JP3507791B2 - Electronic equipment with heat dissipation structure - Google Patents
Electronic equipment with heat dissipation structureInfo
- Publication number
- JP3507791B2 JP3507791B2 JP2000353486A JP2000353486A JP3507791B2 JP 3507791 B2 JP3507791 B2 JP 3507791B2 JP 2000353486 A JP2000353486 A JP 2000353486A JP 2000353486 A JP2000353486 A JP 2000353486A JP 3507791 B2 JP3507791 B2 JP 3507791B2
- Authority
- JP
- Japan
- Prior art keywords
- fan
- heat
- heat dissipation
- main body
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は放熱構造を有する電
子機器、特に、ノートパソコン等のCPUを冷却する放
熱構造を有する電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heat dissipation structure, and more particularly to an electronic device having a heat dissipation structure for cooling a CPU such as a notebook computer.
【0002】[0002]
【従来の技術】従来の放熱構造を有する電子機器につい
て図面を参照して詳細に説明する。2. Description of the Related Art An electronic device having a conventional heat dissipation structure will be described in detail with reference to the drawings.
【0003】図3は第1の従来例を示す部分断面図であ
る。(例えば、特開2000−112572号公報参
照)。FIG. 3 is a partial sectional view showing a first conventional example. (For example, refer to Japanese Patent Application Laid-Open No. 2000-112572).
【0004】CPU203にはCPU203の熱を伝達
する熱伝達部材である放熱グリース206を介して熱排
出部材であるファン207が密着するように取り付けら
れている。ファン207は回転軸方向に空気を吸入し、
円周方向に排出する構造のものである。201aと20
1bは筐体201に設けられた複数のスリットからなる
開口部である。208および209はファン207と開
口部201aおよび201bとの間に設けられた遮蔽の
ためのダクトで、ファン207による空気の流れが他に
漏れないようにしている。201cは筐体201に設け
られたリブでプリント配線基板202上のCPU203
を囲うように形成されている。A fan 207, which is a heat-discharging member, is attached to the CPU 203 so as to be in close contact therewith via a heat-dissipating grease 206, which is a heat-transmitting member that transmits the heat of the CPU 203. The fan 207 sucks air in the rotation axis direction,
It has a structure of discharging in the circumferential direction. 201a and 20
Reference numeral 1b is an opening formed in the housing 201 and including a plurality of slits. Reference numerals 208 and 209 denote ducts provided between the fan 207 and the openings 201a and 201b for shielding, and prevent the air flow from the fan 207 from leaking to other parts. Reference numeral 201c denotes a rib provided on the housing 201, and the CPU 203 on the printed wiring board 202.
It is formed so as to surround.
【0005】以下その動作を説明する。ファン207は
ノートパソコンの駆動とともに回転するが、これによっ
て筐体201の底面に設けられた開口部201aより外
気が流入し、ダクト208からファン207の内部を通
り、ダクト209を経由して開口部201bより排出さ
れる。CPU203から発生した熱は放熱グリース20
6を介してファン207に伝達されるが、ファン207
を通過する外気によって発散する。暖められた外気はそ
のまま排出され、これによりCPU203が冷却され
る。この際、ファン207に流入し排出される外気はダ
クト208および209によって他に漏れにくいため、
CPU203は最も冷たい空気によって冷却され、かつ
冷やす事に使用され、暖められた空気は電子機器内部へ
対流する事無く、外部へ排出される。また、外気の流入
はファン207の軸方向に広い面積で流入し、CPU2
03に平面的に接するので、冷却効果が高くなる。ま
た、リブ201cによってCPU203からの熱は筐体
内部の他の電子部品やハードディスクドライブ装置、バ
ッテリーに伝わらず、逆に流入する外気がこれらの発熱
によって暖められることもない。The operation will be described below. The fan 207 rotates with the drive of the notebook computer, but outside air flows in through the opening 201a provided on the bottom surface of the housing 201, passes through the inside of the fan 207 from the duct 208, and passes through the duct 209. It is discharged from 201b. The heat generated from the CPU 203 is heat radiating grease 20.
