JP3394820B2 - Piezo components - Google Patents
Piezo componentsInfo
- Publication number
- JP3394820B2 JP3394820B2 JP14442494A JP14442494A JP3394820B2 JP 3394820 B2 JP3394820 B2 JP 3394820B2 JP 14442494 A JP14442494 A JP 14442494A JP 14442494 A JP14442494 A JP 14442494A JP 3394820 B2 JP3394820 B2 JP 3394820B2
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- vibration damping
- piezoelectric substrate
- damping layer
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、圧電基板から外部接続
端子を突出させるとともに、圧電基板の表面に振動ダン
ピング層を形成した圧電部品に関する。
【０００２】
【従来の技術】従来から、ＴＳ（厚みすべり振動）モー
ドのセラミックフィルタといった圧電部品として、図３
に示すものがある。この圧電部品５０は、振動電極５１
を有する圧電基板５２に外部接続端子５３を半田付け等
により接続固定するとともに、圧電基板５２の表面にシ
リコンゴムからなる振動ダンピング層５４を形成して構
成されている。振動ダンピング層５４は、振動電極５１
を適度に振動させるとともに、不要振動を抑圧するため
に設けられている。なお、図中、符号５５は、圧電部品
５０の高さ方向の位置決めを目的として、外部接続端子
５３の中途部に設けられた鍔部である。
【０００３】このような構成の圧電部品５０において
は、外部接続端子５３を取り付けた圧電基板５２を液状
シリコン槽に浸漬する、いわゆるディッピング法、もし
くは、外部接続端子５３を取り付けた圧電基板５２に、
コテを用いて液状シリコンを点滴するといった手法によ
り、振動ダンピング層５４を形成するようになってい
た。
【０００４】
【発明が解決しようとする課題】しかしながら、従来の
圧電部品５０では、外部接続端子５３を上側にした状態
で振動ダンピング層材料の塗布、もしくは点滴を行う
と、振動ダンピング層材料が圧電基板５２の、図中、上
側端面から外側にはみ出た状態で固化して、外形寸法に
狂いが生じてしまう。そこで、このような不都合を避け
るために、外部接続端子５３を下側にした状態で振動ダ
ンピング層５４を形成していた。ところが、このように
しても、圧電基板５２表面上に塗布された振動ダンピン
グ層材料の一部が圧電基板５２から外部接続端子５３に
向けて流れ出て、外部接続端子５３上で垂れ下がってし
まい、このような振動ダンピング層５４の垂れにより、
外観不良が発生するという問題があった。
【０００５】したがって、本発明においては、外観不良
を引き起こす振動ディッピング層の垂れを防止するを目
的としている。
【０００６】
【課題を解決するための手段】このような目的を達成す
るために、本発明においては、圧電基板から外部接続端
子を突出させるとともに、この圧電基板の表面には振動
ダンピング層を形成した圧電部品であって、前記外部接
続端子は、その延出方向における前記圧電基板との境目
部分を含んで、端子先端側より拡幅された幅広部を有す
るとともに、この幅広部の端子先端側端部を前記圧電基
板から突出させたことに特徴がある。
【０００７】
【作用】上記構成によれば、振動ダンピング層を形成す
るために、圧電基板上に塗布された振動ダンピング層材
料が外部接続端子に向けて垂れ下がると、まず、前記圧
電基板との境目部分に設けれられた幅広部に流れ込むこ
とになる。幅広部に流れ込んだ振動ダンピング層材料
は、その表面張力により、幅広部より幅が狭くなった外
部接続端子の先端側へは流れ込みにくくなり、この幅広
部で受け止められることになる。つまり、幅広部は外部
接続端子に流れ込んだ振動ダンピング層材料をせき止め
るダムの働きを果たすことになる。
【０００８】
【実施例】以下、本発明の一実施例を図面を参照して詳
細に説明する。図１は本発明の一実施例の圧電部品の正
面図である。
【０００９】この圧電部品１は、ＴＳモードフィルタで
あって、振動電極２を有する圧電基板３を備えている。
圧電基板３の幅方向両端、および中央には、外部接続端
子４が半田付け等により接続固定されている。圧電基板
