JP3391531B2 - Polyethylene resin composition and film comprising the composition - Google Patents
Polyethylene resin composition and film comprising the compositionInfo
- Publication number
- JP3391531B2 JP3391531B2 JP32664193A JP32664193A JP3391531B2 JP 3391531 B2 JP3391531 B2 JP 3391531B2 JP 32664193 A JP32664193 A JP 32664193A JP 32664193 A JP32664193 A JP 32664193A JP 3391531 B2 JP3391531 B2 JP 3391531B2
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- Prior art keywords
- film
- weight
- parts
- polyethylene resin
- acid amide
- Prior art date
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Description
【0001】[0001]
【産業上の利用分野】本発明は、抗ブロッキング性、滑
り性に優れ、フィルム同士の傷つき性を改良した、ポリ
エチレン系樹脂組成物及び該組成物からなるフィルムに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyethylene resin composition having excellent anti-blocking properties and slipperiness and improved scratch resistance between films, and a film comprising the composition.
【0002】[0002]
【従来の技術及び発明が解決しようとする課題】ポリエ
チレン系フィルムは、食品包装を始めとする種々の物品
の包装材料として広く使用されているが、該フィルムを
積み重ねるとフィルムが互いに密着する、いわゆるブロ
ッキングを起こし、包装等の作業性を著しく低下させた
り、開口性がひどく悪いときには使用できない欠点を有
している。BACKGROUND OF THE INVENTION Polyethylene-based films are widely used as packaging materials for various articles such as food packaging. When the films are stacked, the films adhere to each other, so-called It has a drawback that it causes blocking, remarkably lowers workability of packaging and the like, and cannot be used when opening property is bad.
【0003】従来、ポリエチレン系フィルムのブロッキ
ングを防止する手段として、微粒子のシリカ、タルク等
の無機物をポリエチレンに混合する方法が一般に実施さ
れている。しかしながら、上記無機物を使用してポリエ
チレン系フィルムに抗ブロッキング性を付与した場合、
透明性が著しく低下したり、フィルム同士が摩擦したと
き表面に傷が付くことにより透明性が悪化したりする欠
点があった。Conventionally, a method of mixing fine particles of an inorganic substance such as silica or talc with polyethylene is generally practiced as a means for preventing the blocking of the polyethylene film. However, when imparting anti-blocking properties to the polyethylene-based film using the above inorganic material,
There are drawbacks such that the transparency is remarkably lowered, or the surface is scratched when the films are rubbed with each other to deteriorate the transparency.
【0004】[0004]
【課題を解決するための手段】かかる事情に鑑み、本発
明者らは、従来の課題を解決することについて鋭意検討
した結果、ポリエチレン系樹脂に対し、架橋した樹脂粉
末を含有する樹脂組成物が、抗ブロッキング性、透明性
のバランスに優れ、かつ傷付きの少ないことを見出し、
本発明を完成するに至った。In view of such circumstances, the inventors of the present invention have earnestly studied to solve the conventional problems, and as a result, found that a resin composition containing a crosslinked resin powder with respect to a polyethylene resin Finds that it has a good balance of anti-blocking property and transparency, and has little scratches,
The present invention has been completed.
【0005】すなわち、本発明は、ポリエチレン系樹脂
100重量部に対し、平均粒径2〜15μmの樹脂粉末
である架橋ポリメタクリル酸メチル粉末0.05〜2重
量部を含有することを特徴とするポリエチレン系樹脂組
成物、及び該組成物からなるフィルムを提供するもので
ある。That is, the present invention relates to a resin powder having an average particle diameter of 2 to 15 μm with respect to 100 parts by weight of a polyethylene resin.
The present invention provides a polyethylene-based resin composition characterized by containing 0.05 to 2 parts by weight of crosslinked polymethylmethacrylate powder, and a film comprising the composition.
【0006】以下、本発明を詳細に説明する。本発明の
ポリエチレン系樹脂としては、エチレン−α−オレフィ
ン共重合体、低密度ポリエチレン、中密度ポリエチレ
ン、高密度ポリエチレン、エチレン−酢酸ビニル共重合
体、エチレン−アクリル酸共重合体、エチレン−アクリ
ル酸エステル共重合体、エチレン−メタアクリル酸共重
合体、エチレン−メタアクリル酸エステル共重合体等及
びこれらの混合物が挙げられる。The present invention will be described in detail below. Examples of the polyethylene-based resin of the present invention include ethylene-α-olefin copolymer, low-density polyethylene, medium-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid. Examples thereof include ester copolymers, ethylene-methacrylic acid copolymers, ethylene-methacrylic acid ester copolymers and the like, and mixtures thereof.