6 is transmitted to the fan 207,
Emitted by outside air passing through. The warmed outside air is discharged as it is, whereby the CPU 203 is cooled. At this time, since the outside air that flows into and is discharged from the fan 207 is less likely to leak to the other by the ducts 208 and 209,
The CPU 203 is used for cooling and cooling with the coldest air, and the warmed air is discharged outside without convection inside the electronic device. Also, the inflow of outside air flows in a large area in the axial direction of the fan 207, and the CPU 2
Since it is in planar contact with 03, the cooling effect is high. Further, the heat from the CPU 203 is not transmitted to the other electronic components inside the housing, the hard disk drive device, and the battery by the rib 201c, and the outside air flowing in reverse is not warmed by these heat generations.
【0006】これにより、ファン207はCPU203
のみを冷却するのに十分な能力のものでよくなり、従来
35db以上だった騒音を30db程度に押えられる。As a result, the fan 207 is operated by the CPU 203.
It only needs to have enough capacity to cool only the noise, and it can suppress the noise which was 35db or more in the past to about 30db.
【0007】なお、開口部201a、201bはCPU
203の近傍、少なくとも筐体内部の他の電子部品やハ
ードディスクドライブ装置、バッテリーなど、多少の発
熱を伴う部品、ユニット等よりもCPUに近接した位置
にあればよい。The openings 201a and 201b are CPUs.
It suffices that it be located in the vicinity of 203, at least in a position closer to the CPU than other electronic components inside the housing, a hard disk drive device, a battery, and other components and units that generate a little heat.
【0008】なお、本例では、ダクトを別部品としてい
るが、筐体201と一体としたり、筐体201のリブ
と、プリント配線基板などと組み合わせることによって
ダクト形状を形成してもよい。いずれにしても、多少隙
間があいても外気の漏れはほとんど生じない。Although the duct is a separate component in this example, the duct shape may be formed integrally with the casing 201 or by combining the rib of the casing 201 with a printed wiring board or the like. In any case, even if there is a gap, the outside air hardly leaks.
【0009】また、外気が流入するための開口部を筐体
の底面、排出するための開口部を側面に設けたが、これ
を逆にしたり、あるいは上面と側面、側面同士というよ
うにどのような組合せとしてもよい。Further, although the opening for the outside air to flow in is provided on the bottom surface of the housing and the opening for the discharge is provided on the side surface, this may be reversed, or the upper surface and the side surface, or the side surfaces may be replaced with each other. Any combination may be used.
【0010】また、CPUとファンを放熱グリースを介
して密着させたが、放熱ゴムとしたり、さらにヒートシ
ンクなどの熱伝達放熱部材を介在させてもよい。また、
CPUとファンをわずかな隙間をあけて配置してもよ
い。Although the CPU and the fan are brought into close contact with each other via the heat radiating grease, they may be made of heat radiating rubber, or a heat transfer heat radiating member such as a heat sink may be interposed. Also,
The CPU and the fan may be arranged with a slight gap.
【0011】この例では、筐体サイズの薄型化のためフ
ァンを横置きに収容している。しかし、ファンの厚さ及
びファン前後に必要となる空間以下に筐体サイズを薄型
化することはできない。付属装置との連動により発熱素
子の処理性能が増大し発熱量が大きくなる場合、ファン
の大型化が必要になるとともに、ファン前後に必要とな
る空間も大きくなる。従って、筐体サイズの薄型化が困
難になる。In this example, the fan is housed in a horizontal position in order to reduce the size of the housing. However, it is not possible to make the housing thin below the thickness of the fan and the space required before and after the fan. When the processing performance of the heating element is increased and the amount of heat generated is increased due to the linkage with the attached device, the fan needs to be upsized and the space required before and after the fan also becomes large. Therefore, it is difficult to reduce the housing size.
【0012】図4は第2の従来例を示す部分断面図であ
る。(例えば、特開平11−219235号公報参
照)。FIG. 4 is a partial sectional view showing a second conventional example. (See, for example, Japanese Patent Laid-Open No. 11-219235).
【0013】この電子装置は、大別して、CPU(中央
演算処理ユニット)など中枢機能を有する本体中枢部A
と、本体中枢部Aで処理された結果を表示する表示装置
を有する表示部Bと、本体中枢部A、又は本体中枢部A
及び表示部Bを冷却するためのファンを有する付属部C
とから構成されている。This electronic device is roughly classified into a main body central portion A having a central function such as a CPU (central processing unit).
And a display unit B having a display device for displaying the result processed by the main body central part A, the main body central part A, or the main body central part A.
And an accessory C having a fan for cooling the display B
It consists of and.
