JP3442631B2 - Insulation sheet - Google Patents

Insulation sheet

Info

Publication number
JP3442631B2
JP3442631B2 JP32046397A JP32046397A JP3442631B2 JP 3442631 B2 JP3442631 B2 JP 3442631B2 JP 32046397 A JP32046397 A JP 32046397A JP 32046397 A JP32046397 A JP 32046397A JP 3442631 B2 JP3442631 B2 JP 3442631B2
Authority
JP
Japan
Prior art keywords
fiber
resin composition
insulating
fibers
polytetrafluoroethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP32046397A
Other languages
Japanese (ja)
Other versions
JPH11144529A (en
Inventor
栄一 杉本
祥介 石黒
泰正 山本
壽一 廣瀬
実 土田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marusho Co Ltd
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Marusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd, Marusho Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP32046397A priority Critical patent/JP3442631B2/en
Publication of JPH11144529A publication Critical patent/JPH11144529A/en
Application granted granted Critical
Publication of JP3442631B2 publication Critical patent/JP3442631B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は低誘電率・低誘電損
失率(以下、低誘電性と称する)の絶縁シ−トに関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating sheet having a low dielectric constant and a low dielectric loss factor (hereinafter referred to as low dielectric property).

【0002】[0002]

【従来の技術】周知の通り、絶縁体の誘電損失は誘電率
及び誘電損失率に依存し、電磁波伝送の減衰率や伝送速
度も伝送路の誘電特性に左右される。近来、コンピュ−
タ等の高速伝送や衛星放送・通信、移動無線等に要求さ
れる高度の低伝送損失や伝送速度の高速化に対処するた
めに、それらに使用する機器の絶縁材、特にプリント回
路板のより一層の低誘電率化及び低誘電損失化が要求さ
れている。高電圧機器の分野では、電力損失の低減等の
ために、伝統的に低誘電率化及び低誘電損失化が求めら
れている。
As is well known, the dielectric loss of an insulator depends on the dielectric constant and the dielectric loss rate, and the attenuation rate and transmission speed of electromagnetic wave transmission also depend on the dielectric characteristics of the transmission line. Coming soon
In order to cope with the high low transmission loss and high transmission speed required for high-speed transmission of data, satellite broadcasting / communication, mobile radio, etc., the insulation material of the equipment used for them, especially the printed circuit board Further reduction of dielectric constant and reduction of dielectric loss are required. In the field of high-voltage equipment, a low dielectric constant and a low dielectric loss have traditionally been required to reduce power loss and the like.

【0003】他方、100〜200Vクラスの誘導電動
機で駆動される家庭用電気機器、例えば、冷凍機や空調
機の熱交換冷却器等では、誘導電動機のインバ−タ速度
制御でのインバ−タ部のキャリア周波数に起因する電動
機の電磁力騒音を可聴周波数帯域より高い周波数にして
騒音軽減を図ることが要請され、その一般的手段とし
て、高キャリア周波数のPWM制御(pulse width modu
la control)方式の低騒音型インバ−タが使用され、こ
の低騒音型インバ−タの使用のもとでは、インバ−タ部
のトランジスタ−のスイッチング速度が高速であり、ス
イッチングごとに発生する漏れ電流の変化が急峻であっ
てその誘導電動機の絶縁材(すなわち、スロットライナ
−、ウエッジ、段間絶縁材、マグネットワイヤ−、含浸
ワニス等)に低誘電率絶縁材を使用して上記過渡的漏れ
電流を低減することが検討されている。特に、電気冷凍
機においては、オゾン層の破壊防止のために冷媒がフロ
ンからHFC等の新冷媒に代替されつつあり、このHF
Cの誘電率がフロンの誘電率よりも高く、更に冷媒の代
替に伴い潤滑油も鉱油からポリアルキレングリコ−ル、
ポリオ−ルエステル、ポリエ−テル等に替えられつつあ
り、この潤滑油が吸湿性であって比抵抗が低いために、
100〜200Vクラスの低電圧機器であっても、上記
漏れ電流の一層の増大が懸念され、前記誘導電動機の絶
縁材に低誘電率絶縁材を使用することの意義は極めて大
きい。
On the other hand, in household electric appliances driven by an induction motor of 100 to 200 V class, for example, a heat exchange cooler of a refrigerator or an air conditioner, an inverter section for controlling the inverter speed of the induction motor. It is required to reduce the electromagnetic force noise of the electric motor caused by the carrier frequency of the motor to a frequency higher than the audible frequency band, and as a general means, PWM control (pulse width modu
la control) low-noise type inverter is used, and under the use of this low-noise type inverter, the switching speed of the transistor in the inverter is high, and the leakage generated at each switching The transient leakage is caused by using a low-dielectric-constant insulation material for the induction motor insulation material (that is, slot liner, wedge, interstage insulation material, magnet wire, impregnated varnish, etc.) where the change in current is steep. It is considered to reduce the current. Especially in electric refrigerators, new refrigerants such as HFC are being used as the refrigerant instead of CFC to prevent the destruction of the ozone layer.
The permittivity of C is higher than that of CFC, and the lubricant is changed from mineral oil to polyalkylene glycol with the replacement of refrigerant.
It is being replaced with polyol ester, polyether, etc., and since this lubricating oil is hygroscopic and has a low specific resistance,
Even in a low voltage device of 100 to 200 V class, there is a concern that the leakage current will further increase, and the use of a low dielectric constant insulating material as the insulating material of the induction motor is extremely significant.

