JP3479848B2 - Adjustment method of super abrasive wheel - Google Patents
Adjustment method of super abrasive wheelInfo
- Publication number
- JP3479848B2 JP3479848B2 JP26788893A JP26788893A JP3479848B2 JP 3479848 B2 JP3479848 B2 JP 3479848B2 JP 26788893 A JP26788893 A JP 26788893A JP 26788893 A JP26788893 A JP 26788893A JP 3479848 B2 JP3479848 B2 JP 3479848B2
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- superabrasive
- grain
- metal
- truing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ダイヤモンド又はＣＢ
Ｎ（Ｃｕｂｉｃ Ｂｏｒｏｎ Ｎｉｔｒｉｄｅ）等の超
砥粒を使用した超砥粒砥石の研削性能を向上させるため
の調整方法及び研削性能の向上した超砥粒砥石に関す
る。The present invention relates to diamond or CB.
The present invention relates to an adjusting method for improving the grinding performance of a superabrasive grinding wheel using superabrasive particles such as N (Cubic Boron Nitride) and a superabrasive grinding wheel with improved grinding performance.
【０００２】[0002]
【従来の技術】ダイヤモンド又はＣＢＮといった超砥粒
を使用した超砥粒砥石には、メタル（Ｓｎ、Ｃｕ）を結
合材とするメタルボンド超砥粒砥石と、超砥粒砥石が台
金に電着された電着超砥粒砥石があり、いずれも高能率
且つ長寿命な研削加工が可能であるが、高精度も要求さ
れる場合、ツルーイングといわれる加工を施し砥粒先端
の高さのばらつきを矯正することが必須用件となる。2. Description of the Related Art A super-abrasive-grain wheel using a super-abrasive grain such as diamond or CBN is a metal-bond super-abrasive-grain wheel using a metal (Sn, Cu) as a binder, and a super-abrasive-grain wheel for electroplating. There are electrodeposited superabrasive grindstones that have been deposited, and all of them are capable of highly efficient and long-life grinding, but when high precision is also required, a process called truing is applied to vary the height of the abrasive grain tip. Correcting is a mandatory requirement.
【０００３】これまでメタルボンド超砥粒砥石の場合、
ツルーイングは、ダイヤモンドロータリーツルアを使
用する方法、ＳｉＣを主成分とするＧＣ砥石を使用す
る方法、及び放電を利用する方法等により行われてい
る。このうち、上記のダイヤモンドロータリーツルア
による方法では、図１１に矢印のラインで示すように、
砥石１の表面の超砥粒２とメタル３がダイヤモンドロー
タリーツルア４により共に平に研削され、上記のＧＣ
砥石による方法では、図１２に矢印のラインで示すよう
に、ＧＣ砥石５により超砥粒２はほとんど研削されず主
にメタル３が除去され、メタル３による保持力を失った
超砥粒が脱落する。また、上記の放電による方法で
は、図１３に矢印のラインで示すように、電極６と砥石
１間の放電によりメタル３のみが除去（電極とメタル間
でのみ放電が発生する）され、メタル３による保持力を
失った超砥粒が脱落する。In the case of metal bond superabrasive grindstones,
The truing is performed by a method of using a diamond rotary truer, a method of using a GC grindstone containing SiC as a main component, a method of utilizing electric discharge, and the like. Among them, in the method using the diamond rotary truer, as shown by the arrow line in FIG.
The super-abrasive grains 2 and the metal 3 on the surface of the grindstone 1 are flatly ground together by the diamond rotary truer 4, and the above-mentioned GC
In the method using a grindstone, as shown by an arrow line in FIG. 12, the superabrasive grains 2 are hardly ground by the GC grindstone 5 and mainly the metal 3 is removed, and the superabrasive grains that have lost the holding force due to the metal 3 fall off. To do. Further, in the above-described method using electric discharge, as shown by the arrow line in FIG. 13, only the metal 3 is removed (the electric discharge occurs only between the electrode and the metal) by the electric discharge between the electrode 6 and the grindstone 1, and the metal 3 The superabrasive grains that have lost their holding power due to falling off.
