JP3496398B2 - control panel - Google Patents

control panel

Info

Publication number
JP3496398B2
JP3496398B2 JP17312496A JP17312496A JP3496398B2 JP 3496398 B2 JP3496398 B2 JP 3496398B2 JP 17312496 A JP17312496 A JP 17312496A JP 17312496 A JP17312496 A JP 17312496A JP 3496398 B2 JP3496398 B2 JP 3496398B2
Authority
JP
Japan
Prior art keywords
heat sink
control panel
wind tunnel
panel
cooling air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP17312496A
Other languages
Japanese (ja)
Other versions
JPH1023618A (en
Inventor
秀明 志津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Original Assignee
Meidensha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp filed Critical Meidensha Corp
Priority to JP17312496A priority Critical patent/JP3496398B2/en
Publication of JPH1023618A publication Critical patent/JPH1023618A/en
Application granted granted Critical
Publication of JP3496398B2 publication Critical patent/JP3496398B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Patch Boards (AREA)

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】この発明は、電子機器、例え
ばモータの可変速装置などの半導体応用装置のようにモ
ールド型の半導体を用いた電子機器などを盤内に収納し
た制御盤に関し、特にその冷却系に関するものである。 【0002】 【従来の技術】図5及び図6は従来の制御盤の縦断正面
図及び縦断側面図を示し、1は本体部であり、その内部
には取付枠2を介してヒートシンク3が左右二列に三段
に設けられ、ヒートシンク3の外周にはモータの可変速
装置を構成する電子機器であるモールド型のトランジス
タモジュール4が取り付けられている。5は同じく取付
枠2に取り付けられたコンデンサであり、トランジスタ
モジュール4及びコンデンサ5により図7に示すように
コンバータ部6とコンデンサ5とインバータ部7からな
るモータの可変速回路を構成している。ヒートシンク3
は断面長方形の筒状に形成され、内部に縦横の仕切が設
けられている。8は本体部1内の背後側に設けられた風
洞であり、ヒートシンク3の一端は風洞8と連通する。
9は本体部1内の上部に設けられた冷却ファン、10は
本体部1の前面開放側を開閉する扉である。 【0003】図8は従来の制御盤の冷却風の流れを表す
縦断側面図を示し、冷却ファン9を回転させると、冷却
風は扉10の下部に設けた吸気孔10aから内部に入
り、各ヒートシンク3内を通ってトランジスタモジュー
ル4を冷却し、風洞8内で合流して上昇し、冷却ファン
9を介して本体部1の天井部に設けた排気孔1aから外
部へ排出される。 【0004】 【発明が解決しようとする課題】上記した従来の制御盤
においては、トランジスタモジュール4の熱はヒートシ
ンク3及び冷却風を介してその60〜70%が外部に排
出されるが、残りの熱量は内部に放出される。例えば、
盤内上部のA部のような所ではほとんど冷却風が流れな
いので高温となり、支障を来すことがあった。又、制御
盤の周囲の雰囲気が悪い場合、吸気孔10aから一旦
内部に塵埃が入ると、冷却風の流れは少なくともヒート
シンク3の数だけあり、塵埃が盤内にばらまかれること
になった。 【0005】この発明は上記のような課題を解決するた
めに成されたものであり、盤内部の局部的な温度上昇を
防止し、あるいは塵埃の盤内へのばらまきを防止し、内
部に収納された電子機器を好条件に保つことができ、そ
の寿命を延ばすことができる制御盤を得ることを目的と
する。 【0006】 【課題を解決するための手段】この発明の請求項1に係
る制御盤は、下部に設けられた吸気孔と、上部に設けら
れた排気孔と、内部に設けられた風洞と、内部の吸気孔
と排気孔の間に水平に設けられるとともに、筒状に形成
され、外周に電子機器を構成する電子部品が取り付けら
れ、かつ一端が風洞と連通するヒートシンクと、風洞か
らの冷却風を上記排気孔に案内する冷却ファンと、ヒー
トシンクの他端に設けられた上向きの風案内部を設けた
ものである。 【0007】 【発明の実施の形態】実施形態1 以下、この発明の実施の形態を図面とともに説明する。
図1及び図2はこの発明の実施形態1による制御盤の冷
却風の流れを示す縦断側面図及び要部斜視図を示し、1
1は一端が風洞8と連通するヒートシンク3の他端に取
り付けられた上向きの風案内部であり、他の構成は従来
と同様であり、ヒートシンク3は吸気孔10aと排気孔
1aとの間に水平に設けられている。 【0008】上記構成において、冷却ファン9を回転さ
せると、冷却風は吸気孔10aから盤内に入り、上向き
の風案内部11があるために直接的にはヒートシンク3
へ向かわず、通流すべき水平配置のヒートシンク3より
やや上方まで進み、その後各風案内部11に案内されて
各ヒートシンク3内を通流し、風洞8で合流し、冷却フ
ァン9を介して排気孔1aから外部に排出される。 【0009】実施形態1においては、各ヒートシンク3
の他端に上向きの風案内部11を設けており、吸気孔1
0aから盤内に入った冷却風は一旦上方まで進んだ後ヒ
ートシンク3内に吸入される。このため、盤内上方にも
冷却風が通流することになり、盤内を平均して冷却する
ことができる。このため、盤内部の局部的な温度上昇は
生じず、電子機器を好条件に保つことができ、その寿命
を延ばすことができる。 【0010】実施形態2 図3及び図4は実施形態2による制御盤の冷却風の流れ
を示す縦断側面図及び要部斜視図を示し、吸気孔10a
は扉10の各ヒートシンク3と対応した位置に開口す
る。12は筒状の継ぎ風洞であり、その一端は扉10の
吸気孔10aの内側に取り付けられ、継ぎ風洞12の他
端は扉10を閉じた状態でヒートシンク3と連通し、開
口が一致する。13は継ぎ風洞12の内部に設けられた
冷却フィンである。 【0011】上記構成において、冷却ファン9を回転さ
せると、冷却風は吸気孔10aから継ぎ風洞12内に入
って継ぎ風洞12自体及び冷却フィン13と熱交換した
後、ヒートシンク3内に入って熱交換し、風洞8で合流
して冷却ファン9を介して排気孔1aから外部に排出さ
れる。冷却フィン14は盤内の空気と熱交換して盤内を
冷却する。 【0012】実施形態2においては、冷却風は扉10の
吸気孔10aから継ぎ風洞12内、ヒートシンク3内、
及び風洞8内を介して排気孔1aから排出される。従っ
て、冷却風と一緒に塵埃がこれらの通路を通っても盤内
に入ることはなく、盤内にばらまかれることはない。こ
のため、盤内を清浄に保つことができ、トランジスタモ
ジュール4等の電子部品に対して好条件が得られ、電子
部品の寿命を長くすることができる。又、継ぎ風洞12
の内外に冷却フィン13,14を設けたので、盤内空気
を効果的に冷却することができ、局部的な温度上昇も防
止することができる。 【0013】 【発明の効果】以上のようにこの発明の請求項1によれ
ば、水平なヒートシンクの他端に上向きの風案内部を設
けたので、下部に設けられた吸気孔から盤内に入った冷
却風は一旦ヒートシンクより上方まで移動した後ヒート
シンク内に入るので、盤内を平均して冷却することがで
き、局部的な温度上昇を防止することができ、盤内を好
