入が規制され、その結果腐食が防止され、ひいては
接触信頼性が向上するのである。一方、半田付けされる
取付部では、錫メッキを施すことによってロウ材との親
和性が高まり、良好な半田付けが行われる。[0003] The surface of such terminal fittings is plated with tin. At the contact portions between the terminal fittings, tin plating enhances the adhesion between the terminal fittings, thereby restricting the entry of oxygen between the contact surfaces. As a result, corrosion is prevented, and the contact reliability is improved. On the other hand, in the mounting portion to be soldered, the affinity with the brazing material is increased by applying tin plating, and good soldering is performed.
【０００４】[0004]
【発明が解決しようとする課題】上記のように錫メッキ
を施す場合、その厚さをどのように設定するかが問題と
なる。即ち、メッキ厚を薄くすると、端子金具全体の厚
さも薄くなるので、端子金具間の弾性接触に起因する嵌
合・離脱抵抗が小さくなるため嵌合作業に有利である
が、その一方で半田付けに問題がでてくる。この半田付
けの問題について説明すると、錫メッキ層の内部では、
錫と端子金具の母材から析出した亜鉛との合金化現象が
母材に近い内側から表面側に向かって経時的に進行する
が、この合金化が錫メッキ層の表面まで達した状態で半
田付けを行うと、ロウ材とうまく親和できず、半田不良
を起こすという事情がある。したがって、端子金具をメ
ッキ処理済みの製品として出荷する際に、その良好な半
田付けが保証される期間を長くするためには、錫メッキ
厚を厚くすることが望ましい。このように従来では、端
子金具間の嵌合抵抗の低減と、錫メッキ処理後の良好な
半田付けが可能な期間の長期化とを両立させることが困
難であった。本願発明は上記事情に鑑みて創案され、端
子金具間の嵌合・離脱抵抗を低減し、且つ錫メッキ後の
良好な半田付けが可能な期間の長期化を図ることを目的
とするものである。When tin plating is performed as described above, how to set the thickness becomes a problem. That is, when the plating thickness is reduced, the overall thickness of the terminal fittings is also reduced, so that the fitting / removal resistance caused by the elastic contact between the terminal fittings is reduced, which is advantageous for the fitting work. The problem comes up. To explain this soldering problem, inside the tin plating layer,
The alloying phenomenon of tin and zinc precipitated from the base metal of the terminal fitting progresses with time from the inside close to the base metal toward the surface side. When soldering is performed, there is a situation that the soldering cannot be performed well and solder failure occurs. Therefore, when the terminal fitting is shipped as a plated product, it is desirable to increase the thickness of the tin plating in order to prolong the period in which good soldering is guaranteed. As described above, conventionally, it has been difficult to achieve both a reduction in the fitting resistance between the terminal fittings and a prolonged period in which good soldering after the tin plating process is possible. The present invention has been made in view of the above circumstances, and has as its object to reduce the fitting / removing resistance between terminal fittings and extend the period in which good soldering after tin plating is possible. .
【０００５】[0005]
【課題を解決するための手段】請求項１の発明は、黄銅
製の母材をその全領域に亘って取り囲むように錫メッキ
層を形成してなり、相手側端子金具と弾性的に接触する
接触部と、回路基板に半田付けにより取り付けられる取
付部とを備えた端子金具において、前記取付部と対応す
る領域に、前記錫と前記母材から析出した亜鉛との合金
化が前記錫メッキ層の表面に到達することを遅延させる
合金化到達遅延手段を設けた構成とした。According to a first aspect of the present invention, a tin plating layer is formed so as to surround a brass base material over the entire area thereof, and is in elastic contact with a mating terminal fitting. In a terminal fitting having a contact portion and an attachment portion attached to a circuit board by soldering, in a region corresponding to the attachment portion, alloying of the tin and zinc precipitated from the base material is performed by the tin plating layer. The structure is provided with alloying arrival delay means for delaying the arrival at the surface.
