JP3507791B2 - Electronic equipment with heat dissipation structure - Google Patents
Electronic equipment with heat dissipation structureInfo
- Publication number
- JP3507791B2 JP3507791B2 JP2000353486A JP2000353486A JP3507791B2 JP 3507791 B2 JP3507791 B2 JP 3507791B2 JP 2000353486 A JP2000353486 A JP 2000353486A JP 2000353486 A JP2000353486 A JP 2000353486A JP 3507791 B2 JP3507791 B2 JP 3507791B2
- Authority
- JP
- Japan
- Prior art keywords
- fan
- heat
- heat dissipation
- main body
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は放熱構造を有する電
子機器、特に、ノートパソコン等のＣＰＵを冷却する放
熱構造を有する電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heat dissipation structure, and more particularly to an electronic device having a heat dissipation structure for cooling a CPU such as a notebook computer.
【０００２】[0002]
【従来の技術】従来の放熱構造を有する電子機器につい
て図面を参照して詳細に説明する。2. Description of the Related Art An electronic device having a conventional heat dissipation structure will be described in detail with reference to the drawings.
【０００３】図３は第１の従来例を示す部分断面図であ
る。（例えば、特開２０００−１１２５７２号公報参
照）。FIG. 3 is a partial sectional view showing a first conventional example. (For example, refer to Japanese Patent Application Laid-Open No. 2000-112572).
【０００４】ＣＰＵ２０３にはＣＰＵ２０３の熱を伝達
する熱伝達部材である放熱グリース２０６を介して熱排
出部材であるファン２０７が密着するように取り付けら
れている。ファン２０７は回転軸方向に空気を吸入し、
円周方向に排出する構造のものである。２０１ａと２０
１ｂは筐体２０１に設けられた複数のスリットからなる
開口部である。２０８および２０９はファン２０７と開
口部２０１ａおよび２０１ｂとの間に設けられた遮蔽の
ためのダクトで、ファン２０７による空気の流れが他に
漏れないようにしている。２０１ｃは筐体２０１に設け
られたリブでプリント配線基板２０２上のＣＰＵ２０３
を囲うように形成されている。A fan 207, which is a heat-discharging member, is attached to the CPU 203 so as to be in close contact therewith via a heat-dissipating grease 206, which is a heat-transmitting member that transmits the heat of the CPU 203. The fan 207 sucks air in the rotation axis direction,
It has a structure of discharging in the circumferential direction. 201a and 20
Reference numeral 1b is an opening formed in the housing 201 and including a plurality of slits. Reference numerals 208 and 209 denote ducts provided between the fan 207 and the openings 201a and 201b for shielding, and prevent the air flow from the fan 207 from leaking to other parts. Reference numeral 201c denotes a rib provided on the housing 201, and the CPU 203 on the printed wiring board 202.
It is formed so as to surround.
【０００５】以下その動作を説明する。ファン２０７は
ノートパソコンの駆動とともに回転するが、これによっ
て筐体２０１の底面に設けられた開口部２０１ａより外
気が流入し、ダクト２０８からファン２０７の内部を通
り、ダクト２０９を経由して開口部２０１ｂより排出さ
れる。ＣＰＵ２０３から発生した熱は放熱グリース２０
６を介してファン２０７に伝達されるが、ファン２０７
を通過する外気によって発散する。暖められた外気はそ
のまま排出され、これによりＣＰＵ２０３が冷却され
る。この際、ファン２０７に流入し排出される外気はダ
クト２０８および２０９によって他に漏れにくいため、
ＣＰＵ２０３は最も冷たい空気によって冷却され、かつ
冷やす事に使用され、暖められた空気は電子機器内部へ
対流する事無く、外部へ排出される。また、外気の流入
はファン２０７の軸方向に広い面積で流入し、ＣＰＵ２
０３に平面的に接するので、冷却効果が高くなる。ま
た、リブ２０１ｃによってＣＰＵ２０３からの熱は筐体
内部の他の電子部品やハードディスクドライブ装置、バ
ッテリーに伝わらず、逆に流入する外気がこれらの発熱
によって暖められることもない。The operation will be described below. The fan 207 rotates with the drive of the notebook computer, but outside air flows in through the opening 201a provided on the bottom surface of the housing 201, passes through the inside of the fan 207 from the duct 208, and passes through the duct 209. It is discharged from 201b. The heat generated from the CPU 203 is heat radiating grease 20.
