JP3316701B2 - Manufacturing method of microwave circuit device - Google Patents
Manufacturing method of microwave circuit deviceInfo
- Publication number
- JP3316701B2 JP3316701B2 JP7210293A JP7210293A JP3316701B2 JP 3316701 B2 JP3316701 B2 JP 3316701B2 JP 7210293 A JP7210293 A JP 7210293A JP 7210293 A JP7210293 A JP 7210293A JP 3316701 B2 JP3316701 B2 JP 3316701B2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- holding structure
- insulating tube
- substrate
- center conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば電子走査アン
テナ等に組み込まれるマイクロ波回路装置の製造方法及
びその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a microwave circuit device incorporated in, for example, an electronic scanning antenna and the like, and an apparatus therefor.
【０００２】[0002]
【従来の技術】図５はマイクロ波回路装置の部分断面図
である。また、図６は図５において断面矢印ＡＡの方向
より見た図である。図において、１はマイクロ波放射素
子１ａを配置した任意曲面の基板であり、２、３はマイ
クロ波回路基板、２ａは上記マイクロ波回路基板１に被
着しているマイクロ波線路でありマイクロ波放射素子１
ａとの接続用である。３ａはマイクロ波回路基板２に被
着しているマイクロ波線路でありマイクロ波回路装置外
部との接続用である。４は前記の基板１〜３を保持し、
マイクロ波回路装置の主構造部材となる保持構造体であ
り、通常アルミニウム合金等の金属を用いることが多
い。５はマイクロ波コネクタであり、中心導体５ａ、絶
縁管５ｂ、外導体５ｃより構成されている。特に絶縁管
５ｂは電気的な損失を少なくするため４フッ化エチレン
で構成されることが多い。マイクロ波コネクタ５は保持
構造体４にあけられた穴で保持されている。６はスルー
ホールメッキされたスルーホールであり、図５及び図６
に示すごとくスルーホール６は中心導体５ａの周囲に馬
蹄形に配設されマイクロ波コネクタの外導体の役目をな
す。７は上記任意曲面の基板１及びマイクロ波回路基板
２、３を保持構造体４に取り付けるためのネジ等の締結
部品、８はマイクロ波の増幅を行うための電子モジュー
ルである。2. Description of the Related Art FIG. 5 is a partial sectional view of a microwave circuit device. FIG. 6 is a view seen from the direction of the cross-sectional arrow AA in FIG. In the figure, reference numeral 1 denotes a substrate having an arbitrary curved surface on which a microwave radiating element 1a is disposed, reference numerals 2 and 3 denote microwave circuit substrates, and reference numeral 2a denotes a microwave line adhered to the microwave circuit substrate 1. Radiating element 1
a for connection with a. Reference numeral 3a denotes a microwave line attached to the microwave circuit board 2 for connection with the outside of the microwave circuit device. 4 holds the substrates 1 to 3,
A holding structure serving as a main structural member of a microwave circuit device, and usually a metal such as an aluminum alloy is often used. Reference numeral 5 denotes a microwave connector, which includes a center conductor 5a, an insulating tube 5b, and an outer conductor 5c. In particular, the insulating tube 5b is often made of tetrafluoroethylene in order to reduce electric loss. The microwave connector 5 is held by a hole formed in the holding structure 4. 6 is a through-hole plated through-hole, and FIGS. 5 and 6
As shown in the figure, the through hole 6 is arranged in a horseshoe shape around the center conductor 5a and serves as an outer conductor of the microwave connector. Reference numeral 7 denotes a fastening part such as a screw for attaching the substrate 1 and the microwave circuit boards 2 and 3 having the arbitrary curved surface to the holding structure 4, and 8 denotes an electronic module for amplifying the microwave.