【０００６】請求項２の発明は、請求項１の発明におい
て、前記合金化到達遅延手段が、前記取付部の前記錫メ
ッキ層を前記接触部よりも厚くすることによって構成さ
れている。請求項３の発明は、請求項１又は請求項２の
発明において、前記合金化到達遅延手段が、前記錫メッ
キ層よりも内側に配され、前記母材から析出した亜鉛の
前記錫メッキ層への到達を遅延させる遅延層からなる構
成とした。According to a second aspect of the present invention, in the first aspect of the invention, the alloying arrival delay means is configured by making the tin plating layer of the mounting portion thicker than the contact portion. According to a third aspect of the present invention, in the first or second aspect of the invention, the alloying arrival delay means is disposed inside the tin plating layer, and zinc deposited from the base material is transferred to the tin plating layer. And a delay layer that delays the arrival of the light.
【０００７】[0007]
【発明の作用及び効果】＜請求項１の発明＞半田付けさ
れる取付部においては、合金化到達遅延手段により錫と
亜鉛との合金化が錫メッキ層の表面に到達するまでの期
間が長くなっているので、錫メッキ処理後の良好な半田
付けが可能な期間が長期化する。一方、相手側端子金具
との接触部では、合金化を遅らせるために錫メッキ層を
厚くする必要がないので、端子金具間の嵌合・離脱抵抗
を低減することが可能である。<Advantage and Effect of the Invention><Invention of claim 1> In the mounting portion to be soldered, the time until the alloying of tin and zinc reaches the surface of the tin plating layer by the alloying arrival delay means is long. Therefore, the period in which good soldering after tin plating is possible is prolonged. On the other hand, at the contact portion with the mating terminal fitting, it is not necessary to increase the thickness of the tin plating layer in order to delay alloying, so that the fitting / removing resistance between the terminal fittings can be reduced.
【０００８】＜請求項２の発明＞取付部では、錫メッキ
層が厚いので、錫と亜鉛の合金化が錫メッキ層の表面に
到達するのに要する時間が長くかかるようになり、これ
により、錫メッキ処理後の良好な半田付けが可能な期間
が長期化する。
＜請求項３の発明＞母材から析出した亜鉛が遅延層を通
過して錫メッキ層へ到達するのに時間がかかるので、錫
メッキ処理を行ってから合金化が開始されるまでの時
間、ひいては合金化が錫メッキ層の表面に達するまでに
要する時間が長くなる。<Invention of Claim 2> In the mounting portion, since the tin plating layer is thick, alloying of tin and zinc takes a long time to reach the surface of the tin plating layer. The period during which good soldering is possible after the tin plating process is lengthened. <Invention of claim 3> Since it takes time for the zinc deposited from the base material to pass through the delay layer and reach the tin plating layer, the time from when the tin plating process is performed to when the alloying is started, As a result, the time required for alloying to reach the surface of the tin plating layer increases.
【０００９】[0009]
【発明の実施の形態】＜実施形態１＞以下、本発明を具
体化した実施形態１を図１及び図２を参照して説明す
る。本実施形態の端子金具１０は全体として細長いＬ字
形をなし、コネクタＣに取り付けられる。また、このコ
ネクタＣは回路基板Ｐに固定される。コネクタＣは、壁
状本体部Ｃａと、この壁状本体部Ｃａから前方へ延出し
て相手側コネクタ（図示せず）との嵌合を行うフード部
Ｃｂとからなり、壁状本体部Ｃａには複数本の端子金具
１０が後方から圧入によって固定されている。端子金具
１０のフード部Ｃｂ内に突出する前端部は、相手側端子
金具（図示せず）との接触部１１とされており、この接
触部１１は、相手側端子金具の撓み接触片と弾性的に接
触する。一方、壁状本体部Ｃａから後方へ突出されて下
向きに直角に曲げられた下端部は、回路基板Ｐへの取付
部１２とされている。取付部１２は、回路基板Ｐのスル
ーホールＨに差し込まれて半田付けＭにより固定され
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 of the present invention will be described below with reference to FIGS. The terminal fitting 10 of the present embodiment has an elongated L-shape as a whole, and is attached to the connector C. The connector C is fixed to the circuit board P. The connector C includes a wall-shaped main body portion Ca and a hood portion Cb extending forward from the wall-shaped main body portion Ca to engage with a mating connector (not shown). Has a plurality of terminal fittings 10 fixed from behind by press-fitting. The front end of the terminal fitting 10 protruding into the hood portion Cb serves as a contact part 11 with a mating terminal fitting (not shown). Contact. On the other hand, a lower end portion protruding rearward from the wall-shaped main body portion Ca and bent downward at a right angle is a mounting portion 12 to the circuit board P. The mounting portion 12 is inserted into the through hole H of the circuit board P and fixed by soldering M.
