JP3391427B2 - Plated copper alloy sheet and connector manufactured from the sheet - Google Patents
Plated copper alloy sheet and connector manufactured from the sheetInfo
- Publication number
- JP3391427B2 JP3391427B2 JP11904996A JP11904996A JP3391427B2 JP 3391427 B2 JP3391427 B2 JP 3391427B2 JP 11904996 A JP11904996 A JP 11904996A JP 11904996 A JP11904996 A JP 11904996A JP 3391427 B2 JP3391427 B2 JP 3391427B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- thin plate
- alloy thin
- plated
- underlayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Electroplating Methods And Accessories (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、コネクタ、特に
多ピンコネクタを作るためのＳｎまたはＳｎ合金を仕上
げメッキしたメッキ銅合金薄板およびそのＳｎまたはＳ
ｎ合金を仕上げメッキしたメッキ銅合金薄板で製造した
コネクタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plated copper alloy thin plate which is finish-plated with Sn or Sn alloy for making a connector, particularly a multi-pin connector, and the Sn or S thereof.
The present invention relates to a connector manufactured from a plated copper alloy thin plate obtained by finish plating an n alloy.
【０００２】[0002]
【従来の技術】一般に、コネクタはＣｕ−Ｚｎ合金（例
えば、Ｃ２６００）、Ｃｕ−Ｓｎ−Ｐ合金（例えば、Ｃ
５１９１）、Ｍｇ：０．３〜２重量％、Ｐ：０．００１
〜０．１重量％を含有し、残りがＣｕおよび不可避不純
物からなる組成を有する銅合金などの銅合金薄板を切断
して条とし、これをプレス加工、打抜き加工、曲げ加工
などの金属加工を施すことにより作製される。この場
合、得られたコネクタの良好な接触性や熱安定性を得る
とともに経済性を目的に銅合金条の段階でメッキした
り、あるいは最終的に加工を施した後Ｓｎメッキ、Ｓｎ
−Ｐｂ合金などのＳｎ合金メッキを施すことが多く行わ
れている。2. Description of the Related Art Generally, connectors are made of Cu--Zn alloy (for example, C2600), Cu--Sn--P alloy (for example, C2600).
5191), Mg: 0.3-2% by weight, P: 0.001
To 0.1% by weight and the balance is Cu and unavoidable impurities, and a copper alloy thin plate such as a copper alloy is cut into strips, which are subjected to metal working such as pressing, punching and bending. It is produced by applying. In this case, for the purpose of obtaining good contact property and thermal stability of the obtained connector, and also for economical efficiency, plating is performed at the stage of copper alloy strip, or finally processed, and then Sn plating, Sn plating are performed.
In many cases, Sn alloy plating such as -Pb alloy is applied.
【０００３】この時のＳｎメッキ仕上げ層またはＳｎ合
金メッキ仕上げ層は、銅合金薄板の上にＣｕまたはＮｉ
の下地層を形成し、この下地層の上に電気メッキ法によ
り形成される。また、電気メッキした後リフロー処理を
施すことにより表面部を溶融処理する方法、溶融したメ
ッキ浴に銅合金薄板を通す溶融メッキ法が施されること
も知られている。At this time, the Sn plating finish layer or the Sn alloy plating finish layer is Cu or Ni on the copper alloy thin plate.
Is formed on the underlayer by electroplating. It is also known that a method of melting the surface portion by performing reflow processing after electroplating and a method of hot dipping in which a thin copper alloy plate is passed through a molten plating bath are known.
【０００４】[0004]
【発明が解決しようとする課題】近年、電気・電子回路
部品は、多機能化に伴って回路数が増大し、これら回路
を供給するコネクタも多極化が進み、ピン数も２０以上
ある多ピンコネクタの需要が増大してきている。例え
ば、自動車の組み立て工程では、人力によるコネクタの
装着工程が必要とされるが、多ピン化に伴う挿入力の増
大が作業員の疲労をもたらし、大きな問題になってきて
いる。そのため挿入力の小さな多ピンコネクタが求めら
れているが、挿入力を小さくすると離脱しやすくなって
装着性が不安定となる。また、これら多ピンコネクタは
自動車のエンジン廻りのような高温で振動のある環境下
で使用されることがあるが、高温に長時間さらされても
接触抵抗が増大することがなく、さらに把持力が変化せ
ず、エンジンなどの振動により外れることのない安定し
た装着を確保できるコネクタも求められている。In recent years, the number of circuits in electric / electronic circuit parts has increased along with the increase in the number of functions, and the connectors for supplying these circuits have also become multipolar, and the number of pins is 20 or more. Demand is increasing. For example, in a process of assembling an automobile, a process of mounting a connector by human power is required, but an increase in insertion force due to the increase in the number of pins causes fatigue of a worker, which is becoming a big problem. Therefore, a multi-pin connector with a small insertion force is required, but if the insertion force is reduced, it is easy to detach and the mountability becomes unstable. In addition, these multi-pin connectors are sometimes used in environments with high temperatures and vibration, such as around automobile engines, but the contact resistance does not increase even when exposed to high temperatures for a long time, and the gripping force is further increased. There is also a demand for a connector that does not change and that can be stably mounted so that it does not come off due to vibration of the engine or the like.
【０００５】[0005]
【課題を解決するための手段】そこで、本発明者らは、
かかる観点から、多ピンコネクタであっても装着しやす
く、かつ自動車のエンジン廻りのような高温で振動のあ
る環境下で使用しても接触抵抗が増大することがなく、
また外れることのない優れた接続強度を示す多ピンコネ
クタを得るべく研究を行った結果、（ａ）ＪＩＳ Ｚ
２２５１で規定されるヌープ硬さが荷重：９８．０７×
１０ -3ニュートン（１０ｇ）で７０〜１４０（以下、７
０〜１４０ＨＫ０．０１と記す）かつ０．２４５２ニュ
ートン（２５ｇ）で９０〜１８０（以下、９０〜１８０
ＨＫ０．０２５と記す）の範囲内にあるメッキ銅合金薄
板で作製したコネクタ、または、（ｂ）ＪＩＳ Ｚ ２
２５１で規定されるヌープ硬さが７０〜１４０ＨＫ０．
０１でかつ９０〜１８０ＨＫ０．０２５の範囲内にあ
り、かつＡＳＴＭ−Ｄ１８９４で規定される測定方法に
より測定された荷重：５．８８４ニュートン（６００
ｇ）での静止摩擦係数が０．３〜０．５５、運動摩擦係
数が０．２０〜０．４５であるメッキ銅合金薄板で作製
したコネクタ、は挿入力が小さく、かつ離脱力が大きく
て振動のある環境下で使用しても離脱することがなく、
さらに、（ｃ）ＪＩＳ Ｚ ２２５１で規定されるヌー
プ硬さが７０〜１４０ＨＫ０．０１でかつ９０〜１８０
ＨＫ０．０２５の範囲内にあり、かつＡＳＴＭ−Ｄ１８
９４で規定される測定方法により測定された荷重：５．
８８４ニュートン（６００ｇ）での静止摩擦係数が０．
３〜０．５５、運動摩擦係数が０．２０〜０．４５であ
り、前記銅合金薄板がＮｉ：０．５〜３重量％、Ｓｉ：
０．０８〜０．７重量％、Ｓｎ：０．１〜０．９重量
％、Ｚｎ：０．１〜３重量％、Ｆｅ：０．００７〜０．
２５重量％、Ｐ：０．００１〜０．２重量％、Ｍｇ：
０．００１〜０．２重量％、Ｃｒ：０．０１〜０．２重
量％、Ｐｂ：０．００１〜０．０１重量％を含有し、さ
らにＬｉ、Ｉｎ、Ｂａ、Ｐｄ、Ａｕ、Ｐｔ、Ｒｈおよび
Ｉｒのうちの１種または２種以上を合計で０．０００２
〜０．０５重量％を含有し、残りがＣｕおよび不可避不
純物からなる組成を有する銅合金からなる銅合金薄板で
あると、自動車のエンジン廻りのような高温で振動のあ
る環境下で使用しても接触抵抗および把持力が変化せ
ず、エンジンなどの振動により離脱することのない安定
した装着を確保できるという知見を得たのである。Therefore, the present inventors have
From this point of view, it is easy to install even a multi-pin connector
In addition, there is no vibration at high temperature such as around the engine of a car.
The contact resistance does not increase even when used in an environment where
In addition, a multi-pin connector with excellent connection strength that does not come off
As a result of conducting research to obtain Kuta, (a) JIS Z
The Knoop hardness specified by 2251 is a load: 98.07 x
10 -370-140 (hereinafter 7
0-140HK 0.01) and 0.2452 new
90 to 180 in ton (25g) (hereinafter, 90 to 180)
Plated copper alloy thin film within the range of HK0.025)
Connector made of plate, or (b) JIS Z 2
The Knoop hardness specified by 251 is 70 to 140HK0.
01 and within the range of 90 to 180HK0.025
And the measurement method specified in ASTM-D1894
Load measured by: 5.884 Newton (600
The coefficient of static friction in g) is 0.3 to 0.55, and the kinetic friction coefficient
Made of plated copper alloy thin plate whose number is 0.20 to 0.45
Connector has a small insertion force and a large detachment force.
Will not come off even if used in an environment with vibration,
Furthermore, (c) the wildebeest prescribed in JIS Z 2251.
Hardness is 70-140HK0.01 and 90-180
Within HK 0.025 and ASTM-D18
Load measured by the measuring method specified in 94: 5.
The coefficient of static friction at 884 Newton (600 g) is 0.
3 to 0.55, kinetic friction coefficient is 0.20 to 0.45
The copper alloy thin plate contains Ni: 0.5 to 3% by weight, Si:
0.08-0.7 wt%, Sn: 0.1-0.9 wt
%, Zn: 0.1 to 3% by weight, Fe: 0.007 to 0.
25% by weight, P: 0.001-0.2% by weight, Mg:
0.001-0.2 wt%, Cr: 0.01-0.2 wt
%, Pb: 0.001-0.01% by weight,
Li, In, Ba, Pd, Au, Pt, Rh and
0.0002 in total of one or more of Ir
~ 0.05 wt%, the balance Cu and unavoidable
A copper alloy sheet made of a copper alloy having a pure composition
If there is, it will vibrate at high temperatures like around the engine of a car.
Contact resistance and gripping force will not change even when used in
Stable without coming off due to vibration of the engine
We have obtained the knowledge that it is possible to secure the required wearing.
【０００６】この発明は、かかる知見にもとづいてなさ
れたものであって、（１）ＪＩＳ Ｚ ２２５１で規定
されるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９
０〜１８０ＨＫ０．０２５の範囲内にあるメッキ銅合金
薄板、（２）ＪＩＳ Ｚ ２２５１で規定されるヌープ
硬さが７０〜１４０ＨＫ０．０１でかつ９０〜１８０Ｈ
Ｋ０．０２５の範囲内にあり、さらにＡＳＴＭ−Ｄ１８
９４で規定される測定方法により測定された荷重：５．
８８４ニュートン（６００ｇ）での静止摩擦係数が０．
３〜０．５５、運動摩擦係数が０．２０〜０．４５の範
囲内にあるメッキ銅合金薄板、（３）前記（１）または
（２）記載のメッキ銅合金薄板で作られたコネクタ、に
特徴を有するものである。The present invention has been made based on such knowledge, and (1) Knoop hardness defined by JIS Z 2251 is 70 to 140HK0.01 and 9
Plated copper alloy thin plate in the range of 0 to 180HK0.025, (2) Knoop hardness specified by JIS Z 2251 is 70 to 140HK0.01 and 90 to 180H
Within the range of K0.025, and further ASTM-D18
Load measured by the measuring method specified in 94: 5.
