JP3461073B2 - Bare chip sealing method - Google Patents

Bare chip sealing method

Info

Publication number
JP3461073B2
JP3461073B2 JP32029795A JP32029795A JP3461073B2 JP 3461073 B2 JP3461073 B2 JP 3461073B2 JP 32029795 A JP32029795 A JP 32029795A JP 32029795 A JP32029795 A JP 32029795A JP 3461073 B2 JP3461073 B2 JP 3461073B2
Authority
JP
Japan
Prior art keywords
resin
bare chip
printing
embankment
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP32029795A
Other languages
Japanese (ja)
Other versions
JPH09162208A (en
Inventor
裕之 山川
俊夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP32029795A priority Critical patent/JP3461073B2/en
Publication of JPH09162208A publication Critical patent/JPH09162208A/en
Application granted granted Critical
Publication of JP3461073B2 publication Critical patent/JP3461073B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To precisely control the region on a substrate covered with bare chip covering resin, and to provide a highly integrated substrate where the range of sealing resin is precisely limited. SOLUTION: The semiconductor bare chip 3 bonded on the surface 51 of a substrate 5 is covered with resin 6. At this time, a bank printing process, with which a double bank, consisting of at least an inner bank 1 and an outer bank 2 protruding from the surface 51, is formed by printing on the circumference of the surface part 50 of the substrate 5 where the bare chip 3 is connected, and a process, in which fluid resin 6 is fed to the region at least surrounded by the inner bank, the resin is cured in the state that the bare chip is covered with the resin and the bare chip 3 is covered with the cured resin, are conducted. The double banks 1 and 2 are formed by printing in a precise manner, and as the flow out of the resin 6 can be effectively prevented, it is suitable for high density mounting. The covering range of the resin can be visually confirmed easily.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、少なくとも一つの
半導体ベアチップを、樹脂のポッティングにより基板上
に封止する半導体実装技術の技術分野に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of semiconductor mounting technology for sealing at least one semiconductor bare chip on a substrate by resin potting.

【０００２】[0002]

【従来の技術】半導体ベアチップを樹脂のポッティング
により基板上に封止する技術には、以前から堤防状の囲
いをベアチップの周囲に設けて同堤防に囲われた領域を
樹脂で封止するベアチップ封止方法があった。例えば、
特開平３−１９４９４１号公報（前者）や特開平３−２
５７９３７号公報（後者）に、この種のベアチップ封止
方法が開示されている。2. Description of the Related Art A technique for sealing a semiconductor bare chip on a substrate by potting a resin is a bare chip sealing method in which a dike-shaped enclosure has been provided around the bare chip and a region surrounded by the dike is sealed with a resin. There was a stopping method. For example,
JP-A-3-194941 (former) and JP-A-3-2
Japanese Patent No. 57937 (the latter) discloses this type of bare chip sealing method.

【０００３】前者には、ソルダーレジストインキを自動
ディスペンサーでベアチップ周囲の基板表面にリング上
に塗布して堤防を形成し、しかるのちに、ベアチップの
上から熱硬化性樹脂をディスペンサーなどで注いで封止
する方法が記載されている。また、熱硬化性樹脂の硬化
後には、ソルダーレジストインキで形成された堤防を剥
離除去する旨も記載されている。In the former case, solder resist ink is applied on the ring around the surface of the substrate around the bare chip with an automatic dispenser to form a bank, and then a thermosetting resin is poured from above the bare chip by a dispenser or the like and sealed. How to stop is described. It is also described that after the thermosetting resin is cured, the bank formed with the solder resist ink is peeled off.

【０００４】一方、後者には、ベアチップの周囲の基板
表面に高粘度封止剤で堤防（ダム）を形成し、しかるの
ちに、低粘度樹脂をベアチップに注いで封止する技術が
記載されている。後者では、堤防は低粘度樹脂の硬化後
も除去されることなく、そのまま基板上に残る。これら
の封止方法によれば、型等を使用することなく極めて安
価に樹脂によるベアチップ封止ができるばかりではな
く、高密度に集積された基板上で封止樹脂の高さを低く
形成することができるという利点がある。On the other hand, the latter describes a technique of forming a levee (dam) with a high-viscosity sealant on the substrate surface around the bare chip, and then pouring a low-viscosity resin into the bare chip for sealing. There is. In the latter case, the bank is not removed even after the low-viscosity resin is cured and remains on the substrate as it is. According to these encapsulation methods, not only the bare chip encapsulation with a resin can be performed at a very low cost without using a mold, but also the height of the encapsulation resin can be formed low on a highly integrated substrate. The advantage is that

【０００５】[0005]

【発明が解決しようとする課題】前述の従来技術では、
上記利点はあるものの、堤防をディスペンサー等から押
し出した樹脂を基板表面に塗布することによって形成し
ているので、必ずしも所望の位置に所望の高さの堤防が
形成されるとは限らなかった。かといって、印刷により
一重の堤防を形成する方法では、位置や寸法の精度面で
は見劣りがないものの、堤防の高さが不足して堤防に囲
まれた領域から低粘度の封止樹脂が溢れだすのを阻止す
る能力が十分ではない。それゆえ、従来の印刷による堤
防では、周辺の回路素子を流出した樹脂で汚して不具合
を招く可能性があり、高集積化された基板への適用は難
しかった。In the above-mentioned prior art,
Although there are the above advantages, since the dike is formed by applying resin extruded from a dispenser or the like to the surface of the substrate, the dike of a desired height is not always formed at a desired position. However, although the method of forming a single dike by printing is not inferior in terms of position and dimension accuracy, the height of the dike is insufficient and low-viscosity sealing resin overflows from the area surrounded by the dike. There is not enough ability to prevent it. Therefore, in the conventional embankment by printing, there is a possibility that the peripheral circuit elements may be contaminated with the resin that has flowed out, resulting in a problem, and it is difficult to apply the embankment to a highly integrated substrate.

【０００６】そこで、本発明は、ベアチップを封止する
樹脂（封止樹脂）に覆われる基板上の領域を精密に制御
し、封止樹脂の範囲が精密に限定されていて高集積化基
板への適用に好適なベアチップ封止方法を提供すること
を解決すべき課題とする。Therefore, according to the present invention, the area on the substrate covered with the resin (sealing resin) for sealing the bare chip is precisely controlled, and the range of the sealing resin is precisely limited to a highly integrated substrate. It is an object to be solved to provide a bare chip sealing method suitable for application of the above.

