JP3507035B2 - Jig for cleaning substrates for semiconductor integrated circuits - Google Patents
Jig for cleaning substrates for semiconductor integrated circuitsInfo
- Publication number
- JP3507035B2 JP3507035B2 JP2001006271A JP2001006271A JP3507035B2 JP 3507035 B2 JP3507035 B2 JP 3507035B2 JP 2001006271 A JP2001006271 A JP 2001006271A JP 2001006271 A JP2001006271 A JP 2001006271A JP 3507035 B2 JP3507035 B2 JP 3507035B2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- substrate
- cleaning
- outer peripheral
- peripheral frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Packaging Frangible Articles (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体集積回路が搭
載される基板を洗浄する際に、基板を保持するための治
具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for holding a substrate when cleaning the substrate on which a semiconductor integrated circuit is mounted.
【０００２】[0002]
【従来の技術とその問題点】図９〜１１はボールグリッ
ドアレイタイプの半導体装置の一例を示しており、この
半導体装置は、基板４１の上面に搭載された半導体集積
回路４２が樹脂４３によってモールドされ、基板の下面
に半導体装置を電子回路に接続するための多数の端子４
４を有しており、基板４１には半導体集積回路４２と端
子４４を導通する複雑な導電経路が印刷等により形成さ
れている。9 to 11 show an example of a ball grid array type semiconductor device. In this semiconductor device, a semiconductor integrated circuit 42 mounted on an upper surface of a substrate 41 is molded with a resin 43. A plurality of terminals 4 for connecting the semiconductor device to an electronic circuit on the lower surface of the substrate.
4, the substrate 41 is formed with a complicated conductive path for electrically connecting the semiconductor integrated circuit 42 and the terminal 44 by printing or the like.
【０００３】基板４１は基板メーカによって製作される
が、基板は１枚ずつ個別に製作されるのではなく、１枚
の原板に多数枚分の基板が繋がった状態で製作される。
従前は基板が原板の状態で基板のユーザたる半導体装置
メーカに供給され、この半導体装置メーカにて原板をカ
ットしていたが、半導体集積回路４２の高度集積化に伴
って原板のカットにも極めて高度な精密さが要求される
ようになり、現状では基板メーカにおいて原板を正確に
カットした基板を半導体装置メーカに納入することが要
求されるようになってきている。The board 41 is manufactured by a board maker, but the boards are not manufactured individually one by one, but are manufactured in a state in which a large number of boards are connected to one original plate.
In the past, the substrate was supplied to the semiconductor device manufacturer who is the user of the substrate in the state of the original plate, and the original device was cut by this semiconductor device maker. However, with the high integration of the semiconductor integrated circuit 42, the original plate is extremely cut. High precision is required, and at present, a substrate maker is required to deliver a substrate obtained by accurately cutting an original plate to a semiconductor device maker.
【０００４】また、基板メーカにおいては、カット後の
基板に洗浄剤や純水を散布したり、あるいは基板を洗浄
剤や純水を入れた水槽内に入れて洗浄し、基板からカッ
ト時の切り屑やその他の汚れを除去しており、その後、
基板を乾燥させて半導体装置収納用のトレーに収納して
半導体装置メーカに納入している。ところで、基板には
表裏や前後左右の方向性があり、この基板の方向性を保
ったままで基板全体を洗浄しなければならず、従来はカ
ット後の基板を半導体装置収納用のトレーに載せ、その
上から別のトレーを積み重ねて基板を挟み込み、基板を
これらトレーごと洗浄している。Further, in the board maker, a cleaning agent or pure water is sprayed on the cut board, or the board is washed by putting it in a water tank containing the cleaning agent or pure water, and then cutting the board at the time of cutting. Removing debris and other dirt, then
Substrates are dried and stored in a tray for semiconductor device storage before being delivered to semiconductor device manufacturers. By the way, there are front and back, front and back, left and right direction of the substrate, it is necessary to wash the entire substrate while maintaining the directionality of this substrate, conventionally, the substrate after cutting is placed on a tray for storing semiconductor devices, Another tray is stacked on top of it to sandwich the substrate, and the substrate is washed together with these trays.
【０００５】しかし、半導体装置収納用のトレーを基板
の洗浄用に流用した場合には、基板とトレーとの接触部
分やトレーの凹凸部分に洗浄用の純水や洗浄剤が溜り、
洗浄用の純水や洗浄剤が基板に充分に接触せずに洗浄む
らが生じたり、あるいは純水や洗浄剤がその後の乾燥工
程で充分に除去されない場合がある。However, when the tray for storing the semiconductor device is diverted for cleaning the substrate, pure water for cleaning or a cleaning agent is accumulated in the contact portion between the substrate and the tray or the uneven portion of the tray,
In some cases, the pure water or cleaning agent for cleaning does not come into sufficient contact with the substrate to cause uneven cleaning, or the pure water or cleaning agent is not sufficiently removed in the subsequent drying step.
【０００６】[0006]
【目的】本発明の目的とするところは、半導体集積回路
用の基板の向きを所定の方向に揃えたままで保持するこ
とができて基板を確実かつ充分に洗浄することができ、
しかも洗浄後における基板の乾燥も短時間で確実に行な
うことができ、さらに半導体装置収納用のトレーへの移
し替えが容易な半導体集積回路用基板の洗浄用治具を提
供することにある。[Object] An object of the present invention is to maintain the orientation of a substrate for a semiconductor integrated circuit in a predetermined direction, and to wash the substrate reliably and sufficiently.
Moreover, it is an object of the present invention to provide a jig for cleaning a substrate for a semiconductor integrated circuit, which can surely dry the substrate after cleaning in a short time and can be easily transferred to a tray for housing a semiconductor device.