The coefficient of static friction at 884 Newton (600 g) is 0.
3 to 0.55, a plated copper alloy thin plate having a kinetic friction coefficient within the range of 0.20 to 0.45, (3) a connector made of the plated copper alloy thin plate according to (1) or (2) above, It is characterized by
【０００７】すなわち、この発明は、一層具体的には、
（４）銅合金薄板、銅合金薄板の上に形成されたＣｕ下
地層およびＣｕ下地層の上に形成されたＳｎメッキ仕上
げ層からなり、前記Ｃｕ下地層とＳｎメッキ仕上げ層の
間にＣｕ−Ｓｎ拡散合金層が形成されているメッキ銅合
金薄板において、ＪＩＳ Ｚ ２２５１で規定されるヌ
ープ硬さが７０〜１４０ＨＫ０．０１でかつ９０〜１８
０ＨＫ０．０２５の範囲内にあるメッキ銅合金薄板、
（５）銅合金薄板、銅合金薄板の上に形成されたＣｕ下
地層およびＣｕ下地層の上に形成されたＳｎメッキ仕上
げ層からなり、前記Ｃｕ下地層とＳｎメッキ仕上げ層の
間にＣｕ−Ｓｎ拡散合金層が形成されているメッキ銅合
金薄板において、ＪＩＳ Ｚ ２２５１で規定されるヌ
ープ硬さが７０〜１４０ＨＫ０．０１でかつ９０〜１８
０ＨＫ０．０２５の範囲内にあり、さらにＡＳＴＭ−Ｄ
１８９４で規定される測定方法により測定された荷重：
５．８８４ニュートン（６００ｇ）での静止摩擦係数が
０．３〜０．５５、運動摩擦係数が０．２０〜０．４５
の範囲内にあるメッキ銅合金薄板、（６）前記銅合金薄
板の上に形成されたＣｕ下地層の厚さが０．０３〜０．
８μｍの範囲内にあり、前記Ｃｕ下地層とＳｎメッキ仕
上げ層の間のＣｕ−Ｓｎ拡散合金層の厚さが０．０３〜
１．２μｍの範囲内にあり、かつＳｎメッキ仕上げ層の
厚さが０．０５〜１．５μｍの範囲内にある前記（４）
または（５）記載のメッキ銅合金薄板、（７）前記
（４）、（５）または（６）記載のメッキ銅合金薄板で
作られたコネクタ、（８）銅合金薄板、銅合金薄板の上
に形成されたＮｉ下地層およびＮｉ下地層の上に形成さ
れたＳｎメッキ仕上げ層からなり、前記Ｎｉ下地層とＳ
ｎメッキ仕上げ層の間にＮｉ−Ｓｎ拡散合金層が形成さ
れているメッキ銅合金薄板において、ＪＩＳ Ｚ ２２
５１で規定されるヌープ硬さが７０〜１４０ＨＫ０．０
１でかつ９０〜１８０ＨＫ０．０２５の範囲内にあるメ
ッキ銅合金薄板、（９）銅合金薄板、銅合金薄板の上に
形成されたＮｉ下地層およびＮｉ下地層の上に形成され
たＳｎメッキ仕上げ層からなり、前記Ｎｉ下地層とＳｎ
メッキ仕上げ層の間にＮｉ−Ｓｎ拡散合金層が形成され
ているメッキ銅合金薄板において、ＪＩＳ Ｚ ２２５
１で規定されるヌープ硬さが７０〜１４０ＨＫ０．０１
でかつ９０〜１８０ＨＫ０．０２５の範囲内にあり、さ
らにＡＳＴＭ−Ｄ１８９４で規定される測定方法により
測定された荷重：５．８８４ニュートン（６００ｇ）で
の静止摩擦係数が０．３〜０．５５、運動摩擦係数が
０．２０〜０．４５の範囲内にあるメッキ銅合金薄板、
（10）前記銅合金薄板の上に形成されたＮｉ下地層の厚
さが０．０３〜０．８μｍの範囲内にあり、前記Ｎｉ下
地層とＳｎメッキ仕上げ層の間のＮｉ−Ｓｎ拡散合金層
の厚さが０．０３〜１．２μｍの範囲内にあり、かつＳ
ｎメッキ仕上げ層の厚さが０．０５〜１．５μｍの範囲
内にある（７）または（８）記載のメッキ銅合金薄板、
（11）前記（８）、（９）または（１０）記載のメッキ
銅合金薄板で作られたコネクタ。（12）銅合金薄板、銅
合金薄板の上に形成されたＣｕ下地層およびＣｕ下地層
の上に形成されたＳｎ合金メッキ仕上げ層からなり、前
記Ｃｕ下地層とＳｎ合金メッキ仕上げ層の間にＣｕ−Ｓ
ｎ系拡散合金層が形成されているメッキ銅合金薄板にお
いて、メッキ銅合金薄板表面のＪＩＳ Ｚ ２２５１で
規定されるヌープ硬さが７０〜１４０ＨＫ０．０１でか
つ９０〜１８０ＨＫ０．０２５の範囲内にあるメッキ銅
合金薄板、（13）銅合金薄板、銅合金薄板の上に形成さ
れたＣｕ下地層およびＣｕ下地層の上に形成されたＳｎ
合金メッキ仕上げ層からなり、前記Ｃｕ下地層とＳｎ合
金メッキ仕上げ層の間にＣｕ−Ｓｎ系拡散合金層が形成
されているメッキ銅合金薄板において、メッキ銅合金薄
板表面のＪＩＳ Ｚ ２２５１で規定されるヌープ硬さ
が７０〜１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ
０．０２５の範囲内にあり、さらにＡＳＴＭ−Ｄ１８９
４で規定される測定方法により測定された荷重：５．８
８４ニュートン（６００ｇ）での静止摩擦係数が０．３
〜０．５５、運動摩擦係数が０．２０〜０．４５の範囲
内にあるメッキ銅合金薄板、（14）前記銅合金薄板の上
に形成されたＣｕ下地層の厚さが０．０３〜０．８μｍ
の範囲内にあり、前記Ｃｕ下地層とＳｎ合金メッキ仕上
げ層の間のＣｕ−Ｓｎ系拡散合金層の厚さが０．０３〜
１．２μｍの範囲内にあり、かつＳｎ合金メッキ仕上げ
層の厚さが０．０５〜１．５μｍの範囲内にある（１
０）または（１１）記載のメッキ銅合金薄板、（15）前
記（１２）、（１３）または（１４）記載のメッキ銅合
金薄板で作られたコネクタ、（16）銅合金薄板、銅合金
薄板の上に形成されたＮｉ下地層およびＮｉ下地層の上
に形成されたＳｎ合金メッキ仕上げ層からなり、前記Ｎ
ｉ下地層とＳｎ合金メッキ仕上げ層の間にＮｉ−Ｓｎ系
拡散合金層が形成されているメッキ銅合金薄板におい
て、メッキ銅合金薄板表面のＪＩＳ Ｚ ２２５１で規
定されるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ
９０〜１８０ＨＫ０．０２５の範囲内にあるメッキ銅合
金薄板、（17）銅合金薄板、銅合金薄板の上に形成され
たＮｉ下地層およびＮｉ下地層の上に形成されたＳｎ合
金メッキ仕上げ層からなり、前記Ｎｉ下地層とＳｎ合金
メッキ仕上げ層の間にＮｉ−Ｓｎ系拡散合金層が形成さ
れているメッキ銅合金薄板において、メッキ銅合金薄板
表面のＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが
７０〜１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．
０２５の範囲内にあり、さらにＡＳＴＭ−Ｄ１８９４で
規定される測定方法により測定された荷重：５．８８４
ニュートン（６００ｇ）での静止摩擦係数が０．３〜
０．５５、運動摩擦係数が０．２０〜０．４５の範囲内
にあるメッキ銅合金薄板、（18）前記銅合金薄板の上に
形成されたＮｉ下地層の厚さが０．０３〜０．８μｍの
範囲内にあり、前記Ｎｉ下地層とＳｎ合金メッキ仕上げ
層の間のＮｉ−Ｓｎ系拡散合金層の厚さが０．０３〜
１．２μｍの範囲内にあり、かつＳｎ合金メッキ仕上げ
層の厚さが０．０５〜１．５μｍの範囲内にある（１
６）または（１７）記載のメッキ銅合金薄板、（19）前
記（１６）、（１７）または（１８）記載のメッキ銅合
金薄板で作られたコネクタ、に特徴を有するものであ
る。That is, the present invention more specifically,
(4) A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and an Sn-plated finish layer formed on the Cu underlayer, and Cu- between the Cu underlayer and the Sn-plated finish layer. In the plated copper alloy thin plate on which the Sn diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 is 70 to 140HK0.01 and 90 to 18
Plated copper alloy sheet within the range of 0HK0.025,
(5) A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and an Sn-plated finish layer formed on the Cu underlayer, and Cu- between the Cu underlayer and the Sn-plated finish layer. In the plated copper alloy thin plate on which the Sn diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 is 70 to 140HK0.01 and 90 to 18
Within 0HK 0.025 range, and ASTM-D
Load measured by the measuring method specified in 1894:
5.84 Newton (600g) static friction coefficient 0.3-0.55, kinetic friction coefficient 0.20-0.45
(6) The thickness of the Cu underlayer formed on the copper alloy thin plate is 0.03 to 0.
8 μm, and the thickness of the Cu—Sn diffusion alloy layer between the Cu underlayer and the Sn plating finish layer is 0.03 to
The thickness is within the range of 1.2 μm, and the thickness of the Sn plating finish layer is within the range of 0.05 to 1.5 μm.
Or a plated copper alloy thin plate according to (5), (7) a connector made of the plated copper alloy thin plate according to (4), (5) or (6) above, (8) copper alloy thin plate, on a copper alloy thin plate The Ni underlayer and the Sn plating finish layer formed on the Ni underlayer.
In a plated copper alloy thin plate in which a Ni-Sn diffusion alloy layer is formed between n-plated finish layers, JIS Z 22
Knoop hardness specified by 51 is 70 to 140HK0.0
1 and plated copper alloy thin plate within the range of 90 to 180HK0.025, (9) copper alloy thin plate, Ni underlayer formed on the copper alloy thin plate, and Sn plating finish formed on the Ni underlayer A Ni underlayer and Sn
In a plated copper alloy thin plate in which a Ni—Sn diffusion alloy layer is formed between plating finish layers, JIS Z 225
Knoop hardness specified by 1 is 70 to 140HK0.01
And in the range of 90 to 180HK 0.025, and the static friction coefficient at the load: 5.884 Newton (600 g) measured by the measuring method specified by ASTM-D1894 is 0.3 to 0.55, A plated copper alloy sheet having a kinetic friction coefficient within the range of 0.20 to 0.45,
(10) The thickness of the Ni underlayer formed on the copper alloy thin plate is in the range of 0.03 to 0.8 μm, and the Ni—Sn diffusion alloy between the Ni underlayer and the Sn plating finish layer is provided. The layer thickness is in the range of 0.03 to 1.2 μm, and S
The plated copper alloy thin plate according to (7) or (8), wherein the thickness of the n-plated finish layer is within the range of 0.05 to 1.5 μm.