【０００７】[0007]

【課題を解決するための手段およびその作用・効果】上
記課題を解決するために、発明者らは以下の手段を発明
した。本発明の第１手段は、請求項１記載のベアチップ
封止方法である。本手段では、まず堤防印刷工程で、印
刷により全周一様に所定の間隔を開けて設けられた、樹
脂が不足していることを判定する内堤防と樹脂の流出を
阻止するとともに樹脂が過剰であることを判定する内堤
防より高い外堤防とからなる二重堤防が、複数回の印刷
により基板表面のベアチップ接合部の周囲に形成され
る。二重堤防の基板表面上での寸法精度は、印刷によっ
て形成されているので極めて精密である。Means for Solving the Problems and Their Actions / Effects In order to solve the above problems, the inventors have invented the following means. A first means of the present invention is the bare chip sealing method according to claim 1. In this means, first, in the embankment printing process , the trees are provided at regular intervals all over the circumference by printing.
The inner levee and resin outflow to determine lack of oil
Inner bank to prevent and determine excess resin
Double levee consisting of outer levee higher than levee , printing multiple times
It is formed around the bare joint of the substrate surface by. The dimensional accuracy of the double embankment on the substrate surface is extremely precise because it is formed by printing.

【０００８】次に樹脂封止工程で樹脂を注入する際に、
少なくとも内堤防の内側の領域の全てを樹脂で覆うよう
に樹脂の注入量と注入位置が調整される。その結果、内
堤防の内側に位置するベアチップとそのボンディング部
分とは、樹脂により完全に覆われ、固化した樹脂により
封止される。また、内堤防を越えて溢れた樹脂は、その
外側に形成されている外堤防によって外堤防の外への流
出を阻止され、外堤防の外の領域にある回路を汚すこと
がない。Next, when injecting resin in the resin sealing step,
The resin injection amount and injection position are adjusted so that at least the entire area inside the inner bank is covered with the resin. As a result, the bare chip located inside the inner bank and its bonding portion are completely covered with the resin and sealed with the solidified resin. Further, the resin overflowing beyond the inner leve is prevented from flowing out of the outer leve by the outer leve formed on the outer side, and does not contaminate the circuit in the region outside the outer leve.

【０００９】本手段で製造されたベアチップが樹脂で封
止されている基板（封止基板）については、封止樹脂が
覆っている範囲が、内堤防に達していなければ封止樹脂
が不足、外堤防を越えていれば封止樹脂が過剰として、
目視判断が容易にできる。したがって、本手段によれ
ば、封止樹脂に覆われる基板上の領域を二重堤防により
精密に制御し、封止樹脂の範囲を内堤防と外堤防との間
に精密に限定することができる。その結果、容易で安価
な方法でありながら、封止樹脂の範囲を正確に限定する
ことができ、高集積化基板への適用に好適なベアチップ
封止方法を提供することができるという効果がある。Regarding the substrate (sealing substrate) in which the bare chip manufactured by this means is sealed with resin, if the area covered by the sealing resin does not reach the inner bank, the sealing resin is insufficient. If it exceeds the outer bank, the sealing resin is excessive,
Easy visual judgment. Therefore, according to the present means, the area on the substrate covered with the sealing resin can be precisely controlled by the double bank, and the range of the sealing resin can be precisely limited between the inner bank and the outer bank. . As a result, there is an effect that the range of the sealing resin can be accurately limited and a bare chip sealing method suitable for application to a highly integrated substrate can be provided although it is an easy and inexpensive method. .

【００１０】[0010]

【００１１】[0011]

【００１２】本発明の第２手段は、請求項２記載のベア
チップ封止方法である。本手段では、内堤防および外堤
防の第１層が共通であるので、内堤防と外堤防との間に
間隔を設ける必要が必ずしも無く、両者をより近接して
形成することができる。それゆえ、二重堤防の幅（奥行
き）を短縮することができ、外堤防に囲まれている領域
を縮小できるので、基板表面で封止されたベアチップが
占める面積を縮小することが可能である。A second means of the present invention is a bare chip encapsulation method of claim 2 wherein. In this means, since the first layer of the inner and outer levees is common, it is not always necessary to provide a space between the inner and outer levees, and both can be formed closer to each other. Therefore, the width (depth) of the double embankment can be shortened, and the area surrounded by the outer embankment can be reduced, so that the area occupied by the bare chip sealed on the substrate surface can be reduced. .

【００１３】したがって、本手段によれば、基板表面上
のベアチップ封止面積を縮小することにより、より高密
度な実装を可能とすることができるという効果がある。
本発明の第３手段は、請求項３記載のベアチップ封止方
法である。本手段では、硬化前の（流動性を残した）樹
脂の頂部に整形治具を当てることにより、整形治具の当
接面に対応する形状の頂面を封止樹脂に形成することが
できる。例えば、封止樹脂の頂面を平面に形成しておけ
ば、その後の真空チャックによる取扱い・スタンプによ
る印字・超音波探傷などに好都合である。Therefore, according to the present means, there is an effect that the bare chip sealing area on the surface of the substrate can be reduced to enable higher density mounting.
A third means of the present invention is the bare chip sealing method according to the third aspect . In the present means, by applying the shaping jig to the top portion of the resin before curing (remaining fluidity), the top surface of the shape corresponding to the contact surface of the shaping jig can be formed on the sealing resin. . For example, if the top surface of the sealing resin is formed to be a flat surface, it is convenient for subsequent handling with a vacuum chuck, printing with a stamp, ultrasonic flaw detection, and the like.

【００１４】したがって、本手段によれば、その後の工
程で利便を生じるように、封止樹脂の頂面を所定の形状
に形成することができるという効果がある。本発明の第
４手段は、請求項４記載のベアチップ封止方法である。
本手段では、内堤防の内周縁が、ワイヤの外端部から少
なくとも１．２ｍｍの距離をとって内堤防が形成されて
いる。この距離では、劣悪な使用環境下でも封止樹脂の
外縁部から剥離が起こらず、仮に起こってもワイヤの外
端部まで剥離が進行することがないことを、発明者らが
実験により確認している。Therefore, according to the present means, there is an effect that the top surface of the sealing resin can be formed into a predetermined shape so as to provide convenience in the subsequent steps. The present invention
The fourth means is the bare chip sealing method according to the fourth aspect .
With this means, the inner levee is formed such that the inner peripheral edge of the inner levee is at least 1.2 mm from the outer end of the wire. At this distance, the inventors confirmed by experiments that peeling does not occur from the outer edge portion of the sealing resin even under a bad use environment, and even if it occurs, peeling does not proceed to the outer end portion of the wire. ing.