【０００７】[0007]
【発明の構成】上記目的を達成するために、本発明の請
求項１に係る半導体集積回路用基板の洗浄用治具は、外
周枠の上面に上方へ突出する複数の係合用突起と、これ
ら各係合用突起の下方における外周枠の下面にそれぞれ
係合用凹部が形成され、前記外周枠内に、縦横の桟によ
って区画された多数の連通窓を有し、各連通窓の周辺部
上面に、上端部が半球状に形成された下部拡径のガイド
突起を備え、また、各連通窓の内周面から連通窓の内側
へ突出し、上端にて基板支持平面を規定する支持リブを
設けてなる構成としてある。In order to achieve the above object, a cleaning jig for a semiconductor integrated circuit substrate according to a first aspect of the present invention comprises a plurality of engaging projections projecting upward on the upper surface of an outer peripheral frame. Engagement recesses are formed on the lower surface of the outer peripheral frame below each of the engagement projections, and in the outer peripheral frame, there are a large number of communication windows partitioned by vertical and horizontal bars, and on the upper surface of the peripheral portion of each communication window, The upper end portion is provided with a guide projection of a lower diameter which is formed in a hemispherical shape, and is provided with a supporting rib projecting from the inner peripheral surface of each communicating window to the inside of the communicating window and defining the substrate supporting plane at the upper end. It is as a configuration.
【０００８】本発明の請求項２に係る半導体集積回路用
基板の洗浄用治具は、前記支持リブの上端に突出方向ま
わりのアールが付され、かつ上端が前記縦横桟および外
周枠の各上面よりも上方に突出する構成のものとしてあ
る。According to a second aspect of the present invention, there is provided a jig for cleaning a substrate for a semiconductor integrated circuit, wherein the upper ends of the supporting ribs are rounded around the protruding direction, and the upper ends are the upper surfaces of the vertical horizontal rail and the outer peripheral frame. It is configured so as to project above.
【０００９】本発明の請求項３に係る半導体集積回路用
基板の洗浄用治具は、外周枠の上面に上方へ突出する複
数の係合用突起と、これら各係合用突起の下方における
外周枠の下面にそれぞれ係合用凹部が形成され、前記外
周枠内に、縦横の桟によって区画された多数の連通窓を
有し、各連通窓の周辺部上面に、上端部が半球状に形成
された下部拡径のガイド突起を備え、かつ、各連通窓の
内周面から連通窓の内側へ突出し、上下端に突出方向ま
わりのアールが付され、しかも上端および下端がそれぞ
れ前記縦横の桟および外周枠の上下面よりも上下に突出
する支持リブを設け、この支持リブの上端にて基板支持
平面を規定する構成としてある。According to a third aspect of the present invention, there is provided a cleaning jig for a semiconductor integrated circuit substrate, wherein a plurality of engaging projections projecting upward on the upper surface of the outer peripheral frame and an outer peripheral frame below each of the engaging projections. Engagement recesses are formed on the lower surface, and a large number of communication windows partitioned by vertical and horizontal crosspieces are provided in the outer peripheral frame. A lower portion with a hemispherical upper end formed on the upper surface of the peripheral portion of each communication window. Each of the communication windows is provided with a diameter-expanding guide protrusion, protrudes from the inner peripheral surface of each communication window to the inside of the communication window, and is rounded around the protrusion direction at the upper and lower ends. Support ribs projecting vertically from the upper and lower surfaces are provided, and the upper end of the support rib defines the substrate support plane.
【００１０】本発明の請求項４に係る半導体集積回路用
基板の洗浄用治具は、２枚の洗浄用治具を上下に積み重
ねた際に、下側の洗浄用治具のガイド突起の上端にて上
側の洗浄用治具の下面を支承する上側治具の支持平面を
規定する構成としてある。According to a fourth aspect of the present invention, there is provided a cleaning jig for a semiconductor integrated circuit substrate, wherein when two cleaning jigs are vertically stacked, the upper end of the guide protrusion of the lower cleaning jig is provided. Defines the support plane of the upper jig that supports the lower surface of the upper cleaning jig.
【００１１】本発明の請求項５に係る半導体集積回路用
基板の洗浄用治具は、２枚の洗浄用治具を上下に積み重
ねた際に、下側の洗浄用治具の係合用突起が上側の洗浄
用治具の係合用凹部に嵌入し、これら係合用突起と係合
用凹部の嵌合により、上下の洗浄用治具の水平方向の動
きが規制されるように構成してある。According to a fifth aspect of the present invention, there is provided a cleaning jig for a substrate for a semiconductor integrated circuit, wherein when two cleaning jigs are vertically stacked, an engaging protrusion of the lower cleaning jig is It is configured such that the upper and lower cleaning jigs are fitted in the engaging recesses, and the horizontal movements of the upper and lower cleaning jigs are restricted by fitting the engaging projections and the engaging recesses.
【００１２】[0012]
【実施例】以下、本発明に係る洗浄用治具の実施例を添
付図面に示す具体例に基づいて詳細に説明する。本発明
の治具１は２枚１組で使用されるものとしてあり、１枚
の治具上に多数の基板を載せ、その上から別の治具を積
み重ね、基板を上下２枚の治具間に収容するように構成
してあり、上下の治具には同じものを使用する。Embodiments of the cleaning jig according to the present invention will be described below in detail with reference to the specific examples shown in the accompanying drawings. The jig 1 of the present invention is used as a set of two jigs. A large number of substrates are placed on one jig, another jig is stacked on the jig, and two jigs are provided on the upper and lower sides. It is configured to be housed between them, and the same jig is used for the upper and lower jigs.
【００１３】治具１は外周枠２内に縦桟３と横桟４にて
区画されてなる多数（図１、２では４０個）の連通窓
５、５が形成されており、各連通窓は洗浄しようとする
基板の平面形状よりも若干大なる寸法の相似形に形成さ
れ、具体的には例えば基板の平面形状が２７ｍｍ四方の
正方形であれば、連通窓は２７．３０ｍｍ四方の正方形
とする。The jig 1 is provided with a large number (40 in FIGS. 1 and 2) of communication windows 5 and 5 which are defined by vertical bars 3 and horizontal bars 4 in an outer peripheral frame 2. Is formed in a similar shape having a size slightly larger than the planar shape of the substrate to be cleaned. Specifically, for example, if the planar shape of the substrate is a 27 mm square, the communication window is a 27.30 mm square. To do.
