JP3408420B2 - Circuit board layout - Google Patents
Circuit board layoutInfo
- Publication number
- JP3408420B2 JP3408420B2 JP11583498A JP11583498A JP3408420B2 JP 3408420 B2 JP3408420 B2 JP 3408420B2 JP 11583498 A JP11583498 A JP 11583498A JP 11583498 A JP11583498 A JP 11583498A JP 3408420 B2 JP3408420 B2 JP 3408420B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- signal processing
- processing circuit
- power supply
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】
【0001】
【発明の属する技術分野】本発明は、商用電源を用いて
集積回路などの直流低圧回路を作動させ、種々の信号処
理を行う電子回路を形成するための回路基板の配置構造
に関するものである。
【0002】
【従来の技術】今日、制御信号や画像信号など、種々の
電気信号を処理するに際し、ICと称される集積回路を
用いることが多い。この信号処理を行う集積回路は、一
般には、3ボルト又は6ボルトから12ボルト程度の直
流低電圧により作動するものが多用されており、電源と
しては、電池を使用するものの他、日本国内では交流1
00ボルトとされている商用電源の電圧を降圧及び直流
化して使用するものがある。
【0003】ところで、交流100ボルトなどとされる
商用電源電圧の一次側回路と、集積回路などの回路素子
を組み合わせた直流低電圧の二次側回路とは、安全基準
により、例えば4ミリメートルなどの所定の距離とされ
る空間を、少なくとも一次側回路の結線及び回路素子と
二次側回路の結線及び回路素子との間に形成なければな
らない。
【0004】又、一次側回路を形成する各素子や結線と
二次側回路を形成する各素子や結線との間に形成される
空間距離が、所定の距離よりも小さく設定される場合に
は、インシュレータと称される絶縁板を一次側回路と二
次側回路との間に挿入しなければならなかった。
【0005】
【発明が解決しようとする課題】前述のように、集積回
路などの回路素子を用い、信号処理回路を形成する素子
などを密集させて信号処理装置を小型化するに際し、例
えば商用電源により作動する装置として室内監視カメラ
を小型化する場合、一次側回路と二次側回路との間に所
定の間隙を形成する空間を形成することは、信号処理装
置を小型化することが困難となる場合が生じる。
【0006】又、一次側回路を有する電源回路基板と、
集積回路などの二次側回路を有する信号処理回路基板と
を近接させるに際し、電源回路基板と信号処理回路基板
との間に絶縁板を挿入して一次側回路と二次側回路との
絶縁を確保することは、この絶縁板の固定に手数を要す
る欠点があった。尚、信号処理回路基板の裏面などに両
面接着テープを用いて絶縁板を接着し、電源基板に信号
処理回路基板を近接させて重ねるように配置することも
行われているも、このように両面接着テープで絶縁板を
信号処理回路基板に固定するに際しては、信号処理回路
基板の裏面が比較的平坦であり、凹凸の少ないことが条
件となるために、信号処理回路基板への回路素子の取り
付けなどに制約を受ける欠点があった。
【0007】本発明は、このような従来の欠点を排除
し、絶縁板の固定を容易とし、回路基板ひいては回路素
子を密集させることを容易とするものである。
【0008】
【課題を解決するための手段】本発明は、一次側回路を
備えた基板である電源回路基板と、信号処理回路を備え
た基板である第1信号処理回路基板及び第2信号処理回
路基板との組み合わせであって、第1信号処理回路基板
を電源回路基板と略平行として間隙を設けるように重
ね、第1信号処理回路基板と電源回路基板との間に第2
信号処理回路基板を電源回路基板に垂直として配置し、
一辺の少なくとも一部が電源回路基板に係合され、且
つ、対向する他の一辺には第1信号処理回路基板と第2
信号処理回路基板との間に挿入される折り返し部を有す
る絶縁板を第2信号処理回路基板と略平行に配置した回
路基板の配置構造とする。
【0009】このように、電源回路基板との間に間隙を
形成して重ねる信号処理回路基板を設け、この電源回路
基板に重ねる第1の信号処理回路基板と電源回路基板と
の間に第1の信号処理回路基板や電源回路基板と直交さ
せるように第2の信号処理回路基板を配置するため、複
数の基板の間に間隙を形成しつつ各基板に取り付ける回
路素子を近接させてを密集させることが容易に可能とな
る。
【0010】又、第2の信号処理回路基板を電源回路基
板と垂直に配置し、一辺の少なくとも一部を電源回路基
板に係合させ、且つ、対向する辺に設けた折り返し部を
第1の信号処理回路基板と第2の信号処理回路基板との
間に挿入する絶縁板を設ける故、第2の信号処理回路基
板と略平行とした絶縁板を容易に配置し且つ固定するこ
とができ、第2の信号処理回路基板に取り付ける二次側
回路の回路素子と電源回路基板に取り付ける一次側回路
の回路素子との距離を短くするように第2の信号処理回
路基板の位置を設定することができる。
【0011】
【発明の実施の形態】本発明に係る回路基板の組立構造
としての実施の形態は、図1及び図2に示すように、電
源回路を構成する素子を取り付ける電源回路基板11の一
端近くに該電源回路基板11と垂直に第2の信号処理回路