【００１５】したがって、本手段によれば、その製品が
劣悪な環境下で長時間使用されても、封止樹脂の外縁部
からの剥離不具合は起きないだけの耐環境性が保証され
るという効果がある。本発明の第５手段は、請求項５記
載のベアチップ封止方法である。もちろん、ベアチップ
の基板に対する接合は、硝子粉末の焼成による二重堤防
形成後である。Therefore, according to this means, even if the product is used in a bad environment for a long time, the environment resistance is ensured so that the peeling defect of the sealing resin from the outer edge portion does not occur. There is. A fifth means of the present invention is the bare chip sealing method according to the fifth aspect . Of course, the bare chip is bonded to the substrate after the double bank is formed by firing the glass powder.

【００１６】本手段では、通常のガラエポ（エポキシ樹
脂含浸ガラスクロス）製の基板ではなく、優れた各種特
性をもつセラミック基板の表面に強固な二重堤防を形成
することが目的である。硝子ペーストを印刷材料（イン
ク）として印刷すれば、硝子粉末による二重堤防がで
き、さらに焼成すれば強固な二重堤防をセラミック基板
の表面に形成することができる。樹脂によるベアチップ
の封止については、第１手段を同様の作用効果がある。The purpose of this means is to form a strong double bank on the surface of a ceramic substrate having various excellent characteristics, not on a usual glass epoxy (epoxy resin impregnated glass cloth) substrate. If glass paste is printed as a printing material (ink), a double dike with glass powder can be formed, and by firing, a strong double dike can be formed on the surface of the ceramic substrate. Regarding the sealing of the bare chip with the resin, the first means has the same function and effect.

【００１７】したがって、本手段によれば、セラミック
基板の表面に強固な二重堤防を形成して樹脂によるベア
チップ封止ができるという効果がある。本発明の第６手
段は、請求項６記載のベアチップ封止方法である。本手
段では、内堤防と外堤防とが互いに異なる色をしてい
る。したがって、本手段によれば、封止樹脂の範囲の目
視点検がいっそう容易になるという効果がある。Therefore, according to this means, there is an effect that a strong double bank is formed on the surface of the ceramic substrate and the bare chip can be sealed with the resin. A sixth means of the present invention is the bare chip sealing method according to the sixth aspect . In this means, the inner dike and the outer dike have different colors. Therefore, according to this means, there is an effect that the visual inspection of the range of the sealing resin becomes easier.

【００１８】[0018]

〔参考例１〕[ Reference Example 1]

（参考例１のベアチップ封止方法） 本発明の参考例１としてのベアチップ封止方法は、図１
（ａ）〜（ｄ）に示すように、ベアチップ接合工程を挟
んで、二重堤防１，２を形成する堤防印刷工程と、封止
樹脂６をベアチップ３上に注いでベアチップ３を封止す
る樹脂封止工程とからなる。ここで、堤防印刷工程は、
基板５を作成する工程の最後に含まれ、基板５にベアチ
ップ３を接合するベアチップ接合工程に先立って行われ
る。Bare chip sealing method as Reference Example 1 of the present invention (bear chip sealing method of Reference Example 1) Figure 1
As shown in (a) to (d), a levee printing step of forming double levees 1 and 2 with a bare chip joining step interposed, and a sealing resin 6 is poured onto the bare chip 3 to seal the bare chip 3. And a resin sealing step. Here, the embankment printing process is
It is included at the end of the step of forming the substrate 5, and is performed prior to the bare chip joining step of joining the bare chip 3 to the substrate 5.

【００１９】本参考例のベアチップ封止方法に供される
基板５は、図１（ａ）に示すように、ガラエポ製の基板
５の表面５１に導体（プリント配線５２）と不導体（ソ
ルダーレジスト５３）との層がそれぞれ形成されてい
る。通常、ソルダーレジスト５３の層の形成は、印刷に
よっている。まず、堤防印刷工程では、図１（ｂ）に示
すように、ダムシルク印刷により、ベアチップ３が接合
される基板５の表面部分５０の周囲に、表面５１から突
出した二重堤防１，２が一度に形成される。二重堤防
１，２は、表面部分５０の回りを取り囲んで切れ目なく
形成されている内堤防１と、内堤防１から所定の距離を
おいてその外側を切れ目なく取り囲んで形成されている
外堤防２とからなる。堤防１，２を形成するインクに相
当する印刷材料は、エポキシ樹脂を主体とするある程度
の流動性のある熱硬化性樹脂である。したがって、同樹
脂は所定時間後には十分に硬化しており、強固な二重堤
防１，２が基板５の表面５１上に形成される。As shown in FIG. 1A, the substrate 5 used in the bare chip sealing method of this reference example has a conductor (printed wiring 52) and a non-conductor (solder resist) on the surface 51 of the glass epoxy substrate 5. 53) and the layers 53) are respectively formed. Usually, the layer of the solder resist 53 is formed by printing. First, in the embankment printing step, as shown in FIG. 1B, the double embankments 1 and 2 protruding from the surface 51 are once formed around the surface portion 50 of the substrate 5 to which the bare chip 3 is bonded by dam silk printing. Is formed. The double embankments 1 and 2 are an inner embankment 1 that surrounds the surface portion 50 and is formed seamlessly, and an outer embankment that is formed at a predetermined distance from the inner embankment 1 and surrounds the outside thereof without interruption. It consists of 2. A printing material corresponding to the ink forming the banks 1 and 2 is a thermosetting resin mainly containing an epoxy resin and having a certain degree of fluidity. Therefore, the resin is sufficiently hardened after a predetermined time, and strong double banks 1 and 2 are formed on the surface 51 of the substrate 5.

【００２０】堤防印刷工程終了後、図１（ｃ）に示すよ
うに、ベアチップ接合工程が行われる。すなわち、ベア
チップ３が所定の表面部分５０に接合（ダイボンド）さ
れ、さらにワイヤボンドが行われて、ベアチップ３とプ
リント配線５２との間に多数のボンディング・ワイヤ４
が接続される。次に、樹脂封止工程では、図１（ｄ）に
示すように、流動性のある封止樹脂（チップコート樹
脂）６が、内堤防１に囲まれた領域中にディスペンサー
（図示せず）で注入される。封止樹脂６は、ベアチップ
３およびワイヤ４を覆って注入され、その状態で硬化し
ていく。その際、封止樹脂６の外周縁部は、全周囲で内
堤防１にかかっており、一部は外堤防２にも達している
が、外堤防２を越えて周囲に溢れだしている部分はな
い。これで硬化が完了すれば、ベアチップ３は封止樹脂
６により基板５上に封止され、ベアチップ封止は完了す
る。After the embankment printing process is completed, a bare chip bonding process is performed as shown in FIG. That is, the bare chip 3 is bonded (die-bonded) to a predetermined surface portion 50, and wire bonding is further performed, so that a large number of bonding wires 4 are provided between the bare chip 3 and the printed wiring 52.
Are connected. Next, in the resin sealing step, as shown in FIG. 1D, a fluid sealing resin (chip coat resin) 6 is dispensed in a region surrounded by the inner bank 1 (not shown). Injected. The sealing resin 6 is injected so as to cover the bare chip 3 and the wire 4, and is cured in that state. At that time, the outer peripheral edge of the sealing resin 6 covers the inner levee 1 around the entire circumference, and part of the outer levee 2 reaches the outer levee 2, but overflows around the outer levee 2. There is no. When the curing is completed by this, the bare chip 3 is sealed on the substrate 5 by the sealing resin 6, and the bare chip sealing is completed.

