JP3521268B2 - Method for manufacturing photovoltaic device - Google Patents
Method for manufacturing photovoltaic deviceInfo
- Publication number
- JP3521268B2 JP3521268B2 JP36033397A JP36033397A JP3521268B2 JP 3521268 B2 JP3521268 B2 JP 3521268B2 JP 36033397 A JP36033397 A JP 36033397A JP 36033397 A JP36033397 A JP 36033397A JP 3521268 B2 JP3521268 B2 JP 3521268B2
- Authority
- JP
- Japan
- Prior art keywords
- laser light
- electrode film
- irradiation
- photovoltaic device
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光照射により起電力
を発生する複数の光電変換素子を電気的に接続させた光
起電力装置の製造方法に関し、特に、裏面電極膜を各光
電変換素子毎にパターニングする方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a photovoltaic device in which a plurality of photoelectric conversion elements that generate electromotive force by light irradiation are electrically connected, and in particular, a back electrode film is provided for each photoelectric conversion element. Patterning method.
【０００２】[0002]
【従来の技術】透明電極膜，非晶質半導体層，裏面電極
膜をこの順に積層してなる複数の光電変換素子を、透光
性基板上にて電気的に直列接続させた構成をなす光起電
力装置の製品への実用化が急速に進んでいる。この場
合、隣合う光起電力素子間の透明電極膜と裏面電極膜と
を接続させることによって、電気的な直列接続を実現し
ている。2. Description of the Related Art A plurality of photoelectric conversion elements having a transparent electrode film, an amorphous semiconductor layer, and a back electrode film laminated in this order are electrically connected in series on a transparent substrate. Practical application of electromotive force devices to products is rapidly progressing. In this case, an electrical series connection is realized by connecting the transparent electrode film and the back surface electrode film between adjacent photovoltaic elements.
【０００３】このような光起電力装置を製造する場合に
は、成膜した透明電極膜，非晶質半導体層，裏面電極膜
を各光電変換素子毎に分離する工程（パターニング工
程）が必要である。これらの各膜の分離処理には、レー
ザ光照射を利用するレーザパターニングが広く用いられ
ており、レーザ光を所望部位に照射して、各膜を精度良
くパターニングすることが可能である。When manufacturing such a photovoltaic device, a step (patterning step) of separating the formed transparent electrode film, amorphous semiconductor layer, and back electrode film for each photoelectric conversion element is required. is there. Laser patterning using laser light irradiation is widely used for separating each of these films, and it is possible to precisely pattern each film by irradiating a desired portion with laser light.
【０００４】この種のレーザパターニング技術にあっ
て、裏面電極膜のパターニング法としてＹＡＧ（Yittri
um Aluminum garnet）の第２高調波（ＳＨＧ：Second H
armonic Generation）レーザ光を照射する方法が知られ
ている。In this type of laser patterning technique, a YAG (Yittri
um aluminum garnet) second harmonic (SHG: Second H
armonic Generation) A method of irradiating laser light is known.
【０００５】図３は、この従来の裏面電極膜のパターニ
ング法の実施状態を示す模式図である。図３において、
１は透光性基板であり、透光性基板１上には、透明電極
膜２、非晶質半導体層３が各光電変換素子毎に既に分離
された状態で形成されており、更に、分離された複数の
非晶質半導体層３に跨がる態様で裏面電極膜４が積層さ
れている。FIG. 3 is a schematic view showing an implementation state of the conventional patterning method for the back electrode film. In FIG.
Reference numeral 1 denotes a translucent substrate. On the translucent substrate 1, a transparent electrode film 2 and an amorphous semiconductor layer 3 are formed in a state where they are already separated for each photoelectric conversion element. The back surface electrode film 4 is laminated so as to extend over the plurality of amorphous semiconductor layers 3 thus formed.
【０００６】このような状態において、透光性基板１側
から裏面電極膜４の所望の分離領域に、ＹＡＧ第２高調
波レーザ光を照射し、照射領域の裏面電極膜４をその下
地の非晶質半導体層３と共に除去して、裏面電極膜４を
パターニングする。この結果、複数の光電変換素子が、
透明電極膜２及び裏面電極膜４を介して、電気的に直列
接続される。In such a state, YAG second harmonic laser light is radiated from the transparent substrate 1 side to the desired separation region of the back electrode film 4, and the back electrode film 4 in the irradiation region is covered with a non-underlying material. It is removed together with the crystalline semiconductor layer 3 and the back surface electrode film 4 is patterned. As a result, a plurality of photoelectric conversion elements,
It is electrically connected in series through the transparent electrode film 2 and the back electrode film 4.
