JP3506166B2 - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JP3506166B2 JP3506166B2 JP09273896A JP9273896A JP3506166B2 JP 3506166 B2 JP3506166 B2 JP 3506166B2 JP 09273896 A JP09273896 A JP 09273896A JP 9273896 A JP9273896 A JP 9273896A JP 3506166 B2 JP3506166 B2 JP 3506166B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- semiconductor device
- coolant channel
- cooling
- coolant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体装置の冷却装
置に関するものであり、特に電気自動車制御用半導体装
置を冷却するための冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for a semiconductor device, and more particularly to a cooling device for cooling a semiconductor device for controlling an electric vehicle.
【０００２】[0002]
【従来の技術】従来の冷却装置を例えば電気自動車用制
御装置に用いたものでは、インバータ等の複数の半導体
装置をそれぞれ個別に冷却板に搭載し、各半導体装置毎
に車両に搭載している。このような制御装置では、各半
導体装置毎に端子部品や配線が必要になるので、部品点
数が増加するとともに製造コストが増加し、さらに車両
への搭載が煩雑であるという問題がある。また、制御装
置全体の体格が大きくなるので、搭載スペースに制限の
ある車両に搭載したような場合保守、点検等のサービス
性が劣化するという問題が生じる。2. Description of the Related Art In a conventional cooling device used for a control device for an electric vehicle, for example, a plurality of semiconductor devices such as an inverter are individually mounted on a cooling plate, and each semiconductor device is mounted on a vehicle. . In such a control device, since a terminal component and wiring are required for each semiconductor device, there are problems that the number of components is increased, the manufacturing cost is increased, and the mounting on a vehicle is complicated. Further, since the overall size of the control device becomes large, there arises a problem that serviceability such as maintenance and inspection is deteriorated when the control device is installed in a vehicle having a limited installation space.
【０００３】[0003]
【発明が解決しようとする課題】このような問題を解決
するため、一つの冷却装置の両面または片面に複数の半
導体装置を搭載する冷却装置が考えられる。冷媒容器内
に導入する冷媒により半導体装置の冷却を促進する冷却
装置では冷媒容器内の構造が一様に形成されることが一
般的である。つまり、最も発熱量の大きな半導体装置を
冷却可能に形成されているため、発熱量の低い半導体装
置の搭載位置にも冷却用フィンが形成されていることが
ある。In order to solve such a problem, a cooling device in which a plurality of semiconductor devices are mounted on both sides or one side of one cooling device is conceivable. In a cooling device that promotes cooling of a semiconductor device by a coolant introduced into the coolant container, the structure inside the coolant container is generally formed uniformly. That is, since the semiconductor device having the largest heat generation amount can be cooled, the cooling fin may be formed at the mounting position of the semiconductor device having the lowest heat generation amount.
【０００４】また、形状の異なる半導体装置をねじ等で
冷媒容器に取付け可能にするため、冷媒流路を仕切る壁
厚を厚くしてこの仕切壁に半導体装置の取付けねじをね
じ止め可能にしている。したがって、肉厚の薄いフィン
に比較して冷却性能が劣るという問題がある。本発明は
このような問題を解決するためになされたものであり、
半導体装置の冷却性能を保持し小型化可能な冷却装置を
提供することを目的とする。Further, in order to attach a semiconductor device having a different shape to the refrigerant container with a screw or the like, the wall thickness for partitioning the refrigerant flow path is made thick so that the mounting screw for the semiconductor device can be screwed to this partition wall. . Therefore, there is a problem that the cooling performance is inferior to that of the thin fin. The present invention has been made to solve such a problem,
An object of the present invention is to provide a cooling device which can maintain the cooling performance of a semiconductor device and can be downsized.
【０００５】本発明の他の目的は、半導体装置の冷却性
能を保持し小型化可能な電気自動車用制御装置を提供す
ることにある。Another object of the present invention is to provide an electric vehicle control device capable of maintaining the cooling performance of a semiconductor device and downsizing.