【００２１】以上の工程を、平面図を参照して説明する
と、次のようになる。まず、堤防印刷工程が完了した段
階では、図２（ａ）に示すように、ベアチップ３が接合
されるべき表面部分５０を取り巻いて、全周囲に略矩形
の二重堤防１，２が形成されている。内堤防１と外堤防
２との間には、全周一様に所定の間隔が開けられてい
る。The above steps will be described below with reference to the plan view. First, when the embankment printing step is completed, as shown in FIG. 2A, the surface portion 50 to which the bare chip 3 is to be bonded is surrounded, and substantially rectangular double embankments 1 and 2 are formed all around. ing. A predetermined interval is provided uniformly around the entire circumference between the inner bank 1 and the outer bank 2.

【００２２】すでに二重堤防１，２が基板表面５１に形
成されている状態で、図２（ｂ）に示すように、ベアチ
ップ３が基板５の表面の二重堤防１，２の中央（表面部
分５０）に接合され、ワイヤボンディングされる。次
に、樹脂封止工程では、図２（ｃ）に示すように、上記
中央部分に注入された封止樹脂６が、ベアチップ３およ
びワイヤ４およびその周囲の領域を覆っており、内堤防
１の内側の全ての領域を覆っている。封止樹脂６のうち
一部は、内堤防１を越えているが、外堤防２に達しては
おらず、ましてや外堤防２を越えてその外側への流出し
てはいない。With the double banks 1, 2 already formed on the substrate surface 51, as shown in FIG. 2B, the bare chip 3 is formed on the surface of the substrate 5 at the center of the double banks 1, 2. Part 50) and then wire bonded. Next, in the resin encapsulation step, as shown in FIG. 2C, the encapsulation resin 6 injected into the central portion covers the bare chip 3 and the wires 4 and the surrounding region, and the inner levee 1 Covers all areas inside. A part of the sealing resin 6 exceeds the inner bank 1, but does not reach the outer bank 2, let alone flow over the outer bank 2 to the outside.

【００２３】したがって、印刷により形成されているの
で寸法精度や位置精度がともに正確な二重堤防１，２に
より、封止樹脂６は所定の範囲（外堤防２）内に収まっ
ているので、周囲の回路が封止樹脂６の流出で汚される
ことがない。その結果、高集積化に対応して封止樹脂の
しめる面積が小さい実装基板５を、本参考例のベアチッ
プ封止方法により安価で容易に製造することができると
いう効果がある。Therefore, the encapsulating resin 6 is contained within a predetermined range (outer embankment 2) due to the double embankments 1 and 2 which are formed by printing and have accurate dimensional accuracy and positional accuracy. The circuit will not be contaminated by the outflow of the sealing resin 6. As a result, there is an effect that the mounting substrate 5 having a small area covered by the sealing resin can be easily manufactured at low cost by the bare chip sealing method of the present reference example in accordance with high integration.

【００２４】また、内堤防１は、図３に示すように、ボ
ンディング・ワイヤ４の外端部から間隙ｇ＝１．２ｍｍ
を開けて、内堤防１の内縁部がくる位置に形成されてい
る。この距離（１．２ｍｍ）は、封止樹脂６の剥離不具
合が起きない範囲で最も短い距離であり、不具合なしに
封止樹脂６が占める平面投影面積を最小にするものであ
る。したがって、基板の実装の高密度化にいっそう資す
るところがある。As shown in FIG. 3, the inner bank 1 has a gap g = 1.2 mm from the outer end of the bonding wire 4.
It is formed at the position where the inner edge of the inner levee 1 comes to open. This distance (1.2 mm) is the shortest distance within the range where the peeling defect of the sealing resin 6 does not occur, and minimizes the plane projection area occupied by the sealing resin 6 without any defect. Therefore, there is a point that further contributes to high density mounting of the board.

【００２５】発明者らは実験により、ボンディング・ワ
イヤ４の外端部から１．２ｍｍ以上にわたり、封止樹脂
６が基板表面５１に接着していれば、剥離不具合はほと
んど皆無であることを確認している。実験は、６５°
Ｃ、９５％ＲＨの条件下で１０００時間にわたって行っ
た。なお、二重堤防１，２は、全周囲にわたって一様な
断面形状をしている。すなわち、図４に示すように、内
堤防１および外堤防２は、ともに高さ約３０μｍ、幅約
２００μｍの帯状をしており、両者の間隔は約２００ｍ
ｍであって両者の間に堀状の流出阻止帯１２を形成して
いる。The inventors have confirmed through experiments that if the sealing resin 6 adheres to the substrate surface 51 over 1.2 mm or more from the outer end of the bonding wire 4, there is almost no peeling defect. is doing. The experiment is 65 °
C, 95% RH for 1000 hours. The double banks 1, 2 have a uniform cross-sectional shape over the entire circumference. That is, as shown in FIG. 4, the inner levee 1 and the outer levee 2 are both strips having a height of about 30 μm and a width of about 200 μm, and the distance between them is about 200 m.
m, and a moat-shaped outflow prevention zone 12 is formed between them.

【００２６】二重堤防１，２を用いて、封止樹脂６の覆
う範囲の可否を判定することも、容易にできる。例え
ば、封止樹脂６の表面がＣ１に達せず内堤防１に及んで
いない場合には封止樹脂６不足と判定し、封止樹脂６の
表面がＣ２に収まらず外堤防２を越えている場合には封
止樹脂６過剰と判定し、その間に収まっていれば良好と
する目視判定法も可能である。It is also possible to easily determine whether or not the range covered by the sealing resin 6 can be determined by using the double banks 1, 2. For example, when the surface of the sealing resin 6 does not reach C1 and does not reach the inner bank 1, it is determined that the sealing resin 6 is insufficient, and the surface of the sealing resin 6 does not fit in C2 and exceeds the outer bank 2. In this case, it is possible to use a visual judgment method in which it is judged that the sealing resin 6 is excessive, and if it is within the range, it is judged as good.

