JP3457296B2 - Electronic equipment housing - Google Patents
Electronic equipment housingInfo
- Publication number
- JP3457296B2 JP3457296B2 JP2001268570A JP2001268570A JP3457296B2 JP 3457296 B2 JP3457296 B2 JP 3457296B2 JP 2001268570 A JP2001268570 A JP 2001268570A JP 2001268570 A JP2001268570 A JP 2001268570A JP 3457296 B2 JP3457296 B2 JP 3457296B2
- Authority
- JP
- Japan
- Prior art keywords
- box
- electronic
- housing
- heat
- box body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、発熱性電子部品等
の電子機器が収納される電子機器用筐体に関し、例え
ば、自動車用電子機器等の高密度プリント基板等を収納
する、耐熱性・耐水性・耐振性・量産性等に優れた電子
機器用筐体の構造に関する。以下、前記発熱性電子部品
を発熱部品と、前記電子機器用筐体を筐体と、又、前記
プリント基板を電子基板ともいう。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for electronic equipment in which electronic equipment such as heat-generating electronic parts is housed. For example, a high-density printed circuit board for housing electronic equipment for automobiles, etc. The present invention relates to a structure of a housing for electronic equipment, which has excellent water resistance, vibration resistance, mass productivity, and the like. Hereinafter, the heat-generating electronic component is also referred to as a heat-generating component, the electronic device casing is referred to as a casing, and the printed circuit board is also referred to as an electronic substrate.
【0002】[0002]
【従来の技術】一般に、電子基板を収納する筐体の構造
としては、箱底部と箱胴部とが一体の収納部と箱蓋部と
の2ピ−ス構造が最も単純な構成であり、それらは特開
平8−148842号公報、「電子機器」(従来例1)
や特開平11−346418号公報「車両用電子機器」
(従来例2)等で開示されている。上記従来例2の公報
では、電子基板に取付けられた発熱部品の発生熱をいか
に効果的に放散させるかについては全く論及していない
が、従来例1の公報では、発熱部品を絶縁電子回路部品
として、当該電子部品を板金製カバ−に接触させて電気
的ショ−トの保護と放熱効果の向上とを図る考え方が示
されている。又、上記従来例2の公報では、コネクタハ
ウジングと箱蓋部(カバ−)とが一体化され、電子基板
が当該箱蓋部側に固定された構造が示されている。2. Description of the Related Art Generally, as a structure of a housing for housing an electronic substrate, a two-piece structure including a housing portion in which a box bottom and a box body are integrated and a box lid is the simplest structure. They are disclosed in Japanese Patent Application Laid-Open No. 8-148842, "Electronic Equipment" (Prior Art 1).
And Japanese Patent Laid-Open No. 11-346418 "Vehicle electronic device"
(Prior art example 2) and the like. Although the publication of the conventional example 2 does not discuss how to effectively dissipate the heat generated by the heat-generating components mounted on the electronic substrate, the publication of the conventional example 1 discloses that the heat-generating components are insulated electronic circuits. As a component, a concept is proposed in which the electronic component is brought into contact with a sheet metal cover to protect an electrical short and improve a heat radiation effect. Further, the above-mentioned prior art example 2 discloses a structure in which the connector housing and the box lid (cover) are integrated and the electronic board is fixed to the box lid.
【0003】又、電子基板が固定された中間フレ−ムと
しての箱胴部に、上下方向からカバ−としての箱蓋部と
箱底部とを取付けた3ピ−ス構成の筐体構造としては、
特開平6−318790号公報「ケ−ス」(従来例3)
や、特開平8−181471号公報「電子制御装置」
(従来例4)に示されている。上記従来例3の公報で
は、中間フレ−ム(箱胴部)と上下カバ−(箱蓋部、箱
底部)との間の接着固定材によるシ−ルに関するもので
あるが、発熱部品の熱放散性向上については論及されて
いない。上記従来例4の公報では、電子基板の弾性力を
利用して発熱部品を中間フレ−ム部材に圧着させて効果
的に熱放散させる構造が示されている。Further, as a case structure of a three-piece structure in which a box lid portion as a cover and a box bottom portion are vertically attached to a box body portion as an intermediate frame to which an electronic substrate is fixed, as a cover. ,
Japanese Patent Application Laid-Open No. 6-318790 "Case" (Prior art example 3)
Also, Japanese Patent Application Laid-Open No. 8-181471 "Electronic control device"
(Prior art example 4). In the publication of the above-mentioned conventional example 3, the seal by the adhesive fixing material between the intermediate frame (box body part) and the upper and lower covers (box lid part, box bottom part) is concerned. There is no discussion about improving emission. The prior art example 4 discloses a structure in which the heat generating component is pressed against the intermediate frame member by utilizing the elastic force of the electronic substrate to effectively dissipate the heat.
【0004】他方、特開平8−204072号公報「電
子部品の冷却装置」(従来例5)によれば、両面電子基
板の一方の面に固定された発熱部品の発生熱をスル−ホ
−ルメッキ穴を介して他方の面に伝熱させ、熱伝導性の
弾性絶縁シ−トを介して熱伝導性筐体の一部に固定する
ことが示されている。更に、特開平11−266078
号公報「スル−ホ−ル充填用樹脂組成物及び多層プリン
ト配線板」(従来例6)によれば、電子基板のスル−ホ
−ルメッキ穴に充填材を充填し、該充填材を導体層で被
覆する多層基板の製造方法が記述されている。On the other hand, according to JP-A-8-204072, "Electronic Component Cooling Device" (Conventional Example 5), heat generated by a heat-generating component fixed to one surface of a double-sided electronic substrate is through-hole plated. It is shown that heat is transferred to the other surface through the hole and is fixed to a part of the heat conductive casing through a heat conductive elastic insulating sheet. Furthermore, JP-A-11-266078
According to Japanese Patent Laid-Open Publication "Through-Hole Filling Resin Composition and Multilayer Printed Wiring Board" (Conventional Example 6), a filling material is filled in a through-hole plating hole of an electronic substrate, and the filling material is used as a conductor layer. A method of manufacturing a multilayer substrate coated with is described.
【0005】[0005]
【発明が解決しようとする課題】電子基板の小型・高密
度化に伴って、発熱部品に対する熱放散性の向上が重要
となる一方で、自動車用車載電子機器にあっては、防水
性・耐振性・量産性等の様々の要件を満たす電子機器用
筐体が要求されている。しかし、上記従来例1では、熱
伝導性の悪い絶縁電子回路部品を単に箱蓋部に接触させ
るだけの構造であって、十分な熱伝導が期待できないと
いう問題がある。又、従来例4では、発熱部品の半田付
け部のストレスを低減させることが必要であって、電子
基板の弾性力に依存した圧着力を十分高めることができ
ないという問題がある。With the miniaturization and high density of electronic boards, it is important to improve the heat dissipation of heat-generating components. There is a demand for a housing for electronic devices that meets various requirements such as high productivity and mass productivity. However, in the above-mentioned conventional example 1, there is a problem that the insulated electronic circuit component having poor heat conductivity is simply brought into contact with the box lid, and sufficient heat conduction cannot be expected. Further, in Conventional Example 4, it is necessary to reduce the stress on the soldering portion of the heat-generating component, and there is a problem that the crimping force depending on the elastic force of the electronic substrate cannot be sufficiently increased.
【0006】本発明は、上記のような問題を解消し、熱
放散性・耐振性・量産性・防水性に優れた小型・高密度
電子基板等を収納する電子機器用筐体、特に、環境の厳
しい自動車の車室外にも設置可能な電子機器用筐体の提
供を目的とする。The present invention solves the above-mentioned problems and is a housing for electronic equipment which accommodates small-sized and high-density electronic boards which are excellent in heat dissipation, vibration resistance, mass productivity, and waterproofness, and particularly in the environment. It is an object of the present invention to provide a housing for electronic devices that can be installed outside the cabin of a severe automobile.