6 is transmitted to the fan 207,
Emitted by outside air passing through. The warmed outside air is discharged as it is, whereby the CPU 203 is cooled. At this time, since the outside air that flows into and is discharged from the fan 207 is less likely to leak to the other by the ducts 208 and 209,
The CPU 203 is used for cooling and cooling with the coldest air, and the warmed air is discharged outside without convection inside the electronic device. Also, the inflow of outside air flows in a large area in the axial direction of the fan 207, and the CPU 2
Since it is in planar contact with 03, the cooling effect is high. Further, the heat from the CPU 203 is not transmitted to the other electronic components inside the housing, the hard disk drive device, and the battery by the rib 201c, and the outside air flowing in reverse is not warmed by these heat generations.
【０００６】これにより、ファン２０７はＣＰＵ２０３
のみを冷却するのに十分な能力のものでよくなり、従来
３５ｄｂ以上だった騒音を３０ｄｂ程度に押えられる。As a result, the fan 207 is operated by the CPU 203.
It only needs to have enough capacity to cool only the noise, and it can suppress the noise which was 35db or more in the past to about 30db.
【０００７】なお、開口部２０１ａ、２０１ｂはＣＰＵ
２０３の近傍、少なくとも筐体内部の他の電子部品やハ
ードディスクドライブ装置、バッテリーなど、多少の発
熱を伴う部品、ユニット等よりもＣＰＵに近接した位置
にあればよい。The openings 201a and 201b are CPUs.
It suffices that it be located in the vicinity of 203, at least in a position closer to the CPU than other electronic components inside the housing, a hard disk drive device, a battery, and other components and units that generate a little heat.
【０００８】なお、本例では、ダクトを別部品としてい
るが、筐体２０１と一体としたり、筐体２０１のリブ
と、プリント配線基板などと組み合わせることによって
ダクト形状を形成してもよい。いずれにしても、多少隙
間があいても外気の漏れはほとんど生じない。Although the duct is a separate component in this example, the duct shape may be formed integrally with the casing 201 or by combining the rib of the casing 201 with a printed wiring board or the like. In any case, even if there is a gap, the outside air hardly leaks.
【０００９】また、外気が流入するための開口部を筐体
の底面、排出するための開口部を側面に設けたが、これ
を逆にしたり、あるいは上面と側面、側面同士というよ
うにどのような組合せとしてもよい。Further, although the opening for the outside air to flow in is provided on the bottom surface of the housing and the opening for the discharge is provided on the side surface, this may be reversed, or the upper surface and the side surface, or the side surfaces may be replaced with each other. Any combination may be used.
【００１０】また、ＣＰＵとファンを放熱グリースを介
して密着させたが、放熱ゴムとしたり、さらにヒートシ
ンクなどの熱伝達放熱部材を介在させてもよい。また、
ＣＰＵとファンをわずかな隙間をあけて配置してもよ
い。Although the CPU and the fan are brought into close contact with each other via the heat radiating grease, they may be made of heat radiating rubber, or a heat transfer heat radiating member such as a heat sink may be interposed. Also,
The CPU and the fan may be arranged with a slight gap.
【００１１】この例では、筐体サイズの薄型化のためフ
ァンを横置きに収容している。しかし、ファンの厚さ及
びファン前後に必要となる空間以下に筐体サイズを薄型
化することはできない。付属装置との連動により発熱素
子の処理性能が増大し発熱量が大きくなる場合、ファン
の大型化が必要になるとともに、ファン前後に必要とな
る空間も大きくなる。従って、筐体サイズの薄型化が困
難になる。In this example, the fan is housed in a horizontal position in order to reduce the size of the housing. However, it is not possible to make the housing thin below the thickness of the fan and the space required before and after the fan. When the processing performance of the heating element is increased and the amount of heat generated is increased due to the linkage with the attached device, the fan needs to be upsized and the space required before and after the fan also becomes large. Therefore, it is difficult to reduce the housing size.
【００１２】図４は第２の従来例を示す部分断面図であ
る。（例えば、特開平１１−２１９２３５号公報参
照）。FIG. 4 is a partial sectional view showing a second conventional example. (See, for example, Japanese Patent Laid-Open No. 11-219235).
【００１３】この電子装置は、大別して、ＣＰＵ(中央
演算処理ユニット)など中枢機能を有する本体中枢部Ａ
と、本体中枢部Ａで処理された結果を表示する表示装置
を有する表示部Ｂと、本体中枢部Ａ、又は本体中枢部Ａ
及び表示部Ｂを冷却するためのファンを有する付属部Ｃ
とから構成されている。This electronic device is roughly classified into a main body central portion A having a central function such as a CPU (central processing unit).
And a display unit B having a display device for displaying the result processed by the main body central part A, the main body central part A, or the main body central part A.
And an accessory C having a fan for cooling the display B
It consists of and.