【0004】[0004]

【発明が解決しようとする課題】周知の通り、有機絶縁
材料中、ポリテトラフルオロエチレンは代表的な低誘電
性材料であり、その誘電率は2.1以下、誘電正接は
0.02%以下であり、通常、フィルム形態で実用され
ている。しかしながら、非極性に属し併用される含浸樹
脂との接着性に劣り、使用上の制約がある。例えば、プ
リント回路板の用途では銅箔との強固な接着が要求され
るが、ポリテトラフルオロエチレンではこの対応が難し
い。また、機器の絶縁では低吸湿化等のためにレジンを
含浸することが要求されるが、ポリテトラフルオロエチ
レンではこの対応も難しい。従来、フッ素樹脂繊維布に
樹脂を含浸した絶縁シ−トは公知であるが、フッ素樹脂
繊維布の難含浸性もしくは難接着性のために使用可能な
含浸レジンが制限され(特公昭63−46098号)、
含浸レジンに起因する使用条件の制約を免れ得ない。
As is well known, polytetrafluoroethylene is a typical low dielectric material among organic insulating materials, and its dielectric constant is 2.1 or less and dielectric loss tangent is 0.02% or less. And is usually used in the form of a film. However, it is inferior in adhesiveness to the impregnating resin which belongs to the non-polarity and is used together, and there are restrictions in use. For example, in the use of printed circuit boards, strong adhesion to copper foil is required, but polytetrafluoroethylene is difficult to handle this. In addition, for insulation of equipment, it is required to impregnate a resin in order to lower the moisture absorption, and polytetrafluoroethylene is difficult to handle this. Conventionally, an insulating sheet obtained by impregnating a fluororesin fiber cloth with a resin is known, but the impregnating resin that can be used is limited due to the difficulty of impregnating the fluororesin fiber cloth or the adhesion thereof (Japanese Patent Publication No. 63-46098). issue),
Inevitably, there are restrictions on the conditions of use due to the impregnated resin.

【0005】本発明の目的は、樹脂含浸繊維基材シ−ト
において、含浸樹脂に所望の樹脂を使用でき、しかも繊
維基材の低誘電性によってシ−ト全体の低誘電率化・低
誘電損失率化を充分に保証できる絶縁シ−トを提供する
ことにある。
The object of the present invention is to allow a desired resin to be used as the impregnating resin in the resin-impregnated fiber base sheet, and also to lower the permittivity and the low dielectric constant of the entire sheet due to the low dielectric property of the fiber base material. An object of the present invention is to provide an insulating sheet capable of sufficiently guaranteeing a loss rate.

【0006】[0006]

【課題を解決するための手段】本発明に係る絶縁シート
は、繊維基材にポリイミド樹脂組成物、ビスマレイミド
樹脂組成物、ポリフェニレンエーテル樹脂組成物、ウレ
タン樹脂組成物及びエポキシ樹脂組成物より選択された
含浸剤を含浸したシート状絶縁体であり、前記繊維基材
に、フッ素樹脂繊維よりも上記含浸剤に対する親和性若
しくは接着性に優れた絶縁繊維とフッ素樹脂繊維との湿
式抄造法による混抄紙を使用したことを特徴とする構成
であり、絶縁繊維にはガラス繊維、芳香族ポリエステル
繊維、全芳香族ポリアミド繊維、ポリフェニレンスルフ
ィド繊維、ポリパラフェニレンベンゾビスオキサゾール
繊維等を使用でき、フッ素樹脂繊維にはポリテトラフル
オロエチレン繊維を使用できる。
The insulating sheet according to the present invention comprises a fiber base material, a polyimide resin composition, and a bismaleimide.
Resin composition, polyphenylene ether resin composition, Ure
A sheet-like insulator impregnated with an impregnating agent selected from a tongue resin composition and an epoxy resin composition , wherein the fibrous base material has a higher affinity or adhesiveness for the impregnating agent than fluororesin fibers. It is a constitution characterized by using a mixed paper by a wet papermaking method of excellent insulating fibers and fluororesin fibers, the insulating fibers are glass fibers, aromatic polyester fibers, wholly aromatic polyamide fibers, polyphenylene sulfide fibers, available polyparaphenylenebenzobisoxazole fibers, the fluorocarbon resin fibers you can use the polytetrafluoroethylene fibers.

【0007】[0007]

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図1は本発明に係る絶縁
シートを示し、1は繊維基材、2は繊維基材に含浸した
含浸剤であり、繊維基材1にはフッ素樹脂繊維と前記含
浸剤に対する親和性若しくは接着性がフッ素樹脂繊維よ
りも優れた絶縁繊維との湿式抄造法による混抄紙を用い
ている。この混抄紙には、ポリテトラフルオロエチレン
繊維と前記絶縁繊維とを湿式抄造法で混抄したものを使
用でき、ポリテトラフルオロエチレン繊維はビスコース
中にポリテトラフルオロエチレン粉末を分散させエマル
ジョン紡糸することにより得ることができる。上記含浸
剤は絶縁シートの使用条件(耐熱性、耐湿性、機械的強
度、耐電圧性等)に応じて、ポリイミド樹脂組成物、ビ
スマレイミド樹脂組成物、ポリフェニレンエーテル樹脂
組成物、ウレタン樹脂組成物及びエポキシ樹脂組成物
ら選択される。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an insulating sheet according to the present invention, where 1 is a fiber base material, 2 is an impregnating agent impregnated in the fiber base material, and the fibrous base material 1 has affinity or adhesiveness with respect to the fluororesin fiber and the impregnating agent. Uses a mixed paper made by a wet papermaking method with insulating fibers, which is superior to fluororesin fibers. For this mixed paper, it is possible to use a material obtained by mixing polytetrafluoroethylene fiber and the insulating fiber by a wet papermaking method, and the polytetrafluoroethylene fiber is obtained by dispersing polytetrafluoroethylene powder in viscose and emulsion spinning. Can be obtained by The impregnating agent according to the use conditions of the insulating sheet (heat resistance, moisture resistance, mechanical strength, withstand voltage and the like), polyimide resin composition, bismaleimide resin composition, the polyphenylene ether resin composition, a urethane resin or things and the epoxy resin composition
Et al. Ru is selected.