【0007】本発明で用いるポリエチレン系樹脂は、ラ
ジカル重合法またはイオン重合法により製造することが
できる。ラジカル重合法で得られるポリエチレン系樹脂
は、エチレン単独またはエチレンとラジカル重合し得る
単量体とを有機過酸化物や酸素等の遊離基発生剤を使用
して共重合することによって得られるものであり、ラジ
カル重合し得る単量体としては、例えばアクリル酸、メ
タアクリル酸等の不飽和カルボン酸及びそのエステル化
物や酸無水物、酢酸ビニル等のビニルエステル類などが
挙げられる。不飽和カルボン酸のエステル化物として
は、例えばアクリル酸エチル、メタクリル酸メチル、メ
タクリル酸グリシジル等が挙げられる。これらの単量体
は、一種のみならず二種以上用いることができる。ま
た、重合反応は、通常130〜300℃の重合温度下、
500〜3000kg/cm2 の重合圧力下で実施され
る。イオン重合法で得られるポリエチレン系樹脂は、エ
チレン単独またはエチレンと炭素数3〜18のα−オレ
フィンを遷移金属固体触媒またはメタロセン系均一触媒
を使用して重合することによって得られ、重合反応は通
常30℃ないし300℃の重合温度で、常圧ないし30
00kg/cm2 の重合圧力下、溶媒の存在下または不
存在下、気−固、液−固または均一液層下で実施され
る。なお、α−オレフィンとしては、例えばプロピレ
ン、ブテン−1、4−メチルペンテン−1、ヘキセン−
1、オクテン−1、デセン−1、オクタデセン−1等が
用いられるが、炭素数4〜10のα−オレフィンが好ま
しい。また、これらのα−オレフィンは、一種または二
種以上用いてもよい。The polyethylene resin used in the present invention can be produced by a radical polymerization method or an ionic polymerization method. The polyethylene resin obtained by the radical polymerization method is obtained by copolymerizing ethylene alone or ethylene and a monomer capable of radical polymerization with a free radical generator such as organic peroxide or oxygen. Examples of the radically polymerizable monomer include unsaturated carboxylic acids such as acrylic acid and methacrylic acid, their esterified products, acid anhydrides, and vinyl esters such as vinyl acetate. Examples of the esterified product of unsaturated carboxylic acid include ethyl acrylate, methyl methacrylate, glycidyl methacrylate and the like. These monomers may be used alone or in combination of two or more. The polymerization reaction is usually carried out at a polymerization temperature of 130 to 300 ° C.
It is carried out under a polymerization pressure of 500 to 3000 kg / cm 2 . The polyethylene-based resin obtained by the ionic polymerization method is obtained by polymerizing ethylene alone or ethylene and an α-olefin having 3 to 18 carbon atoms using a transition metal solid catalyst or a metallocene-based homogeneous catalyst, and the polymerization reaction is usually Polymerization temperature of 30 ° C to 300 ° C, atmospheric pressure to 30 ° C
It is carried out under a polymerization pressure of 00 kg / cm 2 , in the presence or absence of a solvent, in a gas-solid, liquid-solid or homogeneous liquid layer. Examples of the α-olefin include propylene, butene-1, 4-methylpentene-1, hexene-
1, octene-1, decene-1, octadecene-1 and the like are used, but α-olefins having 4 to 10 carbon atoms are preferable. These α-olefins may be used alone or in combination of two or more.
【0008】本発明で用いるポリエチレン系樹脂は、そ
の密度が通常0. 940g/cm3以下、好ましくは0.
900〜0. 935g/cm3 である。密度が0. 9
40g/cm3 より高いと、ナイロン等と複合フィルム
で包装材として使用する際に、低温あるいは高速でのヒ
ートシール性が劣る。The density of the polyethylene resin used in the present invention is usually 0.940 g / cm 3 or less, preferably 0.9.
It is 900 to 0.935 g / cm 3 . Density is 0.9
When it is higher than 40 g / cm 3 , the heat-sealing property at low temperature or high speed is poor when used as a packaging material with nylon or the like as a composite film.
【0009】また、本発明で用いるポリエチレン系樹脂
は、そのMFRが通常0. 1〜50g/10分、好まし
くは0. 8〜30g/10分の範囲である。The MFR of the polyethylene resin used in the present invention is usually in the range of 0.1 to 50 g / 10 minutes, preferably 0.8 to 30 g / 10 minutes.