(11) A connector made of the plated copper alloy thin plate according to (8), (9) or (10). (12) A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and a Sn alloy plating finish layer formed on the Cu underlayer, and between the Cu underlayer and the Sn alloy plating finish layer. Cu-S
In the plated copper alloy thin plate on which the n-type diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 of the plated copper alloy thin plate surface is in the range of 70 to 140HK0.01 and 90 to 180HK0.025. Plated copper alloy thin plate, (13) copper alloy thin plate, Cu underlayer formed on copper alloy thin plate, and Sn formed on Cu underlayer
In a plated copper alloy thin plate comprising an alloy plated finish layer, and a Cu-Sn diffusion alloy layer formed between the Cu underlayer and the Sn alloy plated finish layer, the surface of the plated copper alloy thin plate is defined by JIS Z 2251. Knoop hardness of 70-140HK 0.01 and 90-180HK
In the range of 0.025, and also ASTM-D189
Load measured by the measuring method specified in 4 .: 5.8
The coefficient of static friction at 84 Newton (600g) is 0.3
.About.0.55, the coefficient of kinetic friction is in the range of 0.20 to 0.45, (14) The thickness of the Cu underlayer formed on the copper alloy thin plate is 0.03 to 0.8 μm
And the thickness of the Cu—Sn based diffusion alloy layer between the Cu underlayer and the Sn alloy plating finish layer is 0.03˜.
It is in the range of 1.2 μm, and the thickness of the Sn alloy plating finish layer is in the range of 0.05 to 1.5 μm (1
0) or (11), the plated copper alloy sheet, (15) the connector made of the plated copper alloy sheet (12), (13) or (14), (16) copper alloy sheet, copper alloy sheet A Ni underlayer formed on the Ni underlayer and a Sn alloy plating finish layer formed on the Ni underlayer.
In a plated copper alloy thin plate in which a Ni-Sn based diffusion alloy layer is formed between an i base layer and a Sn alloy plated finish layer, the Knoop hardness of the surface of the plated copper alloy thin plate defined by JIS Z 2251 is 70 to 140HK0. 0.01 and a plated copper alloy thin plate within the range of 90 to 180HK0.025, (17) a copper alloy thin plate, a Ni underlayer formed on the copper alloy thin plate, and a Sn alloy formed on the Ni underlayer. In a plated copper alloy thin plate comprising a gold-plated finish layer and having a Ni-Sn based diffusion alloy layer formed between the Ni underlayer and the Sn alloy plating finish layer, the surface of the plated copper alloy thin plate is defined by JIS Z2251. Knoop hardness is 70-140HK0.01 and 90-180HK0.
Load within the range of 025 and measured by the measuring method specified in ASTM-D1894: 5.884
The coefficient of static friction in Newton (600g) is 0.3-
0.55, a plated copper alloy thin plate having a kinetic friction coefficient within the range of 0.20 to 0.45, (18) the thickness of the Ni underlayer formed on the copper alloy thin plate is 0.03 to 0 8 μm, and the thickness of the Ni—Sn based diffusion alloy layer between the Ni underlayer and the Sn alloy plating finish layer is 0.03˜.
It is in the range of 1.2 μm, and the thickness of the Sn alloy plating finish layer is in the range of 0.05 to 1.5 μm (1
6) or the plated copper alloy thin plate described in (17), and (19) the connector made of the plated copper alloy thin plate described in (16), (17) or (18) above.
【０００８】さらに、この発明は、Ｃｕ下地層またはＮ
ｉ下地層を形成することなく、銅合金薄板の上に拡散合
金層を介してＳｎまたはＳｎ合金メッキ仕上げ層を形成
しても良い。従って、この発明は、（20）銅合金薄板お
よび銅合金薄板の上に拡散合金層を介して形成されたＳ
ｎメッキ仕上げ層からなるメッキ銅合金薄板において、
ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあることを特徴とするメッキ銅合金薄板、
（21）銅合金薄板および銅合金薄板の上に拡散合金層を
介して形成されたＳｎメッキ仕上げ層からなるメッキ銅
合金薄板において、ＪＩＳ Ｚ ２２５１で規定される
ヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９０〜１
８０ＨＫ０．０２５の範囲内にあり、さらにＡＳＴＭ−
Ｄ１８９４で規定される測定方法により測定された荷
重：５．８８４ニュートン（６００ｇ）での静止摩擦係
数が０．３〜０．５５、運動摩擦係数が０．２０〜０．
４５の範囲内にあることを特徴とするメッキ銅合金薄
板、（22）前記銅合金薄板とＳｎメッキ仕上げ層の間に
形成されたＣｕ−Ｓｎ拡散合金層の厚さが０．０３〜
１．２μｍの範囲内にあり、かつＳｎメッキ仕上げ層の
厚さが０．０５〜１．５μｍの範囲内にあることを特徴
とする（２０）または（２１）記載のメッキ銅合金薄
板、（23）前記（２０）、（２１）または（２２）記載
のメッキ銅合金薄板で作られたコネクタ。（24）銅合金
薄板および銅合金薄板の上に拡散合金層を介して形成さ
れたＳｎ合金メッキ仕上げ層からなるメッキ銅合金薄板
において、ＪＩＳ Ｚ ２２５１で規定されるヌープ硬
さが７０〜１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ
０．０２５の範囲内にあることを特徴とするメッキ銅合
金薄板、（25）銅合金薄板および銅合金薄板の上に拡散
合金層を介して形成されたＳｎ合金メッキ仕上げ層から
なるメッキ銅合金薄板において、ＪＩＳ Ｚ ２２５１
で規定されるヌープ硬さが７０〜１４０ＨＫ０．０１で
かつ９０〜１８０ＨＫ０．０２５の範囲内にあり、さら
にＡＳＴＭ−Ｄ１８９４で規定される測定方法により測
定された荷重：５．８８４ニュートン（６００ｇ）での
静止摩擦係数が０．３〜０．５５、運動摩擦係数が０．
２０〜０．４５の範囲内にあることを特徴とするメッキ
銅合金薄板、（26）前記銅合金薄板とＳｎ合金メッキ仕
上げ層の間に形成されたＣｕ−Ｓｎ拡散合金層の厚さが
０．０３〜１．２μｍの範囲内にあり、かつＳｎ合金メ
ッキ仕上げ層の厚さが０．０５〜１．５μｍの範囲内に
あることを特徴とする（２４）または（２５）記載のメ
ッキ銅合金薄板、（27）前記（２４）、（２５）または
（２６）記載のメッキ銅合金薄板で作られたコネクタ、
に特徴を有するものである。Further, the present invention provides a Cu underlayer or N
The Sn or Sn alloy plating finish layer may be formed on the copper alloy thin plate via the diffusion alloy layer without forming the i underlayer. Therefore, the present invention provides (20) a copper alloy thin plate and an S formed on the copper alloy thin plate through a diffusion alloy layer.
In plated copper alloy thin plate consisting of n-plated finish layer,
Knoop hardness specified by JIS Z 2251 is 70-
140HK0.01 and 90-180HK0.025
Plated copper alloy thin plate, characterized by being within the range of
(21) In a plated copper alloy thin plate composed of a copper alloy thin plate and a Sn-plated finish layer formed on the copper alloy thin plate via a diffusion alloy layer, the Knoop hardness specified by JIS Z 2251 is 70 to 140HK0.01. And 90-1
Within 80HK0.025 range, and ASTM-
Load measured by the measuring method defined by D1894: 5.884 Newton (600 g) has a static friction coefficient of 0.3 to 0.55 and a kinetic friction coefficient of 0.20 to 0.
(22) The thickness of the Cu—Sn diffusion alloy layer formed between the copper alloy thin plate and the Sn plating finish layer is 0.03 to
The plated copper alloy thin plate according to (20) or (21), wherein the thickness of the Sn-plated finish layer is within a range of 1.2 μm and the thickness of the Sn plating finish layer is within a range of 0.05 to 1.5 μm. 23) A connector made of the plated copper alloy thin plate according to (20), (21) or (22). (24) In a plated copper alloy thin plate comprising a copper alloy thin plate and a Sn alloy plating finish layer formed on the copper alloy thin plate via a diffusion alloy layer, the Knoop hardness specified by JIS Z 2251 is 70 to 140HK0. 01 and 90-180HK
Within the range of 0.025, a plated copper alloy thin plate, (25) a copper alloy thin plate, and a plated copper alloy comprising a Sn alloy plating finish layer formed on the copper alloy thin plate via a diffusion alloy layer. For thin plates, JIS Z 2251
The Knoop hardness specified by is in the range of 70 to 140HK0.01 and 90 to 180HK0.025, and the load measured by the measuring method specified in ASTM-D1894 is 5.884 Newton (600g). Has a static friction coefficient of 0.3 to 0.55 and a kinetic friction coefficient of 0.
(26) The thickness of the Cu—Sn diffusion alloy layer formed between the copper alloy thin plate and the Sn alloy plating finish layer is 0. (24) or (25), wherein the thickness of the Sn alloy plating finish layer is within the range of 0.05 to 1.5 μm. Alloy sheet, (27) Connector made of the plated copper alloy sheet according to (24), (25) or (26),
It is characterized by
【０００９】前記（１）〜（２７）の発明で使用する銅
合金薄板は、いかなる成分組成の銅合金薄板であっても
よいが、Ｎｉ：０．５〜３重量％、Ｓｉ：０．０８〜
０．７重量％、Ｓｎ：０．１〜０．９重量％、Ｚｎ：
０．１〜３重量％、Ｆｅ：０．００７〜０．２５重量
％、Ｐ：０．００１〜０．２重量％、Ｍｇ：０．００１
〜０．２重量％、Ｃｒ：０．０１〜０．２重量％、Ｐ
ｂ：０．００１〜０．０１重量％を含有し、さらにＬ
ｉ、Ｉｎ、Ｂａ、Ｐｄ、Ａｕ、Ｐｔ、ＲｈおよびＩｒの
うちの１種または２種以上を合計で０．０００２〜０．
０５重量％を含有し、残りがＣｕおよび不可避不純物か
らなる組成を有する銅合金からなることが一層好まし
い。The copper alloy sheet used in the above inventions (1) to (27) may be a copper alloy sheet having any composition, but Ni: 0.5 to 3% by weight, Si: 0.08. ~
0.7% by weight, Sn: 0.1 to 0.9% by weight, Zn:
0.1 to 3% by weight, Fe: 0.007 to 0.25% by weight, P: 0.001 to 0.2% by weight, Mg: 0.001
~ 0.2 wt%, Cr: 0.01-0.2 wt%, P
b: 0.001 to 0.01% by weight, further L
One or two or more of i, In, Ba, Pd, Au, Pt, Rh, and Ir in total of 0.0002 to 0.
More preferably, it is made of a copper alloy having a composition containing 0.05% by weight and the balance of Cu and inevitable impurities.