【０００６】[0006]
【課題を解決するための手段】本発明の請求項１記載の
冷却装置によると、発熱量の大きな第１半導体装置を第
１冷媒流路で冷却し、発熱量が比較的低く大きさの異な
る複数の装置からなる第２半導体装置は第２冷媒流路で
冷却するといったように半導体装置の発熱量に応じて冷
媒流路の構成を最適化できる。したがって、一つの冷却
装置により冷却性能を保持しつつ冷却装置の小型化が可
能になる。According to the cooling device of the first aspect of the present invention, the first semiconductor device having a large heat generation amount is cooled by the first coolant flow path so that the heat generation amount is relatively low and the size is different. The configuration of the coolant channel can be optimized according to the amount of heat generated by the semiconductor device, such that the second semiconductor device including a plurality of devices is cooled by the second coolant channel. Therefore, it is possible to reduce the size of the cooling device while maintaining the cooling performance with one cooling device.
【０００７】 本発明の請求項２記載の冷却装置による
と、冷媒流れをコ字状にしたことにより、冷媒流れが直
線状のものに比較して半導体装置を搭載した冷却装置と
他装置との干渉を緩和できる。本発明の請求項３記載の
電気自動車用制御装置によると、冷却容器に搭載される
半導体装置の冷却性能を保持しつつ制御装置全体の体格
を小型化できる。According to the cooling device of the second aspect of the present invention, since the coolant flow is U-shaped, the coolant flow between the cooling device equipped with the semiconductor device and the other device is greater than that of the linear coolant flow. Can reduce interference. According to the electric vehicle controller of the third aspect of the present invention, it is possible to reduce the size of the entire controller while maintaining the cooling performance of the semiconductor device mounted in the cooling container.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を示す
実施例を図面に基づいて説明する。本発明の冷却装置を
電気自動車用制御装置に適用した一実施例を図１、２お
よび図３に示す。図２に示す電気自動車用制御装置の冷
却装置１０の冷媒容器１１は、アルミ鋳造の成形体また
はアルミの押出し成形体の両端部を封止することにより
形成されている。入口管３２から冷媒容器１１内に導入
された冷媒は出口管３１から流出する。枠２１は冷媒容
器１１に搭載される図示しない第１半導体装置の取付位
置を示しており、枠２２、２３、２４、２５および２６
は冷媒容器１１に搭載される図示しない第２半導体装置
の取付位置を示している。第１半導体装置および第２半
導体装置は冷媒容器１１の同一面上に搭載される。第１
半導体装置は一つのモジュールまたは同じ大きさのモジ
ュールを組み合わせて構成され、第２半導体装置は大き
さの異なる複数のモジュールで構成されている。２１
ａ、２１ｂ、２１ｃ、２１ｄ、２１ｅ、２１ｆ、２２
ａ、２２ｂ、２２ｃ、２２ｄ、２３ａ、２３ｂ、２３
ｃ、２３ｄ、２４ａ、２４ｂ、２４ｃ、２４ｄ、２５
ａ、２５ｂ、２５ｃ、２５ｄ、２６ａ、２６ｂ、２６
ｃ、２６ｄは各モジュールのねじ穴を示している。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments showing an embodiment of the present invention will be described below with reference to the drawings. An embodiment in which the cooling device of the present invention is applied to a control device for an electric vehicle is shown in FIGS. 1, 2 and 3. The refrigerant container 11 of the cooling device 10 of the control device for an electric vehicle shown in FIG. 2 is formed by sealing both ends of an aluminum cast molded product or an aluminum extruded molded product. The refrigerant introduced into the refrigerant container 11 through the inlet pipe 32 flows out through the outlet pipe 31. The frame 21 shows the mounting position of the first semiconductor device (not shown) mounted in the refrigerant container 11, and the frames 22, 23, 24, 25 and 26 are shown.
Indicates a mounting position of a second semiconductor device (not shown) mounted in the refrigerant container 11. The first semiconductor device and the second semiconductor device are mounted on the same surface of the refrigerant container 11. First
The semiconductor device is configured by combining one module or modules of the same size, and the second semiconductor device is configured by a plurality of modules having different sizes. 21
a, 21b, 21c, 21d, 21e, 21f, 22
a, 22b, 22c, 22d, 23a, 23b, 23
c, 23d, 24a, 24b, 24c, 24d, 25
a, 25b, 25c, 25d, 26a, 26b, 26
Reference characters c and 26d denote screw holes of each module.