【０００４】電着超砥粒砥石の場合、ツルーイングは、
ダイヤモンドロータリーツルア４を使用して行い、図
１４に矢印のラインで示すように、砥石７の表面の超砥
粒２先端が平に研削される。なお、図１４において、８
は砥石の台金、９は超砥粒２を台金８に固着するメッキ
層である。In the case of an electrodeposited superabrasive grindstone, the truing is
The diamond rotary truer 4 is used, and the tips of the superabrasive grains 2 on the surface of the grindstone 7 are ground flat as shown by the arrow lines in FIG. In FIG. 14, 8
Is a base metal of the grindstone, and 9 is a plating layer for fixing the superabrasive grains 2 to the base metal 8.
【０００５】上記従来のツルーイング方法のうち、及
びの方法は、砥石表面のメタル３を除去するとともに
保持力の弱くなった超砥粒を脱落させることにより砥石
表面を整形するもので、超砥粒自体を研削するものでは
ないので、基本的に超砥粒先端のばらつきはツルーイン
グによって矯正されず、超砥粒の粒径が大きくなるほど
超砥粒先端の高さのばらつきが大きくなり、高精度な研
削加工のできる砥石を得ることが困難となる。Among the above-mentioned conventional truing methods, and are methods for shaping the surface of the grindstone by removing the metal 3 on the surface of the grindstone and removing the superabrasive particles having weakened holding force. Since it does not grind itself, variations in the tip of the superabrasive grain are basically not corrected by truing, and the greater the grain size of the superabrasive grain, the greater the variation in the height of the superabrasive grain tip. It becomes difficult to obtain a grindstone that can be ground.
【０００６】これに対し上記及びの方法は、超砥粒
の先端が機械的にカットされるので、ツルーイング後は
超砥粒先端の高さのばらつきが矯正され、高精度な研削
加工のできる砥石を得ることができる。しかしながら、
超砥粒先端のカットされた面が平坦となるので切れ味が
悪く、研削能率が悪化し、また研削能率を上げようとす
ると研削焼けによる砥石寿命の短命化及び被加工面の表
面性状の悪化という問題を惹起する。On the other hand, in the above and other methods, since the tip of the superabrasive grain is mechanically cut, the variation in the height of the superabrasive grain tip is corrected after truing, and a grindstone capable of highly accurate grinding processing. Can be obtained. However,
Since the cut surface of the superabrasive grain tip becomes flat, the sharpness is poor, the grinding efficiency deteriorates, and when trying to increase the grinding efficiency, the life of the grindstone is shortened due to grinding burn and the surface quality of the work surface deteriorates. Cause problems.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上記従来の
問題点に鑑みてなされたもので、高精度な研削加工が可
能であるとともに、研削能率が高く、砥石寿命が長く、
且つ表面性状のよい被加工面が得られる超砥粒砥石を得
ることを目的とする。DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and is capable of high-precision grinding, has high grinding efficiency, and has a long grindstone life.
Moreover, it is an object to obtain a superabrasive grindstone capable of obtaining a processed surface having a good surface property.