【０００７】ところで、光電変換効率の向上を図るため
に、非晶質半導体層３の最適な膜厚の研究が進むにつれ
て、非晶質半導体層３の薄膜化が進んでいる。上述した
ＹＡＧ第２高調波レーザ光を用いるパターニング法で
は、レーザ光から得られるエネルギによって生じる非晶
質半導体層３内の水素の飛散力を利用して、裏面電極膜
４の除去を行っている。非晶質半導体層３が薄くなって
いくと、この水素の飛散力も低下するので、所望領域の
裏面電極膜４を完全に除去することができず、良好なパ
ターニング結果を得られないという問題がある。By the way, in order to improve the photoelectric conversion efficiency, as the research on the optimum film thickness of the amorphous semiconductor layer 3 progresses, the film thickness of the amorphous semiconductor layer 3 is becoming thinner. In the patterning method using the YAG second harmonic laser light described above, the back electrode film 4 is removed by utilizing the hydrogen scattering in the amorphous semiconductor layer 3 generated by the energy obtained from the laser light. . As the amorphous semiconductor layer 3 becomes thinner, the hydrogen scattering force also decreases, so that the back electrode film 4 in the desired region cannot be completely removed, and a good patterning result cannot be obtained. is there.
【０００８】このような非晶質半導体層３の薄膜化に伴
う裏面電極膜４のパターニング不良を解決するためのパ
ターニング法として、エキシマレーザ光を用いる方法が
知られている。図４は、このエキシマレーザ光照射によ
る裏面電極膜のパターニング法の実施状態を示す模式図
である。図４において、図３と同一部分には同一番号を
付している。A method using excimer laser light is known as a patterning method for solving the patterning failure of the back electrode film 4 due to the thinning of the amorphous semiconductor layer 3 as described above. FIG. 4 is a schematic view showing an implementation state of the patterning method of the back electrode film by the irradiation of the excimer laser light. 4, the same parts as those in FIG. 3 are designated by the same reference numerals.
【０００９】透明電極膜２、非晶質半導体層３が各光電
変換素子毎に既に分離され、複数の非晶質半導体層３に
跨がる態様で裏面電極膜４が積層されている状態におい
て、裏面電極膜４側から裏面電極膜４の所望の分離領域
に、シートビーム状のエキシマレーザ光（例えばＫｒ
Ｆ）を照射し、照射領域の裏面電極膜４を除去して、裏
面電極膜４をパターニングする。この結果、図３の例と
同様に、複数の光電変換素子が、透明電極膜２及び裏面
電極膜４を介して、電気的に直列接続される。In a state in which the transparent electrode film 2 and the amorphous semiconductor layer 3 are already separated for each photoelectric conversion element, and the back electrode film 4 is laminated so as to extend over a plurality of amorphous semiconductor layers 3. , A sheet-beam-shaped excimer laser beam (for example, Kr) from the back electrode film 4 side to a desired separation region of the back electrode film 4.
F) is irradiated, the back surface electrode film 4 in the irradiation region is removed, and the back surface electrode film 4 is patterned. As a result, as in the example of FIG. 3, the plurality of photoelectric conversion elements are electrically connected in series via the transparent electrode film 2 and the back electrode film 4.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、エキシ
マレーザ光を使用する方法は、パターニング対象の裏面
電極膜４の膜厚変化に対する制御が難しい。即ち、裏面
電極膜４が薄い場合には下地の非晶質半導体層３に熱影
響を与えてその特性劣化を引き起こし、一方、裏面電極
膜４が厚い場合に完全に除去できない。このように、エ
キシマレーザ光照射では、安定したパターニング結果を
得られ難いという問題がある。However, in the method using the excimer laser light, it is difficult to control the change in the film thickness of the back electrode film 4 to be patterned. That is, when the back electrode film 4 is thin, the underlying amorphous semiconductor layer 3 is thermally affected and its characteristics are deteriorated. On the other hand, when the back electrode film 4 is thick, it cannot be completely removed. As described above, the irradiation of excimer laser light has a problem that it is difficult to obtain a stable patterning result.
