JP3295967B2 - Electronic component joining method - Google Patents
Electronic component joining methodInfo
- Publication number
- JP3295967B2 JP3295967B2 JP17037092A JP17037092A JP3295967B2 JP 3295967 B2 JP3295967 B2 JP 3295967B2 JP 17037092 A JP17037092 A JP 17037092A JP 17037092 A JP17037092 A JP 17037092A JP 3295967 B2 JP3295967 B2 JP 3295967B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- lead
- insertion hole
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、特に電子部品のリード
を基板のリード挿入孔に挿入し、リードと基板の配線と
を半田接合する電子部品接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining electronic components, in particular, by inserting leads of an electronic component into lead insertion holes of a substrate and soldering the leads to wiring of the substrate.
【０００２】[0002]
【従来の技術】近年、電子機器の小形軽量化に伴い回路
基板の高密度化および電子部品の小形化が一層求められ
てきている。2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter, there has been a growing demand for higher density circuit boards and smaller electronic components.
【０００３】まず図５（ａ）に示すように、基板４に設
けられたリード挿入孔５に電子部品７のリード８を挿入
する。次に図５（ｂ）に示すように、リード８の先端を
曲げる（以下クリンチという）。次に図５（ｃ）に示す
ように、噴流式半田槽２４の溶融半田２５にサポータ２
６上に保持した基板４のリード８が突出した側を接触さ
せ、リード８と基板４の配線（図示せず）とを半田接合
する。リード８をクリンチするのは、基板４を溶融半田
２５に接触させたときに溶融半田２５によってリード８
が押し上げられて電子部品７が抜け落ちたり、位置ずれ
したまま半田接合されたりすることを防止するためであ
る。[0005] First, as shown in FIG. 5 (a), a lead 8 of an electronic component 7 is inserted into a lead insertion hole 5 provided in a substrate 4. Next, as shown in FIG. 5B, the tip of the lead 8 is bent (hereinafter, referred to as clinch). Next, as shown in FIG. 5 (c), the supporter 2 is applied to the molten solder 25 of the jet type solder bath 24.
The lead 8 of the substrate 4 held on 6 is brought into contact with the protruding side thereof, and the lead 8 and a wiring (not shown) of the substrate 4 are soldered. The lead 8 is clinched when the substrate 4 is brought into contact with the molten solder 25 by the molten solder 25.
This is to prevent the electronic component 7 from being pushed up and falling off, or from being soldered while being displaced.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、図６（ａ）に示すように、リード８をク
リンチした際に隣り合う電子部品７のリード８が先端部
８ａで接触したり、図６（ｂ）に示すように、同じ電子
部品７のリード８同士が先端部８ｂで接触したりすると
いう課題を有していた。However, in the above-described conventional configuration, as shown in FIG. 6A, when the leads 8 are clinched, the leads 8 of the adjacent electronic components 7 may come into contact at the tip 8a. As shown in FIG. 6B, there is a problem that the leads 8 of the same electronic component 7 come into contact with each other at the tip 8b.
【０００５】さらには、電子部品７自身のリード８をク
リンチする際に、その衝撃力で電子部品７を破壊する場
合もあり、破壊に至らないまでも回路基板としての信頼
性を低下させる一因となっていた。また、図６（ｃ）に
示すように、使用時に発熱するような浮上型の電子部品
７の場合、基板４との隙間３０を設けておかなければな
らず、図示したようなあらかじめリード８の先端部近傍
をいなづま形８ｃにリード成形してこのいなづま形８ｃ
が基板４のリード挿入孔５の内壁に当接して基板４との
隙間３０を設けることが行なわれている。Further, when clinching the lead 8 of the electronic component 7 itself, the electronic component 7 may be destroyed by the impact force, and the reliability as a circuit board is reduced even if it is not destroyed. Had become. As shown in FIG. 6C, in the case of a floating electronic component 7 that generates heat during use, a gap 30 between the electronic component 7 and the substrate 4 must be provided. The tip portion is lead-molded into a shape 8c to form the shape 8c.
Is in contact with the inner wall of the lead insertion hole 5 of the substrate 4 to provide a gap 30 with the substrate 4.