基板25を取り付け、更に、第2の信号処理回路基板25の
上端には電源回路基板11と平行として電源回路基板11に
重ねるようにした第1の信号処理回路基板21を設けるも
のである。
【0012】そして、この第1信号処理回路基板21に
は、信号処理を行う集積回路や小型抵抗器、小型コンデ
ンサなどの二次側回路素子42を取り付け、又、第2信号
処理回路基板25にも小型抵抗器やデップスイッチなどの
二次側回路素子42を取り付け、第2信号処理回路基板25
の内側には、絶縁板31を配置するものである。尚、この
二次側回路素子42により構成される信号処理回路として
は、例えばCCD出力信号からカラービデオ信号を形成
する映像信号処理回路とするものがあり、電源回路基板
11や第1信号処理回路基板21は、長さが7センチメート
ル前後にして幅を4センチメートル前後とし、第2信号
処理回路基板25は、長さが6センチメートル前後にして
幅を3センチメートル足らずとすることにより、小型の
屋内監視カメラを組み上げることのできる回路基板とし
ている。
【0013】そして、この電源回路基板11には、図3に
示すように、直線状に配置される2個の固定穴13を電源
回路基板11の一辺に沿って形成し、この結合手段として
の固定穴13と平行に固定穴13よりも内側に係合穴15を形
成している。又、第2信号処理回路基板25には、図3に
おいて下辺となる一辺から2個の挿入突起27を結合手段
として突出させるものである。
【0014】この挿入突起27は、電源回路基板11に形成
した2個の固定穴13相互間の間隔に合わせた2つの挿入
突起27として形成するものであり、各挿入突起27の厚さ
と各固定穴13の幅を略一致させると共に、各挿入突起27
の突出長さを電源回路基板11の厚さに、又、各挿入突起
27の幅を各固定穴13の長さに略一致させている。従っ
て、挿入突起27を固定穴13に嵌合させて第2信号処理回
路基板25を電源回路基板11に対して垂直に固定すること
ができる。
【0015】尚、結合手段とする挿入突起27及びこの挿
入突起27が嵌合される固定穴13は、2個に限るものでな
く、又、挿入突起を電源回路基板11に形成し、固定穴を
第2信号処理回路基板25に形成することもある。又、第
2信号処理回路基板25の図3における上辺にも、係合手
段としての2個の挿入突起27を形成し、第1信号処理回
路基板21にこの挿入突起27が嵌合する2個の固定穴23を
係合手段として形成することにより、挿入突起27及び固
定穴23による第1信号処理回路基板21と第2信号処理回
路基板25との係合手段を形成するものである。
【0016】更に、この第2信号処理回路基板25の上辺
には、上辺から僅かに窪んだ係合凹部29を形成してい
る。そして、厚さを約0.5ミリメートル程度とした矩
形平板状の絶縁板31には、下辺から突出する係合突起33
を形成し、下辺の対向辺である上辺からは舌片状の突出
部分を設けておき、この突出部分をコ字状に折り曲げて
折り返し部35を形成するものである。
【0017】尚、絶縁板31の下辺から折り返し部35の上
端までの高さは、第2信号処理回路基板25の下辺から係
合凹部29までの高さに略一致させ、絶縁板31の下辺に形
成する係合突起33は、電源回路基板11の係合穴15に挿入
し得る位置及び大きさとして形成すると共に、この絶縁
板31の大きさは、第2信号処理回路基板25の大部分を覆
う大きさとしている。
【0018】従って、第2信号処理回路基板25の挿入突
起27を電源回路基板11の固定穴13に嵌合した後、絶縁板
31の係合突起33を電源回路基板11の係合穴15に挿入し、
絶縁板31の折り返し部35を第2信号処理回路基板25の係
合凹部29に合わせて折り返し部35の先端36を第2信号処
理回路基板25に掛けると、図4に示すように、絶縁板31
により第2信号処理回路基板25の一側面の大部分を覆う
ようにして絶縁板31を容易に取り付けることができる。
【0019】尚、折り返し部先端36と絶縁板31の本体部
との間隔は、第2信号処理回路基板25の内側に配置する
二次側回路素子42の状態に合わせて絶縁板31で第2信号
処理回路基板25を覆うことができるようにし、又、電源
回路基板11に設ける係合穴15は、一次側回路素子41に近
接させつつ固定穴13との間隙は第2信号処理回路基板25
の内側に配置する二次側回路素子42の状態に合わせるも
のである。
【0020】そして、第2信号処理回路基板25の上辺に
形成した挿入突起27を第1信号処理回路基板21の固定穴
23に嵌合させると、図1や図2及び図5に示すように、
第1信号処理回路基板21や第2信号処理回路基板25と電
源回路基板11とを一体とし、且つ、第2信号処理回路基
板25の内側に近接配置した絶縁板31を脱落させないよう
に固定することができる。
【0021】従って、図2に示したように、第2信号処
理回路基板25に信号処理回路を構成する二次側回路素子
42を取り付け、電源回路基板11に商用電源電圧が印加入
力される一次側回路を構成する電源回路素子を取り付け
るに際し、一次側回路素子41である電源回路素子と二次
側回路素子42や二次側回路素子42の端子などとの距離を
1ミリメートル乃至2ミリメートル程度に近接させるこ
とができ、絶縁板31の取り付けが容易であって、回路素
子を密集させることが容易に可能となる回路基板の配置
組み合わせとすることができる。
【0022】又、電源回路基板11及び第2信号処理回路
基板25に形成した結合手段や第1信号処理回路基板21及
び第2信号処理回路基板25に形成した結合手段により、
電源回路基板11や第1信号処理回路基板21を第2信号処
理回路基板25へ一体にすることができるから、この基板
を組み込んで信号を処理する装置の組立をも容易とする
