JP3396778B2 - Discharge treatment equipment - Google Patents

Discharge treatment equipment

Info

Publication number
JP3396778B2
JP3396778B2 JP2000064044A JP2000064044A JP3396778B2 JP 3396778 B2 JP3396778 B2 JP 3396778B2 JP 2000064044 A JP2000064044 A JP 2000064044A JP 2000064044 A JP2000064044 A JP 2000064044A JP 3396778 B2 JP3396778 B2 JP 3396778B2
Authority
JP
Japan
Prior art keywords
oxygen
gas
discharge
oxygen concentration
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000064044A
Other languages
Japanese (ja)
Other versions
JP2001246242A (en
Inventor
敏雄 鈴木
行平 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kasuga Denki Inc
Original Assignee
Kasuga Denki Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kasuga Denki Inc filed Critical Kasuga Denki Inc
Priority to JP2000064044A priority Critical patent/JP3396778B2/en
Publication of JP2001246242A publication Critical patent/JP2001246242A/en
Application granted granted Critical
Publication of JP3396778B2 publication Critical patent/JP3396778B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、フィルム等を表面
改質する放電処理装置、特に、改質による接着性を向上
させるため、酸素濃度を希釈化したガス雰囲気中で放電
処理する放電処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric discharge treatment apparatus for surface-modifying a film or the like, and more particularly to an electric discharge treatment apparatus for electric discharge treatment in a gas atmosphere diluted with oxygen concentration in order to improve adhesion by the modification. Regarding

【0002】[0002]

【従来の技術】この種の放電処理装置として、特開平6
−107828号公報には、処理室内に酸素濃度希釈化
のために希ガスを吹き込みながら、希ガス雰囲気中で放
電電極と対向電極との間に放電を生じさせ、処理室のエ
アーシール壁と対向電極との間の隙間である入口から同
様の隙間である出口へと、フッ素フィルムをロール状の
対向電極で案内しながら走行させて、フッ素フィルムの
表面を改質する方法が開示されている。
2. Description of the Related Art As a discharge processing device of this type, Japanese Patent Laid-Open No.
In Japanese Patent Laid-Open No. 107828/1997, while a rare gas is blown into the processing chamber to dilute the oxygen concentration, an electric discharge is generated between a discharge electrode and a counter electrode in a rare gas atmosphere to face an air seal wall of the processing chamber. A method is disclosed in which a surface of a fluorine film is modified by running a fluorine film while guiding it with a roll-shaped counter electrode from an inlet which is a gap between the electrode and an outlet which is a similar gap.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、処理室
内に希ガスを吹き込んで、処理室内を希ガス雰囲気とし
たとしても、酸素が、エアーシール壁との間の隙間であ
る入口からフィルムに随伴して入り込むことは避けられ
ないが、従来はこれを防止する手段がなかった。
However, even if a rare gas is blown into the processing chamber to create a rare gas atmosphere in the processing chamber, oxygen is accompanied by the film from the inlet which is a gap between the film and the air seal wall. It is inevitable that it will enter, but in the past there was no means to prevent this.

【0004】そこで、本発明の目的は、酸素がフィルム
等の処理対象物に随伴して処理室内に入り込むのを簡単
に抑止できて、処理効果を向上させることができる放電
処理装置を提供することにある。
Therefore, an object of the present invention is to provide an electric discharge treatment device which can easily prevent oxygen from entering the treatment chamber along with a treatment object such as a film and improve the treatment effect. It is in.

【0005】[0005]

【課題を解決するための手段】本発明は、処理室内の入
口付近に酸素抑止用ノズルを設け、このノズルから処理
対象物へ向かって酸素濃度希釈化のためのガスをナイフ
状に噴射して処理対象物に随伴する酸素の浸入を抑止す
るようにしたものである。
According to the present invention, an oxygen suppressing nozzle is provided near the inlet of a processing chamber, and a gas for diluting oxygen concentration is jetted in a knife shape from the nozzle toward the object to be processed. This is to prevent the invasion of oxygen accompanying the object to be treated.

【0006】酸素濃度希釈化のために処理室内に吹き込
むガスが窒素ガスである場合、酸素抑止用ノズルから噴
射するガスも窒素ガスとする。
When the gas blown into the processing chamber for diluting the oxygen concentration is nitrogen gas, the gas injected from the oxygen suppressing nozzle is also nitrogen gas.

【0007】放電電極と対向電極との間の放電領域にお
けるガス雰囲気を安定にするため、酸素抑止用ノズルと
放電電極との間に仕切板を配置する。
In order to stabilize the gas atmosphere in the discharge region between the discharge electrode and the counter electrode, a partition plate is arranged between the oxygen suppressing nozzle and the discharge electrode.

