JP3372240B2 - Contact structure of contact to spherical bump - Google Patents
Contact structure of contact to spherical bumpInfo
- Publication number
- JP3372240B2 JP3372240B2 JP2000171057A JP2000171057A JP3372240B2 JP 3372240 B2 JP3372240 B2 JP 3372240B2 JP 2000171057 A JP2000171057 A JP 2000171057A JP 2000171057 A JP2000171057 A JP 2000171057A JP 3372240 B2 JP3372240 B2 JP 3372240B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- protrusions
- spherical
- bump
- spherical bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【発明の属する技術分野】本発明はＢＧＡ形ＩＣパッケ
ージ等の外部接点を形成する球面形バンプに対するコン
タクトの接触構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact structure for a spherical bump forming an external contact of a BGA type IC package or the like.
【０００２】[0002]
【従来の技術】特許第２６２０５２５号公報（特開平８
−７８１２３号公報）は球面形バンプに対するコンタク
トの接触構造を示しており、この接触構造は球面形バン
プの対向する両側面に加圧接触する一対の接触片を有
し、両接触片の接触部に突起を形成し、この突起を球面
形バンプの表面に喰い込ませるようにしている。2. Description of the Related Art Japanese Patent No. 2620525
-78123) shows a contact structure of a contact with a spherical bump, and this contact structure has a pair of contact pieces which are in pressure contact with opposite side surfaces of the spherical bump. A protrusion is formed on the surface of the spherical bump so that the protrusion can be embedded in the surface of the spherical bump.
【０００３】[0003]
【発明が解決しようとする課題】上記先行例は球面形バ
ンプの両側面に突起を喰い込ませる接触構造によって、
接触の信頼性を大巾に向上せしめ、又球面形バンプの表
面実装される下死点部を損傷しない利点を有している。SUMMARY OF THE INVENTION The above-mentioned prior art example uses a contact structure in which protrusions are inserted into both side surfaces of a spherical bump,
It has the advantages of greatly improving the contact reliability and not damaging the bottom dead center portion of the surface mount of the spherical bump.
【０００４】本発明は上記先行例の利点を享受しつつ、
第１接触片の突起と第２接触片の突起が球面形バンプの
一側面と他側面に安定的に且つ健全に加圧接触せしめる
機能を付与し、高信頼の接触を確保する球面形バンプと
コンタクトの接触構造を提供するものである。The present invention enjoys the advantages of the above prior art,
A spherical bump that ensures a reliable contact by providing the projection of the first contact piece and the projection of the second contact piece with a function of stably and soundly pressingly contacting one side surface and the other side surface of the spherical bump. A contact structure for contacts is provided.
【０００５】[0005]
【課題を解決するための手段】本発明は上記課題に応え
る手段として、上記第１接触片には球面形バンプの直径
線の一端を通る経線の両側方において同バンプの一側面
に加圧接触する第１，第２突起を離間して配置すると共
に、上記第２接触片には球面形バンプの上記直径線の他
端を通る経線の両側方において同バンプの他側面に加圧
接触する第３，第４突起を離間して配置した。Means for Solving the Problems As a means for solving the above problems, the present invention provides a pressure contact with one side surface of the first contact piece on both sides of a meridian passing through one end of a diameter line of the spherical bump. The first and second protrusions are spaced from each other, and the second contact piece is in pressure contact with the other side surface of the bump on both sides of the meridian passing through the other end of the diameter line of the spherical bump. The third and fourth protrusions are arranged separately.
【０００６】上記各接触構造により、球面形バンプとコ
ンタクトとは、球面形バンプの相対する側面において四
点接触し、これにより球面形バンプに対する各突起の相
対位置を確保して安定且つ健全なる加圧接触を確保でき
る。With the above contact structures, the spherical bumps and the contacts make four-point contact on the opposite side surfaces of the spherical bumps, whereby the relative position of each projection with respect to the spherical bumps is secured and stable and sound processing is achieved. Pressure contact can be secured.
【０００７】上記第１，第２，第３，第４突起は球面形
バンプの上下方向へ延在する突条によって形成し、大径
の球面形バンプと小径の球面形バンプの何れに対しても
突条の延在線上において適正なる接触が得られるように
した。The first, second, third, and fourth projections are formed by protrusions extending in the vertical direction of the spherical bumps, and are used for both large-diameter spherical bumps and small-diameter spherical bumps. Also, proper contact was obtained on the extension line of the ridge.