【０００８】[0008]
【課題を解決するための手段】そのため、本発明に関わ
る超砥粒砥石の調整方法は、超砥粒にツルーイングを施
し先端の高さのばらつきを矯正した後、砥石表面に導電
性膜を形成し、次いで砥石表面とそれに対向配置した電
極の間で放電を起こし超砥粒表面に微細な凹凸を形成す
ることを特徴とする。この方法は、台金に超砥粒が電着
された電着超砥粒砥石に対しても、またメタルを結合材
としたメタルボンド超砥粒砥石に対しても等しく適用す
ることができる。さらに、上記本発明方法をメタルボン
ド超砥粒砥石に対し適用する際の具体的態様として、砥
石表面に導電性膜を形成する前に砥石表面をドレッシン
グすることが挙げられる。Therefore, in the method for adjusting a superabrasive grindstone according to the present invention, the superabrasive grains are trued to correct variations in the height of the tip, and then a conductive film is formed on the surface of the grindstone. Then, electric discharge is caused between the surface of the grindstone and the electrodes arranged to face the surface of the grindstone to form fine irregularities on the surface of the superabrasive grains. This method can be applied equally to an electrodeposition superabrasive grindstone in which superabrasive particles are electrodeposited on a base metal, and to a metal bond superabrasive grindstone using a metal as a binder. Further, as a specific mode of applying the method of the present invention to a metal-bonded superabrasive grindstone, dressing the surface of the grindstone before forming a conductive film on the surface of the grindstone can be mentioned.
【０００９】[0009]
【００１０】[0010]
【作用】本発明では、ツルーイング後の砥石表面に導電
性膜を形成して各砥粒を導電性とし、対向配置した放電
電極との間で微小放電を起こし、これにより平にカット
された超砥粒の先端表面に微細な凹凸を形成する。そし
て、本発明の超砥粒砥石においては、超砥粒先端に形成
された微細な凹凸が被切削物に対する切刃として作用す
るので、切れ味が向上し、研削能率が改善され、また研
削能率を上げても被削材の表面性状が悪化しない。さら
に切れ味がよいので研削焼けが起こりにくく、砥石寿命
が延びる。なお、超砥粒に形成される凹凸は微細なもの
とし、研削の加工精度を悪化させるようなことがないよ
うにする。In the present invention, a conductive film is formed on the surface of the grindstone after truing to make each abrasive grain conductive, and a minute discharge is generated between the discharge electrodes arranged facing each other. Fine irregularities are formed on the tip surface of the abrasive grains. And, in the superabrasive grain grindstone of the present invention, since the fine irregularities formed at the superabrasive grain tip act as a cutting edge for the object to be cut, the sharpness is improved, the grinding efficiency is improved, and the grinding efficiency is also improved. Even if raised, the surface quality of the work material does not deteriorate. Furthermore, since it is sharp, grinding burn is less likely to occur and the life of the grindstone is extended. The irregularities formed on the superabrasive grains are made fine so that the grinding processing accuracy is not deteriorated.
【００１１】[0011]
【実施例】以下、図１〜図１０に示す実施例を参照し
て、本発明の構成及び作用をより具体的に説明する。ま
ず、図１（ａ）〜（ｄ）は、電着超砥粒砥石にツルーイ
ング加工を施し、次いで超砥粒表面に微細な凹凸を形成
するときの工程説明図である。ツルーイング前の電着超
砥粒砥石７の表面には、図１（ａ）に示すように超砥粒
２がメッキ層９により台金８に固着され、超砥粒２の先
端の高さにはかなりのばらつきがある。この超砥粒２に
対し例えば図１４に示す方法により仮想線位置までツル
ーイングを施すと、図１（ｂ）に示すように超砥粒２の
