JP3368814B2 - Thermocompression bonding equipment for electronic components - Google Patents
Thermocompression bonding equipment for electronic componentsInfo
- Publication number
- JP3368814B2 JP3368814B2 JP28643897A JP28643897A JP3368814B2 JP 3368814 B2 JP3368814 B2 JP 3368814B2 JP 28643897 A JP28643897 A JP 28643897A JP 28643897 A JP28643897 A JP 28643897A JP 3368814 B2 JP3368814 B2 JP 3368814B2
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- electronic components
- electronic
- thermocompression
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を基板に
熱圧着する電子部品の熱圧着装置に関するものである。BACKGROUND OF THE INVENTION The present invention relates to electronic components thermocompression bonding equipment of electronic components thermocompression bonding to the substrate.
【０００２】[0002]
【従来の技術】電子部品を基板にボンディングする方法
として熱圧着による方法が知られている。この方法は熱
圧着ツールに電子部品を保持させて基板表面に押圧する
とともに、電子部品をヒータにより加熱して基板に半田
付けや樹脂接着剤などにより接着するものである。ここ
で、良好な熱圧着品質を得るためには、熱圧着過程での
圧着荷重や温度を所定の制御目標値にしたがって制御す
る必要がある。2. Description of the Related Art As a method for bonding an electronic component to a substrate, a method by thermocompression bonding is known. In this method, a thermocompression bonding tool holds an electronic component and presses it against the substrate surface, and the electronic component is heated by a heater and bonded to the substrate by soldering or a resin adhesive. Here, in order to obtain good thermocompression bonding quality, it is necessary to control the pressure bonding load and temperature in the thermocompression bonding process according to a predetermined control target value.
【０００３】ところで、電子部品を熱圧着する場合に、
生産性の向上の目的で複数の異る種類の電子部品を一括
して熱圧着することがある。このような場合でも、従来
は単一の熱圧着ツールによって複数の電子部品を一括圧
着する方法や、複数の電子部品をスプリングを介して押
圧する方法などが用いられていた。By the way, in the case of thermocompression bonding of electronic parts,
For the purpose of improving productivity, a plurality of different types of electronic components may be collectively thermocompression bonded. Even in such a case, conventionally, a method of collectively crimping a plurality of electronic components with a single thermocompression bonding tool, a method of pressing a plurality of electronic components via a spring, and the like have been used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
電子部品の熱圧着装置では、複数の異種の電子部品を一
括して熱圧着する場合に、個々の電子部品に応じて異な
る圧着荷重や加熱温度の設定を行うことができなかっ
た。このため、一括して熱圧着される電子部品の組み合
わせによっては、一部の電子部品が不適切な圧着荷重や
加熱温度で熱圧着され、熱圧着品質の不良を生じること
があるという問題点があった。However, in the conventional thermocompression bonding apparatus for electronic parts, when a plurality of different kinds of electronic parts are collectively thermocompression bonded, different crimping loads and heating temperatures are applied depending on the individual electronic parts. Could not be set. Therefore, depending on the combination of electronic components that are thermocompressed collectively, some electronic components may be thermocompressed with an improper crimping load or heating temperature, resulting in poor thermocompression bonding quality. there were.
【０００５】そこで本発明は、複数の異種の電子部品を
一括して熱圧着する場合に、個々の電子部品に応じた適
切な圧着荷重と加熱温度の設定を行うことができる電子
部品の熱圧着装置を提供することを目的とする。Therefore, in the present invention, when a plurality of different types of electronic components are collectively subjected to thermocompression bonding, the thermocompression bonding of the electronic components can be carried out so that an appropriate crimping load and heating temperature can be set according to each electronic component. an object of the present invention is to provide the equipment.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の電子部品
の熱圧着装置は、基板を位置決めする位置決め部と、電
子部品を熱圧着する圧着ヘッドと、この圧着ヘッドを昇
降させる昇降手段とを備え、前記圧着ヘッドに電子部品
を加熱する固有の加熱手段および電子部品を基板に押圧
する固有の押圧手段を有する複数の熱圧着ツールを備
え、且つこれらの熱圧着ツールの自重を軽減する引張り
バネを設けた。According to a first aspect of the present invention, there is provided a thermocompression bonding apparatus for an electronic component, comprising: a positioning portion for positioning a substrate; a crimping head for thermocompressing the electronic component; and an elevating means for raising and lowering the crimping head. And a plurality of thermocompression bonding tools each having a unique heating means for heating electronic parts and a unique pressing means for pressing the electronic parts against the board , and a pulling tool for reducing the weight of these thermocompression bonding tools.