【0010】本発明で用いる架橋ポリメタクリル酸メチ
ル粉末は、ポリエチレン系樹脂のフィルム成形温度、例
えば約130〜350℃において溶融しない平均粒径2
〜15μmの架橋樹脂粉末である。ポリメタクリル酸メ
チルを架橋する方法は、特に限定されるものではなく、
従来公知の架橋剤を用いる方法でよい。The crosslinked poly (methyl methacrylate) powder used in the present invention has an average particle size of 2 which does not melt at a film forming temperature of a polyethylene resin, for example, about 130 to 350 ° C.
It is a crosslinked resin powder having a particle size of 15 μm . The method for crosslinking polymethyl methacrylate is not particularly limited,
A method using a conventionally known crosslinking agent may be used.
【0011】上記樹脂粉末の配合量は、ポリエチレン系
樹脂100重量部に対し、0. 05〜2重量部である。
樹脂粉末が0. 05重量部未満では抗ブロッキング性が
劣り、2重量部を超えると透明性が劣る。The blending amount of the above resin powder is 0.05 to 2 parts by weight based on 100 parts by weight of the polyethylene resin.
If the amount of the resin powder is less than 0.05 parts by weight, the anti-blocking property is poor, and if it exceeds 2 parts by weight, the transparency is poor.
【0012】本発明のポリエチレン系樹脂組成物の製造
方法は、特に限定されるものではなく、例えば本発明で
用いる各成分を均一に混合する方法であればよい。混合
方法としては、各成分を前記範囲で公知の方法、例えば
バンバリーミキサー、ニーダー、二軸混練機等を用い
て、溶融混練後造粒する方法、あるいはバンバリーミキ
サーなどで各成分の高濃度のマスターバッチを作製して
おき、タンブラーブレンダー、タンブルミキサー、ヘン
シェルミキサーのような混合機を用いてドライブレンド
する方法、混合後、さらに単軸押出機、二軸押出機等で
溶融混練造粒する方法等を採用することができる。The method for producing the polyethylene resin composition of the present invention is not particularly limited, and may be, for example, a method of uniformly mixing the components used in the present invention. As a mixing method, each component is a known method in the above range, for example, using a Banbury mixer, a kneader, a twin-screw kneader or the like, a method of melt-kneading and granulating, or a high-concentration master of each component with a Banbury mixer or the like. A method of preparing a batch and dry blending using a mixer such as a tumbler blender, a tumble mixer, and a Henschel mixer, a method of performing melt-kneading granulation with a single-screw extruder, a twin-screw extruder, etc. after mixing Can be adopted.
【0013】次に、本発明の樹脂組成物は、滑剤として
有機脂肪酸アミドを用いてもよく、また、酸化防止剤、
帯電防止剤、無滴剤、耐候剤等のポリオレフィンに、通
常添加される各種配合剤を本発明の目的を損なわない範
囲で用いてもよい。Next, the resin composition of the present invention may use an organic fatty acid amide as a lubricant, and an antioxidant,
Various kinds of compounding agents which are usually added to polyolefins such as antistatic agents, anti-drip agents and weather-resistant agents may be used within a range that does not impair the object of the present invention.
【0014】上記有機脂肪酸アミドとしては、例えば飽
和脂肪酸アミド、不飽和脂肪酸アミド、飽和脂肪酸ビス
アミド、不飽和脂肪酸ビスアミド等が挙げられ、これら
は一種のみならず二種以上用いることができる。飽和脂
肪酸アミドとしては、例えばステアリン酸アミドやベヘ
ニン酸アミドなどがあり、不飽和脂肪酸アミドとして
は、例えばオレイン酸アミドやエルカ酸アミドなどが挙
げられる。また、飽和脂肪酸ビスアミドとしては、例え
ばエチレンビスステアリン酸アミド、不飽和脂肪酸ビス
アミドとしては、例えばエチレンビスオレイン酸アミ
ド、ヘキサメチレンビスオレイン酸アミド、N,N’ジ
オレイルセバシン酸アミドなどが挙げられる。これらの
中でもステアリン酸アミド、ベヘニン酸アミド、オレイ
ン酸アミド、エルカ酸アミド及びエチレンビスオレイン
酸アミド等が好ましい。有機脂肪酸アミドの配合量は、
ポリエチレン系樹脂100重量部に対し、通常0. 01
〜0. 5重量部である。Examples of the organic fatty acid amides include saturated fatty acid amides, unsaturated fatty acid amides, saturated fatty acid bisamides, unsaturated fatty acid bisamides, etc. These can be used not only in one kind but also in two or more kinds. Examples of the saturated fatty acid amide include stearic acid amide and behenic acid amide, and examples of the unsaturated fatty acid amide include oleic acid amide and erucic acid amide. Examples of the saturated fatty acid bisamide include ethylene bisstearic acid amide, and examples of the unsaturated fatty acid bisamide include ethylene bisoleic acid amide, hexamethylene bisoleic acid amide, and N, N ′ dioleyl sebacic acid amide. Among these, stearic acid amide, behenic acid amide, oleic acid amide, erucic acid amide and ethylenebisoleic acid amide are preferable. The amount of organic fatty acid amide compounded is
Usually 0.01 per 100 parts by weight of polyethylene resin
~ 0.5 parts by weight.