【００１４】前記外周枠２の上面には、係合用突起６、
６が所要の間隔で突設されており、この係合用突起に対
応する外周枠の下面には、係合用突起が嵌入する係合用
凹部７、７が形成されている。これら係合用突起６、６
と係合用凹部７、７は２枚の治具を上下に積み重ねた際
に上下の治具の水平方向のずれを規制するためのものと
してある。On the upper surface of the outer peripheral frame 2, engaging projections 6,
6 are provided so as to project at required intervals, and engaging recesses 7, 7 into which the engaging projections are fitted are formed on the lower surface of the outer peripheral frame corresponding to the engaging projections. These engaging projections 6, 6
The engaging recesses 7 and 7 are for restricting the horizontal displacement of the upper and lower jigs when the two jigs are vertically stacked.
【００１５】また、外周枠２の上面には、上端が半球状
に形成された下部拡径の円錐台状にして前記係合用突起
６、６よりも高さの低い支持突起８、８が適宜の間隔で
立設されていて、これら支持突起は２枚の治具を上下に
積み重ねた際に上側の治具の外周枠下面に当接して上側
の治具を支承し、上下の治具の間隔を規定するものとし
てある。Further, on the upper surface of the outer peripheral frame 2, support projections 8, 8 having a lower diameter than the engaging projections 6, 6 and having a shape of a circular cone with a lower diameter having a hemispherical upper end are appropriately formed. These support protrusions abut on the lower surface of the outer peripheral frame of the upper jig when the two jigs are stacked vertically to support the upper jig, It is for defining the interval.
【００１６】しかして、前記各連通窓５、５の４辺にお
ける内周面には、縦桟３および横桟４あるいはこれら縦
横の桟と外周枠２から連通窓の内側へ突出する支持リブ
９、９を各辺ごとに複数個（図では２個）設けてある。However, on the inner peripheral surfaces of the four sides of each of the communication windows 5 and 5, the vertical ribs 3 and the horizontal rails 4, or the vertical and horizontal rails and the supporting ribs 9 protruding from the outer peripheral frame 2 to the inside of the communication window. , 9 are provided for each side (two in the figure).
【００１７】これら支持リブ９、９は、連通窓の上方に
おいて基板１０を支持するためのものとしてあり、図５
に示されるように支持リブの上端は縦横の桟３、４と外
周枠２の上面よりも上方に突出して基板支持平面１１を
規定し、かつ、支持リブの上端には、例えば曲率半径が
０．４ｍｍ程度のアールが支持リブの突出方向まわりに
付されていて、基板１０の下面との接触面積が極めて小
となるように構成されている。These support ribs 9 and 9 are provided to support the substrate 10 above the communication window, and FIG.
As shown in FIG. 5, the upper ends of the supporting ribs project above the vertical and horizontal crosspieces 3 and 4 and the upper surface of the outer peripheral frame 2 to define the substrate supporting plane 11, and the upper ends of the supporting ribs have, for example, a radius of curvature of 0. A radius of about 4 mm is provided around the protruding direction of the support ribs so that the contact area with the lower surface of the substrate 10 is extremely small.
【００１８】また、支持リブの下端部も縦横の桟３、４
と外周枠２の下面よりも下方に突出し、かつ、支持リブ
の下端部にも、例えば曲率半径が０．４ｍｍ程度のアー
ルが支持リブの突出方向まわりに付されている。The lower ends of the supporting ribs also have horizontal and vertical crosspieces 3, 4.
And the lower end portion of the supporting rib is also provided with a radius of curvature of about 0.4 mm around the protruding direction of the supporting rib.
【００１９】これら支持リブの連通窓中央へ方向すなわ
ち水平方向の突出量は、基板が連通窓から脱落しない程
度に基板の下面を支持できる必要最小限としてあり、例
えば前述した２７ｍｍ四方の正方形の基板を支承する場
合には、突出量を０．５〜１．０ｍｍ程度とし、突出方
向先端側における上下端部にアールを付してある。The amount of protrusion of these support ribs toward the center of the communication window, that is, in the horizontal direction is the minimum necessary to support the lower surface of the substrate to the extent that the substrate does not fall off the communication window. For example, the 27 mm square substrate described above is used. When the bearing is supported, the protrusion amount is about 0.5 to 1.0 mm, and the upper and lower ends on the tip side in the protrusion direction are rounded.
【００２０】前記各連通窓５、５の４辺を構成する縦桟
３および横桟４、あるいはこれら縦横の桟と外周枠２の
内周辺の各上面には、それぞれ上端が半球状に形成され
た下部が拡径する円錐台状のガイド突起１２、１２を複
数個（図では２個）設けてあって、これらガイド突起１
２、１２は基板を前記支持リブ９、９上にセットする際
に基板の側面を案内し、かつ、支持リブ９、９上に載せ
た基板１０の水平方向の動きを規制するためのものとし
てある。The vertical bars 3 and the horizontal bars 4 forming the four sides of each of the communication windows 5 and 5, or the vertical and horizontal bars and the upper surfaces of the inner periphery of the outer peripheral frame 2 are each formed with a hemispherical upper end. A plurality of (two in the figure) guide protrusions 12, 12 each having a truncated cone shape whose bottom portion expands in diameter are provided.
Reference numerals 2 and 12 are for guiding the side surface of the substrate when setting the substrate on the supporting ribs 9 and 9 and for restricting the horizontal movement of the substrate 10 placed on the supporting ribs 9 and 9. is there.
【００２１】これらガイド突起１２、１２は円錐台状で
側面が曲面で構成されているので、ガイド突起１２、１
２と基板の側面との接触面積が極めて小となり、したが
って洗浄の際にガイド突起と基板側面との間に洗浄剤や
純水が溜りにくいというメリットがある。Since the guide protrusions 12, 12 are frustoconical in shape and have side surfaces with curved surfaces, the guide protrusions 12, 1 are formed.
The contact area between 2 and the side surface of the substrate is extremely small, so that there is an advantage that the cleaning agent or pure water is unlikely to collect between the guide protrusion and the side surface of the substrate during cleaning.