条件にして電子部品等の寿命を長くすることができる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of controlling electronic equipment, for example, an electronic equipment using a mold type semiconductor such as a semiconductor application device such as a variable speed device of a motor. The present invention relates to a control panel housed therein, and particularly to a cooling system thereof. 2. Description of the Related Art FIGS. 5 and 6 show a vertical front view and a vertical side view of a conventional control panel, wherein 1 is a main body portion, and a heat sink 3 is mounted on the inside thereof through a mounting frame 2. A mold type transistor module 4 which is an electronic device constituting a variable speed device of a motor is mounted on the outer periphery of the heat sink 3 in two rows and three stages. Reference numeral 5 denotes a capacitor similarly mounted on the mounting frame 2. The transistor module 4 and the capacitor 5 constitute a variable speed circuit of the motor including the converter 6, the capacitor 5, and the inverter 7, as shown in FIG. Heat sink 3
Is formed in a tubular shape having a rectangular cross section, and vertical and horizontal partitions are provided inside. Reference numeral 8 denotes a wind tunnel provided on the rear side in the main body 1, and one end of the heat sink 3 communicates with the wind tunnel 8.
Reference numeral 9 denotes a cooling fan provided at an upper portion in the main body 1, and 10 denotes a door that opens and closes the front open side of the main body 1. FIG. 8 is a vertical sectional side view showing the flow of cooling air in a conventional control panel. When the cooling fan 9 is rotated, the cooling air enters through a suction hole 10a provided in a lower portion of a door 10 and each of the cooling air flows into the inside. The transistor module 4 is cooled through the heat sink 3, merges and rises in the wind tunnel 8, and is discharged through a cooling fan 9 to the outside through an exhaust hole 1 a provided in a ceiling portion of the main body 1. [0004] In the above-mentioned conventional control panel, 60-70% of the heat of the transistor module 4 is discharged to the outside through the heat sink 3 and the cooling air. The heat is released inside. For example,
In places such as the upper part A in the panel, the cooling air hardly flows, so that the temperature becomes high, which sometimes causes trouble. Further, in the case where the atmosphere around the control panel is bad, once dust enters the panel through the air intake holes 10a, the flow of cooling air is at least as many as the number of heat sinks 3, and the dust is scattered in the panel. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and it is intended to prevent a local rise in temperature inside a panel or to prevent dust from being scattered in a panel and to store the dust inside the panel. It is an object of the present invention to obtain a control panel capable of keeping a selected electronic device in favorable conditions and extending its life. According to a first aspect of the present invention, there is provided a control panel comprising: an intake hole provided at a lower portion; an exhaust hole provided at an upper portion; a wind tunnel provided inside; Internal air intake
And a heat sink, which is formed horizontally and has a cylindrical shape, and electronic components constituting an electronic device are attached to the outer periphery, and one end of which communicates with the wind tunnel, and cools air from the wind tunnel through the exhaust hole. , And an upward wind guide provided at the other end of the heat sink. Embodiment 1 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 and 2 are a vertical sectional side view and a main part perspective view showing a flow of cooling air of a control panel according to Embodiment 1 of the present invention.