【0014】本体中枢部は、CPU(中央演算処理ユニ
ット)等の特に発熱量の大きい素子1(以下、CPU1
と称す)を下面に取り付けられたサブ配線基板6と、該
サブ配線基板6及び複数の素子を上面に搭載しているメ
イン基板12と、配線基板6の上側に配置されたキーボ
ード14と、上記のサブ配線基板6、メイン基板12な
どを内部に収容し、キーボード14を上面に配置した第
1の筐体100とからなる。表示部Bは表示装置と、こ
の表示装置を収容する第2の筐体16とからなり、そし
て第2の筐体16は第1の筐体100にヒンジ継手を介
して、両筐体が互いに折り重なるよう、転回可能にとり
つけられている。The central portion of the main body is an element 1 (hereinafter, CPU 1) having a particularly large heat generation amount such as a CPU (central processing unit).
(Hereinafter referred to as ") is attached to the lower surface, a sub-wiring board 6 having the sub-wiring board 6 and a plurality of elements mounted on the upper surface, a keyboard 14 disposed above the wiring board 6, The sub-wiring board 6, the main board 12, and the like are housed inside, and the keyboard 14 is arranged on the upper surface of the first housing 100. The display unit B includes a display device and a second housing 16 that accommodates the display device. The second housing 16 is connected to the first housing 100 via a hinge joint so that the two housings are mutually connected. It is mounted so that it can be folded and folded.
【0015】第1の筐体100の内底面部には、放熱板
11が敷設されている。放熱板11は、必要に応じて第
1の筐体100底面とほぼ同面積で、さらに該筐体の背
面まで設置される。また、第1の筐体100自体をMg
合金などの高熱伝導性材料で成形することによって、放
熱板11を筐体と兼用してもよい。サブ配線基板6下面
に実装されたCPU1は、その下側に柔軟熱伝導部材2
(たとえばSiゴムに酸化アルミなどのフィラーを混入
したもの)を介して拡大金属板8がとりつけられ、さら
に拡大金属板8の下面に接して放熱板10が設けられて
いる。サブ配線基板6はその縁部がコネクタを介してメ
イン基板12にとりつけられ、そして両基板6、12の
間には上記CPU1、熱伝導部材として柔軟熱伝導部材
2、拡大金属板8及び放熱板10が設置されている。一
方、CPU1が取り付けられたサブ配線基板6上面に
は、柔軟熱伝導部材3を介して放熱部材7が設置され、
その上にキーボード14が設置されている。放熱部材7
とキーボード14を支持するベース部5(熱伝導率の高
い金属製であることが望ましい)とは、直接に接触する
か、もしくは柔軟熱伝導部材4などを介して熱的に接続
されている。サブ基板6及び該基板6上の放熱部材7
は、それらの縁部が、熱伝導性材料(銅、真鋳、アルミ
など)で成形されたボス9を介して、下方にある放熱板
10の端部、メイン基板12及び放熱板11と共締めさ
れ、かつ、熱的にも接続されている。A heat radiating plate 11 is laid on the inner bottom surface of the first casing 100. If necessary, the heat dissipation plate 11 has substantially the same area as the bottom surface of the first housing 100, and is further installed up to the back surface of the housing. In addition, the first housing 100 itself is
The heat dissipation plate 11 may also be used as a housing by molding with a high thermal conductivity material such as an alloy. The CPU 1 mounted on the lower surface of the sub wiring board 6 has a flexible heat conduction member 2 on the lower side thereof.
The expanded metal plate 8 is attached via (for example, Si rubber mixed with a filler such as aluminum oxide), and the heat dissipation plate 10 is provided in contact with the lower surface of the expanded metal plate 8. The sub-wiring board 6 has its edge attached to the main board 12 via a connector, and the CPU 1, the flexible heat conducting member 2 as a heat conducting member, the enlarged metal plate 8 and the heat radiating plate are mounted between the two substrates 6 and 12. 10 are installed. On the other hand, on the upper surface of the sub wiring board 6 to which the CPU 1 is attached, the heat dissipation member 7 is installed via the flexible heat conduction member 3,
A keyboard 14 is installed on it. Heat dissipation member 7
The base portion 5 supporting the keyboard 14 (which is preferably made of a metal having a high thermal conductivity) are in direct contact with each other or are thermally connected to each other via the flexible thermal conduction member 4 or the like. Sub substrate 6 and heat dissipation member 7 on the substrate 6
The edges of the heat sink 10 and the main board 12 and the heat sink 11 are located below the end of the heat sink 10 via the boss 9 formed of a heat conductive material (copper, brass, aluminum, etc.). It is fastened and also thermally connected.