【００２２】また、これらガイド突起１２、１２は前記
支持突起８、８と先端の高さが等しく、これらガイド突
起１２、１２は支持突起８、８と同様に２枚の治具を上
下に積み重ねた際に上側の治具の縦横の桟３、４あるい
は外周枠２の下面に当接して上側の治具を支承し、上下
の治具の間隔を規定するものとしてあり、これら支持突
起８、８とガイド突起１２、１２の上端で上側の治具の
支持平面１３を規定している。The guide protrusions 12 and 12 have the same tip height as that of the support protrusions 8 and 8. The guide protrusions 12 and 12, like the support protrusions 8 and 8, stack two jigs vertically. In this case, the upper and lower jigs are supported by contacting the vertical and horizontal crosspieces 3 and 4 of the upper jig or the lower surface of the outer peripheral frame 2 to define the distance between the upper and lower jigs. 8 and the upper ends of the guide protrusions 12, 12 define a support plane 13 for the upper jig.
【００２３】なお、図において符号１４、１４は把手を
示し、この把手の上面には治具のメーカ名や製品名等の
文字や記号が記載されるが、これらの文字や記号は基板
を洗浄する際に洗浄剤や純水が溜ることのないように高
さの低い凸状に形成するのが好ましい。In the figure, reference numerals 14 and 14 indicate a handle, and letters and symbols such as a maker name and a product name of the jig are described on the upper surface of the handle. These letters and symbols are used for cleaning the substrate. It is preferable to form a convex shape having a low height so that the cleaning agent and pure water do not accumulate during the process.
【００２４】また、図中の符号１５、１５は外周枠２の
下面に形成された突起を示し、これらの突起は前記支持
リブ９、９の下端よりも若干下方に突出し（例えば０．
１ｍｍ程度）、治具を作業台等の平坦面上に載せた際に
治具の底面を平坦面から浮かせて前記支持リブ９、９の
下端が平坦面に接触するのを防止するとともに、洗浄後
において治具と平坦面との間に洗浄剤や純水が溜まるの
を防止するためのものとしてもあって、できるだけフラ
ットに形成するのが好ましい。Further, reference numerals 15 and 15 in the figure denote projections formed on the lower surface of the outer peripheral frame 2, and these projections project slightly below the lower ends of the support ribs 9 (for example, 0.
(About 1 mm), when the jig is placed on a flat surface such as a workbench, the bottom surface of the jig is lifted from the flat surface to prevent the lower ends of the supporting ribs 9 and 9 from contacting the flat surface and cleaning. It is also used to prevent the cleaning agent and pure water from accumulating between the jig and the flat surface later, and it is preferable to form it as flat as possible.
【００２５】上述のように構成した本発明の洗浄用治具
は図６に示されるように、下側の治具１における連通窓
５の支持リブ９、９上に基板１０を載せ、下側の治具の
上に他の治具１’を載せて使用する。As shown in FIG. 6, the cleaning jig of the present invention having the above-mentioned structure is such that the substrate 10 is placed on the supporting ribs 9 and 9 of the communication window 5 in the jig 1 on the lower side and the lower side. Other jig 1'is placed on the jig of 1 and used.
【００２６】下側の治具１に基板１０を載せる際には、
基板が連通窓５まわりのガイド突起１２、１２の側面に
案内されて連通窓の中央にセットされ、支持リブ９、９
の上端によって連通窓上に支持される。すなわち、基板
は連通窓の周辺たる縦横の桟３、４あるいは縦横の桟と
外周枠２の内周辺よりも高い位置に支持され、かつ基板
の４辺と連通窓との間には隙間が形成される。When the substrate 10 is placed on the lower jig 1,
The substrate is guided by the side surfaces of the guide protrusions 12, 12 around the communication window 5 and set at the center of the communication window, and the supporting ribs 9, 9 are provided.
Is supported on the communication window by the upper end of the. That is, the substrate is supported at a position higher than the vertical and horizontal crosspieces 3, 4 around the communication window or the vertical and horizontal crosspieces and the inner periphery of the outer peripheral frame 2, and a gap is formed between the four sides of the substrate and the communication window. To be done.
【００２７】下側の治具１に基板１０をセットした後、
下側の治具の上に上側の治具１’を載せる。この際、上
側の治具１’の外周枠２’下面に形成された係合用凹部
７’を下側の治具１における係合用突起６に嵌めるが、
これら係合用突起６と係合用凹部７’は前述したとおり
上下の治具の水平方向のずれを規制するためのものであ
り、係合用突起６の上端と、係合用凹部７’の中央部間
は接触しない。After setting the substrate 10 on the lower jig 1,
Place the upper jig 1'onto the lower jig. At this time, the engaging recess 7'formed on the lower surface of the outer peripheral frame 2'of the upper jig 1'is fitted into the engaging projection 6 of the lower jig 1,
As described above, the engaging projection 6 and the engaging recess 7 ′ are for restricting the horizontal displacement of the upper and lower jigs, and are located between the upper end of the engaging projection 6 and the central portion of the engaging recess 7 ′. Do not touch.
【００２８】すなわち、上側の治具１’は下側の治具１
のガイド突起１２、１２と支持突起８、８の上端によっ
て支承され、すなわちこれらガイド突起と支持突起によ
って規定される支持平面１３上に支承される。That is, the upper jig 1'is the lower jig 1
Are supported by the guide projections 12, 12 and the upper ends of the support projections 8, 8, i.e. on the support plane 13 defined by these guide projections and support projections.
【００２９】したがって、下側の治具１の係合用突起６
の上端と、上側の治具１’の係合用凹部７’の中央部と
の間には隙間が形成され、この隙間によって係合用突起
６と係合用凹部７’との間に洗浄剤や純水が溜らないよ
うになっている。Therefore, the engaging projection 6 of the lower jig 1
A gap is formed between the upper end of the engaging recess 7'of the upper jig 1'and the center of the engaging recess 7'of the upper jig 1 '. It is designed not to collect water.
【００３０】また、上側の治具１’の支持リブ９’、
９’はその下端が縦桟３’や横桟４’の下面から下方に
突出して基板１０の上面に臨み、基板の上方向への動き
を規制する。Also, the supporting ribs 9'of the upper jig 1 ',
The lower end of 9'projects downward from the lower surface of the vertical bar 3'or the horizontal bar 4 ', faces the upper surface of the substrate 10, and restricts the upward movement of the substrate.
