JP3375181B2 - Glass composition for low-temperature fired substrate and low-temperature fired substrate obtained therefrom - Google Patents
Glass composition for low-temperature fired substrate and low-temperature fired substrate obtained therefromInfo
- Publication number
- JP3375181B2 JP3375181B2 JP23543793A JP23543793A JP3375181B2 JP 3375181 B2 JP3375181 B2 JP 3375181B2 JP 23543793 A JP23543793 A JP 23543793A JP 23543793 A JP23543793 A JP 23543793A JP 3375181 B2 JP3375181 B2 JP 3375181B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- powder
- weight
- crystalline phase
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子やコイル
（Ｌ）、コンデンサー（Ｃ）、抵抗（Ｒ）等のチップ部
品等を搭載し、これらをＡｇ、Ａｇ−Ｐｄ、Ａｕ、Ｃｕ
等の低抵抗導体配線により相互接続することのできる低
温焼成多層基板用のガラス組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mounts semiconductor devices, chip parts such as coils (L), capacitors (C), resistors (R), etc., and these are mounted on Ag, Ag-Pd, Au, Cu.
The present invention relates to a glass composition for a low temperature firing multilayer substrate which can be interconnected by low resistance conductor wiring such as.
【０００２】[0002]
【従来の技術及びその課題】従来、コンピューターや民
生機器等に使用される基板材料はＡｌ2 Ｏ3 （アルミ
ナ）が一般的であったが、アルミナは焼結温度が約１６
００℃と高く、同時焼成用配線導体にタングステン又は
モリブデン等の高融点金属材料を用いている。しかし、
これらの高融点金属材料では電気抵抗が比較的高いた
め、電気抵抗の低い、Ａｇ、Ａｇ−Ｐｄ、Ａｕ、Ｃｕ等
の使用が望まれていた。そこで、焼成温度が約８５０〜
約１０５０℃と低く、上記低抵抗導体が使用可能な、低
温焼成基板が各種提案されている。2. Description of the Related Art Conventionally, Al 2 O 3 (alumina) was generally used as a substrate material for computers and consumer appliances, but alumina has a sintering temperature of about 16
The temperature is as high as 00 ° C., and a refractory metal material such as tungsten or molybdenum is used for the simultaneous firing wiring conductor. But,
Since these high melting point metal materials have relatively high electric resistance, use of Ag, Ag-Pd, Au, Cu or the like having low electric resistance has been desired. Therefore, the firing temperature is about 850
Various low-temperature fired substrates have been proposed, which have a low temperature of about 1050 ° C. and can use the low-resistance conductor.
【０００３】特開昭６１−３１３４８号公報「低温焼成
セラミックス」では、ＣａＯ−Ｂ2Ｏ3 −ＳｉＯ2 系ガ
ラス５５〜６０％とアルミナ等のフィラー４０〜４５％
とを混合し、７５０〜８５０℃の低温で焼成した基板が
報告されている。又、特開昭５９−８３９５７号公報
「結晶化ガラス体」では、重量％でＳｉＯ2 ４０〜５
２、Ａｌ2 Ｏ3 ２７〜３７、ＭｇＯ１０〜２０、Ｂ2 Ｏ
3 ２〜８、ＣａＯ２〜８、ＺｒＯ2 ０．１〜３からなる
結晶化ガラス成分を粉砕してフリット化し、成形後９０
０〜９５０℃の低温で焼成した基板が報告されている。
しかし、前者はガラス自体の強度が弱いために、基板強
度は１５〜１９（kgｆ／mm2 ）と低く、後者は、主結晶
相であるコージェライトそのものの強度が弱いために、
基板強度は１７〜２１（kgｆ／mm2 ）と低い。このよう
に、従来の技術においては、ガラスセラミックスの強度
が弱く、多層基板とした場合に割れ易く、取り扱いに注
意を要する等の問題があった。[0003] JP At 61-31348 discloses "low-temperature fired ceramics", CaO-B 2 O 3 -SiO 2 based glass 55-60% and a filler 40-45% such as alumina
It has been reported that a substrate prepared by mixing and was baked at a low temperature of 750 to 850 ° C. Further, in JP-A-59-83957 "Crystalline glass body", SiO 2 40 to 5% by weight is used.
2, Al 2 O 3 27-37, MgO 10-20, B 2 O
3 2~8, CaO2~8, fritted by grinding crystallized glass component consisting of ZrO 2 0.1 to 3, forming after 90
Substrates fired at low temperatures of 0-950 ° C have been reported.
However, since the strength of the glass itself is weak in the former, the substrate strength is as low as 15 to 19 (kgf / mm 2 ), and in the latter, the strength of cordierite itself, which is the main crystal phase, is weak.
The substrate strength is as low as 17 to 21 (kgf / mm 2 ). As described above, the conventional techniques have the problems that the strength of the glass ceramics is weak, the glass ceramics are easily broken when formed into a multilayer substrate, and the handling is required with caution.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記の課題を
ふまえた上で開発された低温焼成基板用ガラス組成物に
関する。すなわち、酸化物の重量％表示で：
Ａｌ2 Ｏ3 ：４５〜５８％
ＳｉＯ2 ：２０〜３５％
Ｂ2 Ｏ3 ： ５〜１５％
ＭｇＯ ： ５〜２０％
Ｌｉ2 Ｏ ： ０〜 ２％
Ｎａ2 Ｏ ： ０〜 ２％
Ｋ2 Ｏ ： ０〜 ２％
但し、Ｌｉ2 Ｏ＋Ｎａ2 Ｏ＋Ｋ2 Ｏ：１〜４％
（少なくとも２種必須）からなり、熱処理することによ
ってムライトを主結晶相とし、フォルステライト、スピ
ネル及びサフィリンの内、少なくとも１種を副結晶相と
して析出するガラス組成物であることを特徴とする。SUMMARY OF THE INVENTION The present invention relates to a glass composition for a low temperature fired substrate, which has been developed in view of the above problems. That is, in terms of weight% of oxide: Al 2 O 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 to 2% However, it is composed of Li 2 O + Na 2 O + K 2 O: 1 to 4% (at least two kinds are essential), and mullite is used as a main crystalline phase by heat treatment, The glass composition is characterized in that at least one of stellite, spinel and sapphirine is precipitated as a sub-crystal phase.