【００１１】本発明は斯かる事情に鑑みてなされたもの
であり、下地の非晶質半導体層が薄い場合にあっても、
裏面電極膜を各光電変換素子毎に精度良くパターニング
でき、光起電力装置の製造歩留りを向上することができ
る光起電力装置の製造方法を提供することを目的とす
る。The present invention has been made in view of such circumstances, and even when the underlying amorphous semiconductor layer is thin,
It is an object of the present invention to provide a method for manufacturing a photovoltaic device, which enables accurate patterning of the back electrode film for each photoelectric conversion element and improves the manufacturing yield of the photovoltaic device.
【００１２】[0012]
【課題を解決するための手段】請求項１に係る光起電力
装置の製造方法は、透光性基板の一主面上に透明電極
膜，非晶質半導体層，裏面電極膜をこの順に積層した複
数の光電変換素子を電気的に接続させた光起電力装置を
製造する方法において、隣合う光電変換素子の非晶質半
導体層上に跨がって形成された裏面電極膜を各光電変換
素子毎に分離する際に、前記一主面側から第１レーザ光
を照射して照射領域の前記裏面電極膜の一部を除去する
工程と、前記一主面側と反対側の他主面側から第２レー
ザ光を照射して照射領域の前記裏面電極膜の残存部を非
晶質半導体層と共に除去する工程とを有することを特徴
とする。A method of manufacturing a photovoltaic device according to claim 1, wherein a transparent electrode film, an amorphous semiconductor layer, and a back electrode film are laminated in this order on one main surface of a transparent substrate. In a method for manufacturing a photovoltaic device in which a plurality of photoelectric conversion elements are electrically connected, a back electrode film formed over an amorphous semiconductor layer of an adjacent photoelectric conversion element is converted into each photoelectric conversion element. A step of irradiating a first laser beam from the one main surface side to remove a part of the back electrode film in an irradiation region when separating the elements, and the other main surface opposite to the one main surface side. Irradiating the second laser beam from the side to remove the remaining part of the back electrode film in the irradiation region together with the amorphous semiconductor layer.
【００１３】請求項２に係る光起電力装置の製造方法
は、請求項１において、前記第２レーザ光の照射を、前
記第１レーザ光の照射領域内で行うことを特徴とする。According to a second aspect of the present invention, there is provided a method of manufacturing a photovoltaic device according to the first aspect, wherein the irradiation of the second laser light is performed within an irradiation region of the first laser light.
【００１４】請求項３に係る光起電力装置の製造方法
は、請求項１または２において、前記第２レーザ光の照
射幅が、前記第１レーザ光の照射幅より５０〜１００μ
ｍ狭いことを特徴とする。According to a third aspect of the present invention, in the method for manufacturing a photovoltaic device according to the first or second aspect, the irradiation width of the second laser light is 50 to 100 μm larger than the irradiation width of the first laser light.
It is characterized by being narrow.
【００１５】請求項４に係る光起電力装置の製造方法
は、請求項１〜３の何れかにおいて、前記第２レーザ光
の照射パワーが、前記第１レーザ光の照射パワーより大
きいことを特徴とする。A method for manufacturing a photovoltaic device according to a fourth aspect is the method according to any one of the first to third aspects, wherein the irradiation power of the second laser light is higher than the irradiation power of the first laser light. And
【００１６】請求項５に係る光起電力装置の製造方法
は、請求項１〜４の何れかにおいて、前記第１レーザ光
はエキシマレーザ光であり、前記第２レーザ光はＹＡＧ
第２高調波レーザ光であることを特徴とする。According to a fifth aspect of the present invention, in the method of manufacturing a photovoltaic device according to any one of the first to fourth aspects, the first laser light is excimer laser light and the second laser light is YAG.
It is a second harmonic laser beam.
