JP3515833B2 - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JP3515833B2 JP3515833B2 JP17880595A JP17880595A JP3515833B2 JP 3515833 B2 JP3515833 B2 JP 3515833B2 JP 17880595 A JP17880595 A JP 17880595A JP 17880595 A JP17880595 A JP 17880595A JP 3515833 B2 JP3515833 B2 JP 3515833B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- copper foil
- foil pattern
- wiring board
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は小信号回路等を形成した
プリント基板等に、例えば数十Ａまでの大電流を流す電
線等の電導体を設けた配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which a small signal circuit or the like is formed, and a wiring board provided with an electric conductor such as an electric wire for flowing a large current of up to several tens of amps.
【０００２】[0002]
【従来の技術】従来、小信号回路を形成したプリント基
板は、電流を通す通電路として銅箔パターンを形成して
いるが、これに例えば数十Ａまでの大電流を流す場合は
その銅箔の幅を拡幅し、または厚さを増厚し、あるいは
銅板を張り合せること等により、導電路の断面積を拡大
させている。2. Description of the Related Art Conventionally, a printed circuit board on which a small signal circuit is formed has a copper foil pattern formed as a current-carrying path. However, when a large current of, for example, several tens of amperes is passed through the copper foil pattern, the copper foil pattern is formed. The width of the conductive path is increased, the thickness is increased, or copper plates are attached to increase the cross-sectional area of the conductive path.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うに銅箔を増厚すると、使用する銅材が増えるうえに、
銅箔を形成するためのエッチングの製造条件や基板の半
田付け条件に制約が多くなり、基板が高価になるという
課題がある。However, when the thickness of the copper foil is increased in this way, the copper material used increases and
There are many restrictions on the manufacturing conditions of etching for forming the copper foil and the soldering conditions of the substrate, and there is a problem that the substrate becomes expensive.
【０００４】また、銅箔を増厚せずに、そのパターン幅
のみを拡幅した場合には、基板の大きさも増大させる必
要があり、大型化を招くという課題がある。Further, when only the pattern width is expanded without increasing the thickness of the copper foil, it is necessary to increase the size of the substrate, which causes a problem of increasing the size.
【０００５】そこで本発明の目的は、銅箔パターンの増
厚と拡幅をせずに、数十Ａまでの大電流を流すことがで
きる配線基板を提供することにある。Therefore, an object of the present invention is to provide a wiring board capable of passing a large current of up to several tens of amperes without increasing or widening a copper foil pattern.
【０００６】[0006]
【課題を解決するための手段】請求項１の発明の配線基
板は、基板の一面に形成した銅箔パターン部上に、棒状
の電導体を配置する一方、この基板に固定用端子を、そ
の２股に分岐する開放先端部が前記銅箔パターン部を貫
通して基板から外方へ突出して２股分岐部の開口内に上
記電導体を挿入させ、その挿入状態でこの２股分岐部を
開口内側へかしめることにより上記電導体を上記基板に
固定してなる。Wiring board of the invention of claim 1 Means for Solving the Problems] has, on a copper foil pattern portion formed on one surface of the substrate, while arranging the conductor rod-shaped, the fixed terminal on the substrate, its
The open tip part that branches into two forks penetrates the copper foil pattern part and protrudes outward from the substrate , and is placed in the opening of the two-fork part.
Insert a power storage conductor and insert the power storage conductor into the two-forked part.
The conductor is fixed to the substrate by caulking inside the opening .
【０００７】ここで電導体とは例えば断面形状が円形や
三角形以上の多角形の電線等であり、その断面形状や大
きさは各個別の仕様に応じて種々形成される。例えば断
面形状が四角形の場合には板状の電導体とすることがで
きるので、この電導体を保持する端子の開放先端部の形
状を電導体断面形状に適合させることができ、その分支
持力を増加させることができる。Here, the electric conductor is, for example, an electric wire or the like having a circular cross section or a polygonal shape of a triangle or more, and various cross sectional shapes and sizes are formed according to individual specifications. For example, when the cross-sectional shape is quadrangular, a plate-shaped conductor can be used, so the shape of the open tip of the terminal that holds this conductor can be adapted to the conductor cross-sectional shape, and the supporting force can be increased accordingly. Can be increased.
【０００８】請求項２の発明は、請求項１記載の配線基
板であって、さらに電導体は、複数本に分断され、その
分断端面どうしを、所要の間隙を置いて対向されて固定
されてなる。According to a second aspect of the present invention, in the wiring board according to the first aspect, further, the electric conductor is divided into a plurality of pieces, and the divided end faces are fixed so as to face each other with a required gap. Become.