【０００５】加えて、本発明の低温焼成基板用ガラス組
成物は、上記基本組成にさらに銅、バナジウム、鉄、ニ
ッケル、マンガン、コバルトの酸化物の内、少なくとも
１種を着色成分として加えることを特徴とし、上記基本
ガラス組成物または上記着色成分を加えたガラス組成物
を成形後、Ａｇ、Ａｇ−Ｐｄ、Ａｕのいずれかを主成分
とする導体ペーストで配線を形成し、大気中で焼成する
ことにより白色あるいは着色した低温焼成基板を得るこ
とを特徴とする。In addition, in the glass composition for a low temperature fired substrate of the present invention, at least one of oxides of copper, vanadium, iron, nickel, manganese and cobalt is added to the above basic composition as a coloring component. Characteristically, after molding the basic glass composition or the glass composition to which the coloring component is added, wiring is formed with a conductor paste containing Ag, Ag-Pd, or Au as a main component, and the wiring is baked in the atmosphere. This is characterized in that a white or colored low-temperature fired substrate is obtained.
【０００６】また、本発明の低温焼成基板用ガラス組成
物は、上記基本組成にさらにモリブデン、タングステ
ン、鉄、ニッケル、マンガン、コバルトの酸化物の内、
少なくとも１種を着色成分として加えることを特徴と
し、上記基本ガラス組成物または上記着色成分を加えた
ガラス組成物を成形後、Ｃｕを主成分とする導体ペース
トで配線を形成し、水素を含む還元性雰囲気中で焼成す
ることにより無着色又は着色した低温焼成基板を得るこ
とを特徴とする。The glass composition for a low temperature fired substrate of the present invention has the above basic composition, and further contains oxides of molybdenum, tungsten, iron, nickel, manganese, and cobalt.
At least one kind is added as a coloring component, and after forming the basic glass composition or the glass composition containing the coloring component, wiring is formed with a conductor paste containing Cu as a main component, and reduction containing hydrogen is performed. It is characterized in that a low-temperature fired substrate that is uncolored or colored is obtained by firing in a strong atmosphere.
【０００７】また、本発明の低温焼成基板用ガラス組成
物は、上記基本組成にさらにバナジウム、モリブデン、
鉄の酸化物の内、少なくとも１種を着色成分として加え
ることを特徴とし、上記基本ガラス組成物または上記着
色成分を加えたガラス組成物を成形後、Ａｇ、Ａｇ−Ｐ
ｄ、Ａｕ、Ｃｕのいずれかを主成分とする導体ペースト
で配線を形成し、中性雰囲気（窒素等の不活性雰囲気）
中で焼成することにより白色あるいは着色した低温焼成
基板を得ることを特徴とする。The glass composition for a low temperature fired substrate of the present invention further comprises vanadium, molybdenum, and
At least one kind of iron oxide is added as a coloring component, and after molding the above-mentioned basic glass composition or the glass composition to which the above-mentioned coloring component is added, Ag, Ag-P
Wiring is formed with a conductor paste containing d, Au, or Cu as a main component, and a neutral atmosphere (inert atmosphere such as nitrogen)
It is characterized in that a white or colored low-temperature baked substrate is obtained by baking in the inside.
【０００８】さらに、本発明の低温焼成基板用組成物
は、上記基本ガラス組成物に銅、バナジウム、鉄、ニッ
ケル、マンガン、コバルトの酸化物粉末、金属塩化合物
粉末、金属粉末の内、少なくとも１種を着色フィラ―と
して添加、混合することを特徴とし、それを成形後、Ａ
ｇ、Ａｇ−Ｐｄ、Ａｕのいずれかを主成分とする導体ペ
ーストで配線を形成し、大気中で焼成することにより着
色した低温焼成基板を得ることを特徴とする。Further, the composition for a low temperature fired substrate of the present invention comprises at least one of oxide powders of copper, vanadium, iron, nickel, manganese and cobalt, metal salt compound powders and metal powders in addition to the above basic glass composition. The feature is that seeds are added and mixed as a coloring filler.
It is characterized in that a wiring is formed from a conductive paste containing g, Ag—Pd, or Au as a main component, and the wiring is fired in the air to obtain a colored low-temperature firing substrate.
【０００９】また、本発明の低温焼成基板用組成物は、
上記基本ガラス組成物にモリブデン、タングステン、
鉄、ニッケル、マンガン、コバルトの酸化物粉末、金属
塩化合物粉末、金属粉末の内、少なくとも１種を着色フ
ィラ−として添加、混合することを特徴とし、それを成
形後、Ｃｕを主成分とする導体ペ−ストで配線を形成
し、水素を含む還元性雰囲気中で焼成することにより着
色した低温焼成基板を得ることを特徴とする。The composition for low temperature fired substrate of the present invention is
Molybdenum, tungsten,
At least one of iron, nickel, manganese, and cobalt oxide powders, metal salt compound powders, and metal powders is added and mixed as a coloring filler, and Cu is the main component after molding. A feature is that a colored low-temperature fired substrate is obtained by forming wiring with a conductor paste and firing in a reducing atmosphere containing hydrogen.
【００１０】また、本発明の低温焼成基板用組成物は、
上記基本ガラス組成物にバナジウム、モリブデン、鉄の
酸化物粉末、金属塩化合物粉末、金属粉末の内、少なく
とも１種を着色フィラ−として添加、混合することを特
徴とし、それを成形後、Ａｇ、Ａｇ−Ｐｄ、Ａｕ、Ｃｕ
のいずれかを主成分とする導体ペ−ストで配線を形成
し、中性雰囲気中で焼成することにより着色した低温焼
成基板を得ることを特徴とする。The composition for low temperature fired substrate of the present invention is
At least one of vanadium, molybdenum, iron oxide powder, metal salt compound powder, and metal powder is added and mixed as a coloring filler to the basic glass composition, and after molding, Ag, Ag-Pd, Au, Cu
The wiring is formed with a conductor paste containing any of the above as a main component, and is baked in a neutral atmosphere to obtain a colored low-temperature baked substrate.
【００１１】また、本発明の低温焼成基板の抗折強度は
２３kgｆ／mm2 以上であることを特徴とする。Further, the low temperature fired substrate of the present invention is characterized by having a bending strength of 23 kgf / mm 2 or more.
