JP3428472B2 - Printed board unit and method of manufacturing the printed board unit - Google Patents

Printed board unit and method of manufacturing the printed board unit

Info

Publication number
JP3428472B2
JP3428472B2 JP34453298A JP34453298A JP3428472B2 JP 3428472 B2 JP3428472 B2 JP 3428472B2 JP 34453298 A JP34453298 A JP 34453298A JP 34453298 A JP34453298 A JP 34453298A JP 3428472 B2 JP3428472 B2 JP 3428472B2
Authority
JP
Japan
Prior art keywords
board unit
chip component
circuit board
printed board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34453298A
Other languages
Japanese (ja)
Other versions
JP2000174063A (en
Inventor
延弘 今泉
英士 徳平
仁昭 伊達
真 佐々木
友久 八木
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP34453298A priority Critical patent/JP3428472B2/en
Publication of JP2000174063A publication Critical patent/JP2000174063A/en
Application granted granted Critical
Publication of JP3428472B2 publication Critical patent/JP3428472B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電子部品を搭載したプリ
ント板ユニットに係り、特に電子部品のハンダバンプと
プリント基板のパッドとを電気接続した後、電子部品と
プリント基板との対向領域に樹脂を充填したプリント板
ユニットとその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board unit on which electronic parts are mounted, and more particularly, after electrically connecting a solder bump of an electronic part and a pad of a printed board, a resin is applied to a region where the electronic part and the printed board face each other. The present invention relates to a filled printed board unit and a manufacturing method thereof.

【０００２】[0002]

【従来の技術】プリント板ユニットはプリント基板に電
子部品を半田接続して実装している。最近このプリント
板ユニットは高密度実装化が進んでいる。このためプリ
ント基板のパッドは増々、微細になっている。またプリ
ント基板に搭載される電子部品、特にＩＣ、ＬＳＩ、Ｍ
ＰＵ等のチップ部品は一層小型になり、チップ部品のハ
ンダバンプもまた、微細になっている。従ってプリント
基板のパッドとチップ部品のハンダバンプとの接続面積
および、プリント基板とチップ部品との隙間が狭くなっ
ている。2. Description of the Related Art In a printed circuit board unit, electronic components are mounted on a printed circuit board by soldering. Recently, this printed circuit board unit has been highly integrated. Therefore, the pads on the printed circuit board are becoming finer and finer. In addition, electronic components mounted on the printed circuit board, especially IC, LSI, M
Chip components such as PU are becoming smaller, and the solder bumps of the chip components are also becoming finer. Therefore, the connection area between the pad of the printed board and the solder bump of the chip component and the gap between the printed board and the chip component are narrowed.

【０００３】またチップ部品の機能は向上し、これに伴
い消費電力が大きくなっている。プリント基板およびチ
ップ部品は、この消費電力の熱によって熱せられて熱膨
張する。しかしプリント基板およびチップ部品の熱膨張
率は互いに異なっている。従って、プリント板ユニット
はプリント基板のパッドとチップ部品のハンダバンプと
のはずれ及び導通不良を発生する。Further, the functions of chip parts have been improved, and the power consumption has been increased accordingly. The printed circuit board and the chip component are heated by the heat of the power consumption and thermally expand. However, the thermal expansion coefficients of the printed circuit board and the chip component are different from each other. Therefore, in the printed circuit board unit, the pads of the printed circuit board and the solder bumps of the chip component are dislocated from each other and a conduction failure occurs.

【０００４】このための解決技術としては特開昭６３−
３１６４４７号公報、特開平６−２３２２１２号公報に
記載されたプリント板ユニットがある。これらプリント
板ユニットでは、チップ部品のハンダバンプとプリント
基板のパッドとが電気接続された後、電子部品とプリン
ト基板との対向領域に樹脂が充填されている。As a solution technique for this, Japanese Patent Laid-Open No. 63-
There are printed board units described in Japanese Patent No. 316447 and Japanese Patent Laid-Open No. 6-232212. In these printed board units, after the solder bumps of the chip component and the pads of the printed circuit board are electrically connected, resin is filled in a region where the electronic component and the printed circuit board face each other.

【０００５】この充填用の樹脂の役割は下記の通りであ
る。 １）チップ部品とプリント基板とを接着補強する。 ２）ハンダバンプとパッドとの接続部への埃、塵の付着
を防止する。 ３）プリント基板およびチップ部品の熱膨張率の差異を
樹脂の弾性によって緩和する。The role of this filling resin is as follows. 1) The chip component and the printed board are bonded and reinforced. 2) Prevent dust from adhering to the connection between the solder bump and the pad. 3) The difference in the coefficient of thermal expansion between the printed circuit board and the chip component is relieved by the elasticity of the resin.

【０００６】結果としてチップ部品とプリント基板との
はずれ及び導通不良を防止する。As a result, the chip component and the printed circuit board are prevented from being separated from each other and from defective conduction.

【０００７】[0007]

【発明が解決しようとする課題】しかし昨今ではチップ
部品の消費電力はさらに大きくなっている。このために
プリント基板およびチップ部品の熱膨張率の差異を緩和
せねばならない。対策として、充填用の樹脂は無機フィ
ラーを添加され樹脂の弾性率を低下させられている。し
かし添加されることによって充填用の樹脂は粘度及びチ
クソ性を増加し、充填用樹脂の流動性が悪くなる。結果
として、充填用樹脂はチップ部品とプリント基板との対
向領域全部に充填されにくくなくなる。However, in recent years, the power consumption of chip components has become even greater. For this reason, the difference in the coefficient of thermal expansion between the printed circuit board and the chip component must be alleviated. As a countermeasure, an inorganic filler is added to the filling resin to reduce the elastic modulus of the resin. However, when added, the filling resin increases in viscosity and thixotropy, and the fluidity of the filling resin deteriorates. As a result, the filling resin does not easily fill the entire area where the chip component and the printed board face each other.