【００３１】すなわち、基板１０の上下方向の動きは下
側の治具１の支持リブ９、９の上端と、上側の治具１’
の支持リブ９’、９’の下端とによって規制され、これ
ら上下の支持リブ９、９’間の間隔は例えば基板１０の
厚さが０．８〜１．５ｍｍ程度であれば１．８ｍｍ程度
とするのが好適である。That is, the movement of the substrate 10 in the vertical direction is such that the upper ends of the supporting ribs 9 of the lower jig 1 and the upper jig 1 '.
Of the support ribs 9'and 9 ', and the distance between the upper and lower support ribs 9 and 9'is about 1.8 mm if the thickness of the substrate 10 is about 0.8 to 1.5 mm. Is preferred.
【００３２】また、上側の治具１’の支持リブ９’下端
は治具１’の縦横の桟３’、４’および外周枠２’より
も下方に突出しているので、基板を２枚の治具間に収容
した状態で上下を逆にして基板を支持リブ９’によって
支承しても、縦横の桟３’、４’および外周枠２’と基
板との間には隙間が形成され、洗浄剤や純水が溜らない
ようにしてある。Since the lower end of the supporting rib 9'of the upper jig 1'projects below the vertical and horizontal crosspieces 3 ', 4'and the outer peripheral frame 2'of the jig 1', two boards are used. Even if the substrate is supported upside down by the supporting ribs 9'in the state of being housed between the jigs, a gap is formed between the vertical and horizontal crosspieces 3'and 4'and the outer peripheral frame 2'and the substrate. The cleaning agent and pure water do not collect.
【００３３】上述のように上下の治具１、１’間に基板
１０を収容した状態で上下の治具の左右に形成されてい
る把手１４、１４’間をクリップ等の適宜の固定具で挟
み込み、洗浄剤や純水を溜めた水槽内に漬けたり、ある
いは洗浄剤や純水を吹き付けて洗浄を行なう。As described above, with the substrate 10 accommodated between the upper and lower jigs 1 and 1 ', an appropriate fixing tool such as a clip is provided between the handles 14 and 14' formed on the left and right of the upper and lower jigs. It is sandwiched and immersed in a water tank containing a cleaning agent or pure water, or sprayed with a cleaning agent or pure water for cleaning.
【００３４】洗浄剤や純水は上下の治具の連通窓５、
５’を通して基板１０の上下の面に接触し、基板表面に
付着している基板カット時の切り屑やその他の汚れが洗
浄剤や純水によって除去される。The cleaning agent and pure water are connected to the communication windows 5 of the upper and lower jigs,
The upper and lower surfaces of the substrate 10 are brought into contact with each other through 5 ', and chips and other stains attached to the substrate surface when the substrate is cut are removed by a cleaning agent or pure water.
【００３５】この際、洗浄剤や純水は単に基板の上下面
に接触するだけではなく、基板の４辺と縦横の桟あるい
は外周枠との間の隙間を流通し、基板の表面全体がまん
べんなく洗浄される。At this time, the cleaning agent and pure water not only come into contact with the upper and lower surfaces of the substrate, but also flow through the gaps between the four sides of the substrate and the vertical and horizontal bars or the outer peripheral frame, so that the entire surface of the substrate is evenly distributed. To be washed.
【００３６】洗浄後の基板は、上下の治具１、１’間に
収容した状態のまま乾燥機に入れ、基板や治具に付着し
ている洗浄剤や純水を除去する。この際、基板１０は支
持リブ９、９とごくわずかな面積で接触しているだけな
ので、支持リブと基板間に洗浄剤や純水が残るおそれは
殆どなく、また、支持リブの上下の端部は縦横の桟や外
周枠よりも上下に突出しているので、基板の４辺と縦横
の桟および外周枠との間には隙間が形成されていて、洗
浄後の洗浄剤や純水がこの隙間から容易に流下して洗浄
剤や純水が残りにくく、したがって確実な乾燥が行なわ
れる。The cleaned substrate is placed in a dryer while being housed between the upper and lower jigs 1 and 1'to remove the cleaning agent and pure water adhering to the substrate and the jig. At this time, since the substrate 10 is in contact with the supporting ribs 9 and 9 in a very small area, there is almost no possibility that the cleaning agent or pure water will remain between the supporting ribs and the substrate, and the upper and lower ends of the supporting ribs. Since the parts project vertically above and below the horizontal bars and the outer peripheral frame, a gap is formed between the four sides of the substrate and the vertical and horizontal horizontal bars and the outer peripheral frame. The cleaning agent and pure water are less likely to remain because they easily flow down through the gap, so that reliable drying is performed.
【００３７】基板の乾燥を終えると、上側の治具１’を
取り外し、基板を出荷用のトレーに移し替える。基板出
荷用のトレーには、その基板を用いて製作される半導体
装置収納用のトレーが使用されるのが一般的であり、図
７に出荷用トレー２０の基板搭載面の一例を示す。After the substrate is dried, the upper jig 1'is removed and the substrate is transferred to the shipping tray. As a substrate shipping tray, a tray for housing a semiconductor device manufactured using the substrate is generally used, and FIG. 7 shows an example of the substrate mounting surface of the shipping tray 20.
【００３８】この出荷用トレー２０はベース２１の外周
辺が縁枠２２で囲まれ、この縁枠２２内に突設された縦
横の仕切枠２３、２４によって基板を収容するポケット
２５が形成されている。In this shipping tray 20, the outer periphery of the base 21 is surrounded by an edge frame 22, and vertical and horizontal partition frames 23 and 24 projecting in the edge frame 22 form a pocket 25 for accommodating a substrate. There is.
【００３９】前記縦横の仕切枠２３、２４の交差部、す
なわちポケットの４隅には、コーナーリブ２６、２６が
突設されていて、これらコーナーリブのポケット中央側
の側面に形成された支持段部２７、２７によって基板１
０の４隅を支持するようになっている。Corner ribs 26, 26 are provided at the intersections of the vertical and horizontal partition frames 23, 24, that is, at the four corners of the pocket, and support ribs formed on the side surfaces of these corner ribs on the center side of the pocket. The substrate 1 by the parts 27,
It supports 4 corners of 0.
【００４０】基板を移し替える際には、図８に示すよう
に治具１に基板１０を載せた状態で、治具１上に出荷用
トレー２０をその基板搭載面が下向きとなるようにして
載せる。When transferring the substrates, as shown in FIG. 8, with the substrate 10 placed on the jig 1, the shipping tray 20 is placed on the jig 1 with its substrate mounting surface facing downward. Put.