【０００８】又第１接触片及び第２接触片に離間して配
置した突起を設けているが、好ましくはこの離間配置し
た突起を上記のように上下方向に延在せる突条にて形成
しつつ、両突条には下方へ向け拡開せる傾斜角度を具有
せしめて、径の異なる球面形バンプの両側面にその径に
応じた適正な位置において適正なる加圧力を以って接触
できるようにした。Further, the first contact piece and the second contact piece are provided with the protrusions which are arranged apart from each other, but preferably, the protrusions which are arranged apart from each other are formed by the protrusions extending in the vertical direction as described above. At the same time, both ridges are provided with an inclination angle that can be expanded downward so that both side surfaces of spherical bumps with different diameters can be contacted with appropriate pressure at appropriate positions according to the diameters. I chose
【０００９】又上記第１接触片の第１，第２突起間又は
／及び上記第２接触片の第３，第４突起間には、球面形
バンプに対する第１，第２突起の喰い込み量を設定する
受圧面を形成する。Further, between the first and second projections of the first contact piece or / and between the third and fourth projections of the second contact piece, the amount of engagement of the first and second projections with respect to the spherical bump. To form a pressure receiving surface.
【００１０】又は上記第１接触片の第１，第２突起間又
は／及び上記第２接触片の第３，第４突起間には、球面
形バンプの球面を逃がす逃げ溝を形成する。Alternatively, an escape groove for escaping the spherical surface of the spherical bump is formed between the first and second protrusions of the first contact piece and / or between the third and fourth protrusions of the second contact piece.
【００１１】上記受圧面又は逃げ溝は該受圧面と逃げ溝
の両側に離間配置した両突起の最大喰い込み量を均一に
設定する。The pressure receiving surface or the relief groove uniformly sets the maximum amount of protrusion of both projections arranged on both sides of the pressure receiving surface and the relief groove.
【００１２】又上記突起による四点接触によって、第
１，第２接触片による接触の信頼性を著しく向上でき
る。Further, the four-point contact by the protrusions can remarkably improve the reliability of contact by the first and second contact pieces.
【００１３】[0013]
【発明の実施の形態】図１Ａ，Ｂ，Ｃに示すように、Ｂ
ＧＡ形ＩＣパッケージは、ＩＣパッケージ本体１の下面
に多数の球面形バンプ２を有している。この球面形バン
プ２は図１Ａに示すように、半球形か、図１Ｂに示すよ
うに略球形を呈し、何れも半田材等の低融点金属で形成
され、該球面形バンプの下死点部を配線基板上の配線パ
ターンに融着し、ソケットを介さずにＢＧＡ形ＩＣパッ
ケージを配線基板上へ直接実装する場合が多い。BEST MODE FOR CARRYING OUT THE INVENTION As shown in FIGS.
The GA type IC package has a large number of spherical bumps 2 on the lower surface of the IC package body 1. The spherical bump 2 has a hemispherical shape as shown in FIG. 1A or a substantially spherical shape as shown in FIG. 1B, both of which are made of a low melting point metal such as a solder material. Is often fused to the wiring pattern on the wiring board and the BGA type IC package is directly mounted on the wiring board without using a socket.
【００１４】従ってこのようなＢＧＡ形ＩＣパッケージ
のテスト用ソケットにおいては、上記球面形バンプの下
死点部を損傷せずにテスト用ソケットのコンタクトと球
面形バンプの加圧接触が行なえる接触構造であることが
望まれる。Therefore, in such a test socket for the BGA type IC package, the contact structure is such that the contact of the test socket and the spherical bump can be pressure-contacted without damaging the bottom dead center of the spherical bump. Is desired.
【００１５】このため本発明においては前記先行例と同
様、球面形バンプの対向する左右側面に一対の接触片を
加圧接触せしめることを基本構造として有している。そ
して球面形バンプの対向する両側面に対し、突起による
四点接触構造を形成する。以下その図２乃至図１１に基
づきその実施形態例について詳述する。For this reason, the present invention has a basic structure in which a pair of contact pieces are brought into pressure contact with the opposing left and right side surfaces of the spherical bump, as in the preceding example. Then, a four-point contact structure with protrusions is formed on both opposite sides of the spherical bump. The embodiment will be described in detail below with reference to FIGS. 2 to 11.
【００１６】２はＢＧＡ形ＩＣパッケージ等の電子部品
の外部接点である球面形バンプであり、この球面形バン
プ２の対向する側面にコンタクト３が具有せる弾性を有
する第１，第２接触片４，５を加圧接触せしめる。Reference numeral 2 denotes a spherical bump which is an external contact of an electronic component such as a BGA type IC package. The first and second contact pieces 4 having elasticity that the contact 3 has on the opposite side surfaces of the spherical bump 2. , 5 are brought into pressure contact with each other.