【0015】本発明のフィルムは、本発明の樹脂組成物
を原料樹脂として用い、原料樹脂が融解する温度以上で
インフレーション法、Tダイ法など公知の技術によって
製造できる。フィルムの厚さは、樹脂の押出速度とフィ
ルムの引張速度の選択によって調整できる。加工時の樹
脂温度は完全融解温度から350℃の範囲内で通常選ば
れる。The film of the present invention can be produced by using the resin composition of the present invention as a raw material resin by a known technique such as an inflation method or a T-die method at a temperature at which the raw material resin melts or higher. The thickness of the film can be adjusted by selecting the extrusion rate of the resin and the pulling rate of the film. The resin temperature during processing is usually selected within the range from the complete melting temperature to 350 ° C.
【0016】本発明のフィルムにおいて単層の場合、フ
ィルムの厚さは、5〜500μm、特に10〜200μ
mであることが望ましい。厚さがこの範囲より薄いと、
加工が困難な上にラミネーションする場合に取り扱いが
容易でなく、厚いと、加工が難しくなる。また、本発明
のフィルムは単層フィルムに限らず、ポリエチレン系樹
脂同志または他の熱可塑性樹脂との組合せにより、二層
または二層以上の共押出フィルムとすることができる。In the case of a single layer in the film of the present invention, the thickness of the film is 5 to 500 μm, particularly 10 to 200 μm.
It is desirable that it is m. If the thickness is less than this range,
In addition to being difficult to process, it is not easy to handle when laminating, and if it is thick, processing becomes difficult. Further, the film of the present invention is not limited to a monolayer film, and can be made into a two-layer or two-layer or more coextrusion film by combining polyethylene resins with each other or with another thermoplastic resin.
【0017】[0017]
【発明の効果】以上、詳述したように、本発明によれば
透明性を維持しつつ抗ブロッキング性、滑り性に優れ、
フィルム同士による傷付き性を改良したポリエチレン系
樹脂組成物及び該組成物からなるフィルムが提供でき
る。また、本発明のフィルムは、上記特性を有するの
で、包装用フィルムとして有用である。As described above in detail, according to the present invention, the transparency is maintained while the anti-blocking property and the slip property are excellent.
It is possible to provide a polyethylene resin composition having improved scratch resistance between films and a film made of the composition. Further, the film of the present invention has the above-mentioned properties and is useful as a packaging film.
【0018】[0018]
【実施例】次に、本発明を実施例に基づき説明するが、
本発明はこれらに何ら制限されるものではない。以下に
実施例および比較例における物性値の測定法を説明す
る。
(1)密度
JIS K6760に規定された方法に従った。
(2)メルトフローレート(MFR)
JIS K6760に規定された方法に従った。
(3)平均粒径
コールターカウンター(COULTER COUNTE
R)法によって求めた。
(4)Haze
ASTM D1003に準拠した。
(5)滑り性
(株)東洋精機製、摩擦角測定機を使用してサイズ10
0(縦)×63(横)×19(高)mm、重量1kgの
荷重を用いて、傾斜上昇速度2. 7゜/sec でフィルム
同志の滑り角度θを測定しtanθで表示した。この値
は小さい程滑り性が良好であることを示す。
(6)ブロッキング
フィルムを温度40℃、荷重30g/cm2 下で18時
間、フィルム密着を促進させた後、22cm×10cmにカ
ットした試験片を接着面10cm×10cmとなるよう治具
に固定し、剥離移動荷重速度20g/分で移動させたと
き、このフィルムが全部剥離するのに要した荷重(g/
100cm2 )で表す。
(7)傷付き性
外径10mmのステンレスパイプを二つ折りしたフィル
ムの間に通し、たるみを無くした状態で固定したフィル
ム面とシェーカの上に固定した治具フィルム面に接触さ
せる。60回/分の速度で40mm往復移動しながら1
分間フィルム同志を擦り合わせる。Hazeを測定し、
傷付き前後におけるHazeの差(ΔHaze)で表
す。数値の小さい程、傷が付きにくいことを示す。EXAMPLES Next, the present invention will be explained based on examples.