A spring is provided .
【０００７】請求項２記載の電子部品の熱圧着装置は、
請求項１記載の電子部品の熱圧着装置であって、電子部
品の高さに応じて前記熱圧着ツールの下降限を調整する
ストッパを設けた。The thermocompression bonding apparatus for electronic parts according to claim 2 is
The thermocompression bonding device for electronic parts according to claim 1, wherein the electronic part is provided.
Adjust the lowering limit of the thermocompression bonding tool according to the height of the product
A stopper is provided .
【０００８】請求項３記載の電子部品の熱圧着装置は、
請求項１又は２記載の電子部品の熱圧着装置であって、
前記複数の熱圧着ツールが一体にユニット化されてユニ
ットごと前記圧着ヘッドに着脱可能とした。 請求項４記
載の電子部品の熱圧着装置は、請求項３記載の電子部品
の熱圧着装置であって、前記ユニットはテーパシャンク
により前記圧着ヘッドに着脱自在に装着されるようにし
た。 The thermocompression bonding apparatus for electronic parts according to claim 3 is
A thermocompression bonding apparatus for electronic components according to claim 1 or 2,
The plurality of thermocompression bonding tools are unitized as a unit.
It is possible to attach / detach the entire crimp head to the crimp head. Claim 4
The electronic component thermocompression bonding device according to claim 3,
Thermocompression bonding apparatus, wherein the unit is a taper shank
So that it can be detachably attached to the crimp head.
It was
【０００９】各請求項記載の発明によれば、固有の加熱
手段および押圧手段を有する複数の熱圧着ツールを備え
ることにより、複数の種類の異る電子部品を個々の電子
部品に応じた適切な圧着荷重と加熱温度で一括して熱圧
着することができる。According to the invention described in each claim, by providing a plurality of thermocompression-bonding tools having unique heating means and pressing means, a plurality of different kinds of electronic components can be appropriately selected according to the individual electronic components. It is possible to perform thermocompression bonding collectively with the pressure bonding load and the heating temperature.
【００１０】[0010]
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１は本発明の一実施の形態の電子
部品の熱圧着装置の正面図、図２は同電子部品の熱圧着
装置の熱圧着ツールユニットの断面図、図３は同電子部
品の熱圧着装置の制御系の構成を示すブロック図であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a thermocompression bonding tool unit of the thermocompression bonding apparatus for electronic components, and FIG. 3 is a thermocompression bonding apparatus for electronic components. 3 is a block diagram showing the configuration of the control system of FIG.
【００１１】まず図１を参照して電子部品の熱圧着装置
の全体構造を説明する。図１において位置決めテーブル
１上には基板２が載置されている。基板２の上面には種
類の異る電極２ａ，２ｂが設けられており、電極２ａ，
２ｂにはそれぞれ種類の異る電子部品３、４ががバンプ
３ａ，４ａを介して搭載されている。First, the overall structure of the thermocompression bonding apparatus for electronic components will be described with reference to FIG. In FIG. 1, a substrate 2 is placed on the positioning table 1. Different kinds of electrodes 2a and 2b are provided on the upper surface of the substrate 2, and the electrodes 2a and 2b
Electronic components 3 and 4 of different types are mounted on 2b via bumps 3a and 4a.
【００１２】電子部品３，４は、それぞれ熱圧着ツール
５Ａ，５Ｂによって基板２に押圧されている。熱圧着ツ
ール５Ａ，５Ｂは熱圧着ツールユニット１０に装着され
ており、熱圧着ツールユニット１０はテーパシャンク９
により圧着ヘッド１１に装着されている。圧着ヘッド１
１はＺ軸テーブル１２に装着されており、Ｚ軸モータ１
３を駆動することにより、熱圧着ツール５Ａ，５Ｂは一
体的に上下動する。The electronic components 3 and 4 are pressed against the substrate 2 by thermocompression bonding tools 5A and 5B, respectively. The thermocompression bonding tools 5A and 5B are mounted on the thermocompression bonding tool unit 10, and the thermocompression bonding tool unit 10 has a taper shank 9
Is attached to the pressure bonding head 11. Crimping head 1
1 is mounted on the Z-axis table 12, and the Z-axis motor 1
By driving 3, the thermocompression bonding tools 5A and 5B move up and down integrally.