【0007】[0007]
【課題を解決するための手段】第1の発明は、箱底部と
箱胴部と箱蓋部とで箱状に組立てられ、電子部品が装着
された電子基板が収納される電子機器用筐体において、
前記電子基板は弾性を有し、当該電子基板が前記箱底部
に固定された状態において、当該電子基板の縁部の少な
くとも一部が前記箱胴部に係止され、前記箱底部と箱胴
部とが組立てられた状態にて当該電子基板の弾性によっ
て互いに圧接する構成としたことを特徴とする。A first aspect of the present invention is a housing for an electronic device, which is assembled in a box shape by a box bottom portion, a box body portion, and a box lid portion, and in which an electronic board on which electronic components are mounted is stored. At
The electronic board has elasticity, and in a state where the electronic board is fixed to the box bottom, at least a part of an edge of the electronic board is locked to the box body, and the box bottom and the box body are provided. It is characterized in that they are pressed against each other by the elasticity of the electronic substrate in the assembled state.
【0008】第2の発明は、第1の発明において、筐体
の深さ方向において、電子基板の箱底部との固定部は当
該電子基板の箱胴部との掛止部より深い位置としたこと
を特徴とする。According to a second aspect of the present invention, in the first aspect, the fixing portion of the electronic board to the box bottom is deeper than the hooking portion of the electronic board to the box body in the depth direction. It is characterized by
【0009】第3の発明は、箱底部と箱胴部と箱蓋部と
で箱状に組立てられ、電子部品が装着された電子基板が
収納される電子機器用筐体において、前記箱胴部の上端
面に前記箱蓋部の縁を受け入れる嵌合溝を設けると共
に、前記箱蓋部の縁に切欠部を設けて、箱蓋部の縁を箱
胴部の溝に嵌合させた状態に組付けた際、前記嵌合溝に
充填された接着剤が前記切欠部を通じて縁の内外に流動
可能としたことを特徴とする。A third aspect of the present invention is an electronic equipment casing in which a box bottom portion, a box body portion, and a box lid portion are assembled in a box shape, and an electronic substrate on which electronic components are mounted is stored. A fitting groove for receiving the edge of the box lid is provided on the upper end surface of the box, and a notch is provided on the edge of the box lid so that the edge of the box lid is fitted in the groove of the box body. When assembled, the adhesive filled in the fitting groove is allowed to flow in and out of the edge through the notch.
【0010】第4の発明は、第1乃至第3の発明の何れ
かにおいて、箱蓋部の縁は、少なくとも、箱胴部の溝に
嵌合される部分が縁先端に向って次第に外方に拡開する
形状であることを特徴とする。According to a fourth aspect of the present invention, in any one of the first to third aspects, at least a portion of the edge of the box lid portion that is fitted into the groove of the box body portion is gradually outward toward the tip of the edge. It is characterized in that it has a shape that expands to.
【0011】第5の発明は、第1乃至第4の発明の何れ
かにおいて、箱胴部の外面に設けられるコネクタハウジ
ングを複数に分けて設けたことを特徴とする。A fifth invention is characterized in that, in any one of the first to fourth inventions, a plurality of connector housings provided on the outer surface of the box body are provided separately.
【0012】第6の発明は、第1乃至第5の発明の何れ
かにおいて、箱底部は熱伝導性部材からなり、略垂直な
側面に電子部品が取付られる熱伝導性を有する取付用突
起を電子基板に設けられた切欠部を通って当該箱底部か
ら起立させたことを特徴とする。According to a sixth aspect of the present invention, in any one of the first to fifth aspects of the invention, the box bottom portion is made of a heat conductive member, and a heat conductive mounting protrusion for mounting an electronic component is mounted on a substantially vertical side surface. It is characterized in that it is erected from the bottom of the box through a notch provided in the electronic board.
【0013】第7の発明は、第1乃至第6の発明の何れ
かにおいて、箱底部は熱伝導性部材からなり、略水平な
平面に電子部品が取付られる熱伝導性を有する取付用突
起を電子基板に設けられた切欠部を通って当該箱底部か
ら起立させたことを特徴とする。According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the box bottom portion is made of a heat conductive member, and has a heat conductive mounting protrusion for mounting an electronic component on a substantially horizontal plane. It is characterized in that it is erected from the bottom of the box through a notch provided in the electronic board.
【0014】第8の発明は、第1乃至第7の発明の何れ
かにおいて、電子基板において、少なくとも、発熱部品
が装着される領域のスルーホールメッキ穴に充填材を詰
めると共に当該充填材が詰められたスルーホールの両端
面側にメッキ層を形成し、前記発熱部品の熱をスルーホ
ールメッキ穴を介して熱伝導性部材からなる箱底部に伝
熱させる構成としたことを特徴とする。According to an eighth invention, in any one of the first to seventh inventions, in the electronic board, at least the through hole plating hole in the region where the heat-generating component is mounted is filled with the filling material, and the filling material is also filled. A plating layer is formed on both end surfaces of the through hole, and heat of the heat generating component is transferred to the bottom of the box made of a heat conductive member through the through hole plating hole.
【0015】[0015]
【発明の実施の形態】実施の形態1.実施の形態1は、
箱底部と箱胴部と箱蓋部との3部材が組立てられて成る
電子機器用筐体であり、この筐体は、弾性を有する電子
基板を内蔵し、当該電子基板が箱底部に固定された状態
において、電子基板の縁部の少なくとも一部が箱胴部の
掛止部に係止され、箱胴部と箱底部とが組立られた状態
にて、電子基板の弾性によって、箱胴部と箱底部とが互
いに圧接する構成としたものである。BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Embodiment 1 is
A housing for electronic equipment, which is formed by assembling three members of a box bottom portion, a box body portion, and a box lid portion. This housing contains an elastic electronic substrate, and the electronic substrate is fixed to the box bottom portion. In this state, at least a part of the edge of the electronic board is locked to the hooking portion of the box body, and the box body and the box bottom are assembled, and the elasticity of the electronic board causes the box body to move. And the bottom of the box are in pressure contact with each other.
【0016】以下、この実施の形態1を図1乃至図8に
基づいて説明する。図1は筐体の平面図、図2は箱蓋部
を外した筐体の平面図、図3は図1のA−A断面図、図
4はコネクタハウジング部分の拡大断面図、図5は壁状
に設けられた取付用突起の断面図、図6は箱底部と電子
基板と箱筒部との組付け状態を示す拡大断面図である。The first embodiment will be described below with reference to FIGS. 1 to 8. 1 is a plan view of a housing, FIG. 2 is a plan view of a housing with a box lid removed, FIG. 3 is a sectional view taken along line AA of FIG. 1, FIG. 4 is an enlarged sectional view of a connector housing portion, and FIG. FIG. 6 is a sectional view of a wall-shaped mounting projection, and FIG. 6 is an enlarged sectional view showing an assembled state of the box bottom portion, the electronic substrate, and the box tubular portion.
【0017】先ず、図3を中心に図1乃至図3に基づい
て説明する。図示の筐体は、箱底部10としてのベース
と、箱胴部23としての環状フレームと、箱蓋部30と
してのカバーとの3部材から成り、各種の電子部品41
a〜41hが装備される電子基板40が,前記箱底部1
0との間に適度な間隔を保って略水平状態に内蔵されて
いる。この電子基板40は、箱底部10の適所に突出形
成さた固定部13a〜13dに対応して設けられたネジ
穴を介して、当該箱底部10に固定される。電子基板4
0の箱底部10への固定については後述する。尚、上記
3部材のうち、少なくとも、箱底部10及び箱胴部23
は、例えばアルミダイキャスト製等の熱伝導性部材で形
成されている。First, a description will be given centering on FIG. 3 with reference to FIGS. The case shown in the figure is made up of three members, a base as the box bottom 10, an annular frame as the box body 23, and a cover as the box lid 30, and various electronic components 41 are provided.
The electronic board 40 equipped with a to 41h is the box bottom 1
It is built in a substantially horizontal state with an appropriate distance from 0. The electronic board 40 is fixed to the box bottom 10 through screw holes provided in correspondence with the fixing portions 13a to 13d formed to project in appropriate places on the box bottom 10. Electronic board 4
Fixing 0 to the box bottom 10 will be described later. In addition, at least the box bottom portion 10 and the box body portion 23 among the above-mentioned three members.