【００１０】端子金具１０は、黄銅性の母材１３の表面
全体に亘って銅メッキによる下地層１４を形成し、さら
にその下地層１４の表面に錫メッキ層１５を形成して構
成されている。銅の下地層１４を形成することにより、
母材１３からの亜鉛の析出量が抑制される。また、錫メ
ッキ層１５は次の２つの機能を有する。即ち、相手側端
子金具との接触部１１では、錫メッキ層１５により相互
間の密着性が高くなってその接触面の間への酸素の進入
が規制され、その結果、腐食が防止され、ひいては接触
信頼性を向上させることができる。また、半田付けされ
る取付部１２では、錫メッキを施すことによってロウ材
との親和性が高まり、良好な半田付けＭが行われる。The terminal fitting 10 is formed by forming an underlayer 14 by copper plating over the entire surface of a brass base material 13, and further forming a tin plating layer 15 on the surface of the underlayer 14. . By forming the copper underlayer 14,
The amount of zinc deposited from the base material 13 is suppressed. Further, the tin plating layer 15 has the following two functions. That is, in the contact portion 11 with the counterpart terminal fitting, the tin plating layer 15 enhances the mutual adhesion and restricts the entry of oxygen between the contact surfaces. As a result, corrosion is prevented, and as a result, corrosion is prevented. The contact reliability can be improved. In addition, in the mounting portion 12 to be soldered, the affinity with the brazing material is increased by applying tin plating, and good soldering M is performed.
【００１１】かかる錫メッキ層１５の厚さについては、
相手側端子金具との接触部１１では比較的薄く、回路基
板Ｐへの取付部１２では比較的厚くしている。尚、この
取付部１２における錫メッキ層１５の厚さを厚くした手
段は、本発明の構成要件である合金化到達遅延手段１６
となっている。接触部１１と取付部１２とで厚さを異な
らせる方法としては、最初に端子金具１０の全体をメッ
キ用の電解質溶液中に浸漬させてメッキ処理を行い、そ
の後、厚くすべき取付部１２だけを再び電解質溶液中に
浸漬させてメッキ処理を行う。また、厚さを異ならせる
境界位置は、接触部１１と取付部１２の間であればいず
れの位置にしても良いが、コストを考慮すると、取付部
１２に近い位置にしてメッキ厚の薄い領域を広くするこ
とが好ましい。Regarding the thickness of the tin plating layer 15,
The contact portion 11 with the mating terminal fitting is relatively thin, and the attachment portion 12 to the circuit board P is relatively thick. Incidentally, the means for increasing the thickness of the tin plating layer 15 in the mounting portion 12 corresponds to the alloying arrival delay means 16 which is a constituent element of the present invention.
It has become. As a method of making the contact portion 11 and the attachment portion 12 different in thickness, first, the entire terminal fitting 10 is immersed in an electrolytic solution for plating to perform plating, and then only the attachment portion 12 to be thickened is provided. Is again immersed in an electrolyte solution to perform a plating process. The boundary position at which the thickness is varied may be any position as long as it is between the contact portion 11 and the mounting portion 12. Is preferably widened.