【０００９】請求項３の発明は、請求項１または２記載
の配線基板であって、さらに、電導体と銅箔パターン部
の隙間を半田付けしている。A third aspect of the present invention is the wiring board according to the first or second aspect, further, the gap between the electric conductor and the copper foil pattern portion is soldered.
【００１０】請求項４の発明は、請求項１〜３のいずれ
か１項に記載の配線基板であって、さらに、電導体は、
通電路の違う他の銅箔パターン部に対して所定の間隔を
置くように折曲する折曲部を有している。The invention according to claim 4 is the wiring board according to any one of claims 1 to 3, further comprising:
It has a bent portion that is bent so as to be spaced at a predetermined distance from another copper foil pattern portion having a different energization path.
【００１１】請求項５の発明は、請求項１〜４のいずれ
か１項に記載の配線基板であって、さらに、固定用端子
は、その開放先端部を、成形型に押し込むことによりか
しめられている。A fifth aspect of the present invention is the wiring board according to any one of the first to fourth aspects, further, the fixing terminal is caulked by pressing the open tip portion thereof into a molding die. ing.
【００１２】[0012]
【作用】請求項１〜５の各発明においては、基板の一面
に設けた棒状の電導体を、この基板の厚さ方向に貫通す
る固定用端子の開放先端部のかしめにより機械的に固定
するので、従来例に比して基板に電導体を簡単かつ確実
に固定することができる。また、固定用端子の開放先端
部が銅箔パターン部を貫通して電導体を挟んで基板の外
方へ突出するので、電導体を基板の銅箔パターン部に半
田付けして、簡単かつ確実に電気的に接続することもで
きる。In each of the first to fifth aspects of the invention, the rod-shaped electric conductor provided on one surface of the substrate is mechanically fixed by caulking the open end of the fixing terminal penetrating in the thickness direction of the substrate. Therefore, as compared with the conventional example, the electric conductor can be fixed to the substrate easily and surely. Also, since the open tip of the fixing terminal penetrates the copper foil pattern part and projects to the outside of the board with the conductor sandwiched, the conductor can be soldered to the copper foil pattern part of the board easily and securely. Can also be electrically connected to.
【００１３】したがって、銅箔パターン部の増厚と拡幅
をせずに、電導体により例えば数十Ａの大電流を流すこ
とができるので、コスト低減と小型化とを共に図ること
ができる。Therefore, a large current of, for example, several tens of amperes can be passed by the conductor without increasing or widening the thickness of the copper foil pattern portion, so that both cost reduction and miniaturization can be achieved.
【００１４】しかも、電導体の折曲が容易であるので、
回路設計の自由度も大きくすることができる。Moreover, since the electric conductor can be bent easily,
The degree of freedom in circuit design can also be increased.
【００１５】請求項２の発明においては、例えば２本の
電導体どうしを所要の間隙を置いて対向配置した状態で
固定用端子により固定するので、電導体の温度変化によ
る膨張、収縮を電導体どうし間の間隙により吸収するこ
とができる。このために、電導体の変形を有効に防止す
ることができるうえに、応力を低減することができる。According to the second aspect of the present invention, for example, the two conductors are fixed by the fixing terminal in a state where they are opposed to each other with a required gap, so that expansion and contraction due to temperature change of the conductor is prevented. It can be absorbed by the gap between them. Therefore, the deformation of the conductor can be effectively prevented, and the stress can be reduced.
【００１６】請求項３の発明においては、電導体と銅箔
パターン部の隙間を半田付けするので、許容電流値を増
大でき、放熱効果を向上できる。In the third aspect of the invention, since the gap between the electric conductor and the copper foil pattern portion is soldered, the allowable current value can be increased and the heat radiation effect can be improved.
【００１７】請求項４の発明においては、電導体の一部
を折曲することにより通電路の違う他の銅箔パターン部
との間に所要の間隔を設けることにより、電導体を他の
銅箔パターン部から電気的に絶縁することができる。According to the invention of claim 4, a part of the conductor is bent so that a required space is provided between the conductor and another copper foil pattern portion having a different conduction path. It can be electrically insulated from the foil pattern portion.
【００１８】請求項５の発明においては、固定用端子の
開放先端部を成形型に単に押し込むことによりかしめる
ことができるので、固定用端子の開放先端部が多数あっ
ても、これらを簡単かつ確実にかしめることができる。According to the fifth aspect of the invention, since the open end of the fixing terminal can be caulked by simply pushing it into the mold, even if there are many open ends of the fixing terminal, these can be easily and easily formed. You can surely crimp.