【００１４】本体中枢部は、ＣＰＵ（中央演算処理ユニ
ット）等の特に発熱量の大きい素子１（以下、ＣＰＵ１
と称す）を下面に取り付けられたサブ配線基板６と、該
サブ配線基板６及び複数の素子を上面に搭載しているメ
イン基板１２と、配線基板６の上側に配置されたキーボ
ード１４と、上記のサブ配線基板６、メイン基板１２な
どを内部に収容し、キーボード１４を上面に配置した第
１の筐体１００とからなる。表示部Ｂは表示装置と、こ
の表示装置を収容する第２の筐体１６とからなり、そし
て第２の筐体１６は第１の筐体１００にヒンジ継手を介
して、両筐体が互いに折り重なるよう、転回可能にとり
つけられている。The central portion of the main body is an element 1 (hereinafter, CPU 1) having a particularly large heat generation amount such as a CPU (central processing unit).
(Hereinafter referred to as ") is attached to the lower surface, a sub-wiring board 6 having the sub-wiring board 6 and a plurality of elements mounted on the upper surface, a keyboard 14 disposed above the wiring board 6, The sub-wiring board 6, the main board 12, and the like are housed inside, and the keyboard 14 is arranged on the upper surface of the first housing 100. The display unit B includes a display device and a second housing 16 that accommodates the display device. The second housing 16 is connected to the first housing 100 via a hinge joint so that the two housings are mutually connected. It is mounted so that it can be folded and folded.
【００１５】第１の筐体１００の内底面部には、放熱板
１１が敷設されている。放熱板１１は、必要に応じて第
１の筐体１００底面とほぼ同面積で、さらに該筐体の背
面まで設置される。また、第１の筐体１００自体をＭｇ
合金などの高熱伝導性材料で成形することによって、放
熱板１１を筐体と兼用してもよい。サブ配線基板６下面
に実装されたＣＰＵ１は、その下側に柔軟熱伝導部材２
（たとえばＳｉゴムに酸化アルミなどのフィラーを混入
したもの）を介して拡大金属板８がとりつけられ、さら
に拡大金属板８の下面に接して放熱板１０が設けられて
いる。サブ配線基板６はその縁部がコネクタを介してメ
イン基板１２にとりつけられ、そして両基板６、１２の
間には上記ＣＰＵ１、熱伝導部材として柔軟熱伝導部材
２、拡大金属板８及び放熱板１０が設置されている。一
方、ＣＰＵ１が取り付けられたサブ配線基板６上面に
は、柔軟熱伝導部材３を介して放熱部材７が設置され、
その上にキーボード１４が設置されている。放熱部材７
とキーボード１４を支持するベース部５（熱伝導率の高
い金属製であることが望ましい）とは、直接に接触する
か、もしくは柔軟熱伝導部材４などを介して熱的に接続
されている。サブ基板６及び該基板６上の放熱部材７
は、それらの縁部が、熱伝導性材料（銅、真鋳、アルミ
など）で成形されたボス９を介して、下方にある放熱板
１０の端部、メイン基板１２及び放熱板１１と共締めさ
れ、かつ、熱的にも接続されている。A heat radiating plate 11 is laid on the inner bottom surface of the first casing 100. If necessary, the heat dissipation plate 11 has substantially the same area as the bottom surface of the first housing 100, and is further installed up to the back surface of the housing. In addition, the first housing 100 itself is
The heat dissipation plate 11 may also be used as a housing by molding with a high thermal conductivity material such as an alloy. The CPU 1 mounted on the lower surface of the sub wiring board 6 has a flexible heat conduction member 2 on the lower side thereof.
The expanded metal plate 8 is attached via (for example, Si rubber mixed with a filler such as aluminum oxide), and the heat dissipation plate 10 is provided in contact with the lower surface of the expanded metal plate 8. The sub-wiring board 6 has its edge attached to the main board 12 via a connector, and the CPU 1, the flexible heat conducting member 2 as a heat conducting member, the enlarged metal plate 8 and the heat radiating plate are mounted between the two substrates 6 and 12. 10 are installed. On the other hand, on the upper surface of the sub wiring board 6 to which the CPU 1 is attached, the heat dissipation member 7 is installed via the flexible heat conduction member 3,
A keyboard 14 is installed on it. Heat dissipation member 7
The base portion 5 supporting the keyboard 14 (which is preferably made of a metal having a high thermal conductivity) are in direct contact with each other or are thermally connected to each other via the flexible thermal conduction member 4 or the like. Sub substrate 6 and heat dissipation member 7 on the substrate 6
The edges of the heat sink 10 and the main board 12 and the heat sink 11 are located below the end of the heat sink 10 via the boss 9 formed of a heat conductive material (copper, brass, aluminum, etc.). It is fastened and also thermally connected.