【００１２】このように接触部１１と取付部１２とで錫
メッキ層１５の厚さを相違させたことにより、次のよう
な効果が発揮される。即ち、取付部１２の厚さを薄くし
たことにより取付部１２の母材１３を含む全体の厚さ寸
法が小さくなり、その結果、相手側端子金具との弾性接
触に起因する摩擦抵抗が小さくなる。これにより、嵌合
及び離脱時の作業性が向上する。一方、取付部１２では
半田付けの問題を解消することができる。錫メッキ層１
５の内部では、そのメッキ層中の錫と母材１３から析出
した亜鉛との合金化現象が母材１３に近い内側から表面
側に向かって経時的に進行するが、この合金化が錫メッ
キ層１５の表面まで達した状態で半田付けを行うと、ロ
ウ材とうまく親和できず、半田不良を起こすという事情
がある。ところが、本実施形態では、錫メッキ層１５の
厚さを厚くしているので、合金化が開始してから錫メッ
キ層１５の表面に到達するまでの期間が長くかかり、ひ
いては半田付けを良好に行い得る期間を長く確保でき
る。これは、端子金具１０をメッキ処理済みの製品とし
て出荷した場合に、良好な半田付けが保証される期間が
長くなることを意味するため、製品としての評価が高い
ものとなる。By making the thickness of the tin plating layer 15 different between the contact portion 11 and the mounting portion 12 as described above, the following effects are exhibited. That is, since the thickness of the mounting portion 12 is reduced, the overall thickness of the mounting portion 12 including the base material 13 is reduced, and as a result, the frictional resistance due to the elastic contact with the mating terminal fitting is reduced. . Thereby, workability at the time of fitting and disengaging is improved. On the other hand, the mounting portion 12 can solve the problem of soldering. Tin plating layer 1
5, an alloying phenomenon of tin in the plating layer and zinc precipitated from the base material 13 progresses with time from the inside close to the base material 13 toward the surface side. If soldering is performed in a state where the solder reaches the surface of the layer 15, there is a situation that the soldering cannot be performed well and a solder defect occurs. However, in the present embodiment, since the thickness of the tin plating layer 15 is increased, it takes a long time from the start of alloying to reach the surface of the tin plating layer 15, and thus the soldering can be performed well. A longer possible period can be secured. This means that when the terminal fitting 10 is shipped as a plated product, the period during which good soldering is guaranteed becomes longer, so that the product is highly evaluated.
【００１３】このように、本実施形態では錫メッキ層１
５の厚さを接触部１１と取付部１２とで異ならせたこと
により、端子金具間の嵌合・離脱抵抗を低減すること
と、錫メッキ後の良好な半田付けが可能な期間の長期化
を図ることとの双方を両立させることができる効果があ
る。尚、錫メッキ処理を行ってから良好な半田付けが可
能とされる期間について試験を行ったところ、次のよう
な結果が得られた。試験では、本実施形態１の端子金具
１０の錫メッキの厚さを接触部１１では０．６μｍとす
るとともに取付部１２では１．０μｍとし、従来の端子
金具Ｔの錫メッキ層１５の厚さを全体に亘って均一に
０．６μｍとし、夫々、錫メッキ処理を行ってから良好
な半田付けが不能となるまでの期間を調べた。尚、下地
層１４の厚さは本実施形態の端子金具１０と従来の端子
金具Ｔの双方共に１．０μｍとした。その結果、本実施
形態の端子金具１０は従来の端子金具Ｔの２．５倍以上
の長い期間に亘って良好な半田付けを行うことができ
た。As described above, in this embodiment, the tin plating layer 1 is used.
5 has a different thickness between the contact portion 11 and the mounting portion 12, thereby reducing the fitting / removal resistance between the terminal fittings and extending the period in which good soldering after tin plating is possible. Has the effect of being able to achieve both. In addition, when the test was performed for a period in which good soldering was possible after performing the tin plating treatment, the following results were obtained. In the test, the thickness of the tin plating of the terminal fitting 10 of Embodiment 1 was set to 0.6 μm in the contact part 11 and 1.0 μm in the mounting part 12, and the thickness of the tin plating layer 15 of the conventional terminal fitting T was set. Was set to 0.6 μm uniformly over the whole, and the period from the time when the tin plating process was performed until the time when the good soldering became impossible was examined. The thickness of the underlayer 14 was set to 1.0 μm for both the terminal fitting 10 of the present embodiment and the conventional terminal fitting T. As a result, the terminal fitting 10 of the present embodiment was able to perform good soldering over a long period of 2.5 times or more of the conventional terminal fitting T.