【００１２】以下、本発明を詳細に説明する。Ａｌ2 Ｏ
3 は結晶化ガラス中のムライト（３Ａｌ2 Ｏ3 ・２Ｓｉ
Ｏ2 ）、スピネル（ＭｇＯ・Ａｌ2 Ｏ3 ）及びサフィリ
ン（４ＭｇＯ・５Ａｌ2 Ｏ3 ・２ＳｉＯ2 ）の構成成分
であり、又、残存ガラスの中間酸化物である。Ａｌ2 Ｏ
3 が４５ｗｔ％未満では、ムライトの結晶化度が低く、
強度が２３kgｆ／mm2 に達しない。逆に５８ｗｔ％を越
えると溶融温度が高くなり、失透しやすくなる。The present invention will be described in detail below. Al 2 O
3 is mullite (3Al 2 O 3 .2Si) in crystallized glass
O 2 ), spinel (MgO · Al 2 O 3 ) and sapphirine (4MgO · 5Al 2 O 3 · 2SiO 2 ), and an intermediate oxide of the residual glass. Al 2 O
When 3 is less than 45 wt%, the crystallinity of mullite is low,
The strength does not reach 23 kgf / mm 2 . On the other hand, if it exceeds 58 wt%, the melting temperature becomes high and devitrification is likely to occur.
【００１３】ＳｉＯ2 は結晶化ガラス中のムライト、フ
ォルステライト（２ＭｇＯ・ＳｉＯ2 ）及びサフィリン
の構成成分であり、又、残存ガラスの骨格を形成する。
ＳｉＯ2 が２０ｗｔ％未満であると、これらの結晶が析
出しにくくなる。逆に３５ｗｔ％を越えるとフォルステ
ライト相の代りにコージェライト相が生成し、強度が低
くなる。SiO 2 is a constituent of mullite, forsterite (2MgO.SiO 2 ) and sapphirine in crystallized glass, and also forms the skeleton of the residual glass.
If SiO 2 is less than 20 wt%, it becomes difficult for these crystals to precipitate. On the other hand, when it exceeds 35 wt%, a cordierite phase is generated instead of the forsterite phase, resulting in low strength.
【００１４】Ｂ2 Ｏ3 は融剤として使用され、５ｗｔ％
未満では溶融温度が高くなりすぎる。逆に１５ｗｔ％を
越えると結晶化度が下がり、強度が低下する。B 2 O 3 is used as a flux, and is 5 wt%
If it is less than 1, the melting temperature becomes too high. On the other hand, if it exceeds 15 wt%, the crystallinity decreases and the strength decreases.
【００１５】ＭｇＯはガラス作製時の溶融温度を下げる
とともに、結晶化ガラス中のフォルステライト、スピネ
ル及びサフィリンの構成成分であり、トータルの結晶化
度を高める働きをする。５ｗｔ％未満では、これらの結
晶相の析出量が少ないため強度が上らず、また、溶融温
度も高くなる。逆に２０ｗｔ％を越えると分相領域に入
り、溶融時、失透してしまう。MgO lowers the melting temperature during glass production, and is a constituent of forsterite, spinel and sapphirine in the crystallized glass, and functions to increase the total crystallinity. If it is less than 5 wt%, the amount of precipitation of these crystal phases is small, so that the strength does not increase and the melting temperature also increases. On the other hand, if it exceeds 20 wt%, it enters into the phase separation region and devitrifies during melting.
【００１６】強度、溶融性、成形性、結晶相のバランス
等を総合的に勘案すると、上記成分中のＡｌ2 Ｏ3 は４
７〜５３ｗｔ％、ＳｉＯ2 は２４〜３３ｗｔ％、Ｂ2 Ｏ
3は５〜１５ｗｔ％、ＭｇＯは７〜１４ｗｔ％であるこ
とが好ましい。Taking into consideration the strength, meltability, moldability, balance of crystal phase, etc., the Al 2 O 3 content in the above components is 4
7 to 53 wt%, SiO 2 is 24 to 33 wt%, B 2 O
It is preferable that 3 is 5 to 15 wt% and MgO is 7 to 14 wt%.
【００１７】また、Ｒ2 Ｏ（Ｒ＝Ｌｉ、Ｎａ、Ｋの内、
少なくとも２種必須）成分を添加することにより、高温
時におけるガラスの電気伝導度が大きくなるため、電気
溶融の適用が可能となり、クリーンな状態でガラスを溶
融することが可能となる。Ｒ2 Ｏ成分は、単独で用いる
と結晶化ガラス焼結体の誘電正接（ｔａｎδ）を増大さ
せ、絶縁抵抗を低下させる。しかし、２成分以上を同時
に添加し、混合アルカリ効果を利用するとｔａｎδの増
大及び絶縁抵抗の低下を抑制することができる。Ｒ2 Ｏ
は合計で１ｗｔ％未満では、電気溶融時キャリアーとし
ての効果がない。逆にＬｉ2 Ｏ、Ｎａ2 Ｏ、Ｋ2 Ｏのい
ずれかが２ｗｔ％を越えるか、その合計が４ｗｔ％を越
えると低温焼成基板のｔａｎδの増大及び絶縁抵抗の低
下が起こるばかりでなく、熱膨張係数が大きくなりすぎ
る。上記の理由でＲ2 Ｏは１〜４ｗｔ％とするが、その
構成比は少なくとも２種が０．３ｗｔ％以上であること
が好ましい。また、Ｒ2 Ｏを２成分とする場合はどの２
種の組合せでも良いが、混合アルカリ効果が最も顕著に
現われるＬｉ2 ＯとＫ2 Ｏの組合せが好ましい。Ｒ2 Ｏ
を３成分添加すると更に効果は著しい。In addition, R 2 O (R = Li, Na, K,
By adding at least two essential components, the electric conductivity of the glass at high temperature is increased, and therefore electric melting can be applied, and the glass can be melted in a clean state. The R 2 O component, when used alone, increases the dielectric loss tangent (tan δ) of the crystallized glass sintered body and lowers the insulation resistance. However, if two or more components are added at the same time and the mixed alkali effect is utilized, an increase in tan δ and a decrease in insulation resistance can be suppressed. R 2 O
When the total amount is less than 1 wt%, it has no effect as a carrier during electric melting. On the other hand, if any of Li 2 O, Na 2 O, and K 2 O exceeds 2 wt%, or if the total exceeds 4 wt%, not only does tan δ of the low temperature fired substrate increase and insulation resistance decreases, Expansion coefficient is too high. For the above reasons, R 2 O is 1 to 4 wt%, but the composition ratio of at least two kinds is preferably 0.3 wt% or more. If R 2 O is used as a two component, which two
A combination of species may be used, but a combination of Li 2 O and K 2 O in which the mixed alkali effect is most prominent is preferable. R 2 O
When 3 components are added, the effect is more remarkable.