【0008】上記フッ素樹脂繊維には、ポリテトラフル
オロエチレン繊維の外、テトラフルオロエチレンヘキサ
フルオロプロピレン共重合体、ポリクロロトリフルオロ
エチレン、ポリふっ化ビニリデン等の含フッ素系高分子
の繊維も使用できる。上記絶縁繊維には、誘電率や誘電
損失率がフッ素樹脂繊維よりも劣るが、上記含浸剤に対
する含浸性または接着性がフッ素樹脂繊維よりも優れた
ものが使用され、例えば、溶融異方向性芳香族ポリエス
テル繊維(クラレ社製ベクトラン繊維)、全芳香族ポリ
アミド繊維(例えば、デュポン社製ノ−メックス繊
維)、ポリフエニレンスルフィド繊維、ポリパラフェニ
レンベンゾビスオキサゾ−ル繊維等を使用できる。
In addition to polytetrafluoroethylene fibers, fibers of fluorine-containing polymers such as tetrafluoroethylene hexafluoropropylene copolymer, polychlorotrifluoroethylene, and polyvinylidene fluoride can be used as the fluororesin fibers. . The insulating fiber has a dielectric constant and a dielectric loss rate inferior to those of the fluororesin fiber, but those having a better impregnation property or adhesiveness to the impregnating agent than the fluororesin fiber are used. Group polyester fibers (Vectran fibers manufactured by Kuraray Co., Ltd.), wholly aromatic polyamide fibers (for example, Nomex fibers manufactured by DuPont), polyphenylene sulfide fibers, polyparaphenylene benzobisoxazole fibers and the like can be used.

【0009】上記溶融異方向性芳香族ポリエステルは、
例えば芳香族ジオール、芳香族ジカルボン酸、芳香族ヒ
ドロキシルカルボン酸等より得られるポリマーであり、
特に好ましくは、パラヒドロキシ安息香酸と2−ヒドロ
キシ6−ナフトエ酸の構成単位からなる部分が60モ
ル%以上である溶融異方向性芳香族ポリエステルであ
り、特にパラヒドロキシ安息香酸と2−ヒドロキシ
−ナフトエ酸との合計量に対する2−ヒドロキシ6−
ナフトエ酸成分が5〜45モル%である芳香族ポリエス
テルが好ましい。前記成分中には適宜、テレフタル酸、
ビスフェノール及びアミン誘導体等を含んでいてもよ
い。上記の溶融異方向性とは溶融相において光学的異方
性を示すものであり、このような特性は、例えば、ホッ
トステージに載せた試料を窒素雰囲気下で昇温加熱し、
その透光性を観察することにより設定できる。この溶融
異方向性芳香族ポリエステルの繊維は溶融紡糸により得
られ(強度を高めるために熱処理することもある)、パ
ルプは溶融紡糸した繊維をショートカットした後、ミキ
サー、レファイナーで叩解することにより、または易ア
ルカリ減量性ポリエステルを海成分とし、溶融異方向性
芳香族ポリエステルを島成分として複合紡糸して得られ
た海−島型複合繊維をショートカットし、易アルカリ減
量性ポリエステル成分を溶解除去して極細化することに
より得ることができる。上記フッ素樹脂繊維や絶縁繊維
の直径は、通常10μm〜100μm、好ましくは15
μm〜50μm、長さは1mm〜10mm、好ましくは
3mm〜6mmであり、チョップドスランドの形態で
使用することもできる。
The above-mentioned molten anisotropic aromatic polyester is
For example, a polymer obtained from an aromatic diol, an aromatic dicarboxylic acid, an aromatic hydroxylcarboxylic acid, etc.,
Particularly preferably, a p-hydroxybenzoic acid 2-hydro <br/> carboxymethyl - moiety having the structure units of 6-naphthoic acid is melt anisotropic aromatic polyester is 60 mol% or more, especially p-hydroxybenzoic acid And 2-hydroxy - 6
-2-hydroxy - 6- with respect to the total amount with naphthoic acid
An aromatic polyester having a naphthoic acid component of 5 to 45 mol% is preferable. Among the above components, terephthalic acid,
It may contain bisphenol and amine derivatives. The above-mentioned melting anisotropy is what shows optical anisotropy in the melting phase, and such characteristics include, for example, heating a sample placed on a hot stage in a nitrogen atmosphere at elevated temperature,
It can be set by observing its translucency. The fibers of this melt-differentiated aromatic polyester are obtained by melt spinning (sometimes heat-treated to increase strength), and pulp is made by short-cutting the melt-spun fibers and then beating them with a mixer or refiner, or Sea-island type composite fiber obtained by composite spinning with easy-alkali weight-reducing polyester as sea component and molten anisotropic heteropolyester as island component is short-cut to dissolve and remove easily-alkaline weight-reducing polyester component for extra fineness. Can be obtained. The diameter of the fluororesin textiles and insulating fibers typically 10 m - 100 m, preferably 15
Myuemu~50myuemu, length 1 mm to 10 mm, preferably 3 mm to 6 mm, can also be used in the form of Choppudosu bets land.