【００１６】拡大金属板８、放熱板１１、放熱部材７
は、いずれも、面方向に熱を拡散して放熱効果を向上さ
せる。ＣＰＵ１で発生した熱の一部は、柔軟熱伝導部材
２、拡大金属板８、放熱板１０、放熱板１１を介して第
１の筐体１００の底面から外気に放熱される。さらにＣ
ＰＵ１で発生した熱の一部は、サブ基板６、柔軟熱伝導
部材３、放熱部材７を介し、キーボード１４の表面から
放熱される熱と、ボス９、放熱板１１を介して筐体１０
０の底面から外気に放熱される熱とに分配される。Enlarged metal plate 8, heat dissipation plate 11, heat dissipation member 7
In both cases, heat is diffused in the surface direction to improve the heat dissipation effect. Part of the heat generated by the CPU 1 is radiated to the outside air from the bottom surface of the first housing 100 via the flexible heat conducting member 2, the expanded metal plate 8, the heat radiating plate 10 and the heat radiating plate 11. Furthermore C
Part of the heat generated in the PU 1 is radiated from the surface of the keyboard 14 via the sub-board 6, the flexible heat conducting member 3 and the heat radiating member 7, and the casing 10 via the boss 9 and the heat radiating plate 11.
It is distributed to the heat radiated from the bottom surface of 0 to the outside air.
【００１７】電子装置を構成する付属部Ｃは、記憶装置
１９と、ファン２０と、ファン２０を制御する素子２２
を搭載した配線基板２１と、これら部品１９、２０、２
１等を収容し、かつファン２０用の空気取り入れ口を側
面に、そして空気吹き出し口を上面に形成された付属筐
体１０１とから構成される。ファン２０は、配線基板２
１からコネクタ２３を介し接続される。付属筐体１０１
と本体中枢部の第１の筐体１００とは、コネクタ２４及
び１７によってそれぞれ接続され、第１の筐体１００内
の配線基板１２と付属筐体１０１内の配線基板２１が電
気的に接続される。配線基板１２または２１には、付属
筐体１０１内の電子回路と本体１００内の電子回路が接
続されたことを検知する回路と、該回路と連動したＣＰ
Ｕ１の処理性能制御回路（たとえば、クロック周波数可
変回路）と、ＣＰＵ１の処理性能制御回路と連動したフ
ァン２０の制御回路（たとえば、ファンの回転数制御
や、ファンのオンオフ制御）とを含んでいる。The accessory unit C constituting the electronic device includes a storage device 19, a fan 20, and an element 22 for controlling the fan 20.
A wiring board 21 on which the components are mounted and these components 19, 20, 2
1 and the like, and includes an accessory housing 101 in which an air intake port for the fan 20 is formed on a side surface and an air outlet port is formed on an upper surface. The fan 20 is the wiring board 2
1 through the connector 23. Attached case 101
And the first housing 100 in the central portion of the main body are connected by connectors 24 and 17, respectively, and the wiring board 12 in the first housing 100 and the wiring board 21 in the accessory housing 101 are electrically connected. It On the wiring board 12 or 21, a circuit for detecting that the electronic circuit in the accessory housing 101 and the electronic circuit in the main body 100 are connected, and a CP interlocked with the circuit
It includes a processing performance control circuit of U1 (for example, a clock frequency variable circuit) and a control circuit of the fan 20 (for example, fan rotation speed control and fan on / off control) linked with the processing performance control circuit of the CPU1. .
【００１８】次に、動作について説明する。実施の形態
１の電子装置の本体を、付属部Ｃを切り離して使用する
場合、ＣＰＵ１で発生した熱は、本体の第１の筐体１０
０内に設置された放熱部材によって、前述のようにキー
ボード１４の表面及び筐体１００の底面から分配されて
それぞれ外気に放熱される。付属部Ｃなしに電子装置を
携帯して使用する場合、通常、ＣＰＵ１は最大性能で動
作させる必要はない。従って、第１の筐体１００内に設
置された放熱部材だけによる放熱が可能である。Next, the operation will be described. When the main body of the electronic device according to the first embodiment is used with the accessory C separated, the heat generated by the CPU 1 is generated by the first housing 10 of the main body.
As described above, the heat dissipating member installed inside the housing 0 disperses heat from the surface of the keyboard 14 and the bottom surface of the housing 100 to radiate heat to the outside air. When carrying and using the electronic device without the attachment C, the CPU 1 usually does not need to operate at maximum performance. Therefore, heat can be dissipated only by the heat dissipating member installed in the first housing 100.