Reference numeral 1 denotes an upward wind guide portion attached to the other end of the heat sink 3 having one end communicating with the wind tunnel 8, and the other configuration is the same as that of the conventional heat guide . The heat sink 3 has an intake hole 10a and an exhaust hole.
1a and is provided horizontally. In the above configuration, when the cooling fan 9 is rotated, the cooling air enters the board through the intake hole 10a, and is directly provided by the heat sink 3 because of the upward wind guide portion 11.
Without passing through the heat sink 3, which travels slightly above the horizontally arranged heat sink 3 to be passed through, and then flows through each heat sink 3 while being guided by each wind guide portion 11, merges in the wind tunnel 8, and exhausts through the cooling fan 9. 1a is discharged to the outside. In the first embodiment, each heat sink 3
Is provided with an upward wind guide portion 11 at the other end thereof.
The cooling air that has entered the panel from 0 a once goes upward and is then sucked into the heat sink 3. Therefore, the cooling air flows also in the upper part of the panel, and the inside of the panel can be cooled on average. For this reason, a local temperature rise inside the panel does not occur, and the electronic device can be kept in favorable conditions, and its life can be extended. Second Embodiment FIGS. 3 and 4 are a vertical sectional side view and a main part perspective view showing a flow of cooling air in a control panel according to a second embodiment.
Is opened at a position corresponding to each heat sink 3 of the door 10. Reference numeral 12 denotes a tubular air tunnel, one end of which is attached to the inside of an intake hole 10a of the door 10, and the other end of the air tunnel 12 communicates with the heat sink 3 with the door 10 closed, and the openings coincide. Reference numeral 13 denotes a cooling fin provided inside the wind tunnel 12. In the above configuration, when the cooling fan 9 is rotated, the cooling air flows into the joint wind tunnel 12 through the intake hole 10a, exchanges heat with the joint wind tunnel 12 itself and the cooling fins 13, and then enters the heat sink 3 to generate heat. It is exchanged, merged in the wind tunnel 8, and discharged to the outside through the exhaust hole 1a through the cooling fan 9. The cooling fins 14 exchange heat with air in the panel to cool the inside of the panel. In the second embodiment, the cooling air flows from the air intake hole 10a of the door 10 into the joint wind tunnel 12, the heat sink 3,
And the air is discharged from the exhaust hole 1a through the wind tunnel 8. Therefore, even if dust passes along these passages together with the cooling air, the dust does not enter the panel and is not scattered in the panel. For this reason, the inside of the board can be kept clean, favorable conditions can be obtained for electronic components such as the transistor module 4, and the life of the electronic components can be prolonged. Also, the wind tunnel 12
Since the cooling fins 13 and 14 are provided inside and outside of the panel, the air inside the panel can be effectively cooled, and a local temperature rise can be prevented. As described above, according to the first aspect of the present invention, the upward heat guide is provided at the other end of the horizontal heat sink. The cooling air that has entered once moves above the heat sink and then enters the heat sink, so it is possible to cool the inside of the panel evenly, prevent local temperature rise, and make the inside of the panel a favorable condition. The life of electronic components and the like can be extended.

