JP3470587B2 - Spool storage method, spool used therein, and spool case - Google Patents
Spool storage method, spool used therein, and spool caseInfo
- Publication number
- JP3470587B2 JP3470587B2 JP08066598A JP8066598A JP3470587B2 JP 3470587 B2 JP3470587 B2 JP 3470587B2 JP 08066598 A JP08066598 A JP 08066598A JP 8066598 A JP8066598 A JP 8066598A JP 3470587 B2 JP3470587 B2 JP 3470587B2
- Authority
- JP
- Japan
- Prior art keywords
- spool
- case
- container body
- storage method
- bulge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体あるいは超
伝導素子用ボンディングワイヤー用のスプールの収納方
法、および、これに用いるスプールとスプールケースに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for accommodating a spool for a bonding wire for a semiconductor or a superconducting element, and a spool and a spool case used for the method.
【０００２】[0002]
【従来の技術】従来からボンディングワイヤー用スプー
ルを収納する容器として、筒状スプールを嵌合せしめる
上向き膨出状の嵌合隆を一体に備えた合成樹脂製の容器
本体と、その容器本体の外縁周壁隆に嵌合する蓋体から
なるスプールケースが知られている（例えば、実開昭５
４−１０３７４７号等）。このスプールケースでは容器
本体における嵌合隆を緩円錐台状に形成することで、ス
プールを嵌合隆と堅固に密着させ固定している。2. Description of the Related Art Conventionally, as a container for accommodating a spool for a bonding wire, a synthetic resin container body integrally provided with an upwardly bulging fitting ridge into which a cylindrical spool is fitted, and an outer edge of the container body. A spool case composed of a lid that fits around a peripheral wall is known (for example, in Japanese Utility Model Publication 5).
4-103747, etc.). In this spool case, the fitting ridge in the container body is formed in the shape of a loose truncated cone, so that the spool is firmly attached and fixed to the fitting ridge.
【０００３】しかしながら製造上の理由によりスプール
はその内径がばらつくことがある。上記構造によれば、
スプール径が大きすぎればスプール内周面との嵌合が不
十分で、スプールはスプールケースに固定されない。However, the inner diameter of the spool may vary due to manufacturing reasons. According to the above structure,
If the spool diameter is too large, the fitting with the inner peripheral surface of the spool is insufficient and the spool is not fixed to the spool case.
【０００４】また、スプール径が小さすぎればスプール
内周面と嵌合隆が広範囲に密着し、スプールを取り出す
時に抜き難い。そればかりか、強い力で引き抜こうとす
れば、スプール外周面に巻かれているボンディングワイ
ヤーを容器本体の外縁周壁隆に誤って接触させたり、フ
ランジを指の腹で支えて掴むので指先が巻かれているボ
ンディングワイヤー近傍に位置してしまい、誤って指先
で触れてしまうことがあり、これらが原因でボンディン
グワイヤーが損傷する等の不具合が生じていた。If the spool diameter is too small, the inner peripheral surface of the spool and the fitting ridge will come into close contact with each other over a wide range, and it will be difficult to remove the spool when taking it out. In addition, if you try to pull it out with a strong force, the bonding wire wound on the outer peripheral surface of the spool may be accidentally brought into contact with the outer peripheral wall of the container body, or the flange may be supported by your finger pad and grasped, so your fingertips will be rolled up. The bonding wire may be located in the vicinity of the bonding wire, and may be accidentally touched with a fingertip, which causes problems such as damage to the bonding wire.
【０００５】[0005]
【発明が解決しようとする課題】そこで本発明は、スプ
ールを堅固に固定するとともに、スプールの着脱作業が
容易でかつ振動等による巻き位置のずれを防止でき、し
かも指先でボンディングワイヤーに触れるおそれのない
ボンディングワイヤー用スプールケースを提供すること
を目的とする。SUMMARY OF THE INVENTION Therefore, according to the present invention, the spool can be firmly fixed, the spool can be easily attached and detached, and the winding position can be prevented from being displaced due to vibration or the like. The purpose is to provide a spool case for no bonding wire.
【０００６】[0006]
【課題を解決するための手段】上記目的を解決するため
の本発明のスプールの収納方法は、筒状スプールの内壁
に雌ねじを、スプールケース容器本体の円筒形膨出隆に
雄ねじを形成し、該スプールを該膨出隆にねじ込むこと
でスプールをスプールケースに固定することを特徴とす
る。In order to solve the above-mentioned problems, a spool storing method according to the present invention comprises forming an internal thread on an inner wall of a cylindrical spool and an external thread on a cylindrical bulge of a spool case container body. The spool is fixed to the spool case by screwing the spool into the bulge.