ことができる。
【0023】尚、絶縁板31の厚さは0.5ミリメートル
程度と薄いため、第2信号処理回路基板25に係合凹部29
を形成することなく、第1信号処理回路基板21と第2信
号処理回路基板25の端部とにより折り返し部35を挟み込
んで絶縁板31を固定することもある。更に、絶縁板31の
下端に形成した係合突起33を電源回路基板11の係合穴15
に挿入して絶縁板31の下端の一部を電源回路基板11に係
合固定する場合のみでなく、電源回路基板11に係合溝16
を形成し、且つ、絶縁板31の下端に係合突起33を形成す
ることなく絶縁板31の下辺を直接に係合溝16に挿入する
ことにより、絶縁板31の下辺全体を電源回路基板11に係
合させることもある。
【0024】そして、第2信号処理回路基板25を第1信
号処理回路基板21や電源回路基板11に挿入突起27を用い
て固定する場合のみでなく、図6に示すように、電源回
路基板11や第1信号処理回路基板21及び第2信号処理回
路基板25には、各基板をケース51などに固定するビス穴
55を設け、図7に示すように、電源回路基板11及び第1
信号処理回路基板21や第2信号処理回路基板25を適宜に
ケース51やシャーシーに固定するものとし、ケース51内
に固定される電源回路基板11と第2信号処理回路基板25
とを直交させるように近接又は接触させ、第2信号処理
回路基板25と第1信号処理回路基板21とを直交させて接
触又は近接させるようにケース51内に固定し、第1信号
処理回路基板21と第2信号処理回路基板25との間に絶縁
板31の折り返し部35を挿入し、絶縁板31の下端の少なく
とも一部を電源回路基板11と係合させて絶縁板31を固定
することもある。
【0025】
【発明の効果】本発明は、電源回路基板と、第1及び第
2信号処理回路基板との組み合わせであって、第1信号
処理回路基板を電源回路基板に平行として間隙を設けて
重ね、第1信号処理回路基板と電源回路基板との間に第
2信号処理回路基板を電源回路基板に垂直として配置
し、一辺の少なくとも一部が電源回路基板に係合され、
且つ、対向する他の一辺には第1信号処理回路基板と第
2信号処理回路基板との間に挿入される折り返し部を有
する絶縁板を備え、該絶縁板は第2信号処理回路基板と
略平行に配置される回路基板の配置構造とするものであ
る。
【0026】このため、一次側回路素子と二次側回路素
子との間に絶縁板を配置固定することが容易であり、一
次側回路素子と二次側回路素子とを近接させて配置する
ことが容易に可能となる。従って、商用電源により作動
する信号処理回路を内蔵する装置の小型化が容易となる
利点を有するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit for operating a DC low voltage circuit such as an integrated circuit using a commercial power supply to form an electronic circuit for performing various signal processing. The present invention relates to an arrangement structure of a circuit board. 2. Description of the Related Art Today, integrated circuits called ICs are often used for processing various electric signals such as control signals and image signals. In general, an integrated circuit that performs this signal processing is operated by a low DC voltage of about 3 volts or 6 volts to about 12 volts. In addition to using a battery as a power source, an AC circuit in Japan is used. 1
In some cases, the voltage of a commercial power supply of 00 volts is stepped down and converted to direct current. According to safety standards, a primary circuit of a commercial power supply voltage of 100 VAC or the like and a secondary circuit of a DC low voltage combining circuit elements such as an integrated circuit are, for example, 4 mm in size. A space having a predetermined distance must be formed at least between the connection and circuit element of the primary circuit and the connection and circuit element of the secondary circuit. In the case where a spatial distance formed between each element or connection forming the primary