【図面の簡単な説明】 【図1】この発明の実施形態1による制御盤の冷却風の
流れを示す縦断側面図である。 【図2】実施形態1による制御盤の要部斜視図である。 【図3】実施形態2による制御盤の縦断側面に図であ
る。 【図4】実施形態2による制御盤の要部斜視図である。 【図5】従来の制御盤の縦断正面図である。 【図6】従来の制御盤の縦断側面図である。 【図7】制御盤内の電子機器の回路図である。 【図8】従来の制御盤の冷却風の流れを表す縦断側面図
である。 【符号の説明】 1…本体部 1a…排気孔 3…ヒートシンク 4…トランジスタモジュール 8…風洞 9…冷却ファン 10…扉 10a…吸気孔 11…風案内部 12…継ぎ風洞
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a vertical sectional side view showing a flow of cooling air in a control panel according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of a main part of the control panel according to the first embodiment. FIG. 3 is a view on a longitudinal side surface of a control panel according to a second embodiment. FIG. 4 is a perspective view of a main part of a control panel according to a second embodiment. FIG. 5 is a vertical sectional front view of a conventional control panel. FIG. 6 is a vertical sectional side view of a conventional control panel. FIG. 7 is a circuit diagram of an electronic device in the control panel. FIG. 8 is a vertical sectional side view showing a flow of cooling air in a conventional control panel. [Description of Signs] 1... Main body 1 a... Exhaust holes 3. Heat sinks 4. Transistor modules 8. Wind tunnels 9. Cooling fans 10. Doors 10 a.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平8−65825(JP,A) 実開 昭60−192691(JP,U) 実開 平5−72192(JP,U) 実開 昭61−49462(JP,U) 実開 昭60−125796(JP,U) 実開 昭57−170595(JP,U) 実開 昭57−135891(JP,U) 実開 昭57−93014(JP,U) 実開 昭56−66110(JP,U) 実開 昭56−4268(JP,U) (58)調査した分野(Int.Cl.7,DB名) H02B 1/56 H05K 7/20 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-8-65825 (JP, A) JP-A 60-192691 (JP, U) JP-A 5-72192 (JP, U) JP-A 61-69 49462 (JP, U) Fully open sho 60-125796 (JP, U) Really open sho 57-170595 (JP, U) Fully open sho 57-135891 (JP, U) Really open sho 57-93014 (JP, U) Japanese Utility Model Application Showa 56-66110 (JP, U) Japanese Utility Model Application Showa 56-4268 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H02B 1/56 H05K 7/20