Is formed of a heat conductive member such as a die-cast aluminum product.
【0018】図3において、箱底部10の外周縁には、
組立て時に、後述の箱胴部23の下端面に環状に突出形
成された嵌合突起部23bを受け入れる断面凹状の嵌合
溝14が環状に形成されている。箱底部10の底面から
は、図2及び図5に示すように、電子基板40の切欠部
40aを通って,垂直な壁状に突出形成された熱伝導性
を有する取付用突起15としての伝熱リブが、図示の例
では箱底部10と一体的に形成されている。このような
熱伝導性を有する取付用突起15の略垂直な側面を、発
熱性電子部品の取付面として用いることにより、筐体内
にて、当該電子部品を平面的に設置する場合に比べて、
大幅に設置スペースを縮小化することができるので、筐
体を小型化して設置床面積を縮小することができる。
尚、箱底部10の四隅には、筐体を設置するための取付
け穴12a〜12d(図1)を有する取付け足11a〜
11dが設けられている。In FIG. 3, the outer peripheral edge of the box bottom 10 is
At the time of assembly, a fitting groove 14 having a concave cross section is formed in an annular shape on a lower end surface of a box body portion 23, which will be described later, to receive an engaging projection portion 23b formed in an annular shape. As shown in FIGS. 2 and 5, from the bottom surface of the box bottom portion 10, through the cutout portion 40a of the electronic substrate 40, a transmission as a mounting protrusion 15 having a thermal conductivity and formed in a vertical wall shape is formed. The heat rib is integrally formed with the box bottom portion 10 in the illustrated example. By using the substantially vertical side surface of the mounting protrusion 15 having such thermal conductivity as the mounting surface of the heat-generating electronic component, compared to the case where the electronic component is installed flat in the housing,
Since the installation space can be significantly reduced, the housing can be downsized and the installation floor area can be reduced.
In addition, at four corners of the box bottom portion 10, mounting feet 11a to 12d having mounting holes 12a to 12d (FIG. 1) for mounting the housing are formed.
11d is provided.
【0019】図3、図4及び図6において、箱胴部23
は、この例では四角筒状に形成されており、その下端面
には、箱底部10の外周縁に沿って環状に巡るよう形成
された嵌合溝14に嵌合する嵌合突起部23bが突出形
成され、その上端面には、箱蓋部30の縁31を受け入
れる断面凹状の環状の蓋用溝23aが形成されている。
図2及び図6において、箱胴部23の内周面には、後述
の電子基板40の縁側部分が固定されるねじ穴を有する
掛止部24a〜24cが適所に設けられている。図2に
おいて、3つの掛止部24a〜24cは、うち2つの掛
止部24a、24bが電子基板40の縁の一辺の両端
に、うち1つの掛止部24cが前記一辺と相対する他辺
の長さ方向中央に,三角形の頂点に位置するように配設
されている。In FIGS. 3, 4 and 6, the box body portion 23
Is formed in a square tube shape in this example, and a fitting protrusion 23b that fits into a fitting groove 14 formed so as to circulate along the outer peripheral edge of the box bottom 10 is formed on the lower end surface thereof. An annular lid groove 23a having a concave cross section is formed on the upper end surface of the protruding portion to receive the edge 31 of the box lid portion 30.
2 and 6, the inner peripheral surface of the box body portion 23 is provided with hook portions 24a to 24c having screw holes to which an edge side portion of an electronic board 40 described later is fixed. In FIG. 2, among the three hooking portions 24a to 24c, two of the hooking portions 24a and 24b are at both ends of one side of the edge of the electronic substrate 40, and one of the hooking portions 24c is the other side opposite to the one side. Is arranged at the apex of the triangle at the center of the length direction of the.
【0020】他方、電子基板40の箱底部10との固定
部は、前記2つの掛止部24a、24bの間の辺の中央
の13aと、当該電子基板40の面の中心の13bと、
前記掛止部24cが設けられた辺の両端側13c,13
dとに配設されている(13a〜13dは、図上では、
電子基板40に開けられた固定部に対するネジ穴を指し
ているが、実質的には当該ネジ穴の下に位置している固
定部を指す)。これら4つの固定部13a〜13dのう
ち、3つの固定部13a,13c,13dを頂点とする
三角形は、前記掛止部24a,24b,24cを頂点と
する三角形と対称に配置されている。On the other hand, the fixing portion of the electronic board 40 to the box bottom portion 10 is a center 13a of the side between the two hooking portions 24a and 24b, and a center 13b of the surface of the electronic board 40.
Both ends 13c, 13 of the side where the hooking portion 24c is provided
and 13a to 13d are arranged in the figure.
The term refers to a screw hole for the fixing portion formed in the electronic board 40, but substantially refers to the fixing portion located below the screw hole). Among these four fixing portions 13a to 13d, the triangle having the three fixing portions 13a, 13c and 13d as vertices is arranged symmetrically with the triangle having the hooking portions 24a, 24b and 24c as vertices.
【0021】上記電子基板40の固定部13a〜13b
と蓋胴部23の掛止部24a〜24cとは、図6に示す
ように、筐体の深さ方向において、電子基板40の箱底
部10との固定部(図の例では13a)は当該電子基板
40の箱胴部23との掛止部(図の例では24a)より
深い位置関係となるように設定している。従って、この
電子基板40として、外力による曲げに対し反発して復
元する弾性を備えた基板を用いることにより、当該電子
基板40を介して、箱底部10と箱胴部23とはこれら
3部材の組立て状態において、箱底部10と箱胴部23
とは互いに圧接された状態となる。尚、この例の電子基
板40は、ガラスエポキシ製の基板を用いており、電子
基板40の両面には発熱部品41a〜41h等多数の電
子部品が半田付け装着されている。Fixing portions 13a-13b of the electronic substrate 40
As shown in FIG. 6, the locking portions 24a to 24c of the lid body 23 are the fixing portions (13a in the example of the drawing) of the electronic substrate 40 to the box bottom portion 10 in the depth direction of the housing. The electronic board 40 is set to have a deeper positional relationship than the hooking portion (24a in the illustrated example) with the box body portion 23. Therefore, by using, as the electronic board 40, a board having elasticity that rebounds and restores against bending due to an external force, the box bottom part 10 and the box body part 23 are separated from each other through the electronic board 40. In the assembled state, the box bottom 10 and the box body 23
And are pressed against each other. The electronic board 40 of this example uses a glass epoxy board, and a large number of electronic parts such as heat generating parts 41a to 41h are soldered and mounted on both surfaces of the electronic board 40.
【0022】再び、図6において、電子基板40を介し
ての箱底部10と箱胴部23との組立を説明する。弾性
を有する電子基板40は、その縁側の3箇所が、箱胴部
23の内壁即ち内周面側に設けられ掛止部24a〜掛止
部24cのねじ穴に対して、図中の矢印61方向に図示
しないねじによって締付け固定されると共に、電子基板
40の適所に設けられた固定部13a〜13cが、各々
箱底部10の底面に突設された基板固定部に対し、図中
の矢印62方向に図示しないねじによって締付け固定す
る。Referring again to FIG. 6, the assembly of the box bottom portion 10 and the box body portion 23 via the electronic board 40 will be described. The electronic board 40 having elasticity is provided at three positions on the edge side on the inner wall of the box body 23, that is, on the inner peripheral surface side, and with respect to the screw holes of the hooking portions 24a to 24c, arrows 61 in the figure. The fixing portions 13a to 13c, which are fastened in a direction by screws (not shown) and are provided at appropriate positions of the electronic substrate 40, respectively, are provided with arrows 62 in the figure with respect to the substrate fixing portions protruding from the bottom surface of the box bottom 10. Tighten and fix it in the direction by screws (not shown).