【００１９】一方、本体に付属部Ｃと接続して電子装置
を使用する場合、付属筐体１０１内の記憶装置１９、素
子２２を搭載した配線基板２１等で構成される付属部Ｃ
によって、本体のＣＰＵ１の性能をフルに活用した処理
が可能となる。付属筐体１０１が本体の第１の筐体１０
０に接続され、付属装置と本体内の各電子回路が接続さ
れると、本体はこれを検出して付属装置及び本体が連動
して動作する。この時、ＣＰＵの処理性能が増大する
(処理性能制御手段による)と、それと同時に付属筐体０
１内に収容されたファン２０もこの動作と連動して作動
する。これらの動作は、本体筐体１００内の配線基板１
２に組み込まれた電子回路と付属筐体１０１内の配線基
板２１に組み込まれた電子回路とが接続されたことを検
知する回路、それと連動したＣＰＵ１の処理性能制御回
路、及びＣＰＵ１の処理性能制御回路と連動したファン
２０の制御回路によって行われる。ファン２０の動作に
よって、付属筐体１０１側面の空気取り入れ口を通じて
外部から空気が入気し（２５）、上面の空気吹き出し口
を通じて本体の第１の筐体１００の底面に吹き付けられ
る(２６)。この吹き付けられた冷却風は、筐体１０の下
に設けられた足１８によって第１の筐体１００と付属筐
体１０１との形成された間隙を通過する。従って、付属
筐体１０１内に収容されたファン２０は、第１の筐体１
００内に収容された放熱構造の持つ冷却能力に加えて、
さらにＣＰＵ１を冷却する。On the other hand, when the electronic device is used by connecting it to the accessory unit C on the main body, the accessory unit C composed of the storage device 19 in the accessory housing 101, the wiring board 21 on which the element 22 is mounted, and the like.
With this, it is possible to perform processing that makes full use of the performance of the CPU 1 of the main body. The first housing 10 whose main body is the accessory housing 101
0, and when the accessory device and each electronic circuit in the main body are connected, the main body detects this and the accessory device and the main body operate together. At this time, the processing performance of the CPU increases
(Depending on the processing performance control means), and at the same time, the accessory enclosure 0
The fan 20 housed inside 1 also operates in conjunction with this operation. These operations are performed by the wiring board 1 in the main body housing 100.
2, a circuit for detecting connection between the electronic circuit incorporated in the wiring board 21 and the electronic circuit incorporated in the wiring board 21 in the accessory housing 101, a processing performance control circuit of the CPU 1 interlocked therewith, and a processing performance control of the CPU 1. This is performed by the control circuit of the fan 20 which is linked to the circuit. By the operation of the fan 20, air is introduced from the outside through the air intake port on the side surface of the accessory housing 101 (25) and is blown onto the bottom surface of the first housing 100 of the main body through the air outlet port on the upper surface (26). The blown cooling air passes through the gap formed between the first casing 100 and the accessory casing 101 by the legs 18 provided under the casing 10. Therefore, the fan 20 housed in the accessory housing 101 is
In addition to the cooling capacity of the heat dissipation structure housed in 00,
Further, the CPU 1 is cooled.
【００２０】本例では、本体の第１の筐体１００下面に
冷却風を吹き付けることで、該筐体１００底面側の放熱
性能を向上させている。第１の筐体１００底面側の放熱
性能を向上させる冷却方式では、ＣＰＵ１の熱のキーボ
ード側と底面側への放熱量分配割合が、付属筐体１０１
による冷却が行われることによって底面側への分配割合
が増大する。従って、本方式は、付属筐体１０１の接続
によってＣＰＵ１の発熱量が増大しても、本体の第１の
筐体１００底面側で選択的に放熱性能を向上させること
によって、オペレータの触れるキーボード１４表面温度
の上昇抑制に対して効果的な方法となる。逆に、第１の
筐体１００底面側の温度上昇につながるが、付属筐体１
０１接続時には、該筐体１００底面をオペレータが直接
触れることがないので問題とならない。これによって、
付属装置との連動による装置の処理性能向上に伴いＣＰ
Ｕの発熱量が増大しても、本体の第１の筐体サイズを厚
くすることなく、すなわち、本体携帯時の使用での利便
性を損なうことなく、さらには、オペレータの触れる筐
体表面の温度上昇を抑えながらＣＰＵ１の冷却が可能と
なる。In this example, cooling air is blown to the lower surface of the first housing 100 of the main body to improve the heat dissipation performance on the bottom surface side of the housing 100. In the cooling method that improves the heat dissipation performance on the bottom surface side of the first housing 100, the heat dissipation amount distribution ratio of the heat of the CPU 1 to the keyboard side and the bottom surface side is determined by the accessory housing 101.