【００１３】次に図２を参照して熱圧着ツールユニット
１０について説明する。熱圧着ツールユニット１０は、
下面に開口部を有する箱型のフレーム２０より成り、テ
ーパシャンク９によって圧着ヘッド１１に着脱される。
フレーム２０の両側の内側面にはガイドレール２１Ａ，
２１Ｂが垂直に配設されており、ガイドレール２１Ａ，
２１Ｂにはスライダ２２Ａ，２２Ｂが上下方向にスライ
ド自在に装着されている。スライダ２２Ａ，２２Ｂには
Ｌ型のブラケット２３Ａ，２３Ｂが固着されており、ブ
ラケット２３Ａ，２３Ｂの下面には、ヒータブロック６
Ａ，６Ｂが装着されている。Next, the thermocompression bonding tool unit 10 will be described with reference to FIG. The thermocompression bonding tool unit 10 is
It is composed of a box-shaped frame 20 having an opening on the lower surface, and is attached to and detached from the crimping head 11 by the taper shank 9.
Guide rails 21A are provided on the inner surfaces on both sides of the frame 20,
21B are arranged vertically, and guide rails 21A,
Sliders 22A and 22B are mounted on 21B so as to be vertically slidable. L-shaped brackets 23A and 23B are fixed to the sliders 22A and 22B, and the heater block 6 is provided on the lower surfaces of the brackets 23A and 23B.
A and 6B are attached.
【００１４】ヒータブロック６Ａ，６Ｂにはヒータ７
Ａ，７Ｂが内蔵されており、ヒータ７Ａ，７Ｂを駆動す
ることにより熱圧着ツール５Ａ，５Ｂを介して電子部品
３，４を個別に加熱する。したがってヒータ７Ａ、７Ｂ
は、電子部品３、４を加熱する固有の加熱手段となって
いる。なお、熱圧着ツール５Ａ，５Ｂは電子部品の種類
に応じて交換自在となっている。熱圧着ツール５Ａ，５
Ｂには温度センサ８Ａ，８Ｂが備えられており、温度セ
ンサ８Ａ，８Ｂはヒータ７Ａ，７Ｂによって加熱された
熱圧着ツール５Ａ，５Ｂの温度を検出する。A heater 7 is provided in the heater blocks 6A and 6B.
A and 7B are built in, and the heaters 7A and 7B are driven to individually heat the electronic components 3 and 4 via the thermocompression bonding tools 5A and 5B. Therefore, the heaters 7A, 7B
Is a unique heating means for heating the electronic components 3 and 4. The thermocompression bonding tools 5A and 5B are replaceable according to the type of electronic component. Thermocompression bonding tools 5A, 5
B is equipped with temperature sensors 8A and 8B, and the temperature sensors 8A and 8B detect the temperature of the thermocompression bonding tools 5A and 5B heated by the heaters 7A and 7B.
【００１５】フレーム２０の天井面には、２つのシリン
ダ２５Ａ，２５Ｂがロッド２６Ａ，２６Ｂを下向きにし
て配設されており、ロッド２６Ａ，２６Ｂの下端部はブ
ラケット２３Ａ，２３Ｂの上面に当接している。シリン
ダ２５Ａ，２５Ｂのロッド２６Ａ，２６Ｂを突出させる
ことにより、ブラケット２３Ａ，２３Ｂはシリンダ２５
Ａ，２５Ｂの押圧力によって下向きに押し下げられ、熱
圧着ツール５Ａ，５Ｂを介して電子部品３，４を個別に
下方に押圧する。したがってシリンダ２５Ａ，２５Ｂは
電子部品３、４を基板に押圧する固有の押圧手段となっ
ている。Two cylinders 25A and 25B are arranged on the ceiling surface of the frame 20 with the rods 26A and 26B facing downward, and the lower ends of the rods 26A and 26B are in contact with the upper surfaces of the brackets 23A and 23B. There is. By making the rods 26A and 26B of the cylinders 25A and 25B project, the brackets 23A and 23B are moved to the cylinder 25.