【0008】処理室内の酸素濃度を酸素濃度測定器で測
定すれば、酸素濃度に応じた制御ができる。
If the oxygen concentration in the processing chamber is measured by an oxygen concentration measuring device, control can be performed according to the oxygen concentration.

【0009】[0009]

【発明の実施の形態】次に、本発明の実施の形態を図面
に基づいて詳細に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings.

【0010】図1及び図2において、本放電処理装置
は、処理するフィルム1の幅員に合わせて全体として横
長であり、電極カバーである本体2の複数箇所が水平な
フレーム3に取付ボルト4にて高さ調整可能に垂設され
ていることにより、全体の高さを調整できるようになっ
ている。
In FIG. 1 and FIG. 2, the present electric discharge treatment apparatus is horizontally long as a whole according to the width of the film 1 to be treated, and a plurality of parts of a main body 2 which is an electrode cover are attached to a mounting frame 4 on a horizontal frame 3. The height is adjustable so that the entire height can be adjusted.

【0011】本体2内には、高電圧を印加される横長の
放電電極5が碍子6を介して垂設され、アースされたロ
ール状の対向電極7の真上でこれと対向していて、本体
2の内部空間は、本体2自体と対向電極7とで囲まれた
処理室8となっている。放電電極5は、フレーム3に垂
直に装着された高さ調整用ねじ棒9により、対向電極7
との間の隙間を例えば0.5〜8mmの範囲に調整でき
るようになっている。
In the main body 2, a horizontally long discharge electrode 5 to which a high voltage is applied is vertically provided via an insulator 6, and is directly above and opposed to a grounded roll-shaped counter electrode 7. The internal space of the main body 2 is a processing chamber 8 surrounded by the main body 2 itself and the counter electrode 7. The discharge electrode 5 is attached to the counter electrode 7 by a height adjusting screw rod 9 mounted vertically on the frame 3.
The gap between and can be adjusted within a range of 0.5 to 8 mm, for example.

【0012】処理するフィルム1は、ロール状の対向電
極7の矢印方向の回転により、対向電極7の円弧面に沿
って同方向に案内されて走行する。この走行するフィル
ム1との接触を避けながら本体2の下周縁と対向電極7
の表面との隙間を出来るだけ小さくしてエアーシールす
るため、本体2の前後には、エアーシール壁となる前後
のエアーシール板10・11が傾斜させて垂設されてい
る。その傾斜は、ロール状の対向電極7の中心部へ指向
する向きとなっている。
The film 1 to be processed is guided and runs in the same direction along the arc surface of the counter electrode 7 by the rotation of the roll-shaped counter electrode 7 in the direction of the arrow. While avoiding the contact with the running film 1, the lower peripheral edge of the main body 2 and the counter electrode 7
In order to make the gap between the surface of the main body 2 and the surface of the main body 2 as small as possible, the front and rear of the main body 2 are provided with the front and rear air seal plates 10 and 11 which are inclined and vertically provided. The inclination is directed toward the center of the roll-shaped counter electrode 7.

【0013】従って、フィルム1は、後側のエアーシー
ル板11と対向電極7との隙間である入口12から処理
室8内に入り、処理室8内で放電電極5と対向電極7と
の間の放電領域を通り過ぎてから、前側のエアーシール
板10と対向電極7との隙間である出口13より再び処
理室8外へ出る。後側のエアーシール板11と対向電極
7との隙間(入口12)及び前側のエアーシール板10
と対向電極7との隙間(出口13)は、エアーシール板
10・11により例えば0.5〜3mmに調整できるよ
うになっている。
Therefore, the film 1 enters the processing chamber 8 through the inlet 12 which is a gap between the air seal plate 11 on the rear side and the counter electrode 7, and in the processing chamber 8, between the discharge electrode 5 and the counter electrode 7. After passing through the discharge region of No. 2, the gas exits from the processing chamber 8 again through the outlet 13 which is a gap between the air seal plate 10 on the front side and the counter electrode 7. The gap (inlet 12) between the rear air seal plate 11 and the counter electrode 7 and the front air seal plate 10
The gap (outlet 13) between the counter electrode 7 and the counter electrode 7 can be adjusted to, for example, 0.5 to 3 mm by the air seal plates 10 and 11.