The present invention is not limited to these. The methods for measuring physical property values in Examples and Comparative Examples will be described below. (1) Density According to the method specified in JIS K6760. (2) Melt flow rate (MFR) According to the method specified in JIS K6760. (3) Average particle size Coulter counter
R) method. (4) Based on Haze ASTM D1003. (5) Sliding property, manufactured by Toyo Seiki Co., Ltd., size 10 using a friction angle measuring machine
Using a load of 0 (longitudinal) × 63 (horizontal) × 19 (high) mm and a weight of 1 kg, the sliding angle θ between the films was measured at a tilt rising speed of 2.7 ° / sec and displayed as tan θ. The smaller this value is, the better the slipperiness is. (6) The blocking film was accelerated at a temperature of 40 ° C. under a load of 30 g / cm 2 for 18 hours to promote film adhesion, and then a test piece cut into a size of 22 cm × 10 cm was fixed on a jig so that an adhesive surface was 10 cm × 10 cm. When the peeling moving load speed is 20 g / min, the load required for peeling the entire film (g /
It is represented by 100 cm 2 ). (7) Scratchability A stainless steel pipe having an outer diameter of 10 mm is passed between the folded films, and is brought into contact with the film surface fixed without sagging and the jig film surface fixed on the shaker. While reciprocating 40 mm at a speed of 60 times / minute, 1
Rub the films together for a minute. Measure Haze,
The difference in haze before and after scratching (ΔHaze). The smaller the number, the less likely it is to scratch.
【0019】次に、実施例、比較例で用いたポリエチレ
ン系樹脂について説明する。
LL−1:エチレン−ヘキセン−1共重合体 MFR=
2. 0g/10分、密度=0. 912g/cm3
LL−2:エチレン−ブテン−1共重合体 MFR=
2. 0g/10分、密度=0. 905g/cm3
LL−3:エチレン−ブテン−1共重合体 MFR=
2. 0g/10分、密度=0. 930g/cm3
LL−4:エチレン−ヘキセン−1共重合体 MFR=
20g/10分、密度=0. 920g/cm3
LL−5:エチレン−ブテン−1共重合体 MFR=
0. 8g/10分、密度=0. 919g/cm3
LL−6:エチレン−ブテン−1共重合体 MFR=
0. 8g/10分、密度=0. 925g/cm3
LD :エチレン重合体 MFR=2. 0g/10
分、密度=0. 923g/cm3
EVA :エチレン−酢酸ビニル共重合体 MFR=
2. 0g/10分、酢酸ビニル含有量=5wt%Next, the polyethylene resins used in Examples and Comparative Examples will be described. LL-1: ethylene-hexene-1 copolymer MFR =
2.0 g / 10 minutes, density = 0.912 g / cm 3 LL-2: ethylene-butene-1 copolymer MFR =
2.0 g / 10 minutes, density = 0.905 g / cm 3 LL-3: ethylene-butene-1 copolymer MFR =
2.0 g / 10 min, density = 0.930 g / cm 3 LL-4: ethylene-hexene-1 copolymer MFR =
20 g / 10 min, density = 0.920 g / cm 3 LL-5: ethylene-butene-1 copolymer MFR =
0.8 g / 10 min, density = 0.919 g / cm 3 LL-6: ethylene-butene-1 copolymer MFR =
0.8 g / 10 min, density = 0.925 g / cm 3 LD: ethylene polymer MFR = 2.0 g / 10
Min, density = 0.923 g / cm 3 EVA: ethylene-vinyl acetate copolymer MFR =
2.0g / 10min, vinyl acetate content = 5wt%
【0020】実施例1
ポリエチレン系樹脂LL−1 100重量部に対し、平
均粒径3. 0μmの架橋ポリメタクリル酸メチル(松本
油脂(株)製マツモトマイクロスフェアーM−201)
0. 5重量部及びエルカ酸アミド0. 06重量部をそれ
ぞれ配合した樹脂組成物を、50mmφ押出機(田辺プラ
スチックス(株)製、スクリューL/D=32)に、ダ
イ巾400mm、ダイリップ0. 7mm、ストレートマニー
ホールド型のT−ダイを取り付け、ダイ設定温度240
℃、押出量10kg/hrの条件下で75℃にコントロ
ールされた600mmセミマットロールで冷却し、紙管に
巻き取ることにより厚さ50μmのフィルムを得た。評
価結果を表1に示す。Example 1 100 parts by weight of polyethylene resin LL-1 and 100 parts by weight of crosslinked polymethylmethacrylate having an average particle size of 3.0 μm (Matsumoto Microsphere M-201 manufactured by Matsumoto Yushi Co., Ltd.)