circuit and each element or connection forming the secondary circuit is set smaller than a predetermined distance. In addition, an insulating plate called an insulator has to be inserted between the primary circuit and the secondary circuit. As described above, when circuit elements such as integrated circuits are used and elements forming a signal processing circuit are densely packed to reduce the size of a signal processing apparatus, for example, a commercial power supply is used. In order to reduce the size of the indoor monitoring camera as a device operated by the above, it is difficult to reduce the size of the signal processing device by forming a space that forms a predetermined gap between the primary side circuit and the secondary side circuit. May occur. A power supply circuit board having a primary side circuit;
When approaching a signal processing circuit board having a secondary circuit such as an integrated circuit, an insulating plate is inserted between the power supply circuit board and the signal processing circuit board to insulate the primary circuit and the secondary circuit. To ensure this, there is a disadvantage that the fixing of the insulating plate requires time and effort. In some cases, an insulating plate is adhered to the back surface of the signal processing circuit board using a double-sided adhesive tape, and the signal processing circuit board is arranged so as to be close to the power supply board. When fixing the insulating plate to the signal processing circuit board with the adhesive tape, it is necessary that the back surface of the signal processing circuit board is relatively flat and has little unevenness, so that the circuit element is mounted on the signal processing circuit board. There were drawbacks that were restricted by such factors. The present invention eliminates such conventional disadvantages, facilitates fixing of the insulating plate, and facilitates densely arranging circuit boards and circuit elements. [0008] The present invention provides a power supply circuit board which is a board provided with a primary side circuit, a first signal processing circuit board which is a board provided with a signal processing circuit, and a second signal processing board. The first signal processing circuit board is overlapped with the power supply circuit board so as to provide a gap, and a second signal processing circuit board is disposed between the first signal processing circuit board and the power supply circuit board.