【００４１】この際、治具１上面の係合用突起６は出荷
用トレー２０の縁枠２２内周面に内接し、治具と出荷用
トレーの水平方向の位置合わせが行なわれ、また、治具
の縦横の桟３、４および外周枠２上のガイド突起１２、
１２は出荷用トレーのコーナーリブ２６、２６間に入り
込むようになっている。At this time, the engaging projections 6 on the upper surface of the jig 1 are inscribed in the inner peripheral surface of the edge frame 22 of the shipping tray 20, so that the jig and the shipping tray are aligned in the horizontal direction, and the jig is fixed. Vertical and horizontal bars 3 and 4 of the tool and a guide projection 12 on the outer peripheral frame 2,
12 is designed to be inserted between the corner ribs 26, 26 of the shipping tray.
【００４２】すなわち、治具１の係合用突起６およびガ
イド突起１２、１２の配設位置は出荷用トレーの基板搭
載面の形状に合わせて決定するが、これら係合用突起６
は治具の外周枠２上のどの位置に設けても不都合はな
く、また、ガイド突起１２、１２も連通窓５、５の周辺
上であれば配設する間隔や位置も自由に設定することが
でき、各種の出荷用トレーに容易に適合させることがで
きる。That is, the positions of the engagement projections 6 and the guide projections 12 and 12 of the jig 1 are determined according to the shape of the substrate mounting surface of the shipping tray.
Can be provided at any position on the outer peripheral frame 2 of the jig, and the guide protrusions 12, 12 can be freely set in intervals and positions provided on the periphery of the communication windows 5, 5. It can be easily adapted to various shipping trays.
【００４３】治具１上に出荷用トレー２０をセットした
ら、治具１と出荷用トレー２０を係合させたまま上下を
反転させ、基板を治具の支持リブ９、９上から出荷用ト
レー２０の支持段部２７、２７上に移し替える。この
際、基板１０は治具１のガイド突起１２、１２と出荷用
トレー２０のコーナーリブ２６、２６に案内されて基板
の移し替えがスムーズに行なわれる。After the shipping tray 20 is set on the jig 1, the jig 1 and the shipping tray 20 are engaged with each other and turned upside down, so that the substrate is placed on the jig supporting ribs 9 and 9 from above the shipping tray. 20 on the support steps 27, 27. At this time, the substrate 10 is guided by the guide protrusions 12, 12 of the jig 1 and the corner ribs 26, 26 of the shipping tray 20 to smoothly transfer the substrate.
【００４４】基板が載せられた出荷用トレーは、基板を
収容した状態で上下に積み重ねることができるようにな
っており、１０〜１５枚程度の出荷用トレーが積み重ね
られた状態で基板ユーザたる半導体装置メーカに出荷さ
れる。The shipping trays on which the substrates are placed can be stacked one above the other in a state that the substrates are accommodated therein. When the shipping trays of about 10 to 15 sheets are stacked, the semiconductor which is a substrate user can be used. Shipped to the equipment manufacturer.
【００４５】なお、図において、符号２８は出荷用トレ
ー２０の把手、２９は出荷用トレーどうしを積み重ねる
際に前記縁枠２２の内周面に嵌合する周枠、３０は半導
体装置メーカにて半導体装置を収容する際に半導体装置
の水平方向の移動を規制するためのリブを示している。In the figure, reference numeral 28 is a handle of the shipping tray 20, 29 is a peripheral frame fitted to the inner peripheral surface of the edge frame 22 when the shipping trays are stacked, and 30 is a semiconductor device manufacturer. The ribs for restricting the horizontal movement of the semiconductor device when the semiconductor device is housed are shown.
【００４６】上述した実施例においては、支持突起８、
８とガイド突起１２、１２の先端高さを同じにして、こ
れら支持突起とガイド突起の先端で上側に載せる治具
１’の支持平面１３を規定しているが、支持突起８、８
の先端高さをガイド突起１２、１２の先端高さよりも高
くして、支持突起８、８によって上側治具の支持平面１
３を規定する場合もあるし、支持突起８、８を設けず、
ガイド突起の先端１２、１２だけで上側治具１’の支持
平面１３を規定する場合もある。In the embodiment described above, the support protrusions 8,
8 and the guide projections 12 and 12 have the same tip height to define the support plane 13 of the jig 1 ′ to be placed on the upper side by the tips of the support projections and the guide projections.
The height of the tip of each of the guide projections 12 is made higher than the height of the tip of each of the guide projections 12, and the support projections 8 enable the support plane 1 of the upper jig
3 may be specified, or the supporting protrusions 8 and 8 are not provided,
The support plane 13 of the upper jig 1'may be defined only by the tips 12, 12 of the guide protrusions.
【００４７】[0047]
【発明の作用、効果】本発明に係る洗浄用治具は、各連
通窓の４辺における内周面から連通窓の内側へ突出する
支持リブの上端にて基板の下面を支持し、前記連通窓の
４辺に立設した下部拡径のガイド突起にて基板の水平方
向の動きを規制する構成としてあるので、基板は連通窓
上に安定して支持される。According to the cleaning jig of the present invention, the lower surface of the substrate is supported by the upper ends of the supporting ribs projecting from the inner peripheral surfaces of the four sides of each communication window to the inside of the communication window, and the communication is performed. Since the lower-diameter expanded guide projections provided upright on the four sides of the window regulate the horizontal movement of the substrate, the substrate is stably supported on the communication window.
【００４８】基板を載せた治具の上に、さらに同じ構造
の他の治具を載せると、基板は下側の治具におけるガイ
ド突起の上端と、上側の治具におけるガイド突起の下端
とによって上下方向の動きが規制される。When another jig having the same structure is further placed on the jig on which the substrate is placed, the substrate is formed by the upper end of the guide protrusion of the lower jig and the lower end of the guide protrusion of the upper jig. Vertical movement is restricted.