【００１９】[0019]
【実施例】以下、本発明の実施例を図１〜図１２に基づ
いて説明する。なお、図１〜図１２中、同一または相当
部分には同一符号を付している。Embodiments of the present invention will be described below with reference to FIGS. 1 to 12, the same or corresponding parts are designated by the same reference numerals.
【００２０】図１は本発明に係る配線基板の一実施例の
断面図であり、図２のＩ−Ｉ線に沿う切断部の断面を示
しており、図２は本発明に係る配線基板の一実施例の一
部平面図であり、これらの図において、配線基板１は小
信号回路等を形成するプリント基板等の基板２の一面
に、複数の銅箔パターン部３を形成している。FIG. 1 is a sectional view of an embodiment of a wiring board according to the present invention, showing a cross section of a cut portion taken along the line I--I in FIG. 2. FIG. 2 shows a wiring board according to the present invention. 1 is a partial plan view of an embodiment, in which a wiring board 1 has a plurality of copper foil pattern portions 3 formed on one surface of a board 2 such as a printed board on which small signal circuits and the like are formed.
【００２１】基板２は、その複数の銅箔パターン部３上
に電導体である棒状の電導線４を密着させて、この電導
線４を複数の固定用端子５により基板２にそれぞれ固定
している。電導線４は例えば数十Ａまでの大電流を流す
電流路を形成する棒状体であり、例えば丸棒状の電線等
よりなるが、その断面形状は多角形等角形でもよく、大
きさ等と共に各仕様に応じて適宜変更してもよい。The board 2 has a plurality of copper foil pattern portions 3 on which a rod-shaped conductive wire 4 as an electric conductor is adhered, and the conductive wire 4 is fixed to the board 2 by a plurality of fixing terminals 5. There is. The conductive wire 4 is, for example, a rod-shaped body that forms a current path through which a large current of up to several tens of amperes is formed. You may change suitably according to a specification.
【００２２】各固定用端子５は例えば矩形平板状の平板
部５ａの長手方向両端部に、前後一対の脚部５ｂ，５ｃ
を一体ないし一体的に平板部５ａと直交する方向に形成
し、これら脚部５ｂ，５ｃの先端部に、２股に分岐する
自己保持用爪５ｄ，５ｅを一体に形成して、これら両爪
５ｄ，５ｅ間に先方開放の開口５ｆを形成している。Each fixing terminal 5 has, for example, a pair of front and rear legs 5b and 5c at both ends in the longitudinal direction of a flat plate portion 5a having a rectangular flat plate shape.
Are integrally or integrally formed in a direction orthogonal to the flat plate portion 5a, and self-holding claws 5d and 5e that branch into two forks are integrally formed at the tips of the leg portions 5b and 5c. A front opening 5f is formed between 5d and 5e.
【００２３】そして、このように構成された各固定用端
子５は、図２にも示すように基板２の銅箔パターン部３
の反対側の一面から押し込まれる等により植設されて、
基板２上に固定されると共に、自己保持用爪５ｄ，５ｅ
が銅箔パターン部３を貫通して基板２から外方へ突出す
る。Each fixing terminal 5 thus constructed has a copper foil pattern portion 3 of the substrate 2 as shown in FIG.
Planted by being pushed in from the other side of the
The claws 5d and 5e for self-holding are fixed on the substrate 2
Penetrates the copper foil pattern portion 3 and projects outward from the substrate 2.
【００２４】そこで、この２股の自己保持用爪５ｄ，５
ｅ間の開口５ｆ内に電導線４を挿入させた状態で、これ
ら自己保持用爪５ｄ，５ｅを共に開口５ｆの内側へかし
めることにより機械的に固定している。Therefore, the two-forked self-holding claws 5d, 5
With the conductive wire 4 inserted in the opening 5f between the e, the self-holding claws 5d and 5e are mechanically fixed by caulking both inside the opening 5f.