【００２７】（参考例１の作用効果） 以上詳述したように、本参考例のベアチップ封止方法に
よれば、次のような効果が得られる。まず、封止樹脂６
の範囲の可否が、目視により（あるいは画像認識手段に
より）一目瞭然に確認できるという効果がある。すなわ
ち、本参考例の製品である封止基板については、封止樹
脂６が覆っている範囲が、内堤防１に達していなければ
封止樹脂６が不足、外堤防２を越えていれば封止樹脂２
が過剰として、目視判断が容易にできる。その結果、製
品検査が容易になり、生産コストの低減にもつながる。(Effects of Reference Example 1) As described in detail above, according to the bare chip sealing method of this reference example, the following effects can be obtained. First, the sealing resin 6
Whether or not the range is valid can be visually confirmed (or by an image recognition means) at a glance. That is, in the case of the sealing substrate which is the product of this reference example, if the range covered by the sealing resin 6 does not reach the inner bank 1, the sealing resin 6 is insufficient, and if the area exceeds the outer bank 2, the sealing resin 6 is sealed. Stop resin 2
Is excessive, visual judgment can be easily performed. As a result, product inspection is facilitated and production costs are reduced.

【００２８】次に、印刷により二重堤防１，２を形成す
るので、二重堤防１，２は位置精度も寸法精度も高い。
また、内堤防１と外堤防２との間に所定の間隔（お掘
り）が形成されているので、内堤防１を溢れ出た封止樹
脂６は強い阻止力をもって外堤防２でせき止められ、容
易に溢れ出ることがない。それゆえ、本参考例によれ
ば、封止樹脂に覆われる基板上の領域を二重堤防により
精密に制御し、封止樹脂の範囲を内堤防と外堤防との間
に精密に限定することができる。その結果、容易で安価
な方法でありながら、封止樹脂の範囲を正確に限定する
ことができ、高集積化基板への適用に好適なベアチップ
封止方法を提供することができるという効果がある。Next, since the double banks 1, 2 are formed by printing, the double banks 1, 2 have high positional accuracy and dimensional accuracy.
Further, since a predetermined space (digging) is formed between the inner levees 1 and the outer levees 2, the sealing resin 6 overflowing the inner levees 1 is dammed with a strong blocking force by the outer levees 2, It does not easily overflow. Therefore, according to this reference example, the area on the substrate covered with the sealing resin is precisely controlled by the double dike, and the range of the sealing resin is precisely limited between the inner dike and the outer dike. You can As a result, there is an effect that the range of the sealing resin can be accurately limited and a bare chip sealing method suitable for application to a highly integrated substrate can be provided although it is an easy and inexpensive method. .

【００２９】さらに、本参考例では、内堤防１の内周縁
が、ワイヤ４の外端部から少なくとも１．２ｍｍの距離
をとって内堤防１が形成されており、劣悪な環境下でも
剥離不具合が起こりにくい範囲で、封止樹脂６の面積を
最小に止め得るので、耐環境性と高密度実装との要求を
同時に満たすことができるという効果がある。 （参考例１の変形態様１） 前述の参考例１では、二重堤防１，２の平面形はベアチ
ップ３から適正な距離をとって設定されていたが、その
外に種々の設定の平面形がありうる。Further, in this reference example, the inner levee 1 is formed such that the inner peripheral edge of the inner levee 1 is at least 1.2 mm from the outer end portion of the wire 4, and peeling failure occurs even in a bad environment. Since the area of the encapsulating resin 6 can be minimized in a range in which the occurrence of the problem does not occur easily, there is an effect that the requirements for environment resistance and high-density mounting can be satisfied at the same time. (Variant 1 of Reference Example 1) In the foregoing Reference Example 1, although planar dual embankment 1 and 2 has been set by taking the proper distance from the bare chip 3, planar various settings on the outer There can be

【００３０】例えば、図５に示すように、ワイヤ４の外
端部との距離を所定（１．２ｍｍ）にとって、ベアチッ
プ３の各辺の長さに相当する四辺と、同四辺の隣合う各
辺を９０°分の円弧でつなぐ平面形状の二重堤防１，２
の設定が可能である。あるいは、その他にも、八角形状
や円状、楕円状など、設計上の都合によってある程度二
重堤防の平面形を改変することが可能である。For example, as shown in FIG. 5, when the distance from the outer end of the wire 4 is set to a predetermined value (1.2 mm), four sides corresponding to the length of each side of the bare chip 3 and adjacent four sides of the same side. Plane-shaped double dikes 1,2 that connect sides with 90 ° arcs
Can be set. Alternatively, the plane shape of the double embankment can be modified to some extent, such as an octagonal shape, a circular shape, and an elliptical shape, depending on the design.

【００３１】（実施例１） 堤防印刷工程において二度刷りをすることにより、図６
に示すように、外堤防２’を二段重ねで形成し、内堤防
１よりも高くすることも可能である。この場合、初回の
印刷で内堤防１と外堤防２の第１段２１とを形成し、そ
の樹脂が十分に硬化するのを待って、２回目の印刷で外
堤防２の第２段２２を形成する。(Embodiment 1) By performing printing twice in the embankment printing process, as shown in FIG.
It is also possible to form the outer levees 2'in two steps and to make them higher than the inner levees 1, as shown in FIG. In this case, the inner bank 1 and the first step 21 of the outer bank 2 are formed by the first printing, and after the resin is sufficiently cured, the second step 22 of the outer bank 2 is formed by the second printing. Form.

【００３２】本構成の二重堤防１，２’によれば、流出
阻止帯１２に加えて、外堤防２’の阻止能力が向上する
ので、封止樹脂６はいっそう流出しにくくなり、歩留り
が向上するという効果がある。 （実施例１の変形態様１） 堤防印刷工程において二度刷りをすることにより、図７
に示すように、流出阻止帯１２のない二重堤防１’，
２”を形成することもできる。この場合、初回の印刷で
二重堤防１’，２”の全幅（約４００μｍ）にわたる堤
防１０を形成し、第２回の印刷で堤防１０の外半部に重
畳して外堤防２”の第２段２１を形成する。堤防１０の
内半部で内堤防１’が形成され、堤防１０の外半部と第
２段２１とで外堤防２”が形成される。According to the double levees 1 and 2'of this construction, the blocking ability of the outer levees 2'in addition to the outflow blocking zone 12 is improved, so that the sealing resin 6 becomes more difficult to flow out and the yield is improved. It has the effect of improving. By twice printing in embankments printing process (variant 1 of Example 1), FIG. 7
As shown in Figure 2, the double levees 1'without the outflow prevention zone 12
It is also possible to form 2 ". In this case, the first printing forms the embankment 10 over the entire width of the double embankment 1 ', 2" (about 400 μm), and the second printing forms the outer half of the embankment 10. Overlapping forms the second step 21 of the outer leve 2 ". The inner leve 1'is formed in the inner half of the leve 10, and the outer leve 2" is formed of the outer half of the leve 10 and the second step 21. To be done.