【００１８】着色基板を得るためには、上記基本成分の
他に以下の着色成分をガラス組成中に加えても良い。
銅、バナジウム、鉄、ニッケル、マンガン、コバルトの
酸化物は大気中で焼成を行う場合の着色成分である。
銅、バナジウム、鉄、ニッケル、マンガン、コバルトの
酸化物の内、少なくとも１種が必要である。そしてその
合計量が０．１ｗｔ％未満では着色が不十分で外観上好
ましくない。逆にその合計量が５ｗｔ％を越えると焼結
性が低下し、強度が劣化する。In order to obtain a colored substrate, the following coloring components may be added to the glass composition in addition to the above basic components.
Oxides of copper, vanadium, iron, nickel, manganese, and cobalt are coloring components when firing in air.
At least one of oxides of copper, vanadium, iron, nickel, manganese, and cobalt is required. If the total amount is less than 0.1 wt%, coloring is insufficient and the appearance is not preferable. On the other hand, if the total amount exceeds 5 wt%, the sinterability decreases and the strength deteriorates.
【００１９】また、モリブデン、タングステン、鉄、ニ
ッケル、マンガン、コバルトの酸化物は水素を含む還元
性雰囲気中で焼成を行う場合の着色成分である。モリブ
デン、タングステン、鉄、ニッケル、マンガン、コバル
トの酸化物の内、少なくとも１種が必要である。そして
その合計量が０．１ｗｔ％未満では着色が不十分で外観
上好ましくない。逆にその合計量が５ｗｔ％を越えると
焼結性が低下し、強度が劣化する。Oxides of molybdenum, tungsten, iron, nickel, manganese, and cobalt are coloring components when firing in a reducing atmosphere containing hydrogen. At least one of oxides of molybdenum, tungsten, iron, nickel, manganese, and cobalt is required. If the total amount is less than 0.1 wt%, coloring is insufficient and the appearance is not preferable. On the other hand, if the total amount exceeds 5 wt%, the sinterability decreases and the strength deteriorates.
【００２０】また、バナジウム、モリブデン、鉄の酸化
物は中性雰囲気中で焼成を行う場合の着色成分である。
バナジウム、モリブデン、鉄の酸化物の内、少なくとも
１種が必要である。そしてその合計量が０．１ｗｔ％未
満では着色が不十分で外観上好ましくない。逆にその合
計量が５ｗｔ％を越えると焼結性が低下し、強度が劣化
する。Oxides of vanadium, molybdenum and iron are coloring components when firing in a neutral atmosphere.
At least one kind of oxides of vanadium, molybdenum and iron is required. If the total amount is less than 0.1 wt%, coloring is insufficient and the appearance is not preferable. On the other hand, if the total amount exceeds 5 wt%, the sinterability decreases and the strength deteriorates.
【００２１】なお、これら大気中焼成、還元性雰囲気中
焼成、中性雰囲気中焼成における着色成分については、
上述のようにガラスの成分として加えても、添加物（フ
ィラ−）として加えても、同様の効果が得られる。着色
成分をフィラ−として基本ガラス組成物の粉末に添加、
混合する場合は、酸化物粉末、炭酸塩、硫酸塩、水酸化
物等の金属塩化合物粉末、金属粉末のいずれを用いても
よい。Regarding the coloring components in the firing in the air, the firing in a reducing atmosphere, and the firing in a neutral atmosphere,
Similar effects can be obtained by adding it as a glass component or as an additive (filler) as described above. Add a coloring component as a filler to the powder of the basic glass composition,
When mixing, any of an oxide powder, a metal salt compound powder such as a carbonate, a sulfate and a hydroxide, and a metal powder may be used.
【００２２】また、上記のガラス組成にさらに溶融性向
上のための合計で３ｗｔ％以下のＣａＯ、ＢａＯ、Ｚｎ
Ｏ、結晶化促進剤としての合計で５ｗｔ％以下のＺｒＯ
2 、ＳｎＯ2 、結晶化促進剤としての作用の他に融剤と
しての作用も持つ５ｗｔ％以下のＦ2 等を加えても良
い。In addition to the above glass composition, a total content of 3 wt% or less of CaO, BaO and Zn for improving the melting property is added.
O, 5% by weight or less of ZrO in total as a crystallization accelerator
2 , SnO 2 , and 5 wt% or less of F 2 having a function as a fluxing agent in addition to a function as a crystallization accelerator may be added.
【００２３】[0023]
【発明の作用】本願発明の組成のガラス組成物は、Ａ
ｇ、Ａｇ−Ｐｄ、Ａｕ、Ｃｕ等の低抵抗導体材料と共に
約８５０〜約１０５０℃で焼成可能であり、焼成後ムラ
イトを主結晶相とし、副結晶相としてフォルステライ
ト、スピネル及びサフィリンの内少なくとも１種を有
し、抗折強度２３kgｆ／mm2 以上の高強度基板が得られ
る。また、誘電率は７以下とアルミナに比べて低く、信
号ノイズの低減にも効果を有する。熱膨張係数は５０〜
７０×１０-7／℃であり、アルミナに近く、半導体素子
やＬＣＲ等の部品搭載においても問題は生じない。ま
た、着色成分を使用した場合には、遮光性を有するため
半導体素子を光から保護すると共にアセンブル上の取扱
いが容易となる。The glass composition having the composition of the present invention is A
g, Ag—Pd, Au, Cu, etc., and can be fired at about 850 to about 1050 ° C. with a low resistance conductor material. A high-strength substrate having a bending strength of 23 kgf / mm 2 or more can be obtained. Further, it has a dielectric constant of 7 or less, which is lower than that of alumina, and is effective in reducing signal noise. Coefficient of thermal expansion is 50 ~
It is 70 × 10 −7 / ° C., which is close to that of alumina, and there is no problem in mounting components such as semiconductor elements and LCR. Further, when the coloring component is used, since it has a light-shielding property, it protects the semiconductor element from light and facilitates the assembly process.
【００２４】[0024]
【実施例及び比較例】常法に従い、表に示す目標組成と
なるように各成分原料を適宜秤量、調合してバッチを調
製し、表中に示す溶融温度で２〜３時間溶解し、溶融ガ
ラスとする。この溶融ガラスを水冷ロールでフレーク状
に成形する。このガラスをボールミル等で微粉砕し、平
均粒径約２〜５μｍのガラス微粉体とする。また、着色
成分をフィラ−として添加する場合には、このガラス微
粉体と混合し、本発明の低温焼成基板用組成物微粉体を
得る。[Examples and Comparative Examples] According to a conventional method, the ingredients are appropriately weighed and mixed so as to obtain the target composition shown in the table to prepare a batch, which is melted at the melting temperature shown in the table for 2 to 3 hours and melted Use glass. This molten glass is formed into flakes with a water-cooled roll. This glass is finely pulverized by a ball mill or the like to obtain fine glass powder having an average particle diameter of about 2 to 5 μm. When the coloring component is added as a filler, it is mixed with this glass fine powder to obtain the composition fine powder for a low temperature fired substrate of the present invention.