３の表面には振動電極２を覆ってシリコンゴムからなる
振動ダンピング層５が形成されている。振動ダンピング
層５は、振動電極２を適度に振動させるとともに、不要
振動を抑圧するために設けられている。外部接続端子４
の中途部には、圧電部品１の高さ方向の位置決めを行う
鍔部６が設けられている。鍔部６は、外部接続端子４の
先端部４ａより幅広に形成されている。
【００１０】この圧電部品１は、次に説明する外部接続
端子４の構成に特徴がある。すなわち、外部接続端子４
には、その延出方向における圧電基板３との境目部分を
含んで、端子先端部４ａ（鍔部６を除く）より拡幅され
た幅広部７を備えている。幅広部７の先端側端部７ａは
圧電基板３から若干突出しているとともに、外部接続端
子４の延出方向に対して直交する方向に切り取られてい
る。なお、本実施例の外部接続端子４は、圧電基板３に
当接する基部４ｂ全体を幅広に形成することで幅広部７
を構成している。
【００１１】このように構成された圧電部品１を製造す
るに際しては、従来例と同様、外部接続端子４を取り付
けた状態で、圧電基板３の表面に、ディッピング法、点
滴法（両方法とも従来例参照）により、振動ダンピング
層５となる材料（液状シリコン）を塗布するのである
が、圧電基板３表面上に塗布された振動ダンピング層材
料の一部は、圧電基板３から外部接続端子４（特に、中
央の外部接続端子４）に向けて流れ出てしまう。しかし
ながら、外部接続端子４に流れ出た振動ダンピング層材
料は、まず、圧電基板３との境目部分に設けられた幅広
部７に入り込むことになる。幅広部７に入り込んだ振動
ダンピング層材料は、さらに、外部接続端子４の先端側
に向けて流れ出ようとするが、振動ダンピング層材料の
表面張力が作用するために、幅広部７より狭幅となった
外部接続端子の先端側には流れ込みにくくなっている。
そのため、振動ダンピング層材料が、許容限界（これは
幅広部７の面積や幅広部７の先端側端部７ａの長さ等で
決定される）以上に幅広部７に入り込まない限り、振動
ダンピング層材料は幅広部７でせき止められて、幅広部
７より端子先端側に流れ込むことはない。そのため、振
動ダンピング層５の垂れ下がりを、幅広部７、すなわ
ち、圧電基板３近傍だけに限定することができ、振動ダ
ンピング層５の垂れ下がりによる外観不良は起きなくな
る。
【００１２】なお、上記実施例では、幅広部７の先端側
端部７ａを外部接続端子４の延出方向に対して直交する
方向に切り取っていたが、図２に示すように、幅広部７
の先端側端部７ａを階段状に切り取ってもよい。このよ
うに構成すれば、幅広部先端側端部７ａの長さが長くな
って、振動ダンピング層材料をせき止める力が増強され
ることになる。さらに、図示はしないが、幅広部先端側
端部７ａを円弧状に湾曲させてもよいし、幅広部先端側
端部７ａを先狭まり状に傾斜させてもよい。
【００１３】また、図１において、仮想線で示すよう
に、鍔部６のない外部接続端子４において本発明を実施
できるのもいうまでもない。
【００１４】さらにまた、上記実施例では、外部接続端
子４の基部４ｂ全体を幅広にすることで幅広部７を構成
していたが、本発明はこのような構成に限るわけではな
く、幅広部７は、外部接続端子４の、少なくとも、圧電
基板３との境目部分に設ければよく、そうすれば本発明
の効果を得ることができる。
【００１５】
【発明の効果】以上のように本発明によれば、外部接続
端子に設けた幅広部により、振動ダンピング層材料の垂
れを受け止めることで、振動ダンピング層材料が外部接
続端子上を垂れ下がることを防止できた。そのため、振
動ダンピング層材料の垂れ下がりを起因とする外観不良
がなくなるともに、外観不良による歩留まりの低下をな
くすことができた。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component having external connection terminals projecting from a piezoelectric substrate and having a vibration damping layer formed on the surface of the piezoelectric substrate. 2. Description of the Related Art Conventionally, as a piezoelectric component such as a TS (thickness shear vibration) mode ceramic filter, FIG.