【００４９】また、基板は連通窓の４辺から内側へ突出
する支持リブにて支持されるので、基板は縦横の桟や外
周枠に隠れることなく上下の全面が連通窓内に現れ、し
たがって洗浄時においては洗浄剤や純水が連通窓を通し
て基板全体に充分接触し、基板を確実に洗浄することが
できる。Further, since the substrate is supported by the supporting ribs which project inward from the four sides of the communication window, the entire upper and lower surfaces of the substrate appear in the communication window without being hidden by the horizontal and vertical crosspieces or the outer peripheral frame, and therefore the cleaning is performed. In some cases, the cleaning agent or pure water comes into sufficient contact with the entire substrate through the communication window, and the substrate can be reliably cleaned.
【００５０】さらに、支持リブの上下端を縦横の桟およ
び外周辺の上下面よりも突出させて設けてあり、しかも
支持リブの上下端に突出方向まわりのアールを付してあ
るので、基板の側面と連通窓の４辺間との間に隙間が形
成され、かつ支持リブと基板との接触面積が極めて小と
なり、したがって基板と連通窓の４辺間や基板と支持リ
ブとの間に洗浄剤や純水が流通し易くてより確実な基板
の洗浄を行なうことができるとともに、洗浄剤や純水が
溜りにくくて洗浄後における基板の乾燥を短時間で確実
に行なうことができる。Further, the upper and lower ends of the supporting ribs are provided so as to project from the horizontal and vertical crosspieces and the upper and lower surfaces of the outer periphery, and the upper and lower ends of the supporting ribs are rounded around the projecting direction. A gap is formed between the side surface and the four sides of the communication window, and the contact area between the supporting rib and the substrate is extremely small. Therefore, cleaning is performed between the four sides of the substrate and the communication window and between the substrate and the supporting rib. The cleaning agent and pure water can be more reliably flowed to clean the substrate, and the cleaning agent and pure water are less likely to accumulate, so that the substrate can be dried reliably after cleaning in a short time.
【００５１】また、治具の上面における係合用突起は連
通窓周辺以外の外周枠上であればどこに設けてもよく、
またガイド突起も連通窓の周辺であれば配設位置や間隔
を自由に設定することができ、したがって既存の基板出
荷用トレーの形状に合わせて出荷用トレーの基板搭載面
と治具とが嵌合する構成とすることが容易であり、治具
から出荷用トレーへの基板の移し替えを容易に行なえる
ものとすることができる。The engaging projections on the upper surface of the jig may be provided anywhere on the outer peripheral frame other than the periphery of the communication window.
Also, the guide protrusions can be freely arranged in the vicinity of the communication window, and the arrangement position and interval can be set freely. Therefore, the board mounting surface of the shipping tray and the jig can be fitted according to the shape of the existing board shipping tray. The structure can be easily adapted, and the substrates can be easily transferred from the jig to the shipping tray.
【図１】本発明に係る洗浄用治具の実施例を示す平面
図。FIG. 1 is a plan view showing an embodiment of a cleaning jig according to the present invention.
【図２】本発明に係る洗浄用治具の実施例を示す底面
図。FIG. 2 is a bottom view showing an embodiment of a cleaning jig according to the present invention.
【図３】本発明に係る洗浄用治具の実施例を示す一部拡
大平面図。FIG. 3 is a partially enlarged plan view showing an embodiment of a cleaning jig according to the present invention.
【図４】本発明に係る洗浄用治具の実施例を示す一部拡
大底面図。FIG. 4 is a partially enlarged bottom view showing an embodiment of the cleaning jig according to the present invention.
【図５】図３のV-V 線縦断面図。5 is a vertical cross-sectional view taken along line VV of FIG.
【図６】本発明に係る洗浄用治具の使用状態を示す拡大
縦断面図。FIG. 6 is an enlarged vertical sectional view showing a usage state of the cleaning jig according to the present invention.
【図７】洗浄後の基板を載せる出荷用トレーの基板搭載
面の拡大平面図。FIG. 7 is an enlarged plan view of the substrate mounting surface of the shipping tray on which the substrate after cleaning is placed.
【図８】洗浄後の基板を本発明の洗浄用治具から出荷用
トレーに移す際における洗浄用治具と出荷用トレーとの
係合状態を示す拡大縦断面図。FIG. 8 is an enlarged vertical sectional view showing an engagement state between the cleaning jig and the shipping tray when the cleaned substrate is transferred from the cleaning jig of the present invention to the shipping tray.
【図９】半導体装置の一例を一部破断して示す平面図。FIG. 9 is a plan view showing an example of a semiconductor device with a part thereof cut away.
【図１０】半導体装置の一例を示す正面図。FIG. 10 is a front view showing an example of a semiconductor device.
【図１１】半導体装置の一例を示す底面図。FIG. 11 is a bottom view showing an example of a semiconductor device.