【０００６】その上、近年の電子機器の小形軽量化に伴
う回路基板の高密度化により、クリンチそのものを行な
うスペースがなくなり、従来の工程では装置側としても
対応しきれなくなってきている。In addition, due to the recent trend toward higher density of circuit boards as electronic devices become smaller and lighter, there is no longer any space for clinching itself, and the conventional process is no longer compatible with the apparatus side.
【０００７】本発明は、上記の従来の課題を解決するも
ので、回路基板の品質と実装密度を向上する電子部品接
合方法を提供することを目的とする。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method for joining electronic parts, which improves the quality and mounting density of a circuit board.
【０００８】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明の電子部品接合方法は、基板のリード挿入孔に
クリーム半田を供給する工程と、リードを有する電子部
品をチャックで把持し前記基板のリード挿入孔に前記電
子部品のリードを挿入する工程と、前記電子部品本体が
存在する側と反対側の基板面から熱源により前記クリー
ム半田を溶融させる工程において、前記電子部品をチャ
ックで把持して前記基板のリード挿入孔に前記電子部品
のリードを挿入し、前記電子部品がチャックで把持され
たままの状態で前記電子部品の種類に応じてそのチャッ
クの高さを前記電子部品と前記基板との間に所定の隙間
を設けるように位置決めして前記熱源により前記基板の
リード挿入孔に塗布した前記クリーム半田を溶融させ、
前記電子部品のリードを前記基板に半田接合するもので
ある。Means for Solving the Problems] electronic component bonding method of the present invention in order to achieve the object, a step of supplying solder paste to the lead insertion hole of the substrate, an electronic part having leads
A step of goods was gripped by a chuck for inserting the leads of the electronic component in the lead insertion hole of the substrate, the electronic component main body
The Cree by the heat source from the substrate surface between the existing side opposite
In the step of melting the solder , the electronic component is charged.
Hold the electronic component in the lead insertion hole of the board
Insert the lead and hold the electronic component with the chuck
The height of the chuck is adjusted according to the type of the electronic component in a state where the electronic component and the substrate have a predetermined gap.
And positioning the substrate by the heat source .
Melting the cream solder applied to the lead insertion hole ,
The lead of the electronic component is soldered to the substrate.
【０００９】熱源は移動可能であり、前記熱源により基
板のリード挿入孔に塗布したクリーム半田を溶融させ、
電子部品のリードを前記基板に半田接合するものであ
る。 The heat source is movable and can be
Melt the cream solder applied to the lead insertion hole of the board,
For soldering electronic component leads to the substrate.
You.
【００１０】[0010]
【作用】この方法によって、電子部品のリードをクリン
チすることなく基板に半田接合することができ、クリン
チスペースが不要となり、高密度実装に対応することが
でき、クリンチによる衝撃で破壊しやすい電子部品に対
しても微妙なクリンチを必要としないため回路基板の品
質を安定させることができる。また、浮上型の電子部品
もリード成形を必要とせず、他の電子部品と同様に挿入
し、高さはＮＣ値により任意に設定することが可能とな
る。According to this method, the lead of the electronic component can be soldered to the substrate without clinching, the clinch space is not required, the high density mounting can be supported, and the electronic component easily broken by the impact of the clinch. Therefore, a delicate clinch is not required, so that the quality of the circuit board can be stabilized. In addition, a floating electronic component does not require lead molding, and can be inserted similarly to other electronic components, and the height can be set arbitrarily by the NC value.
【００１１】[0011]
【実施例】以下本発明の一実施例の電子部品接合方法に
ついて、図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component joining method according to one embodiment of the present invention will be described below with reference to the drawings.