【００２５】基板を作製する場合には、前記微粉体をト
ルエン、エタノール等の溶剤と共にボールミル中で分散
した後、ポリビニルブチラール、ポリアクリル酸エステ
ル等のバインダー及びＤＢＰ、ＤＯＰ等の可塑剤を加え
スラリー状にし、ドクターブレード法でグリーンシート
に成形する。これを切断・積層後、大気中、水素を含む
還元性雰囲気中もしくは中性雰囲気中で２００℃／ｈの
昇温速度で８５０〜１０５０℃まで上げ、この焼成温度
で２時間保持し低温焼成基板を得、誘電率、誘電正接及
び絶縁抵抗を以下に示す方法で測定した。その結果を表
１乃至表６（実施例）及び表７乃至表８（比較例）に示
す。When a substrate is prepared, the fine powder is dispersed in a ball mill together with a solvent such as toluene or ethanol, and then a binder such as polyvinyl butyral or polyacrylic ester and a plasticizer such as DBP or DOP are added to the slurry. And shape it into a green sheet by the doctor blade method. After cutting and stacking this, the temperature is raised to 850 to 1050 ° C. at a temperature rising rate of 200 ° C./h in a reducing atmosphere containing hydrogen or in a neutral atmosphere, and the firing temperature is maintained for 2 hours. And the dielectric constant, dielectric loss tangent and insulation resistance were measured by the following methods. The results are shown in Tables 1 to 6 (Examples) and Tables 7 to 8 (Comparative Examples).
【００２６】また、示差熱分析（ＤＴＡ）、熱膨張係
数、結晶相、抗折強度については本実施例及び比較例で
得られた微粉体を用いて以下に示す方法で測定した。そ
の結果を表１乃至表６（実施例）及び表７乃至表８（比
較例）に示す。The differential thermal analysis (DTA), coefficient of thermal expansion, crystal phase, and bending strength were measured by the following methods using the fine powders obtained in this example and comparative examples. The results are shown in Tables 1 to 6 (Examples) and Tables 7 to 8 (Comparative Examples).
【００２７】誘電率、誘電正接（ｔａｎδ）
各粉末を前述の通り基板に成形したものに電極を施し、
２５℃−６０％ＲＨ、１ＭＨｚにおいてインピーダンス
メーターで測定した。Dielectric constant, dielectric loss tangent (tan δ) Each powder was molded on a substrate as described above, electrodes were applied,
It was measured with an impedance meter at 25 ° C.-60% RH and 1 MHz.
【００２８】絶縁抵抗
各粉末を前述の通り基板に成形したものに電極を施し、
２５℃−６０％ＲＨ、５０Ｖにおいて絶縁抵抗計で測定
した。Insulation resistance Each powder was molded on a substrate as described above, and electrodes were applied to the molded product.
It measured by the insulation resistance meter in 25 degreeC-60% RH and 50V.
【００２９】示差熱分析（ＤＴＡ）
各粉末５００mgを示差熱分析装置の試料ホルダーに入
れ、室温から２０℃／min の昇温速度で上昇させ、転移
点、軟化点、結晶化ピーク温度を測定した。Differential thermal analysis (DTA) 500 mg of each powder was placed in a sample holder of a differential thermal analyzer and the temperature was raised from room temperature to 20 ° C./min to measure the transition point, softening point and crystallization peak temperature. .
【００３０】熱膨張係数
各粉末をペレッターで棒状に加圧成形した後、ＤＴＡで
測定した結晶化ピーク温度まで２００℃／ｈで昇温し、
その温度で２時間保持し焼結したサンプルを室温から１
０℃／min の昇温速度で上昇させ、熱膨張係数（３０〜
４００℃の平均値、単位：１０-7／℃）を測定した。Thermal Expansion Coefficient Each powder was pressed into a rod shape with a pelletizer and then heated at 200 ° C./h to the crystallization peak temperature measured by DTA,
Samples sintered by holding at that temperature for 2 hours from room temperature to 1
The coefficient of thermal expansion (30 ~
The average value at 400 ° C., unit: 10 −7 / ° C.) was measured.
【００３１】結晶相
前述ので得られたサンプルと同じ物を再び微粉体とし
た後、粉末Ｘ線回折により測定した。Crystal Phase The same material as the sample obtained as described above was made into a fine powder again and then measured by powder X-ray diffraction.
【００３２】抗折強度
前述ので得られたサンプルと同じ物をＪＩＳ−Ｒ１６
０１に準じて加工し、３点曲げによりその強度を測定し
た。Bending strength The same sample as the one obtained in the above was used in JIS-R16.
The sample was processed according to No. 01 and its strength was measured by three-point bending.
【００３３】[0033]
【表１】 [Table 1]
【００３４】[0034]
【表２】 [Table 2]
【００３５】[0035]
【表３】 [Table 3]
【００３６】[0036]
【表４】 [Table 4]
【００３７】[0037]
【表５】 [Table 5]
【００３８】[0038]
【表６】 [Table 6]
【００３９】[0039]
【表７】 [Table 7]
【００４０】[0040]
【表８】 [Table 8]
【００４１】更に、実施例に示した組成の粉末を用い
て、多層配線基板を試作した。上記グリーンシートにパ
ンチングによりヴィアホールを形成し、Ａｇ、Ａｇ−Ｐ
ｄ、Ａｕ、Ｃｕ等の低抵抗金属粉体からなるペーストを
スクリーン印刷法によりヴィアに充填、さらに所望のパ
ターンを印刷し、回路を形成する。次いで各層を熱圧着
法により積層し、切断後、焼成を行う。Ａｇ、Ａｇ−Ｐ
ｄ、Ａｕ導体の場合は、大気中もしくは中性雰囲気中で
１００〜２００℃／ｈの昇温速度で８５０〜１０００℃
まで上げ、この温度で１〜３時間保持し、多層基板を得
る。Ｃｕ導体の場合は、弱酸化性もしくは非酸化性雰囲
気で脱バインダーを完全に行った後、Ｃｕの酸化防止の
ために水素を含む還元性雰囲気中もしくは中性雰囲気中
８５０〜１０５０℃で焼成を行う。こうして得られた多
層基板の配線抵抗は低く、導体層の接着強度も十分であ
った。また、導体層の半田濡れ性も良好であり、強固な
リード付が可能であった。Further, a multi-layer wiring board was manufactured by using the powder having the composition shown in the examples. Via holes are formed in the green sheet by punching, and Ag, Ag-P
A paste made of a low resistance metal powder such as d, Au or Cu is filled in the via by a screen printing method, and a desired pattern is printed to form a circuit. Next, each layer is laminated by a thermocompression bonding method, cut, and then fired. Ag, Ag-P
In the case of d and Au conductor, it is 850 to 1000 ° C. at a temperature rising rate of 100 to 200 ° C./h in the air or a neutral atmosphere.
