JP3510818B2 - Communication equipment - Google Patents
Communication equipmentInfo
- Publication number
- JP3510818B2 JP3510818B2 JP23217699A JP23217699A JP3510818B2 JP 3510818 B2 JP3510818 B2 JP 3510818B2 JP 23217699 A JP23217699 A JP 23217699A JP 23217699 A JP23217699 A JP 23217699A JP 3510818 B2 JP3510818 B2 JP 3510818B2
- Authority
- JP
- Japan
- Prior art keywords
- local oscillator
- housing
- communication device
- damping material
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Receivers (AREA)
- Transmitters (AREA)
- Casings For Electric Apparatus (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は通信機器に関し、特
に、優れた温度特性及び振動特性を要求される衛星通信
用の通信機器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a communication device, and more particularly to a communication device for satellite communication which is required to have excellent temperature characteristics and vibration characteristics.
【０００２】[0002]
【従来の技術】近年、地上における通信回線網は、幹線
の光ファイバー化や光多重変調技術の発展によりバック
ボーンの容量が増大してきている。しかしながら、一般
家庭での通信においては、末端は現在も銅線によるアナ
ログ回線で、多値変調システムによるモデムを用いた場
合でも、最高で理論値５６Kbps、ＩＳＤＮでも一回線６
４Kbpsに留まっており、高速のバックボーンを活かせな
い状況にある。2. Description of the Related Art In recent years, in the terrestrial communication network, the capacity of the backbone has been increasing due to the development of optical fiber for the trunk line and the development of optical multiplex modulation technology. However, in general household communication, the terminal is still an analog line using copper wire, and even if a modem with a multilevel modulation system is used, the theoretical value is up to 56 Kbps, and ISDN has one line.
It remains at 4 Kbps, and it is in a situation where the high-speed backbone cannot be utilized.
【０００３】需要が高まりつつある在宅医療や高速イン
ターネットの実現のためには動画のやりとりが可能な通
信速度（１Ｍbps以上）を満たす必要があり、地上回線
網での上記サービスは不可能といえる。このような地上
回線網の通信速度の行きづまりを背景として近年注目さ
れているのが人工衛星を用いた高速通信である。特に、
地上回線網を完全にパスできることから、双方向の衛星
通信が有望と考えられている。In order to realize home medical care and high-speed Internet, which are in high demand, it is necessary to meet a communication speed (1 Mbps or more) at which moving pictures can be exchanged, and it can be said that the above-mentioned service on the terrestrial network is impossible. High-speed communication using artificial satellites has been attracting attention in recent years due to the imperfect communication speed of the terrestrial network. In particular,
Two-way satellite communication is considered to be promising because it can completely pass the terrestrial network.
【０００４】しかしながら、これまで双方向衛星通信は
一部の企業や団体のみにしか普及せず、大きな需要が見
込まれる家庭への普及は皆無であった。この原因は端末
コストが高価であることによる。特に、衛星通信の送信
側を担うトランスミッタ（送信機）は、低い出力パワー
で高い通信速度を得るために、局部発振器に従来からＰ
ＬＬ（Phase Locked Loop）を用いた周波数安定回路が
用いられており、このループを構成するための分周器や
基準周波数発生器が高価で全体のコストをつり上げてい
た。However, up to now, bidirectional satellite communication has spread only to some companies and organizations, and has not spread to households where large demand is expected. This is because the terminal cost is high. In particular, a transmitter (transmitter), which is responsible for the transmitting side of satellite communication, has been conventionally equipped with a local oscillator P to obtain a high communication speed with low output power.
A frequency stabilizing circuit using an LL (Phase Locked Loop) is used, and a frequency divider and a reference frequency generator for constructing this loop are expensive and raise the overall cost.
【０００５】そこで、最近の新しいシステムとして、局
部発振器にロックをかけないフリーランＤＲＯ（Dielec
tric Resonator Osillator）を用いたトランスミッタを
採用する動きがある。このトランスミッタの場合、上記
のような分周器や基準周波数発生器を用いないため、コ
ストダウンが可能である。Therefore, as a recent new system, a free-run DRO (Dielec) which does not lock the local oscillator is used.
There is a movement to adopt a transmitter using tric Resonator Osillator). In the case of this transmitter, since the frequency divider and the reference frequency generator as described above are not used, the cost can be reduced.
【０００６】図１０は従来の局部発振器にフリーランＤ
ＲＯを用いたトランスミッタを含む通信機器の一例を示
しており、通信機器筺体１０１と、この通信機器筺体１
０１上に固定された局部発振器１０２とを具備してい
る。FIG. 10 shows a conventional local oscillator with a free-run D
1 shows an example of a communication device including a transmitter using RO, a communication device housing 101, and this communication device housing 1
01 and a fixed local oscillator 102.
【０００７】局部発振器１０２は、回路等の局部発振器
本体（不図示）を局部発振器筺体１０３により封止して
成るもので、基板１０４に端子１０５等を半田付けする
ことで固定されている。通信機器筺体１０１には凹部１
０６が形成されており、局部発振器１０２は凹部１０６
内に収容された状態で基板１０４を通信機器筺体１０１
にネジ止めすることにより通信機器筺体１０１上に固定
される。The local oscillator 102 is formed by sealing a local oscillator body (not shown) such as a circuit with a local oscillator housing 103, and is fixed by soldering a terminal 105 and the like to a substrate 104. The recess 1 is formed in the communication device housing 101.
06 is formed, and the local oscillator 102 has a recess 106.