It is pressed downward by the pressing force of A and 25B, and individually presses the electronic components 3 and 4 downward via the thermocompression bonding tools 5A and 5B. Therefore, the cylinders 25A and 25B are unique pressing means for pressing the electronic components 3 and 4 against the substrate.
【００１６】フレーム２０の天井面と、ブラケット２３
Ａ，２３Ｂの上面の間には引張りバネ２４Ａ，２４Ｂが
架設されている。引張りバネ２４Ａ，２４Ｂはブラケッ
ト２３Ａ，２３Ｂに上向きの引張り力を伝えることによ
り、ブラケット２３Ａ，２３Ｂやヒータブロック６Ａ，
６Ｂ、熱圧着ツール５Ａ，５Ｂなどの自重を支持して軽
減する。また、フレーム２０の下面には、ブラケット２
３Ａ，２３Ｂの下降限を規制するストッパ２７Ａ，２７
Ｂが設けられている。ストッパ２７Ａ，２７Ｂを調整す
ることにより、電子部品の高さに応じた下降限の位置が
調整できる。The ceiling surface of the frame 20 and the bracket 23
Tension springs 24A and 24B are installed between the upper surfaces of A and 23B. The tension springs 24A and 24B transmit the upward tension force to the brackets 23A and 23B, so that the brackets 23A and 23B and the heater block 6A,
6B , and the weight of the thermocompression bonding tools 5A and 5B is supported and reduced. In addition, the bracket 2 is provided on the lower surface of the frame 20.
Stoppers 27A, 27 that regulate the lowering limit of 3A, 23B
B is provided. By adjusting the stoppers 27A and 27B, the lower limit position can be adjusted according to the height of the electronic component.
【００１７】次に図３を参照して電子部品の熱圧着装置
の制御系の構成を説明する。図３において、制御部３０
は、Ｚ軸制御部３１、圧力制御部３２および温度制御部
３４を制御する。Ｚ軸制御部３１はＺ軸テーブル８を駆
動するＺ軸モータ１３の動作を制御する。圧力制御部３
２は圧力源３３からシリンダ２５Ａ，２５Ｂに供給され
るエアー圧力を個別に制御する。温度制御部３４は、制
御部３０からの温度指令と温度センサ８Ａ，８Ｂの検出
温度のフィードバック信号に基き、ヒータ７Ａ，８Ｂを
個別に制御する。Next, the configuration of the control system of the thermocompression bonding apparatus for electronic parts will be described with reference to FIG. In FIG. 3, the control unit 30
Controls the Z-axis controller 31, the pressure controller 32, and the temperature controller 34. The Z-axis control unit 31 controls the operation of the Z-axis motor 13 that drives the Z-axis table 8. Pressure control unit 3
2 individually controls the air pressure supplied from the pressure source 33 to the cylinders 25A and 25B. The temperature control unit 34 individually controls the heaters 7A and 8B based on the temperature command from the control unit 30 and the feedback signal of the temperature detected by the temperature sensors 8A and 8B.
【００１８】この電子部品の熱圧着装置は上記のように
構成されており、次に動作を説明する。まず熱圧着動作
を開始する前に、一括して熱圧着される電子部品の組み
合わせに適合した熱圧着ツールユニット１０を選択し、
圧着ヘッド１１に装着する。次いで、異なる種類の電子
部品３，４が既に搭載された基板２を位置決めテーブル
１上に載置し、基板２を位置決めする。次にＺ軸テーブ
ル８を駆動して熱圧着ユニット１０を一体的に下降さ
せ、基板２に搭載された電子部品３，４にそれぞれ熱圧
着ツール５Ａ、５Ｂを当接させる。The thermocompression bonding apparatus for electronic components is constructed as described above, and its operation will be described below. First, before starting the thermocompression bonding operation, select the thermocompression bonding tool unit 10 suitable for the combination of electronic components that are collectively thermocompression bonded,
It is attached to the pressure bonding head 11. Next, the board 2 on which different types of electronic components 3 and 4 have already been mounted is placed on the positioning table 1 to position the board 2. Next, the Z-axis table 8 is driven to integrally lower the thermocompression bonding unit 10, and the thermocompression bonding tools 5A and 5B are brought into contact with the electronic components 3 and 4 mounted on the substrate 2, respectively.