The resin composition in which 0.5 parts by weight and 0.06 parts by weight of erucic acid amide were respectively mixed was placed in a 50 mmφ extruder (manufactured by Tanabe Plastics Co., Ltd., screw L / D = 32), a die width of 400 mm and a die lip of 0. .7 mm, straight manifold hold type T-die attached, die set temperature 240
A film having a thickness of 50 μm was obtained by cooling with a 600 mm semi-matt roll controlled at 75 ° C. under the conditions of 0 ° C. and an extrusion rate of 10 kg / hr, and winding the film on a paper tube. The evaluation results are shown in Table 1.
【0021】実施例2
実施例1で用いた架橋ポリメタクリル酸メチルを、平均
粒径5. 3μmの架橋ポリメタクリル酸メチル(日本純
薬(株)製ジュリマーMB−SX)0. 5重量部とした
以外は、実施例1と同様の方法でフィルム加工した。評
価結果を表1に示す。Example 2 0.5 parts by weight of the crosslinked polymethylmethacrylate used in Example 1 was added to the crosslinked polymethylmethacrylate having an average particle size of 5.3 μm (Jurimer MB-SX manufactured by Nippon Pure Chemical Industries, Ltd.). A film was processed in the same manner as in Example 1 except that the above was performed. The evaluation results are shown in Table 1.
【0022】実施例3
ポリエチレン系樹脂LL−2 100重量部に対し、平
均粒径6.5μmの架橋ポリメタクリル酸メチル(日本
触媒(株)製エポスタMA1006)0. 5重量部、エ
ルカ酸アミド0. 06重量部を配合した以外は、実施例
1と同様の方法でフィルム加工した。評価結果を表1に
示す。Example 3 0.5 part by weight of crosslinked polymethylmethacrylate (Eposta MA1006 manufactured by Nippon Shokubai Co., Ltd.) having an average particle size of 6.5 μm and 100 parts by weight of erucamide were added to 100 parts by weight of polyethylene resin LL-2. A film was processed in the same manner as in Example 1 except that 0.06 part by weight was blended. The evaluation results are shown in Table 1.
【0023】比較例1
実施例1で用いた架橋ポリメタクリル酸メチルの代わり
に、平均粒径5.5μmのシリカ0.5重量部とした以
外は、実施例1と同様の方法でフィルム加工した。評価
結果を表1に示す。Comparative Example 1 A film was processed in the same manner as in Example 1 except that 0.5 part by weight of silica having an average particle size of 5.5 μm was used in place of the crosslinked polymethylmethacrylate used in Example 1. . The evaluation results are shown in Table 1.
【0024】比較例2
実施例1で用いた架橋ポリメタクリル酸メチルの代わり
に、平均粒径5.1μmのアルミノシリケート0.5重
量部とした以外は、実施例1と同様の方法でフィルム加
工した。評価結果を表1に示す。Comparative Example 2 A film was processed in the same manner as in Example 1 except that 0.5 part by weight of an aluminosilicate having an average particle size of 5.1 μm was used in place of the crosslinked polymethyl methacrylate used in Example 1. did. The evaluation results are shown in Table 1.
【0025】比較例5
実施例1で用いた架橋ポリメタクリル酸メチルの代わり
に、平均粒径4. 5μmの架橋シリコーン樹脂(東芝シ
リーコーン(株)製トスパール145)0. 5重量部と
した以外は、実施例1と同様の方法でフィルム加工し
た。評価結果を表1に示す。 Comparative Example 5 In place of the crosslinked polymethylmethacrylate used in Example 1, 0.5 part by weight of a crosslinked silicone resin having an average particle size of 4.5 μm (TOSPEARL 145 manufactured by Toshiba Silycorn Co., Ltd.) was used. Was processed into a film in the same manner as in Example 1. The evaluation results are shown in Table 1.
【0026】実施例5
ポリエチレン系樹脂LL−3 100重量部に対し、平
均粒径2. 5μmの架橋ポリメタクリル酸メチル(綜研
化学(株)製MR−2G)0. 2重量部及びエルカ酸ア
ミド0. 05重量部を配合し、セミマットロール温度を
50℃とした以外は、実施例1と同様の方法でフィルム
加工した。評価結果を表1に示す。Example 5 0.2 parts by weight of crosslinked polymethylmethacrylate (MR-2G manufactured by Soken Chemical Co., Ltd.) having an average particle diameter of 2.5 μm and erucic acid amide per 100 parts by weight of polyethylene resin LL-3. A film was processed in the same manner as in Example 1 except that 0.05 part by weight was compounded and the semi-matte roll temperature was set to 50 ° C. The evaluation results are shown in Table 1.