【0014】処理室8内の上部には、多数の噴射孔14
を有するガス吹き込み管15が架設されている。このガ
ス吹き込み管15は、放電処理によるフィルム1の改質
性を向上させるため、希ガスや不活性ガス、本例の場合
には窒素ガスを処理室8内に吹き込んで処理室8内の酸
素濃度を所定値以下に保つためのもので、多数の噴射孔
14からの窒素ガスの噴射方向を変えられる構造になっ
ている。
A large number of injection holes 14 are provided in the upper portion of the processing chamber 8.
A gas blowing pipe 15 having the above is installed. The gas blowing pipe 15 blows a rare gas or an inert gas, in the case of this example, a nitrogen gas into the processing chamber 8 in order to improve the reforming property of the film 1 by the electric discharge treatment, and oxygen in the processing chamber 8 is blown. This is for keeping the concentration below a predetermined value, and has a structure capable of changing the injection direction of nitrogen gas from a large number of injection holes 14.

【0015】また、処理室8内には、ガス吹き込み管1
5の下側に、放電電極5と後側のエアーシール板11と
の間を仕切る仕切板16が垂設され、更にこの仕切板1
6と後側のエアーシール板11との間に酸素抑止用ノズ
ル17が架設されている。この酸素抑止用ノズル17は
その噴射方向が可変となっていて、フィルム1の速度等
に応じて窒素ガスの噴射方向を調整する。
Further, in the processing chamber 8, the gas blowing pipe 1
A partition plate 16 for partitioning between the discharge electrode 5 and the rear air seal plate 11 is vertically provided under the partition plate 5.
An oxygen-suppressing nozzle 17 is installed between 6 and the rear air seal plate 11. The injection direction of the oxygen suppressing nozzle 17 is variable, and the injection direction of the nitrogen gas is adjusted according to the speed of the film 1 and the like.

【0016】酸素抑止用ノズル17は、ガス吹き込み管
15と同じガス、つまり窒素ガスを入口12に向けてナ
イフ状に噴射して、フィルム1に随伴して浸入してくる
酸素を抑止する。
The oxygen-suppressing nozzle 17 jets the same gas as the gas blowing pipe 15, that is, nitrogen gas, toward the inlet 12 in a knife shape, and suppresses the oxygen that is accompanied and intrudes into the film 1.

【0017】更に、処理室8内には、放電電極5と前側
のエアーシール板10との間の上方において、酸素濃度
を測定する酸素濃度測定器18が配設されている。
Further, in the processing chamber 8, an oxygen concentration measuring device 18 for measuring the oxygen concentration is arranged above the discharge electrode 5 and the air seal plate 10 on the front side.

【0018】本放電処理装置は上記のように構成されて
いるので、走行するフィルム1は、放電電極5と対向電
極7との間の放電により窒素ガス雰囲気中において表面
処理される。フィルム1には、入口12に付近で酸素抑
止用ノズル17から窒素ガスがナイフ状に吹き付けられ
ているので、フィルム1に随伴して入口12から入り込
んでくる酸素は、フィルム1上から切り取るようして処
理室8外へ返され、処理室8内への浸入を抑止される。
Since the present discharge treatment device is constructed as described above, the traveling film 1 is surface-treated in the nitrogen gas atmosphere by the discharge between the discharge electrode 5 and the counter electrode 7. Nitrogen gas is blown into the film 1 from the oxygen suppressing nozzle 17 near the inlet 12 in a knife shape, so that the oxygen that accompanies the film 1 and enters from the inlet 12 is cut off from the film 1. Are returned to the outside of the processing chamber 8 and are prevented from entering the inside of the processing chamber 8.

【0019】放電電極5側に仕切板16があるため、酸
素抑止用ノズル17から窒素ガスを噴射しても、放電電
極5と対向電極7との間の放電環境を安定に保つことが
できる。処理室8内の酸素濃度を酸素濃度測定器18に
て測定するので、その測定した濃度に応じてガス吹き込
み管15からの吹き込み量及び酸素抑止用ノズル17か
らの噴射量を自動調整することが可能である。
Since the partition plate 16 is provided on the discharge electrode 5 side, the discharge environment between the discharge electrode 5 and the counter electrode 7 can be kept stable even if nitrogen gas is jetted from the oxygen suppressing nozzle 17. Since the oxygen concentration in the processing chamber 8 is measured by the oxygen concentration measuring device 18, the blowing amount from the gas blowing pipe 15 and the injection amount from the oxygen suppressing nozzle 17 can be automatically adjusted according to the measured concentration. It is possible.

【0020】[0020]

【発明の効果】本発明によれば、酸素がフィルム等の処
理対象物に随伴して処理室内に入り込むのを抑止して、
処理効果を向上させることができる。
According to the present invention, it is possible to prevent oxygen from entering the processing chamber along with an object to be processed such as a film,
The processing effect can be improved.

【0021】請求項3によれば、酸素抑止用ノズルと放
電電極との間に仕切板を配置したので、酸素抑止用ノズ
ルからガスを噴射しても、放電電極と対向電極との間の
放電環境を安定に保てる。
According to the third aspect, since the partition plate is arranged between the oxygen suppressing nozzle and the discharge electrode, even if gas is injected from the oxygen suppressing nozzle, the discharge between the discharge electrode and the counter electrode is generated. The environment can be kept stable.