【０００３】従来のマイクロ波回路装置は上記のように
構成されており、マイクロ波は外部よりマイクロ波線路
３ａを介して電子モジュール８の一端のコネクタに接続
するマイクロ波コネクタに入り、電子モジュール８にて
増幅された後マイクロ波コネクタを介しマイクロ波線路
２ａに供給され放射素子１ａにて外部に放射される。ま
た、マイクロ波の外部への漏洩を防止するため、締結部
品７はマイクロ波回路基板と保持構造体の密着性が良く
なるよう高密度に配置される。[0003] The conventional microwave circuit device is configured as described above, and the microwave enters the microwave connector connected to the connector at one end of the electronic module 8 from the outside via the microwave line 3a. After being amplified by the radiating element 1a, the signal is supplied to the microwave line 2a via the microwave connector and radiated to the outside by the radiation element 1a. Further, in order to prevent the microwave from leaking to the outside, the fastening components 7 are arranged at a high density so that the adhesion between the microwave circuit board and the holding structure is improved.
【０００４】[0004]
【発明が解決しょうとする課題】上記のように構成され
た従来のマイクロ波回路装置では、保持構造体４が曲面
であるためマイクロ波コネクタ５の長さを保持構造体４
の各部に空けた穴の長さ合わせて製作する必要があり、
設計、製造コストが非常に高くなる。In the conventional microwave circuit device configured as described above, since the holding structure 4 is a curved surface, the length of the microwave connector 5 is reduced.
It is necessary to manufacture according to the length of the hole made in each part of
Design and manufacturing costs are very high.
【０００５】[0005]
【０００６】この発明は、かかる問題点を解決するため
になされたものであり、マイクロ波コネクタの種類を減
らし、設計、製造コストを削減することのできるマイク
ロ波回路装置の製造方法及びマイクロ波回路装置を得る
ことを目的としている。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a microphone which can reduce the number of types of microwave connectors and reduce design and manufacturing costs.
Method of manufacturing microwave circuit device and microwave circuit device
It is intended to be .
【０００７】[0007]
【課題を解決するための手段】この発明に係わるマイク
ロ波回路装置の製造方法においては、保持構造体自身が
マイクロ波コネクタの外導体を兼ねるようにし、保持構
造体の厚さより長いマイクロ波コネクタを保持構造体に
予め空けられた穴に挿入し、コネクタの一端または両端
を切断した後基板や中心導体等を配置する。In the method of manufacturing a microwave circuit device according to the present invention, the holding structure itself also functions as the outer conductor of the microwave connector, and the microwave connector longer than the thickness of the holding structure is used. After inserting one end or both ends of the connector into a hole preliminarily formed in the holding structure, a substrate, a center conductor and the like are arranged.
【０００８】[0008]
【０００９】[0009]
【作用】この発明は、保持構造体の厚さより長いマイク
ロ波コネクタを保持構造体の内部に予め空けられた穴に
挿入し、コネクタの一端または両端を切断した後基板や
中心導体等を配置することにより、保持構造体自身がマ
イクロ波コネクタの外導体を兼ねる。According to the present invention, a microwave connector longer than the thickness of the holding structure is inserted into a hole preliminarily formed inside the holding structure, and one or both ends of the connector are cut, and then a substrate, a center conductor and the like are arranged. Thereby, the holding structure itself also serves as the outer conductor of the microwave connector.
【００１０】[0010]
【００１１】[0011]
【実施例】実施例１． 図１はこの発明の一実施例に係わるマイクロ波回路装置
を示す。図１において、１〜４及び６〜８は上記従来例
と同一または相当品である。９はマイクロ波コネクタの
構成要素である中心導体であり、従来例とは異なり、絶
縁管や外導体との一体化はなされていない。１０は絶縁
管であり、保持構造体４の中に埋め込まれ、従来例の５
ｂと同様に電気的な損失を少なくするため４フッ化エチ
レンで構成されることが多い。[Embodiment 1] FIG. 1 shows a microwave circuit device according to one embodiment of the present invention. In FIG. 1, reference numerals 1 to 4 and 6 to 8 are the same as or equivalent to the above conventional example. Reference numeral 9 denotes a center conductor which is a component of the microwave connector. Unlike the conventional example, the center conductor 9 is not integrated with an insulating tube or an outer conductor. Reference numeral 10 denotes an insulating tube which is embedded in the holding structure 4 and which is 5
Like b, it is often made of tetrafluoroethylene in order to reduce electric loss.