先端が平に研削され、先端のばらつきが矯正される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration and operation of the present invention will be described more specifically below with reference to the embodiments shown in FIGS. First, FIGS. 1A to 1D are process explanatory diagrams when a truing process is performed on an electrodeposited superabrasive grain grindstone and then fine irregularities are formed on the superabrasive grain surface. On the surface of the electrodeposited superabrasive grain grindstone 7 before truing, the superabrasive grains 2 are fixed to the base metal 8 by the plating layer 9 as shown in FIG. Varies considerably. When this superabrasive grain 2 is trued to the position of the imaginary line by the method shown in FIG. 14, the tip of the superabrasive grain 2 is ground flat as shown in FIG. It
【００１２】続いて、図１（ｃ）に示すように砥石表面
に薄い導電膜（例えば金蒸着膜）１１を形成する。導電
膜１１は導電性のない超砥粒２に導電性を付与するため
のものであり、図示しない電極を超砥粒砥石７表面にご
く近接させて電圧を印加すると、超砥粒２の先端はメッ
キ層９から突出しているので電極との距離が小さく、電
極と超砥粒２との間に放電が起こるが、電極とメッキ層
９との間には放電は起こらない。この放電現象により、
超砥粒２の先端面に微細な凹凸１２が刻設される（図１
（ｄ））。Subsequently, as shown in FIG. 1C, a thin conductive film (for example, a gold vapor deposition film) 11 is formed on the surface of the grindstone. The conductive film 11 is for imparting conductivity to the superabrasive grain 2 having no conductivity, and when an electrode (not shown) is brought close to the surface of the superabrasive grain grindstone 7 and a voltage is applied, the tip of the superabrasive grain 2 is applied. Has a small distance from the electrode because it protrudes from the plating layer 9, and discharge occurs between the electrode and the superabrasive grain 2, but no discharge occurs between the electrode and the plating layer 9. Due to this discharge phenomenon,
Fine irregularities 12 are engraved on the tip surface of the superabrasive grain 2 (see FIG. 1).
(D)).
【００１３】図２は、φ３００×幅１０ｍｍの電着超砥
粒砥石にツルーイングを施したときの超砥粒の写真であ
り、図３は、この超砥粒砥石に導電性膜を形成した後２
０００ｒｐｍで回転し、電極を表面に近接させて電圧５
０Ｖ、電流１Ａの条件で放電させたとき得られた超砥粒
の写真である。このように、放電による処理をする前は
超砥粒の先端は平で凹凸が見られないが、放電処理後は
多数の微細な凹凸が形成されている。FIG. 2 is a photograph of the superabrasive grains when truing was applied to an electrodeposited superabrasive grain wheel with a diameter of 300 mm and a width of 10 mm, and FIG. 3 was obtained after forming a conductive film on the superabrasive grain wheel. Two
Rotate at 000 rpm to bring the electrode close to the surface and apply a voltage of 5
3 is a photograph of superabrasive grains obtained when discharged under conditions of 0 V and 1 A of current. As described above, the tip of the superabrasive grain is flat and no unevenness is observed before the treatment by electric discharge, but many fine irregularities are formed after the electric discharge treatment.
【００１４】図４（ａ）〜（ｅ）は、メタルボンド超砥
粒砥石にツルーイング加工を施し、次いで超砥粒表面に
微細な凹凸を形成するときの工程説明図である。ツルー
イング前のメタルボンド超砥粒砥石１の表面には、図４
（ａ）に示すように超砥粒２とメタル３がかなりの凹凸
をなして分布しており、ここに例えば図１１に示す方法
を使用し仮想線位置までツルーイングを施すと、図４
（ｂ）に示すように表面のメタル３が平に除去されると
ともに、超砥粒２の先端が平に研削され高さのばらつき
が矯正される。FIGS. 4 (a) to 4 (e) are process explanatory views when the metal bond superabrasive grain grindstone is subjected to truing, and then fine irregularities are formed on the superabrasive grain surface. The surface of the metal bond superabrasive grindstone 1 before truing is shown in FIG.
As shown in (a), the super-abrasive grains 2 and the metal 3 are distributed with considerable irregularities, and when the method shown in FIG.
As shown in (b), the metal 3 on the surface is removed flat, and the tips of the superabrasive grains 2 are ground flat to correct height variations.