【００１７】図４乃至図６等に示すように、上記第１接
触片４は球面形バンプ２の横直径線Ｒ１の一端を通る経
線Ａ１の両側方において同バンプの一側面に加圧接触す
る離間して配置された第１，第２突起１１，１２を有
し、上記第２接触片５は球面形バンプ２の上記直径線Ｒ
１の他端を通る経線Ａ２の両側方において同バンプの他
側面に加圧接触する離間して配置された第３突起１３と
第４突起１４を有する。As shown in FIGS. 4 to 6, the first contact piece 4 comes into pressure contact with one side surface of the spherical bump 2 on both sides of a meridian A1 passing through one end of the lateral diameter line R1 of the bump. The second contact piece 5 has first and second protrusions 11 and 12 which are spaced apart from each other, and the second contact piece 5 has the diameter line R of the spherical bump 2.
On both sides of the meridian A2 passing through the other end of the first bump 1, there are third protrusions 13 and fourth protrusions 14 which are spaced apart and are in pressure contact with the other side surface of the bump.
【００１８】上記コンタクト３の第１接触片４と第２接
触片５は上下方向に延在し且つ左右に対向して配置され
ており、この第１，第２接触片４，５の下端は互いに連
結され、この連結部９から下方へ延ばされた配線回路基
板に接続するための雄端子１０を有する。第１，第２接
触片４，５と雄端子１０とは金属板から一体に打抜き形
成される。The first contact piece 4 and the second contact piece 5 of the contact 3 extend in the up-down direction and are arranged so as to oppose each other on the left and right. The lower ends of the first and second contact pieces 4, 5 are It has male terminals 10 connected to each other and connected to a printed circuit board extending downward from this connecting portion 9. The first and second contact pieces 4, 5 and the male terminal 10 are integrally punched and formed from a metal plate.
【００１９】上記第１，第２接触片４，５は開閉弾性を
有し、弾性に抗して外側へ拡開可能であり、又弾性に従
い内側方ヘ復元可能である。この復元力によって球面形
バンプ２の左右側面へ突起１１，１２，１３，１４を加
圧接触せしめる。上記第１，第２接触片４，５は下端連
結部９から上方へ向け対向して延ばされ、その上端（自
由端）の内側面、即ち第１，第２接触片４，５の自由端
部内側面に前記突起１１，１２，１３，１４を形成して
いる。The first and second contact pieces 4 and 5 have opening and closing elasticity, can be expanded outwardly against the elasticity, and can be restored to the inner side according to the elasticity. Due to this restoring force, the projections 11, 12, 13, 14 are brought into pressure contact with the left and right side surfaces of the spherical bump 2. The first and second contact pieces 4, 5 extend upward from the lower end connecting portion 9 so as to face each other, and the inner surface of the upper end (free end) of the first, second contact pieces 4, 5 is free. The protrusions 11, 12, 13, 14 are formed on the inner surface of the end portion.
【００２０】好ましくはこの突起１１，１２，１３，１
４は球面形バンプ２の上下方向へ延在する突条によって
形成する。上記第１，第２，第３，第４突起１１，１
２，１３，１４を形成する突条は第１接触片４の上端縁
から第１，第２接触片４，５の下端連結部９へ向って延
在する。Preferably, the protrusions 11, 12, 13, 1
4 is formed by a ridge extending in the vertical direction of the spherical bump 2. The first, second, third and fourth protrusions 11, 1
The ridges forming 2, 13, 14 extend from the upper edge of the first contact piece 4 toward the lower end connecting portion 9 of the first and second contact pieces 4, 5.
【００２１】図５Ａ，Ｂに示すように、上記突起１１，
１２，１３，１４を形成する突条は球面形バンプ２の左
右側面に対し、その延在方向の途中において加圧接触す
るが、図５Ａ，図６Ａに示す小径の球面形バンプ２ａ
と、図５Ｂ，図６Ｂに示す大径の球面形バンプ２ｂに対
しては夫々加圧接触位置が異なる。As shown in FIGS. 5A and 5B, the protrusions 11,
The ridges forming 12, 13, and 14 are in pressure contact with the left and right side surfaces of the spherical bump 2 in the middle of the extending direction thereof, but the small-diameter spherical bump 2a shown in FIGS. 5A and 6A is used.
With respect to the large-diameter spherical bumps 2b shown in FIGS. 5B and 6B, the pressure contact positions are different.