【０００９】枠２１は車両駆動用モータを制御する公知
のインバータの取付位置を示しており、枠２２はエアコ
ン用インバータの取付位置を示しており、枠２３は電気
自動車で商用電源を使用するためのインバータの取付位
置を示しており、枠２４は整流器の取付位置を示してお
り、枠２５はトランスの取付位置を示しており、枠２６
はトランジスタ等の取付位置を示している。枠２４、２
５および２６に搭載されるモジュールにより電気自動車
の高電圧バッテリからヘッドライト等の車載機器用補機
バッテリへ電圧変換する公知のＤＣ／ＤＣコンバータが
構成されている。A frame 21 shows a mounting position of a known inverter for controlling a vehicle drive motor, a frame 22 shows a mounting position of an air conditioner inverter, and a frame 23 uses a commercial power source in an electric vehicle. Of the inverter, the frame 24 shows the position of the rectifier, the frame 25 shows the position of the transformer, and the frame 26
Indicates the mounting position of a transistor or the like. Frames 24, 2
The modules mounted on 5 and 26 constitute a known DC / DC converter for converting the voltage from the high voltage battery of the electric vehicle to the auxiliary battery for vehicle equipment such as a headlight.
【００１０】図１に示すように、第１半導体装置を構成
するモジュール（以下、「第１半導体装置を構成するモ
ジュール」を第１モジュールという）の搭載位置に対応
する冷媒容器１１内には第１冷媒流路４１が形成されて
おり、第２半導体装置を構成するモジュール（以下、
「第２半導体装置を構成するモジュール」を第２モジュ
ールという）の搭載位置に対応する冷媒容器１１内には
第２冷媒流路４３が形成されている。図３に示すよう
に、第１冷媒流路４１および第２冷媒流路４３の断面形
状は矩形である。図１に示すように、第１冷媒流路４１
は冷媒出口３１ａと連通しており、第２冷媒流路４３は
冷媒入口３２ａと連通している。第１冷媒流路４１およ
び第２冷媒流路４３は連通流路４５によりそれぞれ一方
の端部で連通されている。As shown in FIG. 1, in the refrigerant container 11 corresponding to the mounting position of the module (hereinafter, the "module forming the first semiconductor device" is referred to as the first module) forming the first semiconductor device, The first coolant channel 41 is formed, and the module that constitutes the second semiconductor device (hereinafter,
A second refrigerant flow path 43 is formed in the refrigerant container 11 corresponding to the mounting position of the “module forming the second semiconductor device” is referred to as the second module). As shown in FIG. 3, the cross-sectional shapes of the first coolant flow channel 41 and the second coolant flow channel 43 are rectangular. As shown in FIG. 1, the first refrigerant flow channel 41
Is in communication with the refrigerant outlet 31a, and the second refrigerant flow passage 43 is in communication with the refrigerant inlet 32a. The first refrigerant flow channel 41 and the second refrigerant flow channel 43 are communicated with each other at one end by a communication channel 45.
【００１１】第１冷媒流路４１内には十数枚の肉厚の薄
いスリット状のフィン４２が冷媒容器１１の本体と一体
に形成されており、第１冷媒流路４１はこのフィン４２
により十数本の流路に分かれている。第２冷媒流路４３
内には取付部４４ａ、および壁厚の厚い仕切壁４４ｂが
冷媒容器１１の本体と一体に形成されており、第２冷媒
流路４３は取付部４４ａ、および仕切壁４４ｂにより４
本の流路に分かれている。取付部４４ａには枠２５、２
６に搭載される第２モジュールのねじ穴が形成されてお
り、この取付部４４ａに枠２５、２６に搭載されるモジ
ュールがねじ止めされる。A dozen or more thin slit-like fins 42 are formed integrally with the main body of the refrigerant container 11 in the first refrigerant passage 41, and the first refrigerant passage 41 has the fins 42.
Is divided into a dozen or more channels. Second refrigerant channel 43
Inside, a mounting portion 44a and a partition wall 44b having a large wall thickness are integrally formed with the main body of the refrigerant container 11, and the second refrigerant flow channel 43 is formed by the mounting portion 44a and the partition wall 44b.
Divided into book channels. Frames 25 and 2 are attached to the mounting portion 44a.
6 is formed with a screw hole for the second module, and the modules mounted on the frames 25 and 26 are screwed to the mounting portion 44a.