【００１０】この発明のメッキ銅合金薄板は、銅合金薄
板の上にＣｕまたはＮｉの下地層を形成し、この下地層
の上にＳｎまたはＳｎ合金メッキ仕上げ層を電気メッキ
法により形成した後、通常より高い温度でリフロー処理
を施すことにより製造する。また、前記Ｓｎ合金メッキ
仕上げ層のＳｎ合金は、いかなる組成のＳｎ合金であっ
てもよいが、Ｐｂ：３〜５０重量％を含有し、残りがＳ
ｎおよび不可避不純物からなるＳｎハンダ、またはＣ
ｕ：１〜１０重量％を含有し、残りがＳｎおよび不可避
不純物からなるＳｎハンダであることが好ましい。メッ
キ仕上げ層がＳｎである場合、拡散合金層は二元系のＣ
ｕ−Ｓｎ合金またはＮｉ−Ｓｎ合金で構成されるが、メ
ッキ仕上げ層がＳｎ合金である場合、三元系以上のＣｕ
−Ｓｎ系合金またはＮｉ−Ｓｎ系合金で構成される。In the plated copper alloy thin plate of the present invention, a Cu or Ni underlayer is formed on the copper alloy thin plate, and a Sn or Sn alloy plating finish layer is formed on the underlayer by electroplating. It is manufactured by performing reflow treatment at a higher temperature than usual. The Sn alloy of the Sn alloy plating finish layer may be a Sn alloy having any composition, but contains Pb: 3 to 50% by weight, and the rest is S.
Sn solder consisting of n and unavoidable impurities, or C
It is preferable that the Sn solder contains u: 1 to 10% by weight, and the balance is Sn and inevitable impurities. When the plating finish layer is Sn, the diffusion alloy layer is a binary C
It is composed of u-Sn alloy or Ni-Sn alloy, but when the plating finish layer is Sn alloy, Cu of ternary system or more is used.
-Sn alloy or Ni-Sn alloy.
【００１１】つぎに、この発明のメッキ銅合金薄板およ
びその薄板で製造したコネクタの表面硬さ、表面摩擦係
数、下地層、拡散合金層および仕上げメッキ層の限定理
由について説明する。
ａ．表面硬さ
メッキ銅合金薄板の表面硬さは、コネクタの装着安定性
に大きな影響を及ぼすが、ＪＩＳ Ｚ ２２５１で規定
されるヌープ硬さが７０未満ＨＫ０．０１でかつ９０未
満ＨＫ０．０２５では表面が軟らかすぎて多ピンコネク
タの挿入力が大きくなりすぎるので好ましくなく、一
方、ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが１
４０超ＨＫ０．０１でかつ１８０超ＨＫ０．０２５では
適正な挿入力が得られても、離脱力が小さくなり、装着
性に不安が生じて来る。したがって、この発明のメッキ
銅合金薄板の表面硬さは、ＪＩＳ Ｚ ２２５１で規定
されるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９
０〜１８０ＨＫ０．０２５の範囲内にあるように定め
た。この発明のメッキ銅合金薄板の表面硬さは、ＪＩＳ
Ｚ ２２５１で規定されるヌープ硬さが８０〜１３０Ｈ
Ｋ０．０１でかつ１００〜１７０ＨＫ０．０２５が一層
好ましい範囲である。Next, the reasons for limiting the surface hardness, surface friction coefficient, underlayer, diffusion alloy layer and finish plating layer of the plated copper alloy thin plate of the present invention and the connector manufactured from the thin plate will be described. a. Surface hardness The surface hardness of the plated copper alloy thin plate has a great influence on the mounting stability of the connector, but when the Knoop hardness specified by JIS Z 2251 is less than 70 HK0.01 and less than 90 HK0.025, the surface hardness is Is too soft and the insertion force of the multi-pin connector becomes too large, which is not preferable. On the other hand, the Knoop hardness specified by JIS Z 2251 is 1
When the HK is more than 40 and the HK is more than 180 and the HK is more than 180 and 0.025, even if the proper insertion force is obtained, the detachment force becomes small, and the wearability becomes uneasy. Therefore, as for the surface hardness of the plated copper alloy thin plate of the present invention, the Knoop hardness defined by JIS Z 2251 is 70 to 140HK0.01 and 9 or less.
It was determined to be within the range of 0 to 180HK0.025. The surface hardness of the plated copper alloy thin plate of the present invention is JIS
Knoop hardness specified by Z 2251 is 80 to 130H.
K0.01 and 100 to 170HK0.025 are more preferable ranges.
【００１２】ｂ．摩擦係数
メッキ表面の硬さに加えてメッキ表面の摩擦係数もコネ
クタの装着安定性に寄与する構成であって、静止摩擦係
数はコネクタの離脱力に影響を及ぼし、運動摩擦係数は
コネクタの挿入力に影響を及ぼす因子であるが、ＡＳＴ
Ｍ−Ｄ１８９４で規定される測定方法により測定された
荷重：５．８８４ニュートン（６００ｇ）での静止摩擦
係数が静止摩擦係数が０．３未満でかつ運動摩擦係数が
０．２０未満では、離脱力が小さくなり、装着安定性が
低下するので好ましくなく、一方、静止摩擦係数が０．
５５を越え、かつ運動摩擦係数が０．４５を越えると挿
入力が大きくなり、特に多ピンコネクタでは好ましくな
い。したがって、この発明のメッキ銅合金薄板のＡＳＴ
Ｍ−Ｄ１８９４で規定される測定方法により測定された
荷重：５．８８４ニュートン（６００ｇ）での静止摩擦
係数を０．３〜０．５５（好ましくは０．３５〜０．５
０）、運動摩擦係数を０．２０〜０．４５（好ましくは
０．２５〜０．４０）に定めた。B. Friction coefficient In addition to the hardness of the plated surface, the friction coefficient of the plated surface also contributes to the mounting stability of the connector.The static friction coefficient affects the detachment force of the connector, and the kinetic friction coefficient is the insertion force of the connector. Is a factor that affects the
Load measured by the measuring method specified in M-D1894: When the coefficient of static friction at 5.884 Newton (600 g) is less than 0.3 and the coefficient of kinetic friction is less than 0.20, the separation force is Is unfavorable because the wear resistance becomes smaller and the wearing stability decreases. On the other hand, the coefficient of static friction is 0.
If it exceeds 55 and the coefficient of kinetic friction exceeds 0.45, the insertion force becomes large, which is not preferable especially for a multi-pin connector. Therefore, the AST of the plated copper alloy thin plate of the present invention
Load measured by the measuring method defined by M-D1894: static friction coefficient at 5.884 Newton (600 g) is 0.3 to 0.55 (preferably 0.35 to 0.5).
0), and the coefficient of kinetic friction was set to 0.20 to 0.45 (preferably 0.25 to 0.40).
【００１３】ｃ．拡散合金層の厚さおよび仕上げメッキ
金属の厚さ
下地金属と仕上げメッキ金属との間に形成された拡散合
金層は、通常、仕上げメッキ金属よりも硬く、挿入力を
低める意味から有効であり、最小限０．０３μｍは必要
であるが、それが１．２μｍを越えるようになると曲げ
加工で割れ発生の原因になるところから、拡散合金層の
厚さは０．０３〜１．２μｍ（好ましくは、０．１０〜
１．１μｍ）に定めた。さらに、仕上げメッキ金属は、
通常、軟らかいので０．０５μｍ未満では離脱力が小さ
くなりすぎるとともに熱安定性が悪くなるので好ましく
なく、一方、１．５μｍを越えるようになると挿入力を
大きくし、多ピンコネクタには好ましくない。したがっ
て、仕上げメッキ金属の厚さは０．０５〜１．５μｍ
（好ましくは、０．１０〜１．３μｍ）に定めた。C. Thickness of Diffusion Alloy Layer and Thickness of Finish-Plated Metal The diffusion alloy layer formed between the base metal and the finish-plated metal is usually harder than the finish-plated metal and effective in reducing the insertion force, The minimum thickness is 0.03 μm, but if it exceeds 1.2 μm, cracking may occur during bending, so the thickness of the diffusion alloy layer should be 0.03 to 1.2 μm (preferably , 0.10
1.1 μm). In addition, the finish plated metal is
Usually, since it is soft, if it is less than 0.05 μm, the releasing force becomes too small and the thermal stability deteriorates, and if it exceeds 1.5 μm, the inserting force becomes large, which is not preferable for a multi-pin connector. Therefore, the thickness of the finish-plated metal is 0.05 to 1.5 μm.
(Preferably 0.10 to 1.3 μm).
【００１４】ｄ．Ｃｕ下地金属の厚さ
母材が、例えば、Ｃｕ−Ｚｎ合金のように、Ｃｕ中にＺ
ｎ成分が多く含まれている場合、そのままＳｎメッキを
行うと、望ましい光沢が得難くなると共に、過熱状態で
メッキ密着性が悪くなるなど熱安定性が劣化するところ
からＣｕ下地メッキを施すが、この場合、Ｃｕ下地メッ
キの厚さが０．０３μｍ未満では所望の効果が得られ
ず、一方、０．８０μｍを越えるとその効果が飽和する
ようになるので、Ｃｕ下地金属の厚さは０．０３〜０．
８０μｍ（好ましくは、０．１０〜０．７０μｍ）に定
めた。D. The thickness of the base metal of Cu base metal is, for example, Cu--Zn alloy, Z in Cu.
When a large amount of n component is contained, if Sn plating is performed as it is, it is difficult to obtain a desired gloss, and since the thermal stability is deteriorated such that the plating adhesion is deteriorated in an overheated state, Cu undercoating is performed. In this case, if the thickness of the Cu undercoat is less than 0.03 μm, the desired effect cannot be obtained, while if it exceeds 0.80 μm, the effect is saturated, so the thickness of the Cu undercoat metal is less than 0. 03-0.
The thickness is set to 80 μm (preferably 0.10 to 0.70 μm).
【００１５】ｅ．Ｎｉ下地金属の厚さ
コネクタが、例えば、自動車のエンジン回りのように、
高い温度の環境下で使用する場合、母材あるいは下地金
属のＣｕおよびＣｕ中に含まれる合金元素が、メッキ表
面に拡散し、酸化物を形成するなど黒変色や接触抵抗の
増大をもたらし、熱安定性を著しく劣化させるところか
らＮｉ下地メッキを施すが、この場合、Ｎｉ下地メッキ
の厚さが０．０３μｍ未満では所望の効果が得られず、
一方、０．８０μｍを越えると曲げ加工性に悪影響を及
ぼすようになるところから、Ｎｉ下地金属の厚さは０．
０３〜０．８０μｍ（好ましくは、０．０５〜０．６０
μｍ）に定めた。E. The thickness of the Ni base metal connector is, for example, around the engine of an automobile,
When used in a high temperature environment, Cu of the base material or base metal and the alloying elements contained in Cu diffuse to the plating surface to form an oxide, resulting in black discoloration and increase in contact resistance, and heat Ni undercoating is performed because it significantly deteriorates stability. In this case, if the Ni undercoating thickness is less than 0.03 μm, the desired effect cannot be obtained.
On the other hand, if the thickness exceeds 0.80 μm, the bending workability is adversely affected.
03-0.80 [mu] m (preferably 0.05-0.60)
μm).