【００１５】続いて、例えば図１２又は図１３で説明し
た方法を使用し、図４（ｃ）に示すように表面をドレッ
シング（メタルを除去して砥粒を露出させること）し、
さらに、図４（ｄ）に示すように砥石表面に薄い導電膜
１１を形成する。次に、図示しない電極を超砥粒砥石１
表面にごく近接させて電圧を印加すると、超砥粒２の先
端はメタル３から突出しているので電極との距離が小さ
く、電極と超砥粒２との間に放電が起こるが、電極とメ
タル３との間には放電は起こらない。この放電現象によ
り、超砥粒２の先端面に微細な凹凸１２が刻設される
（図４（ｅ））。Then, using the method described in FIG. 12 or 13, for example, the surface is dressed (the metal is removed to expose the abrasive grains) as shown in FIG. 4 (c),
Further, as shown in FIG. 4D, a thin conductive film 11 is formed on the surface of the grindstone. Next, the electrode (not shown) is attached to the superabrasive grindstone 1
When a voltage is applied in close proximity to the surface, the tip of the superabrasive grain 2 protrudes from the metal 3, so the distance between the electrode and the electrode is small, and discharge occurs between the electrode and the superabrasive grain 2. No discharge occurs between 3 and. Due to this discharge phenomenon, fine irregularities 12 are formed on the tip surface of the superabrasive grain 2 (FIG. 4 (e)).
【００１６】ところで、上記メタルボンド超砥粒砥石に
関する実施例では、ツルーイング加工と放電処理の間に
独立したドレッシング工程を設けていたが、放電処理の
条件を適当に選び、超砥粒の先端に微細な凹凸を形成す
ると同時にドレッシングを施すことが可能である。図５
（ａ）〜（ｄ）は、これを説明するもので、まず先の実
施例と同様、当初のメタルボンド超砥粒砥石１に対し仮
想線位置までツルーイングを施し、表面のメタル３を除
去するるとともに、超砥粒２の先端を平に研削し高さの
ばらつきを矯正する（図５（ａ）、（ｂ））。In the embodiment relating to the metal-bonded superabrasive grindstone, an independent dressing process was provided between the truing process and the electric discharge process. It is possible to form fine irregularities and simultaneously perform dressing. Figure 5
(A) to (d) are for explaining this. First, as in the previous embodiment, the original metal bond superabrasive grindstone 1 is subjected to truing up to the virtual line position to remove the metal 3 on the surface. At the same time, the tips of the superabrasive grains 2 are ground flat to correct height variations (FIGS. 5A and 5B).
【００１７】次に、このメタルボンド超砥粒砥石１の表
面に導電膜１１を形成し（図５（ｃ））、先の実施例と
同様に図示しない電極を超砥粒砥石１表面にごく近接さ
せて電圧を印加すると、電極と超砥粒２との間及び電極
とメタル３との間に放電が起こり、超砥粒２の先端面に
微細な凹凸１２が刻設されるとともにメタル３も除去さ
れ、図５（ｄ）に示すように、メタル３表面から超砥粒
２の先端が突出したメタルボンド超砥粒砥石１が得られ
る。なお、φ３００×幅１０ｍｍ、粒度＃４０／５０、
集中度１００のメタルボンド超砥粒砥石を使用し、砥石
表面に導電性ペーストを塗布して試験したところ、電圧
５０Ｖ、電流３Ａの放電条件で、超砥粒の先端に微細な
凹凸を形成すると同時にドレッシングを施すことが可能
であった。Next, a conductive film 11 is formed on the surface of the metal-bonded superabrasive grindstone 1 (FIG. 5C), and an electrode (not shown) is formed on the surface of the superabrasive grindstone 1 as in the previous embodiment. When a voltage is applied in close proximity, a discharge is generated between the electrode and the superabrasive grain 2 and between the electrode and the metal 3 to form fine irregularities 12 on the tip surface of the superabrasive grain 2 and the metal 3 5D is also removed, and as shown in FIG. 5D, the metal-bonded superabrasive grain grindstone 1 in which the tips of the superabrasive grains 2 protrude from the surface of the metal 3 is obtained. In addition, φ300 × width 10 mm, grain size # 40/50,
Using a metal-bonded superabrasive grindstone with a concentration of 100 and applying a conductive paste to the surface of the grindstone for testing, it was found that fine irregularities were formed at the tip of the superabrasive under a discharge condition of voltage 50V and current 3A. It was possible to dress at the same time.