【０００８】下記は弾性率を低くするために無機フィラ
ーを添加した充填用樹脂の構成成分である。The following are constituent components of a filling resin to which an inorganic filler is added in order to lower the elastic modulus.

【０００９】 エポキシ主剤: ビスフェノールＦ １００重量部 硬化剤 : Ｍ−ＨＨＰＡ １１０重量部 反応性希釈剤: 樹脂量 １０重量部 無機フィラー: シリカ ３３０重量部 上記の充填用樹脂の粘度は約２００００cps 、チクソ性
は１．０５〜１．１０である。また弾性率は約６ＧＰａ
から約１３ＧＰａである。Epoxy main agent: Bisphenol F 100 parts by weight Curing agent: M-HHPA 110 parts by weight Reactive diluent: Resin amount 10 parts by weight Inorganic filler: Silica 330 parts by weight The above-mentioned filling resin has a viscosity of about 20,000 cps and thixotropic properties. Is 1.05 to 1.10. The elastic modulus is about 6 GPa
To about 13 GPa.

【００１０】この充填用樹脂を使用して下記の方法でプ
リント板ユニットを作った。たとえばプリント基板の材
料はガラスエポキシ樹脂であり、チップ部品は２０mm正
方角のＭＰＵ部品で具体的には富士通株式会社製の製品
名ＣＳ７００である。またチップ部品をプリント基板に
搭載した状態でチップ部品とプリント基板との隙間は約
０．１mmである。そして上記充填用樹脂はこれらのチッ
プ部品とプリント基板との隙間にデイスペンサー装置等
にて充填される。Using this filling resin, a printed board unit was made by the following method. For example, the material of the printed circuit board is glass epoxy resin, and the chip part is a 20 mm square MPU part, specifically, the product name CS700 manufactured by Fujitsu Limited. In addition, the gap between the chip component and the printed circuit board is about 0.1 mm when the chip component is mounted on the printed circuit board. Then, the filling resin is filled in the gap between these chip components and the printed circuit board by a dispenser device or the like.

【００１１】この結果、上記充填用樹脂は樹脂温度が６
０度Ｃでチップ部品の対向領域の約３分の１しか充填で
きなかった。また樹脂温度が１００度Ｃでチップ部品の
対向領域の約３分の２しか充填できなかった。従ってこ
の充填用樹脂は上記充填樹脂の役割を果たせない。As a result, the filling resin has a resin temperature of 6
At 0 ° C., only about one third of the facing area of the chip component could be filled. Moreover, when the resin temperature was 100 ° C., only about two-thirds of the facing area of the chip component could be filled. Therefore, the filling resin cannot play the role of the filling resin.

【００１２】本発明の目的はプリント板ユニットの高密
度実装化、チップ部品の小型化が進み、そしてチップ部
品とプリント基板との隙間が狭くなってもチップ部品と
プリント基板との対向領域全部に充填用樹脂を充填で
き、またチップ部品の発熱量が増えてもチップ部品の熱
膨張率とプリント基板との熱膨張率の差異を緩和してチ
ップ部品のはずれ及び導通不良を防止できる新しいプリ
ント板ユニットを提供するものである。The object of the present invention is to achieve high-density mounting of printed board units, miniaturization of chip parts, and even if the gap between the chip parts and the printed board becomes narrow, the entire area where the chip parts and the printed board face each other. A new printed circuit board that can be filled with a resin for filling and that can reduce the difference between the coefficient of thermal expansion of the chip component and the coefficient of thermal expansion of the printed circuit board even when the amount of heat generated by the chip component increases to prevent chip component peeling and conduction failure. It provides a unit.

【００１３】[0013]

【課題を解決するための手段】請求項１に記載の発明
は、導電端子を有する電子部品と導通端子を有するプリ
ント基板とを電気接続するプリント板ユニットにおい
て、絶縁性の布織体を介して前記電子部品の導電端子と
前記プリント基板の導通端子とを接続し、かつ、接続間
隙に樹脂を充填してなる構成を特徴としている。従って
チップ部品とプリント基板との対向領域全部に樹脂を充
填でき、そしてチップ部品の発熱量が増えてもチップ部
品とプリント基板とのはずれ、及び導通不良を防止でき
る。According to a first aspect of the present invention, there is provided a printed circuit board unit for electrically connecting an electronic component having a conductive terminal and a printed circuit board having a conductive terminal, through an insulating cloth woven body. It is characterized in that the conductive terminal of the electronic component and the conductive terminal of the printed circuit board are connected to each other, and the connection gap is filled with resin. Therefore, the entire area where the chip component and the printed circuit board face each other can be filled with the resin, and even if the amount of heat generated by the chip component is increased, the chip component and the printed circuit board can be prevented from coming off and conduction failure can be prevented.

【００１４】請求項２に記載の発明は、布織体の熱膨張
率がマイナス６．２ppm からプラス１０．０ppm である
構成を特徴としている。従って、チップ部品の熱膨張率
とプリント基板との熱膨張率の差異を緩和できる。The invention according to claim 2 is characterized in that the coefficient of thermal expansion of the woven fabric is from minus 6.2 ppm to plus 10.0 ppm. Therefore, the difference between the coefficient of thermal expansion of the chip component and the coefficient of thermal expansion of the printed board can be reduced.

【００１５】請求項３に記載の発明は、布織体の繊維密
度が縦２５から５０本／mm、横２５から５０本／mmで、
前記繊維の直径は約５μm 〜約２５μm Φである構成を
特徴としている。従って、長繊維布織体を介してチップ
部品のハンダバンプと前記プリント基板のパッドとを接
続しても導通不良にならない。According to a third aspect of the present invention, the fiber density of the woven fabric is 25 to 50 fibers / mm in the longitudinal direction and 25 to 50 fibers / mm in the lateral direction,
The fibers are characterized by having a diameter of about 5 μm to about 25 μm Φ. Therefore, even if the solder bumps of the chip component and the pads of the printed circuit board are connected to each other through the long fiber cloth woven body, the conduction failure does not occur.