The substrate 104 is accommodated in the communication device housing 101.
It is fixed on the communication device housing 101 by screwing.
【０００８】このような構造により、局部発振器筺体１
０３の周囲は通信機器筺体１０１と基板１０４とで遮蔽
された状態となり、局部発振器１０２から発生する局部
発振信号が通信機器内部の回路や通信機器外部へ漏洩す
るのを防止することができる。With such a structure, the local oscillator housing 1
The area around 03 is shielded by the communication device housing 101 and the substrate 104, so that the local oscillation signal generated from the local oscillator 102 can be prevented from leaking to the circuit inside the communication device or the outside of the communication device.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、フリー
ランＤＲＯはロックをかけないため、温度変化や振動に
よる発振周波数の変動が大きく、トータルシステムへ悪
影響を及ぼす可能性があった。However, since the free-run DRO is not locked, the oscillation frequency fluctuates greatly due to temperature changes and vibrations, which may adversely affect the total system.
【００１０】本発明は上述した問題点を解決するために
なされたものであって、その目的は、温度変化や振動に
よる発振周波数の変動が少ない通信機器を提供すること
にある。The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a communication device in which the fluctuation of the oscillation frequency due to the temperature change or the vibration is small.
【００１１】[0011]
【課題を解決するための手段】上述した目的を達成する
ために、本発明は、通信機器筺体と、この通信機器筺体
上に固定された局部発振器とを具備し、前記局部発振器
がフリーランＤＲＯであり、かつ局部発振器本体を局部
発振器筺体により封止して成るものである通信機器にお
いて、前記通信機器筺体が前記局部発振器を収容する凹
部を有し、前記局部発振器は、基板上に固定された状態
で前記凹部内に収容されるとともに前記基板を介して前
記通信機器筺体上に固定され、熱伝導性の制振材を前記
凹部の内面と前記局部発振器筺体の間に設け、さらに前
記凹部の内面と前記局部発振器筺体の間に導電性を有す
る振動吸収用のバネを設けたことを特徴とするものであ
る。In order to achieve the above-mentioned object, the present invention comprises a communication equipment housing and a local oscillator fixed on the communication equipment housing, the local oscillator being a free-run DRO. In a communication device in which the local oscillator main body is sealed with a local oscillator housing, the communication device housing has a recess for housing the local oscillator.
And the local oscillator is fixed on the substrate.
Is accommodated in the recessed portion by the front of the substrate.
The heat-damping damping material fixed on the communication device housing is
Provided between the inner surface of the recess and the local oscillator housing.
There is conductivity between the inner surface of the recess and the local oscillator housing.
A vibration absorbing spring is provided .
【００１２】このような構成によれば、制振材を介して
局部発振器筐体から通信機器筐体への熱回路が新たな形
成されるため、外気温と局部発振器筐体との温度差が小
さくなり、外気温の変化による局部発振器の周波数の変
動が小さくなる。それと同時に、振動エネルギーが局部
発振器筐体に与えられた場合も制振材により振動エネル
ギーの一部が吸収されるため、振動による局部発振器の
振動数変動も小さくなる。局部発振器筐体が通信機器筐
体を介して接地されるため、局部発振器の動作が安定す
る。また、バネは振動を制振する機能も果たすため、振
動による局部発振器の周波数変動も小さくなる。 According to this structure, a thermal circuit is newly formed from the local oscillator casing to the communication device casing via the damping material, so that the temperature difference between the outside air temperature and the local oscillator casing is reduced. The fluctuation of the frequency of the local oscillator due to the change of the outside temperature becomes small. At the same time, when the vibration energy is applied to the local oscillator housing, a part of the vibration energy is absorbed by the damping material, so that the frequency fluctuation of the local oscillator due to the vibration is also reduced. The local oscillator housing is a communication equipment housing
Since it is grounded through the body, the operation of the local oscillator is stable.
It In addition, since the spring also functions to suppress vibration,
The frequency fluctuation of the local oscillator due to the movement also becomes small.
【００１３】また、前記制振材が導電性を有することを
特徴とするものである。 [0013] is characterized in that the previous SL damping material is electrically conductive.
【００１４】この場合、局部発振器筺体が通信機器筺体
を介して接地された状態となるため、局部発振器の動作
が安定する。In this case, since the local oscillator housing is grounded via the communication equipment housing, the operation of the local oscillator is stabilized.
【００１５】[0015]
【００１６】[0016]
【００１７】[0017]
【００１８】また、前記基板が、前記凹部の開口部を覆
うように形成されるとともに前記開口部に対向する部位
に空気抜き用の孔が設けられたことを特徴とするもので
ある。 Further, before Symbol substrate is characterized in that the hole for air vent at a portion opposed to the opening portion while being formed so as to cover the opening of the recess is provided.
【００１９】この場合、基板及び局部発振器を通信機器
筺体に取り付ける際に空気抵抗が少なくなるため、組み
立て易くなる。In this case, since air resistance is reduced when the board and the local oscillator are attached to the housing of the communication device, it is easy to assemble.
【００２０】また、前記制振材は、流動性を有する状態
で前記通信機器筺体内に充填されるとともに、前記局部
発振器を前記通信機器筺体に組み込んだ状態で保形性を
有する状態に変化させ得るように成したものであること
を特徴とするものである。 Further, the prior SL damping material, while being filled in the communication device within the housing in a fluid state, changing the local oscillator in a state having a shape retaining property in a state incorporated in the communication device housing It is characterized by being configured so that it can be performed.