【００１２】図１において、１はシリンジ、２はクリー
ム半田、３は塗布されたクリーム半田塊、３ａは溶融し
接合した半田、４は基板、５は電子部品７のリード８を
挿入するリード挿入孔、６は電子部品７を把持し移載す
るチャック、９は熱源としてのレーザー光線、１０はレ
ーザー光線９を伝送する光ファイバーである。まず図１
（ａ）に示すように、シリンジ１からクリーム半田２を
供給し、基板４に設けられたリード挿入孔５の周辺部に
クリーム半田塊３を形成する。次に図１（ｂ）に示すよ
うに、基板４を反転させる。そして図１（ｃ）に示すよ
うに、チャック６により電子部品７を移載し、リード８
をリード挿入孔５に挿入する。電子部品７が浮上型の場
合は、チャック６の高さをＮＣ値により設定する。チャ
ック６が電子部品７を把持したままの状態で、挿入され
たリード８に対し光ファイバー１０で伝送されてきたレ
ーザー光線９を基板下部より照射し、クリーム半田塊３
を溶融させ電子部品７のリード８を基板４に半田接合さ
せる。In FIG. 1, reference numeral 1 denotes a syringe, 2 denotes cream solder, 3 denotes applied cream solder mass, 3a denotes melted and bonded solder, 4 denotes a substrate, and 5 denotes a lead insertion for inserting a lead 8 of an electronic component 7. A hole 6 is a chuck for holding and transferring the electronic component 7, a laser beam 9 as a heat source, and an optical fiber 10 for transmitting the laser beam 9. First, Figure 1
As shown in FIG. 1A, a cream solder 2 is supplied from a syringe 1 to form a cream solder mass 3 around a lead insertion hole 5 provided in a substrate 4. Next, as shown in FIG. 1B, the substrate 4 is inverted. Then, as shown in FIG. 1C, the electronic component 7 is transferred by the chuck 6 and the lead 8 is moved.
Into the lead insertion hole 5. When the electronic component 7 is a floating type, the height of the chuck 6 is set by the NC value. With the chuck 6 holding the electronic component 7, the inserted lead 8 is irradiated with the laser beam 9 transmitted by the optical fiber 10 from the lower part of the substrate, and the solder paste 3
And the leads 8 of the electronic component 7 are soldered to the substrate 4.
【００１３】図２は上記接合方法を実現するための電子
部品接合装置の斜視図である。図２において、１１はチ
ャック６を有する挿入ヘッド部、１２はＸＹロボット、
１３，１４，１５はそれぞれ電子部品７を供給するトレ
イ、スティック、テープ、１６は搬送レール、１７は光
ファイバー１０（図示していない）を係止し移動する下
部照射ユニットである。まず図２に示すように、基板４
が搬送レール１６により搬送され所定の位置に位置決め
される。挿入ヘッド部１１はＸＹロボット１２に係止さ
れており、装置内を移動することができる。挿入ヘッド
１１はトレイ１３またスティック１４またテープ１５に
移動し、挿入ヘッド１１内のチャック６（図示していな
い）により、電子部品７を取り出し基板４上に移載す
る。次に下部照射ユニット１７がレーザー光線９の照射
位置に光ファイバー１０を移動させ、チャック６が電子
部品７を基板４に挿入するとレーザー光線を照射する。FIG. 2 is a perspective view of an electronic component joining apparatus for realizing the above joining method. In FIG. 2, reference numeral 11 denotes an insertion head having a chuck 6, 12 denotes an XY robot,
Reference numerals 13, 14, and 15 denote trays, sticks, and tapes for supplying the electronic components 7, reference numeral 16 denotes a transport rail, and reference numeral 17 denotes a lower irradiation unit that locks and moves the optical fiber 10 (not shown). First, as shown in FIG.
Is transported by the transport rail 16 and positioned at a predetermined position. The insertion head 11 is locked by the XY robot 12, and can move inside the apparatus. The insertion head 11 moves to the tray 13, the stick 14, or the tape 15, and the electronic component 7 is taken out and transferred onto the substrate 4 by the chuck 6 (not shown) in the insertion head 11. Next, the lower irradiation unit 17 moves the optical fiber 10 to the irradiation position of the laser beam 9, and irradiates the laser beam when the chuck 6 inserts the electronic component 7 into the substrate 4.