Claims (1)

(57)【特許請求の範囲】 【請求項1】 内部に電子機器が収納された制御盤にお
いて、下部に設けられた吸気孔と、上部に設けられた排
気孔と、内部に設けられた風洞と、内部の吸気孔と排気
孔の間に水平に設けられるとともに筒状に形成され、外
周に電子機器を構成する電子部品が取り付けられ、かつ
一端が風洞と連通するヒートシンクと、風洞からの冷却
風を上記排気孔に案内する冷却ファンと、ヒートシンク
の他端に設けられた上向きの風案内部を備えたことを特
徴とする制御盤。
(57) [Claim 1] In a control panel in which an electronic device is housed, an intake hole provided in a lower portion, an exhaust hole provided in an upper portion, and a wind tunnel provided in an inner portion. And internal intake and exhaust
A heat sink, which is provided horizontally between the holes and is formed in a cylindrical shape, has electronic components attached to the outer periphery thereof, and has one end communicating with the wind tunnel, and guides cooling air from the wind tunnel to the exhaust hole. A control panel comprising: a cooling fan; and an upward wind guide provided at the other end of the heat sink.
JP17312496A 1996-07-03 1996-07-03 control panel Expired - Fee Related JP3496398B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17312496A JP3496398B2 (en) 1996-07-03 1996-07-03 control panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17312496A JP3496398B2 (en) 1996-07-03 1996-07-03 control panel

Publications (2)

Publication Number Publication Date
JPH1023618A JPH1023618A (en) 1998-01-23
JP3496398B2 true JP3496398B2 (en) 2004-02-09

Family

ID=15954585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17312496A Expired - Fee Related JP3496398B2 (en) 1996-07-03 1996-07-03 control panel

Country Status (1)

Country Link
JP (1) JP3496398B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN108199263A (en) * 2017-12-25 2018-06-22 罗新华 A kind of dust-extraction unit suitable at the top of power distribution cabinet
CN108281891A (en) * 2017-12-25 2018-07-13 罗新华 A kind of dust removal method suitable at the top of power distribution cabinet

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JP3408424B2 (en) 1998-07-28 2003-05-19 日本電気株式会社 Electronic equipment cooling structure
JP3988282B2 (en) * 1998-10-26 2007-10-10 株式会社デンソー Programmable controller
JP2010080456A (en) * 2007-01-10 2010-04-08 Ntt Electornics Corp Electronic unit
JP4854687B2 (en) * 2008-02-01 2012-01-18 三菱電機株式会社 Cooling system
FI20085945L (en) 2008-10-08 2010-04-09 Abb Oy Electronic device cooling structure and method
CN102468615B (en) * 2010-11-05 2016-12-28 广东天富电气股份有限公司 A kind of all--weather box type electric substation
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JP2021052155A (en) 2019-09-26 2021-04-01 ファナック株式会社 Electrical device including fan unit, and control panel including electrical device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108199263A (en) * 2017-12-25 2018-06-22 罗新华 A kind of dust-extraction unit suitable at the top of power distribution cabinet
CN108281891A (en) * 2017-12-25 2018-07-13 罗新华 A kind of dust removal method suitable at the top of power distribution cabinet

Also Published As

Publication number Publication date
JPH1023618A (en) 1998-01-23

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