【００１６】ｆ．銅合金薄板の成分
通常のコネクタを作製するために使用する銅合金薄板
は、黄銅、青銅、燐青銅など通常の銅合金薄板で十分で
あるが、特に熱安定性に優れたコネクタを得ようとする
場合、下地金属を含めてメッキ表面が耐熱性に優れてい
るとともに、耐熱クリープ性やメッキ密着性に優れてい
ることが必要であるところから、Ｎｉ：０．５〜３重量
％、Ｓｉ：０．０８〜０．７重量％、Ｓｎ：０．１〜
０．９重量％、Ｚｎ：０．１〜３重量％、Ｆｅ：０．０
０７〜０．２５重量％、Ｐ：０．００１〜０．２重量
％、Ｍｇ：０．００１〜０．２重量％、Ｃｒ：０．０１
〜０．２重量％、Ｐｂ：０．００１〜０．０１重量％を
含有し、さらにＬｉ、Ｉｎ、Ｂａ、Ｐｄ、Ａｕ、Ｐｔ、
ＲｈおよびＩｒのうちの１種または２種以上を合計で
０．０００２〜０．０５重量％を含有し、残りがＣｕお
よび不可避不純物からなる組成を有する銅合金からなる
薄板を使用することが一層好ましい。F. Components of copper alloy thin plate As the copper alloy thin plate used for producing an ordinary connector, an ordinary copper alloy thin plate such as brass, bronze, phosphor bronze is sufficient, but in particular, in order to obtain a connector excellent in thermal stability. In this case, it is necessary that the plating surface including the base metal has excellent heat resistance, and also has excellent heat resistance creep resistance and plating adhesion. Therefore, Ni: 0.5 to 3 wt%, Si: 0.08-0.7 wt%, Sn: 0.1
0.9% by weight, Zn: 0.1 to 3% by weight, Fe: 0.0
07-0.25% by weight, P: 0.001-0.2% by weight, Mg: 0.001-0.2% by weight, Cr: 0.01
.About.0.2 wt%, Pb: 0.001 to 0.01 wt%, and further contains Li, In, Ba, Pd, Au, Pt,
It is more preferable to use a thin plate made of a copper alloy containing one or more of Rh and Ir in a total amount of 0.0002 to 0.05% by weight, and the balance of Cu and unavoidable impurities. preferable.
【００１７】[0017]
【発明の実施の形態】表１〜表２に示される成分組成、
引張り強さ、伸びおよびビッカース硬さを有する板厚：
０．３ｍｍの銅合金板Ａ〜Ｈを用意した。BEST MODE FOR CARRYING OUT THE INVENTION The composition of components shown in Tables 1 and 2,
Plate thickness with tensile strength, elongation and Vickers hardness:
0.3 mm copper alloy plates A to H were prepared.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【表２】 [Table 2]
【００２０】実施例１
表１に示される銅合金板Ａ〜Ｃをアルカリ脱脂、電解脱
脂および酸洗いした後、下記の条件により、Ｃｕ下地メ
ッキまたはＮｉ下地メッキを行った後、Ｓｎ仕上げメッ
キまたは９０％Ｓｎ−１０％Ｐｂ仕上げメッキを行い、
ついで還元雰囲気中、表３〜表４に示される条件のリフ
ロー処理を行うことにより、表３〜表４に示される厚さ
の下地メッキ層、拡散合金層および仕上げメッキ層を有
する本発明メッキ銅合金薄板（以下、本発明薄板とい
う）１〜１１、比較メッキ銅合金薄板（以下、比較薄板
という）１〜４および従来メッキ銅合金薄板（以下、従
来薄板という）を作製した。Example 1 The copper alloy plates A to C shown in Table 1 were alkali degreased, electrolytic degreased and pickled, and then Cu undercoat or Ni undercoat under the following conditions, followed by Sn finish plating or 90% Sn-10% Pb finish plating,
Then, by performing reflow treatment under the conditions shown in Tables 3 to 4 in a reducing atmosphere, the plated copper of the present invention having a base plating layer, a diffusion alloy layer and a finish plating layer having the thicknesses shown in Tables 3 to 4 Alloy thin plates (hereinafter referred to as the thin plate of the present invention) 1 to 11, comparative plated copper alloy thin plates (hereinafter referred to as the comparative thin plate) 1 to 4 and conventional plated copper alloy thin plates (hereinafter referred to as the conventional thin plate) were produced.
【００２１】ａ．Ｃｕ下地メッキ条件
メッキ浴組成：硫酸銅２５０ｇ／ｌ、硫酸６０ｇ／ｌ、
塩素イオン５０ｇ／ｌ、添加剤２ｇ／ｌ，
メッキ浴温度：３０℃、
電流密度：３Ａ／ｄｍ2 、A. Cu base plating conditions Plating bath composition: copper sulfate 250 g / l, sulfuric acid 60 g / l,
Chloride ion 50 g / l, additive 2 g / l, plating bath temperature: 30 ° C., current density: 3 A / dm 2 ,
【００２２】ｂ．Ｎｉ下地メッキ条件
メッキ浴組成：硫酸ニッケル２５０ｇ／ｌ、塩化ニッケ
ル４５ｇ／ｌ、硼酸３５ｇ／ｌ、
メッキ浴温度：４５℃、
電流密度：４Ａ／ｄｍ2 、B. Ni undercoating conditions Plating bath composition: nickel sulfate 250 g / l, nickel chloride 45 g / l, boric acid 35 g / l, plating bath temperature: 45 ° C., current density: 4 A / dm 2 ,
【００２３】ｃ．Ｓｎ仕上げメッキ条件
メッキ浴組成：硫酸第一錫４０ｇ／ｌ、硫酸１１０ｇ／
ｌ、クレゾールスルホン酸２５ｇ／ｌ、添加剤７ｇ／
ｌ、
メッキ浴温度：２０℃、
電流密度：３Ａ／ｄｍ2 、C. Sn finish plating conditions Plating bath composition: Stannous sulfate 40 g / l, sulfuric acid 110 g /
1, cresol sulfonic acid 25 g / l, additive 7 g /
1, plating bath temperature: 20 ° C., current density: 3 A / dm 2 ,
【００２４】ｄ．９０％Ｓｎ−１０％Ｐｂ仕上げメッキ
条件
メッキ浴組成：ホウフッ化第一錫２００ｇ／ｌ、ホウフ
ッ化鉛２０ｇ／ｌ、ホウフッ化水素酸２３５ｇ／ｌ、添
加剤３０ｇ／ｌ、
メッキ浴温度：２５℃、
電流密度：２Ａ／ｄｍ2 、D. 90% Sn-10% Pb finish plating conditions plating bath composition: stannous borofluoride 200 g / l, lead borofluoride 20 g / l, borofluoric acid 235 g / l, additive 30 g / l, plating bath temperature: 25 ° C. , Current density: 2 A / dm 2 ,
【００２５】なお、得られた本発明薄板１〜１１、比較
薄板１〜４および従来薄板の下地メッキ層、拡散合金層
および仕上げメッキ層の厚さは、電解式膜厚計により測
定すると共に、補助的に蛍光Ｘ線膜厚計、断面のＳＥＭ
観察およびＥＰＭＡによる観測などの手段を用いて測定
した。The thicknesses of the base plating layer, diffusion alloy layer and finish plating layer of the obtained thin plates 1 to 11 of the present invention, comparative thin plates 1 to 4 and conventional thin plates were measured by an electrolytic film thickness meter, and Fluorescent X-ray film thickness meter, SEM of cross section
The measurement was performed by means of observation and observation by EPMA.
【００２６】[0026]
【表３】 [Table 3]
【００２７】[0027]
【表４】 [Table 4]
【００２８】本発明薄板１〜１１、比較薄板１〜４およ
び従来薄板について、ＪＩＳ Ｚ２２５１で規定される
荷重９８．０７×１０-3Ｎ（１０ｇ）および０．２４５
Ｎ（２５ｇ）のヌープ硬さ、並びにＡＳＴＭ−Ｄ１８９
４で規定される測定方法により測定された荷重：５．８
８４ニュートンでの静止摩擦係数および運動摩擦係数を
測定し、その結果を表５〜表６に示した。With respect to the thin plates 1 to 11 of the present invention, the comparative thin plates 1 to 4 and the conventional thin plates, the load defined by JIS Z2251 is 98.07 × 10 −3 N (10 g) and 0.245.
Knoop hardness of N (25 g), as well as ASTM-D189
Load measured by the measuring method specified in 4 .: 5.8
The static friction coefficient and kinetic friction coefficient at 84 Newton were measured, and the results are shown in Tables 5 to 6.
【００２９】ｅ．挿入力および離脱力の測定
前記本発明薄板１〜１１、比較薄板１〜４および従来薄
板を用い、図１に示される形状の雄コネクタ１および雌
コネクタ２を作製し、雄コネクタ１を雌コネクタ２に挿
入したのち、雄コネクタ１を雌コネクタ２から引き抜
き、挿入する時の最大加重および引き抜く時の最大加重
をそれぞれ１０回測定し、その平均値をそれぞれ挿入力
および離脱力として表５〜表６に示した。E. Measurement of Insertion Force and Removal Force Using the thin plates 1 to 11 of the present invention, the comparative thin plates 1 to 4 and the conventional thin plate, a male connector 1 and a female connector 2 having the shapes shown in FIG. 1 were produced, and the male connector 1 was replaced with a female connector. After inserting the male connector 1 into the female connector 2, the male connector 1 is pulled out from the female connector 2, and the maximum load at the time of inserting and the maximum load at the time of pulling out are measured 10 times respectively, and the average value thereof is taken as the inserting force and the releasing force, respectively. 6 shows.
【００３０】[0030]
【表５】 [Table 5]
【００３１】[0031]
【表６】 [Table 6]
【００３２】表１〜表６に示される結果から、本発明薄
板１〜１１で作られたコネクタは、いずれも挿入力が
３．５（Ｎ）以下でかつ離脱力が３．７（Ｎ）以上にな
っており、適正な設計を行うことにより、挿入力が小さ
くかつ挿入後離脱することのない安定した多ピンコネク
タが得られることが分かる。しかし、ＪＩＳ Ｚ ２２
５１で規定される荷重９８．０７×１０-3Ｎ（１０ｇ）
および０．２４５Ｎ（２５ｇ）のヌープ硬さ、並びにＡ
ＳＴＭ−Ｄ１８９４で規定される測定方法により測定さ
れた荷重：５．８８４ニュートン（６００ｇ）での静止
摩擦係数および運動摩擦係数がこの発明の範囲から外れ
た比較薄板１〜４および従来薄板で作られたコネクタ
は、挿入力が大き過ぎるかまたは離脱力が小さすぎるか
の不具合が生じ、多ピンコネクタとして安定性に問題が
あることが分かる。From the results shown in Tables 1 to 6, all the connectors made of the thin plates 1 to 11 of the present invention have an insertion force of 3.5 (N) or less and a detachment force of 3.7 (N). As described above, it can be seen that by performing an appropriate design, a stable multi-pin connector that has a small insertion force and does not come off after insertion can be obtained. However, JIS Z 22
Load specified by 51: 98.07 × 10 -3 N (10g)
And Knoop hardness of 0.245 N (25 g), and A
Loads measured by the measuring method specified in STM-D1894: Coefficients of static friction and kinetic friction at 5.884 Newton (600 g) are out of the scope of the invention. It can be seen that such a connector has a problem that the insertion force is too large or the detachment force is too small, and that there is a problem in stability as a multi-pin connector.