As a result of cooling by, the distribution ratio to the bottom side increases. Therefore, in this method, even if the amount of heat generated by the CPU 1 increases due to the connection of the accessory housing 101, the keyboard 14 touched by the operator is selectively improved by selectively improving the heat dissipation performance on the bottom surface side of the first housing 100 of the main body. This is an effective method for suppressing the rise in surface temperature. On the contrary, although the temperature rises on the bottom side of the first casing 100, the attached casing 1
At the time of 01 connection, there is no problem because the operator does not directly touch the bottom surface of the housing 100. by this,
CP along with the improvement of the processing performance of the device by linking with the attached device
Even if the amount of heat generated by U increases, the size of the first housing of the main body is not increased, that is, the convenience of use when carrying the main body is not impaired. The CPU 1 can be cooled while suppressing the temperature rise.
【００２１】[0021]
【発明が解決しようとする課題】上述した従来の放熱構
造を有する電子機器は、排気口パネルのスリットの形状
が、上下にまっすぐに穴があけられているので、空気の
流れが床面に対してスムーズに流れにくいという欠点が
あった。In the electronic device having the conventional heat dissipation structure described above, since the slit shape of the exhaust port panel is formed by vertically piercing the slits, the air flow with respect to the floor surface. It had the drawback of not flowing smoothly and smoothly.
【００２２】[0022]
【課題を解決するための手段】第１の発明の放熱構造を
有する電子機器は、本体（３０１）の底面に設けられた
排気穴パネル（３０４）と本体３０１に内蔵されるＣＰ
Ｕ（３０３）の発熱を排気穴パネル（３０４）に向けて
送風するファン（３０２）とを備える放熱構造を有する
電子機器において、排気穴パネル（３０４）のスリット
（３０５）を本体（３０１）の外側に向って斜にいれて
あることを特徴とする放熱構造を有する。An electronic device having a heat dissipation structure according to the first aspect of the present invention includes an exhaust hole panel (304) provided on a bottom surface of a main body (301) and a CP incorporated in the main body 301.
In an electronic device having a heat dissipation structure including a fan (302) that blows the heat generated by U (303) toward an exhaust hole panel (304), the slit (305) of the exhaust hole panel (304) is provided in the main body (301). It has a heat dissipation structure characterized by being inclined toward the outside.
【００２３】第２の発明の放熱構造を有する電子機器
は、第１の発明において、排気穴パネル（３０４）に排
気用の金網を設ける。In the electronic device having the heat dissipation structure of the second invention, the exhaust hole panel (304) is provided with an exhaust metal mesh in the first invention.
【００２４】第３の発明の放熱構造を有する電子機器
は、第１の発明において、排気穴パネル（３０４）は本
体（３０１）の手前から後方にスライドできるようにな
っており、ファン（３０２）からの排気を直接本体（３
０１）の外に排出する。In the electronic device having the heat dissipation structure of the third invention, in the first invention, the exhaust hole panel (304) is slidable from the front side of the main body (301) to the rear side, and the fan (302). Exhaust directly from the body (3
It is discharged to outside of 01).
【００２５】第４の発明の放熱構造を有する電子機器
は、第１の発明において、本体（３０１）の底面に取り
付けるものであって、排気穴パネル（３０４）をスライ
ドさせるためのフック（３１３）を有する拡張ユニット
（３１１）を備える。An electronic device having a heat dissipation structure according to a fourth aspect of the present invention is the electronic device according to the first aspect, which is attached to the bottom surface of the main body (301) and has a hook (313) for sliding the exhaust hole panel (304). And an expansion unit (311) having
【００２６】第５の発明の放熱構造を有する電子機器
は、第１の発明において、拡張ユニット（３１１）にフ
ァン（３１２）を増設する。In the electronic device having the heat dissipation structure of the fifth invention, the fan (312) is added to the expansion unit (311) in the first invention.
【００２７】第６の発明の放熱構造を有する電子機器
は、第５の発明において、ファン（３１２）の排気方向
を側面に設定する。In the electronic device having the heat dissipation structure of the sixth invention, the exhaust direction of the fan (312) is set to the side surface in the fifth invention.
【００２８】[0028]
【発明の実施の形態】次に、本発明について図面を参照
して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings.