【００２５】したがって本実施例によれば、大電流を流
すことができる電導線４を基板２に簡単迅速かつ確実に
固定することができる。また、その固定状態で、さらに
これら自己保持用爪５ｄ，５ｅに電導線４を半田付けす
ることにより、各固定端子５を介して電導線４に銅箔パ
ターン部３を電気的に接続することができると共に、電
導線４を基板２に２重に固定することができるので、そ
の固定を一層確実にすることができる。したがって、こ
の半田が劣化しても電導線４が基板２から脱落するのを
防止することができる。さらに、電導線４と銅箔パター
ン部３の隙間を半田付けして埋めることにより、許容電
流値を高めることができると共に、放熱効果を向上させ
ることができる。Therefore, according to this embodiment, the conductive wire 4 capable of passing a large current can be fixed to the substrate 2 simply, quickly and surely. Further, in the fixed state, the copper wire pattern portion 3 is electrically connected to the conductive wire 4 via each fixed terminal 5 by soldering the conductive wire 4 to the self-holding claws 5d and 5e. In addition to the above, the conductive wire 4 can be doubly fixed to the substrate 2, so that the fixing can be made more reliable. Therefore, even if the solder deteriorates, the conductive wire 4 can be prevented from falling off the substrate 2. Furthermore, by filling the gap between the conductive wire 4 and the copper foil pattern portion 3 by soldering, the allowable current value can be increased and the heat dissipation effect can be improved.
【００２６】図３は本発明の第２実施例の要部拡大底面
図であり、これは例えば２本の電導線４ａ，４ｂを、銅
箔パターン部３上にて所要の間隙ｇを置いて同心状に対
向配置し、その状態で固定用端子５の各自己保持用爪５
ｄ，５ｅのかしめにより、これら電導線４ａ，４ｂを基
板２に固定した点に特徴がある。FIG. 3 is an enlarged bottom view of the essential portions of the second embodiment of the present invention. This shows, for example, two conductive wires 4a and 4b on the copper foil pattern portion 3 with a required gap g. The self-holding claws 5 of the fixing terminal 5 are arranged concentrically opposite to each other
It is characterized in that these conductive wires 4a and 4b are fixed to the substrate 2 by caulking d and 5e.
【００２７】この第２実施例によれば、２本の電導線４
ａ，４ｂの対向面どうし間に所要の間隙ｇを置いている
ので、これら電導線４ａ，４ｂの温度変化に伴なう膨張
や収縮をこの間隙ｇにより吸収することができる。この
ために、これら電導線４ａ，４ｂの変形と応力の低減
と、を共に図ることができる。また、電導線４ａ，４ｂ
を短く分割することができるうえに、その形状を標準化
できる効果を有する。According to this second embodiment, the two conductive wires 4
Since the required gap g is provided between the facing surfaces of a and 4b, expansion and contraction of these conductive wires 4a and 4b due to the temperature change can be absorbed by this gap g. For this reason, both the deformation and stress reduction of these conductive wires 4a and 4b can be achieved. In addition, the conductive wires 4a, 4b
Has the effect of standardizing its shape.
【００２８】図４は本発明の第３実施例の要部拡大縦断
面図であり、これは図示しないリード線を接続せしめる
ファストン端子６の先端部６ａと、基板２上に実装され
る実装部品の一種である電解コンデンサ７の複数の端子
７ａの先端部７ｂとを、上記固定用端子５の先端部５ａ
と同様に例えば２股に開脚させて、自己保持用爪６ｂ，
６ｃ、７ｃ，７ｄをそれぞれ形成し、これら爪を内方へ
それぞれかしめることにより各電導線４ａ，４ｂを挟持
し、基板２に固定した点に特徴がある。FIG. 4 is an enlarged vertical cross-sectional view of an essential part of the third embodiment of the present invention. This is a tip portion 6a of a faston terminal 6 for connecting a lead wire (not shown) and a mounting component mounted on the substrate 2. Of the plurality of terminals 7a of the electrolytic capacitor 7, which is a type of
In the same manner as the above, for example, by opening the legs into two legs,
6c, 7c and 7d are formed respectively, and the claws are crimped inwardly to sandwich the respective conductive wires 4a and 4b and fix them to the substrate 2.
【００２９】この第３実施例によれば、図示しないリー
ド線を、ファストン端子６を介して、大電流を流し得る
電導線４ａに確実に電気的に接続することができると共
に、大電流を流し得る電解コンデンサ７を端子７ａを介
して電導線４ｂに電気的に簡単迅速かつ確実に接続する
ことができる。According to the third embodiment, the lead wire (not shown) can be reliably electrically connected to the conducting wire 4a capable of passing a large current through the faston terminal 6 and the large current can be passed therethrough. The electrolytic capacitor 7 to be obtained can be electrically, simply, quickly and surely connected to the conductive wire 4b through the terminal 7a.