Place the signal processing circuit board perpendicular to the power supply circuit board,
At least a part of one side is engaged with the power supply circuit board, and the other side opposite to the first signal processing circuit board is
An insulating plate having a folded portion inserted between the signal processing circuit board and the second signal processing circuit board is arranged substantially in parallel with the circuit board. As described above, the signal processing circuit board is formed so as to overlap the power supply circuit board with a gap formed therebetween, and the first signal processing circuit board and the power supply circuit board are stacked between the signal processing circuit board and the first signal processing circuit board. In order to arrange the second signal processing circuit board so as to be orthogonal to the signal processing circuit board and the power supply circuit board, the circuit elements to be mounted on each board are closely arranged while forming a gap between the plurality of boards, and are densely packed. It becomes possible easily. The second signal processing circuit board is disposed perpendicular to the power supply circuit board, at least a part of one side is engaged with the power supply circuit board, and the folded portion provided on the opposite side is formed by the first signal processing circuit board. Since the insulating plate inserted between the signal processing circuit board and the second signal processing circuit board is provided, the insulating plate substantially parallel to the second signal processing circuit board can be easily arranged and fixed, The position of the second signal processing circuit board may be set so as to shorten the distance between the circuit element of the secondary circuit attached to the second signal processing circuit board and the circuit element of the primary circuit attached to the power supply circuit board. it can. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a circuit board assembly structure according to the present invention, as shown in FIGS. 1 and 2, has one end of a power supply circuit board 11 on which elements constituting a power supply circuit are mounted. A second signal processing circuit board 25 is attached near the power circuit board 11 perpendicularly to the power circuit board 11, and further, on the upper end of the second signal processing circuit board 25, parallel to the power circuit board 11 so as to overlap the power circuit board 11. The first signal processing circuit board 21 described above is provided. On the first signal processing circuit board 21, a secondary circuit element 42 such as an integrated circuit for performing signal processing, a small resistor, a small capacitor, or the like is mounted. The secondary side circuit element 42 such as a small resistor or a dip switch is attached to the second signal processing circuit board 25.
Is provided with an insulating plate 31 inside. The signal processing circuit constituted by the secondary side circuit element 42 may be, for example, a video signal processing circuit for forming a color video signal from a CCD output signal.
11 and the first signal processing circuit board 21 are about 7 cm in length and about 4 cm in width, and the second signal processing circuit board 25 is about 6 cm in length and 3 cm in width. By using less than a meter, the circuit board can be assembled with a small indoor surveillance camera. As shown in FIG. 3, the power supply circuit board 11 is formed with two fixing holes 13 arranged linearly along one side of the power supply circuit board 11 and serves as a coupling means. An engagement hole 15 is formed inside the fixing hole 13 in parallel with the fixing hole 13. In the second signal processing circuit board 25, two insertion projections 27 are projected from one side, which is the lower side in FIG. 3, as coupling means. The insertion projections 27 are formed as two insertion projections 27 corresponding to the interval between the two fixing holes 13 formed in the power supply circuit board 11, and the thickness of each insertion projection 27 and each fixing projection The width of the hole 13 is made substantially the same,
Length of the power supply circuit board 11 and each insertion protrusion
The width of 27 is approximately equal to the length of each fixing hole 13. Accordingly, the second signal processing circuit board 25 can be vertically fixed to the power supply circuit board 11 by fitting the insertion protrusion 27 into the fixing hole 13. It should be noted that the number of the insertion protrusions 27 serving as the coupling means and the fixing holes 13 into which the insertion protrusions 27 are fitted are not limited to two. May be formed on the second signal processing circuit board 25 in some cases. Also, two insertion projections 27 are formed on the upper side of FIG. 3 of the second signal processing circuit board 25 as engagement means, and two insertion projections 27 fitted to the first signal processing circuit board 21 are formed. By forming the fixing hole 23 as an engaging means, an engaging means between the first signal processing circuit board 21 and the second signal processing circuit board 25 by the insertion projection 27 and the fixing hole 23 is formed. Further, an engagement recess 29 slightly recessed from the upper side is formed on the upper side of the second signal processing circuit board 25. An engagement protrusion 33 protruding from the lower side is provided on the rectangular flat insulating plate 31 having a thickness of about 0.5 mm.