【００１６】請求項４に記載の発明は、布織体がアルミ
ナ、シリカ、アルミナ- シリカ化合物、アルミナ- シリ
カ- ボリア化合物、炭化けい素、ちっ化ケイ素、サファ
イア、アラミド樹脂の内少なくとも１つからなる構成を
特徴としている。従って無機フィラーを使用することな
くチップ部品の熱膨張率とプリント基板との熱膨張率の
差異を緩和することができる。In a fourth aspect of the present invention, the fabric body is made of at least one of alumina, silica, alumina-silica compound, alumina-silica-boria compound, silicon carbide, silicon fluoride, sapphire and aramid resin. It is characterized by Therefore, the difference between the coefficient of thermal expansion of the chip component and the coefficient of thermal expansion of the printed board can be alleviated without using the inorganic filler.

【００１７】請求項５に記載の発明は、一方の端子上に
無機長繊維から成る布織体を埋め込む形で半田を形成す
る工程と、接続すべき両方の端子間を半田接続する工程
と、接続部の間隙に樹脂を充填する工程とを有すること
を特徴としている。従って無機長繊維を介してチップ部
品とプリント基板とを半田接続でき、そしてチップ部品
とプリント基板との対向領域全部に樹脂を充填したプリ
ント板ユニットを製造できる。According to a fifth aspect of the present invention, a step of forming a solder by embedding a cloth woven body made of inorganic long fibers on one terminal, and a step of connecting both terminals to be connected by soldering, And a step of filling a resin in the gap between the connecting portions. Therefore, the chip component and the printed board can be connected by soldering through the inorganic long fiber, and the printed board unit in which the entire area where the chip component and the printed board face each other is filled with resin can be manufactured.

【００１８】[0018]

【発明の実施の形態】本発明の実施例を図面に基づいて
説明する。 ＜第１の実施例＞図１は第１の実施例に係るプリント板
ユニットの側断面図である。プリント板ユニットは通常
複数の電子部品を実装されるが、内容を理解し易くする
ために１個の部品を実装した図面である。そしてチップ
部品の各スッタドバンプ間を切断した図面である。Embodiments of the present invention will be described with reference to the drawings. <First Embodiment> FIG. 1 is a side sectional view of a printed circuit board unit according to the first embodiment. The printed board unit is usually mounted with a plurality of electronic parts, but in the drawing, one part is mounted for easy understanding of the contents. And it is the drawing which cut | disconnected between each stubbed bump of a chip component.

【００１９】１はプリント板ユニット、２はプリント基
板、２１はプリント基板のパッド（導通端子）、３は布
織体、４はチップ部品、４１はチップ部品のハンダバン
プ（導電端子）、５は充填用樹脂である。プリント板ユ
ニット１は大略、所要の回路パターンを有する１層また
は多層のプリント基板２と布織体３とチップ部品４とか
らプリント板ユニット１として構成されている。プリン
ト基板２のパッド２１とチップ部品４のハンダバンプ４
１とは布織体３を介してハンダ付けされている。そして
プリント基板２とチップ部品４との隙間全部に充填用樹
脂５が充填されている。1 is a printed circuit board unit, 2 is a printed circuit board, 21 is a printed circuit board pad (conductive terminal), 3 is a cloth body, 4 is a chip component, 41 is a solder bump (conductive terminal) of the chip component, and 5 is a filling. Resin. The printed board unit 1 is generally configured as a printed board unit 1 from a single-layer or multilayer printed board 2 having a required circuit pattern, a cloth body 3, and a chip component 4. The pads 21 of the printed circuit board 2 and the solder bumps 4 of the chip component 4
1 is soldered through a cloth body 3. The filling resin 5 is filled in the entire gap between the printed circuit board 2 and the chip component 4.

【００２０】図２は第１の実施例に係る布織体の構成図
である。布織体３は具体的には三井鉱山マテリアル株式
会社製の製品名ＡＬＭＡＸ、３Ｍ株式会社製の製品名Ｎ
extel 610 、製品名Ｎextel 440 、製品名Ｎcxtcl 312
、Ｓａｐｈｉｋｏｎ株式会社製の製品名Ｓａｐｈｉｋ
ｏｎ、住友化学株式会社製の製品名ＡＬＴＥＸ等であ
る。FIG. 2 is a block diagram of the cloth weave body according to the first embodiment. The cloth body 3 is specifically a product name ALMAX manufactured by Mitsui Mining Materials Co., Ltd. and a product name N manufactured by 3M Co., Ltd.
extel 610, product name Nextel 440, product name Ncxtcl 312
, A product name Saphik manufactured by Saphikon Co., Ltd.
on, product name ALTEX manufactured by Sumitomo Chemical Co., Ltd.