【0016】拡大金属板8、放熱板11、放熱部材7
は、いずれも、面方向に熱を拡散して放熱効果を向上さ
せる。CPU1で発生した熱の一部は、柔軟熱伝導部材
2、拡大金属板8、放熱板10、放熱板11を介して第
1の筐体100の底面から外気に放熱される。さらにC
PU1で発生した熱の一部は、サブ基板6、柔軟熱伝導
部材3、放熱部材7を介し、キーボード14の表面から
放熱される熱と、ボス9、放熱板11を介して筐体10
0の底面から外気に放熱される熱とに分配される。Enlarged metal plate 8, heat dissipation plate 11, heat dissipation member 7
In both cases, heat is diffused in the surface direction to improve the heat dissipation effect. Part of the heat generated by the CPU 1 is radiated to the outside air from the bottom surface of the first housing 100 via the flexible heat conducting member 2, the expanded metal plate 8, the heat radiating plate 10 and the heat radiating plate 11. Furthermore C
Part of the heat generated in the PU 1 is radiated from the surface of the keyboard 14 via the sub-board 6, the flexible heat conducting member 3 and the heat radiating member 7, and the casing 10 via the boss 9 and the heat radiating plate 11.
It is distributed to the heat radiated from the bottom surface of 0 to the outside air.
【0017】電子装置を構成する付属部Cは、記憶装置
19と、ファン20と、ファン20を制御する素子22
を搭載した配線基板21と、これら部品19、20、2
1等を収容し、かつファン20用の空気取り入れ口を側
面に、そして空気吹き出し口を上面に形成された付属筐
体101とから構成される。ファン20は、配線基板2
1からコネクタ23を介し接続される。付属筐体101
と本体中枢部の第1の筐体100とは、コネクタ24及
び17によってそれぞれ接続され、第1の筐体100内
の配線基板12と付属筐体101内の配線基板21が電
気的に接続される。配線基板12または21には、付属
筐体101内の電子回路と本体100内の電子回路が接
続されたことを検知する回路と、該回路と連動したCP
U1の処理性能制御回路(たとえば、クロック周波数可
変回路)と、CPU1の処理性能制御回路と連動したフ
ァン20の制御回路(たとえば、ファンの回転数制御
や、ファンのオンオフ制御)とを含んでいる。The accessory unit C constituting the electronic device includes a storage device 19, a fan 20, and an element 22 for controlling the fan 20.
A wiring board 21 on which the components are mounted and these components 19, 20, 2
1 and the like, and includes an accessory housing 101 in which an air intake port for the fan 20 is formed on a side surface and an air outlet port is formed on an upper surface. The fan 20 is the wiring board 2
1 through the connector 23. Attached case 101
And the first housing 100 in the central portion of the main body are connected by connectors 24 and 17, respectively, and the wiring board 12 in the first housing 100 and the wiring board 21 in the accessory housing 101 are electrically connected. It On the wiring board 12 or 21, a circuit for detecting that the electronic circuit in the accessory housing 101 and the electronic circuit in the main body 100 are connected, and a CP interlocked with the circuit
It includes a processing performance control circuit of U1 (for example, a clock frequency variable circuit) and a control circuit of the fan 20 (for example, fan rotation speed control and fan on / off control) linked with the processing performance control circuit of the CPU1. .
【0018】次に、動作について説明する。実施の形態
1の電子装置の本体を、付属部Cを切り離して使用する
場合、CPU1で発生した熱は、本体の第1の筐体10
0内に設置された放熱部材によって、前述のようにキー
ボード14の表面及び筐体100の底面から分配されて
それぞれ外気に放熱される。付属部Cなしに電子装置を
携帯して使用する場合、通常、CPU1は最大性能で動
作させる必要はない。従って、第1の筐体100内に設
置された放熱部材だけによる放熱が可能である。Next, the operation will be described. When the main body of the electronic device according to the first embodiment is used with the accessory C separated, the heat generated by the CPU 1 is generated by the first housing 10 of the main body.