And a tongue-shaped protruding portion is provided from the upper side which is the opposite side of the lower side, and this protruding portion is bent into a U-shape to form a folded portion 35. The height from the lower side of the insulating plate 31 to the upper end of the folded portion 35 is substantially equal to the height from the lower side of the second signal processing circuit board 25 to the engaging recess 29, and the lower side of the insulating plate 31 The engagement protrusion 33 formed on the power supply circuit board 11 is formed so as to have a position and a size that can be inserted into the engagement hole 15 of the power supply circuit board 11. And the size to cover. Therefore, after the insertion protrusion 27 of the second signal processing circuit board 25 is fitted into the fixing hole 13 of the power supply circuit board 11, the insulating plate
Insert the engagement protrusion 33 of the 31 into the engagement hole 15 of the power supply circuit board 11,
When the folded portion 35 of the insulating plate 31 is aligned with the engaging concave portion 29 of the second signal processing circuit board 25 and the tip 36 of the folded portion 35 is hung on the second signal processing circuit board 25, as shown in FIG. 31
Accordingly, the insulating plate 31 can be easily attached so as to cover most of one side surface of the second signal processing circuit board 25. The distance between the end 36 of the folded portion and the main body of the insulating plate 31 is adjusted by the insulating plate 31 in accordance with the state of the secondary circuit element 42 disposed inside the second signal processing circuit board 25. The signal processing circuit board 25 can be covered, and the engagement hole 15 provided in the power supply circuit board 11 is close to the primary circuit element 41 while the gap between the fixing hole 13 and the second signal processing circuit board 25 is
In accordance with the state of the secondary side circuit element 42 disposed inside. Then, the insertion protrusion 27 formed on the upper side of the second signal processing circuit board 25 is fixed to the fixing hole of the first signal processing circuit board 21.
When fitted to 23, as shown in FIGS. 1, 2 and 5,
The first signal processing circuit board 21 and the second signal processing circuit board 25 are integrated with the power supply circuit board 11, and the insulating plate 31 disposed close to the inside of the second signal processing circuit board 25 is fixed so as not to fall off. be able to. Accordingly, as shown in FIG. 2, the secondary side circuit element constituting the signal processing circuit is provided on the second signal processing circuit board 25.
When attaching the power supply circuit element constituting the primary side circuit to which the commercial power supply voltage is applied and input to the power supply circuit board 11 when attaching the power supply circuit element 41 and the secondary side circuit element 42 and the secondary circuit element 42, The distance between the side circuit element 42 and the terminal and the like can be reduced to about 1 to 2 millimeters, so that the insulating plate 31 can be easily attached and the circuit elements can be densely arranged. An arrangement combination can be used. The coupling means formed on the power supply circuit board 11 and the second signal processing circuit board 25, and the coupling means formed on the first signal processing circuit board 21 and the second signal processing circuit board 25,
Since the power supply circuit board 11 and the first signal processing circuit board 21 can be integrated with the second signal processing circuit board 25, it is possible to easily assemble an apparatus for processing a signal by incorporating this board. Since the thickness of the insulating plate 31 is as small as about 0.5 mm, the engaging recess 29 is formed in the second signal processing circuit board 25.