【００２１】この場合、通信機器筺体における局部発振
器の取り付け箇所及び局部発振器筺体が複雑な形状であ
る場合でも、制振材が通信機器筺体及び局部発振器筺体
の表面形状に沿った形状になるため、制振材の通信機器
筺体及び局部発振器筺体との接触面積を大きくすること
ができ、高い放熱性能及び振動制振性能を確保すること
ができる。In this case, even if the location of the local oscillator in the communication device housing and the local oscillator housing have complicated shapes, the damping material has a shape that follows the surface shapes of the communication device housing and the local oscillator housing. The contact area of the vibration damping material with the communication device housing and the local oscillator housing can be increased, and high heat dissipation performance and vibration damping performance can be secured.
【００２２】[0022]
【発明の実施の形態】以下、本発明の具体的な実施形態
を図面を参照しながら説明する。図１は本発明の第１の
実施形態の概略構成を示す断面図、図２は本発明の第２
の実施形態の概略構成を示す断面図、図３は本発明の第
３の実施形態の概略構成を示す断面図、図４は本発明の
第４の実施形態の概略構成を示す断面図、図５は本発明
の第５の実施形態の概略構成を示す分解斜視図、図６は
本発明の第６の実施形態の概略構成を示す断面図、図７
は本発明の第７の実施形態の概略構成を示す断面図、図
８は本発明の第８の実施形態の概略構成を示す断面図、
図９は本発明の第９の実施形態の概略構成を示す断面図
である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a schematic configuration of a first embodiment of the present invention, and FIG. 2 is a second view of the present invention.
Is a sectional view showing a schematic configuration of an embodiment of the present invention, FIG. 3 is a sectional view showing a schematic configuration of a third embodiment of the present invention, and FIG. 4 is a sectional view showing a schematic configuration of a fourth embodiment of the present invention. 5 is an exploded perspective view showing a schematic configuration of a fifth embodiment of the present invention, FIG. 6 is a sectional view showing a schematic configuration of the sixth embodiment of the present invention, FIG.
Is a sectional view showing a schematic configuration of a seventh embodiment of the present invention, FIG. 8 is a sectional view showing a schematic configuration of the eighth embodiment of the present invention,
FIG. 9 is a sectional view showing a schematic configuration of the ninth embodiment of the present invention.
【００２３】本実施形態の通信機器は、局部発振器にフ
リーランＤＲＯを用いたトランスミッタを含むものであ
って、図１に示すように、通信機器筺体１と、この通信
機器筺体１上に固定された局部発振器２とを具備してい
る。The communication device of this embodiment includes a transmitter using a free-run DRO as a local oscillator. As shown in FIG. 1, the communication device housing 1 is fixed to the communication device housing 1. And a local oscillator 2.
【００２４】局部発振器２は、回路等の局部発振器本体
（不図示）を局部発振器筺体３により封止して成るもの
で、基板４に端子５等を半田付けすることで固定されて
いる。第１の実施形態では、通信機器筺体１が、上面か
ら下方に向かって形成された凹部６を有しており、局部
発振器２は凹部６内に収容された状態で基板４を通信機
器筺体１にネジ止めすることにより通信機器筺体１上に
固定される。なお、基板４は凹部６の開口部を覆うた
め、局部発振器２の挿入時の空気抵抗が小さくなるよう
に、基板４における凹部６の開口部に対向する部位に空
気抜き用の孔を設けるようにしてもよい。The local oscillator 2 is formed by sealing a local oscillator body (not shown) such as a circuit with a local oscillator housing 3, and is fixed by soldering a terminal 5 and the like to a substrate 4. In the first embodiment, the communication device housing 1 has a recess 6 formed downward from the upper surface, and the local oscillator 2 is accommodated in the recess 6 and the substrate 4 is placed in the communication device housing 1. It is fixed on the communication device housing 1 by being screwed on. Since the substrate 4 covers the opening of the concave portion 6, an air vent hole is provided in the portion of the substrate 4 facing the opening of the concave portion 6 so that the air resistance when the local oscillator 2 is inserted is reduced. May be.
【００２５】凹部６の底面と局部発振器筺体３の間に
は、熱抵抗が小さくかつ振動吸収性に優れた制振材７が
設けられている。この制振材７は、例えば、シリコンゴ
ム、ボロンナイトライド（窒化ボロン）、フィラー等か
ら成り、局部発振器２が通信機器筺体１上に固定される
前に凹部６の底面上に敷設される。制振材７の自由状態
における厚さは、凹部６の底面と局部発振器筺体３との
間に形成される隙間の高さと同じあるいはそれよりも大
きくなっており、局部発振器２を通信機器筺体１上に固
定することで制振材７は局部発振器筺体３と凹部６の双
方に接触する。Between the bottom surface of the concave portion 6 and the local oscillator housing 3, a damping material 7 having a small thermal resistance and an excellent vibration absorbing property is provided. The damping material 7 is made of, for example, silicon rubber, boron nitride (boron nitride), a filler, etc., and is laid on the bottom surface of the recess 6 before the local oscillator 2 is fixed on the communication device housing 1. The thickness of the damping material 7 in the free state is equal to or larger than the height of the gap formed between the bottom surface of the concave portion 6 and the local oscillator housing 3, and the local oscillator 2 and the communication device housing 1 are connected to each other. The vibration damping material 7 comes into contact with both the local oscillator housing 3 and the concave portion 6 by fixing the vibration damping material 7 on top.