【００２９】図１は本発明の第１の実施形態を示す断面
図である。図１に示す放熱構造を有する電子機器は、本
体３０１の底面に設けられた排気穴パネル３０４と本体
３０１に内蔵されるＣＰＵ３０３の発熱を排気穴パネル
３０４に向けて送風するファン３０２とを備える放熱構
造を有する電子機器において、排気穴パネル３０４のス
リット３０５を本体３０１の外側に向って斜にいれてあ
る。FIG. 1 is a sectional view showing a first embodiment of the present invention. The electronic device having the heat dissipation structure shown in FIG. 1 includes an exhaust hole panel 304 provided on the bottom surface of the main body 301 and a fan 302 that blows the heat generated by the CPU 303 built in the main body 301 toward the exhaust hole panel 304. In the electronic device having the structure, the slit 305 of the exhaust hole panel 304 is slanted toward the outside of the main body 301.
【００３０】本体３０１の放熱対策のためにファン３０
２がＣＰＵ３０３の真下に実装されており、空気は本体
３０１内部あるいは、本体３０１の側面吸気口から吸い
込み、ファン３０２の下方、本体３０１の底面に排出さ
れる構造になっている。A fan 30 is provided to prevent heat radiation from the main body 301.
2 is mounted right under the CPU 303, and the air is sucked into the main body 301 or from a side air inlet of the main body 301 and is discharged below the fan 302 and to the bottom surface of the main body 301.
【００３１】この排気口パネル３０４のスリットの形状
が、従来であれば上下にまっすぐに穴があけられている
が、これを外側に向かって斜めにスリットをいれること
で、空気の流れが床面に対してスムーズに流れるように
なり、排出される空気の量が多くなり、いっしょに熱も
そとに排出されるため、効率よく放熱が可能になるもの
である。Conventionally, the shape of the slit of the exhaust port panel 304 is vertically straight, but the slit is slanted toward the outside so that the air flow can be improved. As a result, the air flows smoothly, the amount of discharged air increases, and the heat is also discharged together, so that heat can be efficiently dissipated.
【００３２】排気穴パネル３０４には、スリットを設け
る代りに、金網などを用いて空気を放出させてもよい。Instead of providing the slits in the exhaust hole panel 304, air may be discharged by using a wire mesh or the like.
【００３３】排気穴パネル３０４は、図１の左側（本体
３０１の手前から後方に）にスライドできるようになっ
ており、ファン３０２からの排気を直接本体３０１の外
に排出することもできる。The exhaust hole panel 304 is slidable to the left side of FIG. 1 (from the front side of the main body 301 to the rear side), and the exhaust air from the fan 302 can be directly discharged to the outside of the main body 301.
【００３４】図２は本発明の第２の実施形態を示す断面
図である。本体３０１の底面にはファン３１２と排気穴
パネル３０４をスライドさせるためのフック３１３を有
する拡張ユニット３１１が取り付けられる。FIG. 2 is a sectional view showing a second embodiment of the present invention. An expansion unit 311 having a hook 312 for sliding the fan 312 and the exhaust hole panel 304 is attached to the bottom surface of the main body 301.
【００３５】本体３０１を拡張用のユニット３１１に接
続する際に、本体３０１を手前からスライドさせながら
移動させると、ファン３０２下部の排気口パネル３０４
が横にスライドして、本体３０１が拡張ユニット３１１
に接続されると、ファン３０２の下方に障害物がなくな
るため風の流れがよくなることで放熱効果を高めるもの
である。When the main body 301 is connected to the expansion unit 311, when the main body 301 is slid from the front side and moved, the exhaust port panel 304 below the fan 302.
Slides sideways, and the main body 301 is expanded unit 311
When it is connected to the fan 302, there is no obstacle below the fan 302, so that the flow of air is improved and the heat radiation effect is enhanced.
【００３６】さらに、拡張ユニット３１１側に大きなフ
ァン３１２を実装しておき、本体３０１側の熱をファン
３１２で吸引することで排気応力を上げることも可能で
ある。It is also possible to mount a large fan 312 on the side of the expansion unit 311 and suck the heat of the body 301 side by the fan 312 to increase the exhaust stress.
【００３７】[0037]
【発明の効果】本発明の放熱構造を有する電子機器は、
排気口のスリットの形状をストレートから斜めにするこ
とで空気の流れをスムーズにすることが可能になる。ま
た、拡張ユニットを接続した際にファン下部の排気口パ
ネルを移動させることで排気のための障害物がなくなり
風がとおりやすくなる。さらに拡張ユニット側に新たな
ファンをつけることで、携帯ＰＣの熱も外に排出できる
という効果がある。The electronic device having the heat dissipation structure of the present invention is
It is possible to make the air flow smooth by changing the shape of the slit of the exhaust port from straight to diagonal. Also, by moving the exhaust port panel at the bottom of the fan when the expansion unit is connected, there are no obstacles for exhaust, and it is easier for the wind to pass. Furthermore, by adding a new fan to the expansion unit side, the heat of the portable PC can be discharged to the outside.