【0010】本発明において、フッ素樹脂繊維と絶縁繊
維との混成基材には、上記湿式抄造法による混抄紙より
なるが、前記エマルジョン紡糸で得たポリテトラフルオ
ロエチレン繊維とガラス繊維と結着剤(例えば、ポリビ
ニルアルコール繊維)との水分散液を抄紙し、この抄紙
シートをポリテトラフルオロエチレンの融点以上でガラ
ス繊維の融点以下の温度にて熱処理して紡糸時のビスコ
ース及び抄紙時の結着剤を熱分解させ除去すると共に繊
維の交点を融着させ、更にポリテトラフルオロエチレン
の融点以上でガラス繊維の融点以下の温度にて残存カー
ボンを酸化除去したものを使用することが好ましい。こ
のようにして得たポリテトラフルオロエチレン・ガラス
混抄紙の厚さは50μm〜500μm、密度は0.2〜
0.8g/cm3 、平均孔径は30μmである。このポ
リテトラフルオロエチレン・ガラス混抄紙において、ポ
リテトラフルオロエチレン繊維量が多いと樹脂の含浸が
困難になり、ガラス繊維量が多いと誘電率及び誘電損失
率が高くなるので、ポリテトラフルオロエチレンの含有
量を10〜80重量%、好ましくは30〜70重量%と
することが適切である。
[0010] In the present invention, the hybrid substrate of the fluororesin Abura繊 Wei and insulating fibers, from mixed paper by the wet papermaking method
However, an aqueous dispersion of polytetrafluoroethylene fibers obtained by the emulsion spinning, glass fibers, and a binder (for example, polyvinyl alcohol fibers) is made into paper, and the paper sheet is made into glass at a melting point of polytetrafluoroethylene or higher. Heat treatment at a temperature below the melting point of the fiber to thermally decompose and remove viscose during spinning and the binder at the time of papermaking, and to fuse the intersections of the fibers, and further to the glass fiber above the melting point of polytetrafluoroethylene. It is preferable to use the one obtained by oxidizing and removing the residual carbon at a temperature equal to or lower than the melting point. The polytetrafluoroethylene / glass mixed paper thus obtained has a thickness of 50 μm to 500 μm and a density of 0.2 to
The average pore size is 0.8 g / cm 3 , and the average pore size is 30 μm. In this polytetrafluoroethylene / glass mixed paper, when the amount of polytetrafluoroethylene fiber is large, it becomes difficult to impregnate the resin, and when the amount of glass fiber is large, the dielectric constant and the dielectric loss rate become high. It is suitable that the content is 10 to 80% by weight, preferably 30 to 70% by weight.

【0011】厚い絶縁シ−トを得るには(500μm以
上)、抄紙した単層抄紙シ−トを複数枚積層し熱処理
(ポリテトラフルオロエチレンの融点以上でガラス繊維
の融点以下の温度での加熱と残存カ−ボンの酸化除去の
ための加熱)により積層間を融着させ、この積層抄紙シ
−トに樹脂を含浸するか、または単層抄紙シ−トに樹脂
をB-stageにて含浸し、このプリプレグを複数枚積層し
加熱加圧により一体化することができる。
In order to obtain a thick insulating sheet (500 μm or more), a plurality of papermaking single-layer papermaking sheets are laminated and heat-treated (heating at a temperature above the melting point of polytetrafluoroethylene but below the melting point of glass fiber). And heating for oxidation removal of residual carbon) to fuse the layers to impregnate the laminated paper sheet with resin or the single-layer paper sheet with resin at B-stage. Then, a plurality of these prepregs can be laminated and integrated by heating and pressing.

【0012】本発明に係る絶縁シ−トはリジット印刷配
線板やフレキシブル印刷配線板の絶縁基板、高電圧機器
の絶縁、インバ−タ速度制御の低電圧誘導電動機の絶縁
等に好適に使用される。本発明に係る絶縁シ−トを印刷
配線板として使用する場合は、リジット印刷配線板の絶
縁基板の厚みは0.3〜1.6mm、フレキシブル印刷
配線板の絶縁基板の厚みは0.1〜0.2mmとし、含
浸樹脂がB-stageのときに銅箔を貼付け、ついで含浸樹
脂を加熱硬化させ、銅箔をサブトラクティブ法によりエ
ッチンングして回路パタ−ンに形成するか、絶縁シ−ト
表面に接着剤を塗布しておきアルアディティブ法により
無電解銅メッキの回路パタ−ンを形成することができ
る。本発明に係る絶縁シ−トを高電圧機器の絶縁に使用
する場合、例えば、トランスや母線の絶縁に使用する場
合は、樹脂含浸絶縁シ−トをB-stageの状態で巻回し、
ついで含浸樹脂を加熱硬化させると共に巻回層間を一体
化するか、未含浸状態で巻回し、ついで巻回体に樹脂を
真空含浸し、ついで含浸樹脂を加熱硬化することができ
る。
The insulating sheet according to the present invention is preferably used for insulating boards for rigid printed wiring boards and flexible printed wiring boards, insulating high voltage equipment, insulating low voltage induction motors for inverter speed control, and the like. . When the insulating sheet according to the present invention is used as a printed wiring board, the rigid printed wiring board has an insulating substrate with a thickness of 0.3 to 1.6 mm, and the flexible printed wiring board has an insulating substrate with a thickness of 0.1 to 1.6 mm. 0.2 mm, when the impregnating resin is B-stage, a copper foil is attached, then the impregnating resin is heated and cured, and the copper foil is etched by the subtractive method to form a circuit pattern or an insulating sheet. It is possible to form an electroless copper-plated circuit pattern by applying an adhesive agent on the surface by an aladditive method. When the insulation sheet according to the present invention is used for insulation of high-voltage equipment, for example, when it is used for insulation of a transformer or a bus bar, a resin-impregnated insulation sheet is wound in a B-stage state,
Then, the impregnated resin can be heat-cured and the wound layers can be integrated or wound in an unimpregnated state, the wound body can be vacuum-impregnated with the resin, and then the impregnated resin can be heat-cured.