【００２２】詳述すると、第１，第２接触片４，５の突
起１１，１２，１３，１４を形成する突条は、図５Ａ，
図６Ａに示す小径の球面形バンプ２ａに対しては、突条
の先端側で同バンプ２ａの左右側面に加圧接触し、図５
Ｂ，図６Ｂに示す大径の球面形バンプ２ｂに対しては、
小径の球面形バンプより下位において加圧接触し、小径
の球面形バンプ２ａと大径の球面形バンプ２ｂの何れに
対しても適正な加圧接触が期待できる。More specifically, the ridges forming the protrusions 11, 12, 13, 14 of the first and second contact pieces 4, 5 are as shown in FIG.
With respect to the small-diameter spherical bump 2a shown in FIG. 6A, the left and right side surfaces of the bump 2a are pressed and contacted on the tip side of the ridge.
B, for the large diameter spherical bump 2b shown in FIG. 6B,
Pressure contact is made below the small-diameter spherical bumps, and proper pressure contact can be expected for both the small-diameter spherical bumps 2a and the large-diameter spherical bumps 2b.
【００２３】最も理想的な例として、上記第１接触片４
の第１，第２突起１１，１２は球面形バンプ２の横直径
線Ｒ１の一端を通る左半球上の経線Ａ１上の側方に略対
称に加圧接触せしめると共に、第２接触片５の突起１
３，１４は上記横直径線Ｒ１の他端を通る右半球上の経
線Ａ２の両側方に略対称に配置して球面形バンプ２に加
圧接触せしめる。即ち第１，第２突起１１，１２と第
２，第３突起１３，１４とは平面視した時に略正四辺形
の各頂点を形成する位置に配すると共に球面形バンプ２
の略同一緯線Ｂ上において加圧接触するように配する。As the most ideal example, the first contact piece 4
The first and second projections 11 and 12 of the second contact piece 5 are pressed substantially symmetrically and laterally on the meridian A1 on the left hemisphere passing through one end of the lateral diameter line R1 of the spherical bump 2. Protrusion 1
3 and 14 are arranged substantially symmetrically on both sides of a meridian A2 on the right hemisphere passing through the other end of the lateral diameter line R1 and are brought into pressure contact with the spherical bump 2. That is, the first and second protrusions 11 and 12 and the second and third protrusions 13 and 14 are arranged at positions that form the vertices of a substantially regular quadrangle when viewed in plan, and the spherical bump 2
Are arranged so as to come into pressure contact with each other on substantially the same latitude line B.
【００２４】上記第１，第２突起１１，１２、即ちその
例示である突条は第１接触片４の上下方向の中心線に対
し略対称に配し、同様に第２，第３突起１３，１４、即
ちその例示である突条は第２接触片５の上下方向の中心
線に対し略左右対称に並置する。The first and second protrusions 11 and 12, that is, the ridges as an example thereof, are arranged substantially symmetrically with respect to the vertical center line of the first contact piece 4, and similarly the second and third protrusions 13 are arranged. , 14, that is, the ridges as an example thereof, are juxtaposed substantially symmetrically with respect to the vertical center line of the second contact piece 5.
【００２５】上記第１接触片４は突起１１，１２たる一
対の突条の間に、突起１１，１２の球面形バンプ２に対
する喰い込み量を設定する受圧面１６を形成している。The first contact piece 4 has a pressure receiving surface 16 between a pair of protrusions 11 and 12 for setting the amount of the protrusion 11 and 12 to bite into the spherical bump 2.
【００２６】同様に、第２接触片５は離間して配した突
起１３，１４の間、即ち一対の突条間に受圧面１７を形
成している。球面形バンプ２がバーンインテストにより
軟化した時に、上記突起１１，１２，１３，１４は第
１，第２接触片４，５の弾力により、球面形バンプ２の
表面に喰い込む。この時上記受圧面１６，１７は球面形
バンプ２の球面を受け止め、突起１１，１２，１３，１
４の最大喰い込み量を設定する手段となる。Similarly, the second contact piece 5 has a pressure receiving surface 17 formed between the protrusions 13 and 14 arranged apart from each other, that is, between a pair of protrusions. When the spherical bump 2 is softened by the burn-in test, the protrusions 11, 12, 13, 14 bit into the surface of the spherical bump 2 by the elasticity of the first and second contact pieces 4, 5. At this time, the pressure receiving surfaces 16 and 17 receive the spherical surfaces of the spherical bumps 2, and the projections 11, 12, 13, 1
It is a means to set the maximum bite amount of 4.
【００２７】上記突起１１，１２，１３，１４は点状突
起にするか、上記突条にて形成し、一例として何れの場
合も球面形バンプ２の同一緯線Ｂ上において加圧接触す
るように配置する。The protrusions 11, 12, 13 and 14 may be point protrusions or may be formed by the protrusions. As an example, in any case, the spherical bumps 2 are brought into pressure contact on the same latitude line B. Deploy.