The temperature is raised to 1 hour and held at this temperature for 1 to 3 hours to obtain a multilayer substrate. In the case of a Cu conductor, after completely removing the binder in a weakly oxidizing or non-oxidizing atmosphere, firing is performed at 850 to 1050 ° C. in a reducing atmosphere containing hydrogen or a neutral atmosphere to prevent Cu oxidation. To do. The wiring resistance of the thus obtained multilayer substrate was low, and the adhesive strength of the conductor layer was also sufficient. Moreover, the solder wettability of the conductor layer was also good, and firm lead attachment was possible.
フロントページの続き (72)発明者 田中 淳 鹿児島県国分市山下町１番１号京セラ株 式会社鹿児島国分工場内 (72)発明者 小長 智美 鹿児島県国分市山下町１番１号京セラ株 式会社鹿児島国分工場内 (72)発明者 森上 義博 鹿児島県国分市山下町１番１号京セラ株 式会社鹿児島国分工場内 (56)参考文献 特開 昭59−39744（ＪＰ，Ａ) 特開 昭62−252340（ＪＰ，Ａ) 作花済夫、外２名，ガラスハンドブッ ク，株式会社朝倉書店，1975年 ９月30 日，ｐ718、728、740、765、855 (58)調査した分野(Int.Cl.7，ＤＢ名) C04B 35/00 - 35/22 C03C 1/00 - 14/00 H05K 1/03 ＷＰＩFront page continued (72) Inventor Jun Tanaka 1-1, Yamashita-cho, Kokubun-shi, Kagoshima Prefecture Kyocera Stock Company Kagoshima Kokubun Factory (72) Inventor Tomomi Ogana 1-1, Yamashita-cho, Kokubun-shi, Kagoshima Prefecture Company Kagoshima Kokubun Factory (72) Inventor Yoshihiro Morikami 1-1, Yamashita Town, Kokubun City, Kagoshima Prefecture Kyocera Stock Company Kagoshima Kokubun Factory (56) Reference JP-A-59-39744 (JP, A) JP A 62-252340 (JP, A) Sakubana Sachio, 2 others, Glass Handbook, Asakura Shoten Co., Ltd., September 30, 1975, p718, 728, 740, 765, 855 (58) Fields investigated (Int .Cl. 7 , DB name) C04B 35/00-35/22 C03C 1/00-14/00 H05K 1/03 WPI
Claims (11)
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなり、粉末ガラスの熱処理後、抗折強度が２
３ｋｇｆ／ｍｍ 2 以上であり、かつ白色又は着色されて
なることを特徴とする低温焼成基板用ガラス組成物。1. A glass which is obtained by precipitating mullite as a main crystalline phase and at least one of forsterite, spinel and sapphirine as a secondary crystalline phase by heat treatment, and is expressed in weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
4% Tona is, after heat treatment of powdered glass, bending strength 2
3 kgf / mm 2 or more, and white or colored
A glass composition for a low-temperature fired substrate, which comprises:
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％銅、バナジウム、モリブデン、タングステン、
鉄、ニッケル、マンガン、コバルトの酸化物の内少なく
とも１種：０.１〜５％からなり、粉末ガラスの熱処理
後、抗折強度が２３ｋｇｆ／ｍｍ 2 以上であり、かつ白
色又は着色されてなることを特徴とする低温焼成基板用
ガラス組成物。2. A glass which is obtained by precipitating mullite as a main crystal phase and at least one of forsterite, spinel and sapphirine as a sub-crystal phase by heat treatment, and is expressed in weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
~ 4% copper, vanadium, molybdenum, tungsten,
At least one of oxides of iron, nickel, manganese, and cobalt: 0.1 to 5% , heat treatment of powder glass
Later, the bending strength is 23 kgf / mm 2 or more, and white
A glass composition for a low-temperature fired substrate, which is colored or colored .
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなる低温焼成基板用ガラス組成物の粉末１０
０重量部に対し、銅、バナジウム、モリブデン、タング
ステン、鉄、ニッケル、マンガン、コバルトの酸化物粉
末、金属塩化合物粉末、金属粉末の内少なくとも１種：
０.１〜５重量部をフィラーとして添加、混合してな
り、粉末ガラスとフィラーの混合物の熱処理後、抗折強
度が２３ｋｇｆ／ｍｍ 2 以上であり、かつ白色又は着色
されてなることを特徴とする低温焼成基板用組成物。3. A glass which, when heat-treated, precipitates mullite as a main crystalline phase and at least one of forsterite, spinel and sapphirine as a secondary crystalline phase, expressed in weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
Powder of glass composition for low temperature firing substrate consisting of ˜4% 10
At least one of oxide powders of copper, vanadium, molybdenum, tungsten, iron, nickel, manganese, and cobalt, metal salt compound powders, and metal powders relative to 0 parts by weight:
Adding 0.1 to 5 parts by weight as a filler, it is mixed
Strength after heat treatment of a mixture of powdered glass and filler
Degree of 23 kgf / mm 2 or more and white or colored
A composition for a low-temperature fired substrate , characterized by comprising:
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなる低温焼成基板用ガラス組成物の粉末を成
形し、その上にＡｇ、Ａｇ−Ｐｄ、Ａｕのいずれかを主
成分とする導体ペーストで配線を形成した後、大気中も
しくは中性雰囲気中で焼成して作製され、抗折強度が２
３ｋｇｆ／ｍｍ 2 以上であり、かつ白色又は着色されて
なることを特徴とする低温焼成基板。4. A glass in which mullite is the main crystal phase and at least one of forsterite, spinel and sapphirine is precipitated as the sub crystal phase by heat treatment, and the glass is represented by weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
After molding a powder of a glass composition for a low-temperature fired substrate consisting of ˜4%, and forming a wiring on the powder with a conductor paste containing Ag, Ag—Pd, or Au as a main component, the powder is exposed to air or neutral. It is manufactured by firing in an atmosphere and has a bending strength of 2
3 kgf / mm 2 or more, and white or colored
A low temperature fired substrate.