【0022】請求項4によれば、処理室内の酸素濃度を
測定するので、その測定した濃度に応じてガス吹き込み
管からの吹き込み量及び酸素抑止用ノズルからの噴射量
を自動調整することが可能である。
According to the fourth aspect, since the oxygen concentration in the processing chamber is measured, the blowing amount from the gas blowing pipe and the injection amount from the oxygen suppressing nozzle can be automatically adjusted according to the measured concentration. Is.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

【図2】同上の一部省略正面図である。FIG. 2 is a partially omitted front view of the above.

【符号の説明】 1 フィルム 2 本体 3 フレーム 4 取付ボルト 5 放電電極 6 碍子 7 対向電極 8 処理室 9 高さ調整用ねじ棒 10・11 エアーシール板 12 入口 13 出口 14 噴射孔 15 ガス吹き込み管 16 仕切板 17 酸素抑止用ノズル 18 酸素濃度測定器[Explanation of symbols] 1 film 2 body 3 frames 4 mounting bolts 5 discharge electrodes 6 insulator 7 Counter electrode 8 processing room 9 Height adjustment screw rod 10/11 Air seal plate 12 entrance 13 exit 14 injection holes 15 gas blowing pipe 16 partition boards 17 Oxygen suppression nozzle 18 Oxygen concentration measuring instrument

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B01J 19/08 H01L 21/00 - 21/98 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) B01J 19/08 H01L 21/00-21/98

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】処理室内に酸素濃度希釈化のためのガスを
吹き込みながら、そのガス雰囲気中で放電電極と対向電
極との間に放電を生じさせ、処理室のエアーシール壁と
対向電極との間の隙間である入口から同様の隙間である
出口へとフィルム等の処理対象物を走行させて、処理対
象物の表面を改質する放電処理装置において、前記処理
室内の前記入口付近に、処理対象物へ向かって酸素濃度
希釈化のためのガスをナイフ状に噴射して処理対象物に
随伴する酸素の浸入を抑止する酸素抑止用ノズルを設け
たことを特徴とする放電処理装置。
1. A gas for diluting an oxygen concentration is blown into a processing chamber, and a discharge is generated between a discharge electrode and a counter electrode in the gas atmosphere so that the air seal wall and the counter electrode in the process chamber are separated from each other. In the electric discharge treatment device that modifies the surface of the object to be treated by running the object to be treated such as an inlet from the inlet that is the gap between the inlet and the outlet that is the same gap, in the vicinity of the inlet in the treatment chamber, the treatment is performed. An electric discharge treatment apparatus comprising an oxygen suppressing nozzle for injecting a gas for diluting oxygen concentration toward a target object in a knife shape to suppress the invasion of oxygen accompanying the target object.
【請求項2】酸素濃度希釈化のためのガスが窒素ガスで
あることを特徴とする請求項1に記載の放電処理装置。
2. The discharge processing apparatus according to claim 1, wherein the gas for diluting the oxygen concentration is nitrogen gas.
【請求項3】酸素抑止用ノズルと放電電極との間に仕切
板を配置したことを特徴とする請求項1又は2に記載の
放電処理装置。
3. The discharge treatment apparatus according to claim 1, wherein a partition plate is arranged between the oxygen suppressing nozzle and the discharge electrode.
【請求項4】処理室内に、酸素濃度を測定する酸素濃度
測定器を配設したことを特徴とする請求項1、2又は3
に記載の放電処理装置。
4. An oxygen concentration measuring device for measuring oxygen concentration is provided in the processing chamber.
The electric discharge treatment device described in.
JP2000064044A 2000-03-08 2000-03-08 Discharge treatment equipment Expired - Fee Related JP3396778B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000064044A JP3396778B2 (en) 2000-03-08 2000-03-08 Discharge treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000064044A JP3396778B2 (en) 2000-03-08 2000-03-08 Discharge treatment equipment

Publications (2)

Publication Number Publication Date
JP2001246242A JP2001246242A (en) 2001-09-11
JP3396778B2 true JP3396778B2 (en) 2003-04-14

Family

ID=18583812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000064044A Expired - Fee Related JP3396778B2 (en) 2000-03-08 2000-03-08 Discharge treatment equipment

Country Status (1)

Country Link
JP (1) JP3396778B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6421962B1 (en) * 2017-08-09 2018-11-14 春日電機株式会社 Surface reformer
JP6598177B1 (en) * 2019-04-10 2019-10-30 春日電機株式会社 Surface modification method and surface modification apparatus

Also Published As

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JP2001246242A (en) 2001-09-11

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