【００１４】図３は上記装置における下部照射ユニット
１７の詳細図である。図３において、１８はＸ軸モータ
ー、１９はＹ軸モーター、２０はθ軸モーター、２１は
ホルダーである。まず図３に示されるように、光ファイ
バー１０はホルダー２１に固定されており、Ｘ軸モータ
ー１８、Ｙ軸モーター１９、θ軸モーター２０により基
板下部を自在に移動することができる。これら各軸の移
動データーは、挿入する電子部品７の挿入位置データー
とリード８の本数およびピッチを記録してある部品デー
ターとから計算され、ホルダー２１を移動させて全ての
リードにレーザー光線９を照射する。FIG. 3 is a detailed view of the lower irradiation unit 17 in the above apparatus. In FIG. 3, 18 is an X-axis motor, 19 is a Y-axis motor, 20 is a θ-axis motor, and 21 is a holder. First, as shown in FIG. 3, the optical fiber 10 is fixed to a holder 21, and can be freely moved below the substrate by an X-axis motor 18, a Y-axis motor 19, and a θ-axis motor 20. The movement data of each axis is calculated from the insertion position data of the electronic component 7 to be inserted and the component data in which the number and pitch of the leads 8 are recorded, and the holder 21 is moved to irradiate all the leads with the laser beam 9. I do.
【００１５】また図４は、電子部品７のリード８を認識
する装置である。図４において、２２は認識カメラ、２
３は照明である。下部照射ユニット１７に認識カメラ２
２、照明２３を配することにより、電子部品７が挿入さ
れたか否か認識カメラ２２によりリード８を認識するこ
とにより、挿入ミスの際レーザー光線９を照射すること
がなくなり、また溶融し接合した半田３ａを認識するこ
とにより接合の状態を確認することができる。FIG. 4 shows an apparatus for recognizing the leads 8 of the electronic component 7. In FIG. 4, 22 is a recognition camera, 2
3 is illumination. Recognition camera 2 in lower irradiation unit 17
2. By arranging the illumination 23, the recognition of the lead 8 by the camera 22 as to whether or not the electronic component 7 has been inserted eliminates the irradiation of the laser beam 9 in the case of an insertion error, and the melting and joining of the solder. By recognizing 3a, the joining state can be confirmed.
【００１６】なお本実施例では、半田接合する熱源にレ
ーザー光線９を使用しシリンジ１により半田を供給した
例について説明したが、キセノンランプなどの光線を使
用し印刷機により半田を供給しても同等の効果が得られ
る。In this embodiment, an example in which the laser beam 9 is used as the heat source for soldering and the solder is supplied by the syringe 1 has been described. However, the same applies when the solder is supplied by a printing machine using a light beam such as a xenon lamp. The effect of is obtained.
【００１７】また本実施例では、挿入ヘッド部１１にチ
ャック６を設け、電子部品７を供給部から取り出し基板
４に挿入まで行なったが、電子部品７が吸着可能な形状
である場合は吸着ノズルを設け、吸着ノズルの吸引力に
より電子部品７を取り出し基板４に挿入することも可能
である。In this embodiment, the chuck 6 is provided on the insertion head 11 and the electronic component 7 is taken out from the supply section and inserted into the substrate 4. However, when the electronic component 7 has a shape that can be sucked, the suction nozzle is used. And the electronic component 7 can be taken out and inserted into the substrate 4 by the suction force of the suction nozzle.
【００１８】またクリーム半田塊３に光線を照射する前
に、約１００℃の熱風によりクリーム半田塊３を予熱し
ておくと、クリーム半田塊３内の水分が蒸発しクリーム
半田塊３が突沸により飛び散ることがない。If the cream solder mass 3 is preheated by hot air at about 100 ° C. before irradiating the cream solder mass 3 with light, the water in the cream solder mass 3 evaporates and the cream solder mass 3 is bumped. Does not splatter.
【００１９】[0019]
【発明の効果】以上の実施例の説明により明らかなよう
に本発明は、基板のリード挿入孔にクリーム半田を供給
する工程と、リードを有する電子部品をチャックで把持
し前記基板のリード挿入孔に前記電子部品のリードを挿
入する工程と、前記電子部品本体が存在する側と反対側
の基板面から熱源により前記クリーム半田を溶融させる
工程において、前記電子部品をチャックで把持して前記
基板のリード挿入孔に前記電子部品のリードを挿入し、
前記電子部品がチャックで把持されたままの状態で前記
電子部品の種類に応じてそのチャックの高さを前記電子
部品と前記基板との間に所定の隙間を設けるように位置
決めして前記熱源により前記基板のリード挿入孔に塗布
した前記クリーム半田を溶融させ、前記電子部品のリー
ドを前記基板に半田接合することにより、部品の種類に
応じてチャックの高さを部品と基板との間に所定の隙間
を設けることが可能なため、例えば半田溶融時の熱によ
る悪影響を受けやすい部品に対しても、基板と部品との
間に所定の距離を保つことができ、部品に熱の影響を与
えることを回避できる。この結果として、良好な接合品
質の基板が提供できる。As is clear from the above description of the embodiment, the present invention provides a process of supplying cream solder to a lead insertion hole of a substrate, and holding an electronic component having a lead with a chuck.