【0013】家庭用電気機器に組み込む誘導電動機にお
いては、騒音軽減のために可聴周波数帯域よりも高い周
波数のPWM制御方式のインバ−タで速度制御すること
が有効である。而して、インバ−タ部のトランジスタ−
のスイッチング速度が高速となって過渡的漏洩電流が大
きくなるので、本発明に係る低誘電率絶縁シ−トをその
誘導電動機の絶縁材、すなわち、スロットライナ−、ウ
エッジ、段間絶縁材、結束用コ−ド、口出し線の絶縁ス
リ−ブとして有効に使用できる。特に、電気冷凍機にお
ける冷媒圧縮機用誘導電動機の場合、近来、冷媒がHF
C等の新冷媒に代替され、冷媒に混合する潤滑油が旧来
の鉱油に較べ吸水性の大きいポリアルキレングリコ−
ル、ポリオ−ルエステル、ポリオ−ルエ−テルまたはカ
−ポネ−ト等に代替されつつあり、上記スロットライナ
−等には耐加水分解性、低オリゴマ−性(オリゴマ−が
冷媒中に溶出し、これが原因で循環系パイプの流通性低
下やモ−タロック等が惹起されるのを抑制する)を付与
することが重要であり、絶縁シ−トの片面または両面に
耐加水分解性、低オリゴマ−性の絶縁フィルムや絶縁布
(織布、不織布)を積層することが望ましく、この絶縁
フィルムや絶縁布には、ポリエチレンテレフタレ−ト、
ポリエチレンナフタレ−ト、ポリフェニレンサルフアィ
ド、溶融異方向性芳香族ポリエステル、ポリアミド、ポ
リイミド、ポリテトラフルオロエチレン、ポリエ−テル
ニトリルまたはポリスチレンのフィルム、溶融異方向性
芳香族ポリエステル繊維紙〔(株)クラレ社製ベクル
ス〕、全芳香族ポリアミド繊維紙(例えば、du Pond社
製ノ−メックス紙)等を使用できる。
In an induction motor incorporated in a household electric appliance, it is effective to control the speed with an inverter of a PWM control system having a frequency higher than an audible frequency band in order to reduce noise. Thus, the transistor in the inverter section
Since the switching speed is increased and the transient leakage current is increased, the low dielectric constant insulating sheet according to the present invention is used as an insulating material for the induction motor, that is, a slot liner, a wedge, an interstage insulating material, and a binding material. It can be effectively used as an insulation sleeve for cords and lead wires. In particular, in the case of an induction motor for a refrigerant compressor in an electric refrigerator, recently, the refrigerant is HF.
The lubricating oil to be mixed with the new refrigerant such as C is mixed with the refrigerant and has a higher water absorption than the conventional mineral oil.
, Slot-liners, etc. are resistant to hydrolysis and low oligomers (oligomers are eluted in the refrigerant). It is important to prevent the flowability of the circulation pipe from decreasing and the occurrence of motor lock etc. due to this, and it is important to impart hydrolysis resistance and low oligomers to one side or both sides of the insulating sheet. It is desirable to laminate a negative insulating film or insulating cloth (woven cloth, non-woven cloth). The insulating film and insulating cloth are made of polyethylene terephthalate,
Polyethylene naphthalate, polyphenylene sulfide, fused anisotropic polyester, polyamide, polyimide, polytetrafluoroethylene, polyethylene nitrile or polystyrene film, fused anisotropic polyester fiber paper [Kuraray Co., Ltd.] Veculus manufactured by the company, wholly aromatic polyamide fiber paper (for example, Nomex paper manufactured by du Pond) and the like can be used.

【0014】本発明に係る絶縁シ−トにおいては、繊維
基材にポリテトラフルオロエチレン繊維と他の繊維との
混抄紙を用いており、ポリテトラフルオロエチレン繊維
の低誘電率及び低誘電損失率のために低誘電性化を図り
得、また他の繊維にポリテトラフルオロエチレン繊維よ
りも含浸性に優れたガラス繊維等を用いているので、樹
脂をボイドレスでかつ安定な結着性で含浸でき、低誘電
性で低吸水性の絶縁シ−トを提供できる。このことは次
ぎの実施例と比較例との対比からも明らかである。
In the insulating sheet according to the present invention, a mixed paper of polytetrafluoroethylene fiber and another fiber is used as a fiber base material, and the low dielectric constant and low dielectric loss factor of the polytetrafluoroethylene fiber are used. For this reason, it is possible to lower the dielectric constant, and since other fibers such as glass fiber, which has better impregnation properties than polytetrafluoroethylene fibers, are used, it is possible to impregnate the resin with voidless and stable binding properties. It is possible to provide an insulating sheet having a low dielectric constant and a low water absorption. This is clear from the comparison between the following examples and comparative examples.