【００２８】図７に示すように、上記第１接触片４に形
成せる突起１１，１２たる一対の突条と、上記第２接触
片５に形成せる突起１３，１４たる一対の突条とは上下
方向に延在し且つ左右方向に略等間隔を以って並設す
る。As shown in FIG. 7, the pair of protrusions 11 and 12 formed on the first contact piece 4 and the pair of protrusions 13 and 14 formed on the second contact piece 5 are formed. They extend in the up-down direction and are arranged side by side in the left-right direction at substantially equal intervals.
【００２９】又は図６Ａ２，Ｂ２に示すように、上記第
１接触片４の第１，第２突起１１，１２を形成する両突
条は下方へ向け拡開せる傾斜角度を以って延在せしめ
る。同様に第２接触片５の第３，第４突起を形成する両
突条も下方へ向け拡開せる傾斜角度を以って延在せしめ
る。Alternatively, as shown in FIGS. 6A2 and 6B, both ridges forming the first and second protrusions 11 and 12 of the first contact piece 4 extend with an inclination angle so that they can be expanded downward. Excuse me. Similarly, both ridges forming the third and fourth protrusions of the second contact piece 5 are also extended with an inclination angle so that they can be expanded downward.
【００３０】上記第１，第２突起１１，１２を形成する
両突条と、第３，第４突起１３，１４を形成する両突条
を上記傾斜角度を以って設けることにより、図１１，図
１２Ａ，Ｂ，Ｃに示すように小径の球面形バンプ２ａと
大径の球面形バンプ２ｂに対する上記各対の突条の接触
位置は自動的に変更される。By providing both ridges forming the first and second protrusions 11 and 12 and both ridges forming the third and fourth protrusions 13 and 14 with the above-mentioned inclination angle, As shown in FIGS. 12A, 12B and 12C, the contact positions of the above-mentioned pairs of protrusions on the small-diameter spherical bump 2a and the large-diameter spherical bump 2b are automatically changed.
【００３１】即ち、図６Ａ１，Ａ２，Ｃに示すように、
各対の突条は小径の球面形バンプ２ａに対しては接触点
Ｐ１，Ｐ２とＰ３，Ｐ４を以って接触し、接触点Ｐ１と
Ｐ２の間隔ｔ１と同Ｐ３とＰ４の間隔ｔ１は小であり、
他方各対の突条の大径の球面形バンプ２ｂに対しては接
触点Ｐ１，Ｐ２とＰ３，Ｐ４を以って接触し、接触点Ｐ
１，Ｐ２間と、Ｐ３，Ｐ４間の間隔ｔ２は大となる。That is, as shown in FIGS. 6A1, A2 and C,
The ridges of each pair contact the small-diameter spherical bump 2a at contact points P1, P2, P3, and P4, and the distance t1 between the contact points P1 and P2 and the distance t1 between P3 and P4 are small. And
On the other hand, the large-diameter spherical bumps 2b of each pair of protrusions are contacted at contact points P1, P2 and P3, P4.
The interval t2 between P1 and P2 and between P3 and P4 is large.
【００３２】小径の球面形バンプ２ａに対しては第１，
第２接触片４，５による突起１１，１２，１３，１４の
加圧接触力は小であり、第１，第２接触片４，５の各二
つの突起１１，１２間と１３，１４間が近接していても
球面形バンプ２ａの局部に対するダメージは少ない。For the small-diameter spherical bump 2a, the first
The pressure contact force of the projections 11, 12, 13, 14 by the second contact pieces 4, 5 is small, and between the two projections 11, 12 of each of the first and second contact pieces 4, 5 and between 13, 14, respectively. However, the damage to the local parts of the spherical bumps 2a is small even if they are close to each other.
【００３３】他方図６Ｂ１，Ｂ２，Ｃに示すように、大
径の球面形バンプ２ｂに対しては第１，第２接触片４，
５の突起１１，１２，１３，１４の加圧接触力が加乗的
に大になる。従って第１，第２接触片４，５の各二つの
突起、１１，１２と１３，１４、即ち各二つの突条が小
径の球面形バンプ２ａと同じ間隔で大径の球面形バンプ
２ｂに加圧接触すると、バンプ局部に対するダメージが
過大となり、球面形バンプの過度の変形を招来し、表面
実装に支障を来す。On the other hand, as shown in FIGS. 6B1, B2, and C, the first and second contact pieces 4 are attached to the large-diameter spherical bump 2b.