A step to inserting the leads of the electronic component in the lead insertion hole of the substrate, opposite to the side where the electronic component body is present
In the step of melting the cream solder from a substrate surface with a heat source , gripping the electronic component with a chuck,
Insert the lead of the electronic component into the lead insertion hole of the board,
The electronic height of the chuck according to the type of the electronic component in a state in which the electronic component is grasped by the chuck
Position so as to provide a predetermined gap between the component and the substrate
Determine and apply to the lead insertion hole of the board by the heat source
The solder of the cream solder is melted, and the lead of the electronic component is solder-bonded to the substrate, so that the height of the chuck is adjusted to a predetermined gap between the component and the substrate according to the type of the component.
Since it is possible to maintain a predetermined distance between the board and the component, for example, even for a component that is easily affected by heat at the time of solder melting, it is possible to prevent the component from being affected by heat. Can be avoided. As a result, a substrate with good bonding quality can be provided.
【図１】（ａ）本発明の一実施例の電子部品接合方法の
基板のリード挿入孔近傍に半田クリームを供給する状態
を示す断面図 （ｂ）同反転した基板を示す断面図 （ｃ）同チャックで把持した電子部品のリードを反転し
た基板のリード挿入孔に挿入する状態を示す断面図FIG. 1A is a cross-sectional view showing a state in which solder cream is supplied in the vicinity of a lead insertion hole of a board in a method for bonding electronic components according to one embodiment of the present invention. FIG. 1B is a cross-sectional view showing the inverted board. Sectional view showing a state in which leads of electronic components held by the chuck are inserted into lead insertion holes of an inverted substrate.
【図２】同電子部品接合方法を実施するための装置の全
体構成を示す斜視図FIG. 2 is a perspective view showing an entire configuration of an apparatus for performing the electronic component bonding method.
【図３】同装置における下部照射ユニットの構成を示す
斜視図FIG. 3 is a perspective view showing a configuration of a lower irradiation unit in the apparatus.
【図４】同装置における電子部品のリードを認識する装
置の構成を示す断面図FIG. 4 is a sectional view showing a configuration of an apparatus for recognizing leads of electronic components in the apparatus.
【図５】（ａ）従来の電子部品接合方法の電子部品のリ
ードを基板のリード挿入孔に挿入する状態を示す断面図 （ｂ）同基板のリード挿入孔に挿入された電子部品のリ
ードを内側に曲げた状態を示す断面図 （ｃ）同溶融半田に基板のリードを接触させる状態を示
す断面図FIG. 5A is a cross-sectional view showing a state in which a lead of an electronic component is inserted into a lead insertion hole of a substrate according to a conventional electronic component bonding method. Sectional view showing an inwardly bent state. (C) Sectional view showing a state in which a lead of a substrate is brought into contact with the molten solder.
【図６】（ａ）同電子部品接合方法で生じる不良例を示
す断面図 （ｂ）同電子部品接合方法で生じる不良例を示す断面図 （ｃ）同浮上型の電子部品の成形されたリードとリード
挿入孔の関係を示す断面図FIG. 6A is a cross-sectional view illustrating an example of a defect generated by the electronic component bonding method. FIG. 6B is a cross-sectional view illustrating a defective example of the electronic component bonding method. FIG. 6C is a molded lead of the floating electronic component. Sectional view showing the relationship between lead insertion holes
２ クリーム半田 ３ クリーム半田塊 ４ 基板 ５ リード挿入孔 ６ チャック ７ 電子部品 ８ リード ９ レーザー光線（熱源） １７ 下部照射ユニット 2 cream solder 3 cream solder mass 4 board 5 lead insertion hole 6 chuck 7 electronic component 8 lead 9 laser beam (heat source) 17 lower irradiation unit
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/34 H05K 13/04 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/34 H05K 13/04
Claims (2)
する工程と、リードを有する電子部品をチャックで把持
し前記基板のリード挿入孔に前記電子部品のリードを挿
入する工程と、前記電子部品本体が存在する側と反対側
の基板面から熱源により前記クリーム半田を溶融させる
工程において、前記電子部品をチャックで把持して前記
基板のリード挿入孔に前記電子部品のリードを挿入し、
前記電子部品がチャックで把持されたままの状態で前記
電子部品の種類に応じてそのチャックの高さを前記電子
部品と前記基板との間に所定の隙間を設けるように位置
決めして前記熱源により前記基板のリード挿入孔に塗布
した前記クリーム半田を溶融させ、前記電子部品のリー
ドを前記基板に半田接合する電子部品接合方法。1. A step of supplying cream solder to a lead insertion hole of a substrate, and holding an electronic component having a lead by a chuck.