【００１２】また、図２（ａ）、（ｂ）は前記保持構造
体４内にマイクロ波コネクタを構成する絶縁管１０を形
成するための製造工程を示すものである。図２（ａ）は
保持構造体４内に、マイクロ波の周波数によって決まる
直径で空けられた貫通穴に４フッ化エチレン等で構成さ
れた絶縁管を挿入したものである。絶縁管の内径は中心
導体外径、絶縁管の外径は保持構造体４に空けられた穴
の径に合わせてある。図２（ｂ）は保持構造体４に挿入
された絶縁管を、保持構造体４の曲面形状に合わせて切
断したものである。FIGS. 2A and 2B show a manufacturing process for forming an insulating tube 10 constituting a microwave connector in the holding structure 4. FIG. 2A shows an example in which an insulating tube made of tetrafluoroethylene or the like is inserted into a through hole formed in the holding structure 4 with a diameter determined by the frequency of the microwave. The inner diameter of the insulating tube corresponds to the outer diameter of the center conductor, and the outer diameter of the insulating tube corresponds to the diameter of a hole formed in the holding structure 4. FIG. 2B shows the insulating tube inserted into the holding structure 4 cut in accordance with the curved shape of the holding structure 4.
【００１３】この後、マイクロ波回路基板３を配置し、
マイクロは回路基板３に予め空けられた穴と絶縁管１０
内に中心導体９を挿入し、マイクロ波線路３ａとはんだ
付け等して回路の接続を行う。中心導体９の長さは回路
の位置によって異なるため、挿入後に長さ調整のための
切断をする。マイクロ波回路基板２も同様に配置する。
さらに、基板１を配置しネジ等の締結部品７にて保持構
造体４に固定する。最後に、電子モジュール８を配置し
てマイクロ波回路装置が構成される。Thereafter, the microwave circuit board 3 is placed,
The micro-hole and the insulating tube 10 are formed in the circuit board 3 in advance.
The central conductor 9 is inserted in the inside, and the circuit is connected to the microwave line 3a by soldering or the like. Since the length of the center conductor 9 varies depending on the position of the circuit, cutting for adjusting the length is performed after the insertion. The microwave circuit board 2 is similarly arranged.
Further, the substrate 1 is arranged and fixed to the holding structure 4 with fastening parts 7 such as screws. Finally, the microwave circuit device is configured by disposing the electronic module 8.
【００１４】前記のようなマイクロ波回路装置の製造方
法によれば、絶縁管１０および中心導体９を保持構造体
４の曲面形状や厚さに合わせて成形できるため、マイク
ロ波コネクタを多種類用意する必要がなくなり、さら
に、保持構造体自身がマイクロ波コネクタの外導体の役
割を果たす。との兼ね合いから０．１ｍｍ程度の厚さに
する。According to the method of manufacturing a microwave circuit device as described above, the insulating tube 10 and the center conductor 9 can be formed according to the curved surface shape and thickness of the holding structure 4, so that various types of microwave connectors are prepared. In addition, the holding structure itself serves as an outer conductor of the microwave connector. To a thickness of about 0.1 mm.
【００１５】実施例２．上記実施例１では絶縁管１０を
保持構造体４成形後に保持構造体４の曲面形状に合わせ
て切断するものとしているが、曲面形状成形前の保持構
造体４に絶縁管１０を埋め込んだ後に曲面形状を成形し
ても良い。Embodiment 2 FIG. In the first embodiment, the insulating tube 10 is cut in accordance with the curved surface shape of the holding structure 4 after the holding structure 4 is formed. The shape may be formed.
【００１６】実施例３．図３はこの発明の他の実施例に
係わるマイクロ波回路装置を示す。図において、１〜６
および２ａは上記従来例と同一または相当品である。１
１はベリリウム銅等のバネ性を有する部材である。図４
は部材１１の立体図である。部材１１はマイクロ波の電
気的性能に影響がないようできるだけ薄いほうが良いが
バネの剛性との兼ね合いから０．１ｍｍ程度の厚さにす
る。Embodiment 3 FIG. FIG. 3 shows a microwave circuit device according to another embodiment of the present invention. In the figure, 1-6
And 2a are the same as or equivalent to the above conventional example. 1
Reference numeral 1 denotes a member having a spring property such as beryllium copper. FIG.