【００１７】[0017]
【００１８】図１は、本発明の光起電力装置の製造方法
（裏面電極膜のパターニング）の概念を示す模式図であ
る。図１（ａ）は裏面電極膜のパターニング処理の前状
態を示しており、透光性基板１上には、透明電極膜２、
非晶質半導体層３が各光電変換素子毎に既に分離された
状態で形成されており、更に、分離された複数の非晶質
半導体層３に跨がる態様で裏面電極膜４が積層されてい
る。FIG. 1 is a schematic view showing the concept of the method for manufacturing a photovoltaic device (patterning of a back electrode film) according to the present invention. FIG. 1A shows a state before the patterning process of the back electrode film, in which the transparent electrode film 2,
The amorphous semiconductor layer 3 is formed in a state where it is already separated for each photoelectric conversion element, and the back surface electrode film 4 is laminated so as to extend over the plurality of separated amorphous semiconductor layers 3. ing.
【００１９】まず、裏面電極膜４側から、裏面電極膜４
の所望の領域に、第１レーザ光を照射する（図１
（ｂ））。この際、第１レーザ光の照射により、照射領
域の裏面電極膜４をすべて除去するのではなく、表面側
の部分のみを除去して、非晶質半導体層３側の一部の裏
面電極膜４は残存させておく。First, from the back electrode film 4 side, the back electrode film 4
Irradiate the desired region of the first laser beam (Fig. 1
(B)). At this time, by irradiating the first laser beam, the back surface electrode film 4 in the irradiation region is not entirely removed, but only the front surface portion is removed, and a part of the back surface electrode film on the amorphous semiconductor layer 3 side is removed. 4 is left.
【００２０】次に、第１レーザの照射領域内に、透光性
基板１側から、第２レーザ光を照射し、裏面電極膜４の
残存部を、その下地の非晶質半導体層３と共に除去する
（図１（ｃ））。Next, the second laser beam is irradiated from the transparent substrate 1 side into the irradiation region of the first laser, and the remaining portion of the back surface electrode film 4 together with the underlying amorphous semiconductor layer 3 are irradiated. It is removed (FIG. 1 (c)).
【００２１】上述したような裏面電極膜のパターニング
方法では、第１段階としての第１レーザ光照射工程にお
いて、裏面電極膜４の一部を残存させる程度の低パワー
のレーザ光を照射するので、下地層である非晶質半導体
層３に対する熱影響は全くなく、その特性劣化も起こら
ない。また、第２段階としての第２レーザ光照射工程に
おいて、裏面電極膜４の厚さが薄くなっているので、下
地層である非晶質半導体層３の厚さには関係なく、つま
りその厚さが薄くても、薄くなった裏面電極膜４の残存
部を除去するには十分の飛散力を発生することができ、
一部を残すことなく裏面電極膜４を完全に除去できる。
このようにして、本発明では、裏面電極膜の良好なパタ
ーニング結果を得ることが可能となる。In the method of patterning the back electrode film as described above, in the first laser beam irradiation step as the first step, the laser beam of low power enough to leave a part of the back electrode film 4 is irradiated, There is no thermal effect on the amorphous semiconductor layer 3 which is the base layer, and its characteristics are not deteriorated. Further, in the second laser light irradiation step as the second step, since the thickness of the back surface electrode film 4 is thin, it does not depend on the thickness of the amorphous semiconductor layer 3 as the base layer, that is, its thickness. Even if the thickness is thin, a sufficient scattering force can be generated to remove the remaining portion of the thinned back surface electrode film 4,
The back electrode film 4 can be completely removed without leaving a part.
Thus, according to the present invention, it is possible to obtain a good patterning result for the back electrode film.
【００２２】また、第２レーザ光の照射は、第１レーザ
光の照射領域内に対して行い、第２レーザ光の照射幅
を、第１レーザ光の照射幅より５０〜１００μｍ狭くす
る。第１段階としてのエキシマレーザ光照射工程の目的
は、裏面電極膜４の厚さを薄くするためであるが、第２
レーザ光による加工幅が第１レーザ光による加工幅と等
しい場合には、端部において裏面電極膜４の加工不良が
発生する可能性がある。この加工不良を防止するために
は、両加工幅の差を５０μｍ以上とすれば十分である。
但し、両加工幅の差が大きくなり過ぎると、光電変換に
関与しない無効領域が増えてしまうので、その差は１０
０μｍ以下が適当である。Further, the irradiation of the second laser light is performed within the irradiation area of the first laser light, and the irradiation width of the second laser light is made narrower by 50 to 100 μm than the irradiation width of the first laser light. The purpose of the excimer laser light irradiation step as the first step is to reduce the thickness of the back electrode film 4, but the second step
When the processing width by the laser light is equal to the processing width by the first laser light, a processing defect of the back surface electrode film 4 may occur at the end portion. In order to prevent this processing failure, it is sufficient that the difference between the two processing widths is 50 μm or more.