【００１９】このとき、ストッパ２７Ａ，２７Ｂを調整
して電子部品３，４の高さ寸法、また電極２ａ，２ｂの
高さ位置の差に応じてブラケット２３Ａ，２３Ｂの下降
限位置を調整しておくことにより、電子部品３，４に熱
圧着ツール５Ａ、５Ｂが当接するタイミングを同期させ
ることができる。これにより、電子部品３，４の熱圧着
過程が開始するタイミングを一致させることとなり、複
数電子部品一括圧着に際しての熱圧着時間の管理が容易
となる。すなわち、ストッパ２７Ａ、２７Ｂは熱圧着ツ
ール５Ａ、５Ｂの下面の高さを電子部品の厚さに応じて
調整する高さ調整手段となっている。At this time, the stoppers 27A and 27B are adjusted to adjust the lower limit positions of the brackets 23A and 23B according to the height dimensions of the electronic components 3 and 4 and the difference in the height positions of the electrodes 2a and 2b. By setting it, it is possible to synchronize the timing when the thermocompression bonding tools 5A and 5B come into contact with the electronic components 3 and 4. As a result, the timing of starting the thermocompression bonding process of the electronic components 3 and 4 is made coincident, and the thermocompression bonding time at the time of collectively bonding the plurality of electronic components becomes easy to manage. That is, the stoppers 27A, 27B are height adjusting means for adjusting the height of the lower surface of the thermocompression bonding tools 5A, 5B according to the thickness of the electronic component.
【００２０】この後、電子部品３，４の種類に応じて設
定された制御条件にしたがって、圧力制御部３２によっ
てシリンダ２５Ａ，２５Ｂの圧力を、温度制御部３４に
よってヒータ７Ａ，７Ｂを、それぞれ個別に制御するこ
とにより、それぞれの電子部品３，４は適切な圧着温
度、圧着荷重で基板２に一括して熱圧着される。After that, the pressure of the cylinders 25A and 25B is controlled by the pressure control unit 32 and the heaters 7A and 7B are controlled by the temperature control unit 34 according to the control conditions set according to the types of the electronic components 3 and 4, respectively. The electronic components 3 and 4 are collectively thermocompression-bonded to the substrate 2 at an appropriate pressure-bonding temperature and pressure-bonding load.
【００２１】[0021]
【発明の効果】本発明によれば、圧着ヘッドに固有の加
熱手段および押圧手段を有する複数の熱圧着ツールを備
えたので、複数の種類の異る電子部品を、個々の電子部
品に応じた適切な圧着荷重と加熱温度で一括して熱圧着
することができ、熱圧着品質を良好に保つと同時に、熱
圧着の生産性を向上させることができる。また、複数の
熱圧着ツールを熱圧着ツールユニットとして一体化する
ことにより、電子部品の品種切換え時の段取り替え作業
が効率化される。According to the present invention, since a plurality of thermocompression bonding tools having a heating means and a pressing means unique to the crimping head are provided, a plurality of types of different electronic components can be used according to the individual electronic components. It is possible to perform thermocompression bonding collectively with an appropriate crimping load and heating temperature, and it is possible to maintain good thermocompression bonding quality and improve thermocompression bonding productivity. Further, by integrating a plurality of thermocompression bonding tools as a thermocompression bonding tool unit, the setup change work at the time of switching the types of electronic components can be made efficient.
【図１】本発明の一実施の形態の電子部品の熱圧着装置
の正面図FIG. 1 is a front view of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention.
【図２】本発明の一実施の形態の電子部品の熱圧着装置
の熱圧着ツールユニットの断面図FIG. 2 is a cross-sectional view of a thermocompression bonding tool unit of the thermocompression bonding apparatus for electronic components according to the embodiment of the present invention.
【図３】本発明の一実施の形態の電子部品の熱圧着装置
の制御系の構成を示すブロック図FIG. 3 is a block diagram showing a configuration of a control system of the thermocompression bonding apparatus for electronic parts according to the embodiment of the present invention.