【0023】この場合、掛止部24aの電子基板40と
の当接面と基板固定部13aの電子基板40との当接面
との間の距離Tが、電子基板40の厚さtに比べて大き
くなるように、前記掛止部24aと基板固定部13aと
の位置関係が設定されているので、即ち、筐体の深さ方
向において、電子基板40の箱底部10との固定部13
a〜13d、より正確には電子基板40の面が固定部1
3a〜13dとが接する部位が、電子基板40の箱胴部
23との掛止部24a〜24c、より正確には電子基板
40の面が面掛止部24a〜24cと接する部位よりも
深い(低い)位置に設定されているので、電子基板40
を介して箱底部10と箱胴部23とが仮組付けされると
共に、箱胴部23と箱底部10とが仮の組立て状態にお
いて、電子基板40の弾性によって互いに圧接された状
態となる。従って、適当な接着剤を用いて箱底部10と
箱胴部23とを接着固定するに際して、組付け状態の安
定が得られるため作業が容易となると共に、密着させる
ことができるので、シール性が高められる。In this case, the distance T between the contact surface of the engaging portion 24a with the electronic substrate 40 and the contact surface of the substrate fixing portion 13a with the electronic substrate 40 is smaller than the thickness t of the electronic substrate 40. Since the positional relationship between the hooking portion 24a and the board fixing portion 13a is set so as to become larger, that is, the fixing portion 13 of the electronic board 40 with the box bottom portion 10 in the depth direction of the housing.
a to 13d, more accurately, the surface of the electronic substrate 40 is the fixed portion 1
3a to 13d are in contact with the box body portion 23 of the electronic board 40, and more precisely, the surface of the electronic board 40 is deeper than the area in which the surface stop portions 24a to 24c are contacted ( (Lower) position, the electronic board 40
The box bottom part 10 and the box body part 23 are temporarily assembled through the via, and the box body part 23 and the box bottom part 10 are pressed against each other by the elasticity of the electronic substrate 40 in the temporary assembled state. Therefore, when the box bottom portion 10 and the box body portion 23 are bonded and fixed using an appropriate adhesive, the work can be facilitated because the assembly state can be stabilized, and the sealing can be achieved. To be enhanced.
【0024】次に、筐体の箱胴部23に一体的に設けら
れるコネクタハウジング20について説明する。図2乃
至図4において、この形態1のコネクタハウジング20
は、機能的には1個設ければ済むところを複数個、この
例では2個に機能を分割し、それぞれ分割コネクタハウ
ジング20a,20bとして設けてある。何れの分割コ
ネクタハウジング20a,20bも、例えばPBT(ポ
リブチレン・テレフタレ−ト)等によって樹脂成形され
たもので、それぞれ、多数の折曲形(ライトアングルタ
イプ)の接続ピン22a、22bと、箱胴部23の外周
面側に突出した接続ピン22a、22bを保護する保護
筒部21a,21bとを備えている。Next, the connector housing 20 provided integrally with the box body portion 23 of the housing will be described. 2 to 4, the connector housing 20 of the first embodiment is shown.
Is divided into a plurality of parts, which are functionally provided by one, and in this example, the functions are divided into two and provided as divided connector housings 20a and 20b, respectively. Both of the split connector housings 20a and 20b are resin-molded by, for example, PBT (polybutylene terephthalate) or the like, and have a large number of bent (right-angle type) connection pins 22a and 22b and a box body, respectively. It is provided with protective cylinder portions 21a and 21b for protecting the connection pins 22a and 22b protruding to the outer peripheral surface side of the portion 23.
【0025】図4は、分割コネクタハウジング20aに
相手側コネクタ50が接続された状態を示すもので、分
割コネクタハウジング20aの接続ピン22aと相手側
コネクタ50の図示されていないメスピンとが接触嵌合
するように構成されている。相手側コネクタ50には上
記保護筒部21aを挟み込むよう環状溝51が設けら
れ、環状溝51の内部外周面には例えばゴム材による弾
性パッキン52が装着されている。この弾性パッキンに
よって従来に比べてより高く防水性を確保することがで
きる。又、従来、1つで賄われていたコネクタハウジン
グ20の機能を複数の分割コネクタハウジング20a,
20bに分割して設けることにより、各分割コネクタハ
ウジング20a,20bにおける相手コネクタ51との
着脱に際し、従来に比べて無理な力を必要とせず、容易
に着脱を行うことができる。FIG. 4 shows a state in which the mating connector 50 is connected to the split connector housing 20a, and the connection pin 22a of the split connector housing 20a and the female pin (not shown) of the mating connector housing 50 are fitted in contact with each other. Is configured to. An annular groove 51 is provided in the mating connector 50 so as to sandwich the protective cylinder portion 21a, and an elastic packing 52 made of, for example, a rubber material is attached to the inner peripheral surface of the annular groove 51. With this elastic packing, it is possible to secure higher waterproofness as compared with the conventional one. In addition, the function of the connector housing 20 which is conventionally provided by one is divided into a plurality of divided connector housings 20a,
By providing the split connector housings 20a and 20b separately, it is possible to easily attach / detach each of the split connector housings 20a, 20b to / from the mating connector 51 without requiring an unreasonable force as compared with the related art.
【0026】次に、箱蓋部30を説明する。図3及び図
6において、箱蓋部30は、箱胴部23の上面側を覆う
例えば板金製のカバ−である。この箱蓋部30の縁は、
少なくとも、箱胴部23の蓋用溝23aに嵌合される部
分が、断面において、縁先端に向って次第に拡開する外
周折曲部31となるような形状とされている。又、箱蓋
部30の縁に形成された外周折曲部31の開口斜面部3
3には、プレス加工で打ち抜き断裁された縁の切り口面
としての周縁断裁部32と、縁に沿って適当間隔にて設
けられた複数の縁切欠部34とが設けられている。Next, the box lid portion 30 will be described. In FIGS. 3 and 6, the box lid portion 30 is a cover made of, for example, sheet metal, which covers the upper surface side of the box body portion 23. The edge of the box lid 30 is
At least a portion of the box body portion 23 that is fitted into the lid groove 23a has a cross-sectional shape that forms an outer peripheral bent portion 31 that gradually expands toward the edge tip. In addition, the opening slope portion 3 of the outer peripheral bent portion 31 formed on the edge of the box lid portion 30.
3 is provided with a peripheral edge cut portion 32 as a cut surface of an edge punched and cut by press working, and a plurality of edge cutout portions 34 provided at appropriate intervals along the edge.
【0027】開口斜面部33は、箱蓋部30が閉じられ
ると箱胴部23の凹状の蓋用溝23aに嵌入し、蓋用溝
23aに充填される接着シール材70にて固定される。
この場合、蓋用溝23aの外周側内壁面と周縁断裁部3
2即ち縁の切り口面との間には間隙Gが生ずるよう予め
箱蓋部30が形成されている。この間隙Gは、上記縁切
欠部34と共に、蓋用溝23a内において、充填された
接着シール材70の流動化を促し、これにより、蓋用溝
23aに納まった箱蓋部30の縁即ち開口斜面部33の
内・外周縁に迅速且つ均一に接着シール材70が施され
て固着及びシール性を向上させる。The opening slope 33 is fitted into the concave lid groove 23a of the box body 23 when the box lid 30 is closed, and is fixed by the adhesive sealing material 70 filled in the lid groove 23a.
In this case, the inner wall surface on the outer peripheral side of the lid groove 23a and the peripheral cutting portion 3
A box lid portion 30 is formed in advance so that a gap G is formed between the two, that is, the edge cut surface. The gap G, together with the edge cutout 34, promotes fluidization of the filled adhesive sealing material 70 in the lid groove 23a, whereby the edge or opening of the box lid portion 30 housed in the lid groove 23a. The adhesive sealing material 70 is applied to the inner and outer peripheral edges of the slope portion 33 quickly and uniformly to improve fixation and sealing performance.