【００１２】図３に示す符号５１は冷媒容器１１の裏蓋
であり、符号５１ａおよび５１ｂに示す接触分部でロウ
付等で冷媒容器１１の本体に固定され第１冷媒流路４１
および第２冷媒流路４３を封止している。冷媒入口３２
ａから導入した冷媒は、第２冷媒流路４３、連通流路４
５、第１冷媒流路４１を経て冷媒出口３１ａから流出す
る。冷媒出口３１ａから流出した冷媒は、図示しない放
熱器で冷却され再び冷媒入口３２ａに導入される。冷媒
流れはコ字状に形成されており、冷媒は第２冷媒流路４
３、第１冷媒流路４１を逆方向に流れる。Reference numeral 51 shown in FIG. 3 is a back lid of the refrigerant container 11, and is fixed to the body of the refrigerant container 11 by brazing or the like at the contact portions shown by reference numerals 51a and 51b.
And the 2nd refrigerant channel 43 is sealed. Refrigerant inlet 32
The refrigerant introduced from a is the second refrigerant channel 43 and the communication channel 4
5, and then flows out of the refrigerant outlet 31a through the first refrigerant flow path 41. The refrigerant flowing out of the refrigerant outlet 31a is cooled by a radiator (not shown) and is introduced again into the refrigerant inlet 32a. The coolant flow is formed in a U shape, and the coolant is the second coolant flow path 4
3. The first coolant flow channel 41 flows in the opposite direction.
【００１３】前述したように、枠２１に搭載される第１
モジュールは電気自動車の駆動用モータを制御するイン
バータであるため、枠２２、２３、２４、２５、２６に
搭載される第２モジュールよりも駆動電力および発熱量
が大きい。したがって、冷媒と冷媒容器１１との接触面
積を増大させる肉厚の薄いフィン４２を多数配設するこ
とにより、第１モジュールから伝導した熱により加熱さ
れるフィン４２が第１冷媒流路４１を流れる冷媒により
素早く冷却されるので、第１モジュールが良好に冷却さ
れる。As described above, the first device mounted on the frame 21
Since the module is an inverter that controls the driving motor of the electric vehicle, the driving power and the heat generation amount are larger than those of the second modules mounted in the frames 22, 23, 24, 25, and 26. Therefore, by disposing a large number of thin fins 42 that increase the contact area between the refrigerant and the refrigerant container 11, the fins 42 heated by the heat conducted from the first module flow through the first refrigerant flow path 41. The first module is cooled well because it is quickly cooled by the refrigerant.
【００１４】枠２２、２３、２４、２５、２６に搭載さ
れる第２モジュールは第１モジュールよりも比較的駆動
電力および発熱量が小さいので、冷媒と冷媒容器１１と
の接触面積を第１冷媒流路４１におけるほど増大させる
必要はなく第２モジュールの取付けが優先される。第２
モジュールは大きさが異なり取付ねじ位置がばらばらで
あるためねじ穴の一部が第２冷媒流路４３に位置してい
るので、第２冷媒流路４３に取付部４４ａを配設して第
２モジュールの取付けを可能にしている。第２モジュー
ルをねじ止め可能にするために取付部４４ａの壁厚はか
なり厚くなっており冷媒との接触面積は小さいが、取付
部４４ａ、仕切壁４４ｂを除いた第２冷媒流路４３の実
質的流路断面積は冷却装置１０の冷却性能を保持するよ
うに確保されている。Since the second modules mounted on the frames 22, 23, 24, 25, and 26 have relatively smaller driving power and heat generation amount than the first module, the contact area between the refrigerant and the refrigerant container 11 is set to the first refrigerant. It does not need to be increased as much as in the flow path 41, and the mounting of the second module is prioritized. Second
Since the modules are different in size and the mounting screw positions are different, a part of the screw hole is located in the second refrigerant flow passage 43. Allows module mounting. The wall thickness of the mounting portion 44a is considerably thick so that the second module can be screwed, and the contact area with the refrigerant is small. However, the second refrigerant passage 43 except for the mounting portion 44a and the partition wall 44b is substantially formed. The cross-sectional area of the dynamic flow path is ensured so as to maintain the cooling performance of the cooling device 10.
【００１５】以上説明したように本発明の上記実施例で
は、発熱量の大きな第１モジュールを冷却する第１冷媒
流路４１には冷却性能を高めるために多数のフィン４２
を配設し、第１モジュールに比較して発熱量の少ない第
２モジュールの搭載面位置に形成される第２冷媒流路４
３には取付部４４ａを形成することにより第２モジュー
ルの取付けを優先している。このように半導体装置を構
成する各モジュールの発熱量に応じて冷媒容器内の冷却
機構を異なる構造にすることにより、発熱量の異なる第
１モジュールおよび第２モジュールを一つの冷却容器の
同一平面上に搭載することができる。したがって、電気
自動車用制御装置全体としての体格を小型化することが
できるとともに搭載スペースを限られた車両への搭載が
容易になる。As described above, in the above embodiment of the present invention, a large number of fins 42 are provided in the first refrigerant passage 41 for cooling the first module having a large heat generation amount in order to enhance the cooling performance.