【００３３】実施例２
表１〜表２に示される銅合金板Ｄ〜Ｈをアルカリ脱脂、
電解脱脂および酸洗いした後、実施例１で行った条件と
同じ条件により、Ｃｕ下地メッキまたはＮｉ下地メッキ
を行った後、Ｓｎ仕上げメッキまたは９０％Ｓｎ−１０
％Ｐｂ仕上げメッキを行い、ついで還元雰囲気中、表７
〜表８に示される条件のリフロー処理を行うことによ
り、表７〜表８に示される厚さの下地メッキ層、拡散合
金層および仕上げメッキ層を有する本発明薄板１２〜２
２および比較薄板５〜６を作製した。さらに従来薄板も
用意した。Example 2 The copper alloy plates D to H shown in Tables 1 and 2 were alkali degreased,
After electrolytic degreasing and pickling, Cu undercoating or Ni undercoating was performed under the same conditions as in Example 1, followed by Sn finish plating or 90% Sn-10.
% Pb finish plating, then in reducing atmosphere, see Table 7
~ By carrying out the reflow treatment under the conditions shown in Table 8, the thin plates 12-2 of the present invention having a base plating layer, a diffusion alloy layer and a finish plating layer having the thicknesses shown in Tables 7-8.
2 and comparative thin plates 5-6 were produced. Furthermore, conventional thin plates are also available.
【００３４】[0034]
【表７】 [Table 7]
【００３５】[0035]
【表８】 [Table 8]
【００３６】得られた本発明薄板１２〜２２、比較薄板
５〜６および用意した従来薄板について、ＪＩＳ Ｚ
２２５１で規定される荷重９８．０７×１０-3Ｎ（１０
ｇ）および０．２４５Ｎ（２５ｇ）のヌープ硬さ、並び
にＡＳＴＭ−Ｄ１８９４で規定される測定方法により測
定された荷重：５．８８４ニュートンでの静止摩擦係数
および運動摩擦係数を測定し、その結果を表９〜表１０
に示した。Regarding the obtained thin plates 12 to 22 of the present invention, comparative thin plates 5 to 6 and prepared conventional thin plates, JIS Z
2251 specified load 98.07 × 10 -3 N (10
g) and the Knoop hardness of 0.245 N (25 g), and the load measured by the measuring method defined by ASTM-D1894: The static friction coefficient and the kinetic friction coefficient at 5.884 Newton were measured, and the result was measured. Table 9 to Table 10
It was shown to.
【００３７】さらに、前記本発明薄板１２〜２２、比較
薄板５〜６および従来薄板について、実施例１と同様に
して図１に示される形状の雄コネクタ１および雌コネク
タ２を作製し、挿入力、離脱力を測定し、その結果を表
９〜表１０に示した。Further, with respect to the thin plates 12 to 22 of the present invention, the comparative thin plates 5 to 6 and the conventional thin plates, a male connector 1 and a female connector 2 having the shapes shown in FIG. The detachment force was measured, and the results are shown in Tables 9 to 10.
【００３８】また、実施例２においては、図１に示され
るように雄コネクタ１を雌コネクタ２に挿入したまま、
大気中、１８０℃にて５００時間焼鈍したものについ
て、焼鈍前と焼鈍後の接触抵抗の差を焼鈍による接触抵
抗の増加として表８に示し、さらに焼鈍後雄コネクタ１
を雌コネクタ２から引き抜く時の最大加重を測定し、そ
の値を焼鈍後の離脱力として表９〜表１０に示し、熱安
定性の評価を行った。In the second embodiment, as shown in FIG. 1, while the male connector 1 is inserted into the female connector 2,
Table 8 shows the difference in contact resistance before and after annealing for 500 hours at 180 ° C. in air as an increase in contact resistance due to annealing, and after annealing, male connector 1
The maximum load at the time of pulling out from the female connector 2 was measured, and the value was shown as a detaching force after annealing in Tables 9 to 10, and the thermal stability was evaluated.
【００３９】[0039]
【表９】 [Table 9]
【００４０】[0040]
【表１０】 [Table 10]
【００４１】表１〜表２および表７〜表１０に示される
結果から、本発明薄板１２〜２２で作られたコネクタ
は、いずれも挿入力が３．５（Ｎ）以下、離脱力が３．
８（Ｎ）以上でかつ焼鈍による接触抵抗の増加および離
脱力の低下が少ないことが分かる。しかし、ＪＩＳ Ｚ
２２５１で規定される荷重９８．０７×１０-3Ｎ（１
０ｇ）および０．２４５Ｎ（２５ｇ）のヌープ硬さ、Ａ
ＳＴＭ−Ｄ１８９４で規定される測定方法により測定さ
れた荷重：５．８８４ニュートン（６００ｇ）での静止
摩擦係数および運動摩擦係数、並びにメッキ層の厚さが
がこの発明の範囲から外れた比較薄板５〜６で作られた
コネクタは、挿入力、離脱力および焼鈍による接触抵抗
の増加の内、いずれかが劣ることが分かる。From the results shown in Tables 1 to 2 and Tables 7 to 10, the connectors made of the thin plates 12 to 22 of the present invention all have an insertion force of 3.5 (N) or less and a detachment force of 3 or less. ．
It can be seen that it is 8 (N) or more, and the increase in contact resistance and the decrease in detachment force due to annealing are small. However, JIS Z
2251 specified load 98.07 × 10 -3 N (1
Knoop hardness of 0 g) and 0.245 N (25 g), A
Load measured by the measuring method specified in STM-D1894: Coefficient of static friction and coefficient of kinematics at 5.884 Newton (600 g), and the thickness of the plating layer outside the range of the present invention. It can be seen that the connectors produced by ~ 6 are inferior in any of the insertion force, the detachment force and the increase in contact resistance due to annealing.
【００４２】[0042]
【発明の効果】上述のように、この発明のメッキ銅合金
薄板は、従来のメッキ銅合金薄板と比べてコネクタ板材
として優れており、この発明のメッキ銅合金薄板で作製
したコネクタは、雄コネクタを雌コネクタに挿入する時
の挿入力が小さいところからコネクタの挿入作業がやり
やすく、離脱力が大きくかつ焼鈍による接触抵抗の増加
が少ないところから、自動車のエンジン廻りのような過
酷な高温環境下において脱落などのトラブルの発生もな
く、優れたコネクタを提供することができる。As described above, the plated copper alloy thin plate of the present invention is superior to the conventional plated copper alloy thin plate as a connector plate material, and a connector made of the plated copper alloy thin plate of the present invention is a male connector. Since the insertion force when inserting the female connector into the female connector is small, the insertion work of the connector is easy to perform, the large detachment force and the small increase in contact resistance due to annealing make it possible to operate in a harsh high temperature environment such as around the engine of a car. It is possible to provide an excellent connector without causing a trouble such as dropping.
【図１】雄コネクタを雌コネクタに挿入した状態を示す
斜視図である。FIG. 1 is a perspective view showing a state in which a male connector is inserted into a female connector.
１ 雄コネクタ ２ 雌コネクタ 1 male connector 2 female connector
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小田嶋 美智代 福島県会津若松市扇町128−７ 三菱伸 銅株式会社 若松製作所内 (72)発明者 土川 真由起 福島県会津若松市扇町128−７ 三菱伸 銅株式会社 若松製作所内 (56)参考文献 特開 平２−270992（ＪＰ，Ａ) 特開 平４−235292（ＪＰ，Ａ) 特開 平４−323396（ＪＰ，Ａ) 特開 平５−2940（ＪＰ，Ａ) 特開 平５−230690（ＪＰ，Ａ) 特開 平７−90674（ＪＰ，Ａ) 特開 平７−157893（ＪＰ，Ａ) 特開 平７−268511（ＪＰ，Ａ) 特開 平８−55521（ＪＰ，Ａ) 特開 昭60−116795（ＪＰ，Ａ) 特開 昭61−284593（ＪＰ，Ａ) 特開 昭62−149899（ＪＰ，Ａ) 「増補新版コネクタ最新技術」（1987 年４月10日），総合技術出版発行，第Ｉ 章第１−12頁 (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 5/24 C25D 7/00 H01R 13/03 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Michiyo Odashima 128-7 Ogimachi, Aizuwakamatsu, Fukushima Prefecture Mitsubishi Shindoh Co., Ltd. Wakamatsu Works (72) Inventor Mayuhi Tsuchikawa 128-7 Ogimachi, Aizuwakamatsu, Fukushima Prefecture Mitsubishi Shin Copper Co., Ltd. Wakamatsu Seisakusho (56) Reference JP-A-2-270992 (JP, A) JP-A-4-235292 (JP, A) JP-A-4-323396 (JP, A) JP-A-5-2940 (JP, A) JP 5-230690 (JP, A) JP 7-90674 (JP, A) JP 7-157893 (JP, A) JP 7-268511 (JP, A) Kaihei 8-55521 (JP, A) JP 60-116795 (JP, A) JP 61-284593 (JP, A) JP 62-149899 (JP, A) (April 10, 1987), Published by Sogo Gijutsu, Chapter I, pages 1-12 (58) Fields investigated (Int.Cl. 7 , DB name) C25D 5/24 C25D 7/00 H01R 13/03
Claims (28)
プ硬さが荷重：９８．０７×１０-3ニュートン（１０
ｇ）で７０〜１４０（以下、７０〜１４０ＨＫ０．０１
と記す）かつ０．２４５２ニュートン（２５ｇ）で９０
〜１８０（以下、９０〜１８０ＨＫ０．０２５と記す）
の範囲内にあることを特徴とするメッキ銅合金薄板。1. The Knoop hardness defined by JIS Z 2251 has a load of 98.07 × 10 −3 Newton (10
g) 70 to 140 (hereinafter 70 to 140HK0.01
90) at 0.2452 Newton (25 g)
~ 180 (hereinafter referred to as 90 to 180HK0.025)
Plated copper alloy sheet characterized by being within the range of.
プ硬さが７０〜１４０ＨＫ０．０１でかつ９０〜１８０
ＨＫ０．０２５の範囲内にあり、さらにＡＳＴＭ−Ｄ１
８９４で規定される測定方法により測定された荷重：
５．８８４ニュートン（６００ｇ）での静止摩擦係数が
０．３〜０．５５、運動摩擦係数が０．２０〜０．４５
の範囲内にあることを特徴とするメッキ銅合金薄板。2. The Knoop hardness specified by JIS Z 2251 is 70 to 140 HK0.01 and 90 to 180.
Within the range of HK0.025, and further ASTM-D1
Load measured by the measuring method specified in 894:
5.84 Newton (600g) static friction coefficient 0.3-0.55, kinetic friction coefficient 0.20-0.45
Plated copper alloy sheet characterized by being within the range of.
板で作られたコネクタ。3. A connector made of the plated copper alloy thin plate according to claim 1 or 2.
たＣｕ下地層およびＣｕ下地層の上に形成されたＳｎメ
ッキ仕上げ層からなり、前記Ｃｕ下地層とＳｎメッキ仕
上げ層の間にＣｕ−Ｓｎ拡散合金層が形成されているメ
ッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあることを特徴とするメッキ銅合金薄板。4. A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and an Sn-plated finish layer formed on the Cu underlayer, and between the Cu underlayer and the Sn-plated finish layer. In a plated copper alloy thin plate on which a Cu—Sn diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 is 70 to
140HK0.01 and 90-180HK0.025
Plated copper alloy sheet characterized by being within the range of.