【００２１】布織体３の形状は縦幅Ｈ約２０mm、横幅Ｗ
約２０mmであり、搭載チップ部品と大略同形状で同寸法
である。そして格子状に繊維３１の縦糸と横糸とが交互
に編み込まれたものである。この布織体３の繊維密度は
縦２５から５０本／mm、横２５から５０本／mm程度であ
る。繊維３１は例えば無機の材料であればアルミナ、シ
リカ、アルミナ- シリカ化合物、アルミナ- シリカ- ボ
リア化合物、炭化けい素、ちっ化ケイ素、サファイア等
を繊維状にしたものある。これらの材料は混合して使用
しても良い。有機の材料であればアラミド樹脂を繊維状
にしたものある。これらの繊維の直径は約５μm 〜２５
μm Φである。これら繊維の熱膨張率は約マイナス６．
２ppm から約プラス１０．０ppm である。引張り強度は
約１６００ＭＰａから約３４００ＭＰａであり、好まし
くは約２０００ＭＰａである。引張り弾性率は約０．５
ＧＰａから約４００ＧＰａであり好ましくは約３３０Ｇ
Ｐａである。 ＜プリント板ユニットの製造方法＞図３は第１の実施例
に係るプリント板ユニットの製造方法を説明する説明図
である。The fabric woven body 3 has a vertical width H of about 20 mm and a horizontal width W.
It is about 20 mm, which is almost the same shape and size as the mounted chip parts. The warp yarns and the weft yarns of the fibers 31 are alternately woven in a lattice pattern. The fiber density of the fabric body 3 is about 25 to 50 fibers / mm in the longitudinal direction and 25 to 50 fibers / mm in the lateral direction. The fiber 31 is, for example, an inorganic material made of alumina, silica, an alumina-silica compound, an alumina-silica-boria compound, silicon carbide, silicon nitride, sapphire or the like. These materials may be mixed and used. If it is an organic material, it is made of fibrous aramid resin. The diameter of these fibers is about 5 μm to 25 μm.
μm Φ. The coefficient of thermal expansion of these fibers is about minus 6.
It is about 2ppm to about plus 10.0ppm. The tensile strength is about 1600 MPa to about 3400 MPa, preferably about 2000 MPa. Tensile modulus is about 0.5
GPA to about 400 GPa, preferably about 330 Gpa
Pa. <Manufacturing Method of Printed Board Unit> FIG. 3 is an explanatory view for explaining the manufacturing method of the printed board unit according to the first embodiment.

【００２２】上記プリント基板２の形状は縦約３０cm、
横約２０cmの長方形であり、ガラスエポキシ樹脂材であ
る。プリント基板２のパッド２１の形状は直径０．１m
m、の円形である。このプリント基板２はパッド２１と
チップ部品４のハンダバンプ４１の位置合わせ用の位置
合わせマーク２２が形成されている。この位置合わせマ
ーク２２はチップ部品４を搭載する位置に所定個数形成
されている。The printed circuit board 2 has a vertical length of about 30 cm,
It is a rectangle of about 20 cm in width and is a glass epoxy resin material. The shape of the pad 21 of the printed circuit board 2 is 0.1 m in diameter.
It is a circle with m. The printed board 2 is provided with a pad 21 and an alignment mark 22 for aligning the solder bump 41 of the chip component 4. A predetermined number of the alignment marks 22 are formed at the position where the chip component 4 is mounted.

【００２３】最初に布織体３はプリント基板２のチップ
部品４の搭載部分に載置される。その後プリント基板２
のパッド２１はメッキ、蒸着等でハンダを形成される。
従って布織体３はパッド２１にハンダに埋設され固定さ
れている。この布織体３は三井鉱山マテリアル株式会社
製の製品名ＡＬＭＡＸであり、形状は大略、チップ部品
４と同じ大きさである。またはチップ部品４を搭載しな
い領域を除いたプリント基板２と大略同じ大きさであっ
てもかまわない。布織体３の繊維３１は直径；１０μm
Φ、熱膨張率；約プラス７．０ppm 、引張り強度；約１
８００ＭＰａ、引張り弾性率；約３３０ＧＰａの繊維３
１を格子状に編み込んだものを使用した。First, the cloth body 3 is placed on the mounting portion of the chip component 4 of the printed circuit board 2. Then printed circuit board 2
The pad 21 is soldered by plating, vapor deposition, or the like.
Therefore, the cloth body 3 is embedded in the pad 21 and fixed to the solder. This cloth woven body 3 is a product name ALMAX manufactured by Mitsui Mining Materials Co., Ltd., and its shape is roughly the same as the chip component 4. Alternatively, the size may be substantially the same as that of the printed circuit board 2 excluding the area where the chip component 4 is not mounted. The fiber 31 of the fabric body 3 has a diameter of 10 μm.
Φ, coefficient of thermal expansion: about plus 7.0ppm, tensile strength: about 1
800 MPa, tensile elastic modulus; about 330 GPa fiber 3
1 was woven in a lattice shape.

【００２４】図４は第１の実施例に係るプリント板ユニ
ットの製造方法を説明する説明図である。FIG. 4 is an explanatory view for explaining the method of manufacturing the printed board unit according to the first embodiment.

【００２５】次に、布織体３を載置したプリント基板２
に予備ハンダを行ったチップ部品４を位置合わせマーク
に位置合わせされチップ搭載機等の装置にて載置され
る。そして、チップ部品４はプリント板ユニット１に加
熱され仮固定される。チップ部品４は１個ずつ所定個数
分、繰り返して位置合わせマークに位置合わせされ、加
熱され仮固定される。従ってプリント基板２のパッド２
１とチップ部品４のハンダバンプ４１はハンダ付けされ
電気的に接続される。この状態で布織体３はパッド２１
とハンダバンプ４１の隙間に圧接されハンダに埋設され
ている。そしてハンダが布織体３の繊維３１に浸透して
いる。Next, the printed circuit board 2 on which the fabric body 3 is placed
The chip component 4 preliminarily soldered is aligned with the alignment mark and placed by a device such as a chip mounting machine. Then, the chip component 4 is heated and temporarily fixed to the printed board unit 1. A predetermined number of the chip components 4 are repeatedly aligned with the alignment marks, heated, and temporarily fixed. Therefore, the pad 2 of the printed circuit board 2
1 and the solder bumps 41 of the chip component 4 are soldered and electrically connected. In this state, the cloth body 3 has the pad 21
And is buried in the solder by being pressed into the gap between the solder bumps 41. Then, the solder penetrates the fibers 31 of the fabric body 3.