【００１４】＜実施形態２＞次に、本発明を具体化した
実施形態２を図３を参照して説明する。本実施形態は、
合金化到達遅延手段を上記実施形態１とは異なる構成と
したものである。その他の構成については上記実施形態
１と同じであるため、同じ構成については、同一符号を
付し、構造、作用及び効果の説明は省略する。本実施形
態の端子金具２０では、合金化到達遅延手段２３として
取付部２２における下地層１４の表面にニッケルメッキ
による遅延層２４を形成しており、この遅延層２４の表
面に錫メッキ層１５が形成されている。この取付部２２
における錫メッキ層１５の厚さは、接触部２１の錫メッ
キ層１５と同じ寸法とされている。ニッケルメッキによ
る遅延層２４は、母材１３から析出した亜鉛の浸透を遅
らせる機能を有する。これにより、メッキ処理を行って
から亜鉛が錫メッキ層１５へ到達するのに長い時間を要
することになり、錫と亜鉛との合金化の開始が遅れる。
その結果、錫と亜鉛の合金化が錫メッキ層１５の表面へ
到達するのに要する期間が長くなるのである。Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment,
The alloying arrival delay means has a different configuration from the first embodiment. Other configurations are the same as those in the first embodiment, and thus the same configurations are denoted by the same reference numerals, and description of the structures, operations, and effects will be omitted. In the terminal fitting 20 of this embodiment, a delay layer 24 formed by nickel plating is formed on the surface of the base layer 14 in the mounting portion 22 as the alloying arrival delay means 23, and the tin plating layer 15 is formed on the surface of the delay layer 24. Is formed. This mounting part 22
The thickness of the tin plating layer 15 is the same as the thickness of the tin plating layer 15 of the contact portion 21. The delay layer 24 formed by nickel plating has a function of delaying penetration of zinc precipitated from the base material 13. As a result, it takes a long time for zinc to reach the tin plating layer 15 after performing the plating process, and the start of alloying of tin and zinc is delayed.
As a result, the time required for the alloying of tin and zinc to reach the surface of the tin plating layer 15 becomes longer.
【００１５】このように、母材１３と錫メッキ層１５と
の間に、亜鉛が錫メッキ層１５へ到達することを遅らせ
る遅延層２４を形成したので、メッキ処理後において半
田付けを良好に行い得る期間を長く確保することができ
る。尚、本実施形態２の端子金具２０についても、実施
形態１の端子金具１０と同様に錫メッキ処理を行ってか
ら良好な半田付けが可能とされる期間について試験を行
ったところ、次のような結果が得られた。試験では、本
実施形態２の端子金具２０の遅延層２４の厚さを０．５
μｍとし、錫メッキ層１５の厚さを接触部２１と取付部
２２の双方共に０．６μｍとし、図５に示す従来の端子
金具Ｔの錫メッキ１５の厚さを全体に亘って均一に０．
６μｍとし、夫々、錫メッキ処理を行ってから良好な半
田付けが不能となるまでの期間を調べた。尚、下地層１
４の厚さは本実施形態２の端子金具２０と従来の端子金
具Ｔの双方共に１．０μｍとした。その結果、本実施形
態２の端子金具２０は従来の端子金具Ｔの５倍以上の長
い期間に亘って良好な半田付けを行うことができた。As described above, since the delay layer 24 for delaying the arrival of zinc at the tin plating layer 15 is formed between the base material 13 and the tin plating layer 15, soldering can be performed well after plating. A long period of time can be secured. In addition, the terminal fitting 20 of the second embodiment was also subjected to a test for a period in which good soldering was possible after the tin plating process was performed in the same manner as the terminal fitting 10 of the first embodiment. Results were obtained. In the test, the thickness of the delay layer 24 of the terminal fitting 20 of the second embodiment was set to 0.5
μm, the thickness of the tin plating layer 15 is set to 0.6 μm for both the contact portion 21 and the mounting portion 22, and the thickness of the tin plating 15 of the conventional terminal fitting T shown in FIG. .
The thickness was set to 6 μm, and the period from when the tin plating process was performed until good soldering became impossible was examined. The underlayer 1
The thickness of No. 4 was 1.0 μm for both the terminal fitting 20 of Embodiment 2 and the conventional terminal fitting T. As a result, the terminal fitting 20 of the second embodiment was able to perform good soldering over a long period of time that was at least five times longer than that of the conventional terminal fitting T.