【0028】次に、取付用突起15を説明する。図3及
び図5において、電子基板40の適所には基板切欠部4
0aを設け、この基板切欠部40aを通って、熱伝導性
を備えた箱底部10と一体成型された取付用突起15と
しての伝熱リブを壁状に突設し、この略垂直な壁の壁面
に、電子基板40に半田付けされたトランジスタ等の発
熱部品41dをクリップ等の弾性止着部材60a、60
bを介して圧着する。これにより、平面的な設置スペー
スを広く必要とする発熱部品41dを、垂直方向に縦に
設置することができるので、筐体の平面的な設置スペー
スを大幅に縮小させることができる。Next, the mounting projection 15 will be described. In FIGS. 3 and 5, the board notch 4 is provided at an appropriate position of the electronic board 40.
0a is provided, a heat transfer rib as a mounting projection 15 integrally formed with the box bottom portion 10 having heat conductivity is formed in a wall shape through the substrate cutout portion 40a, and the substantially vertical wall On the wall surface, a heat generating component 41d such as a transistor soldered to the electronic board 40 is elastically attached to the clip 60a, 60.
Crimp through b. As a result, the heat-generating component 41d, which requires a large planar installation space, can be installed vertically in the vertical direction, so that the planar installation space of the housing can be significantly reduced.
【0029】上記実施の形態1の筐体の組立を説明す
る。先ず、電子基板40に、発熱部品41a〜41hを
含む多くの電子部品を実装する。次に、分割コネクタハ
ウジング20a,20b部に、それぞれ多数の接続ピン
22a、22bが圧入された箱胴部23に対して、電子
基板40をねじ止め固定し、噴流半田付け装置等を用い
て接続ピン22a、22bを電子基板40に半田付けす
る。次に、箱底部10の嵌合溝14に、例えばシリコン
系の熱硬化性接着材である接着シール材70を注入した
上で、基板固定ねじ等によって電子基板40を箱底部1
0に締付け固定する。Assembly of the housing of the first embodiment will be described. First, many electronic components including the heat generating components 41a to 41h are mounted on the electronic substrate 40. Next, the electronic board 40 is screwed and fixed to the box body portion 23 in which a large number of connection pins 22a and 22b are press-fitted into the split connector housings 20a and 20b, respectively, and connected using a jet soldering device or the like. The pins 22a and 22b are soldered to the electronic board 40. Next, after the adhesive sealing material 70, which is, for example, a silicon-based thermosetting adhesive, is injected into the fitting groove 14 of the box bottom portion 10, the electronic board 40 is attached to the box bottom portion 1 with a board fixing screw or the like.
Tighten and fix to 0.
【0030】上記の組立工程において、電子基板40を
基板固定ねじで箱底部10に締付け固定した段階では、
電子基板40が弾性変形内で変形して、図6における距
離Tが圧縮される。この結果、箱胴部23と箱底部10
とが当該電子基板40を介して圧接仮止めされることと
なるので、接着シール材70が硬化するまで、箱胴部2
3と箱底部10との組立安定性が確保される。In the above assembly process, when the electronic board 40 is fixed to the box bottom 10 with the board fixing screws,
The electronic substrate 40 is deformed within the elastic deformation, and the distance T in FIG. 6 is compressed. As a result, the box body 23 and the box bottom 10
Will be temporarily pressure-bonded to each other via the electronic board 40, so that the box body portion 2 is kept until the adhesive sealing material 70 is cured.
Assembling stability of 3 and the box bottom 10 is secured.
【0031】こうして組立てられた筐体を、例えば、自
動車の車体に装着するには、機械的強度が強く重量も重
くした箱底部10の取付け足11a〜11dを所定位置
に設置した上で、筐体の分割コネクタ20a、20bに
応じて予め準備していた相手方コネクタ50をそれぞれ
接続する。尚、取付け足11a〜11dを設けた箱底部
10を重量体として形成すると共に、内蔵される電子基
板40をガラスエポキシ材とすることによって、実用運
転時の電子基板40や接着シール材部分70への振動荷
重の作用を軽減するができると共に、電子基板40の強
度をも高めることができる。To mount the thus-assembled housing on, for example, the body of an automobile, the mounting feet 11a to 11d of the box bottom 10 having high mechanical strength and heavy weight are installed at predetermined positions, and then the housing is mounted. The mating connectors 50 prepared in advance are connected to the body split connectors 20a and 20b, respectively. In addition, by forming the box bottom portion 10 provided with the mounting feet 11a to 11d as a weight body and using the built-in electronic board 40 as a glass epoxy material, the electronic board 40 and the adhesive sealing material portion 70 at the time of practical operation can be obtained. The effect of the vibration load can be reduced, and the strength of the electronic substrate 40 can be increased.
【0032】又、上記実施の形態1によれば、弾性止着
部材60a、60bによって、発熱部品41a〜41h
を取付部材15としての伝熱リブに密着するようにした
ので、発生熱によるリード線の伸縮に伴う半田付け部の
ストレスを吸収し、確実に熱放散を行うことができると
共に、多数の発熱部品41a〜41hの取付け面積を削
減することができる。又、蓋用溝23aに、例えばシリ
コン系の熱硬化性接着材である接着シール材70を注入
した上で、箱蓋部30を載せて加熱乾燥することによっ
て、箱底部10と箱筒部23と箱蓋部30との3部材と
を一体化させて筐体を組み上げることができる。Further, according to the first embodiment, the heat generating parts 41a to 41h are provided by the elastic fastening members 60a and 60b.
Since it is brought into close contact with the heat transfer rib as the mounting member 15, it is possible to absorb the stress of the soldering part due to the expansion and contraction of the lead wire due to the generated heat, and to surely dissipate the heat, and to generate a large number of heat-generating components. The mounting area of 41a to 41h can be reduced. In addition, for example, an adhesive sealing material 70 which is a thermosetting adhesive of silicon type is injected into the groove 23a for the lid, and then the box lid portion 30 is placed and heated and dried, so that the box bottom portion 10 and the box tubular portion 23. It is possible to assemble the housing by integrating the three members, that is, the box lid section 30 and the box lid section 30.
【0033】実施の形態2.実施の形態2は、上記実施
の形態1において、略垂直な取付面をもつ壁状の取付用
突起15に代えて、略水平な取付面を頂面にもつ台状の
取付用突起16を設けたものである。これを図7に基づ
いて説明する。図7は、略水平に取付面が形成された熱
伝導性を有する取付用突起16の垂直断面図である。図
7において、電子基板40の切欠部40bを通って,頂
面が電子基板40の上面側に臨むよう台状に突出形成さ
れた熱伝導性を有する取付用突起16が、上記取付用突
起15と同様に、箱底部10と一体的に形成されてい
る。Embodiment 2. In the second embodiment, in place of the wall-shaped mounting projection 15 having the substantially vertical mounting surface in the first embodiment, a trapezoidal mounting projection 16 having a substantially horizontal mounting surface on the top surface is provided. It is a thing. This will be described with reference to FIG. FIG. 7 is a vertical cross-sectional view of the mounting protrusion 16 having a thermal conductivity and having a mounting surface formed substantially horizontally. In FIG. 7, a mounting protrusion 16 having heat conductivity, which is formed in a trapezoidal shape so that the top surface faces the upper surface side of the electronic substrate 40 through the cutout portion 40b of the electronic substrate 40, is the mounting protrusion 15 described above. Similarly, is formed integrally with the box bottom portion 10.
【0034】電子基板40に半田付けされた折曲リード
線付きのトランジスタ等の発熱部品41iは固定ねじ6
3によって上記取付用突起16にネジ63で固定され
る。上記の発熱部品41iは、図示のように折曲リード
線を介して電子基板40に半田付けされるので、温度変
化に伴うリード線の伸縮があっても、発生熱によるリー
ド線の伸縮に伴う半田付け部のストレスを、当該リード
線の折曲部で吸収し半田部に無理なストレスを与えるこ
とがない。The heat-generating component 41i such as a transistor with a bent lead wire soldered to the electronic board 40 is fixed with a fixing screw 6.
It is fixed to the mounting projection 16 with a screw 63. Since the heat generating component 41i is soldered to the electronic substrate 40 via the bent lead wire as shown in the drawing, even if the lead wire expands or contracts due to temperature change, the lead wire expands or contracts due to the generated heat. The stress of the soldering portion is absorbed by the bent portion of the lead wire, and the soldering portion is not unnecessarily stressed.