【００２６】チップ部品４のＭＰＵは具体的には富士通
株式会社製の製品名ＣＳ７００であり形状は縦約２０m
m、横約２０mmの四角形であり、ＭＰＵのハンダバンプ
４１の形状は直径０．１mmΦの円形で、高さ０．１mmで
ある。従って、パッド２１とハンダバンプ４１との接続
面積は直径約０．１mmΦの円形となり、プリント基板２
のパッド２１とチップ部品４のハンダバンプ４１との隙
間は約０．１mmである。The MPU of the chip component 4 is concretely a product name CS700 manufactured by Fujitsu Limited, and the shape is about 20 m in length.
It is a quadrangle with m and a width of about 20 mm, and the shape of the solder bump 41 of the MPU is a circle with a diameter of 0.1 mmΦ and a height of 0.1 mm. Therefore, the connection area between the pad 21 and the solder bump 41 becomes a circle having a diameter of about 0.1 mmΦ, and the printed board 2
The gap between the pad 21 and the solder bump 41 of the chip component 4 is about 0.1 mm.

【００２７】また布織体３の繊維３１は直径約１０μm
Φであり、パッド２１とハンダバンプ４１との接続面積
は直径約０．１mmΦである。従って、導通面積は充分確
保される。The fibers 31 of the fabric body 3 have a diameter of about 10 μm.
Φ, and the connection area between the pad 21 and the solder bump 41 has a diameter of about 0.1 mmΦ. Therefore, the conductive area is sufficiently secured.

【００２８】図５は第１の実施例に係るプリント板ユニ
ットの製造方法を説明する説明図である。FIG. 5 is an explanatory view for explaining the method of manufacturing the printed board unit according to the first embodiment.

【００２９】更に、所定個数のチップ部品４を搭載した
プリント板ユニット１をリフロー炉でリフローしハンダ
付けを行い本固定した。Further, the printed board unit 1 on which a predetermined number of chip parts 4 are mounted is reflowed in a reflow oven, soldered and permanently fixed.

【００３０】図６は第１の実施例に係るプリント板ユニ
ットの製造方法を説明する説明図である。次に、充填用
樹脂５をプリント基板２とチップ部品４との対向領域に
デイスペンサー装置を使用して充填した。その後１５０
度Ｃ、約２時間、加熱して充填用樹脂５を硬化させる。FIG. 6 is an explanatory view for explaining the method of manufacturing the printed board unit according to the first embodiment. Next, the filling resin 5 was filled in a region where the printed circuit board 2 and the chip component 4 face each other using a dispenser device. Then 150
The filling resin 5 is cured by heating at a temperature of C for about 2 hours.

【００３１】上記充填用樹脂５は下記の各材料である。The filling resin 5 is the following materials.

【００３２】 エポキシ主剤: ビスフェノールＦ １００重量部 硬化剤 : Ｍ−ＨＨＰＡ １１０重量部 反応性希釈剤: 樹脂量 １０重量部 この充填用樹脂５と従来の充填用樹脂との差異は、従来
の充填用樹脂から無機フィラーを除去しただけである。
無機フィラーを除去した上記充填用樹脂の粘度は約４０
０ cpsであり、チクソ性は約１．０であった。上記の充
填用樹脂５は無機フィラーを混合していない為に粘度、
チクソ性が従来の充填用樹脂と比較して低く流動性が良
い。従って、確実にチップ部品４とプリント基板２との
対向領域全部に充填用樹脂５を充填できる。そして布織
体３を介してチップ部品４のハンダバンプ４１と前記プ
リント基板２のパッド２１は接続されている。従って、
チップ部品４の発熱量が増加しても、布織体３がプリン
ト基板２およびチップ部品４の熱膨張率の差を緩和でき
る。Epoxy main agent: Bisphenol F 100 parts by weight Curing agent: M-HHPA 110 parts by weight Reactive diluent: Resin amount 10 parts by weight The difference between this filling resin 5 and the conventional filling resin is Only the inorganic filler was removed from the resin.
The viscosity of the filling resin from which the inorganic filler is removed is about 40.
It was 0 cps and the thixotropic property was about 1.0. Since the above-mentioned filling resin 5 does not contain an inorganic filler, the viscosity,
It has low thixotropy and low flowability compared to conventional filling resins. Therefore, the filling resin 5 can be surely filled in the entire area where the chip component 4 and the printed circuit board 2 face each other. The solder bumps 41 of the chip component 4 and the pads 21 of the printed circuit board 2 are connected to each other via the cloth body 3. Therefore,
Even if the amount of heat generated by the chip component 4 increases, the cloth weave 3 can alleviate the difference in coefficient of thermal expansion between the printed circuit board 2 and the chip component 4.

【００３３】また上記充填用樹脂５の弾性率は約０．５
ＧＰａから約２ＧＰａである。従来の充填用樹脂と比較
して弾性率が低いためにチップ部品の交換が容易とな
る。従って、プリント板ユニット１に障害を発生した時
に修復が容易となる。The elastic modulus of the filling resin 5 is about 0.5.
It is from GPa to about 2 GPa. Since the modulus of elasticity is lower than that of the conventional filling resin, the chip parts can be easily replaced. Therefore, when a failure occurs in the printed board unit 1, the repair becomes easy.

【００３４】結果としてチップ部品とプリント基板との
はずれ及び導通不良を防止できる。チップ部品のハンダ
バンプ４１およびプリント基板２のパッド２１の形状は
平坦な直径０．１mmΦの円形で説明した。しかし布織体
３を突破り易い突起状をハンダバンプ４１およびパッド
２１の接続面に設けたものであれば導通不良の防止効果
を増すことができる。 ＜導通試験＞次に、このように布織体３をパッド２１と
ハンダバンプ４１の対向領域に介在させたプリント板ユ
ニットの導通試験をした。As a result, it is possible to prevent the chip component and the printed circuit board from being separated from each other and to prevent defective conduction. The shape of the solder bump 41 of the chip component and the pad 21 of the printed circuit board 2 is described as a flat circle having a diameter of 0.1 mmΦ. However, if the projections that easily break through the fabric body 3 are provided on the connection surfaces of the solder bumps 41 and the pads 21, the effect of preventing conduction failure can be enhanced. <Conductivity test> Next, a continuity test was performed on the printed board unit in which the cloth woven body 3 was interposed between the pads 21 and the solder bumps 41 in this manner.