As described above, the heat dissipating member installed inside the housing 0 disperses heat from the surface of the keyboard 14 and the bottom surface of the housing 100 to radiate heat to the outside air. When carrying and using the electronic device without the attachment C, the CPU 1 usually does not need to operate at maximum performance. Therefore, heat can be dissipated only by the heat dissipating member installed in the first housing 100.
【0019】一方、本体に付属部Cと接続して電子装置
を使用する場合、付属筐体101内の記憶装置19、素
子22を搭載した配線基板21等で構成される付属部C
によって、本体のCPU1の性能をフルに活用した処理
が可能となる。付属筐体101が本体の第1の筐体10
0に接続され、付属装置と本体内の各電子回路が接続さ
れると、本体はこれを検出して付属装置及び本体が連動
して動作する。この時、CPUの処理性能が増大する
(処理性能制御手段による)と、それと同時に付属筐体0
1内に収容されたファン20もこの動作と連動して作動
する。これらの動作は、本体筐体100内の配線基板1
2に組み込まれた電子回路と付属筐体101内の配線基
板21に組み込まれた電子回路とが接続されたことを検
知する回路、それと連動したCPU1の処理性能制御回
路、及びCPU1の処理性能制御回路と連動したファン
20の制御回路によって行われる。ファン20の動作に
よって、付属筐体101側面の空気取り入れ口を通じて
外部から空気が入気し(25)、上面の空気吹き出し口
を通じて本体の第1の筐体100の底面に吹き付けられ
る(26)。この吹き付けられた冷却風は、筐体10の下
に設けられた足18によって第1の筐体100と付属筐
体101との形成された間隙を通過する。従って、付属
筐体101内に収容されたファン20は、第1の筐体1
00内に収容された放熱構造の持つ冷却能力に加えて、
さらにCPU1を冷却する。On the other hand, when the electronic device is used by connecting it to the accessory unit C on the main body, the accessory unit C composed of the storage device 19 in the accessory housing 101, the wiring board 21 on which the element 22 is mounted, and the like.
With this, it is possible to perform processing that makes full use of the performance of the CPU 1 of the main body. The first housing 10 whose main body is the accessory housing 101
0, and when the accessory device and each electronic circuit in the main body are connected, the main body detects this and the accessory device and the main body operate together. At this time, the processing performance of the CPU increases
(Depending on the processing performance control means), and at the same time, the accessory enclosure 0
The fan 20 housed inside 1 also operates in conjunction with this operation. These operations are performed by the wiring board 1 in the main body housing 100.
2, a circuit for detecting connection between the electronic circuit incorporated in the wiring board 21 and the electronic circuit incorporated in the wiring board 21 in the accessory housing 101, a processing performance control circuit of the CPU 1 interlocked therewith, and a processing performance control of the CPU 1. This is performed by the control circuit of the fan 20 which is linked to the circuit. By the operation of the fan 20, air is introduced from the outside through the air intake port on the side surface of the accessory housing 101 (25) and is blown onto the bottom surface of the first housing 100 of the main body through the air outlet port on the upper surface (26). The blown cooling air passes through the gap formed between the first casing 100 and the accessory casing 101 by the legs 18 provided under the casing 10. Therefore, the fan 20 housed in the accessory housing 101 is
In addition to the cooling capacity of the heat dissipation structure housed in 00,
Further, the CPU 1 is cooled.
【0020】本例では、本体の第1の筐体100下面に
冷却風を吹き付けることで、該筐体100底面側の放熱
性能を向上させている。第1の筐体100底面側の放熱
性能を向上させる冷却方式では、CPU1の熱のキーボ
ード側と底面側への放熱量分配割合が、付属筐体101
による冷却が行われることによって底面側への分配割合
が増大する。従って、本方式は、付属筐体101の接続
によってCPU1の発熱量が増大しても、本体の第1の
筐体100底面側で選択的に放熱性能を向上させること
によって、オペレータの触れるキーボード14表面温度
の上昇抑制に対して効果的な方法となる。逆に、第1の
筐体100底面側の温度上昇につながるが、付属筐体1
01接続時には、該筐体100底面をオペレータが直接
触れることがないので問題とならない。これによって、
付属装置との連動による装置の処理性能向上に伴いCP
Uの発熱量が増大しても、本体の第1の筐体サイズを厚
くすることなく、すなわち、本体携帯時の使用での利便
性を損なうことなく、さらには、オペレータの触れる筐
体表面の温度上昇を抑えながらCPU1の冷却が可能と
なる。In this example, cooling air is blown to the lower surface of the first housing 100 of the main body to improve the heat dissipation performance on the bottom surface side of the housing 100. In the cooling method that improves the heat dissipation performance on the bottom surface side of the first housing 100, the heat dissipation amount distribution ratio of the heat of the CPU 1 to the keyboard side and the bottom surface side is determined by the accessory housing 101.