There are the following. The piezoelectric component 50 includes a vibration electrode 51
The external connection terminals 53 are connected and fixed to the piezoelectric substrate 52 having soldering by soldering or the like, and a vibration damping layer 54 made of silicon rubber is formed on the surface of the piezoelectric substrate 52. The vibration damping layer 54 includes the vibration electrode 51
Is provided to moderately vibrate and suppress unnecessary vibration. In the drawing, reference numeral 55 denotes a flange provided at an intermediate portion of the external connection terminal 53 for the purpose of positioning the piezoelectric component 50 in the height direction. In the piezoelectric component 50 having such a configuration, a so-called dipping method in which the piezoelectric substrate 52 having the external connection terminals 53 attached thereto is immersed in a liquid silicon bath,
The vibration damping layer 54 has been formed by a technique such as instilling liquid silicon using a trowel. [0004] However, in the conventional piezoelectric component 50, when the material of the vibration damping layer is applied or drip is performed with the external connection terminal 53 being on the upper side, the material of the vibration damping layer becomes piezoelectric. The substrate 52 is solidified in a state of protruding outside from the upper end surface in the drawing, and the external dimensions are deviated. Therefore, in order to avoid such inconvenience, the vibration damping layer 54 is formed with the external connection terminal 53 facing down. However, even in this case, a part of the vibration damping layer material applied on the surface of the piezoelectric substrate 52 flows out from the piezoelectric substrate 52 toward the external connection terminal 53, and hangs down on the external connection terminal 53. Due to such a droop of the vibration damping layer 54,
There is a problem that poor appearance occurs. [0005] Therefore, an object of the present invention is to prevent the sagging of the vibration dipping layer which causes the appearance defect. In order to achieve the above object, according to the present invention, an external connection terminal is projected from a piezoelectric substrate, and a vibration damping layer is formed on the surface of the piezoelectric substrate. Wherein the external connection terminal has a wide portion wider than the terminal tip side, including a boundary portion with the piezoelectric substrate in an extending direction thereof, and a terminal tip end of the wide portion. It is characterized in that the portion protrudes from the piezoelectric substrate. According to the above construction, when the material of the vibration damping layer applied on the piezoelectric substrate hangs down toward the external connection terminals in order to form the vibration damping layer, first, the boundary between the piezoelectric substrate and the piezoelectric substrate is formed. It will flow into the wide part provided in the part. Due to the surface tension of the vibration damping layer material that has flowed into the wide portion, it is difficult for the vibration damping layer material to flow into the distal end side of the external connection terminal that is narrower than the wide portion, and is received by the wide portion. That is, the wide portion functions as a dam for damping the vibration damping layer material flowing into the external connection terminal. An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a front view of a piezoelectric component according to one embodiment of the present invention. The piezoelectric component 1 is a TS mode filter and includes a piezoelectric substrate 3 having a vibrating electrode 2.