【００３５】図７は導通試験用チップ部品の導電端子の
配列示す平面図である。チップ部品の導通試験用とし
て、図７のように１辺が約１０ｍｍの略正方状のチップ
部品試験片４２０を用意した。このチップ部品試験片４
２０の周縁部には、各辺に３２個ずつ合計１２８個の接
続用パッド４２２が設けられている。つまり、このチッ
プ部品試験片４２０は１２８ピンのチップ部品４に相当
する。このパッド４２２の大きさは直径０．１Φの円形
であり、パッド間隔は６０μｍである。各パッド４２２
は導体４２３によって２個ずつ順に導電接続されてお
り、このようなパッド４２２及び導体４２３はアルミニ
ウム蒸着膜のパターニングによって形成されている。な
おパッド４２２には、それぞれに金線のワイヤボンディ
ングによって０．１ｍ程度の高さのハンダバンプが設け
られている。FIG. 7 is a plan view showing an arrangement of conductive terminals of the continuity test chip component. For the continuity test of the chip component, a substantially square chip component test piece 420 having a side of about 10 mm was prepared as shown in FIG. This chip component test piece 4
A total of 128 connection pads 422, 32 on each side, are provided on the peripheral edge of the 20. That is, the chip component test piece 420 corresponds to the 128-pin chip component 4. The size of the pad 422 is a circle with a diameter of 0.1Φ, and the pad interval is 60 μm. Each pad 422
Are sequentially conductively connected two by two by conductors 423, and such pads 422 and conductors 423 are formed by patterning an aluminum vapor deposition film. Note that each pad 422 is provided with a solder bump having a height of about 0.1 m by wire bonding with a gold wire.

【００３６】図８は導通試験用のプリント基板の導通端
子配列を示す平面図である。FIG. 8 is a plan view showing a conductive terminal arrangement of a printed circuit board for a continuity test.

【００３７】次に、プリント基板２の導通試験用とし
て、図８のように、合計１２８個のパッド２１２を有し
たプリント基板２１０を用意した。パッド２１２は、部
品試験片のパッド配列に合わせて略正方状に配列されて
おり、大きさ及び間隔はパッド４２２と同一である。た
だし、プリント基板２１０では、正方形の各辺に対応す
る３２個のパッド２１２の内、両端のパッド２１２は導
通チェック用パッド２１４と接続され、残りの３０個の
パッド２１２が導体２１３によって２個ずつ順に導電接
続されている。つまり、チップ部品試験片４２０が実装
された時点では、各辺において、両端の導通チェック用
パッド２１４が導通状態になる。このようなパッド２１
２及び導体２１３は、厚さ約７μｍの銅薄膜をパターニ
ングしたものである。Next, for the continuity test of the printed board 2, a printed board 210 having a total of 128 pads 212 was prepared as shown in FIG. The pads 212 are arranged in a substantially square shape in accordance with the pad arrangement of the component test piece, and have the same size and interval as the pads 422. However, in the printed circuit board 210, among the 32 pads 212 corresponding to each side of the square, the pads 212 at both ends are connected to the continuity check pads 214, and the remaining 30 pads 212 are two by two by the conductor 213. Conductive connection is made in order. That is, when the chip component test piece 420 is mounted, the continuity check pads 214 at both ends are in a conductive state on each side. Such a pad 21
2 and the conductor 213 are obtained by patterning a copper thin film having a thickness of about 7 μm.

【００３８】チップ部品試験片４２０のハンダバンプ４
２２は布織体３を介してプリント基板２１０のパッド２
１２とハンダ接続された。そしてチップ部品試験片４２
０とプリント基板２１０との隙間に充填用樹脂５を充填
した。Solder bump 4 of chip component test piece 420
22 is a pad 2 of the printed circuit board 210 through the cloth body 3
Soldered to 12. And the chip component test piece 42
0 and the printed circuit board 210 were filled with the filling resin 5.

【００３９】そして両端の導通チェック用パッド２１４
間の導通試験を行った。この結果、１接続点あたりの導
通抵抗は０．０５Ω以下であった。従って、導通状態は
良好で電気的な接続には問題ない。 ＜第２の実施例＞図９は第２の実施例に係るプリント板
ユニットの側断面図である。第２の実施例に係るプリン
ト板ユニット１はチップ部品４を実装した補助プリント
基板６と、プリント基板２から構成されている。チップ
部品４は補助プリント基板６に電気的に導通接続されて
いる。そしてこの導通接続部に充填用樹脂７を充填され
ている。換言するとプリント板ユニット１は補助プリン
ト基板６とチップ部品４とからなる組立体のチップ部品
と、プリント基板２例えばマザーボード基板２とから構
成されている。そして補助プリント基板６の導電端子は
布織体３を介してプリント基板２の導通端子と接続され
ている。このように複数段積層する場合は布織体３を少
なくとも１段いずれかに設けることができる。Then, the continuity check pads 214 at both ends
A continuity test between them was performed. As a result, the conduction resistance per connection point was 0.05Ω or less. Therefore, the conductive state is good and there is no problem in electrical connection. <Second Embodiment> FIG. 9 is a side sectional view of a printed board unit according to the second embodiment. The printed board unit 1 according to the second embodiment comprises an auxiliary printed board 6 on which a chip component 4 is mounted and a printed board 2. The chip component 4 is electrically connected to the auxiliary printed circuit board 6. Then, the conductive connecting portion is filled with the filling resin 7. In other words, the printed board unit 1 is composed of the chip component of the assembly including the auxiliary printed substrate 6 and the chip component 4, and the printed substrate 2, for example, the motherboard substrate 2. The conductive terminals of the auxiliary printed circuit board 6 are connected to the conductive terminals of the printed circuit board 2 through the cloth body 3. In the case of laminating a plurality of layers in this way, the fabric woven body 3 can be provided in at least one layer.