And the second refrigerant flow path 4 formed at the mounting surface position of the second module that generates less heat than the first module.
By attaching the mounting portion 44a to the third module 3, the mounting of the second module is prioritized. As described above, the cooling mechanism in the refrigerant container has a different structure according to the heat generation amount of each module constituting the semiconductor device, so that the first module and the second module having different heat generation amounts are on the same plane of one cooling container. Can be mounted on. Therefore, the overall size of the control device for an electric vehicle can be reduced, and the control device for an electric vehicle can be easily mounted on a vehicle with a limited mounting space.
【００１６】また、本実施例では冷媒流れをコ字状に形
成したことにより冷却装置の面拡がり方向をほぼ均一に
しているので、冷却装置が一方向に延びて形成されるこ
とを防止している。したがって、車両等に搭載する際の
他装置との干渉を緩和できる。本発明の上記実施例では
電気自動車用制御装置に本発明の冷却装置を適用した例
について説明したが、冷却性能を保持するとともに小型
化を必要とされる冷却装置に本発明を適用することは可
能である。Further, in this embodiment, since the cooling medium flow is formed in a U shape to make the surface expansion direction of the cooling device substantially uniform, the cooling device is prevented from being formed extending in one direction. There is. Therefore, it is possible to reduce interference with other devices when mounted on a vehicle or the like. In the above-described embodiment of the present invention, the example in which the cooling device of the present invention is applied to the control device for the electric vehicle has been described, but the present invention can be applied to the cooling device that is required to be downsized while maintaining the cooling performance. It is possible.
【００１７】また本実施例では取付部４４ａは第２冷媒
流路４３を仕切る構造であるが、モジュールの大きさま
たは形状によっては、流路を仕切らず流路に突出するだ
けの構造にすることも可能である。また本実施異例では
冷媒流れをコ字状に形成したが、冷媒入口、第２冷媒流
路、連通流路、第１冷媒流路、冷媒出口を直線上に配置
し、冷媒流れを直線にすることも可能である。さらにま
た、第１冷媒流路から第２冷媒流路に向けて本実施例と
逆方向に冷媒を流すことも可能である。Further, in the present embodiment, the mounting portion 44a has a structure for partitioning the second refrigerant flow path 43, but depending on the size or shape of the module, the structure may be such that the flow path is not partitioned and only projects into the flow path. Is also possible. Although the refrigerant flow is formed in a U-shape in this embodiment, the refrigerant inlet, the second refrigerant passage, the communication passage, the first refrigerant passage, and the refrigerant outlet are arranged in a straight line to make the refrigerant flow a straight line. It is also possible. Furthermore, it is also possible to flow the refrigerant from the first refrigerant flow path toward the second refrigerant flow path in the direction opposite to that of the present embodiment.
【図１】本発明の一実施例による冷却装置の面拡がり方
向の断面図である。FIG. 1 is a cross-sectional view of a cooling device according to an exemplary embodiment of the present invention in a surface expansion direction.
【図２】本実施例の冷却装置を示す平面図である。FIG. 2 is a plan view showing a cooling device of this embodiment.
【図３】図１のIII-III 線断面図である。FIG. 3 is a sectional view taken along line III-III in FIG.
１０ 冷却装置 １１ 冷媒容器 ３１ａ 冷媒出口 ３２ａ 冷媒入口 ４１ 第１冷媒流路 ４３ 第２冷媒流路 ４２ フィン ４４ａ 取付部 ４５ 連通流路 10 Cooling device 11 Refrigerant container 31a Refrigerant outlet 32a refrigerant inlet 41 First Refrigerant Flow Path 43 Second refrigerant flow path 42 fins 44a mounting part 45 communication channel
Claims (3)
冷媒流路と前記第２冷媒流路とを連通する連通流路、前
記第１冷媒流路および前記第２冷媒流路の一方と連通す
る冷媒入口、ならびに前記第１冷媒流路および前記第２
冷媒流路の他方と連通する冷媒出口を有する一つの冷媒
容器を備え、前記冷媒入口から導入し前記冷媒出口から
流出する冷媒により前記冷媒容器に搭載した複数の半導
体装置を冷却する冷却装置であって、 前記半導体装置は少なくとも第１半導体装置および第２
半導体装置を有し、前記第１冷媒流路には肉厚の薄いフィンが配設されて前
記第１半導体装置を冷却し、前記第２冷媒流路には前記
第２冷媒流路に突出するか、または前記第２冷媒流路を
仕切る前記第２半導体装置の取付部が形成されている こ
とを特徴とする冷却装置。1. A first coolant channel, a second coolant channel, the first coolant channel.