たＣｕ下地層およびＣｕ下地層の上に形成されたＳｎメ
ッキ仕上げ層からなり、前記Ｃｕ下地層とＳｎメッキ仕
上げ層の間にＣｕ−Ｓｎ拡散合金層が形成されているメ
ッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあり、さらにＡＳＴＭ−Ｄ１８９４で規定さ
れる測定方法により測定された荷重：５．８８４ニュー
トン（６００ｇ）での静止摩擦係数が０．３〜０．５
５、運動摩擦係数が０．２０〜０．４５の範囲内にある
ことを特徴とするメッキ銅合金薄板。5. A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and an Sn-plated finish layer formed on the Cu underlayer, and between the Cu underlayer and the Sn-plated finish layer. In a plated copper alloy thin plate on which a Cu—Sn diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 is 70 to
140HK0.01 and 90-180HK0.025
And the static friction coefficient at a load of 5.884 Newton (600 g) measured by the measuring method specified by ASTM-D1894 is 0.3 to 0.5.
5. A plated copper alloy thin plate having a coefficient of kinetic friction in the range of 0.20 to 0.45.
地層の厚さが０．０３〜０．８μｍの範囲内にあり、前
記Ｃｕ下地層とＳｎメッキ仕上げ層の間のＣｕ−Ｓｎ拡
散合金層の厚さが０．０３〜１．２μｍの範囲内にあ
り、かつＳｎメッキ仕上げ層の厚さが０．０５〜１．５
μｍの範囲内にあることを特徴とする請求項４または５
記載のメッキ銅合金薄板。6. The Cu underlayer formed on the copper alloy thin plate has a thickness in the range of 0.03 to 0.8 μm, and Cu—Sn between the Cu underlayer and the Sn plating finish layer. The thickness of the diffusion alloy layer is in the range of 0.03 to 1.2 μm, and the thickness of the Sn plating finish layer is 0.05 to 1.5.
It is within the range of μm.
The described plated copper alloy thin plate.
金薄板で作られたコネクタ。7. A connector made of the plated copper alloy thin plate according to claim 4, 5 or 6.
たＮｉ下地層およびＮｉ下地層の上に形成されたＳｎメ
ッキ仕上げ層からなり、前記Ｎｉ下地層とＳｎメッキ仕
上げ層の間にＮｉ−Ｓｎ拡散合金層が形成されているメ
ッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあることを特徴とするメッキ銅合金薄板。8. A copper alloy thin plate, a Ni underlayer formed on the copper alloy thin plate, and a Sn-plated finish layer formed on the Ni underlayer, and between the Ni underlayer and the Sn-plated finish layer. In a plated copper alloy thin plate on which a Ni—Sn diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 is 70 to
140HK0.01 and 90-180HK0.025
Plated copper alloy sheet characterized by being within the range of.
たＮｉ下地層およびＮｉ下地層の上に形成されたＳｎメ
ッキ仕上げ層からなり、前記Ｎｉ下地層とＳｎメッキ仕
上げ層の間にＮｉ−Ｓｎ拡散合金層が形成されているメ
ッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあり、さらにＡＳＴＭ−Ｄ１８９４で規定さ
れる測定方法により測定された荷重：５．８８４ニュー
トン（６００ｇ）での静止摩擦係数が０．３〜０．５
５、運動摩擦係数が０．２０〜０．４５の範囲内にある
ことを特徴とするメッキ銅合金薄板。9. A copper alloy thin plate, a Ni underlayer formed on the copper alloy thin plate, and a Sn-plated finish layer formed on the Ni underlayer, and between the Ni underlayer and the Sn-plated finish layer. In a plated copper alloy thin plate on which a Ni—Sn diffusion alloy layer is formed, the Knoop hardness specified by JIS Z 2251 is 70 to
140HK0.01 and 90-180HK0.025
And the static friction coefficient at a load of 5.884 Newton (600 g) measured by the measuring method specified by ASTM-D1894 is 0.3 to 0.5.
5. A plated copper alloy thin plate having a coefficient of kinetic friction in the range of 0.20 to 0.45.
下地層の厚さが０．０３〜０．８μｍの範囲内にあり、
前記Ｎｉ下地層とＳｎメッキ仕上げ層の間のＮｉ−Ｓｎ
拡散合金層の厚さが０．０３〜１．２μｍの範囲内にあ
り、かつＳｎメッキ仕上げ層の厚さが０．０５〜１．５
μｍの範囲内にあることを特徴とする請求項７または８
記載のメッキ銅合金薄板。10. Ni formed on the copper alloy thin plate
The thickness of the underlayer is in the range of 0.03 to 0.8 μm,
Ni—Sn between the Ni underlayer and the Sn plated finish layer
The thickness of the diffusion alloy layer is in the range of 0.03 to 1.2 μm, and the thickness of the Sn plating finish layer is 0.05 to 1.5.
It is in the range of μm.
The described plated copper alloy thin plate.
銅合金薄板で作られたコネクタ。11. A connector made of the plated copper alloy sheet according to claim 8, 9, or 10.
れたＣｕ下地層およびＣｕ下地層の上に形成されたＳｎ
合金メッキ仕上げ層からなり、前記Ｃｕ下地層とＳｎ合
金メッキ仕上げ層の間にＣｕ−Ｓｎ系拡散合金層が形成
されているメッキ銅合金薄板において、 メッキ銅合金薄板表面のＪＩＳ Ｚ ２２５１で規定さ
れるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９０
〜１８０ＨＫ０．０２５の範囲内にあることを特徴とす
るメッキ銅合金薄板。12. A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and Sn formed on the Cu underlayer.
A plated copper alloy thin plate comprising an alloy plated finish layer, and a Cu-Sn type diffusion alloy layer formed between the Cu underlayer and the Sn alloy plated finish layer, in accordance with JIS Z 2251 of the surface of the plated copper alloy thin plate. Knoop hardness of 70-140HK0.01 and 90
~ 180HK 0.025 in the range, a plated copper alloy thin plate.
れたＣｕ下地層およびＣｕ下地層の上に形成されたＳｎ
合金メッキ仕上げ層からなり、前記Ｃｕ下地層とＳｎ合
金メッキ仕上げ層の間にＣｕ−Ｓｎ系拡散合金層が形成
されているメッキ銅合金薄板において、 メッキ銅合金薄板表面のＪＩＳ Ｚ ２２５１で規定さ
れるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９０
〜１８０ＨＫ０．０２５の範囲内にあり、さらにＡＳＴ
Ｍ−Ｄ１８９４で規定される測定方法により測定された
荷重：５．８８４ニュートン（６００ｇ）での静止摩擦
係数が０．３〜０．５５、運動摩擦係数が０．２０〜
０．４５の範囲内にあることを特徴とするメッキ銅合金
薄板。13. A copper alloy thin plate, a Cu underlayer formed on the copper alloy thin plate, and Sn formed on the Cu underlayer.
A plated copper alloy thin plate comprising an alloy plated finish layer, and a Cu-Sn type diffusion alloy layer formed between the Cu underlayer and the Sn alloy plated finish layer, in accordance with JIS Z 2251 of the surface of the plated copper alloy thin plate. Knoop hardness of 70-140HK0.01 and 90
Within 180HK0.025, AST
Load measured by the measuring method defined in M-D1894: Coefficient of static friction at 5.884 Newton (600 g) is 0.3 to 0.55, and coefficient of kinetic friction is 0.20 to 0.20.
A plated copper alloy thin plate characterized by being in the range of 0.45.
下地層の厚さが０．０３〜０．８μｍの範囲内にあり、
前記Ｃｕ下地層とＳｎ合金メッキ仕上げ層の間のＣｕ−
Ｓｎ系拡散合金層の厚さが０．０３〜１．２μｍの範囲
内にあり、かつＳｎ合金メッキ仕上げ層の厚さが０．０
５〜１．５μｍの範囲内にあることを特徴とする請求項
１０または１１記載のメッキ銅合金薄板。14. Cu formed on the copper alloy thin plate
The thickness of the underlayer is in the range of 0.03 to 0.8 μm,
Cu- between the Cu underlayer and the Sn alloy plating finish layer
The thickness of the Sn-based diffusion alloy layer is in the range of 0.03 to 1.2 μm, and the thickness of the Sn alloy plating finish layer is 0.0.
The plated copper alloy thin plate according to claim 10 or 11, wherein the plated copper alloy thin plate is in the range of 5 to 1.5 µm.
ッキ銅合金薄板で作られたコネクタ。15. A connector made of the plated copper alloy thin plate according to claim 12, 13 or 14.
れたＮｉ下地層およびＮｉ下地層の上に形成されたＳｎ
合金メッキ仕上げ層からなり、前記Ｎｉ下地層とＳｎ合
金メッキ仕上げ層の間にＮｉ−Ｓｎ系拡散合金層が形成
されているメッキ銅合金薄板において、 メッキ銅合金薄板表面のＪＩＳ Ｚ ２２５１で規定さ
れるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９０
〜１８０ＨＫ０．０２５の範囲内にあることを特徴とす
るメッキ銅合金薄板。16. A copper alloy thin plate, a Ni underlayer formed on the copper alloy thin plate, and Sn formed on the Ni underlayer.
A plated copper alloy thin plate comprising an alloy plated finish layer, and a Ni-Sn type diffusion alloy layer formed between the Ni underlayer and the Sn alloy plated finish layer, in accordance with JIS Z 2251 of the surface of the plated copper alloy thin plate. Knoop hardness of 70-140HK0.01 and 90
~ 180HK 0.025 in the range, a plated copper alloy thin plate.
れたＮｉ下地層およびＮｉ下地層の上に形成されたＳｎ
合金メッキ仕上げ層からなり、前記Ｎｉ下地層とＳｎ合
金メッキ仕上げ層の間にＮｉ−Ｓｎ系拡散合金層が形成
されているメッキ銅合金薄板において、 メッキ銅合金薄板表面のＪＩＳ Ｚ ２２５１で規定さ
れるヌープ硬さが７０〜１４０ＨＫ０．０１でかつ９０
〜１８０ＨＫ０．０２５の範囲内にあり、さらにＡＳＴ
Ｍ−Ｄ１８９４で規定される測定方法により測定された
荷重：５．８８４ニュートン（６００ｇ）での静止摩擦
係数が０．３〜０．５５、運動摩擦係数が０．２０〜
０．４５の範囲内にあることを特徴とするメッキ銅合金
薄板。17. A copper alloy thin plate, a Ni underlayer formed on the copper alloy thin plate, and Sn formed on the Ni underlayer.
A plated copper alloy thin plate comprising an alloy plated finish layer, and a Ni-Sn type diffusion alloy layer formed between the Ni underlayer and the Sn alloy plated finish layer, in accordance with JIS Z 2251 of the surface of the plated copper alloy thin plate. Knoop hardness of 70-140HK0.01 and 90
Within 180HK0.025, AST
Load measured by the measuring method defined in M-D1894: Coefficient of static friction at 5.884 Newton (600 g) is 0.3 to 0.55, and coefficient of kinetic friction is 0.20 to 0.20.
A plated copper alloy thin plate characterized by being in the range of 0.45.
下地層の厚さが０．０３〜０．８μｍの範囲内にあり、
前記Ｎｉ下地層とＳｎ合金メッキ仕上げ層の間のＮｉ−
Ｓｎ系拡散合金層の厚さが０．０３〜１．２μｍの範囲
内にあり、かつＳｎ合金メッキ仕上げ層の厚さが０．０
５〜１．５μｍの範囲内にあることを特徴とする請求項
１６または１７記載のメッキ銅合金薄板。18. Ni formed on the copper alloy thin plate
The thickness of the underlayer is in the range of 0.03 to 0.8 μm,
Ni-between the Ni underlayer and the Sn alloy plating finish layer
The thickness of the Sn-based diffusion alloy layer is in the range of 0.03 to 1.2 μm, and the thickness of the Sn alloy plating finish layer is 0.0.