【0027】比較例3
実施例5で用いた架橋ポリメタクリル酸メチルの代わり
に、平均粒径3.1μmのシリカ0.2重量部とし、セ
ミマットロール温度を50℃とした以外は、実施例1と
同様の方法でフィルム加工した。評価結果を表1に示
す。Comparative Example 3 Example 1 was repeated except that 0.2 part by weight of silica having an average particle size of 3.1 μm was used instead of the crosslinked polymethylmethacrylate used in Example 5 and the semi-mat roll temperature was 50 ° C. The film was processed in the same manner as in. The evaluation results are shown in Table 1.
【0028】実施例6
ポリエチレン系樹脂LL−4 100重量部に対し、平
均粒径13μmの架橋ポリメタクリル酸メチル(日本触
媒(株)製エポスタMA1013)0. 5重量部を配合
し、ダイ設定温度を210℃とした以外は、実施例1と
同様の方法でフィルム加工した。評価結果を表1に示
す。Example 6 0.5 part by weight of crosslinked polymethylmethacrylate (Eposta MA1013 manufactured by Nippon Shokubai Co., Ltd.) having an average particle size of 13 μm was added to 100 parts by weight of polyethylene resin LL-4, and a die set temperature was set. Was processed in the same manner as in Example 1 except that the temperature was set to 210 ° C. The evaluation results are shown in Table 1.
【0029】実施例7
ポリエチレン系樹脂LL−5 80重量%にLDを20
重量%を加えて造粒した樹脂混合物100重量部に対
し、平均粒径3. 0μmの架橋ポリメタクリル酸メチル
(松本油脂(株)製マツモトマイクロスフェアーM20
1)0. 4重量部、エルカ酸アミド0. 15重量、ステ
アリン酸アミド0. 04重量部をそれぞれ配合した樹脂
組成物を、ダイ径125mmφ、ダイリップ2. 0mmのス
パイラルダイおよびアイリス付きエアーリングを備えた
インフレ成形機(プラコー製、スクリュー50mmφ、L
/D=28)を用いて、ダイ設定温度200℃、押出量
25kg/hrの条件下で押出し、ブローアップ比1.
8で厚さ30μmのフィルムを得た。評価結果を表1に
示す。Example 7 Polyethylene resin LL-5 80% by weight and 20 LD
To 100 parts by weight of the resin mixture obtained by adding the mixture by weight of 100% by weight, crosslinked polymethylmethacrylate having an average particle diameter of 3.0 μm (Matsumoto Microsphere M20 manufactured by Matsumoto Yushi Co., Ltd.)
1) A resin composition containing 0.4 parts by weight, 0.15 parts by weight of erucic acid amide and 0.04 parts by weight of stearic acid amide, respectively, was put into a spiral die having a die diameter of 125 mmφ, a die lip of 2.0 mm and an air ring with an iris. Inflation molding machine equipped (made by Placo, screw 50 mmφ, L
/ D = 28) and extruded under conditions of a die set temperature of 200 ° C. and an extrusion rate of 25 kg / hr, and a blow-up ratio of 1.
In 8, a film having a thickness of 30 μm was obtained. The evaluation results are shown in Table 1.
【0030】比較例4
実施例7で用いた架橋ポリメタクリル酸メチルの代わり
に、平均粒径3. 0μmのアルミノシリケート0.4重
量部とした以外は、実施例7と同様の方法でフィルム加
工した。評価結果を表1に示す。Comparative Example 4 A film was processed in the same manner as in Example 7 except that 0.4 part by weight of an aluminosilicate having an average particle size of 3.0 μm was used in place of the crosslinked polymethylmethacrylate used in Example 7. did. The evaluation results are shown in Table 1.
【0031】実施例8
ポリエチレン系樹脂LL−6 80重量%とLD 20
重量%の合計100重量部に対し、平均粒径3. 0μm
の架橋ポリメタクリル酸メチル(松本油脂(株)製マツ
モトマイクロスフェアーM201)0. 3重量部及びエ
ルカ酸アミド0. 12重量部を配合した以外は、実施例
7と同様の方法でフィルム加工した。評価結果を表1に
示す。Example 8 Polyethylene resin LL-6 80% by weight and LD 20
Average particle size of 3.0 μm with respect to 100 parts by weight in total
A film was processed in the same manner as in Example 7 except that 0.3 part by weight of cross-linked polymethyl methacrylate (Matsumoto Yushi Co., Ltd. Matsumoto Microspheres M201) and 0.12 part by weight of erucamide were blended. . The evaluation results are shown in Table 1.