【００２６】これにより、制振材７を介して局部発振器
筺体３から通信機器筺体１への熱回路が新たに形成され
るため、外気温と局部発振器筺体３との温度差が小さく
なり、外気温の変化による局部発振器２の周波数の変動
が小さくなる。それと同時に、振動エネルギーが局部発
振器筺体３に与えられた場合に制振材７により振動エネ
ルギーの一部が吸収されるため、振動による局部発振器
２の周波数変動も小さくなる。また、制振材７が導電性
を有するものである場合には、局部発振器筺体３が通信
機器筺体１を介して接地した状態となり、局部発振器２
の動作が安定する。As a result, a thermal circuit is newly formed from the local oscillator housing 3 to the communication device housing 1 via the damping material 7, so that the temperature difference between the outside air temperature and the local oscillator housing 3 becomes small, and Fluctuations in the frequency of the local oscillator 2 due to changes in air temperature are reduced. At the same time, when the vibration energy is applied to the local oscillator housing 3, a part of the vibration energy is absorbed by the damping material 7, so that the frequency fluctuation of the local oscillator 2 due to the vibration is also reduced. When the vibration damping material 7 has conductivity, the local oscillator housing 3 is grounded via the communication equipment housing 1, and the local oscillator 2
Operation is stable.
【００２７】なお、制振材７の表面を粘着加工してお
き、この粘着面を介して制振材７を局部発振器筺体３に
貼付してから局部発振器２を通信機器筺体１上に固定す
るようにしてもよい。また、制振材７の厚みを大きくす
るほど局部発振器筺体３及び通信機器筺体１との接触熱
抵抗が小さくなり、接触面積も拡大するので放熱上有利
になる。ただし、制振材７の厚みを大きくした場合、制
振材７の圧縮に必要な力を組み立て時に加えることが可
能な範囲内に収める必要がある。また、制振材７を圧縮
しすぎた場合、振動エネルギーの吸収が悪くなる可能性
があるため、振動エネルギー吸収に適した圧縮率で制振
材７が圧縮されるように制振材７の厚みを設定する必要
がある。It should be noted that the surface of the damping material 7 is adhesively processed, the damping material 7 is attached to the local oscillator housing 3 via this adhesive surface, and then the local oscillator 2 is fixed on the communication equipment housing 1. You may do it. Further, as the thickness of the damping material 7 is increased, the contact thermal resistance with the local oscillator housing 3 and the communication device housing 1 is reduced, and the contact area is expanded, which is advantageous in heat dissipation. However, when the thickness of the damping material 7 is increased, it is necessary to keep the force required for compressing the damping material 7 within a range that can be applied during assembly. Further, if the vibration damping material 7 is compressed too much, the absorption of the vibration energy may be deteriorated. Therefore, the vibration damping material 7 should be compressed so that the vibration damping material 7 is compressed at a compression rate suitable for absorbing the vibration energy. It is necessary to set the thickness.
【００２８】次に、図２に基づいて本発明の第２の実施
形態について説明する。なお、以下の各実施形態におい
て、第１の実施形態と対応する部分には同一の符号を付
してあり、同一の部分については説明を省略してある。
本実施形態では、凹部６の側面上にも制振材７と同じ構
成の制振材８、９が設けられている。このようにするこ
とで、局部発振器筺体３の底面だけでなく、側面におい
ても放熱と振動の制振がなされるため、放熱性能と振動
吸収性能の向上が図れる。なお、コスト等の点で、凹部
６の側面のみに制振材を設けることも考えられる。Next, a second embodiment of the present invention will be described with reference to FIG. In each of the following embodiments, parts corresponding to those in the first embodiment are designated by the same reference numerals, and description of the same parts is omitted.
In the present embodiment, vibration damping materials 8 and 9 having the same configuration as the vibration damping material 7 are also provided on the side surface of the recess 6. By doing so, heat radiation and vibration damping are performed not only on the bottom surface of the local oscillator housing 3 but also on the side surfaces thereof, so that heat radiation performance and vibration absorption performance can be improved. It is also possible to provide the damping material only on the side surface of the recess 6 in terms of cost and the like.
【００２９】なお、凹部６の側面上に制振材８、９が存
在することで局部発振器筺体３を凹部６に挿入しにくく
なる可能性があるので、シリコングリース等の潤滑剤を
局部発振器筺体３の側面あるいは制振材８、９の表面に
塗布したり、凹部６の側面を開口部側に向かって拡開す
るように傾斜させたりする等の工夫が必要である。The presence of the damping materials 8 and 9 on the side surface of the concave portion 6 may make it difficult to insert the local oscillator casing 3 into the concave portion 6. Therefore, a lubricant such as silicon grease may be used for the local oscillator casing. It is necessary to apply it to the side surface of No. 3 or the surface of the damping material 8 or 9, or to incline the side surface of the concave portion 6 so as to widen toward the opening side.
【００３０】次に、図３に基づいて本発明の第３の実施
形態について説明する。本実施形態では、第２の実施形
態において、凹部６の底面上に設けられた制振材７を導
電性を有するバネ１０に置き換えたものである。これに
よって、局部発振器筺体がを通信機器筺体１を介して接
地した状態となるため、局部発振器２の動作が安定す
る。また、バネ１０は振動を制振する機能も果たす。Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment, the damping material 7 provided on the bottom surface of the recess 6 in the second embodiment is replaced with a spring 10 having conductivity. As a result, the local oscillator housing is brought into a state of being grounded via the communication device housing 1, so that the operation of the local oscillator 2 is stabilized. Further, the spring 10 also has a function of damping vibration.