【００３３】また、堤防１０と外堤防２の第２段２１と
は、顔料の混入により印刷材料の樹脂の色を変えてあ
る。それゆえ、封止樹脂６の覆う領域の良否の目視確認
が容易であるという効果がある。 （実施例１の変形態様２） 前述の変形態様１にさらに重畳して、図８に示すよう
に、三度刷りにより外堤防２”’が三段重ねの二重堤防
１’，２”’を形成することも可能である。Further, the bank 10 and the second step 21 of the outer bank 2 have different colors of the resin of the printing material due to the mixing of the pigment. Therefore, there is an effect that it is easy to visually check the quality of the area covered by the sealing resin 6. (Modification 2 of Example 1) As shown in FIG. 8, further overlapping with Modification 1 described above, the double embankment 1 ', 2 "' in which the outer embankment 2"'is three-tiered by triple printing. Can also be formed.

【００３４】本構成の二重堤防１’，２”’によれば、
外堤防２”’がいっそう高くなり、その阻止能力が向上
するので、封止樹脂６はさらに流出しにくくなり、歩留
りがなお向上するという効果がある。 （参考例２） 前述の参考例１の樹脂封止工程において、封止樹脂６の
注入後に、下面７１が平面である整形治具７を基板表面
５１から所定距離に保って、封止樹脂６の頂部に当接さ
せたまま封止樹脂６を硬化させるベアチップ封止方法も
可能である。According to the double embankment 1 ', 2 "' of this construction,
Since the outer levee 2 "'is further raised and its blocking ability is improved, the sealing resin 6 is more difficult to flow out, and the yield is further improved. ( Reference Example 2 ) The above-mentioned Reference Example 1 In the resin encapsulation step, after the encapsulation resin 6 is injected, the shaping jig 7 whose lower surface 71 is a flat surface is kept at a predetermined distance from the substrate surface 51, and is kept in contact with the top of the encapsulation resin 6. A bare chip sealing method of hardening 6 is also possible.

【００３５】以上のようにして硬化した封止樹脂６は、
頂面６１が平面に形成されている。それゆえ、本変形態
様のベアチップ封止方法で製造された製品は、頂面６１
への印字、頂面６１を真空チャックで保持する工程の自
動化、頂面６１からの超音波探傷が良好に行えるという
効果がある。 （実施例１のその他の変形態様） 実施例１およびその変形態様１、２に関しては、材料・
条件等を適当に変えた変形態様が無数に存在しうる。例
えば、封止樹脂６に、シリコーン樹脂、シリコーンゴム
などの代替品の使用が可能で、基板や二重堤防を形成し
ている材質との濡れ性や接着性などの各種特性を勘案の
上、選定すればよい。また、基板５の材料や、印刷材料
を変更した変形態様も可能である。The sealing resin 6 cured as described above is
The top surface 61 is formed into a flat surface. Therefore, the product manufactured by the bare chip sealing method of the present modified embodiment has the top surface 61
There is an effect that printing on the surface, automation of a process of holding the top surface 61 with a vacuum chuck, and ultrasonic flaw detection from the top surface 61 can be favorably performed. (Other Modifications of Example 1) Regarding Example 1 and its modifications 1 and 2 , materials and
There can be innumerable variations in which conditions and the like are appropriately changed. For example, it is possible to use a substitute such as silicone resin or silicone rubber for the sealing resin 6, and in consideration of various characteristics such as wettability and adhesiveness with the material forming the substrate and double bank, You can select it. Further, a modified mode in which the material of the substrate 5 or the printing material is changed is also possible.

【００３６】さらに、印刷方法を変えた変形態様も可能
で、例えばインクジェットで二重堤防１，２を形成する
ことも可能である。その場合、内堤防１および外堤防２
の高さは実施例１に及ばないかもしれないが、その囲む
範囲を少し広げるだけで適用可能で、封止樹脂６の外縁
の範囲の良否判定機能は落ちないものと考えられる。 〔参考例３〕 （参考例３のベアチップ封止方法） 本発明の参考例３としてのベアチップ封止方法は、セラ
ミックス製の基板５Ｃの表面５１に、硝子ペーストを焼
成して二重堤防１Ｇ，２Ｇを形成し、その内側に封止樹
脂６を注入してベアチップ封止を行う方法である。Further, a modified mode in which the printing method is changed is possible, and for example, the double bank 1, 2 can be formed by ink jet. In that case, inner dike 1 and outer dike 2
Although the height may not reach that of the first embodiment, it can be applied only by slightly expanding the surrounding range, and it is considered that the quality determination function of the range of the outer edge of the sealing resin 6 does not deteriorate. Bare chip sealing method as Reference Example 3] Reference Example 3 of the present invention (bear chip sealing method of Reference Example 3), the surface 51 of the ceramic substrate 5C, dual embankment 1G by firing a glass paste, This is a method of forming 2G and injecting the sealing resin 6 into the inside to perform bare chip sealing.

【００３７】まず、堤防印刷工程では、セラミックス製
の基板の表面に印刷・乾燥・焼成により二重堤防１Ｇ，
２Ｇを形成する。印刷に際し、インクに相当する印刷材
料は、硝子ペーストである。硝子ペーストは、粒径数μ
ｍ程度のホウ珪酸鉛亜鉛硝子の粉粒と、有機バインダー
としてのセルロースと、若干の溶剤としてのテレピネオ
ールとを用いている。First, in the embankment printing process, double embankment 1G, by printing, drying and firing on the surface of the ceramic substrate,
2G is formed. At the time of printing, a printing material corresponding to ink is glass paste. Glass paste has a particle size of several μ
About m of lead zinc borosilicate glass particles, cellulose as an organic binder, and terpineol as a small amount of solvent are used.