１、１’ 治具 ２ 外周枠 ３ 縦桟 ４ 横桟 ５ 連通窓 ６ 係合用突起 ７ 係合用凹部 ８ 支持突起 ９ 支持リブ １０ 基板 １１ 基板支持平面 １２ ガイド突起 １３ 上側治具の支持平面 １４ 把手 １５ 突起 ２０ 出荷用トレー ２１ ベース ２２ 縁枠 ２３ 縦仕切枠 ２４ 横仕切枠 ２５ ポケット ２６ コーナーリブ ２７ 支持段部 ２８ 把手 ２９ 周枠 ３０ リブ 1, 1'jig 2 outer peripheral frame 3 Vertical bars 4 Horizontal bars 5 Communication window 6 Engagement protrusion 7 Engagement recess 8 Support protrusion 9 Support rib 10 Substrate 11 substrate support plane 12 guide protrusion 13 Supporting surface of upper jig 14 Handle 15 protrusions 20 Shipping tray 21 Base 22 Edge frame 23 Vertical partition frame 24 Horizontal Partition Frame 25 Pockets 26 corner rib 27 support step 28 Handle 29 Perimeter frame 30 ribs
───────────────────────────────────────────────────── フロントページの続き (72)発明者 東 聖治 東京都荒川区西日暮里２−25−１ シノ ン電気産業株式会社内 (72)発明者 田所 晃平 東京都荒川区西日暮里２−25−１ シノ ン電気産業株式会社内 (56)参考文献 特開 平７−112785（ＪＰ，Ａ) 特開 平７−277388（ＪＰ，Ａ) 特開 平11−10103（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/12 B65D 85/86 H05K 3/26 H01L 21/52 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Seiji Higashi 2-25-1, Nishi-nippori, Arakawa-ku, Tokyo Inside Shinon Electric Industry Co., Ltd. (72) Kohei Tadokoro 2-25-1, Nishi-nippori, Arakawa-ku, Tokyo Inside Shinon Electric Industry Co., Ltd. (56) Reference JP-A-7-112785 (JP, A) JP-A-7-277388 (JP, A) JP-A-11-10103 (JP, A) (58) Field (Int.Cl. 7 , DB name) H01L 23/12 B65D 85/86 H05K 3/26 H01L 21/52
Claims (5)
用突起と、これら各係合用突起の下方における外周枠の
下面にそれぞれ係合用凹部が形成され、前記外周枠内
に、縦横の桟によって区画された多数の連通窓を有し、
各連通窓の周辺部上面に、上端部が半球状に形成された
下部拡径のガイド突起を備え、また、各連通窓の内周面
から連通窓の内側へ突出し、上端にて基板支持平面を規
定する支持リブを設けてなる半導体集積回路用基板の洗
浄用治具。1. A plurality of engaging projections projecting upward on the upper surface of an outer peripheral frame, and engaging recesses on the lower surface of the outer peripheral frame below these engaging projections, respectively. It has a large number of communication windows divided by crosspieces,
The upper part of the periphery of each communicating window is provided with a lower-diameter guide projection whose upper end is formed in a hemispherical shape. Also, it projects from the inner peripheral surface of each communicating window to the inside of the communicating window, and the substrate supporting plane at the upper end. A jig for cleaning a substrate for a semiconductor integrated circuit, which is provided with a supporting rib that defines
方向まわりのアールが付され、かつ上端が前記縦横桟お
よび外周枠の各上面よりも上方に突出する半導体集積回
路用基板の洗浄用治具。2. The supporting rib according to claim 1, wherein the upper end of the supporting rib is rounded around the projecting direction, and the upper end of the supporting rib projects above the upper surfaces of the vertical and horizontal rails and the outer peripheral frame. Cleaning jig.
用突起と、これら各係合用突起の下方における外周枠の
下面にそれぞれ係合用凹部が形成され、前記外周枠内
に、縦横の桟によって区画された多数の連通窓を有し、
各連通窓の周辺部上面に、上端部が半球状に形成された
下部拡径のガイド突起を備え、かつ、各連通窓の内周面
から連通窓の内側へ突出し、上下端に突出方向まわりの
アールが付され、しかも上端および下端がそれぞれ前記
縦横の桟および外周枠の上下面よりも上下に突出する支
持リブを設け、この支持リブの上端にて基板支持平面を
規定する半導体集積回路用基板の洗浄用治具。3. A plurality of engaging projections projecting upward on the upper surface of the outer peripheral frame, and engaging recesses on the lower surface of the outer peripheral frame below these engaging projections, respectively. It has a large number of communication windows divided by crosspieces,
The upper surface of the periphery of each communication window is provided with a lower-diameter guide projection whose upper end is formed in a hemispherical shape. For a semiconductor integrated circuit, which is provided with supporting ribs whose upper and lower ends respectively project above and below the vertical and horizontal bars and the upper and lower surfaces of the outer peripheral frame, and which defines the substrate supporting plane at the upper ends of the supporting ribs. A jig for cleaning substrates.
の洗浄用治具を上下に積み重ねた際に、下側の洗浄用治
具のガイド突起の上端にて上側の洗浄用治具の下面を支
承する上側治具の支持平面を規定する半導体集積回路用
基板の洗浄用治具。4. The guide projection according to claim 1, wherein when the two cleaning jigs are vertically stacked, the upper projection is provided at the upper end of the guide projection of the lower cleaning jig. A jig for cleaning a semiconductor integrated circuit substrate that defines the support plane of the upper jig that supports the lower surface of the jig.
の洗浄用治具を上下に積み重ねた際に、下側の洗浄用治
具の係合用突起が上側の洗浄用治具の係合用凹部に嵌入
し、これら係合用突起と係合用凹部の嵌合により、上下
の洗浄用治具の水平方向の動きが規制される半導体集積
回路用基板の洗浄用治具。5. The engagement protrusion according to claim 1, wherein when the two cleaning jigs are vertically stacked, the engagement protrusion of the lower cleaning jig has an upper cleaning jig. A jig for cleaning a substrate for a semiconductor integrated circuit in which the horizontal movements of the upper and lower cleaning jigs are restricted by being fitted into the engaging recesses of the tool, and by fitting the engaging projections and the engaging recesses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001006271A JP3507035B2 (en) | 2001-01-15 | 2001-01-15 | Jig for cleaning substrates for semiconductor integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001006271A JP3507035B2 (en) | 2001-01-15 | 2001-01-15 | Jig for cleaning substrates for semiconductor integrated circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002217326A JP2002217326A (en) | 2002-08-02 |
| JP3507035B2 true JP3507035B2 (en) | 2004-03-15 |
Family
ID=18874181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001006271A Expired - Fee Related JP3507035B2 (en) | 2001-01-15 | 2001-01-15 | Jig for cleaning substrates for semiconductor integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3507035B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100630325B1 (en) | 2004-12-09 | 2006-10-04 | 원용권 | Semiconductor package substrate cleaning jig and semiconductor package substrate cleaning transportation method which it uses |
| KR101378578B1 (en) | 2012-09-12 | 2014-03-25 | (주)에스티아이 | Jig for Glass Etching |
| JP2018195772A (en) * | 2017-05-22 | 2018-12-06 | 日本特殊陶業株式会社 | Manufacturing method for wiring board, and wiring board holding jig |
| CN110190018B (en) * | 2019-07-01 | 2024-08-20 | 南通玖方新材料股份有限公司 | Spliced silicon wafer bearing frame |
| CN113734582A (en) * | 2021-08-27 | 2021-12-03 | 深圳市鑫达辉软性电路科技有限公司 | FPC circulation book |
-
2001
- 2001-01-15 JP JP2001006271A patent/JP3507035B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002217326A (en) | 2002-08-02 |
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