【００１６】＜実施形態３＞次に、本発明を具体化した
実施形態３を図４を参照して説明する。本実施形態は、
合金化到達遅延手段を上記実施形態１とは異なる構成と
したものである。その他の構成については上記実施形態
１と同じであるため、同じ構成については、同一符号を
付し、構造、作用及び効果の説明は省略する。本実施形
態３の端子金具３０では、合金化到達遅延手段３３とし
て、取付部３２における下地層１４の表面にニッケルメ
ッキによる遅延層３４を形成した上で、さらにこの遅延
層３４の表面に形成される錫メッキ層１５の厚さを接触
部３１よりも厚くする手段がとられている。ニッケルメ
ッキによる遅延層３４では、母材１３から析出した亜鉛
が錫メッキ層１５へ到達するのを遅らせ、錫メッキ層１
５では亜鉛との合金化が表面へ到達するまでの時間が長
くかかるようにしている。これにより、メッキ処理を行
ってから錫と亜鉛の合金化が錫メッキ層１５の表面へ到
達するのに長い期間がかかるようになっている。尚、本
実施形態３の端子金具３０についても、実施形態１の端
子金具１０と同様に錫メッキ処理を行ってから良好な半
田付けが可能とされる期間について試験を行ったとこ
ろ、次のような結果が得られた。試験では、本実施形態
３の端子金具３０の遅延層３４の厚さを０．５μｍと
し、錫メッキ層１５の厚さを接触部３１では０．６μｍ
とするとともに取付部３２では１．０μｍとし、図５に
示す従来の端子金具Ｔの錫メッキ層１５の厚さを全体に
亘って均一に０．６μｍとし、夫々、錫メッキ処理を行
ってから良好な半田付けが不能となるまでの期間を調べ
た。尚、下地層１４の厚さは本実施形態３の端子金具３
０と従来の端子金具Ｔの双方共に１．０μｍとした。そ
の結果、本実施形態３の端子金具３０は従来の端子金具
Ｔの５倍以上の長い期間に亘って良好な半田付けを行う
ことができた。Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment,
The alloying arrival delay means has a different configuration from the first embodiment. Other configurations are the same as those in the first embodiment, and thus the same configurations are denoted by the same reference numerals, and description of the structures, operations, and effects will be omitted. In the terminal fitting 30 of the third embodiment, as the alloying arrival delay means 33, a delay layer 34 formed by nickel plating is formed on the surface of the base layer 14 in the mounting portion 32, and further formed on the surface of the delay layer 34. The thickness of the tin plating layer 15 is made thicker than that of the contact portion 31. The nickel-deposited delay layer 34 delays the zinc deposited from the base material 13 from reaching the tin-plated layer 15 and causes the tin-plated layer 1
In No. 5, the time required for alloying with zinc to reach the surface is long. Thus, it takes a long time for the alloying of tin and zinc to reach the surface of the tin plating layer 15 after performing the plating process. In addition, the terminal fitting 30 of the third embodiment was also subjected to a test for a period in which good soldering was possible after the tin plating treatment was performed in the same manner as the terminal fitting 10 of the first embodiment. Results were obtained. In the test, the thickness of the delay layer 34 of the terminal fitting 30 of Embodiment 3 was set to 0.5 μm, and the thickness of the tin plating layer 15 was set to 0.6 μm in the contact portion 31.
And the thickness of the tin plating layer 15 of the conventional terminal fitting T shown in FIG. 5 is uniformly set to 0.6 μm throughout, and after the tin plating process, respectively. The period until good soldering became impossible was examined. The thickness of the base layer 14 is the same as that of the terminal fitting 3 of the third embodiment.
0 and the conventional terminal fitting T were both 1.0 μm. As a result, the terminal fitting 30 of the third embodiment was able to perform good soldering over a long period of time that was at least five times longer than that of the conventional terminal fitting T.