However, if the difference between the two processing widths becomes too large, the number of invalid regions that do not participate in photoelectric conversion increases, so the difference is 10
A size of 0 μm or less is suitable.
【００２３】なお、第１レーザ光としてエキシマレーザ
光、第２レーザ光としてＹＡＧ第２高調波レーザ光をそ
れぞれ使用することが良い。It is preferable to use excimer laser light as the first laser light and YAG second harmonic laser light as the second laser light.
【００２４】[0024]
【発明の実施の形態】以下、本発明をその実施の形態を
示す図面を参照して具体的に説明する。図２は、本発明
による裏面電極膜のパターニングの実施状態を示す模式
図である。図２において、５は被パターニング材を載置
するステージである。ステージ５の下方には、第１レー
ザ光としてのエキシマレーザ光（例えばＫｒＦレーザ
光）を出射するエキシマレーザ６、エキシマレーザ６か
らのレーザ光を収束するレンズ８、レンズ８からの収束
レーザ光を被パターニング材に向けて反射させるミラー
９が設けられている。また、ステージ５の上方には、第
２レーザ光としてのＹＡＧ第２高調波レーザ光を出射す
るＹＡＧ第２高調波レーザ７、ＹＡＧ第２高調波レーザ
７からのレーザ光を収束するレンズ８、レンズ８からの
収束レーザ光を被パターニング材に向けて反射させるミ
ラー９が設けられている。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to the drawings showing the embodiments thereof. FIG. 2 is a schematic view showing an implementation state of patterning of the back electrode film according to the present invention. In FIG. 2, 5 is a stage on which the material to be patterned is placed. Below the stage 5, there are an excimer laser 6 that emits excimer laser light (eg, KrF laser light) as the first laser light, a lens 8 that converges the laser light from the excimer laser 6, and a converged laser light from the lens 8. A mirror 9 for reflecting the material to be patterned is provided. Further, above the stage 5, a YAG second harmonic laser 7 that emits YAG second harmonic laser light as the second laser light, a lens 8 that converges the laser light from the YAG second harmonic laser 7, A mirror 9 for reflecting the convergent laser light from the lens 8 toward the material to be patterned is provided.
【００２５】そして、ステージ５に基板が上側になるよ
うに被パターニング材が載置されている。被パターニン
グ材は、透光性基板としてのガラス基板１上に、透明電
極膜としてのＳｎＯ2 膜２（厚さ：約１μｍ）、非晶質
半導体層としてのａ−Ｓｉ層３（厚さ：約０．３μｍ）
が各光電変換素子毎に分離された状態で形成され、更
に、分離された複数のａ−Ｓｉ層３に跨がる態様で裏面
電極膜としてのＡｇ膜４（厚さ：約０．４μｍ）が積層
されている構成をなす。Then, the material to be patterned is placed on the stage 5 so that the substrate is on the upper side. As the material to be patterned, a SnO 2 film 2 (thickness: about 1 μm) as a transparent electrode film and an a-Si layer 3 (thickness: as an amorphous semiconductor layer) on a glass substrate 1 as a transparent substrate. About 0.3 μm)
Is formed in a state of being separated for each photoelectric conversion element, and further, the Ag film 4 (thickness: about 0.4 μm) as a back electrode film in a state of straddling a plurality of separated a-Si layers 3. Are laminated.
【００２６】なお、上記ＳｎＯ2 膜２，ａ−Ｓｉ層３，
Ａｇ膜４は、例えば公知の熱ＣＶＤ法，プラズマＣＶＤ
法，スパッタ法によりそれぞれ形成する。また、ＳｎＯ
2 膜２，ａ−Ｓｉ層３のパターニングは、例えば公知の
レーザパターニング、ドライエッチングまたはウェット
エッチングにより行う。The SnO 2 film 2, the a-Si layer 3,
The Ag film 4 is formed, for example, by a known thermal CVD method or plasma CVD method.