【００３１】次に、図４に基づいて本発明の第４の実施
形態について説明する。本実施形態では、第１の実施形
態において、制振材７が、局部発振器筺体３の凹部６へ
の挿入によって圧縮された際に、局部発振器筺体３の底
面全体を覆うように広がるとともに凹部６の側面と局部
発振器筺体３の側面との間に全周にわたって入り込むよ
うに形成されている。このようにすることで、第１の実
施形態に比べて制振材７の局部発振器筺体３や通信機器
筺体１との接触面積が拡大するため、放熱性能と振動吸
収性能の向上を図ることができる。Next, a fourth embodiment of the present invention will be described with reference to FIG. In the present embodiment, in the first embodiment, when the damping material 7 is compressed by being inserted into the recess 6 of the local oscillator housing 3, the damping material 7 spreads so as to cover the entire bottom surface of the local oscillator housing 3 and the recess 6 is formed. Is formed so as to extend over the entire circumference between the side surface of and the side surface of the local oscillator housing 3. By doing so, the contact area of the damping material 7 with the local oscillator housing 3 and the communication equipment housing 1 is expanded as compared with the first embodiment, so that the heat dissipation performance and the vibration absorption performance can be improved. it can.
【００３２】本実施形態の効果は第２の実施形態と同様
であるが、潤滑剤の塗布を必要とせず、かつ制振材の個
数が一つであるため、第２の実施形態に比べて工程数、
部品点数を削減することができ、コストダウンを図れ
る。The effect of this embodiment is the same as that of the second embodiment, but the application of lubricant is not necessary and the number of damping materials is one. Therefore, compared with the second embodiment. Number of steps,
The number of parts can be reduced and the cost can be reduced.
【００３３】次に、図５に基づいて本発明の第５の実施
形態について説明する。本実施形態では、制振材７に局
部発振器筺体３を嵌め込むことができる凹部１１が形成
されており、制振材７が凹部６の側面及び局部発振器筺
体３の側面に全周にわたって接触するため、第１の実施
形態に比べて制振材７の通信機器筺体１及び局部発振器
筺体３に対する接触面積が拡大し、放射性能と振動吸収
性能の向上を図ることができる。Next, a fifth embodiment of the present invention will be described with reference to FIG. In this embodiment, the recess 11 into which the local oscillator housing 3 can be fitted is formed in the vibration damping material 7, and the vibration damping material 7 contacts the side surface of the recess 6 and the side surface of the local oscillator housing 3 over the entire circumference. Therefore, as compared with the first embodiment, the contact area of the damping material 7 with the communication device housing 1 and the local oscillator housing 3 is expanded, and the radiation performance and the vibration absorption performance can be improved.
【００３４】本実施形態の効果は第４の実施形態と同様
であるが、制振材７が局部発振器筺体３を嵌め込むこと
ができるように形成されているため、局部発振器筺体３
に大きな圧力をかけることなく、制振材７を局部発振器
筺体３及び通信機器筺体１に広い面積にわたって接触さ
せることができる。The effect of this embodiment is similar to that of the fourth embodiment, but since the damping material 7 is formed so that the local oscillator housing 3 can be fitted therein, the local oscillator housing 3 is formed.
It is possible to bring the damping material 7 into contact with the local oscillator housing 3 and the communication device housing 1 over a large area without applying a large pressure to the housing.
【００３５】次に、図６に基づいて本発明の第６の実施
形態について説明する。本実施形態では、制振材７を構
成する材料が、加熱、光照射等の特定の条件によって固
体あるいはそれに近い保形性を有する状態から液体ある
いはそれに近い流動性を有する状態へ可逆的に変化する
ように成したもので、この材料を流動性を有する状態で
通信機器筺体１の凹部６内に充填して局部発振器２を凹
部６内に組み込む。そして、前記特定の条件によって材
料を保形性を有する状態に変化させる。その結果得られ
る制振材７は、局部発振器筺体３及び凹部６の底面及び
側面の全周にわたって接触するため、局部発振器筺体３
及び通信機器筺体１に対する接触面積が大きく、高い放
熱性能及び振動制振性能を有する。Next, a sixth embodiment of the present invention will be described with reference to FIG. In the present embodiment, the material forming the vibration damping material 7 reversibly changes from a solid or a shape-retaining state close to it to a liquid or a fluidity close to it depending on specific conditions such as heating and light irradiation. The local oscillator 2 is incorporated into the recess 6 by filling the recess 6 of the communication device housing 1 with this material in a fluid state. Then, the material is changed into a shape-retaining state under the specific conditions. The vibration damping material 7 obtained as a result comes into contact with the local oscillator housing 3 and the concave portion 6 over the entire circumferences of the bottom surface and the side surface thereof.
Also, the contact area with the communication device housing 1 is large, and high heat dissipation performance and vibration damping performance are provided.