１ 位置決めテーブル ２ 基板 ３，４ 電子部品 ５Ａ，５Ｂ 熱圧着ツール ７Ａ，７Ｂ ヒータ ８Ａ，８Ｂ 温度センサ １０ 熱圧着ツールユニット １１ 圧着ヘッド １２ Ｚ軸テーブル ２５Ａ，２５Ｂ シリンダ ２７Ａ，２７Ｂ ストッパ 1 Positioning table 2 substrates 3,4 Electronic parts 5A, 5B thermocompression bonding tool 7A, 7B heater 8A, 8B temperature sensor 10 Thermocompression bonding tool unit 11 Crimping head 12 Z-axis table 25A, 25B cylinder 27A, 27B stopper
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 H01L 21/52 H05K 3/32 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 21/60 H01L 21/52 H05K 3/32
Claims (4)
品を熱圧着する圧着ヘッドと、この圧着ヘッドを昇降さ
せる昇降手段とを備え、前記圧着ヘッドに電子部品を加
熱する固有の加熱手段および電子部品を基板に押圧する
固有の押圧手段を有する複数の熱圧着ツールを備え、且
つこれらの熱圧着ツールの自重を軽減する引張りバネを
設けたことを特徴とする電子部品の熱圧着装置。1. A positioning unit for positioning a substrate, a pressure bonding head for thermocompression bonding an electronic component, and an elevating unit for elevating the pressure bonding head, and a unique heating unit and an electronic for heating the electronic component to the pressure bonding head. comprising a plurality of thermocompression bonding tool having a specific pressing means for pressing the components on a substrate,且
One is a tension spring that reduces the weight of these thermocompression bonding tools.
A thermocompression bonding device for electronic parts, which is provided .
の下降限を調整するストッパを設けたことを特徴とする
請求項１記載の電子部品の熱圧着装置。 2. The thermocompression bonding tool according to the height of an electronic component.
It is characterized in that a stopper for adjusting the descending limit of
The thermocompression bonding device for an electronic component according to claim 1.
化されてユニットごと前記圧着ヘッドに着脱可能である
ことを特徴とする請求項１又は２記載の電子部品の熱圧
着装置。Wherein the plurality of thermo-compression bonding tool thermocompression bonding apparatus for electronic components according to claim 1 or 2, wherein the detachable to said bonding head per unit are unitized integrally.
圧着ヘッドに着脱自在に装着されることを特徴とする請Contractor characterized by being detachably attached to the crimping head
求項３記載の電子部品の熱圧着装置。A thermocompression bonding apparatus for electronic components according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28643897A JP3368814B2 (en) | 1997-10-20 | 1997-10-20 | Thermocompression bonding equipment for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28643897A JP3368814B2 (en) | 1997-10-20 | 1997-10-20 | Thermocompression bonding equipment for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11121532A JPH11121532A (en) | 1999-04-30 |
| JP3368814B2 true JP3368814B2 (en) | 2003-01-20 |
Family
ID=17704397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28643897A Expired - Fee Related JP3368814B2 (en) | 1997-10-20 | 1997-10-20 | Thermocompression bonding equipment for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3368814B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017068691A1 (en) * | 2015-10-22 | 2017-04-27 | 堺ディスプレイプロダクト株式会社 | Component pressure-bonding device and component pressure-bonding method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1030349B2 (en) * | 1999-01-07 | 2013-12-11 | Kulicke & Soffa Die Bonding GmbH | Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips |
| JP4206320B2 (en) | 2003-09-19 | 2009-01-07 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor integrated circuit device |
| DE102004010399A1 (en) * | 2004-03-03 | 2005-09-22 | Atv Technologie Gmbh | Metallic components e.g. copper bumps, and semiconductor substrate connecting device, has pressing equipment with supporting plate and press die with plate including mounting ring that holds pressing mat |
| JP2010034423A (en) | 2008-07-30 | 2010-02-12 | Fujitsu Ltd | Pressure-heating apparatus and method |
| EP2439289B1 (en) * | 2010-10-05 | 2016-09-28 | Schwartz GmbH | Method and furnace for treating workpieces |
-
1997
- 1997-10-20 JP JP28643897A patent/JP3368814B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017068691A1 (en) * | 2015-10-22 | 2017-04-27 | 堺ディスプレイプロダクト株式会社 | Component pressure-bonding device and component pressure-bonding method |
| JPWO2017068691A1 (en) * | 2015-10-22 | 2018-08-09 | 堺ディスプレイプロダクト株式会社 | Component crimping apparatus and component crimping method |
| US10631416B2 (en) | 2015-10-22 | 2020-04-21 | Sakai Display Products Corporation | Compression bonding apparatus and compression bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11121532A (en) | 1999-04-30 |
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