【0032】実施例9
ポリエチレン系樹脂LD100重量部に対し、平均粒径
3. 0μmの架橋ポリメタクリル酸メチル(松本油脂
(株)製マツモトマイクロスフェアーM201)0. 0
8重量部及びオレイン酸アミド0.08重量部を配合し
た樹脂組成物を、ダイ径100mmφ、ダイリップ0. 8
mmのスパイラルダイおよびエアーリングを備えたインフ
レ成形機(トミー製、スクリュー50mmφ、L/D=2
8)を用いて、ダイ設定温度150℃、押出量20kg
/hrの条件下で押出し、ブローアップ比1. 8で厚さ
30μmのフィルムを得た。評価結果を表1に示す。Example 9 Crosslinked polymethylmethacrylate (Matsumoto Microsphere M201 manufactured by Matsumoto Yushi Co., Ltd.) having an average particle size of 3.0 μm was added to 100 parts by weight of LD of polyethylene resin.
A resin composition containing 8 parts by weight and 0.08 parts by weight of oleic acid amide was used, and a die diameter of 100 mmφ and a die lip of 0.8
Inflation molding machine equipped with spiral die and air ring of mm (made by Tommy, screw 50mmφ, L / D = 2
Using 8), die set temperature 150 ° C, extrusion rate 20 kg
The film having a blow-up ratio of 1.8 and a thickness of 30 μm was obtained by extrusion under the condition of / hr. The evaluation results are shown in Table 1.
【0033】実施例10
実施例9で用いたLDの代わりにEVAとし、実施例9
で用いたオレイン酸アミドの代わりにオレイン酸アミド
0.08重量部及びステアリン酸アミド0.04重量部
とした以外は、実施例9と同様の方法でフィルム加工し
た。評価結果を表1に示す。Example 10 In place of the LD used in Example 9, EVA was used, and Example 9 was used.
A film was processed in the same manner as in Example 9 except that 0.08 parts by weight of oleic acid amide and 0.04 part by weight of stearic acid amide were used in place of the oleic acid amide used in Step 1. The evaluation results are shown in Table 1.
【0034】[0034]
【表1】 [Table 1]
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭50−51142(JP,A) 特開 昭57−131254(JP,A) 特開 昭62−215646(JP,A) 特開 平4−189837(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08L 23/00 - 23/36 C08K 3/00 - 13/08 C08J 5/18 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-50-51142 (JP, A) JP-A-57-131254 (JP, A) JP-A-62-215646 (JP, A) JP-A-4- 189837 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C08L 23/00-23/36 C08K 3/00-13/08 C08J 5/18
Claims (3)
平均粒径2〜15μmの樹脂粉末である架橋ポリメタク
リル酸メチル粉末0.05〜2重量部を含有することを
特徴とするポリエチレン系樹脂組成物。1. To 100 parts by weight of polyethylene resin,
A polyethylene resin composition comprising 0.05 to 2 parts by weight of crosslinked polymethylmethacrylate powder, which is a resin powder having an average particle size of 2 to 15 μm .
からなることを特徴とするフィルム。2. A film comprising the polyethylene resin composition according to claim 1 .
2記載のフィルム。3. The film is, claim a packaging film
The film according to 2 .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32664193A JP3391531B2 (en) | 1993-12-24 | 1993-12-24 | Polyethylene resin composition and film comprising the composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32664193A JP3391531B2 (en) | 1993-12-24 | 1993-12-24 | Polyethylene resin composition and film comprising the composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07179679A JPH07179679A (en) | 1995-07-18 |
JP3391531B2 true JP3391531B2 (en) | 2003-03-31 |
Family
ID=18190059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32664193A Ceased JP3391531B2 (en) | 1993-12-24 | 1993-12-24 | Polyethylene resin composition and film comprising the composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3391531B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11147294A (en) * | 1997-11-19 | 1999-06-02 | Dainippon Printing Co Ltd | Chemical-resistant laminated film and paper container composed of laminated body thereof |
JP4558143B2 (en) * | 2000-05-31 | 2010-10-06 | 神東塗料株式会社 | Anionic electrodeposition paint and electrodeposition coating method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1049185A (en) * | 1973-08-31 | 1979-02-20 | Rohm And Haas Company | Surface altering agent for thermoplastic polymers |
JPS57131254A (en) * | 1981-02-09 | 1982-08-14 | Mitsubishi Rayon Co Ltd | Thermoplastic resin composition having improved blocking resistance |
JPS62215646A (en) * | 1986-03-17 | 1987-09-22 | Mitsubishi Petrochem Co Ltd | Propylene polymer composition |
JPH04189837A (en) * | 1990-11-22 | 1992-07-08 | Kao Corp | Fine particle-containing polyolefin film |
-
1993
- 1993-12-24 JP JP32664193A patent/JP3391531B2/en not_active Ceased
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JPH07179679A (en) | 1995-07-18 |
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