The pressing contact force of the protrusions 11, 12, 13, 14 of 5 becomes large as a force. Therefore, each of the two protrusions 11, 12 and 13, 14 of the first and second contact pieces 4, 5 is formed into a large-diameter spherical bump 2b at the same intervals as the small-diameter spherical bump 2a. The pressure contact causes excessive damage to the local parts of the bumps, causes excessive deformation of the spherical bumps, and interferes with surface mounting.
【００３４】この問題は上記のように第１接触片４の両
突起１１，１２の間隔と、第２接触片５の両突起１３，
１４の間隔、即ち各対の突条間の間隔を下方へ向け漸次
拡大することによって有効に解消できる。即ち、大径の
球面形バンプ２ｂに対する両突起１１，１２間と１３，
１４間の接触間隔ｔ２を小径の球面形バンプ２ａに対す
る場合よりも拡大することによって大径の球面形バンプ
２ｂの局部に対するダメージをより少なくすることがで
きる。This problem is caused by the distance between the protrusions 11 and 12 of the first contact piece 4 and the protrusions 13 and 12 of the second contact piece 5 as described above.
This can be effectively eliminated by gradually increasing the 14 intervals, that is, the interval between each pair of ridges downward. That is, between the large-diameter spherical bumps 2b, between the protrusions 11 and 12, and 13,
By making the contact distance t2 between 14 larger than that for the small diameter spherical bump 2a, it is possible to further reduce the damage to the local portion of the large diameter spherical bump 2b.
【００３５】図８乃至図１１に示すように、前記受圧面
１６，１７に代えて、上記第１接触片４の第１，第２突
起１１，１２たる一対の突条間、並びに第２接触片５の
第３，第４突起１３，１４たる一対の突条間に球面形バ
ンプ２の球面を逃す逃げ溝１５を形成することができ
る。As shown in FIGS. 8 to 11, instead of the pressure receiving surfaces 16 and 17, between the pair of ridges which are the first and second protrusions 11 and 12 of the first contact piece 4 and the second contact. An escape groove 15 for escaping the spherical surface of the spherical bump 2 can be formed between a pair of protrusions, which are the third and fourth protrusions 13 and 14 of the piece 5.
【００３６】この逃げ溝１５は両突条間に沿って延びそ
の上端は第１，第２接触片４，５の先端において開放し
ている。上記各突条はこの逃げ溝の上下方向の開口縁か
ら内方へ突出する。上記逃げ溝１５は第１，第２接触片
４，５の双方又は一方に設けるか、一方には前記受圧面
１６又は１７を設けることができる。The escape groove 15 extends along both the protrusions, and its upper end is open at the tips of the first and second contact pieces 4, 5. Each of the protrusions projects inward from the opening edge of the escape groove in the vertical direction. The relief groove 15 may be provided on both or one of the first and second contact pieces 4, 5, or on one side thereof, the pressure receiving surface 16 or 17 may be provided.
【００３７】球面形バンブ２がバーンインテストにより
軟化した時に、突起１１，１２，１３，１４は球面形バ
ンプ２の表面に喰い込み、この時上記逃げ溝１５はバン
プ球面を逃がして上記喰込みを適正に行なわせる。When the spherical bump 2 is softened by the burn-in test, the projections 11, 12, 13, 14 bite into the surface of the spherical bump 2, and at this time, the relief groove 15 escapes the spherical surface of the bump so that the biting occurs. Let them do it properly.
【００３８】[0038]
【発明の効果】上記接触構造により、球面形バンプとコ
ンタクトとは、球面形バンプの相対する側面において四
点接触し、これにより球面形バンプに対する各突起の相
対位置を確保して安定且つ健全なる加圧接触を確保でき
る。With the above contact structure, the spherical bumps and the contacts make four-point contact on the opposite side surfaces of the spherical bumps, whereby the relative positions of the respective projections with respect to the spherical bumps are secured and stable and sound. Pressure contact can be secured.
【００３９】上記第１，第２，第３，第４突起を球面形
バンプの上下方向へ延在する突条によって形成すること
により、大径の球面形バンプと小径の球面形バンプの何
れに対しても突条の延在線上において適正なる接触が得
られる。By forming the first, second, third and fourth protrusions by the protrusions extending in the vertical direction of the spherical bump, it is possible to form a large diameter spherical bump or a small diameter spherical bump. On the contrary, proper contact can be obtained on the extension line of the ridge.