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなる低温焼成基板用ガラス組成物の粉末を成
形し、その上にＣｕを主成分とする導体ペーストで配線
を形成した後、水素を含む還元性雰囲気中もしくは中性
雰囲気中で焼成して作製され、抗折強度が２３ｋｇｆ／
ｍｍ 2 以上であり、かつ白色又は着色されてなることを
特徴とする低温焼成基板。5. A glass which, when heat-treated, precipitates mullite as a main crystalline phase and at least one of forsterite, spinel and sapphirine as a secondary crystalline phase, expressed as a weight percentage of oxides: Al 2 O 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
-4% of a glass composition for a low temperature firing substrate is molded, and a conductor paste having Cu as a main component is formed thereon to form wiring, and then firing is performed in a reducing atmosphere containing hydrogen or in a neutral atmosphere. Manufactured with a bending strength of 23 kgf /
mm 2 or more and white or colored
Characteristic low temperature firing substrate.
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％銅、バナジウム、鉄、ニッケル、マンガン、コバ
ルトの酸化物の内少なくとも１種：０.１〜５％からな
る低温焼成基板用ガラス組成物の粉末を成形し、その上
にＡｇ、Ａｇ−Ｐｄ、Ａｕのいずれかを主成分とする導
体ペーストで配線を形成した後、大気中で焼成して作製
され、抗折強度が２３ｋｇｆ／ｍｍ 2 以上であり、かつ
白色又は着色されてなることを特徴とする低温焼成基
板。6. A glass which is obtained by heat-treating mullite as a main crystalline phase and at least one of forsterite, spinel and sapphirine as a secondary crystalline phase, and is expressed as a weight percentage of oxides: Al 2 O 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
-4% At least one kind of oxides of copper, vanadium, iron, nickel, manganese, and cobalt: 0.1-5% of a glass composition powder for low-temperature firing substrate is molded, and Ag, Ag are formed on the powder. -The wiring is formed by forming a wiring with a conductor paste containing Pd or Au as a main component, and then firing in air, and the bending strength is 23 kgf / mm 2 or more, and
A low-temperature fired substrate characterized by being white or colored .
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％モリブデン、タングステン、鉄、ニッケル、マン
ガン、コバルトの酸化物の内少なくとも１種：０.１〜
５％からなる低温焼成基板用ガラス組成物の粉末を成形
し、その上にＣｕを主成分とする導体ペーストで配線を
形成した後、水素を含む還元性雰囲気中で焼成して作製
され、抗折強度が２３ｋｇｆ／ｍｍ 2 以上であり、かつ
白色又は着色されてな ることを特徴とする低温焼成基
板。7. A glass which is obtained by precipitating mullite as a main crystal phase and at least one of forsterite, spinel and sapphirine as a sub-crystal phase by heat treatment, and is expressed in weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
~ 4% at least one of oxides of molybdenum, tungsten, iron, nickel, manganese, and cobalt: 0.1-
The powder of the low-temperature firing glass composition for substrates consisting of 5% was formed, after forming the wiring conductor paste mainly composed of Cu thereon, fabricated by firing in a reducing atmosphere containing hydrogen, anti Folding strength is 23 kgf / mm 2 or more, and
Temperature fired substrate, wherein the white or colored in such Rukoto.
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％バナジウム、モリブデン、鉄の酸化物の内少なく
とも１種：０.１〜５％からなる低温焼成基板用ガラス
組成物の粉末を成形し、その上にＡｇ、Ａｇ−Ｐｄ、Ａ
ｕ、Ｃｕのいずれかを主成分とする導体ペーストで配線
を形成した後、中性雰囲気中で焼成して作製され、抗折
強度が２３ｋｇｆ／ｍｍ 2 以上であり、かつ白色又は着
色されてなることを特徴とする低温焼成基板。8. A glass which is obtained by precipitating mullite as a main crystalline phase and at least one of forsterite, spinel and sapphirine as a secondary crystalline phase by heat treatment, wherein the oxide is represented by weight%: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
Powder of a glass composition for low temperature firing substrate, which is made of at least one of vanadium, molybdenum, and iron oxides: 0.1 to 5%, and is formed on top of Ag, Ag-Pd, and A.
u, after forming the wiring conductor paste mainly composed of any one of Cu, are produced by sintering in a neutral atmosphere, the flexural
Strength is 23 kgf / mm 2 or more, and white or wear
A low temperature fired substrate characterized by being colored .
とし、フォルステライト、スピネル及びサフィリンの内
少なくとも１種を副結晶相として析出するガラスであっ
て、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなる低温焼成基板用ガラス組成物の粉末１０
０重量部に対し、銅、バナジウム、鉄、ニッケル、マン
ガン、コバルトの酸化物粉末、金属塩化合物粉末、金属
粉末の内少なくとも１種０.１〜５重量部をフィラーと
して添加、混合して成形し、その上にＡｇ、Ａｇ−Ｐ
ｄ、Ａｕのいずれかを主成分とする導体ペーストで配線
を形成した後、大気中で焼成して作製され、抗折強度が
２３ｋｇｆ／ｍｍ 2 以上であり、かつ白色又は着色され
てなることを特徴とする低温焼成基板。9. A glass in which mullite is a main crystalline phase and at least one of forsterite, spinel and sapphirine is precipitated as a secondary crystalline phase by heat treatment, and the glass is represented by weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
Powder of glass composition for low temperature firing substrate consisting of ˜4% 10
0.1 to 5 parts by weight of at least one of copper, vanadium, iron, nickel, manganese, cobalt oxide powder, metal salt compound powder, and metal powder is added as a filler to 0 parts by weight, and mixed to form And Ag, Ag-P on it
d, after forming the wiring conductor paste mainly composed of any one of Au, it is prepared by sintering in air, flexural strength
23 kgf / mm 2 or more, and white or colored
A low temperature fired substrate characterized by the following .