【0035】このような熱伝導性を有する取付用突起1
6の略水平な頂面即ち平面を、発熱部品の取付面として
用いることにより、上記実施の形態1の略垂直な取付面
をもつ壁状の取付用突起15に比べて、筐体の高さ(深
さ)方向を縮小させることができる。仮に、略垂直な取
付面をもつ取付用突起15のみを筐体内部に配設すれ
ば、筐体の設置床面積を縮小することができるし、熱伝
導性突起16のみを筐体内部に配設すれば、筐体の高さ
を縮小することができる。又、略垂直な取付面をもつ取
付用突起15とこの略水平な取付面をもつ取付用突起1
6とを適宜組み合わせて併用することにより、筐体容積
が小さくコンパクト化された、筐体を提供することもで
きる。Mounting protrusion 1 having such thermal conductivity
By using the substantially horizontal top surface or flat surface of 6 as the mounting surface of the heat-generating component, the height of the housing is higher than that of the wall-shaped mounting projection 15 having the substantially vertical mounting surface of the first embodiment. The (depth) direction can be reduced. If only the mounting projection 15 having a substantially vertical mounting surface is provided inside the housing, the installation floor area of the housing can be reduced, and only the heat conductive projection 16 is provided inside the housing. If provided, the height of the housing can be reduced. Further, the mounting projection 15 having a substantially vertical mounting surface and the mounting projection 1 having the substantially horizontal mounting surface
By appropriately combining and using 6 and 6, it is possible to provide a compact housing having a small housing volume.
【0036】実施の形態3.実施の形態3は、上記実施
の形態1や形態2における電子基板40において、少な
くとも、発熱部品が装着される領域のスルーホールメッ
キ穴に充填材を詰めると共に、当該充填材が詰められた
スルーホールの両端面側にメッキ層を施して、前記発熱
部品の熱を当該スルーホールメッキ穴を介して熱伝導性
部材からなる箱底部に伝熱させる構成としたものであ
る。以下これを、図8及び図9に基づいて説明する。図
8は電子基板の箱底部との取付状態を示す部分拡大垂直
断面図であり、図9はその電子基板の平面図である。Embodiment 3. In the third embodiment, in the electronic board 40 according to the first or second embodiment, at least the through-hole plating hole in the region where the heat-generating component is mounted is filled with the filling material, and the through-hole filled with the filling material. A plating layer is applied to both end surfaces of the heat generating component to transfer the heat of the heat generating component to the bottom of the box made of a heat conductive member through the through hole plating hole. This will be described below with reference to FIGS. 8 and 9. FIG. 8 is a partially enlarged vertical cross-sectional view showing a state where the electronic board is attached to the bottom of the box, and FIG. 9 is a plan view of the electronic board.
【0037】図8及び図9において、17は上記箱底部
10の底面に位置する伝熱面、18は、例えばシリコン
材等による軟質・熱伝導性の絶縁シ−ト18であり、絶
縁シ−ト18は上記の伝熱面17に密着して配置されて
いる。尚、この伝熱絶縁シ−ト18に代えて、伝熱・絶
縁性接着材を用いることもできる。In FIGS. 8 and 9, 17 is a heat transfer surface located on the bottom surface of the box bottom portion 10, and 18 is a soft and heat conductive insulating sheet 18 made of, for example, a silicon material. The heater 18 is arranged in close contact with the heat transfer surface 17. A heat transfer / insulating adhesive may be used instead of the heat transfer insulating sheet 18.
【0038】42aは、例えば平面構造のパワ−トラン
ジスタである発熱部品41jに設けられた放熱電極とし
てのコレクタ端子、42c、42dは第二・第三電極と
してのエミッタ端子、ベ−ス端子であり、上記放熱電極
42aとしてのコレクタ端子は発熱部品41jの略全面
にわたる広い面積となっている。Reference numeral 42a denotes a collector terminal as a heat dissipation electrode provided on a heat generating component 41j which is a power transistor having a planar structure, and 42c and 42d denote emitter terminals and base terminals as second and third electrodes. The collector terminal as the heat dissipation electrode 42a has a large area over substantially the entire surface of the heat generating component 41j.
【0039】44a、44bは上記コレクタ端子42a
が接続される銅箔パタ−ン、43a〜43i(43d〜
43iは図9参照)は電子基板40に設けられた多数の
スル−ホ−ルメッキ穴、45a、45bは上記銅箔パタ
−ン44a、44bを連結する、例えば銅メッキによる
第一のメッキ層、46a、46bは半田レジスト層、4
7a〜47iは上記スル−ホ−ルメッキ穴43a〜43
iに充填された例えばエポキシ樹脂等の充填材、48
a、48bは該充填材を封鎖する例えば銅メッキ等によ
る第二のメッキ層、49aは上記放熱電極42aに対す
る半田層である。尚、前記の充填材47a〜47iは熱
伝導性を有するものが好ましい。44a and 44b are the collector terminals 42a.
Copper foil pattern, 43a-43i (43d-
43i refers to FIG. 9) is a large number of through-hole plating holes provided in the electronic substrate 40, 45a and 45b connect the copper foil patterns 44a and 44b, for example, a first plating layer by copper plating, 46a, 46b are solder resist layers, 4
7a to 47i are the through-hole plating holes 43a to 43.
a filler such as an epoxy resin filled in i, 48
Reference numerals a and 48b are second plating layers for blocking the filling material, for example, copper plating, and 49a is a solder layer for the heat dissipation electrode 42a. The fillers 47a to 47i preferably have thermal conductivity.
【0040】又、上記第二・第三電極42c、42dに
対する半田層49c、49d(49dは図示されず)や
第二のメッキ層48c、48d、第一のメッキ層45
c、45d(45dは図示されず),或いは銅箔パタ−
ン44c、44d(44dは図示されず)等は,上記放
熱電極42aとは電気的に分離して構成されている。Further, the solder layers 49c and 49d (49d is not shown) for the second and third electrodes 42c and 42d, the second plating layers 48c and 48d, and the first plating layer 45.
c, 45d (45d is not shown), or copper foil pattern
The parts 44c, 44d (44d is not shown) and the like are electrically separated from the heat dissipation electrode 42a.
【0041】この実施の形態3によれば、電子基板40
の表面側に平面取付け構造で装着された発熱部品41j
の発生熱を、当該電子基板40のスルーホールメッキ穴
43a〜43cを介して、当該電子基板40の裏面から
箱底部10に効率よく伝熱させることができる。又、当
該スルーホールメッキ穴43a〜43cは、充填材47
a〜47cで穴が塞がれ、塞がれたスルーホールメッキ
穴43a〜43cの両端側に、メッキ層(第2のメッキ
層)48c,48dが形成してあるので、スル−ホ−ル
メッキ穴43a〜43cに半田が流れ込むことを防止す
ることができると共に、伝熱面との接触平面を広く確保
することができる。更に、同様のスル−ホ−ルメッキ穴
43a〜43cを更に多数設けることによって、熱伝導
性を向上させることができので、実装される発熱部品4
0jに応じて、その温度上昇を更に一段と低減させるこ
とができる。According to the third embodiment, the electronic substrate 40
Heat generating component 41j mounted on the front side of the plate by a flat mounting structure
The generated heat can be efficiently transferred from the back surface of the electronic board 40 to the box bottom portion 10 through the through-hole plating holes 43a to 43c of the electronic board 40. In addition, the through-hole plating holes 43a to 43c are filled with the filling material 47.
The holes are closed by a to 47c, and plating layers (second plating layers) 48c and 48d are formed on both ends of the closed through-hole plating holes 43a to 43c. Solder can be prevented from flowing into the holes 43a to 43c, and a wide contact plane with the heat transfer surface can be secured. Further, by providing a larger number of similar through-hole plating holes 43a to 43c, the thermal conductivity can be improved, so that the heat generating component 4 to be mounted is mounted.
Depending on 0j, the temperature rise can be further reduced.