【００３８】印刷手法は、参考例１と同じくスクリーン
印刷ではあるが、スクリーンにステンレス製の２５０番
メッシュのマスクを使用し、ローラーに代えてスキージ
（へら）で硝子ペーストを刷り込んでいる点が、参考例
１と異なっている。印刷されて基板表面５１に張りつい
ている硝子ペーストは、乾燥ののち、焼成されて、ガラ
ス質の強固な二重堤防１Ｇ，２Ｇを形成する。The printing method is screen printing as in Reference Example 1, except that a 250-mesh stainless steel mask is used for the screen and the glass paste is imprinted with a squeegee instead of rollers. Different from Reference Example 1. The glass paste that has been printed and adhered to the substrate surface 51 is dried and then fired to form the glassy strong double bank 1G, 2G.

【００３９】本参考例の堤防印刷工程で形成される二重
堤防１Ｇ，２Ｇは、参考例１と同様に、全周囲にわたっ
て一様な断面形状をしている。すなわち、図１０に示す
ように、内堤防１Ｇおよび外堤防２Ｇは、ともに高さ約
１５μｍ、幅約１５０μｍの帯状をしており、両者の間
隔は約１５０ｍｍであって両者の間に堀状の流出阻止帯
１２を形成している。内堤防１Ｇおよび外堤防２Ｇの両
側には、幅２０μｍ程度のダレが生じるが、大勢には影
響はなく、むしろ応力集中を防ぐのでより強固に基板５
Ｃに固着する作用を有する。The double embankments 1G and 2G formed in the embankment printing step of the present reference example have a uniform cross-sectional shape over the entire circumference, as in the first reference example. That is, as shown in FIG. 10, the inner levee 1G and the outer levee 2G each have a strip shape with a height of about 15 μm and a width of about 150 μm, and the distance between them is about 150 mm and a moat is formed between them. The outflow prevention zone 12 is formed. A sag having a width of about 20 μm occurs on both sides of the inner levee 1G and the outer levee 2G, but this does not affect the majority and rather stress concentration is prevented, so that the substrate 5 is strengthened.
It has the effect of sticking to C.

【００４０】本参考例の樹脂封止工程は、参考例１の樹
脂封止工程に準ずる。 （参考例３の作用効果） 本参考例のベアチップ封止方法は、参考例１と同様の作
用効果を有するうえに、セラミック基板５Ｃに強固なガ
ラス質の二重堤防１Ｇ，２Ｇを形成することができる。
したがって、本実施例によれば、実施例１同様に簡便で
安価な封止方法をとりながら、セラミック基板５Ｃの種
々の良好な特性を利用することができるという効果があ
る。The resin encapsulation process of this reference example is similar to the resin encapsulation process of reference example 1. (Operation and Effect of Reference Example 3 ) The bare chip sealing method of this reference example has the same operation and effect as that of Reference Example 1 and, in addition, forms a strong vitreous double bank 1G, 2G on the ceramic substrate 5C. You can
Therefore, according to the present embodiment, there is an effect that various good characteristics of the ceramic substrate 5C can be utilized while adopting the simple and inexpensive sealing method as in the first embodiment.

【００４１】（実施例２） 実施例１の各種変形態様に相当する変形態様が、実施例
２についても可能である。例えば、図１１に示すよう
に、実施例１の変形態様１に相当する変形態様が可能で
ある。なお、堤防印刷工程において重ね刷りをする場合
には、焼成を各段について毎回するか、全ての印刷が完
了してから一度に焼成するかの二通りの方法がある。す
なわち、印刷されたペーストが乾燥したのち焼成してか
ら重ね刷りする方法と、印刷されたペーストが乾燥した
ら焼成せずにその上に重ね刷りをし、最後のペーストが
乾燥してからまとめて焼成する方法とがある。後者の方
が、工数が少ない点では利がある。(Embodiment 2) Modifications corresponding to various modifications of Embodiment 1 are also possible for Embodiment 2. For example, as shown in FIG. 11, a modification mode corresponding to the modification mode 1 of the first embodiment is possible. When performing overprinting in the embankment printing step, there are two methods: firing for each stage or firing once after all printing is completed. That is, the printed paste is dried and then fired before overprinting, and when the printed paste is dried, overprinting is performed on it without firing, and the final paste is dried and then fired together. There is a way to do it. The latter is more advantageous in that it requires less man-hours.

【００４２】また、実施例１と同様に、セラミック基板
の表面にエポキシ樹脂による二重堤防の印刷形成を行う
ことも可能である。Further, as in the first embodiment, it is also possible to print and form a double bank with epoxy resin on the surface of the ceramic substrate.

【図面の簡単な説明】[Brief description of drawings]

【図１】 参考例１としてのベアチップ封止方法の各工
程を示す組図 （ａ）本方法に供する基板の構成を示す側端面図 （ｂ）堤防印刷工程を示す基板の側端面図 （ｃ）ベアチップ接合工程を示す基板の側端面図 （ｄ）樹脂封止工程を示す基板の側端面図FIG. 1 is an assembly diagram showing each step of a bare chip sealing method as Reference Example (a) a side end view showing a configuration of a substrate used in the method (b) a side end view of a substrate showing a bank printing step (c) ) Side end view of substrate showing bare chip joining step (d) Side end view of substrate showing resin sealing step

【図２】 参考例１としてのベアチップ封止方法の各工
程を示す組図 （ａ）堤防印刷工程を示す基板の側端面図 （ｂ）ベアチップ接合工程を示す基板の側端面図 （ｃ）樹脂封止工程を示す基板の側端面図FIG. 2 is an assembly diagram showing each step of the bare chip sealing method as Reference Example 1 (a) Side end view of a substrate showing a bank printing step (b) Side end view of a substrate showing a bare chip joining step (c) Resin Side view of substrate showing sealing process

【図３】 ボンディング・ワイヤと内堤防との間隔を示
す部分側断面図FIG. 3 is a partial side sectional view showing a distance between a bonding wire and an inner bank.

【図４】 参考例１の二重堤防の寸法および形状を示す
要部端面図FIG. 4 is an end view of the main part showing the dimensions and shape of the double embankment of Reference Example 1.

【図５】 参考例１の変形態様１の二重堤防の配置を示
す平面図FIG. 5 is a plan view showing the arrangement of the double embankment of Modification 1 of Reference Example 1.

【図６】 実施例１の二重堤防の寸法形状を示す要部端
面図FIG. 6 is an end view of the main part showing the dimensions and shape of the double embankment of the first embodiment.

【図７】 実施例１の変形態様１の二重堤防の寸法形状
を示す要部端面図[7] main part end view showing the geometry of the double embankment variant 1 of Example 1

【図８】 実施例１の変形態様２の二重堤防の寸法形状
を示す要部端面図[8] main part end view showing the geometry of the double embankment variant 2 of Example 1

【図９】 参考例２の整形治具による頂面形成を示す模
式図FIG. 9 is a schematic diagram showing formation of a top surface by a shaping jig of Reference Example 2 .