相とし、フォルステライト、スピネル及びサフィリンの
内少なくとも１種を副結晶相として析出するガラスであ
って、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなる低温焼成基板用ガラス組成物の粉末１０
０重量部に対し、モリブデン、タングステン、鉄、ニッ
ケル、マンガン、コバルトの酸化物粉末、金属塩化合物
粉末、金属粉末の内少なくとも１種０.１〜５重量部を
フィラーとして添加、混合して成形し、その上にＣｕを
主成分とする導体ペーストで配線を形成した後、水素を
含む還元性雰囲気中で焼成して作製され、抗折強度が２
３ｋｇｆ／ｍｍ 2 以上であり、かつ白色又は着色されて
なることを特徴とする低温焼成基板。10. A glass in which mullite is a main crystalline phase and at least one of forsterite, spinel and sapphirine is precipitated as a secondary crystalline phase by heat treatment, and the glass is represented by weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
Powder of glass composition for low temperature firing substrate consisting of ˜4% 10
0.1 to 5 parts by weight of at least one kind of oxide powder of molybdenum, tungsten, iron, nickel, manganese, and cobalt, metal salt compound powder, and metal powder is added to 0 parts by weight as a filler, and molded. and, after forming the wiring conductor paste mainly composed of Cu thereon, fabricated by firing in a reducing atmosphere containing hydrogen, flexural strength 2
3 kgf / mm 2 or more, and white or colored
A low temperature fired substrate.
相とし、フォルステライト、スピネル及びサフィリンの
内少なくとも１種を副結晶相として析出するガラスであ
って、酸化物の重量％表示で： Ａｌ2Ｏ3：４５〜５８％ ＳｉＯ2 ：２０〜３５％ Ｂ2Ｏ3 ： ５〜１５％ ＭｇＯ ： ５〜２０％ Ｌｉ2Ｏ ： ０〜 ２％ Ｎａ2Ｏ ： ０〜 ２％ Ｋ2Ｏ ： ０〜 ２％ 但し、Ｌｉ2Ｏ＋Ｎａ2Ｏ＋Ｋ2Ｏの少なくとも２種：１
〜４％からなる低温焼成基板用ガラス組成物の粉末１０
０重量部に対し、バナジウム、モリブデン、鉄の酸化物
粉末、金属塩化合物粉末、金属粉末の内の少なくとも１
種：０.１〜５重量部をフィラーとして添加、混合して
成形し、その上にＡｇ、Ａｇ−Ｐｄ、Ａｕ、Ｃｕのいず
れかを主成分とする導体ペーストで配線を形成した後、
中性雰囲気中で焼成して作製され、抗折強度が２３ｋｇ
ｆ／ｍｍ 2 以上であり、かつ白色又は着色されてなるこ
とを特徴とする低温焼成基板。11. A glass which, when heat-treated, precipitates mullite as a main crystalline phase and at least one of forsterite, spinel and sapphirine as a secondary crystalline phase, and is represented by weight% of oxide: Al 2 O. 3 : 45 to 58% SiO 2 : 20 to 35% B 2 O 3 : 5 to 15% MgO: 5 to 20% Li 2 O: 0 to 2% Na 2 O: 0 to 2% K 2 O: 0 2% However, at least two kinds of Li 2 O + Na 2 O + K 2 O: 1
Powder of glass composition for low temperature firing substrate consisting of ˜4% 10
At least 1 of vanadium, molybdenum, iron oxide powder, metal salt compound powder, and metal powder to 0 parts by weight.
Species: 0.1 to 5 parts by weight as a filler is added, mixed and molded, and after forming wiring with a conductor paste containing Ag, Ag-Pd, Au, or Cu as a main component,
It is manufactured by firing in a neutral atmosphere and has a bending strength of 23 kg.
f / mm 2 or more, and white or colored
And a low temperature fired substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23543793A JP3375181B2 (en) | 1992-11-21 | 1993-08-26 | Glass composition for low-temperature fired substrate and low-temperature fired substrate obtained therefrom |
| US08/156,059 US5468694A (en) | 1992-11-21 | 1993-11-22 | Composition for producing low temperature co-fired substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33555492 | 1992-11-21 | ||
| JP4-335554 | 1992-11-21 | ||
| JP23543793A JP3375181B2 (en) | 1992-11-21 | 1993-08-26 | Glass composition for low-temperature fired substrate and low-temperature fired substrate obtained therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06206736A JPH06206736A (en) | 1994-07-26 |
| JP3375181B2 true JP3375181B2 (en) | 2003-02-10 |
Family
ID=26532125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23543793A Expired - Fee Related JP3375181B2 (en) | 1992-11-21 | 1993-08-26 | Glass composition for low-temperature fired substrate and low-temperature fired substrate obtained therefrom |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3375181B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR0211580A (en) * | 2001-08-02 | 2004-07-13 | 3M Innovative Properties Co | Methods for the manufacture of amorphous material, ceramics comprising glass, an article comprising glass, glass ceramics, a glass ceramic article and abrasive particles |
| US7368408B2 (en) | 2004-03-01 | 2008-05-06 | Murata Manufacturing Co., Ltd. | Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component |
| US7439202B2 (en) | 2004-03-01 | 2008-10-21 | Murata Manufacturing Co., Ltd. | Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component |
| CN1826299B (en) | 2004-03-01 | 2010-06-16 | 株式会社村田制作所 | Insulating ceramic composition, insulating ceramic sintered body, and multilayer ceramic electronic component |
| US7417001B2 (en) | 2004-03-01 | 2008-08-26 | Murata Manufacturing Co., Ltd | Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component |
| WO2013179330A1 (en) * | 2012-05-28 | 2013-12-05 | ニチアス株式会社 | Si-Mg-BASED INORGANIC FIBER AND COMPOSITION CONTAINING SAME |
| JP5977088B2 (en) * | 2012-06-01 | 2016-08-24 | 日本山村硝子株式会社 | Lead-free glass ceramic composition for low-temperature fired substrates |
| JP2014008432A (en) * | 2012-06-28 | 2014-01-20 | Ngk Spark Plug Co Ltd | Ceramic porous membrane, and ceramic filter and manufacturing method thereof |
| KR102639865B1 (en) * | 2017-12-15 | 2024-02-22 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
| JP7323879B2 (en) * | 2020-09-14 | 2023-08-09 | 岡本硝子株式会社 | Low-temperature co-fired substrate composition |
-
1993
- 1993-08-26 JP JP23543793A patent/JP3375181B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| 作花済夫、外２名，ガラスハンドブック，株式会社朝倉書店，１９７５年 ９月３０日，ｐ７１８、７２８、７４０、７６５、８５５ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06206736A (en) | 1994-07-26 |
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