【図１】本発明の第１の実施形態を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.
【図２】本発明の第２の実施形態を示す断面図である。FIG. 2 is a sectional view showing a second embodiment of the present invention.
【図３】第１の従来例を示す断面図である。FIG. 3 is a cross-sectional view showing a first conventional example.
【図４】第２の従来例を示す断面図である。FIG. 4 is a sectional view showing a second conventional example.
３０１ 本体 ３０２ ファン ３０３ ＣＰＵ ３０４ 排気穴パネル ３０５ スリット ３１１ 拡張ユニット ３１２ ファン ３１３ フック 301 body 302 fan 303 CPU 304 exhaust hole panel 305 slit 311 Expansion unit 312 fans 313 hook
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開2000−112572（ＪＰ，Ａ) 特開2000−59060（ＪＰ，Ａ) 特開 平11−219235（ＪＰ，Ａ) 実開 平４−8495（ＪＰ，Ｕ) 実開 平３−104217（ＪＰ，Ｕ) 実開 平２−27795（ＪＰ，Ｕ) 実開 平２−754（ＪＰ，Ｕ) 実開 平４−8491（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 7/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 2000-112572 (JP, A) JP 2000-59060 (JP, A) JP 11-219235 (JP, A) Actual Kaihei 4-8495 ( JP, U) Actual flat 3-104217 (JP, U) Actual flat 2-27795 (JP, U) Actual flat 2-754 (JP, U) Actual flat 4-8491 (JP, U) (58 ) Fields surveyed (Int.Cl. 7 , DB name) H05K 7/20
Claims (6)
穴パネル（３０４）と本体３０１に内蔵されるＣＰＵ
（３０３）の発熱を排気穴パネル（３０４）に向けて送
風するファン（３０２）とを備える放熱構造を有する電
子機器において、排気穴パネル（３０４）のスリット
（３０５）を本体（３０１）の外側に向って斜にいれて
あることを特徴とする放熱構造を有する電子機器。1. An exhaust hole panel (304) provided on a bottom surface of a main body (301) and a CPU incorporated in the main body 301.
In an electronic device having a heat dissipation structure including a fan (302) that blows the heat generated by (303) toward an exhaust hole panel (304), the slit (305) of the exhaust hole panel (304) is placed outside the main body (301). An electronic device having a heat-dissipating structure, characterized in that the electronic device is inclined toward the side.
を設けた請求項１記載の放熱構造を有する電子機器。2. An electronic device having a heat dissipation structure according to claim 1, wherein the exhaust hole panel (304) is provided with an exhaust wire mesh.
１）の手前から後方にスライドできるようになってお
り、ファン（３０２）からの排気を直接本体（３０１）
の外に排出することができる請求項１記載の放熱構造を
有する電子機器。3. The exhaust hole panel (304) comprises a body (30).
It is designed so that it can slide from the front of 1) to the rear, and exhaust air from the fan (302) can be directly fed to the main body (301).
The electronic device having the heat dissipation structure according to claim 1, which is capable of being discharged to the outside.
であって、排気穴パネル（３０４）をスライドさせるた
めのフック（３１３）を有する拡張ユニット（３１１）
を備える請求項１記載の放熱構造を有する電子機器。4. An expansion unit (311) which is attached to the bottom surface of the body (301) and has a hook (313) for sliding an exhaust hole panel (304).
An electronic device having the heat dissipation structure according to claim 1.
２）を増設した請求項１記載の放熱構造を有する電子機
器。5. A fan (31) is attached to the expansion unit (311).
The electronic device having the heat dissipation structure according to claim 1, wherein 2) is added.
定した請求項５記載の放熱構造を有する電子機器。6. An electronic device having a heat dissipation structure according to claim 5, wherein the exhaust direction of the fan (312) is set to the side surface.
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|---|---|---|---|
| JP2000353486A JP3507791B2 (en) | 2000-11-20 | 2000-11-20 | Electronic equipment with heat dissipation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000353486A JP3507791B2 (en) | 2000-11-20 | 2000-11-20 | Electronic equipment with heat dissipation structure |
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| Publication Number | Publication Date |
|---|---|
| JP2002158476A JP2002158476A (en) | 2002-05-31 |
| JP3507791B2 true JP3507791B2 (en) | 2004-03-15 |
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ID=18826244
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| JP2000353486A Expired - Fee Related JP3507791B2 (en) | 2000-11-20 | 2000-11-20 | Electronic equipment with heat dissipation structure |
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