【００４０】又上記突起を上記のように上下方向に延在
せる突条にて形成しつつ、両突条には下方へ向け拡開せ
る傾斜角度を具有せしめることにより、径の異なる球面
形バンプの両側面にその径に応じた適正な位置において
適正なる加圧力を以って接触できる。Further, while the projections are formed by the projections extending in the vertical direction as described above, both projections are provided with an inclination angle capable of expanding downward, so that spherical bumps having different diameters can be obtained. Both side surfaces can be contacted with appropriate pressure at appropriate positions according to their diameters.
【００４１】又上記突起による四点接触によって、第
１，第２接触片による接触の信頼性を著しく向上でき
る。Further, the four-point contact by the protrusions can remarkably improve the reliability of contact by the first and second contact pieces.
【図面の簡単な説明】[Brief description of drawings]
【図１】Ａ，ＢはＢＧＡ形ＩＣパッケージの各例を示す
側面図、Ｃは同底面図。1A and 1B are side views showing examples of BGA type IC packages, and C is a bottom view thereof.
【図２】本発明の四点接触構造例を示すコンタクトの要
部斜視図。FIG. 2 is a perspective view of essential parts of a contact showing an example of a four-point contact structure of the present invention.
【図３】同コンタクト平面図。FIG. 3 is a plan view of the contact.
【図４】上記コンタクトの球面形バンプに対する加圧接
触状態を示す横断面図。FIG. 4 is a cross-sectional view showing a pressure contact state of the contact with the spherical bump.
【図５】Ａは小径の球面形バンプに対するコンタクトの
加圧接触状態を示す側面図、Ｂは大径の球面形バンプに
対する同加圧接触状態を示す側面図。5A is a side view showing a pressure contact state of a contact with a small diameter spherical bump, and FIG. 5B is a side view showing the same pressure contact state with a large diameter spherical bump.
【図６】Ａ１は小径の球面形バンプに対するコンタクト
の加圧接触状態を示す横断面図、Ａ２は同正面図、Ｂ１
は大径の球面形バンプに対するコンタクトの加圧接触状
態を示横断面図、Ｂ２は同正面図、Ｃは同コンタクトの
小径と大径の球面形バンプに対する接触点を説明する平
面図。FIG. 6 is a transverse sectional view showing a contact state of a contact with a small-diameter spherical bump, and A2 is a front view thereof;
Is a cross-sectional view showing a contact state of a contact with a large-diameter spherical bump, B2 is a front view of the same, and C is a plan view illustrating contact points of the contact with a small-diameter spherical bump and a large-diameter spherical bump.
【図７】上記コンタクトにおける突起を平行に設けた例
を示す要部背面図。FIG. 7 is a rear view of an essential part showing an example in which protrusions of the contact are provided in parallel.
【図８】上記四点接触構造例の変形例を示すコンタクト
の要部斜視図。FIG. 8 is a perspective view of a main part of a contact showing a modified example of the four-point contact structure example.
【図９】上記コンタクトの球面形バンプに対する加圧接
触状態を示す横断面図。FIG. 9 is a cross-sectional view showing a pressed contact state of the contact with the spherical bump.
【図１０】同縦断面図。FIG. 10 is a longitudinal sectional view of the same.
【図１１】同背面図。FIG. 11 is a rear view of the same.
１ ＢＧＡ形ＩＣパッケージ本体 ２ 球面形バンプ ３ コンタクト ４ 第１接触片 ５ 第２接触片 １１ 第１突起 １２ 第２突起 １３ 第３突起 １４ 第４突起 １５ 逃げ溝 １６，１７ 受圧面 Ｐ１乃至Ｐ４ 接触点 Ｒ１ 横直径線 Ａ１，Ａ２ 経線 Ｂ 緯線 1 BGA type IC package body 2 Spherical bump 3 contacts 4 first contact piece 5 Second contact piece 11 First protrusion 12 Second protrusion 13 Third protrusion 14 Fourth protrusion 15 escape groove 16, 17 Pressure receiving surface P1 to P4 contact points R1 horizontal diameter line A1, A2 meridian B parallel
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平８−78123（ＪＰ，Ａ) 特開 平11−26126（ＪＰ，Ａ) 特開 平７−335350（ＪＰ，Ａ) 特開 平10−189191（ＪＰ，Ａ) 特開 平11−135214（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 13/11 G01R 1/067 G01R 1/073 G01R 31/26 H01R 4/26 ─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-8-78123 (JP, A) JP-A-11-26126 (JP, A) JP-A-7-335350 (JP, A) JP-A-10- 189191 (JP, A) JP-A-11-135214 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01R 13/11 G01R 1/067 G01R 1/073 G01R 31/26 H01R 4/26
Claims (4)
が具有せる第１，第２接触片を加圧接触せしめる球面形
バンプとコンタクトの接触構造において、上記第１接触
片は球面形バンプの直径線の一端を通る経線の両側方に
おいて同バンプの一側面に加圧接触する離間して配置さ
れた第１，第２突起を有し、上記第２接触片は球面形バ
ンプの上記直径線の他端を通る経線の両側方において同
バンプの他側面に加圧接触する離間して配置された第
３，第４突起を有し、上記第１，第２，第３，第４突起
が球面形バンプの上下方向へ延在する突条によって形成
されていることを特徴とする球面形バンプに対するコン
タクトの接触構造。1. A contact structure of a spherical bump and a contact, wherein first and second contact pieces having contacts on opposite side surfaces of the spherical bump are brought into pressure contact with each other, wherein the first contact piece has a diameter of the spherical bump. On both sides of the meridian passing through one end of the wire, there are spaced apart first and second protrusions that come into pressure contact with one side surface of the bump, and the second contact piece is one of the diameter lines of the spherical bump. third, fourth and have a protrusion, the first, second, third, fourth projection sphere in both sides of the meridian passing through the other end positioned apart from that pressure contact with the other side surface of the bump A contact structure for a contact with a spherical bump, which is formed by a protrusion extending in the vertical direction of the bump.