The plated copper alloy thin plate according to claim 16 or 17, characterized in that the thickness is in the range of 5 to 1.5 µm.
ッキ銅合金薄板で作られたコネクタ。19. A connector made of the plated copper alloy thin plate according to claim 16, 17, or 18.
散合金層を介して形成されたＳｎメッキ仕上げ層からな
るメッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあることを特徴とするメッキ銅合金薄板。20. A plated copper alloy thin plate comprising a copper alloy thin plate and a Sn plating finish layer formed on the copper alloy thin plate via a diffusion alloy layer, wherein the Knoop hardness specified by JIS Z 2251 is 70-.
140HK0.01 and 90-180HK0.025
Plated copper alloy sheet characterized by being within the range of.
散合金層を介して形成されたＳｎメッキ仕上げ層からな
るメッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあり、さらにＡＳＴＭ−Ｄ１８９４で規定さ
れる測定方法により測定された荷重：５．８８４ニュー
トン（６００ｇ）での静止摩擦係数が０．３〜０．５
５、運動摩擦係数が０．２０〜０．４５の範囲内にある
ことを特徴とするメッキ銅合金薄板。21. A plated copper alloy thin plate comprising a copper alloy thin plate and a Sn plating finish layer formed on the copper alloy thin plate via a diffusion alloy layer, wherein the Knoop hardness specified by JIS Z 2251 is 70-.
140HK0.01 and 90-180HK0.025
And the static friction coefficient at a load of 5.884 Newton (600 g) measured by the measuring method specified by ASTM-D1894 is 0.3 to 0.5.
5. A plated copper alloy thin plate having a coefficient of kinetic friction in the range of 0.20 to 0.45.
の間に形成されたＣｕ−Ｓｎ拡散合金層の厚さが０．０
３〜１．２μｍの範囲内にあり、かつＳｎメッキ仕上げ
層の厚さが０．０５〜１．５μｍの範囲内にあることを
特徴とする請求項２０または２１記載のメッキ銅合金薄
板。22. The thickness of the Cu—Sn diffusion alloy layer formed between the copper alloy thin plate and the Sn plating finish layer is 0.0.
The plated copper alloy thin plate according to claim 20 or 21, wherein the thickness of the Sn plating finish layer is within a range of 3 to 1.2 µm, and the thickness of the Sn plating finish layer is within a range of 0.05 to 1.5 µm.
ッキ銅合金薄板で作られたコネクタ。23. A connector made of the plated copper alloy thin plate according to claim 20, 21 or 22.
散合金層を介して形成されたＳｎ合金メッキ仕上げ層か
らなるメッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあることを特徴とするメッキ銅合金薄板。24. A plated copper alloy thin plate comprising a copper alloy thin plate and a Sn alloy plating finish layer formed on the copper alloy thin plate via a diffusion alloy layer, wherein the Knoop hardness specified by JIS Z 2251 is 70 to
140HK0.01 and 90-180HK0.025
Plated copper alloy sheet characterized by being within the range of.
散合金層を介して形成されたＳｎ合金メッキ仕上げ層か
らなるメッキ銅合金薄板において、 ＪＩＳ Ｚ ２２５１で規定されるヌープ硬さが７０〜
１４０ＨＫ０．０１でかつ９０〜１８０ＨＫ０．０２５
の範囲内にあり、さらにＡＳＴＭ−Ｄ１８９４で規定さ
れる測定方法により測定された荷重：５．８８４ニュー
トン（６００ｇ）での静止摩擦係数が０．３〜０．５
５、運動摩擦係数が０．２０〜０．４５の範囲内にある
ことを特徴とするメッキ銅合金薄板。25. A plated copper alloy thin plate comprising a copper alloy thin plate and a Sn alloy plating finish layer formed on the copper alloy thin plate via a diffusion alloy layer, wherein the Knoop hardness specified by JIS Z 2251 is 70 to 50.
140HK0.01 and 90-180HK0.025
And the static friction coefficient at a load of 5.884 Newton (600 g) measured by the measuring method specified by ASTM-D1894 is 0.3 to 0.5.
5. A plated copper alloy thin plate having a coefficient of kinetic friction in the range of 0.20 to 0.45.
げ層の間に形成されたＣｕ−Ｓｎ拡散合金層の厚さが
０．０３〜１．２μｍの範囲内にあり、かつＳｎ合金メ
ッキ仕上げ層の厚さが０．０５〜１．５μｍの範囲内に
あることを特徴とする請求項２４または２５記載のメッ
キ銅合金薄板。26. The thickness of the Cu—Sn diffusion alloy layer formed between the copper alloy thin plate and the Sn alloy plating finish layer is in the range of 0.03 to 1.2 μm, and the Sn alloy plating finish layer. 26. The plated copper alloy thin plate according to claim 24 or 25, wherein the thickness of the plated copper alloy thin plate is in the range of 0.05 to 1.5 μm.
ッキ銅合金薄板で作られたコネクタ。27. A connector made of the plated copper alloy thin plate according to claim 24, 25 or 26.
重量％、Ｓｉ：０．０８〜０．７重量％、Ｓｎ：０．１
〜０．９重量％、Ｚｎ：０．１〜３重量％、Ｆｅ：０．
００７〜０．２５重量％、Ｐ：０．００１〜０．２重量
％、Ｍｇ：０．００１〜０．２重量％、Ｃｒ：０．０１
〜０．２重量％、Ｐｂ：０．００１〜０．０１重量％を
含有し、さらにＬｉ、Ｉｎ、Ｂａ、Ｐｄ、Ａｕ、Ｐｔ、
ＲｈおよびＩｒのうちの１種または２種以上を合計で
０．０００２〜０．０５重量％を含有し、残りがＣｕお
よび不可避不純物からなる組成を有する銅合金からなる
銅合金薄板であることを特徴とする請求項１〜２７の内
のいずれか１項記載のメッキ銅合金薄板。28. The copper alloy thin plate is made of Ni: 0.5 to 3
% By weight, Si: 0.08 to 0.7% by weight, Sn: 0.1
.About.0.9 wt%, Zn: 0.1-3 wt%, Fe: 0.
007 to 0.25% by weight, P: 0.001 to 0.2% by weight, Mg: 0.001 to 0.2% by weight, Cr: 0.01
.About.0.2 wt%, Pb: 0.001 to 0.01 wt%, and further contains Li, In, Ba, Pd, Au, Pt,
It is a copper alloy thin plate made of a copper alloy having a composition of one or more of Rh and Ir in a total amount of 0.0002 to 0.05% by weight and the balance of Cu and inevitable impurities. The plated copper alloy thin plate according to any one of claims 1 to 27, which is characterized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11904996A JP3391427B2 (en) | 1996-05-14 | 1996-05-14 | Plated copper alloy sheet and connector manufactured from the sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11904996A JP3391427B2 (en) | 1996-05-14 | 1996-05-14 | Plated copper alloy sheet and connector manufactured from the sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09320668A JPH09320668A (en) | 1997-12-12 |
| JP3391427B2 true JP3391427B2 (en) | 2003-03-31 |
Family
ID=14751649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11904996A Expired - Lifetime JP3391427B2 (en) | 1996-05-14 | 1996-05-14 | Plated copper alloy sheet and connector manufactured from the sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3391427B2 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4401580B2 (en) * | 2001-02-15 | 2010-01-20 | 株式会社オートネットワーク技術研究所 | Connector terminal structure |
| JP2003013279A (en) * | 2001-07-02 | 2003-01-15 | Mitsubishi Shindoh Co Ltd | METHOD FOR MANUFACTURING REFLOW Sn OR Sn ALLOY PLATED SHEET SUPERIOR IN MIGRATION RESISTANCE |
| JP3562719B2 (en) * | 2001-11-13 | 2004-09-08 | 矢崎総業株式会社 | Terminal |
| JP2003151668A (en) * | 2001-11-13 | 2003-05-23 | Yazaki Corp | Terminal |
| JP4247339B2 (en) * | 2002-01-21 | 2009-04-02 | Ｄｏｗａメタルテック株式会社 | Sn-coated member and manufacturing method thereof |
| JP4302392B2 (en) * | 2002-11-28 | 2009-07-22 | 三菱伸銅株式会社 | Connector terminal, connector, connector terminal manufacturing method, and connector strip |
| JP4112426B2 (en) * | 2003-05-14 | 2008-07-02 | 三菱伸銅株式会社 | Method for manufacturing plating material |
| JP2005206942A (en) * | 2003-12-26 | 2005-08-04 | Fuji Denshi Kogyo Kk | PRESS-BLANKING MATERIAL, AND Sn PLATING TREATMENT METHOD |
| JP4302545B2 (en) | 2004-02-10 | 2009-07-29 | 株式会社オートネットワーク技術研究所 | Press-fit terminal |
| JP4176081B2 (en) * | 2005-01-19 | 2008-11-05 | 日本航空電子工業株式会社 | Contact manufacturing method |
| JP2006307336A (en) * | 2005-03-29 | 2006-11-09 | Nikko Kinzoku Kk | Sn-PLATED STRIP OF Cu-Ni-Si-Zn-BASED ALLOY |
| TW200704790A (en) * | 2005-03-29 | 2007-02-01 | Nippon Mining Co | Sn-plated strip of cu-ni-si-zn-based alloy |
| TW200706662A (en) * | 2005-03-29 | 2007-02-16 | Nippon Mining Co | Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof |
| JP4814552B2 (en) * | 2005-06-13 | 2011-11-16 | Ｄｏｗａメタルテック株式会社 | Surface treatment method |
| JP2007063624A (en) * | 2005-08-31 | 2007-03-15 | Nikko Kinzoku Kk | Copper alloy tinned strip having excellent insertion/withdrawal property and heat resistance |
| JP4868892B2 (en) * | 2006-03-02 | 2012-02-01 | 富士通株式会社 | Plating method |
| JP2007262458A (en) * | 2006-03-27 | 2007-10-11 | Nikko Kinzoku Kk | WHISKER RESISTANT REFLOW Sn PLATING MATERIAL |
| JP2007291459A (en) * | 2006-04-26 | 2007-11-08 | Nikko Kinzoku Kk | TINNED STRIP OF Cu-Sn-P-BASED ALLOY |
| JP2007297668A (en) * | 2006-04-28 | 2007-11-15 | Om Sangyo Kk | Method for manufacturing plated product |
| JP4260826B2 (en) * | 2006-07-20 | 2009-04-30 | 日本航空電子工業株式会社 | Connector parts |
| JP5261278B2 (en) * | 2009-05-12 | 2013-08-14 | 古河電気工業株式会社 | Connectors and metal materials for connectors |
| JP6259628B2 (en) * | 2013-10-07 | 2018-01-10 | 住友ゴム工業株式会社 | Compressor for power plug and tire puncture emergency repair kit including the power plug |
-
1996
- 1996-05-14 JP JP11904996A patent/JP3391427B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| 「増補新版コネクタ最新技術」（１９８７年４月１０日），総合技術出版発行，第Ｉ章第１−１２頁 |
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| Publication number | Publication date |
|---|---|
| JPH09320668A (en) | 1997-12-12 |
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