【００３０】図５は本発明の第４実施例の要部拡大縦断
面図であり、これは電導線４の一部を、基板２の一面に
形成した通電路の違う他の銅箔パターン部３の近傍で、
例えば外方へＵ字状に折曲する曲げ部４ｃを形成し、こ
の曲げ部４ｃと銅箔パターン部３との間に所要の間隔ｌ
を設けている点に特徴がある。FIG. 5 is an enlarged vertical cross-sectional view of an essential part of a fourth embodiment of the present invention, which shows another copper foil pattern portion having a part of the conductive wire 4 formed on one surface of the substrate 2 and having a different current path. In the vicinity of 3,
For example, a bent portion 4c that is bent outward in a U-shape is formed, and a required distance l is provided between the bent portion 4c and the copper foil pattern portion 3.
It is characterized by the provision of.
【００３１】したがって、この第４実施例によれば、か
かる間隔ｌにより通電路の違う他の銅箔パターン部３と
電導線４とを電気的に絶縁することができ、配線回路を
小さく収納することができる。Therefore, according to the fourth embodiment, the space l can electrically insulate the other conductors 4 from the copper foil pattern portions 3 having different current paths, and the wiring circuit can be accommodated in a small size. be able to.
【００３２】図６は本発明の第５実施例の要部拡大縦断
面図であり、これは上記各実施例の固定用端子５の長手
方向中間部に、その幅方向で対向する一対の基板保持用
中間爪５ｇ，５ｈを設けた点に特徴がある。FIG. 6 is an enlarged vertical sectional view of an essential part of the fifth embodiment of the present invention. This is a pair of substrates facing in the longitudinal direction the intermediate portion of the fixing terminal 5 of each of the above embodiments. It is characterized in that intermediate holding claws 5g and 5h are provided.
【００３３】各基板保持用中間爪５ｇ，５ｈは、その両
側の自己保持用爪５ｄ，５ｅよりも短く、基板２の一面
側でかしめられて専ら基板２を挟持する。The substrate holding intermediate claws 5g, 5h are shorter than the self-holding claws 5d, 5e on both sides thereof, and are crimped on one surface side of the substrate 2 to hold the substrate 2 exclusively.
【００３４】したがって、各自己保持用爪５ｄ，５ｅと
共に、各基板保持用中間爪５ｇ，５ｈによっても各固定
用端子５を基板２に固定するので、その固定力を増強す
ることができ、ひいては固定用端子５による電導線４の
基板２への固定力の増強を図ることができる。Therefore, since the fixing terminals 5 are fixed to the substrate 2 by the self-holding claws 5d and 5e as well as the substrate holding intermediate claws 5g and 5h, the fixing force can be increased, and by extension, the fixing force can be increased. The fixing force of the conductive wire 4 to the substrate 2 by the fixing terminal 5 can be enhanced.
【００３５】図７は本発明の第６実施例の一部を断面で
示す図であり、これは上記各固定用端子５の平板部５ａ
の上面を、成形用の端子押さえ８により押さえ、その押
え状態で成形型９を、そのかしめ用凹部９ａ内に各固定
用端子５の自己保持用爪５ｄ，５ｅを嵌入させて基板２
側へ押し込むことにより、各自己保持用爪５ｄ，５ｅを
成形型９のかしめ用凹部８の内周壁面上を摺動させて内
方へ閉じるようにかしめる点に特徴がある。FIG. 7 is a sectional view showing a part of the sixth embodiment of the present invention, which is a flat plate portion 5a of each fixing terminal 5 described above.
The upper surface of the substrate 2 is pressed by the terminal 8 for molding, the molding die 9 is held in the pressed state, and the self-holding claws 5d and 5e of the fixing terminals 5 are fitted into the caulking recesses 9a.
It is characterized in that each of the self-holding claws 5d and 5e is swung on the inner peripheral wall surface of the caulking recess 8 of the molding die 9 so as to be closed inward by being pushed inward.
【００３６】この第６実施例によれば、各自己保持用爪
５ｄ，５ｅを簡単迅速かつ確実にかしめることができ
る。なお、第６実施例においては、図１３に示すよう
に、電導線４，４ａ，４ｂを成形した後、固定用端子５
を基板２に仮止めし、電導線４，４ａ，４ｂを固定用端
子５により基板２に取り点け、固定用端子５の先端の成
形と電導線４，４ａ，４ｂをかしめて固定用端子５およ
び電導線４，４ａ，４ｂと銅箔パターン部３の隙間を半
田付けするという手順で製造される。According to the sixth embodiment, the self-holding claws 5d and 5e can be swaged simply, quickly and surely. In addition, in the sixth embodiment, as shown in FIG. 13, after the conductive wires 4, 4a, 4b are molded, the fixing terminal 5 is formed.