【0015】[0015]

【実施例】〔実施例1〕ポリテトラフルオロエチレン繊
維(東レファインケミカル社製繊維、外径15μm、長
さ3mmを使用)50重量%とガラス繊維(繊維外径1
5μm、長さ6mmを使用)50重量%とを結着剤(ポ
リビニルアルコ−ル繊維6μm)と共に水に分散させ、
この水分散液を抄紙しこの抄紙シ−トをポリテトラフル
オロエチレンの融点以上でガラス繊維の融点以下の温度
にて熱処理して結着剤を熱分解させ除去すると共に繊維
の交点を融着させ、更にポリテトラフルオロエチレンの
融点以上でガラス繊維の融点以下の温度にて数10時間
加熱し残存カ−ボンを酸化除去して厚さ100μmの混
抄紙を得た。この混抄紙に低誘電性ポリイミド樹脂組成
物〔日東電工(株)製ポリイミドAワニス8〕を含浸乾
燥させてB-stageのプリプレグを得、このプリプレグを
5枚重ね合わせ、175℃×50kg/cm2×120
分で加熱加圧して低誘電性絶縁シ−トを作成した。
[Example 1] 50% by weight of polytetrafluoroethylene fiber (fiber made by Toray Fine Chemical Co., outer diameter 15 μm, length 3 mm) and glass fiber (fiber outer diameter 1
5 μm, length 6 mm) and 50% by weight are dispersed in water together with a binder (polyvinyl alcohol fiber 6 μm),
This aqueous dispersion is made into paper, and the papermaking sheet is heat-treated at a temperature not lower than the melting point of polytetrafluoroethylene and not higher than the melting point of the glass fiber to thermally decompose and remove the binder and fuse the intersections of the fibers. Further, by heating for several tens of hours at a temperature above the melting point of polytetrafluoroethylene and below the melting point of the glass fiber, the residual carbon was oxidized and removed to obtain a mixed paper having a thickness of 100 μm. This mixed paper was impregnated with a low dielectric polyimide resin composition [Polyimide A varnish 8 manufactured by Nitto Denko Corporation] and dried to obtain a B-stage prepreg. Five prepregs were superposed on each other and 175 ° C. × 50 kg / cm. 2 x 120
A low dielectric insulating sheet was prepared by heating and pressing for minutes.

【0016】〔実施例2〜5〕実施例1に対し、両繊維
の重量割合をガラス繊維30重量%(実施例2)、ガラ
ス繊維40重量%(実施例3)、ガラス繊維60重量%
(実施例4)、ガラス繊維70重量%(実施例5)とし
た以外、実施例1と同様にして低誘電性ポリイミド樹脂
組成物含浸シ−トを得た。
[Examples 2 to 5] Compared with Example 1, the weight ratio of both fibers is 30% by weight of glass fiber (Example 2), 40% by weight of glass fiber (Example 3), 60% by weight of glass fiber.
(Example 4) A low dielectric polyimide resin composition-impregnated sheet was obtained in the same manner as in Example 1 except that glass fiber was 70% by weight (Example 5).

【0017】〔比較例1〕実施例1に対し、ポリテトラ
フルオロエチレン繊維を100重量%としガラス繊維は
無添加とした以外、実施例1と同様に含浸・加熱加圧を
行って低誘電性ポリイミド樹脂組成物含浸ポリテトラフ
ルオロエチレン繊維シ−トを得た。 〔比較例2〕実施例1に対し、ガラス繊維を100重量
%としポリテトラフルオロエチレン繊維は無添加とした
以外、実施例1と同様に含浸・加熱加圧を行って低誘電
性ポリイミド樹脂組成物含浸ガラス繊維シ−トを得た。
[Comparative Example 1] In comparison with Example 1, impregnation and heating / pressurization were carried out in the same manner as in Example 1 except that polytetrafluoroethylene fiber was 100% by weight and glass fiber was not added. A polytetrafluoroethylene fiber sheet impregnated with the polyimide resin composition was obtained. Comparative Example 2 A low dielectric polyimide resin composition was prepared by impregnating and heating and pressing in the same manner as in Example 1 except that the glass fiber was 100% by weight and the polytetrafluoroethylene fiber was not added. A product-impregnated glass fiber sheet was obtained.

【0018】これらの実施例品及び比較例品について
(試料数はそれぞれ10個)、25℃,60Hz、1MHz、
100MHz、で誘電率及びtanδを測定し、更にはんだ耐熱
試験(温度約300℃の溶融はんだ浴に2分間浸漬し、
異常の有無をチエック)を行ったところ、表1の通りで
あった。
Regarding these example products and comparative example products (10 samples each), 25 ° C., 60 Hz, 1 MHz,
Dielectric constant and tan δ are measured at 100MHz, and solder heat resistance test (immersion in a molten solder bath at a temperature of about 300 ℃ for 2 minutes,
When checking whether there is any abnormality, the results are shown in Table 1.

【0019】[0019]

【表1】 [Table 1]

【0020】比較例品1では、はんだ耐熱試験の結果、
繊維と含浸樹脂との界面が剥離し、吸水性の低下が顕著
であり、絶縁抵抗や絶縁耐圧を保証し得ない。また、比
較例品2では、繊維基材がガラス繊維単独であるために
誘電率及び誘電損失率が高く低誘電性を達成できない。
これに対し、実施例品においては、ガラス繊維と含浸樹
脂との優れた結着性のためにはんだ耐熱試験に耐え得、
ポリテトラフルオロエチレンの低誘電率及び低誘電損失
率のために低誘電性も良好に達成されている。
In the comparative example product 1, the result of the solder heat resistance test was
The interface between the fiber and the impregnated resin is peeled off, and the water absorption is significantly reduced, so that the insulation resistance and the withstand voltage cannot be guaranteed. Further, in Comparative Example Product 2, since the fiber base material is glass fiber alone, the dielectric constant and the dielectric loss rate are high and low dielectric properties cannot be achieved.
On the other hand, in the example product, it can withstand the solder heat resistance test due to the excellent binding property between the glass fiber and the impregnated resin,
Low dielectric properties are also well achieved due to the low dielectric constant and low dielectric loss of polytetrafluoroethylene.