Method and sputtering method. Also, SnO
The patterning of the two films 2 and the a-Si layer 3 is performed by, for example, known laser patterning, dry etching or wet etching.
【００２７】このような状態において、被パターニング
材の下方（Ａｇ膜４）側から、シートビーム状のエキシ
マレーザ光（ＫｒＦレーザ光，出力：１０ｍＷ，シート
長さ：１０ｃｍ，シートの幅：１００μｍ）を、Ａｇ膜
４の所望領域に照射する。この際、ａ−Ｓｉ層３に熱影
響が加わらないように、エキシマレーザ６の出力パワー
を低いレベルに設定する。このようにするためには、製
造する光起電力装置で予想される最も薄いＡｇ膜４に対
してそのＡｇ膜４を除去できる程度以下に、照射するエ
キシマレーザ光のパワーを設定すれば良い。よって、Ａ
ｇ膜４はその照射領域においてすべての部分が除去され
ることはなく、一部が除去されずに残存する。In such a state, a sheet beam-shaped excimer laser beam (KrF laser beam, output: 10 mW, sheet length: 10 cm, sheet width: 100 μm) from the lower side (Ag film 4) side of the material to be patterned. To a desired region of the Ag film 4. At this time, the output power of the excimer laser 6 is set to a low level so that the a-Si layer 3 is not thermally affected. In order to do so, the power of the excimer laser light to be irradiated may be set to the thinnest Ag film 4 expected in the photovoltaic device to be manufactured so that the Ag film 4 can be removed. Therefore, A
In the irradiation region, not all of the g film 4 is removed, and a part of the g film 4 remains without being removed.
【００２８】エキシマレーザ光照射にてパターニングす
る次の領域がエキシマレーザ光の照射位置に合致し、エ
キシマレーザ光照射にてパターニングされた先の領域が
ＹＡＧ第２高調波レーザ光の照射位置に合致するよう
に、ステージ５を移動させる。そして、次の領域にエキ
シマレーザ光を同様に照射すると同時に、エキシマレー
ザ光が既に照射されてＡｇ膜４が薄くなった先の領域
に、被パターニング材の上方（ガラス基板１）側から、
ＹＡＧ第２高調波レーザ光（波長：５３０ｎｍ，出力：
４０ｍＷ，スポットの幅：５０μｍ）を照射する。そう
すると、そのＹＡＧ第２高調波レーザ光のエネルギから
得られるエネルギによって生じるａ−Ｓｉ層３内の水素
の飛散力により、薄くなったＡｇ膜４（残存部）がその
下地のａ−Ｓｉ層３と共に除去される。この際、Ａｇ膜
４は十分に薄くなっているので（０．０５μｍ以下）、
ａ−Ｓｉ層３が薄くてその飛散力が小さい場合にも、そ
の下方のＡｇ膜４を完全に除去することが可能である。The next region to be patterned by the excimer laser light irradiation matches the irradiation position of the excimer laser light, and the previous region patterned by the excimer laser light irradiation matches the irradiation position of the YAG second harmonic laser light. The stage 5 is moved so that it does. Then, at the same time as irradiating the next region with the excimer laser light, at the same time as the region where the Ag film 4 has been thinned due to the excimer laser light being already irradiated, from above (the glass substrate 1) side of the material to be patterned,
YAG second harmonic laser light (wavelength: 530 nm, output:
Irradiation with 40 mW and spot width: 50 μm). Then, the thin Ag film 4 (remaining portion) forms the underlying a-Si layer 3 due to the scattering force of hydrogen in the a-Si layer 3 generated by the energy obtained from the energy of the YAG second harmonic laser light. Is removed with. At this time, since the Ag film 4 is sufficiently thin (0.05 μm or less),
Even when the a-Si layer 3 is thin and its scattering force is small, the Ag film 4 therebelow can be completely removed.