In some cases, the insulating plate 31 may be fixed by sandwiching the folded portion 35 between the first signal processing circuit board 21 and the end of the second signal processing circuit board 25 without forming the same. Further, the engaging protrusion 33 formed at the lower end of the insulating plate 31 is engaged with the engaging hole 15 of the power supply circuit board 11.
Not only when a part of the lower end of the insulating plate 31 is engaged with and fixed to the power supply circuit board 11,
And by inserting the lower side of the insulating plate 31 directly into the engaging groove 16 without forming the engaging projection 33 at the lower end of the insulating plate 31, the entire lower side of the insulating plate 31 is May be engaged. In addition to the case where the second signal processing circuit board 25 is fixed to the first signal processing circuit board 21 or the power supply circuit board 11 using the insertion projection 27, as shown in FIG. And the first signal processing circuit board 21 and the second signal processing circuit board 25 have screw holes for fixing each board to the case 51 or the like.
55, the power supply circuit board 11 and the first
The signal processing circuit board 21 and the second signal processing circuit board 25 are appropriately fixed to the case 51 and the chassis, and the power supply circuit board 11 and the second signal processing circuit board 25 fixed in the case 51.
Are fixed in a case 51 so that the second signal processing circuit board 25 and the first signal processing circuit board 21 are orthogonally contacted or brought close to each other, and the first signal processing circuit board Inserting the folded portion 35 of the insulating plate 31 between the 21 and the second signal processing circuit board 25 and fixing the insulating plate 31 by engaging at least a part of the lower end of the insulating plate 31 with the power supply circuit board 11 There is also. The present invention relates to a combination of a power supply circuit board and first and second signal processing circuit boards, wherein the first signal processing circuit board is parallel to the power supply circuit board and a gap is provided. Overlapping, arranging the second signal processing circuit board perpendicular to the power circuit board between the first signal processing circuit board and the power circuit board, at least a part of one side is engaged with the power circuit board,
In addition, an insulating plate having a folded portion inserted between the first signal processing circuit board and the second signal processing circuit board is provided on another opposite side, and the insulating plate is substantially the same as the second signal processing circuit board. This is an arrangement structure of circuit boards arranged in parallel. Therefore, it is easy to arrange and fix the insulating plate between the primary side circuit element and the secondary side circuit element, and to arrange the primary side circuit element and the secondary side circuit element close to each other. Can be easily performed. Therefore, there is an advantage that the size of the device incorporating the signal processing circuit operated by the commercial power supply can be easily reduced.
【図面の簡単な説明】
【図1】本発明に係る回路基板の組立構造を示す斜視
図。
【図2】本発明に係る回路基板の組立構造の側面図。
【図3】本発明に係る回路基板の組立構造の分解斜視
図。
【図4】本発明に係る回路基板の組立構造の一部分解
図。
【図5】本発明に係る回路基板の組立構造の正面図。
【図6】本発明に係る回路基板の組立構造の他の例を示
す分解斜視図。
【図7】本発明に係る回路基板の組立構造の他の例にお
ける組立図。
【符号の説明】
11 電源回路基板 13 固定穴
15 係合穴 16 係合溝
21 第1信号処理回路基板 23 固定穴
25 第2信号処理回路基板 27 挿入突起
29 係合凹部
31 絶縁板 33 係合突起
35 折り返し部 36 折り返し部先
端
41 一次側回路素子 42 二次側回路素
子