【００１８】図６は、ツルーイングと放電処理の双方を
行うことのできる放電処理兼用ツルア１５を示し、円周
面上にダイヤモンド砥粒１６が電着されたホイール１７
の側面の円周等分箇所に複数の放電電極１８が取り付け
られ、ボルト１９及び長穴２０により突出量を調整可能
とされている。この放電処理兼用ツルア１５であればツ
ルーイングと放電処理のための別々の工具を必要とせ
ず、例えば超砥粒砥石の切れ味が悪くなったとき、ユー
ザー側で本発明方法を実施する際に使用するのに便利で
ある。FIG. 6 shows a truer 15 for electric discharge treatment which can perform both truing and electric discharge treatment, and a wheel 17 having diamond abrasive grains 16 electrodeposited on its circumferential surface.
A plurality of discharge electrodes 18 are attached to the side surface of the side surface at equally divided positions, and the amount of protrusion can be adjusted by bolts 19 and elongated holes 20. This truer 15 for both electric discharge treatment does not require separate tools for truing and electric discharge treatment, and is used when the method of the present invention is carried out on the user side when the sharpness of the superabrasive grindstone becomes poor, for example. It is convenient for
【００１９】図７及び図８に、ツルーイングのみ施した
超砥粒砥石（従来例）と、さらに放電処理により超砥粒
先端に微細な凹凸を形成した超砥粒砥石（実施例）の研
削性能について試験した結果が示されている。なお、こ
こで使用した超砥粒砥石７は、図９に示すように、＃８
０のＣＢＮ砥粒２を台金８上に厚さ１００μｍのＮｉメ
ッキ層９で電着した電着超砥粒砥石（φ１６０×幅５０
ｍｍ）とし、ツルーイングは台金８からの高さ２００μ
ｍのライン（仮想線で示す）まで施した。被削材として
１００×５０×２０ｍｍの直方体をなすＳＣＭ４２０Ｈ
（ＨＲＣ６０−６２）材を使用し、研削条件を、超砥粒
砥石の周速Ｖ＝３０ｍ／ｓｅｃ（Ｎ＝３５８０ｒｐ
ｍ）、送り速度ｆ＝０．１、０．５、１．０、２．０、
３．０ｍｍ／ｒｅｖ、取り代ｄ＝５０、１００μｍに設
定して、図１０に示すように、被削材の表面を研削し
た。FIGS. 7 and 8 show the grinding performance of a superabrasive grain grindstone (conventional example) only subjected to truing, and a superabrasive grain grindstone (example) in which fine irregularities are formed on the tips of the superabrasive grains by electric discharge treatment. The result of having tested about is shown. The superabrasive grindstone 7 used here is # 8 as shown in FIG.
No. 0 CBN abrasive grain 2 is electrodeposited on a base metal 8 with a Ni plating layer 9 having a thickness of 100 μm (φ160 × width 50)
mm), and the truing is a height of 200 μ from the base metal 8.
It was applied to the m line (shown by a virtual line). SCM420H forming a rectangular parallelepiped of 100 × 50 × 20mm as a work material
(HRC60-62) material is used and the grinding conditions are as follows: circumferential speed of superabrasive grindstone V = 30 m / sec (N = 3580 rp)
m), feed rate f = 0.1, 0.5, 1.0, 2.0,
The surface of the work material was ground as shown in FIG. 10 by setting 3.0 mm / rev, stock removal d = 50, and 100 μm.