【００１７】＜他の実施形態＞本発明は上記記述及び図
面によって説明した実施形態に限定されるものではな
く、例えば次のような実施態様も本発明の技術的範囲に
含まれ、さらに、下記以外にも要旨を逸脱しない範囲内
で種々変更して実施することができる。
（１）上記実施形態１〜３では母材の表面に下地層を形
成したが、本発明によれば、下地層のない構成とするこ
ともできる。
（２）上記実施形態１〜３では下地層として銅を用いた
が、本発明によれば、銅に限らず、例えばニッケルなど
の他の金属としてもよい。<Other Embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings. For example, the following embodiments are also included in the technical scope of the present invention. In addition, various changes can be made without departing from the scope of the invention. (1) In the first to third embodiments, the base layer is formed on the surface of the base material. However, according to the present invention, a configuration without the base layer can be adopted. (2) In the first to third embodiments, copper is used as the base layer. However, according to the present invention, the metal is not limited to copper, and may be another metal such as nickel.
【００１８】（３）上記実施形態１では下地層を接触部
から取付部の全体に亘って均一の厚さとしたが、取付部
のみを厚くして、その厚くした分を本発明の遅延層とし
て機能させることもできる。この場合、下地層は銅でも
ニッケルでもよく、あるいは他の金属でもよい。
（４）上記実施形態２及び３では下地層と取付部の遅延
層とを別の金属としたが、下地層と遅延層を同一の金属
とすることもできる。
（５）上記実施形態２及び３では取付部に形成した遅延
層にニッケルを用いたが、本発明によれば、ニッケルに
限らず、例えば銅などの他の金属を用いることもでき
る。(3) In the first embodiment, the underlayer has a uniform thickness from the contact portion to the entire mounting portion. However, only the mounting portion is thickened, and the increased thickness is used as the delay layer of the present invention. It can also work. In this case, the underlayer may be copper or nickel, or another metal. (4) In the second and third embodiments, the base layer and the delay layer of the mounting portion are made of different metals. However, the base layer and the delay layer may be made of the same metal. (5) In the second and third embodiments, nickel is used for the delay layer formed in the mounting portion. However, according to the present invention, not only nickel but also other metals such as copper can be used.
【００１９】（６）上記各実施形態に示した下地層及び
メッキ層の厚さ寸法は試験のために設定したものに過ぎ
ず、目的・用途に応じて厚さを適切に設定し得ることは
言うまでもない。(6) The thickness dimensions of the underlayer and the plating layer shown in each of the above embodiments are merely set for testing, and it is not possible to appropriately set the thickness according to the purpose and application. Needless to say.
【図１】実施形態１の端子金具が適用されるコネクタ及
び回路基板の断面図FIG. 1 is a cross-sectional view of a connector and a circuit board to which a terminal fitting according to a first embodiment is applied.
【図２】実施形態１の端子金具の部分拡大図FIG. 2 is a partially enlarged view of a terminal fitting according to the first embodiment.
【図３】実施形態２の端子金具の部分拡大断面図FIG. 3 is a partially enlarged cross-sectional view of a terminal fitting according to a second embodiment.
【図４】実施形態３の端子金具の部分拡大断面図FIG. 4 is a partially enlarged cross-sectional view of a terminal fitting according to a third embodiment.
【図５】従来の端子金具の部分拡大断面図FIG. 5 is a partially enlarged sectional view of a conventional terminal fitting.
Ｐ…回路基板 １０…端子金具 １１…接触部 １２…取付部 １３…母材 １５…錫メッキ層 １６…合金化到達遅延手段 ２０，３０…端子金具 ２１，３１…接触部 ２２，３２…取付部 ２３，３３…合金化到達遅延手段 ２４，３４…遅延層 P… Circuit board 10 Terminal fittings 11 Contact part 12 Mounting part 13: Base material 15: Tin plating layer 16 ... Alloying arrival delay means 20, 30 ... terminal fittings 21, 31 ... contact part 22, 32 ... Mounting part 23, 33 ... means for delaying alloying arrival 24, 34 ... delay layer
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 4/02 H01R 9/09 H01R 13/03 H01R 23/68 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01R 4/02 H01R 9/09 H01R 13/03 H01R 23/68
Claims (3)
囲むように錫メッキ層を形成してなり、相手側端子金具
と弾性的に接触する接触部と、回路基板に半田付けによ
り取り付けられる取付部とを備えた端子金具において、 前記取付部と対応する領域に、前記錫と前記母材から析
出した亜鉛との合金化が前記錫メッキ層の表面に到達す
ることを遅延させる合金化到達遅延手段を設けたことを
特徴とする端子金具。A contact portion which is formed by forming a tin plating layer so as to surround a brass base material over the entire region thereof, and which elastically contacts a mating terminal fitting; Wherein the alloying of the tin and zinc precipitated from the base material reaches a surface of the tin plating layer in a region corresponding to the mounting portion. A terminal fitting provided with an alloying arrival delay means for delaying the alloying.