As a result of cooling by, the distribution ratio to the bottom side increases. Therefore, in this method, even if the amount of heat generated by the CPU 1 increases due to the connection of the accessory housing 101, the keyboard 14 touched by the operator is selectively improved by selectively improving the heat dissipation performance on the bottom surface side of the first housing 100 of the main body. This is an effective method for suppressing the rise in surface temperature. On the contrary, although the temperature rises on the bottom side of the first casing 100, the attached casing 1
At the time of 01 connection, there is no problem because the operator does not directly touch the bottom surface of the housing 100. by this,
CP along with the improvement of the processing performance of the device by linking with the attached device
Even if the amount of heat generated by U increases, the size of the first housing of the main body is not increased, that is, the convenience of use when carrying the main body is not impaired. The CPU 1 can be cooled while suppressing the temperature rise.
【0021】[0021]
【発明が解決しようとする課題】上述した従来の放熱構
造を有する電子機器は、排気口パネルのスリットの形状
が、上下にまっすぐに穴があけられているので、空気の
流れが床面に対してスムーズに流れにくいという欠点が
あった。In the electronic device having the conventional heat dissipation structure described above, since the slit shape of the exhaust port panel is formed by vertically piercing the slits, the air flow with respect to the floor surface. It had the drawback of not flowing smoothly and smoothly.
【0022】[0022]
【課題を解決するための手段】第1の発明の放熱構造を
有する電子機器は、本体(301)の底面に設けられた
排気穴パネル(304)と本体301に内蔵されるCP
U(303)の発熱を排気穴パネル(304)に向けて
送風するファン(302)とを備える放熱構造を有する
電子機器において、排気穴パネル(304)のスリット
(305)を本体(301)の外側に向って斜にいれて
あることを特徴とする放熱構造を有する。An electronic device having a heat dissipation structure according to the first aspect of the present invention includes an exhaust hole panel (304) provided on a bottom surface of a main body (301) and a CP incorporated in the main body 301.
In an electronic device having a heat dissipation structure including a fan (302) that blows the heat generated by U (303) toward an exhaust hole panel (304), the slit (305) of the exhaust hole panel (304) is provided in the main body (301). It has a heat dissipation structure characterized by being inclined toward the outside.
【0023】第2の発明の放熱構造を有する電子機器
は、第1の発明において、排気穴パネル(304)に排
気用の金網を設ける。In the electronic device having the heat dissipation structure of the second invention, the exhaust hole panel (304) is provided with an exhaust metal mesh in the first invention.
【0024】第3の発明の放熱構造を有する電子機器
は、第1の発明において、排気穴パネル(304)は本
体(301)の手前から後方にスライドできるようにな
っており、ファン(302)からの排気を直接本体(3
01)の外に排出する。In the electronic device having the heat dissipation structure of the third invention, in the first invention, the exhaust hole panel (304) is slidable from the front side of the main body (301) to the rear side, and the fan (302). Exhaust directly from the body (3
It is discharged to outside of 01).
【0025】第4の発明の放熱構造を有する電子機器
は、第1の発明において、本体(301)の底面に取り
付けるものであって、排気穴パネル(304)をスライ
ドさせるためのフック(313)を有する拡張ユニット
(311)を備える。An electronic device having a heat dissipation structure according to a fourth aspect of the present invention is the electronic device according to the first aspect, which is attached to the bottom surface of the main body (301) and has a hook (313) for sliding the exhaust hole panel (304). And an expansion unit (311) having
【0026】第5の発明の放熱構造を有する電子機器
は、第1の発明において、拡張ユニット(311)にフ
ァン(312)を増設する。In the electronic device having the heat dissipation structure of the fifth invention, the fan (312) is added to the expansion unit (311) in the first invention.
【0027】第6の発明の放熱構造を有する電子機器
は、第5の発明において、ファン(312)の排気方向
を側面に設定する。In the electronic device having the heat dissipation structure of the sixth invention, the exhaust direction of the fan (312) is set to the side surface in the fifth invention.