【００３６】このように、制振材が流動性を有する状態
で通信機器筺体内に充填されることにより、通信機器筺
体における局部発振器の取り付け箇所及び局部発振器筺
体が複雑な形状である場合でも、制振材が通信機器筺体
及び局部発振器筺体の表面形状に沿った形状になり、制
振材の通信機器筺体及び局部発振器筺体との接触面積を
大きくすることができるため、高い放熱性能及び振動制
振性能を確保することができるAs described above, by filling the communication device housing with the damping material in a fluid state, even if the location of the local oscillator in the communication device housing and the local oscillator housing are complicated, Since the damping material has a shape that conforms to the surface shape of the communication device housing and the local oscillator housing, and the contact area of the damping material with the communication equipment housing and the local oscillator housing can be increased, high heat dissipation performance and vibration control are achieved. Vibration performance can be secured
【００３７】次に、図７に基づいて本発明の第７の実施
形態について説明する。本実施形態では、通信機器筺体
１が、通信機器筺体本体１２とその上面に取り付けられ
る蓋体１３とから成っている。局部発振器２は端子５等
を介して基板４に半田付けにより固定されており、基板
４及び局部発振器２は、通信機器筺体本体１２の上面か
ら下方に向かって形成された凹部１４内において、基板
４における局部発振器２が取り付けられた面を上に向け
て取り付けられている。凹部１４の底部には、基板４か
ら突出した端子５を収容する凹部１５が形成されてい
る。蓋体１３は凹部１４の開口部を覆うように通信機器
筺体本体１２にネジ止めされており、蓋体１３とこれに
対向する局部発振器筺体３の底面との間に制振材７が設
けられている。Next, a seventh embodiment of the present invention will be described with reference to FIG. In this embodiment, the communication device housing 1 is composed of a communication device housing body 12 and a lid 13 attached to the upper surface thereof. The local oscillator 2 is fixed to the substrate 4 by soldering via the terminals 5 and the like, and the substrate 4 and the local oscillator 2 are disposed in the recess 14 formed downward from the upper surface of the communication device housing body 12 in the substrate 14. 4 is attached with the surface on which the local oscillator 2 is attached facing upward. At the bottom of the recess 14, a recess 15 for accommodating the terminal 5 protruding from the substrate 4 is formed. The lid 13 is screwed to the communication device housing body 12 so as to cover the opening of the recess 14, and the damping material 7 is provided between the lid 13 and the bottom surface of the local oscillator housing 3 facing the lid 13. ing.
【００３８】このような形態は、コスト等の問題により
局部発振器２を含めた部品を基板４の片面に実装しなけ
ればならない場合に有効である。片面実装の場合、通信
機器筺体１の蓋体１３が局部発振器３の上方に位置する
ため、このような形態で局部発振器２に対して放射性能
と振動制振性能を確保することができる。Such a form is effective when components including the local oscillator 2 have to be mounted on one surface of the substrate 4 due to cost and other problems. In the case of single-sided mounting, since the lid 13 of the communication device housing 1 is located above the local oscillator 3, it is possible to secure radiation performance and vibration damping performance for the local oscillator 2 in this manner.
【００３９】次に、図８に基づいて本発明の第８の実施
形態について説明する。本実施形態では、第７の実施形
態において、制振材７が、蓋体１３の通信機器筺体本体
１２への取り付けによって圧縮された際に、局部発振器
筺体３の底面全体に広がるとともに局部発振器筺体３の
側面に全周にわたって回り込むように形成されている。
このようにすることで、制振材７の局部発振器筺体３や
通信機器筺体１との接触面積が拡大するため、放熱性能
と振動吸収性能の向上を図ることができる。Next, an eighth embodiment of the present invention will be described with reference to FIG. In this embodiment, in the seventh embodiment, when the damping material 7 is compressed by attaching the lid 13 to the communication device housing body 12, the damping material 7 spreads over the entire bottom surface of the local oscillator housing 3 and the local oscillator housing. It is formed so as to surround the side surface of No. 3 over the entire circumference.
By doing so, the contact area of the damping material 7 with the local oscillator housing 3 and the communication equipment housing 1 is expanded, so that the heat radiation performance and the vibration absorption performance can be improved.
【００４０】ただし、第１の実施形態でも述べたよう
に、制振材７の圧縮に必要な力を組み立て時に加えるこ
とが可能な範囲内におさめる必要がある。また、制振材
７を圧縮しすぎた場合、振動エネルギーの吸収が悪くな
る可能性があるため、振動エネルギー吸収に適した圧縮
率で制振材７が圧縮されるように制振材７の厚みを設定
する必要がある。However, as described in the first embodiment, it is necessary to keep the force necessary for compressing the damping material 7 within a range that can be applied during assembly. Further, if the vibration damping material 7 is compressed too much, the absorption of the vibration energy may be deteriorated. Therefore, the vibration damping material 7 should be compressed so that the vibration damping material 7 is compressed at a compression rate suitable for absorbing the vibration energy. It is necessary to set the thickness.
【００４１】次に、図９に基づいて本発明の第９の実施
形態について説明する。本実施形態では、制振材７に局
部発振器筺体３を嵌め込むことができる凹部１６が形成
されていて、制振材７が局部発振器筺体３の側面に全周
にわたって接触するため、第７の実施形態に比べて制振
材７の通信機器筺体１及び局部発振器筺体３に対する接
触面積が拡大し、放射性能と振動吸収性能の向上を図る
ことができる。Next, a ninth embodiment of the present invention will be described with reference to FIG. In the present embodiment, the recess 16 into which the local oscillator housing 3 can be fitted is formed in the damping material 7, and the damping material 7 comes into contact with the side surface of the local oscillator housing 3 over the entire circumference. Compared to the embodiment, the contact area of the vibration damping material 7 with the communication device housing 1 and the local oscillator housing 3 is increased, and the radiation performance and the vibration absorption performance can be improved.