Is temporarily fixed to the substrate 2, the conductive wires 4, 4a, 4b are spotted on the substrate 2 by the fixing terminal 5, the tip of the fixing terminal 5 is molded, and the conductive wires 4, 4a, 4b are caulked. Also, it is manufactured by the procedure of soldering the gaps between the conductive wires 4, 4a, 4b and the copper foil pattern portion 3.
【００３７】図８は本発明の第７実施例の要部拡大縦断
面図であり、これは基板２上に電導線４を載置し、この
電導線４上から各固定用端子５の自己保持用爪５ｄ，５
ｅを基板２に打ち込み、基板２の他面（図８では下面）
側へ突出させ、その突出端部どうしを内方へかしめるこ
とにより電導線４を基板２上に固定している。FIG. 8 is an enlarged vertical sectional view of an essential part of the seventh embodiment of the present invention, in which a conductive wire 4 is placed on a substrate 2 and the fixing terminals 5 are self-mounted from the conductive wire 4. Holding claws 5d, 5
e is driven into the substrate 2 and the other surface of the substrate 2 (lower surface in FIG. 8)
The conductive wire 4 is fixed on the substrate 2 by projecting it to the side and crimping the projecting end portions inward.
【００３８】図９は本発明の第８実施例の要部拡大縦断
面図、図１０は図９の平面図であり、銅箔パターン部３
上で、大電流が流れる実装部品の一種である例えばリー
ド部品１０，１１の各リード線１０ａ，１１ａが互いに
隣り合う基板２のスルーホール１２，１３内にそれぞれ
挿入される。そして、基板の他面（図９では下面）側か
ら電導線である断面Ｌ字状のジャンパー線１４の両端部
１４ａ，１４ｂを挿入している。そして、スルーホール
１２，１３および銅箔パターン部３とジャンパー線１４
との間を半田１５により固着している。FIG. 9 is an enlarged vertical sectional view of an essential part of the eighth embodiment of the present invention, and FIG. 10 is a plan view of FIG.
Above, the lead wires 10a and 11a of the lead parts 10 and 11, which are a type of mounted parts through which a large current flows, are inserted into the through holes 12 and 13 of the substrate 2 adjacent to each other, respectively. Both ends 14a and 14b of the jumper wire 14 having an L-shaped cross section, which is a conductive wire, are inserted from the other surface (lower surface in FIG. 9) of the substrate. Then, the through holes 12 and 13, the copper foil pattern portion 3 and the jumper wire 14
Are fixed to each other by the solder 15.
【００３９】したがって、この第８実施例ではジャンパ
ー線１４を銅箔パターン部３に半田付けしているので、
通電路の表面積が増大し許容電流値を大きくすることが
できると共に放熱効果が向上し、さらに、ジャンパー線
１４の通電熱が基板２にも熱電導するので、さらに放熱
効果を高めることができる。Therefore, since the jumper wire 14 is soldered to the copper foil pattern portion 3 in this eighth embodiment,
The surface area of the energization path is increased, the allowable current value can be increased, the heat dissipation effect is improved, and the energized heat of the jumper wire 14 is also conducted to the substrate 2, so that the heat dissipation effect can be further enhanced.
【００４０】なお、上記した第８実施例の隣り合うスル
ーホール１２，１３どうしを一体に連結して図１１、図
１２でそれぞれ示す長穴状のスルーホール１６に形成
し、この長穴スルーホール１６内に半田１５を充填して
もよく、これによっても第８実施例と同様の効果を有す
る。The adjacent through holes 12 and 13 of the above-described eighth embodiment are integrally connected to each other to form elongated through holes 16 shown in FIGS. 11 and 12, respectively. 16 may be filled with the solder 15, which also has the same effect as the eighth embodiment.
【００４１】[0041]
【発明の効果】以上説明したように請求項１〜５の各発
明においては、基板の一面に添設した電導体を、この基
板の厚さ方向に貫通する固定用端子の開放先端部のかし
めにより機械的に固定するので、従来例に比して基板に
電導体を簡単かつ確実に固定することができる。また、
固定用端子の開放先端部が銅箔パターンを貫通して外方
へ突出するので、電導体を基板の銅箔パターン部に半田
付けして、これらを簡単かつ確実に電気的に接続するこ
ともできる。As described above, in each of the first to fifth aspects of the invention, the caulking of the open end of the fixing terminal penetrating the electric conductor provided on one surface of the substrate in the thickness direction of the substrate. Since it is mechanically fixed, the electric conductor can be easily and surely fixed to the substrate as compared with the conventional example. Also,
Since the open end of the fixing terminal penetrates the copper foil pattern and projects outward, it is also possible to solder the electric conductor to the copper foil pattern portion of the board and connect them easily and securely. it can.