【００４０】図１０は第３の実施例に係るプリント板ユ
ニットの側断面図である。第３の実施例に係るプリント
板ユニット１はチップ部品４を搭載したインターポーザ
８と、プリント基板２から構成されている。チップ部品
４はインターポーザ８に電気的に導通接続されている。
そしてこの導通接続部とチップ部品４とは充填用樹脂７
が充填されている。換言するとプリント板ユニット１は
インターポーザ８とチップ部品４とからなる組立体のチ
ップ部品と、プリント基板２例えばマザーボード基板２
とから構成されている。そしてインターポーザ６の導電
端子は布織体３を介してプリント基板２の導通端子と接
続されている。このように複数段積層されたプリント板
ユニット１は布織体３を少なくとも１段いずれかに設け
ることができる。 ＜チップ部品の交換＞第１、２、３の実施例で使用する
各充填樹脂は従来の充填樹脂に比較して弾性力が低い。
従ってプリント板ユニットからチップ部品４を取り外し
が容易である。FIG. 10 is a side sectional view of a printed board unit according to the third embodiment. The printed board unit 1 according to the third embodiment comprises an interposer 8 on which a chip component 4 is mounted and a printed board 2. The chip component 4 is electrically connected to the interposer 8.
The conductive connection portion and the chip component 4 are filled with the filling resin 7
Is filled. In other words, the printed board unit 1 is a chip component of an assembly including the interposer 8 and the chip component 4, and the printed board 2 such as the motherboard board 2.
It consists of and. The conductive terminal of the interposer 6 is connected to the conductive terminal of the printed board 2 through the cloth body 3. In the printed board unit 1 having a plurality of stacked layers, the cloth woven body 3 can be provided in at least one of the stacked layers. <Replacement of Chip Parts> Each of the filling resins used in the first, second and third embodiments has a lower elastic force than the conventional filling resins.
Therefore, the chip component 4 can be easily removed from the printed board unit.

【００４１】図１１はプリント板ユニットのチップ部品
を交換する説明図である。このプリント板ユニット１は
チップ部品４を布織体３を介してプリント基板２に実装
されたものである。このプリント板ユニット１が基台に
固定載置されている。このプリント板ユニット１の上方
に加熱剪断工具が設けられている。この加熱剪断工具は
プリント板ユニット１と対向する面にチップ部品４と大
略同じ凹部が設けられている。この加熱剪断工具の凹部
が該チップ部品４を覆い。そして加熱剪断工具の熱にて
充填用樹脂５を溶融せる。その後、加熱剪断工具を回転
させる。そしてチップ部品４に剪断力を加えプリント板
ユニット１からチップ部品４を除去する。FIG. 11 is an explanatory view for exchanging the chip parts of the printed board unit. The printed board unit 1 has a chip component 4 mounted on a printed board 2 with a cloth body 3 interposed therebetween. The printed board unit 1 is fixedly mounted on the base. A heating shearing tool is provided above the printed board unit 1. The heating shearing tool is provided with a recess substantially the same as the chip component 4 on the surface facing the printed board unit 1. The recess of the heating shearing tool covers the chip component 4. Then, the filling resin 5 is melted by the heat of the heating shearing tool. Then, the heating shearing tool is rotated. Then, a shearing force is applied to the chip component 4 to remove the chip component 4 from the printed board unit 1.

【００４２】その他の除去方法として、チップ部品除去
工具がプリント板ユニット１の充填用樹脂５を加熱した
後、チップ部品４を吸着し垂直に引き上げる。そしてプ
リント板ユニット１からチップ部品４を除去する。As another removing method, after the chip component removing tool heats the filling resin 5 of the printed board unit 1, the chip component 4 is adsorbed and pulled up vertically. Then, the chip component 4 is removed from the printed board unit 1.

【００４３】または充填用樹脂５を薬品処理後、チップ
部品４を吸着し垂直に引き上げる。そしてプリント板ユ
ニット１からチップ部品４を除去する。Alternatively, after the filling resin 5 is chemically treated, the chip component 4 is adsorbed and pulled up vertically. Then, the chip component 4 is removed from the printed board unit 1.

【００４４】[0044]

【発明の効果】以上説明したとおり、本発明によればプ
リント板ユニットの高密度実装化、チップ部品の小型が
進み、チップ部品とプリント基板との間隔が狭くなって
もチップ部品とプリント基板との対向領域全部に充填用
樹脂を充填できる。またチップ部品の発熱量が増えても
チップ部品の熱膨張率とプリント基板との熱膨張率の差
異を緩和してチップ部品のはずれ及び導通不良を防止で
きる。As described above, according to the present invention, the high density mounting of the printed board unit and the miniaturization of the chip parts are advanced, and even if the distance between the chip parts and the printed board is narrowed, the chip parts and the printed board are separated. The filling resin can be filled in the entire facing region. Further, even if the amount of heat generated by the chip component increases, the difference between the coefficient of thermal expansion of the chip component and the coefficient of thermal expansion of the printed circuit board can be alleviated, and the chip component can be prevented from coming off and defective conduction can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図１】 第１の実施例に係るプリント板ユニットの側
断面図、FIG. 1 is a side sectional view of a printed board unit according to a first embodiment,

【図２】 第１の実施例に係る長繊維の構成図、FIG. 2 is a configuration diagram of a long fiber according to the first embodiment,

【図３】 第１の実施例に係るプリント板ユニットの製
造方法を説明する説明図、FIG. 3 is an explanatory view illustrating a method of manufacturing the printed board unit according to the first embodiment,

【図４】 第１の実施例に係るプリント板ユニットの製
造方法を説明する説明図、FIG. 4 is an explanatory view illustrating a method of manufacturing the printed board unit according to the first embodiment,

【図５】 第１の実施例に係るプリント板ユニットの製
造方法を説明する説明図、FIG. 5 is an explanatory view illustrating a method of manufacturing the printed board unit according to the first embodiment,