【００４２】本実施形態の効果は第８の実施形態と同様
であるが、制振材７が局部発振器筺体３を嵌め込むこと
ができるように形成されているため、局部発振器筺体３
に大きな圧力をかけることなく、制振材７を局部発振器
筺体３及び通信機器筺体１に広い面積にわたって接触さ
せることができる。The effect of this embodiment is similar to that of the eighth embodiment, but since the damping material 7 is formed so that the local oscillator housing 3 can be fitted therein, the local oscillator housing 3 is formed.
It is possible to bring the damping material 7 into contact with the local oscillator housing 3 and the communication device housing 1 over a large area without applying a large pressure to the housing.
【００４３】[0043]
【発明の効果】以上説明したように本発明の通信機器
は、局部発振器筐体と通信機器筐体の間に熱伝導性の制
振材を設けたことにより、制振材を介して局部発振器筐
体から通信機器筐体への熱回路が新たな形成されるた
め、外気温と局部発振器筐体との温度差が小さくなり、
局部発振器の周波数の変動が小さくなる。それと同時
に、振動エネルギーが局部発振器筐体に与えられた場合
も制振材により振動エネルギーの一部が吸収されるた
め、振動による局部発振器の振動数変動も小さくなる。
局部発振器を収容する内面と局部発振器筐体の間に導電
性を有する振動吸収用のバネを設けたことにより、局部
発振器筐体が通信機器筐体を介して接地されるため、局
部発振器の動作が安定する。また、バネは振動を制振す
る機能も果たすため、振動による局部発振器の周波数変
動も小さくなる。 As described above, the communication device of the present invention is provided with the thermally conductive damping material between the local oscillator housing and the communication equipment housing, so that the local oscillator is provided through the damping material. Since a new thermal circuit is formed from the case to the communication device case, the temperature difference between the outside air temperature and the local oscillator case is reduced,
The fluctuation of the frequency of the local oscillator is reduced. At the same time, when the vibration energy is applied to the local oscillator housing, a part of the vibration energy is absorbed by the damping material, so that the frequency fluctuation of the local oscillator due to the vibration is also reduced.
Conduction between the inner surface that houses the local oscillator and the local oscillator housing
By providing a spring that absorbs vibration,
Since the oscillator housing is grounded via the communication equipment housing,
The operation of the local oscillator becomes stable. Also, the spring damps the vibration.
Function of the local oscillator
The movement also becomes smaller.
【００４４】また、制振材が導電性を有することによ
り、局部発振器筐体が通信機器筐体を介して接地した状
態となるため、局部発振器の動作が安定する。[0044] Also, by damping materials is conductive, since a state of the local oscillator housing is grounded via the communication device housing, the operation of the local oscillator is stabilized.
【００４５】[0045]
【００４６】また、基板が、局部発振器を収容する凹部
の開口部を覆うように形成されるとともに凹部の開口部
に対向する部位に空気抜き用の孔が設けたことにより、
基板及び局部発振器を通信機器筐体に取り付ける際に空
気抵抗が少なくなるため、組み立て易くなる。[0046] By board is a hole for air vent at a portion facing the opening of the recess while being formed so as to cover the opening of the recess for accommodating the local oscillator is provided,
Air resistance is reduced when the board and the local oscillator are attached to the communication device housing, which facilitates assembly.
【００４７】また、制振材が、流動性を有する状態で前
記通信機器筺体内に充填されるとともに、局部発振器を
通信機器筺体に組み込んだ状態で保形性を有する状態に
変化させ得るように成したものであることにより、通信
機器筐体における局部発振器の取り付け箇所及び局部発
振器筐体が複雑な形状である場合でも、制振材が通信機
器筐体及び局部発振器筐体の表面形状に沿った形状にな
るため、制振材の通信機器筐体及び局部発振器筐体との
接触面積を大きくすることができ、高い放熱性能及び振
動制振性能を確保することができる。 Further, damping materials is, as with be filled to the communication device within the housing in a fluid state may change to a state having a shape retention while incorporating a local oscillator to the communication device housing Even if the local oscillator mounting location in the communication device housing and the local oscillator housing have a complicated shape, the damping material follows the surface shape of the communication device housing and the local oscillator housing. Since the shape is changed, the contact area of the vibration damping material with the communication device housing and the local oscillator housing can be increased, and high heat dissipation performance and vibration damping performance can be secured.
【図１】 本発明の第１の実施形態の概略構成を示す断
面図。FIG. 1 is a sectional view showing a schematic configuration of a first embodiment of the present invention.
【図２】 本発明の第２の実施形態の概略構成を示す断
面図。FIG. 2 is a sectional view showing a schematic configuration of a second embodiment of the present invention.
【図３】 本発明の第３の実施形態の概略構成を示す断
面図。FIG. 3 is a sectional view showing a schematic configuration of a third embodiment of the present invention.
【図４】 本発明の第４の実施形態の概略構成を示す断
面図。FIG. 4 is a sectional view showing a schematic configuration of a fourth embodiment of the present invention.
【図５】 本発明の第５の実施形態の概略構成を示す分
解斜視図。FIG. 5 is an exploded perspective view showing a schematic configuration of a fifth embodiment of the present invention.
【図６】 本発明の第６の実施形態の概略構成を示す断
面図。FIG. 6 is a sectional view showing a schematic configuration of a sixth embodiment of the present invention.
【図７】 本発明の第７の実施形態の概略構成を示す断
面図。FIG. 7 is a sectional view showing a schematic configuration of a seventh embodiment of the present invention.