Is a three-dimensional view of the member 11. The member 11 is preferably as thin as possible so as not to affect the electrical performance of the microwave. However, the thickness is about 0.1 mm in consideration of the rigidity of the spring.
【００１７】前記のように構成されたマイクロ波回路装
置においては、部材１１がバネ性を持っているため、マ
イクロ波回路基板３と保持構造体４の両方に接触するよ
うになる。すると、中心導体を通過するマイクロ波がコ
ネクタ外部に漏れる事を防止し、さらに、前記マイクロ
波回路基板３と保持構造体４それぞれの工作精度による
曲率の違いに係わらず密着性を確保する事が可能にな
る。In the microwave circuit device configured as described above, since the member 11 has a spring property, it comes into contact with both the microwave circuit board 3 and the holding structure 4. Then, the microwave passing through the center conductor is prevented from leaking to the outside of the connector, and the adhesion can be ensured irrespective of the difference in curvature due to the machining accuracy of the microwave circuit board 3 and the holding structure 4. Will be possible.
【００１８】[0018]
【発明の効果】この発明は以上説明したように構成され
ているので、以下のような効果がある。Since the present invention is configured as described above, the following effects can be obtained.
【００１９】マイクロ波コネクタの絶縁管を保持構造体
に直接埋め込んでいるため、保持構造体がマイクロ波コ
ネクタの外導体を兼ねることになり、部品点数を削減で
き回路の構成を単純化できる。Since the insulating tube of the microwave connector is directly embedded in the holding structure, the holding structure also serves as the outer conductor of the microwave connector, so that the number of parts can be reduced and the circuit configuration can be simplified.
【００２０】また、絶縁管を保持構造体に埋め込んだ後
に切断することにより、マイクロ波コネクタを保持構造
体の穴の長さの種類だけ用意する必要がなくなり、種類
を大幅に削減することができる。Further, by cutting the insulating tube after embedding it in the holding structure, it is not necessary to prepare the microwave connector only for the length of the hole of the holding structure, and the type can be greatly reduced. .
【００２１】また、絶縁管を保持構造体に埋め込んだ後
に切断することにより、保持構造体とマイクロ波コネク
タ長さの整合を取るための保持構造体の精度を高める必
要が少なくなる。Further, by cutting the insulating tube after embedding it in the holding structure, it is less necessary to increase the accuracy of the holding structure for matching the length of the microwave connector with the holding structure.
【００２２】[0022]
【００２３】[0023]
【００２４】[0024]
【図１】この発明の実施例１を示す部分断面図である。FIG. 1 is a partial cross-sectional view showing Embodiment 1 of the present invention.
【図２】この発明の実施例１を示すマイクロ波コネクタ
の製造工程図である。FIG. 2 is a manufacturing process diagram of the microwave connector according to the first embodiment of the present invention.
【図３】この発明の実施例３を示す部分断面図である。FIG. 3 is a partial sectional view showing Embodiment 3 of the present invention.
【図４】この発明の実施例３にわるバネ性を有するシム
の立体図である。FIG. 4 is a three-dimensional view of a shim having spring properties according to a third embodiment of the present invention.
【図５】従来のマイクロ波回路装置の部分断面図であ
る。FIG. 5 is a partial cross-sectional view of a conventional microwave circuit device.
【図６】図５の従来のマイクロ波回路装置を断面矢印Ａ
Ａより見た図である。FIG. 6 is a sectional view of the conventional microwave circuit device of FIG.
FIG.