【0028】[0028]
【発明の実施の形態】次に、本発明について図面を参照
して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings.
【0029】図1は本発明の第1の実施形態を示す断面
図である。図1に示す放熱構造を有する電子機器は、本
体301の底面に設けられた排気穴パネル304と本体
301に内蔵されるCPU303の発熱を排気穴パネル
304に向けて送風するファン302とを備える放熱構
造を有する電子機器において、排気穴パネル304のス
リット305を本体301の外側に向って斜にいれてあ
る。FIG. 1 is a sectional view showing a first embodiment of the present invention. The electronic device having the heat dissipation structure shown in FIG. 1 includes an exhaust hole panel 304 provided on the bottom surface of the main body 301 and a fan 302 that blows the heat generated by the CPU 303 built in the main body 301 toward the exhaust hole panel 304. In the electronic device having the structure, the slit 305 of the exhaust hole panel 304 is slanted toward the outside of the main body 301.
【0030】本体301の放熱対策のためにファン30
2がCPU303の真下に実装されており、空気は本体
301内部あるいは、本体301の側面吸気口から吸い
込み、ファン302の下方、本体301の底面に排出さ
れる構造になっている。A fan 30 is provided to prevent heat radiation from the main body 301.
2 is mounted right under the CPU 303, and the air is sucked into the main body 301 or from a side air inlet of the main body 301 and is discharged below the fan 302 and to the bottom surface of the main body 301.
【0031】この排気口パネル304のスリットの形状
が、従来であれば上下にまっすぐに穴があけられている
が、これを外側に向かって斜めにスリットをいれること
で、空気の流れが床面に対してスムーズに流れるように
なり、排出される空気の量が多くなり、いっしょに熱も
そとに排出されるため、効率よく放熱が可能になるもの
である。Conventionally, the shape of the slit of the exhaust port panel 304 is vertically straight, but the slit is slanted toward the outside so that the air flow can be improved. As a result, the air flows smoothly, the amount of discharged air increases, and the heat is also discharged together, so that heat can be efficiently dissipated.
【0032】排気穴パネル304には、スリットを設け
る代りに、金網などを用いて空気を放出させてもよい。Instead of providing the slits in the exhaust hole panel 304, air may be discharged by using a wire mesh or the like.
【0033】排気穴パネル304は、図1の左側(本体
301の手前から後方に)にスライドできるようになっ
ており、ファン302からの排気を直接本体301の外
に排出することもできる。The exhaust hole panel 304 is slidable to the left side of FIG. 1 (from the front side of the main body 301 to the rear side), and the exhaust air from the fan 302 can be directly discharged to the outside of the main body 301.
【0034】図2は本発明の第2の実施形態を示す断面
図である。本体301の底面にはファン312と排気穴
パネル304をスライドさせるためのフック313を有
する拡張ユニット311が取り付けられる。FIG. 2 is a sectional view showing a second embodiment of the present invention. An expansion unit 311 having a hook 312 for sliding the fan 312 and the exhaust hole panel 304 is attached to the bottom surface of the main body 301.
【0035】本体301を拡張用のユニット311に接
続する際に、本体301を手前からスライドさせながら
移動させると、ファン302下部の排気口パネル304
が横にスライドして、本体301が拡張ユニット311
に接続されると、ファン302の下方に障害物がなくな
るため風の流れがよくなることで放熱効果を高めるもの
である。When the main body 301 is connected to the expansion unit 311, when the main body 301 is slid from the front side and moved, the exhaust port panel 304 below the fan 302.
Slides sideways, and the main body 301 is expanded unit 311
When it is connected to the fan 302, there is no obstacle below the fan 302, so that the flow of air is improved and the heat radiation effect is enhanced.
【0036】さらに、拡張ユニット311側に大きなフ
ァン312を実装しておき、本体301側の熱をファン
312で吸引することで排気応力を上げることも可能で
ある。It is also possible to mount a large fan 312 on the side of the expansion unit 311 and suck the heat of the body 301 side by the fan 312 to increase the exhaust stress.