【図６】 第１の実施例に係るプリント板ユニットの製
造方法を説明する説明図、FIG. 6 is an explanatory view illustrating a method of manufacturing the printed board unit according to the first embodiment,

【図７】 導通試験用のチップ部品の導電端子配列示す
平面図、FIG. 7 is a plan view showing a conductive terminal array of a chip part for continuity test,

【図８】 導通試験用のプリント基板の導通端子配列を
示す平面図、FIG. 8 is a plan view showing a conductive terminal array of a printed circuit board for a continuity test,

【図９】 第２の実施例に係るプリント板ユニットの側
断面図、FIG. 9 is a side sectional view of a printed board unit according to a second embodiment,

【図１０】 第３の実施例に係るプリント板ユニットの
側断面図、FIG. 10 is a side sectional view of a printed board unit according to a third embodiment,

【図１１】 プリント板ユニットのチップ部品を交換す
る説明図である。FIG. 11 is an explanatory diagram of replacing a chip component of the printed board unit.

【符号の説明】[Explanation of symbols]

１ プリント板ユニット、 ２ プリント基板、 ２１ パッド（導通端子）、 ３ 布織体、 ３１ 繊維、 ４ チップ部品、 ４１ チップ部品のハンダバンプ（導電端子）、 ５ 充填用樹脂である。 1 printed board unit, 2 printed circuit boards, 21 pad (conduction terminal), 3 cloth weave, 31 fibers, 4 chip parts, 41 Solder bumps (conductive terminals) of chip parts, 5 It is a filling resin.

フロントページの続き (72)発明者 佐々木 真 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 八木 友久 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 横内 貴志男 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (56)参考文献 特開 平10−223691（ＪＰ，Ａ) 特開 平６−232203（ＪＰ，Ａ) 特開 昭64−81237（ＪＰ，Ａ) 特開 昭62−282490（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 311 Front page continuation (72) Inventor Makoto Sasaki 4-1-1 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Within Fujitsu Limited (72) Inventor Tomohisa Yagi 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Within Fujitsu Limited (72) Inventor Takao Yokouchi 4-1-1 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Within Fujitsu Limited (56) Reference JP-A-10-223691 (JP, A) JP-A-6 -232203 (JP, A) JP-A-64-81237 (JP, A) JP-A-62-282490 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/60 311

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 導電端子を有する電子部品と導通端子を
有するプリント基板とを電気接続するプリント板ユニッ
トにおいて、 絶縁性の布織体を介して前記電子部品の導電端子と前記
プリント基板の導通端子とを接続し、 かつ、接続間隙に樹脂を充填してなることを特徴とする
プリント板ユニット。1. A printed board unit for electrically connecting an electronic component having a conductive terminal and a printed circuit board having a conductive terminal, wherein a conductive terminal of the electronic component and a conductive terminal of the printed circuit board are provided via an insulating cloth woven body. A printed circuit board unit, characterized in that it is connected to and is filled with resin in the connection gap. 【請求項２】 前記布織体の熱膨張率はマイナス６．２
ppm からプラス１０．０ppm であることを特徴とする請
求項１記載のプリント板ユニット。2. The coefficient of thermal expansion of the woven fabric is minus 6.2.
2. The printed circuit board unit according to claim 1, wherein the content is from ppm to plus 10.0 ppm. 【請求項３】 前記布織体の繊維密度は縦２５から５０
本／mm、横２５から５０本／mmで、前記繊維の直径は約
５μm 〜約２５μm Φであることを特徴とする請求項１
記載のプリント板ユニット。3. The fiber density of the woven fabric is 25 to 50 in the longitudinal direction.
The number of fibers / mm, the width of 25 to 50 fibers / mm, and the diameter of the fibers are about 5 μm to about 25 μm Φ.
Printed board unit described. 【請求項４】 前記布織体はアルミナ、シリカ、アルミ
ナ- シリカ化合物、アルミナ- シリカ- ボリア化合物、
炭化けい素、ちっ化ケイ素、サファイア、アラミド樹脂
の内少なくとも１つからなることを特徴とする請求項１
記載のプリント板ユニット。4. The woven fabric is alumina, silica, an alumina-silica compound, an alumina-silica-boria compound,
2. At least one of silicon carbide, silicon nitride, sapphire, and aramid resin.
Printed board unit described. 【請求項５】 一方の端子上に無機長繊維から成る布織
体を埋め込む形で半田を形成する工程と、 接続すべき両方の端子間を半田接続する工程と、 接続部の間隙に樹脂を充填する工程とを有することを特
徴とするプリント板ユニットの製造方法。5. A step of forming a solder by embedding a woven fabric made of inorganic long fibers on one terminal, a step of solder-connecting both terminals to be connected, and a resin in a gap between the connecting portions. And a step of filling the printed board unit.
JP34453298A 1998-12-03 1998-12-03 Printed board unit and method of manufacturing the printed board unit Expired - Fee Related JP3428472B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34453298A JP3428472B2 (en) 1998-12-03 1998-12-03 Printed board unit and method of manufacturing the printed board unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34453298A JP3428472B2 (en) 1998-12-03 1998-12-03 Printed board unit and method of manufacturing the printed board unit

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JP2000174063A JP2000174063A (en) 2000-06-23
JP3428472B2 true JP3428472B2 (en) 2003-07-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9827629B2 (en) 2005-12-30 2017-11-28 Micron Technology, Inc. Connection verification technique

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1976000A3 (en) * 2007-03-26 2009-05-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4396746B2 (en) 2007-08-13 2010-01-13 セイコーエプソン株式会社 Electronic devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9827629B2 (en) 2005-12-30 2017-11-28 Micron Technology, Inc. Connection verification technique
US10717141B2 (en) 2005-12-30 2020-07-21 Micron Technology, Inc. Connection verification technique

Also Published As

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