【００２０】図７は取り代ｄを５０μｍに設定して研削
した後の被削材表面の面粗さと送り速度ｆの関係を示す
グラフであり、図８は取り代ｄを１００μｍに設定した
ときのグラフである。送り速度がごく小さいとき、得ら
れる面粗さは実施例と従来例で大差ないが、送り速度が
大きくなると従来例では面粗さが急速に悪化し、さらに
送り速度を上げると研削焼けが発生し研削をストップせ
ざるを得なくなるのに対し、実施例では送り速度を上げ
ても面粗さが余り悪化せず、高い加工能率で研削を継続
することができる。FIG. 7 is a graph showing the relationship between the surface roughness of the workpiece surface and the feed rate f after grinding with the machining allowance d set to 50 μm, and FIG. 8 shows the relationship when the machining allowance d is set to 100 μm. Is a graph of. When the feed rate is very low, the obtained surface roughness is not much different between the example and the conventional example, but when the feed rate becomes large, the surface roughness deteriorates rapidly in the conventional example, and when the feed rate is further increased, grinding burn occurs. However, in the embodiment, the surface roughness does not deteriorate much even if the feed rate is increased, and the grinding can be continued with high processing efficiency.
【００２１】[0021]
【発明の効果】本発明によれば、超砥粒先端に形成され
た微細な凹凸が被削材に対する切刃として作用するの
で、超砥粒砥石の切れ味が向上し、研削能率が改善さ
れ、また研削能率を上げても被削材の表面性状が悪化し
ない。さらに研削焼けが起こりにくいので砥石寿命を延
ばすことができる。According to the present invention, since the fine irregularities formed on the tip of the superabrasive grains act as a cutting edge for the work material, the sharpness of the superabrasive grain grindstone is improved, and the grinding efficiency is improved. Even if the grinding efficiency is increased, the surface quality of the work material does not deteriorate. Furthermore, since grinding burn does not easily occur, the life of the grindstone can be extended.
【図１】本発明の方法を電着超砥粒砥石に適用するとき
の工程説明図である。FIG. 1 is a process explanatory diagram when a method of the present invention is applied to an electrodeposited superabrasive grindstone.
【図２】ツルーイング後の超砥粒の表面構造を示す図
（粒子構造写真）である。FIG. 2 is a view (grain structure photograph) showing a surface structure of superabrasive grains after truing.
【図３】微細な凹凸が形成された超砥粒の表面構造を示
す図（粒子構造写真）である。FIG. 3 is a diagram (grain structure photograph) showing a surface structure of superabrasive grains on which fine irregularities are formed.
【図４】本発明の方法をメタルボンド超砥粒砥石に適用
するときの工程説明図である。FIG. 4 is a process explanatory view when the method of the present invention is applied to a metal bond superabrasive grindstone.
【図５】本発明の方法をメタルボンド超砥粒砥石に適用
するときの別の工程説明図である。FIG. 5 is another process explanatory diagram when the method of the present invention is applied to a metal bond superabrasive grindstone.
【図６】放電兼用ツルアの正面図（ａ）及び側面図
（ｂ）である。FIG. 6 is a front view (a) and a side view (b) of the discharging dual tool.
【図７】本発明の実施例と従来例の電着超砥粒砥石の研
削性能を比較したグラフである。FIG. 7 is a graph comparing the grinding performances of the electrodeposited superabrasive grindstone of the example of the present invention and the conventional example.
【図８】本発明の実施例と従来例の電着超砥粒砥石の研
削性能を比較したグラフである。FIG. 8 is a graph comparing the grinding performances of the electrodeposited superabrasive grindstone of the example of the present invention and the conventional example.
【図９】研削性能の試験に供した電着超砥粒砥石の電着
部分を説明するための図である。FIG. 9 is a view for explaining an electrodeposited portion of an electrodeposited superabrasive grindstone used for a grinding performance test.
【図１０】研削性能の試験方法を示す説明図である。FIG. 10 is an explanatory diagram showing a test method of grinding performance.
【図１１】メタルボンド超砥粒砥石に対する従来のツル
ーイング方法の説明図である。FIG. 11 is an explanatory diagram of a conventional truing method for a metal bond superabrasive grindstone.