方へ向け拡開せる傾斜角度を有し、同様に上記第３，第
４突起を形成する両突条が下方へ向け拡開せる傾斜角度
を有することを特徴とする請求項１記載の球面形バンプ
に対するコンタクトの接触構造。2. Both projections forming the first and second projections have an inclination angle that allows the projections to expand downward, and similarly both projections forming the third and fourth projections project downward. The contact structure of a contact for a spherical bump according to claim 1 , wherein the contact structure has an inclination angle capable of expanding.
る両突条間又は／及び上記第２接触片の第３，第４突起
を形成する両突条間に、球面形バンプに対する第１，第
２突起を形成する両突条の喰い込み量を設定する受圧面
を有することを特徴とする請求項１又は２記載の球面形
バンプに対するコンタクトの接触構造。3. The first and second protrusions of the first contact piece are formed.
Between the two protrusions or / and the third and fourth protrusions of the second contact piece
Between both ridges forming the first against the spherical bumps, spherical form of claim 1, wherein it has a pressure receiving surface for setting the embedding amount of the two ridges forming the second protrusion Contact structure of contact to bump.
る両突条間又は／及び上記第２接触片の第３，第４突起
を形成する両突条間に、球面形バンプの球面を逃がす逃
げ溝を有することを特徴とする請求項１又は２記載の球
面形バンプに対するコンタクトの接触構造。4. The first and second protrusions of the first contact piece are formed.
Between the two protrusions or / and the third and fourth protrusions of the second contact piece
3. The contact structure for a contact with a spherical bump according to claim 1, further comprising an escape groove for escaping the spherical surface of the spherical bump between both of the protrusions forming the .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000171057A JP3372240B2 (en) | 1998-06-26 | 2000-06-07 | Contact structure of contact to spherical bump |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18108098A JP3128540B2 (en) | 1998-06-26 | 1998-06-26 | Contact structure of contact to spherical bump |
| JP2000171057A JP3372240B2 (en) | 1998-06-26 | 2000-06-07 | Contact structure of contact to spherical bump |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18108098A Division JP3128540B2 (en) | 1998-06-26 | 1998-06-26 | Contact structure of contact to spherical bump |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001043920A JP2001043920A (en) | 2001-02-16 |
| JP3372240B2 true JP3372240B2 (en) | 2003-01-27 |
Family
ID=26500390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000171057A Expired - Lifetime JP3372240B2 (en) | 1998-06-26 | 2000-06-07 | Contact structure of contact to spherical bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3372240B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4041341B2 (en) * | 2002-05-02 | 2008-01-30 | 株式会社エンプラス | Socket for electrical parts |
| JP4532308B2 (en) * | 2005-02-21 | 2010-08-25 | 株式会社アイペックス | Electrical connector connection terminals |
| US9832876B2 (en) * | 2014-12-18 | 2017-11-28 | Intel Corporation | CPU package substrates with removable memory mechanical interfaces |
| JP6497075B2 (en) * | 2015-01-09 | 2019-04-10 | オムロン株式会社 | Electrical equipment system |
| JP6515877B2 (en) | 2016-06-17 | 2019-05-22 | オムロン株式会社 | Probe pin |
-
2000
- 2000-06-07 JP JP2000171057A patent/JP3372240B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001043920A (en) | 2001-02-16 |
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