【図１０】参考例２の二重堤防の寸法および形状を示す
要部端面図FIG. 10 is an end view of the essential portions showing the dimensions and shape of the double embankment of Reference Example 2.

【図１１】実施例２の変形態様の二重堤防の寸法形状を
示す要部端面図FIG. 11 is an end view of the essential portion showing the dimensions and shape of a double embankment according to a modification of Example 2 .

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−21624（ＪＰ，Ａ) 特開 平６−29427（ＪＰ，Ａ) 特開 平７−263489（ＪＰ，Ａ) 特開 平５−226505（ＪＰ，Ａ) 特開 昭62−128534（ＪＰ，Ａ) 実開 平４−116145（ＪＰ，Ｕ) 実開 平６−82876（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/56 H01L 23/28 ─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-6-21624 (JP, A) JP-A-6-29427 (JP, A) JP-A-7-263489 (JP, A) JP-A-5- 226505 (JP, A) JP 62-128534 (JP, A) Actual flat 4-116145 (JP, U) Actual flat 6-82876 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/56 H01L 23/28

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】基板の表面上に接合されている半導体ベア
チップを樹脂で封止する方法であって、 前記ベアチップが接合される該基板の表面部分の周囲
に、前記表面から突出するとともに全周一様に所定の間
隔を開けて設けられた、少なくとも該樹脂が不足してい
ることを判定する内堤防と該樹脂の流出を阻止するとと
もに該樹脂が過剰であることを判定する該内堤防より高
い外堤防とからなる二重堤防を複数回の印刷により形成
する堤防印刷工程と、 少なくとも該内堤防に囲まれた領域に流動性のある樹脂
を注入し、該樹脂が該ベアチップを覆っている状態で硬
化させ、該ベアチップを固化した樹脂により封止する樹
脂封止工程と、を有することを特徴とするベアチップ封
止方法。1. A method of encapsulating a semiconductor bare chip bonded on a surface of a substrate with a resin, the method comprising: projecting from the surface and surrounding the entire surface of the surface of the substrate to which the bare chip is bonded. For a predetermined time
Spaced apart, at least lacking the resin
To prevent the outflow of the resin and the inner levee that determines that
Higher than the inner levee that determines that the resin is excessive
And embankment printing step of forming a dual embankment consisting of a had outer embankment by printing a plurality of times, and injecting a resin having fluidity in a region surrounded by at least the inner embankment, the resin covers the bare chip And a resin sealing step of sealing the bare chip with a solidified resin. 【請求項２】前記堤防印刷工程で、複数回の印刷が行わ
れ、 初回の印刷では、前記内堤防と前記外堤防とは互いに連
続して形成され、 第２回以降の印刷では、少なくとも該外堤防は重畳して
形成される請求項１記載のベアチップ封止方法。2. In the embankment printing step, printing is performed a plurality of times, the inner embankment and the outer embankment are formed continuously in the first printing, and at least in the second and subsequent printing. The bare chip encapsulation method according to claim 1, wherein the outer bank is formed so as to overlap. 【請求項３】前記樹脂封止工程で、前記樹脂の注入後
に、少なくとも表面の一部が略平面である整形治具を、
前記基板表面から所定距離に保って前記樹脂の頂部に当
接させる請求項１記載のベアチップ封止方法。3. A shaping jig having a substantially flat surface at least in part after the resin is injected in the resin sealing step,
The bare chip sealing method according to claim 1, wherein the bare chip is kept in contact with the top of the resin while keeping a predetermined distance from the surface of the substrate. 【請求項４】前記ベアチップは、前記基板の配線にボン
ディング・ワイヤにより接続されており、 前記堤防印刷工程で、前記内堤防の内周縁が該ワイヤの
外端部から少なくとも１．２ｍｍの距離をとって、該内
堤防は形成される請求項１記載のベアチップ封止方法。4. The bare chip is connected to a wiring of the substrate by a bonding wire, and in the embankment printing step, an inner peripheral edge of the inner embankment is separated from an outer end portion of the wire by a distance of at least 1.2 mm. The bare chip sealing method according to claim 1, wherein the inner bank is formed. 【請求項５】前記基板は、セラミックス製であり、 前記堤防印刷工程で、前記二重堤防は、硝子粉末を主成
分とする硝子ペーストの印刷および乾燥の後、該硝子粉
末の焼成により形成される請求項１記載のベアチップ封
止方法。5. The substrate is made of ceramics, and in the bank printing step, the double bank is formed by printing and drying a glass paste containing glass powder as a main component, and then firing the glass powder. The bare chip sealing method according to claim 1. 【請求項６】前記内堤防の色調は、前記外堤防の色調と
異なっている請求項１記載のベアチップ封止方法。6. The bare chip sealing method according to claim 1, wherein the color tone of the inner bank is different from the color tone of the outer bank.
JP32029795A 1995-12-08 1995-12-08 Bare chip sealing method Expired - Fee Related JP3461073B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32029795A JP3461073B2 (en) 1995-12-08 1995-12-08 Bare chip sealing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32029795A JP3461073B2 (en) 1995-12-08 1995-12-08 Bare chip sealing method

Publications (2)

Publication Number Publication Date
JPH09162208A JPH09162208A (en) 1997-06-20
JP3461073B2 true JP3461073B2 (en) 2003-10-27

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ID=18119938

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Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP3461073B2 (en)

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* Cited by examiner, † Cited by third party
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JP3560599B2 (en) 2002-04-26 2004-09-02 松下電器産業株式会社 Electronic circuit device
JP4437014B2 (en) 2003-04-25 2010-03-24 パナソニック株式会社 Electronic circuit equipment
JP4535969B2 (en) 2005-08-24 2010-09-01 新光電気工業株式会社 Semiconductor device
JPWO2007083481A1 (en) * 2006-01-19 2009-06-11 ローム株式会社 Semiconductor display device and manufacturing method of semiconductor display device
JP5269990B2 (en) * 2009-06-01 2013-08-21 アルプス電気株式会社 Manufacturing method of humidity detection sensor package
JP5241627B2 (en) * 2009-06-24 2013-07-17 株式会社フジクラ Membrane switch
JP2013149637A (en) * 2012-01-17 2013-08-01 Asahi Glass Co Ltd Light emitting device and manufacturing method of the same
JP6032096B2 (en) * 2013-03-28 2016-11-24 株式会社デンソー Electronic control unit and manufacturing method thereof
JP6111832B2 (en) * 2013-05-06 2017-04-12 株式会社デンソー Multilayer substrate, electronic device using the same, and method for manufacturing electronic device
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