【図１２】メタルボンド超砥粒砥石に対する従来のツル
ーイング方法の説明図である。FIG. 12 is an explanatory diagram of a conventional truing method for a metal bond superabrasive grindstone.
【図１３】メタルボンド超砥粒砥石に対する従来のツル
ーイング方法の説明図である。FIG. 13 is an explanatory diagram of a conventional truing method for a metal bond superabrasive grindstone.
【図１４】電着超砥粒砥石に対する従来のツルーイング
方法の説明図である。FIG. 14 is an explanatory diagram of a conventional truing method for an electrodeposited superabrasive grindstone.
１ メタルボンド超砥粒砥石 ２ 超砥粒 ３ メタル ４ ダイヤモンドロータリーツルア ５ ＧＣ砥石 ６ 放電電極 ７ 電着超砥粒砥石 ８ 砥石の台金 ９ メッキ層 １１ 導電性膜 １２ 砥粒先端の微細な凹凸 1 Metal bond superabrasive stone 2 Super abrasive grain 3 metal 4 Diamond Rotary Truer 5 GC whetstone 6 discharge electrodes 7 Electroplated superabrasive grindstone 8 Wheel base metal 9 plating layer 11 Conductive film 12 Fine irregularities at the tip of the abrasive grain
Claims (3)
し先端の高さのばらつきを矯正した後、砥石表面に導電
性膜を形成し、次いで砥石表面とそれに対向配置した電
極の間で放電を起こし超砥粒表面に微細な凹凸を形成す
ることを特徴とする超砥粒砥石の調整方法。A superabrasive grain of a superabrasive grindstone is subjected to truing to correct variations in the height of the tip, a conductive film is formed on the surface of the grindstone, and then between the surface of the grindstone and electrodes arranged opposite thereto. A method of adjusting a superabrasive grain grindstone, which comprises causing a discharge to form fine irregularities on the surface of the superabrasive grain.
電着超砥粒砥石であることを特徴とする請求項１に記載
された超砥粒砥石の調整方法。2. The method for adjusting a superabrasive grain grindstone according to claim 1, wherein the superabrasive grain grindstone is an electrodeposited superabrasive grain grindstone in which superabrasive grains are electrodeposited on a base metal.
ルボンド超砥粒砥石であり、砥石表面に導電性膜を形成
する前に砥石表面をドレッシングすることを特徴とする
請求項１に記載された超砥粒砥石の調整方法。3. The super-abrasive grain grindstone is a metal-bonded super-abrasive grain grindstone using a metal as a binder, and the grindstone surface is dressed before the conductive film is formed on the grindstone surface. The described method of adjusting a superabrasive grindstone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26788893A JP3479848B2 (en) | 1993-09-29 | 1993-09-29 | Adjustment method of super abrasive wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26788893A JP3479848B2 (en) | 1993-09-29 | 1993-09-29 | Adjustment method of super abrasive wheel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0796461A JPH0796461A (en) | 1995-04-11 |
| JP3479848B2 true JP3479848B2 (en) | 2003-12-15 |
Family
ID=17451023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26788893A Expired - Lifetime JP3479848B2 (en) | 1993-09-29 | 1993-09-29 | Adjustment method of super abrasive wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3479848B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0870578A4 (en) * | 1996-09-30 | 2002-03-13 | Osaka Diamond Ind | Superabrasive tool and method of its manufacture |
| JP4988271B2 (en) * | 2006-08-16 | 2012-08-01 | 株式会社日進製作所 | Honing whetstone |
| GB2528638A (en) * | 2014-06-18 | 2016-02-03 | Element Six Technologies Ltd | Post-synthesis processing of diamond and related super-hard materials |
-
1993
- 1993-09-29 JP JP26788893A patent/JP3479848B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0796461A (en) | 1995-04-11 |
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