【０００７】[0007]
【発明の実施の形態】本発明において、筒状スプールの
内壁に雌ねじを、スプールケース容器本体の円筒形膨出
隆に雄ねじを形成すれば、スプールを膨出隆にねじ込む
ことでスプールをスプールケースに固定できる。スプー
ルの内壁の雌ねじの谷の径は、製造上のばらつきで想定
される最小のスプール内径よりも小さくすれば、確実に
スプールが装着できる。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, if a female thread is formed on the inner wall of a tubular spool and a male thread is formed on a cylindrical bulge of a spool case container body, the spool is screwed into the bulge to make the spool case of the spool case. Can be fixed to. If the diameter of the root of the female thread on the inner wall of the spool is smaller than the minimum spool inner diameter that is assumed due to manufacturing variations, the spool can be mounted securely.
【０００８】本発明のスプールケースの蓋は、容器本体
と嵌合させた状態でスプールに巻かれたボンディングワ
イヤーと接触しなければその形状を特に限定するもので
はない。なお、蓋の脱着時に蓋とボンディングワイヤー
が触れないように、突起等は極力排し、蓋をした状態で
容器本体との間に広い空間を有する形状が望ましい。The shape of the lid of the spool case of the present invention is not particularly limited as long as it does not come into contact with the bonding wire wound on the spool in a state of being fitted with the container body. It is desirable that the protrusions are removed as much as possible so that the lid and the bonding wire do not come into contact with each other when the lid is attached and detached, and a wide space is provided between the lid and the container body.
【０００９】容器本体や蓋は、例えば合成樹脂をその材
料に選べる。For the container body and the lid, for example, synthetic resin can be selected as the material.
【００１０】[0010]
【実施例】以下に本発明の実施例を図面を参照して説明
する。図１は本発明のスプール１が本発明のスプールケ
ースの容器本体２にねじ込まれた状態を示す図であり、
スプール１の内壁には雌ねじが、スプールケース容器本
体２の膨出隆３には雄ねじが、それぞれかみ合うように
形成されている。ねじを介してスプール１は容器本体２
に堅固に固定されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a state in which a spool 1 of the present invention is screwed into a container body 2 of a spool case of the present invention,
A female screw is formed on the inner wall of the spool 1, and a male screw is formed on the bulge 3 of the spool case container body 2 so as to engage with each other. The spool 1 is a container body 2 through a screw.
It is firmly fixed to.
【００１１】[0011]
【発明の効果】以上の通り、本発明のスプール収納方法
はねじでスプールを容器本体に固定するので、確実かつ
堅固に固定でき、着脱も容易である。As described above, according to the spool storing method of the present invention, since the spool is fixed to the container body with the screw, the spool can be securely and firmly fixed and can be easily attached and detached.
【図１】本発明のスプールをスプールケースにねじ込ん
だ状態の断面図である。FIG. 1 is a cross-sectional view of a spool of the present invention screwed into a spool case.
１ スプール ２ スプールケースの容器本体 ３ 容器本体の膨出隆 1 spool 2 Spool case container body 3 Swelling ridge of container body
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 301 B65D 85/00 - 85/28 B65D 85/575 B65H 75/00 - 75/32 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 21/60 301 B65D 85/00-85/28 B65D 85/575 B65H 75/00-75/32
Claims (3)
ルケース容器本体の円筒形膨出隆に雄ねじを形成し、該
スプールを該膨出隆にねじ込むことでスプールをスプー
ルケースに固定することを特徴とするスプールの収納方
法。1. An internal thread is formed on an inner wall of a tubular spool, and a male thread is formed on a cylindrical bulge of a spool case container body, and the spool is fixed to the spool case by screwing the spool into the bulge. Characteristic spool storage method.
のスプールの収納方法に用いるスプール。2. The spool used in the spool storing method according to claim 1, wherein an internal thread is formed on the inner wall.
した請求項１に記載のスプールの収納方法に用いるスプ
ールケース。3. A spool case used in the spool storing method according to claim 1, wherein a male screw is formed on the cylindrical bulge of the container body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08066598A JP3470587B2 (en) | 1998-03-27 | 1998-03-27 | Spool storage method, spool used therein, and spool case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08066598A JP3470587B2 (en) | 1998-03-27 | 1998-03-27 | Spool storage method, spool used therein, and spool case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11284012A JPH11284012A (en) | 1999-10-15 |
| JP3470587B2 true JP3470587B2 (en) | 2003-11-25 |
Family
ID=13724672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08066598A Expired - Fee Related JP3470587B2 (en) | 1998-03-27 | 1998-03-27 | Spool storage method, spool used therein, and spool case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3470587B2 (en) |
-
1998
- 1998-03-27 JP JP08066598A patent/JP3470587B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11284012A (en) | 1999-10-15 |
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