の前記錫メッキ層を前記接触部よりも厚くすることによ
って構成されていることを特徴とする請求項１記載の端
子金具。2. The terminal fitting according to claim 1, wherein the alloying arrival delay means is configured by making the tin plating layer of the mounting portion thicker than the contact portion.
キ層よりも内側に配され、前記母材から析出した亜鉛の
前記錫メッキ層への到達を遅延させる遅延層からなるこ
とを特徴とする請求項１又は請求項２記載の端子金具。3. The alloying arrival delay means comprises a delay layer disposed inside the tin plating layer and delaying zinc deposited from the base material to reach the tin plating layer. The terminal fitting according to claim 1 or 2, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01452598A JP3538747B2 (en) | 1998-01-27 | 1998-01-27 | Terminal fitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01452598A JP3538747B2 (en) | 1998-01-27 | 1998-01-27 | Terminal fitting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11214050A JPH11214050A (en) | 1999-08-06 |
| JP3538747B2 true JP3538747B2 (en) | 2004-06-14 |
Family
ID=11863547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01452598A Expired - Fee Related JP3538747B2 (en) | 1998-01-27 | 1998-01-27 | Terminal fitting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3538747B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7357681B2 (en) | 2004-07-30 | 2008-04-15 | Tyco Electronics Amp K.K. | Electrical connector |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4100987B2 (en) * | 2002-07-22 | 2008-06-11 | 株式会社リコー | Flexible flat cable connection structure, connection method, inkjet head, and inkjet printing apparatus |
| JP4560642B2 (en) * | 2004-04-19 | 2010-10-13 | Ｄｏｗａメタルテック株式会社 | Method for producing Sn-coated conductive material |
| WO2008072418A1 (en) * | 2006-12-13 | 2008-06-19 | Nikko Fuji Electronics Co., Ltd. | Male terminal, and its manufacturing method |
| JP5005420B2 (en) * | 2007-05-01 | 2012-08-22 | 株式会社神戸製鋼所 | Mating connector terminal and manufacturing method thereof |
| JP5229785B2 (en) * | 2007-12-28 | 2013-07-03 | 日本圧着端子製造株式会社 | Plating layer and method for forming the same |
| US8487183B2 (en) | 2008-05-19 | 2013-07-16 | Phoenix Contact Gmbh & Co. Kg | Contact unit and method for producing a contact unit |
| JP5079605B2 (en) * | 2008-06-30 | 2012-11-21 | 株式会社オートネットワーク技術研究所 | Crimp terminal, electric wire with terminal, and manufacturing method thereof |
| JP4632380B2 (en) * | 2009-06-04 | 2011-02-16 | 協和電線株式会社 | Plating film connection terminal member, connection terminal using the same, plating film material and multilayer plating material used therefor, and method for producing plating film connection terminal member |
| JP5595251B2 (en) * | 2010-12-10 | 2014-09-24 | 日本航空電子工業株式会社 | Contact, connector and manufacturing method thereof |
| JP2012190603A (en) * | 2011-03-09 | 2012-10-04 | Sumitomo Wiring Syst Ltd | Terminal fitting |
-
1998
- 1998-01-27 JP JP01452598A patent/JP3538747B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7357681B2 (en) | 2004-07-30 | 2008-04-15 | Tyco Electronics Amp K.K. | Electrical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11214050A (en) | 1999-08-06 |
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