【0042】尚、上記実施の形態1乃至3において、電
子基板40と箱胴部23との固定は、ねじを用いる代り
に箱胴部23と一体成形されたフックと電子基板40に
設けた穴とを無理嵌合させる構成としてもよいし(非図
示)、リベットを箱底部10に圧入し、リベットの頭で
電子基板を押さえるようにしたり、箱底部10と一体成
形されたピンをカシメしても良い(非図示)。又、上記
実施の形態1乃至3において、箱蓋体30と箱胴部23
との固定は、接着シール材70による接着固定に代え
て、パッキンとねじとを用いて固定することもできる
(非図示)。この場合には余分の部品等を必要とする反
面で、保守点検が容易となる。又、上記実施の形態3に
おいて、発熱部品41iを固定する手段としては、固定
ねじ63に代えて、リベットやカシメ方式等を用いるこ
ともできる(非図示)。In the first to third embodiments, the electronic board 40 and the box body 23 are fixed to each other by using a hook integrally formed with the box body 23 and a hole provided in the electronic board 40 instead of using screws. May be forcedly fitted (not shown), or the rivet may be press-fitted into the box bottom 10 so that the head of the rivet presses the electronic board, or the pins integrally formed with the box bottom 10 are caulked. Also good (not shown). In addition, in the first to third embodiments, the box lid 30 and the box body 23
Instead of the adhesive fixing by the adhesive sealing material 70, the packing and the screw can be used for fixing (not shown). In this case, although extra parts and the like are required, maintenance and inspection are easy. Further, in the third embodiment, as a means for fixing the heat-generating component 41i, a rivet or a caulking method may be used instead of the fixing screw 63 (not shown).
【0043】[0043]
【発明の効果】第1乃至第8の発明によれば、何れも、
組み上げられる筐体が、電子基板の弾性によって、箱底
部と箱胴部とが互いに組み合わせ状態で圧接された状態
で固着することができるので、箱胴部と箱底部との間の
接着シール材が硬化するまでの工程間移送が容易とな
る。又、前記の状態にて、箱蓋部が取付け可能となるの
で筐体の組み付け作業を効率的に行うことができる。
又、箱蓋部を装着する前段階において、既に電気的には
完成品となっているので、電子基板上のチェック端子や
相手側コネクタを用いた製品試験を、箱蓋部が外された
状態で容易に行うこともできる。According to the first to eighth inventions,
Due to the elasticity of the electronic substrate, the case to be assembled can be fixed in a state where the box bottom and the box body are pressed against each other in a combined state, so that the adhesive sealing material between the box body and the box bottom is It becomes easy to transfer between steps until it hardens. Further, since the box lid can be attached in the above state, the work of assembling the housing can be efficiently performed.
In addition, before the box lid is attached, it has already been electrically completed, so the product test using the check terminals on the electronic board and the mating connector should be done with the box lid removed. Can also be done easily.
【0044】第3及び第4の発明によれば、何れも、箱
胴部に対する箱蓋部の接着シール材による接着強度が従
来に比べてより高まるので、両部の固定及びシール性を
より確実にすることができる。According to the third and fourth inventions, the adhesive strength of the box lid portion to the box body portion due to the adhesive sealing material is higher than in the conventional case, so that the fixing and sealing properties of both portions are more reliable. Can be
【0045】第5の発明によれば、従来、1つで賄われ
ていたコネクタハウジングの機能を複数の分割コネクタ
ハウジングに分割しているので、各分割コネクタハウジ
ングにおける相手コネクタとの着脱に際して、無理な力
を必要とせず、容易におこなうことができる。According to the fifth aspect of the invention, the function of the connector housing, which is conventionally provided by one, is divided into a plurality of divided connector housings. Therefore, it is impossible to attach / detach the divided connector housing to / from the mating connector. It can be done easily without requiring a lot of force.
【0046】第6の発明によれば、電子基板に設けられ
た発熱部品を確実に箱底部に対して伝熱取付けすること
ができると共に、筐体の設置スペースを縮小させること
ができる。According to the sixth aspect, the heat-generating component provided on the electronic substrate can be securely mounted to the bottom of the box by heat transfer, and the installation space of the housing can be reduced.
【0047】第7の発明によれば、電子基板に設けられ
た発熱部品を確実に箱底部に対して伝熱取付けすること
ができると共に、筐体の高さ寸法を縮小させることがで
きる。According to the seventh aspect of the present invention, the heat-generating component provided on the electronic substrate can be securely mounted on the bottom of the box by heat transfer, and the height of the housing can be reduced.
【0048】第8の発明によれば、電子基板の表面側に
平面取付け構造で装着された発熱部品の発生熱を、当該
電子基板のスルーホールメッキ穴を利用して、当該電子
基板の裏面から箱底部に効率よく伝熱させることができ
る。又、当該スルーホールメッキ穴は充填材で穴が充填
され、スルーホールの両端側にメッキ層が形成してある
ので、スル−ホ−ルメッキ穴に半田が流れ込むことを防
止することができると共に、伝熱面との接触平面を広く
確保することができる。更に、同様のスル−ホ−ルメッ
キ穴を更に多数設けることによって、熱伝導性を向上さ
せることができので、実装される発熱部品に応じて、そ
の温度上昇を低減させることができる。According to the eighth aspect of the invention, the heat generated by the heat-generating component mounted on the front surface side of the electronic board by the flat mounting structure is transferred from the back surface of the electronic board by utilizing the through-hole plating hole of the electronic board. Heat can be efficiently transferred to the bottom of the box. Further, since the through-hole plated hole is filled with a filling material and the plated layers are formed on both end sides of the through-hole, it is possible to prevent the solder from flowing into the through-hole plated hole, A wide contact plane with the heat transfer surface can be secured. Furthermore, since the thermal conductivity can be improved by providing more similar through-hole plating holes, the temperature rise can be reduced depending on the heat-generating components to be mounted.
【図1】 実施の形態1の筐体の平面図である。FIG. 1 is a plan view of a housing according to a first embodiment.
【図2】 箱蓋部を外した筐体の平面図である。FIG. 2 is a plan view of a housing with a box lid removed.
【図3】 図1のA−A線断面図である。3 is a cross-sectional view taken along the line AA of FIG.
【図4】 コネクタハウジング部分の拡大断面図であ
る。FIG. 4 is an enlarged cross-sectional view of a connector housing portion.
【図5】 壁状に設けられた取付用突起の断面図であ
る。FIG. 5 is a cross-sectional view of a wall-shaped mounting protrusion.
【図6】 箱底部と電子基板と箱筒部との組付け状態を
示す拡大断面図である。FIG. 6 is an enlarged cross-sectional view showing an assembled state of the box bottom portion, the electronic substrate, and the box cylinder portion.
【図7】 実施の形態2の筐体の部分断面図である。FIG. 7 is a partial cross-sectional view of the housing according to the second embodiment.
【図8】 実施の形態3の電子基板の断面図である。FIG. 8 is a sectional view of an electronic board according to a third embodiment.
【図9】 図8の電子基板の平面図である。9 is a plan view of the electronic substrate of FIG.