【0021】〔実施例6〜11〕実施例1〜5に対し、
ガラス混抄紙に代え溶融液晶芳香族ポリエステル繊維
(クラレ社製ベクトラン繊維、耐熱温度260℃、。)
を使用し、混抄紙として、前記ポリテトラフルオロエチ
レン繊維とベクトラン繊維とを所定の重量比で結着剤と
共に水に分散させ、この水分散液を抄紙しこの抄紙シ−
トをベクトラン繊維の融点よりもやや高い温度にて熱処
理して結着剤を熱分解させ除去すると共に繊維の交点を
融着させて厚さ100μmの混抄紙を得、実施例1〜5
と同様に低誘電性ポリイミド樹脂組成物を含浸乾燥させ
てB-stageのプリプレグを得、このプリプレグを5枚重
ね合わせ、175℃×50kg/cm2×120分で加
熱加圧して低誘電性絶縁シ−トを製作した。 〔比較例3〕実施例6〜11に対し、ベクトラン繊維を
100重量%としポリテトラフルオロエチレン繊維は無
添加とした以外、実施例6〜11と同じとして低誘電性
ポリイミド樹脂組成物含浸ベクトラン繊維シ−トを得
た。
[Examples 6 to 11] In contrast to Examples 1 to 5,
Melted liquid crystal aromatic polyester fiber (Vectran fiber manufactured by Kuraray Co., Ltd., heat-resistant temperature 260 ° C.) instead of glass mixed paper.
As a mixed paper, the above polytetrafluoroethylene fiber and vectran fiber are dispersed in water together with a binder at a predetermined weight ratio, and the aqueous dispersion is made into a papermaking paper.
Of the Vectran fiber was heat-treated at a temperature slightly higher than the melting point of the Vectran fiber to thermally decompose and remove the binder, and the fiber intersection was fused to obtain a mixed paper having a thickness of 100 μm.
In the same manner as above, a low dielectric polyimide resin composition was impregnated and dried to obtain a B-stage prepreg. Five prepregs were stacked and heated and pressed at 175 ° C × 50 kg / cm 2 × 120 minutes for low dielectric insulation. I made a sheet. [Comparative Example 3] Vectran fibers impregnated with a low dielectric polyimide resin composition as in Examples 6 to 11 except that Vectran fibers were 100% by weight and no polytetrafluoroethylene fibers were added to Examples 6 to 11. I got a seat.

【0022】これらの実施例品及び比較例品について
(試料数はそれぞれ10個)、上記と同様に誘電率及び
tanδを測定し、更にはんだ耐熱試験を行ったところ、
比較例品3も各実施例品と同様はんだ耐熱試験は良好で
あった。しかし比較例品3では、繊維基材がベクトラン
繊維単独であるために誘電率及び誘電損失率が高く、低
誘電性を達成できないなかったのに対し、実施例品6〜
11においては、ポリテトラフルオロエチレンの低誘電
率及び低誘電損失率のために低誘電性も良好に達成でき
た。
Regarding these example products and comparative example products (the number of samples is 10 each), the dielectric constant and
When tan δ was measured and a solder heat resistance test was performed,
The comparative example product 3 was also good in the solder heat resistance test as in each example product. However, in Comparative Example Product 3, since the fiber base material was Vectran fiber alone, the dielectric constant and the dielectric loss rate were high, and low dielectric properties could not be achieved.
In No. 11, low dielectric properties could be well achieved due to the low dielectric constant and low dielectric loss ratio of polytetrafluoroethylene.

【0023】[0023]

【発明の効果】本発明に係る樹脂含浸絶縁シ−トにおい
ては、繊維基材に低誘電率・低誘電損失率のポリテトラ
フルオロエチレン繊維を含有する混抄紙を用いているか
ら、そのポリテトラフルオロエチレン繊維のために低誘
電性を保証でき、また混抄紙にポリテトラフルオロエチ
レン繊維よりも含浸樹脂に対する親和性若しくは結着性
に優れた繊維、例えばガラス繊維を含有させてあるか
ら、繊維基材と含浸樹脂とを強固・安定に結着でき、安
定な低吸湿性とこの低吸湿性に基づく優れた絶縁抵抗や
絶縁耐圧を保証できる。
In the resin-impregnated insulation sheet according to the present invention, since a mixed paper containing a polytetrafluoroethylene fiber having a low dielectric constant and a low dielectric loss rate is used as a fiber base material, the polytetrafluoroethylene fiber is used. Since the fluoroethylene fiber can guarantee a low dielectric property, and the mixed paper contains a fiber having a higher affinity or binding property for the impregnated resin than the polytetrafluoroethylene fiber, for example, glass fiber, The material and the impregnated resin can be firmly and stably bound, and stable low hygroscopicity and excellent insulation resistance and withstand voltage based on this low hygroscopicity can be guaranteed.

【0024】また、低誘電性を気孔含有に依存すること
なく達成でき、リント配線板の実装はんだ付けを気孔
破裂等の畏れなく安全に行い得、また、高電圧下での誘
電損失の低減をボイド放電等の畏れなく良好に行い得
る。
Further, be achieved without depending low dielectric into the pores containing, reducing the dielectric loss of the mounting soldering print wiring board securely performed obtained without fear of such pores burst, also at high voltages Can be satisfactorily performed without fear of void discharge.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る絶縁シ−トを示す図面である。FIG. 1 is a view showing an insulating sheet according to the present invention.