【００４２】したがって、銅箔パターン部の増厚と拡幅
をせずに、電導体により例えば数十Ａの大電流を流すこ
とができるので、コスト低減と小型化とを共に図ること
ができる。Therefore, a large current of, for example, several tens of amperes can be passed by the electric conductor without increasing the thickness and widening of the copper foil pattern portion, so that both cost reduction and miniaturization can be achieved.
【００４３】しかも、電導体の折曲が容易であるので、
回路設計の自由度も大きくすることができる。Moreover, since it is easy to bend the conductor,
The degree of freedom in circuit design can also be increased.
【００４４】請求項２の発明においては、例えば２本の
導電体どうしを所要の間隙を置いて対向配置した状態で
固定用端子により固定するので、電導体の温度変化によ
る膨張、収縮を電導体どうし間の間隙により吸収するこ
とができる。このために、電導体の変形を有効に防止す
ることができるうえに、応力を低減することができる。According to the second aspect of the present invention, for example, the two conductors are fixed by the fixing terminal in a state of being opposed to each other with a required gap, so that the expansion and contraction of the electric conductor due to the temperature change can be prevented. It can be absorbed by the gap between them. Therefore, the deformation of the conductor can be effectively prevented, and the stress can be reduced.
【００４５】請求項３の発明においては、電導体と銅箔
パターン部の隙間を半田付けして埋めることにより、許
容電流値を増大できると共に放熱効果を向上できる。In the third aspect of the present invention, the allowable current value can be increased and the heat radiation effect can be improved by filling the gap between the electric conductor and the copper foil pattern portion by soldering.
【００４６】請求項４の発明においては、電導体の一部
を折曲することにより銅箔パターンとの間に所要の間隔
を設けることにより、電導体の銅箔パターンとを電気的
に絶縁することができる。In the fourth aspect of the present invention, a part of the electric conductor is bent so that a required space is provided between the electric conductor and the copper foil pattern, thereby electrically insulating the electric conductor from the copper foil pattern. be able to.
【００４７】請求項５の発明においては、固定用端子の
開放先端部を成形型に単に押し込むことによりかしめる
ことができるので、固定用端子の開放先端部が多数あっ
ても、これらを簡単かつ確実にかしめることができる。According to the fifth aspect of the invention, since the open end of the fixing terminal can be caulked by simply pushing it into the mold, even if there are many open ends of the fixing terminal, these can be easily and easily You can surely crimp.
【図１】本発明に係る配線基板の第１実施例の要部の断
面図であり、図２のＩ−Ｉ線に沿う切断部の断面を示
す。1 is a cross-sectional view of a main part of a first embodiment of a wiring board according to the present invention, showing a cross-section of a cut part taken along line I-I of FIG.
【図２】本発明に係る配線基板の第１実施例の要部底面
図。FIG. 2 is a bottom view of the essential portions of the first embodiment of the wiring board according to the present invention.
【図３】本発明の第２実施例の要部底面図。FIG. 3 is a bottom view of essential parts of a second embodiment of the present invention.
【図４】本発明の第３実施例の要部縦断面図。FIG. 4 is a longitudinal sectional view of a main part of a third embodiment of the present invention.
【図５】本発明の第４実施例の要部縦断面図。FIG. 5 is a vertical cross-sectional view of a main part of a fourth embodiment of the present invention.
【図６】本発明の第５実施例の要部縦断面図。FIG. 6 is a longitudinal sectional view of a main part of a fifth embodiment of the present invention.
【図７】本発明の第６実施例の要部縦断面図。FIG. 7 is a vertical cross-sectional view of a main part of a sixth embodiment of the present invention.
【図８】本発明の第７実施例の要部縦断面図。FIG. 8 is a longitudinal sectional view of a main part of a seventh embodiment of the present invention.
【図９】本発明の第８実施例の要部縦断面図。FIG. 9 is a longitudinal sectional view of an essential part of an eighth embodiment of the present invention.
【図１０】図９の平面図。FIG. 10 is a plan view of FIG.
【図１１】本発明の第９実施例の要部縦断面図。FIG. 11 is a vertical cross-sectional view of the essential parts of the ninth embodiment of the present invention.