【００２９】以上のように、２種類のレーザ光によるパ
ターニングを同時に行うようにしたので、単一のレーザ
光を使用する両従来法（ＹＡＧ第２高調波レーザ光のみ
を照射する方法及びエキシマレーザ光のみを照射する方
法）に比べて、生産性が低下することはない。As described above, since the patterning with two kinds of laser light is performed at the same time, both conventional methods using a single laser light (method of irradiating only YAG second harmonic laser light and excimer laser light) are used. The productivity does not decrease as compared with the method of irradiating only light).
【００３０】また、本発明によるパターニング法を利用
して製造した光起電力装置の歩留りは９８％であり、両
従来法によるパターニング法を利用して製造した光起電
力装置の歩留りが８０％であることと比較して、本発明
により光起電力装置の歩留りを大幅に向上させることが
できる。Further, the yield of the photovoltaic device manufactured by using the patterning method according to the present invention is 98%, and the yield of the photovoltaic device manufactured by using the patterning method according to both conventional methods is 80%. In comparison with the above, the present invention can significantly improve the yield of photovoltaic devices.
【００３１】なお、上述した例では裏面電極膜の構成を
Ａｇの単層膜としたが、Ａｇ／Ｔｉ，Ａｇ／Ｔｉ／ＩＴ
Ｏ等の多層膜の構成である裏面電極膜に対しても、本発
明を同様に適用できることは勿論である。In the above-mentioned example, the back electrode film has a single-layer Ag film, but Ag / Ti and Ag / Ti / IT.
Needless to say, the present invention can be similarly applied to a back electrode film having a multi-layered structure such as O.
【００３２】[0032]
【発明の効果】以上詳述したように、本発明では、第１
レーザ光（エキシマレーザ光）を照射して裏面電極膜の
一部を除去し、次いで、第２レーザ光（ＹＡＧ第２高調
波レーザ光）を照射して裏面電極膜の残存部及び非晶質
半導体層を除去するようにしたので、非晶質半導体層が
薄い場合にあっても、裏面電極膜を精度良くパターニン
グでき、その結果、光起電力装置の製造歩留りを向上す
ることが可能となる。As described in detail above, according to the present invention, the first
Laser light (excimer laser light) is irradiated to remove a part of the back electrode film, and then second laser light (YAG second harmonic laser light) is irradiated to irradiate the remaining portion of the back electrode film and the amorphous material. Since the semiconductor layer is removed, the back electrode film can be accurately patterned even when the amorphous semiconductor layer is thin, and as a result, the manufacturing yield of the photovoltaic device can be improved. .
【００３３】また、第２レーザ光（ＹＡＧ第２高調波レ
ーザ光）の照射を第１レーザ光（エキシマレーザ光）の
照射領域内で行い、第２レーザ光（ＹＡＧ第２高調波レ
ーザ光）の照射幅を第１レーザ光（エキシマレーザ光）
の照射幅より５０〜１００μｍ狭くするようにしたの
で、裏面電極膜の加工不良が発生せず、発電の無効領域
の増加を抑制できる。Further, the irradiation of the second laser light (YAG second harmonic laser light) is performed within the irradiation region of the first laser light (excimer laser light), and the second laser light (YAG second harmonic laser light) is emitted. Irradiation width of the first laser light (excimer laser light)
Since the irradiation width is set to be 50 to 100 μm narrower than the irradiation width, the back electrode film is not processed defectively and the increase of the ineffective region of power generation can be suppressed.
【図１】本発明の光起電力装置の製造方法の概念を示す
模式図である。FIG. 1 is a schematic view showing the concept of a method for manufacturing a photovoltaic device of the present invention.
【図２】本発明による裏面電極膜のパターニングの実施
状態を示す模式図である。FIG. 2 is a schematic view showing an implementation state of patterning of a back electrode film according to the present invention.
【図３】従来の裏面電極膜のパターニングの一例の実施
状態を示す模式図である。FIG. 3 is a schematic diagram showing an implementation state of an example of conventional patterning of a back electrode film.
【図４】従来の裏面電極膜のパターニングの他の例の実
施状態を示す模式図である。FIG. 4 is a schematic view showing an implementation state of another example of conventional patterning of a back electrode film.