51 ケース 55 ビス穴BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an assembly structure of a circuit board according to the present invention. FIG. 2 is a side view of a circuit board assembly structure according to the present invention. FIG. 3 is an exploded perspective view of the circuit board assembly structure according to the present invention. FIG. 4 is a partially exploded view of a circuit board assembly structure according to the present invention. FIG. 5 is a front view of a circuit board assembly structure according to the present invention. FIG. 6 is an exploded perspective view showing another example of the circuit board assembly structure according to the present invention. FIG. 7 is an assembly view in another example of an assembly structure of a circuit board according to the present invention. DESCRIPTION OF SYMBOLS 11 power supply circuit board 13 fixing hole 15 engaging hole 16 engaging groove 21 first signal processing circuit board 23 fixing hole 25 second signal processing circuit board 27 insertion protrusion 29 engagement recess 31 insulating plate 33 engagement Projection 35 Folded part 36 Folded part tip 41 Primary circuit element 42 Secondary circuit element 51 Case 55 Screw hole
フロントページの続き (72)発明者 黒須 隆 埼玉県北葛飾郡庄和町大字新宿新田321 リズム時計工業株式会社 埼玉事業所 内 (56)参考文献 特開 平1−268097(JP,A) 特開 平6−252527(JP,A) 特開 昭62−263698(JP,A) 特開 昭60−207398(JP,A) 実開 昭58−150884(JP,U) 実開 平1−130588(JP,U) 実開 平7−32990(JP,U) 実開 平3−13784(JP,U) 実開 昭61−27394(JP,U) (58)調査した分野(Int.Cl.7,DB名) H05K 7/14 Continuation of front page (72) Inventor Takashi Kurosu 321 Shinjuku Nitta, Shinjuku, Showa-cho, Kitakatsushika-gun, Saitama Prefecture Rhythm Watch Industry Co., Ltd. Saitama Office (56) References JP-A 1-268097 (JP, A) JP-A Hei 6-252527 (JP, A) JP-A-62-263698 (JP, A) JP-A-60-207398 (JP, A) JP-A-58-1550884 (JP, U) JP-A-1-130588 (JP, A) U) U.S.A. 7-32990 (JP, U) U.S.A. 3-13784 (JP, U) U.S.A. 61-27394 (JP, U) (58) Fields surveyed (Int. Cl. 7 , DB name) ) H05K 7/14
Claims (1)
基板と、信号処理回路を備えた基板である第1信号処理
回路基板及び第2信号処理回路基板との組み合わせであ
って、第1信号処理回路基板を電源回路基板と略平行と
して間隙を設けるように重ね、第1信号処理回路基板と
電源回路基板との間に第2信号処理回路基板を電源回路
基板に垂直として配置し、一辺の少なくとも一部が電源
回路基板に係合され、且つ、対向する他の一辺には第1
信号処理回路基板と第2信号処理回路基板との間に挿入
される折り返し部を有する絶縁板を備え、該絶縁板は第
2信号処理回路基板と略平行に配置されていることを特
徴とする回路基板の配置構造。(57) Claims 1. A power supply circuit board which is a board provided with a primary side circuit, and a first signal processing circuit board and a second signal processing circuit board which are board provided with a signal processing circuit Wherein the first signal processing circuit board is overlapped with the power supply circuit board so as to be substantially parallel to the power supply circuit board, and the second signal processing circuit board is connected to the power supply circuit between the first signal processing circuit board and the power supply circuit board. It is arranged perpendicular to the circuit board, and at least a part of one side is engaged with the power supply circuit board, and the other opposing side has a first side.
An insulating plate having a folded portion inserted between the signal processing circuit board and the second signal processing circuit board is provided, and the insulating plate is disposed substantially parallel to the second signal processing circuit board. Arrangement structure of circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11583498A JP3408420B2 (en) | 1998-04-27 | 1998-04-27 | Circuit board layout |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11583498A JP3408420B2 (en) | 1998-04-27 | 1998-04-27 | Circuit board layout |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11307958A JPH11307958A (en) | 1999-11-05 |
JP3408420B2 true JP3408420B2 (en) | 2003-05-19 |
Family
ID=14672282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11583498A Expired - Fee Related JP3408420B2 (en) | 1998-04-27 | 1998-04-27 | Circuit board layout |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3408420B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007253630A (en) * | 2007-05-16 | 2007-10-04 | Olympus Corp | Portable printer device |
-
1998
- 1998-04-27 JP JP11583498A patent/JP3408420B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH11307958A (en) | 1999-11-05 |
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