【図１２】図１１の平面図。12 is a plan view of FIG.
【図１３】本発明の第６実施例の製造方法の一例を示す
フローチャート。FIG. 13 is a flowchart showing an example of a manufacturing method according to the sixth embodiment of the present invention.
１ 配線基板 ２ 基板 ３ 銅箔パターン部 ４，４ａ，４ｂ 電導線（電導体） ４ｃ 曲げ部 ５ 固定用端子 ５ａ 固定用端子の平板部 ５ｂ，５ｃ 固定用端子の脚部 ５ｄ，５ｅ 一対の自己保持用爪 ５ｆ 一対の自己保持用爪の開口 ５ｇ，５ｈ 基板保持用中間爪 ６ ファストン端子 ６ｂ，６ｃ ファストン端子の自己保持用爪 ７ 電解コンデンサ（実装部品） ７ｃ，７ｄ コンデンサの自己保持用爪 ８ 成形用押え ９ 成形用型 ９ａ 成形用凹部 １０，１１ リード部品（実装部品） １２，１３ スルーホール １４ ジャンパー線 １５ 半田 1 wiring board 2 substrates 3 Copper foil pattern part 4,4a, 4b Conductive wire (electric conductor) 4c bending part 5 Terminal for fixing 5a Flat part of fixing terminal 5b, 5c Leg of fixing terminal 5d, 5e A pair of self-holding claws 5f A pair of self-holding claw openings 5g, 5h Substrate holding intermediate claw 6 Faston terminals 6b, 6c Faston terminal self-holding claw 7 Electrolytic capacitor (Mounted parts) 7c, 7d Self-holding claws for capacitors 8 Molding foot 9 Mold for molding 9a Recess for molding 10, 11 Lead parts (mounting parts) 12,13 through hole 14 jumper wire 15 Solder
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/02 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H05K 1/02
Claims (5)
に、棒状の電導体を配置する一方、この基板に固定用端
子を、その２股に分岐する開放先端部が前記銅箔パター
ン部を貫通して基板から外方へ突出して２股分岐部の開
口内に上記電導体を挿入させ、その挿入状態でこの２股
分岐部を開口内側へかしめることにより上記電導体を上
記基板に固定することを特徴とする配線基板。To 1. A copper foil pattern portion formed on one surface of the substrate, while arranging the conductor rod-shaped, the fixed terminal on the substrate, an open distal end portion that branches to the bifurcated said copper foil pattern portion Through the board and project outward from the substrate to open the bifurcated bifurcation
Insert the conductor into the mouth and insert the two
A wiring substrate, wherein the conductor is fixed to the substrate by caulking the branch portion inside the opening .
体は、複数本に分断され、その分断端面どうしを、所要
の間隙を置いて対向されて固定されてなることを特徴と
する配線基板。2. The wiring board according to claim 1, wherein the electric conductor is divided into a plurality of pieces, and the divided end faces are opposed to each other with a required gap and fixed. .
て、電導体と銅箔パターン部の隙間を半田付けしている
ことを特徴とする配線基板。3. The wiring board according to claim 1, wherein a gap between the electric conductor and the copper foil pattern portion is soldered.
線基板において、電導体は、通電路の違う他の銅箔パタ
ーン部に対して所定の間隔を置くように折曲する折曲部
を有することを特徴とする配線基板。4. The wiring board according to any one of claims 1 to 3, wherein the electric conductor is bent so that a predetermined space is provided between the electric conductor and another copper foil pattern portion having a different conduction path. A wiring board having a curved portion.
線基板において、固定用端子は、その開放先端部を、成
形型に押し込むことによりかしめられていることを特徴
とする配線基板。5. The wiring board according to any one of claims 1 to 4, wherein the fixing terminal is caulked by pressing an open tip of the terminal into a molding die. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17880595A JP3515833B2 (en) | 1995-07-14 | 1995-07-14 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17880595A JP3515833B2 (en) | 1995-07-14 | 1995-07-14 | Wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0936571A JPH0936571A (en) | 1997-02-07 |
| JP3515833B2 true JP3515833B2 (en) | 2004-04-05 |
Family
ID=16054967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17880595A Expired - Fee Related JP3515833B2 (en) | 1995-07-14 | 1995-07-14 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3515833B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587937B (en) * | 2018-12-14 | 2021-12-17 | 广东浪潮大数据研究有限公司 | Current conduction device and equipment |
-
1995
- 1995-07-14 JP JP17880595A patent/JP3515833B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0936571A (en) | 1997-02-07 |
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