１ 透光性基板（ガラス基板） ２ 透明電極膜（ＳｎＯ2 膜） ３ 非晶質半導体層（ａ−Ｓｉ層） ４ 裏面電極膜（Ａｇ膜） ５ ステージ ６ エキシマレーザ ７ ＹＡＧ第２高調波レーザ1 translucent substrate (glass substrate) 2 transparent electrode film (SnO 2 film) 3 amorphous semiconductor layer (a-Si layer) 4 back electrode film (Ag film) 5 stage 6 excimer laser 7 YAG second harmonic laser
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平５−55612（ＪＰ，Ａ) 特開 平３−194975（ＪＰ，Ａ) 特開 平９−135036（ＪＰ，Ａ) 特開 昭61−6828（ＪＰ，Ａ) 特開 昭59−172274（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 31/04 - 31/078 ─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-5-55612 (JP, A) JP-A-3-194975 (JP, A) JP-A-9-135036 (JP, A) JP-A-61- 6828 (JP, A) JP 59-172274 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 31/04-31/078
Claims (5)
晶質半導体層，裏面電極膜をこの順に積層した複数の光
電変換素子を電気的に接続させた光起電力装置を製造す
る方法において、隣合う光電変換素子の非晶質半導体層
上に跨がって形成された裏面電極膜を各光電変換素子毎
に分離する際に、前記一主面側から第１レーザ光を照射
して照射領域の前記裏面電極膜の一部を除去する工程
と、前記一主面側と反対側の他主面側から第２レーザ光
を照射して照射領域の前記裏面電極膜の残存部を非晶質
半導体層と共に除去する工程とを有することを特徴とす
る光起電力装置の製造方法。1. A photovoltaic device in which a plurality of photoelectric conversion elements each having a transparent electrode film, an amorphous semiconductor layer, and a back electrode film laminated in this order on one main surface of a transparent substrate are electrically connected. In the manufacturing method, when separating the back electrode film formed over the amorphous semiconductor layers of the adjacent photoelectric conversion elements for each photoelectric conversion element, the first laser beam is applied from the one main surface side. And removing a part of the back surface electrode film in the irradiation area, and irradiating a second laser beam from the other main surface side opposite to the one main surface side to the back surface electrode film in the irradiation area. And a step of removing the remaining portion together with the amorphous semiconductor layer, the method for manufacturing a photovoltaic device.
ーザ光の照射領域内で行う請求項１に記載の光起電力装
置の製造方法。2. The method for manufacturing a photovoltaic device according to claim 1, wherein the irradiation of the second laser light is performed within an irradiation region of the first laser light.
レーザ光の照射幅より５０〜１００μｍ狭い請求項１ま
たは２に記載の光起電力装置の製造方法。3. The irradiation width of the second laser light is the first width.
The method for manufacturing a photovoltaic device according to claim 1, wherein the irradiation width of the laser light is narrower by 50 to 100 μm.
第１レーザ光の照射パワーより大きい請求項１〜３の何
れかに記載の光起電力装置の製造方法。4. The method for manufacturing a photovoltaic device according to claim 1, wherein the irradiation power of the second laser light is higher than the irradiation power of the first laser light.
あり、前記第２レーザ光はＹＡＧ第２高調波レーザ光で
ある請求項１〜４の何れかに記載の光起電力装置の製造
方法。5. The method of manufacturing a photovoltaic device according to claim 1, wherein the first laser light is an excimer laser light and the second laser light is a YAG second harmonic laser light. .
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36033397A JP3521268B2 (en) | 1997-12-26 | 1997-12-26 | Method for manufacturing photovoltaic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36033397A JP3521268B2 (en) | 1997-12-26 | 1997-12-26 | Method for manufacturing photovoltaic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11191630A JPH11191630A (en) | 1999-07-13 |
| JP3521268B2 true JP3521268B2 (en) | 2004-04-19 |
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| JP2011040462A (en) * | 2009-08-07 | 2011-02-24 | Mitsubishi Electric Corp | Photoelectric conversion device, and method of manufacturing the same |
| KR20110032939A (en) | 2009-09-24 | 2011-03-30 | 삼성전자주식회사 | Solar cell and manufacturing method thereof |
| JP7324499B2 (en) * | 2019-08-29 | 2023-08-10 | 三星ダイヤモンド工業株式会社 | Groove forming method and groove forming apparatus |
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