A step to inserting the leads of the electronic component in the lead insertion hole of the substrate, opposite to the side where the electronic component body is present
In the step of melting the cream solder from a substrate surface with a heat source , gripping the electronic component with a chuck,
Insert the lead of the electronic component into the lead insertion hole of the board,
The electronic height of the chuck according to the type of the electronic component in a state in which the electronic component is grasped by the chuck
Position so as to provide a predetermined gap between the component and the substrate
Determine and apply to the lead insertion hole of the board by the heat source
The cream solder is melted, the electronic component bonding method soldered leads of the electronic component on the substrate that.
板のリード挿入孔に塗布したクリーム半田を溶融させ、
電子部品のリードを前記基板に半田接合する請求項１記
載の電子部品接合方法。 2. The heat source is movable and can be controlled by said heat source.
Melt the cream solder applied to the lead insertion hole of the board,
2. The lead of an electronic component is soldered to the substrate.
Electronic component bonding method described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17037092A JP3295967B2 (en) | 1992-06-29 | 1992-06-29 | Electronic component joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17037092A JP3295967B2 (en) | 1992-06-29 | 1992-06-29 | Electronic component joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0613746A JPH0613746A (en) | 1994-01-21 |
| JP3295967B2 true JP3295967B2 (en) | 2002-06-24 |
Family
ID=15903681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17037092A Expired - Fee Related JP3295967B2 (en) | 1992-06-29 | 1992-06-29 | Electronic component joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3295967B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026457A (en) * | 2003-07-02 | 2005-01-27 | Toshiba Corp | Method for mounting electronic component, substrate manufacturing apparatus, and circuit board |
| JP5294916B2 (en) | 2009-02-17 | 2013-09-18 | パナソニック株式会社 | Laser soldering equipment |
| JP6062444B2 (en) * | 2012-09-20 | 2017-01-18 | 富士機械製造株式会社 | Anti-substrate working machine and mounting method |
| US10285316B2 (en) | 2013-10-21 | 2019-05-07 | Fuji Corporation | Electronic component mounting device |
| WO2015059747A1 (en) | 2013-10-21 | 2015-04-30 | 富士機械製造株式会社 | Electronic component mounting apparatus |
| JP2015119114A (en) * | 2013-12-19 | 2015-06-25 | 第一実業株式会社 | Mounting method of electronic component and mounting device of electronic component |
| GB2588599B (en) * | 2019-10-24 | 2021-11-17 | Apollo Fire Detectors Ltd | Soldering Process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226893A (en) * | 1985-07-26 | 1987-02-04 | シチズン時計株式会社 | Fixing of electronic component with lead |
| US4799268A (en) * | 1985-11-12 | 1989-01-17 | Usm Corporation | Lead sense system for component insertion machine |
| JP2844778B2 (en) * | 1989-12-28 | 1999-01-06 | ソニー株式会社 | How to solder two types of parts to a single-sided printed circuit board |
| JPH0393086U (en) * | 1990-01-11 | 1991-09-24 | ||
| JP2636952B2 (en) * | 1990-07-03 | 1997-08-06 | 富士機械製造株式会社 | Electronic component mounting equipment |
-
1992
- 1992-06-29 JP JP17037092A patent/JP3295967B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0613746A (en) | 1994-01-21 |
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