A communication channel that communicates the coolant channel and the second coolant channel, a coolant inlet that communicates with one of the first coolant channel and the second coolant channel, and the first coolant channel and the second coolant channel.
A cooling device comprising one refrigerant container having a refrigerant outlet communicating with the other of the refrigerant channels, and cooling a plurality of semiconductor devices mounted in the refrigerant container by a refrigerant introduced from the refrigerant inlet and flowing out from the refrigerant outlet. The semiconductor device includes at least a first semiconductor device and a second semiconductor device.
A semiconductor device is provided, and a thin fin is provided in the first coolant channel.
Note that the first semiconductor device is cooled, and
Projects into the second coolant channel or connects the second coolant channel
The cooling device is characterized in that an attachment portion for partitioning the second semiconductor device is formed .
よび前記連通流路はコ字状の冷媒流れを形成し、前記第
１冷媒流路と前記第２冷媒流路とを逆方向に冷媒が流れ
ることを特徴とする請求項１記載の冷却装置。2. The first coolant channel, the second coolant channel and the communication channel form a U-shaped coolant flow, and the first coolant channel and the second coolant channel are reversed. cooling apparatus according to claim 1, wherein the refrigerant flows in the direction.
自動車制御用半導体装置の冷却装置として用い、前記第
１半導体装置で駆動用モータを制御することを特徴とす
る電気自動車用制御装置。3. A controller for an electric vehicle, wherein the cooling device according to claim 1 or 2 is used as a cooling device for a semiconductor device for controlling an electric vehicle, and a drive motor is controlled by the first semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09273896A JP3506166B2 (en) | 1996-04-15 | 1996-04-15 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09273896A JP3506166B2 (en) | 1996-04-15 | 1996-04-15 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09283679A JPH09283679A (en) | 1997-10-31 |
| JP3506166B2 true JP3506166B2 (en) | 2004-03-15 |
Family
ID=14062769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09273896A Expired - Fee Related JP3506166B2 (en) | 1996-04-15 | 1996-04-15 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3506166B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4085559B2 (en) * | 2000-06-20 | 2008-05-14 | 株式会社デンソー | Cooling fluid cooling type circuit device |
| DE102004057526B4 (en) | 2003-12-03 | 2020-08-20 | Denso Corporation | Stack cooler |
| US20050269691A1 (en) * | 2004-06-04 | 2005-12-08 | Cooligy, Inc. | Counter flow micro heat exchanger for optimal performance |
| US7187549B2 (en) * | 2004-06-30 | 2007-03-06 | Teradyne, Inc. | Heat exchange apparatus with parallel flow |
| JP2008171840A (en) * | 2007-01-05 | 2008-07-24 | T Rad Co Ltd | Liquid-cooling heat sink and design method thereof |
| JP5381561B2 (en) | 2008-11-28 | 2014-01-08 | 富士電機株式会社 | Semiconductor cooling device |
| JP2011134979A (en) * | 2009-12-25 | 2011-07-07 | Fuji Electric Co Ltd | Liquid cooling type heat sink |
| JP5790039B2 (en) * | 2010-07-23 | 2015-10-07 | 富士電機株式会社 | Semiconductor device |
| KR101255935B1 (en) | 2011-07-08 | 2013-04-23 | 삼성전기주식회사 | Power Module Package and Method for Manufacturing the same |
| KR101278313B1 (en) * | 2011-11-04 | 2013-06-25 | 삼성전기주식회사 | Heat sink |
| JP6868633B2 (en) * | 2016-09-23 | 2021-05-12 | 住友精密工業株式会社 | Cooling system |
-
1996
- 1996-04-15 JP JP09273896A patent/JP3506166B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09283679A (en) | 1997-10-31 |
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