External connection terminals 4 are connected and fixed to both ends and the center in the width direction of the piezoelectric substrate 3 by soldering or the like. A vibration damping layer 5 made of silicon rubber is formed on the surface of the piezoelectric substrate 3 so as to cover the vibration electrode 2. The vibration damping layer 5 is provided for appropriately vibrating the vibration electrode 2 and for suppressing unnecessary vibration. External connection terminal 4
A flange 6 for positioning the piezoelectric component 1 in the height direction is provided in the middle part. The flange 6 is formed wider than the tip 4 a of the external connection terminal 4. This piezoelectric component 1 is characterized by the configuration of an external connection terminal 4 described below. That is, the external connection terminal 4
Is provided with a wide portion 7 wider than the terminal tip portion 4a (excluding the flange portion 6), including a boundary portion with the piezoelectric substrate 3 in the extending direction. The distal end 7a of the wide portion 7 slightly protrudes from the piezoelectric substrate 3 and is cut in a direction orthogonal to the extending direction of the external connection terminal 4. Note that the external connection terminal 4 of the present embodiment has a wide portion 7 by forming the entire base 4b in contact with the piezoelectric substrate 3 wide.
Is composed. When manufacturing the piezoelectric component 1 configured as described above, the dipping method and the drip method (both conventional methods) are applied to the surface of the piezoelectric substrate 3 with the external connection terminals 4 attached, as in the conventional example. According to the example, the material (liquid silicon) to be the vibration damping layer 5 is applied, and a part of the vibration damping layer material applied on the surface of the piezoelectric substrate 3 is transferred from the piezoelectric substrate 3 to the external connection terminal 4 ( In particular, it flows toward the central external connection terminal 4). However, the vibration damping layer material that has flowed out to the external connection terminals 4 first enters the wide portion 7 provided at the boundary with the piezoelectric substrate 3. The vibration damping layer material that has entered the wide portion 7 further tries to flow toward the distal end side of the external connection terminal 4. However, since the surface tension of the vibration damping layer material acts, the vibration damping layer material has a smaller width than the wide portion 7. It is difficult to flow into the tip of the external connection terminal.
Therefore, as long as the vibration damping layer material does not enter the wide part 7 beyond the allowable limit (which is determined by the area of the wide part 7 and the length of the front end 7a of the wide part 7), the vibration damping layer The material is blocked by the wide portion 7 and does not flow into the terminal tip side from the wide portion 7. Therefore, the sagging of the vibration damping layer 5 can be limited only to the wide portion 7, that is, the vicinity of the piezoelectric substrate 3, and the appearance defect due to the sagging of the vibration damping layer 5 does not occur. In the above-described embodiment, the distal end 7a of the wide portion 7 is cut off in a direction perpendicular to the extending direction of the external connection terminal 4. However, as shown in FIG.
May be cut out in a step-like manner. According to this structure, the length of the wide end portion side end portion 7a is increased, and the force for damping the vibration damping layer material is increased. Further, although not shown, the wide portion distal end 7a may be curved in an arc shape, or the wide portion distal end 7a may be tapered and inclined. Also, as shown in FIG. 1, the present invention can be implemented in the external connection terminal 4 without the flange 6 as shown by the phantom line. Further, in the above-described embodiment, the wide portion 7 is formed by widening the entire base portion 4b of the external connection terminal 4. However, the present invention is not limited to such a structure, and the wide portion 7 is not limited to such a structure. 7 may be provided at least at the boundary between the external connection terminal 4 and the piezoelectric substrate 3, so that the effects of the present invention can be obtained. As described above, according to the present invention, the wide portion provided in the external connection terminal receives the droop of the vibration damping layer material, so that the vibration damping layer material hangs down on the external connection terminal. Was prevented. Therefore, the appearance defect due to the sagging of the vibration damping layer material was eliminated, and the decrease in the yield due to the appearance defect was eliminated.