【0037】[0037]
【発明の効果】本発明の放熱構造を有する電子機器は、
排気口のスリットの形状をストレートから斜めにするこ
とで空気の流れをスムーズにすることが可能になる。ま
た、拡張ユニットを接続した際にファン下部の排気口パ
ネルを移動させることで排気のための障害物がなくなり
風がとおりやすくなる。さらに拡張ユニット側に新たな
ファンをつけることで、携帯PCの熱も外に排出できる
という効果がある。The electronic device having the heat dissipation structure of the present invention is
It is possible to make the air flow smooth by changing the shape of the slit of the exhaust port from straight to diagonal. Also, by moving the exhaust port panel at the bottom of the fan when the expansion unit is connected, there are no obstacles for exhaust, and it is easier for the wind to pass. Furthermore, by adding a new fan to the expansion unit side, the heat of the portable PC can be discharged to the outside.
【図1】本発明の第1の実施形態を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.
【図2】本発明の第2の実施形態を示す断面図である。FIG. 2 is a sectional view showing a second embodiment of the present invention.
【図3】第1の従来例を示す断面図である。FIG. 3 is a cross-sectional view showing a first conventional example.
【図4】第2の従来例を示す断面図である。FIG. 4 is a sectional view showing a second conventional example.
301 本体 302 ファン 303 CPU 304 排気穴パネル 305 スリット 311 拡張ユニット 312 ファン 313 フック 301 body 302 fan 303 CPU 304 exhaust hole panel 305 slit 311 Expansion unit 312 fans 313 hook
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開2000−112572(JP,A) 特開2000−59060(JP,A) 特開 平11−219235(JP,A) 実開 平4−8495(JP,U) 実開 平3−104217(JP,U) 実開 平2−27795(JP,U) 実開 平2−754(JP,U) 実開 平4−8491(JP,U) (58)調査した分野(Int.Cl.7,DB名) H05K 7/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 2000-112572 (JP, A) JP 2000-59060 (JP, A) JP 11-219235 (JP, A) Actual Kaihei 4-8495 ( JP, U) Actual flat 3-104217 (JP, U) Actual flat 2-27795 (JP, U) Actual flat 2-754 (JP, U) Actual flat 4-8491 (JP, U) (58 ) Fields surveyed (Int.Cl. 7 , DB name) H05K 7/20
Claims (6)
穴パネル(304)と本体301に内蔵されるCPU
(303)の発熱を排気穴パネル(304)に向けて送
風するファン(302)とを備える放熱構造を有する電
子機器において、排気穴パネル(304)のスリット
(305)を本体(301)の外側に向って斜にいれて
あることを特徴とする放熱構造を有する電子機器。1. An exhaust hole panel (304) provided on a bottom surface of a main body (301) and a CPU incorporated in the main body 301.
In an electronic device having a heat dissipation structure including a fan (302) that blows the heat generated by (303) toward an exhaust hole panel (304), the slit (305) of the exhaust hole panel (304) is placed outside the main body (301). An electronic device having a heat-dissipating structure, characterized in that the electronic device is inclined toward the side.
を設けた請求項1記載の放熱構造を有する電子機器。2. An electronic device having a heat dissipation structure according to claim 1, wherein the exhaust hole panel (304) is provided with an exhaust wire mesh.
1)の手前から後方にスライドできるようになってお
り、ファン(302)からの排気を直接本体(301)
の外に排出することができる請求項1記載の放熱構造を
有する電子機器。3. The exhaust hole panel (304) comprises a body (30).
It is designed so that it can slide from the front of 1) to the rear, and exhaust air from the fan (302) can be directly fed to the main body (301).
The electronic device having the heat dissipation structure according to claim 1, which is capable of being discharged to the outside.
であって、排気穴パネル(304)をスライドさせるた
めのフック(313)を有する拡張ユニット(311)
を備える請求項1記載の放熱構造を有する電子機器。4. An expansion unit (311) which is attached to the bottom surface of the body (301) and has a hook (313) for sliding an exhaust hole panel (304).
An electronic device having the heat dissipation structure according to claim 1.
2)を増設した請求項1記載の放熱構造を有する電子機
器。5. A fan (31) is attached to the expansion unit (311).
The electronic device having the heat dissipation structure according to claim 1, wherein 2) is added.
定した請求項5記載の放熱構造を有する電子機器。6. An electronic device having a heat dissipation structure according to claim 5, wherein the exhaust direction of the fan (312) is set to the side surface.
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JP2000353486A JP3507791B2 (en) | 2000-11-20 | 2000-11-20 | Electronic equipment with heat dissipation structure |
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JP3507791B2 true JP3507791B2 (en) | 2004-03-15 |
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