【符号の説明】[Explanation of symbols]

1 繊維基材 2 含浸樹脂 1 Fiber substrate 2 Impregnating resin

───────────────────────────────────────────────────── フロントページの続き (72)発明者 山本 泰正 大阪市北区天満三丁目11番12号 丸正株 式会社内 (72)発明者 廣瀬 壽一 静岡市用宗巴町3番1号 株式会社巴川 製紙所技術研究所内 (72)発明者 土田 実 静岡市用宗巴町3番1号 株式会社巴川 製紙所技術研究所内 (56)参考文献 特開 昭62−90808(JP,A) 特開 昭57−124811(JP,A) 特開 平4−257397(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01B 3/16 - 3/56 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasumasa Yamamoto 3-11-12 Tenma, Kita-ku, Osaka Marusho Co., Ltd. (72) Inventor Hirokazu Toshiichi Shizuoka City Nozomicho 3-1, Tomoegawa Co., Ltd. Inside the Paper Mill Technical Laboratory (72) Inventor Minoru Tsuchida No. 3 Somunecho for Shizuoka City Tomagawa Co., Ltd. Inside the Paper Mill Technical Laboratory (56) Reference JP 62-90808 (JP, A) JP 57 -124811 (JP, A) JP-A-4-257397 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01B 3/16-3/56

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】繊維基材にポリイミド樹脂組成物、ビスマ
レイミド樹脂組成物、ポリフェニレンエーテル樹脂組成
物、ウレタン樹脂組成物及びエポキシ樹脂組成物より選
択された含浸剤を含浸したシート状絶縁体であり、前記
繊維基材に、フッ素樹脂繊維よりも上記含浸剤に対する
親和性若しくは接着性に優れた絶縁繊維とフッ素樹脂繊
維との湿式抄造法による混抄紙を使用したことを特徴と
する絶縁シート。
1. A polyimide resin composition and a bismuth on a fiber base material.
Reimide resin composition, polyphenylene ether resin composition
Material, urethane resin composition and epoxy resin composition
A sheet-shaped insulator impregnated with a selected impregnating agent, wherein the fibrous base material is formed by a wet papermaking method of an insulating fiber and a fluororesin fiber having a higher affinity or adhesiveness for the impregnating agent than the fluororesin fiber. An insulating sheet characterized by using a mixed paper.
【請求項2】繊維基材にポリイミド樹脂組成物、ビスマ
レイミド樹脂組成物、ポリフェニレンエーテル樹脂組成
物、ウレタン樹脂組成物及びエポキシ樹脂組成物より選
択された含浸剤を含浸したシート状絶縁体であり、前記
繊維基材に、ガラス繊維、芳香族ポリエステル繊維、全
芳香族ポリアミド繊維、ポリフェニレンスルフィド繊
維、ポリパラフェニレンベンゾビスオキサゾール繊維の
何れか一種または二種以上の絶縁繊維とフッ素樹脂繊維
との湿式抄造法による混抄紙を使用したことを特徴とす
る絶縁シート。
2. A polyimide resin composition and a bismuth on a fiber base material.
Reimide resin composition, polyphenylene ether resin composition
Material, urethane resin composition and epoxy resin composition
A sheet-like insulator impregnated with a selected impregnating agent, wherein the fiber base material is any one of glass fiber, aromatic polyester fiber, wholly aromatic polyamide fiber, polyphenylene sulfide fiber, and polyparaphenylene benzobisoxazole fiber. Alternatively, an insulating sheet characterized by using a mixed paper made by a wet papermaking method of two or more kinds of insulating fibers and fluororesin fibers.
【請求項3】絶縁繊維がガラス繊維であり、フッ素樹脂
繊維がポリテトラフルオロエチレン繊維である請求項1
または2記載の絶縁シート。
3. The insulating fiber is glass fiber and the fluororesin fiber is polytetrafluoroethylene fiber.
Or the insulating sheet according to 2.
【請求項4】プリント回路板の基板に使用する請求項1
〜3の何れかに記載の絶縁シート。
4. Use as a substrate of a printed circuit board.
The insulating sheet according to any one of 1 to 3.
【請求項5】インバータ制御機器の絶縁体に使用する請
求項1〜3の何れかに記載の絶縁シート。
5. A contract used for an insulator of an inverter control device
The insulating sheet according to any one of claims 1 to 3.
JP32046397A 1997-11-05 1997-11-05 Insulation sheet Expired - Fee Related JP3442631B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32046397A JP3442631B2 (en) 1997-11-05 1997-11-05 Insulation sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32046397A JP3442631B2 (en) 1997-11-05 1997-11-05 Insulation sheet

Publications (2)

Publication Number Publication Date
JPH11144529A JPH11144529A (en) 1999-05-28
JP3442631B2 true JP3442631B2 (en) 2003-09-02

Family

ID=18121740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32046397A Expired - Fee Related JP3442631B2 (en) 1997-11-05 1997-11-05 Insulation sheet

Country Status (1)

Country Link
JP (1) JP3442631B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7015159B2 (en) * 2001-07-24 2006-03-21 E. I. Du Pont De Nemours And Company Nonwoven material for low friction bearing surfaces
JP4580704B2 (en) * 2004-07-08 2010-11-17 株式会社巴川製紙所 Base material for electrical insulation, method for producing the same, and prepreg and printed wiring board using the base material
JPWO2007023944A1 (en) * 2005-08-26 2009-03-05 日本ゼオン株式会社 Composite resin molded body, laminate, multilayer circuit board, and electronic device
JP4954631B2 (en) * 2006-07-28 2012-06-20 ソマール株式会社 Method for manufacturing power insulating device, power insulating device and insulating film
WO2018199604A1 (en) * 2017-04-27 2018-11-01 주식회사 엘지화학 Insulating member, method for manufacturing insulating member, and method for manufacturing cylindrical battery comprising insulating member

Also Published As

Publication number Publication date
JPH11144529A (en) 1999-05-28

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