【図８】 本発明の第８の実施形態の概略構成を示す断
面図。FIG. 8 is a sectional view showing a schematic configuration of an eighth embodiment of the present invention.
【図９】 本発明の第９の実施形態の概略構成を示す断
面図。FIG. 9 is a sectional view showing a schematic configuration of a ninth embodiment of the present invention.
【図１０】 従来の通信機器の概略構成を示す断面図。FIG. 10 is a sectional view showing a schematic configuration of a conventional communication device.
１ 通信機器筺体 ２ 局部発振器 ３ 局部発振器筺体 ４ 基板 ６ 凹部 ７ 制振材 １０ バネ 1 communication equipment housing 2 local oscillator 3 Local oscillator housing 4 substrates 6 recess 7 damping material 10 springs
フロントページの続き (56)参考文献 特開 平４−304703（ＪＰ，Ａ) 特開 平３−261203（ＪＰ，Ａ) 特開 平７−58460（ＪＰ，Ａ) 実開 平２−133033（ＪＰ，Ｕ) Ｖｏｌｔａｇｅ Ｃｏｎｔｒｏｌｌｅ ｄ Ｏｓｃｉｌｌａｔｏｒｓ，ＭＩＣＲ ＯＷＡＶＥＳ＆ＲＦ，Ａ ＰＥＮＴＯＮ ＰＵＢＬＩＣＡＴＩＯＮ，1998年12 月，ＶＯＬ．37，ＮＯ．12，ｐ．575 (58)調査した分野(Int.Cl.7，ＤＢ名) H03B 1/00 H04B 1/03 H04B 1/08 H05K 5/02 H05K 7/20 Continuation of the front page (56) References JP-A-4-304703 (JP, A) JP-A-3-261203 (JP, A) JP-A-7-58460 (JP, A) Actual Kaihei 2-130333 (JP , U) Voltage Controlled Oscillators, MICR OWAVES & RF, A PENTON PUBLICATION, December 1998, VOL. 37, NO. 12, p. 575 (58) Fields investigated (Int.Cl. 7 , DB name) H03B 1/00 H04B 1/03 H04B 1/08 H05K 5/02 H05K 7/20
Claims (4)
固定された局部発振器とを具備し、前記局部発振器がフ
リーランＤＲＯであり、かつ局部発振器本体を局部発振
器筺体により封止して成るものである通信機器におい
て、前記通信機器筺体が前記局部発振器を収容する凹部を有
し、前記局部発振器は、基板上に固定された状態で前記
凹部内に収容されるとともに前記基板を介して前記通信
機器筺体上に固定され、熱伝導性の制振材を前記凹部の
内面と前記局部発振器筺体の間に設け、さらに前記凹部
の内面と前記局部発振器筺体の間に導電性を有する振動
吸収用のバネを設けた ことを特徴とする通信機器。1. A communication device housing, and a local oscillator fixed on the communication device housing, wherein the local oscillator is a free-run DRO, and the local oscillator body is sealed by the local oscillator housing. In the communication device, the communication device housing has a recess for accommodating the local oscillator.
The local oscillator is fixed on the substrate
The communication is accommodated in the recess and via the substrate.
A damping material that is fixed on the equipment housing and that has thermal conductivity is
Provided between the inner surface and the local oscillator housing, and further the recess
Vibration between the inner surface of the antenna and the local oscillator housing
A communication device characterized by having a spring for absorption .
とする請求項１に記載の通信機器。2. The communication device according to claim 1, wherein the damping material has conductivity.
うに形成されるとともに前記開口部に対向する部位に空
気抜き用の孔が設けられたことを特徴とする請求項１に
記載の通信機器。3. The communication according to claim 1 , wherein the substrate is formed so as to cover the opening of the recess, and an air vent hole is provided at a portion facing the opening. machine.
記通信機器筺体内に充填されるとともに、前記局部発振
器を前記通信機器筺体に組み込んだ状態で保形性を有す
る状態に変化させ得るように成したものであることを特
徴とする請求項１〜請求項３のいずれかに記載の通信機
器。4. The damping material is filled in the communication device housing in a fluid state, and is changed to have a shape retention property in a state where the local oscillator is incorporated in the communication device housing. The communication device according to any one of claims 1 to 3, which is configured to be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23217699A JP3510818B2 (en) | 1999-08-19 | 1999-08-19 | Communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23217699A JP3510818B2 (en) | 1999-08-19 | 1999-08-19 | Communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001057508A JP2001057508A (en) | 2001-02-27 |
| JP3510818B2 true JP3510818B2 (en) | 2004-03-29 |
Family
ID=16935206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23217699A Expired - Fee Related JP3510818B2 (en) | 1999-08-19 | 1999-08-19 | Communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3510818B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289191A (en) | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| CN113840513B (en) * | 2021-08-10 | 2023-04-11 | 中国电子科技集团公司第二十九研究所 | Vibration damping and heat dissipation locking device with adjustable vibration damping frequency |
-
1999
- 1999-08-19 JP JP23217699A patent/JP3510818B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| Ｖｏｌｔａｇｅ Ｃｏｎｔｒｏｌｌｅｄ Ｏｓｃｉｌｌａｔｏｒｓ，ＭＩＣＲＯＷＡＶＥＳ＆ＲＦ，Ａ ＰＥＮＴＯＮ ＰＵＢＬＩＣＡＴＩＯＮ，１９９８年１２月，ＶＯＬ．３７，ＮＯ．１２，ｐ．５７５ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001057508A (en) | 2001-02-27 |
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