１ 曲面基板 １ａ 放射素子 ２ マイクロ波回路基板 ２ａ マイクロ波線路 ３ マイクロ波回路基板 ３ａ マイクロ波線路 ４ 保持構造体 ５ マイクロ波コネクタ ６ スルーホール ７ 締結部品 ８ 電子モジュール ９ 中心導体 １０ 絶縁管 １１ シム DESCRIPTION OF SYMBOLS 1 Curved board 1a Radiating element 2 Microwave circuit board 2a Microwave line 3 Microwave circuit board 3a Microwave line 4 Holding structure 5 Microwave connector 6 Through hole 7 Fastening component 8 Electronic module 9 Center conductor 10 Insulation tube 11 Shim
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01P 11/00 H01P 3/08 H01P 1/04 H01Q 21/00 - 25/00 H01Q 13/08 ──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. 7 , DB name) H01P 11/00 H01P 3/08 H01P 1/04 H01Q 21/00-25/00 H01Q 13/08
Claims (2)
の基板と、曲率が前記曲面基板に合ったマイクロ波回路
基板と、一方の曲率が前記任意曲面の基板に合致し、他
方が平面または円筒などの単純曲面を有し上記基板の保
持をする導電性の保持構造体と、マイクロ波の増幅を行
うための電子モジュールと、保持構造体内部に埋め込ま
れたマイクロ波コネクタとを有するマイクロ波回路装置
において、上記保持構造体の厚みより長い絶縁管をその
絶縁管の一端または両端が上記保持構造の曲面側に突出
するように保持構造体に形成された絶縁管挿入穴に埋設
した状態で、上記絶縁管の一端または両端を上記保持構
造体の曲面に合うように切断した後、上記保持構造体上
に上記絶縁管と対応する中心導体挿入穴を有するマイク
ロ波基板を配置し、上記中心導体を上記中心導体挿入穴
と絶縁管に配置させた後、中心導体とマイクロ波基板の
線路間を接するようにしたことを特徴とするマイクロ波
回路装置の製造方法。1. A substrate having an arbitrary curved surface on which a microwave radiating element is arranged, a microwave circuit substrate having a curvature matching the curved substrate, one of the curvatures conforming to the substrate having the arbitrary curved surface, and the other being a plane or a cylinder. A microwave circuit having a conductive holding structure having a simple curved surface and holding the substrate, an electronic module for amplifying microwaves, and a microwave connector embedded inside the holding structure In the device, in a state where an insulating tube longer than the thickness of the holding structure is embedded in an insulating tube insertion hole formed in the holding structure such that one or both ends of the insulating tube protrude toward the curved surface side of the holding structure, After cutting one or both ends of the insulating tube to fit the curved surface of the holding structure, a microwave substrate having a center conductor insertion hole corresponding to the insulating tube is placed on the holding structure, A method of manufacturing a microwave circuit device, wherein the center conductor is arranged in the center conductor insertion hole and the insulating tube, and then the center conductor and the line of the microwave substrate are brought into contact with each other.
埋め込んだ状態で保持構造体を曲面形状に成形した後、
上記保持構造体上に上記絶縁管と対応する中心導体挿入
穴を有するマイクロ波基板を配置し、上記中心導体を上
記中心導体挿入穴と絶縁管に配置させた後、中心導体と
マイクロ波基板の線路間を接続するようにしたことを特
徴とする請求項１記載のマイクロ波回路装置の製造方
法。2. After the holding structure is formed into a curved shape with the insulating tube embedded in the holding structure before the curved shape is formed,
After arranging a microwave substrate having a center conductor insertion hole corresponding to the insulating tube on the holding structure, and arranging the center conductor in the center conductor insertion hole and the insulating tube, the center conductor and the microwave substrate 2. The method for manufacturing a microwave circuit device according to claim 1, wherein the lines are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7210293A JP3316701B2 (en) | 1993-03-30 | 1993-03-30 | Manufacturing method of microwave circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7210293A JP3316701B2 (en) | 1993-03-30 | 1993-03-30 | Manufacturing method of microwave circuit device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002103375A Division JP2003008301A (en) | 2002-04-05 | 2002-04-05 | Microwave circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06283916A JPH06283916A (en) | 1994-10-07 |
| JP3316701B2 true JP3316701B2 (en) | 2002-08-19 |
Family
ID=13479710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7210293A Expired - Fee Related JP3316701B2 (en) | 1993-03-30 | 1993-03-30 | Manufacturing method of microwave circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3316701B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6569826B2 (en) | 2017-01-12 | 2019-09-04 | 株式会社村田製作所 | Antenna module |
-
1993
- 1993-03-30 JP JP7210293A patent/JP3316701B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06283916A (en) | 1994-10-07 |
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