10 箱底部、13a〜13d 固定部、14 嵌合
溝、52 弾性パッキン、15 取付突起(壁状)16
取付突起(台状)、17 伝熱面、18 絶縁シ−ト
(熱伝導性絶縁層)、20a,20b 分割コネクタハ
ウジング、22a、22b 接続ピン、23 箱胴部
(筐体)、23a 縁嵌合溝、24a〜24c 掛止
部、30 箱蓋部(筐体)、31 縁(外周折曲部)、
32 周縁断裁部、33 開口斜面部、34 縁切欠
部、40 電子基板、41a〜41j 発熱部品、43
a〜43c スル−ホ−ルメッキ穴、44a、44b
銅箔パタ−ン、45a、45b 第一のメッキ層、47
a〜47i 充填材、48a、48b 第二のメッキ
層。60a、60b 弾性体、70 接着シール材、G
隙間、T 距離、t 厚み。10 Box Bottom, 13a to 13d Fixed Part, 14 Fitting Groove, 52 Elastic Packing, 15 Mounting Protrusion (Wall) 16
Mounting protrusion (trapezoid), 17 heat transfer surface, 18 insulating sheet (heat conductive insulating layer), 20a, 20b split connector housing, 22a, 22b connection pin, 23 box body (housing), 23a edge fitting Mating groove, 24a to 24c hooking portion, 30 box lid portion (housing), 31 edge (periphery bending portion),
32 peripheral edge cutting part, 33 opening slope part, 34 edge notch part, 40 electronic board, 41a to 41j heat generating component, 43
a-43c through-hole plated holes, 44a, 44b
Copper foil pattern, 45a, 45b First plating layer, 47
a to 47i Filler, 48a, 48b Second plating layer. 60a, 60b Elastic body, 70 Adhesive sealing material, G
Gap, T distance, t thickness.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開2002−316597(JP,A) 特開 平11−312884(JP,A) 特開2001−85866(JP,A) 特開 平11−251764(JP,A) 特開 平11−261254(JP,A) 特開2000−183574(JP,A) 特開2001−308566(JP,A) 特開 平9−283886(JP,A) 特開2000−349466(JP,A) 特開 平9−23536(JP,A) 特開 平6−77674(JP,A) 特開 平9−238419(JP,A) 特開 平10−243527(JP,A) 特開 平8−181471(JP,A) 特開 平11−266078(JP,A) 実開 平6−9190(JP,U) 実開 昭58−142988(JP,U) 実開 昭62−158897(JP,U) 実開 平3−2699(JP,U) 特公 平6−52831(JP,B2) (58)調査した分野(Int.Cl.7,DB名) H05K 7/14 H05K 5/00 - 5/06 H05K 7/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 2002-316597 (JP, A) JP 11-312884 (JP, A) JP 2001-85866 (JP, A) JP 11-251764 ( JP, A) JP 11-261254 (JP, A) JP 2000-183574 (JP, A) JP 2001-308566 (JP, A) JP 9-283886 (JP, A) JP 2000- 349466 (JP, A) JP 9-23536 (JP, A) JP 6-77674 (JP, A) JP 9-238419 (JP, A) JP 10-243527 (JP, A) JP-A-8-181471 (JP, A) JP-A-11-266078 (JP, A) Actually open 6-9190 (JP, U) Actually open 58-142988 (JP, U) Actually open 62-158897 (JP, U) Actual Kaihei 3-2699 (JP, U) Japanese Patent Publication 6-52831 (JP, B2) (58) Fields investigated (Int.Cl. 7 , D B name) H05K 7/14 H05K 5/00-5/06 H05K 7/20
Claims (8)
てられ、電子部品が装着された電子基板が収納される電
子機器用筐体において、 前記電子基板は弾性を有し、当該電子基板が前記箱底部
に固定された状態において、当該電子基板の縁部の少な
くとも一部が前記箱胴部に係止され、前記箱底部と箱胴
部とが組立てられた状態にて当該電子基板の弾性によっ
て互いに圧接する構成としたことを特徴とする電子機器
用筐体。1. A housing for an electronic device, which is assembled in a box shape by a box bottom portion, a box body portion, and a box lid portion, and in which an electronic substrate on which electronic components are mounted is stored, wherein the electronic substrate has elasticity. In a state in which the electronic board is fixed to the box bottom, at least a part of an edge of the electronic board is locked to the box body, and the box bottom and the box body are assembled. A housing for an electronic device, wherein the housings are pressed against each other by the elasticity of the electronic substrate.
底部との固定部は当該電子基板の箱胴部との掛止部より
深い位置としたことを特徴とする請求項1に記載の電子
機器用筐体。2. The method according to claim 1, wherein, in the depth direction of the housing, the fixing portion of the electronic board to the box bottom is deeper than the hooking portion of the electronic board to the box body. For electronic devices.
てられ、電子部品が装着された電子基板が収納される電
子機器用筐体において、 前記箱胴部の上端面に前記箱蓋部の縁を受け入れる嵌合
溝を設けると共に、前記箱蓋部の縁に切欠部を設けて、
箱蓋部の縁を箱胴部の溝に嵌合させた状態に組付けた
際、前記嵌合溝に充填された接着剤が前記切欠部を通じ
て縁の内外に流動可能としたことを特徴とする請求項1
又は請求項2に記載の電子機器用筐体。3. A housing for an electronic device, which is assembled in a box shape with a box bottom portion, a box body portion, and a box lid portion, and in which an electronic board on which electronic components are mounted is stored, wherein an upper end surface of the box body portion is provided. A fitting groove for receiving the edge of the box lid is provided, and a cutout is provided at the edge of the box lid,
When the edge of the box lid is fitted into the groove of the box body when assembled, the adhesive filled in the fitting groove is allowed to flow through the notch into and out of the edge. Claim 1
Alternatively, the electronic device casing according to claim 2.
に嵌合される部分が縁先端に向って次第に外方に拡開す
る形状であることを特徴とする請求項1乃至請求項3の
何れかに記載の電子機器用筐体。4. The edge of the box lid has a shape in which at least a portion fitted into the groove of the box body gradually expands outward toward the tip of the edge. The electronic device casing according to claim 3.
ジングを複数に分けて設けたことを特徴とする請求項1
乃至請求項4の何れかに記載の電子機器用筐体。5. The connector housing provided on the outer surface of the box body is divided into a plurality of parts and is provided.
A housing for an electronic device according to claim 4.
な側面に電子部品が取付られる熱伝導性を有する取付用
突起を、電子基板に設けられた切欠部を通って当該箱底
部から起立させたことを特徴とする請求項1乃至請求項
5の何れかに記載の電子機器用筐体。6. The bottom of the box is made of a heat conductive material, and a mounting protrusion having heat conductivity for mounting an electronic component is attached to a substantially vertical side surface from the bottom of the box through a notch formed in the electronic board. The housing for electronic equipment according to any one of claims 1 to 5, which is raised.
な平面に電子部品が取付られる熱伝導性を有する取付用
突起を、電子基板に設けられた切欠部を通って当該箱底
部から起立させたことを特徴とする請求項1乃至請求項
5の何れかに記載の電子機器用筐体。7. The box bottom is made of a heat conductive member, and a mounting protrusion having heat conductivity for mounting an electronic component on a substantially horizontal plane is passed from a bottom of the box through a notch provided in the electronic board. The housing for electronic equipment according to any one of claims 1 to 5, which is raised.
品が装着される領域のスルーホールメッキ穴に充填材を
詰めると共に当該充填材が詰められたスルーホールの両
端面側にメッキ層を形成し、前記発熱部品の熱をスルー
ホールメッキ穴を介して熱伝導性部材からなる箱底部に
伝熱させる構成としたことを特徴とする請求項1乃至請
求項7の何れかに記載の電子機器用筐体。8. In an electronic board, at least a through-hole plating hole in a region where a heat-generating component is mounted is filled with a filling material, and a plating layer is formed on both end surfaces of the through-hole filled with the filling material. 8. The electronic device casing according to claim 1, wherein the heat of the heat generating component is transferred to the bottom of the box made of a heat conductive member through the through hole plating hole. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001268570A JP3457296B2 (en) | 2001-09-05 | 2001-09-05 | Electronic equipment housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001268570A JP3457296B2 (en) | 2001-09-05 | 2001-09-05 | Electronic equipment housing |
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Publication Number | Publication Date |
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JP2003078260A JP2003078260A (en) | 2003-03-14 |
JP3457296B2 true JP3457296B2 (en) | 2003-10-14 |
Family
ID=19094531
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JP2001268570A Expired - Fee Related JP3457296B2 (en) | 2001-09-05 | 2001-09-05 | Electronic equipment housing |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP4589239B2 (en) * | 2006-01-12 | 2010-12-01 | 株式会社日立製作所 | Electronic equipment cooling structure |
JP5609395B2 (en) * | 2010-08-02 | 2014-10-22 | 富士電機株式会社 | Enclosure |
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2001
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