【図面の簡単な説明】
【図１】本発明の一実施例に係る圧電部品の構造を示す
正面図である。
【図２】本発明の変形例を示す正面図である。
【図３】従来例の圧電部品の構造を示す正面図である。
【符号の説明】
３ 圧電基板
４ 外部接続端子
５ 振動ダンピング層
７ 幅広部
７ａ 幅広部の先端側端部BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view showing a structure of a piezoelectric component according to one embodiment of the present invention. FIG. 2 is a front view showing a modification of the present invention. FIG. 3 is a front view showing the structure of a conventional piezoelectric component. [Description of Signs] 3 Piezoelectric substrate 4 External connection terminal 5 Vibration damping layer 7 Wide part 7a End part on the tip side of wide part
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−85603（ＪＰ，Ａ) 実開 平４−76721（ＪＰ，Ｕ) ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-6-85603 (JP, A) Actual opening Hei 4-76721 (JP, U)
Claims (1)
とともに、この圧電基板の表面に振動ダンピング層を形
成した圧電部品であって前記外部接続端子は、その延出
方向における前記圧電基板との境目部分を含んで、端子
先端側より拡幅された幅広部を有するとともに、この幅
広部の端子先端側端部を前記圧電基板から突出させたこ
とを特徴とする圧電部品。(57) [Claim 1] A piezoelectric component having an external connection terminal protruding from a piezoelectric substrate and a vibration damping layer formed on a surface of the piezoelectric substrate, wherein the external connection terminal has an extension. A piezoelectric element having a wide portion that is wider than a terminal tip side, including a boundary portion with the piezoelectric substrate in an outgoing direction, and a terminal tip end portion of the wide portion protrudes from the piezoelectric substrate. parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14442494A JP3394820B2 (en) | 1994-06-27 | 1994-06-27 | Piezo components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14442494A JP3394820B2 (en) | 1994-06-27 | 1994-06-27 | Piezo components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0818386A JPH0818386A (en) | 1996-01-19 |
| JP3394820B2 true JP3394820B2 (en) | 2003-04-07 |
Family
ID=15361872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14442494A Expired - Lifetime JP3394820B2 (en) | 1994-06-27 | 1994-06-27 | Piezo components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3394820B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5916414A (en) * | 1996-08-22 | 1999-06-29 | Mitsubishi Heavy Industries, Ltd. | Glue applicator for corrugated board |
-
1994
- 1994-06-27 JP JP14442494A patent/JP3394820B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0818386A (en) | 1996-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3394820B2 (en) | Piezo components | |
| JP2001308673A5 (en) | ||
| JP2001144577A (en) | Piezoelectric resonator | |
| JP3449268B2 (en) | Semiconductor pressure sensor | |
| JP3735858B2 (en) | Soldering structure of parts to printed circuit board | |
| JP2004056296A (en) | Electronic component and surface acoustic wave device | |
| JP3633971B2 (en) | Surface mount crystal unit | |
| JPH0865093A (en) | Electronic component and manufacture thereof | |
| JPH0328596Y2 (en) | ||
| JP3976859B2 (en) | Crystal resonator electrode shape | |
| JP2004056295A (en) | Electronic component and surface acoustic wave apparatus | |
| JP3204486B2 (en) | Optical hybrid circuit | |
| JP2549911Y2 (en) | Ultrasonic transducer | |
| JPH0436558Y2 (en) | ||
| JP4039969B2 (en) | Package for electronic components | |
| JP3384296B2 (en) | Bare chip component mounting structure | |
| JPH07335679A (en) | Soldering structure for aluminum post | |
| JPH06314749A (en) | Semiconductor device | |
| JP2001257444A (en) | Electric connection structure of electronic component | |
| JPH098441A (en) | Semiconductor device | |
| JP2599581Y2 (en) | Support structure for piezoelectric vibrator | |
| JPH0730007A (en) | Package for semiconductor device | |
| JPH0750542A (en) | Piezo-resonator | |
| JPH03259609A (en) | Piezoelectric vibration component | |
| JPS6119214A (en) | Electrode structure of piezoelectric vibrator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090131 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090131 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100131 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110131 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110131 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120131 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120131 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130131 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130131 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140131 Year of fee payment: 11 |
|
| EXPY | Cancellation because of completion of term |