JP3294312B2 - Manufacturing method of jumper chip - Google Patents
Manufacturing method of jumper chipInfo
- Publication number
- JP3294312B2 JP3294312B2 JP10686892A JP10686892A JP3294312B2 JP 3294312 B2 JP3294312 B2 JP 3294312B2 JP 10686892 A JP10686892 A JP 10686892A JP 10686892 A JP10686892 A JP 10686892A JP 3294312 B2 JP3294312 B2 JP 3294312B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- hoop material
- metal
- metal hoop
- jumper chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ギャップを隔てて対向
する一対のパターンを短絡するために使用されるジャン
パーチップの製造方法に関する。The present invention relates to relates to a jumper chip manufacturing method used to short-circuit the pair of patterns facing each other across a gap.
【０００２】[0002]
【従来の技術】従来のジャンパーチップとしては、図５
に示すように、直方体形状のセラミック基板１の両側部
にニッケルメッキおよびはんだメッキを施してなる電極
２を設け、かつ両電極２，２をセラミック基板１の上面
に設けた短絡電極３にて導通せしめたものが広く用いら
れている。このものは、図示せぬプリント基板上でギャ
ップを隔てて対向する一対のパターンを短絡する位置に
載置され、両側部の電極２，２と各パターンとをはんだ
付けすることによって、これら両パターンを短絡した状
態で該プリント基板上に実装される。2. Description of the Related Art As a conventional jumper chip, FIG.
As shown in FIG. 1, nickel-plated and solder-plated electrodes 2 are provided on both sides of a rectangular parallelepiped ceramic substrate 1, and both electrodes 2 and 2 are electrically connected by a short-circuit electrode 3 provided on the upper surface of the ceramic substrate 1. The impregnated one is widely used. This is mounted on a printed circuit board (not shown) at a position where a pair of patterns facing each other with a gap therebetween is short-circuited, and by soldering the electrodes 2 and 2 on both sides and each pattern, these two patterns are soldered. Is mounted on the printed circuit board in a state where is short-circuited.
【０００３】だが、かかる従来品は、まずセラミック基
板を形成し、そこに所定形状のメッキ層を形成しなけれ
ばならないので、材料費および加工費が嵩み、高価なジ
ャンパーチップになってしまうという不具合があった。[0003] However, in such a conventional product, a ceramic substrate is first formed, and a plating layer of a predetermined shape must be formed thereon, so that material and processing costs are increased, resulting in an expensive jumper chip. There was a defect.
【０００４】そこで従来、金属板をベース材とすること
でコストダウンを図ったジャンパーチップが、実開平２
−１２９６１２号公報に提案されている。このものは、
図６に示すように、片面にはんだメッキを施した所定形
状の金属板４を折曲加工することにより、はんだメッキ
層５が外側に露出するように略コ字形に折り曲げた両側
部の折曲げ部６，７を電極となしており、プリント基板
上へ実装する際には両折曲げ部６，７をそれぞれ該プリ
ント基板のパターンにはんだ付けする。また、金属板４
のうち両折曲げ部６，７を連結する個所は、はんだメッ
キを施していない面が外側に露出するように折り返した
折返し部８を重合載置しているので、プリント基板のパ
ターンへのはんだ付け時に、折曲げ部６，７を昇って金
属板４の中央部へ向かうはんだを該折返し部８によって
阻止することができ、はんだの滴下に起因する不所望な
ショートが発生しないように配慮されている。[0004] Conventionally, a jumper chip which has been reduced in cost by using a metal plate as a base material has been proposed in Japanese Utility Model Application Publication No.
No. 129612. This one is
As shown in FIG. 6, by bending a metal plate 4 having a predetermined shape on which one side is subjected to solder plating, both sides bent in a substantially U-shape so that the solder plating layer 5 is exposed to the outside. The parts 6, 7 serve as electrodes, and when mounted on a printed circuit board, the two bent parts 6, 7 are soldered to the pattern of the printed circuit board, respectively. Also, the metal plate 4
Of the portions where the two bent portions 6 and 7 are connected, the folded portion 8 which is folded so that the surface not subjected to the solder plating is exposed to the outside is superposed and mounted, so that the solder on the printed circuit board pattern is At the time of attachment, the solder which goes up the bent portions 6 and 7 toward the central portion of the metal plate 4 can be blocked by the folded portion 8, and care is taken so that an undesired short circuit due to the dripping of the solder does not occur. ing.
【０００５】かかる従来提案は、セラミック基板を形成
する必要がなく、金属フープ材の片面にはんだメッキを
施してからプレス抜きすることによって、折曲加工を残
すのみの単品のジャンパーチップが多数個取りできるの
で、材料費や加工費を大幅に低減することが可能となっ
ている。According to the conventional proposal, it is not necessary to form a ceramic substrate, and a large number of single jumper chips which only leave a bending process are obtained by applying a solder plating to one side of a metal hoop material and then pressing. As a result, material costs and processing costs can be significantly reduced.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記し
た従来提案は、金属フープ材から抜き落とした金属板を
個別に折曲加工しなければならないので、一辺の寸法が
１〜２ｍｍ程度の小さなジャンパーチップを製造しよう
とすると量産性が悪く、結果としてコストダウンのメリ
ットが少ないという不具合があった。However, in the above-mentioned conventional proposal, since a metal plate pulled out from a metal hoop material must be individually bent, a small jumper chip having a side size of about 1 to 2 mm is required. However, there is a disadvantage that mass production is poor when manufacturing is attempted, and as a result, there is little merit of cost reduction.
【０００７】本発明はこのような従来技術の課題に鑑み
てなされたもので、その目的は、材料費や加工費が安く
て量産性に優れたジャンパーチップの製造方法を提供す
ることにある。[0007] The present invention has been made in view of the problems of the prior art, the purpose of that is to provide a method for producing a jumper chip material costs and processing costs and excellent cheap mass production .
【０００８】[0008]
【課題を解決するための手段】上記した本発明の目的
は、金属フープ材に穴あけ加工を施すことにより、ジャ
ンパーチップの金属基板用として複数の透孔に囲まれた
チップ領域を多数形成し、次に、該チップ領域の少なく
とも両側部を除く表面と上記透孔の内面の一部とに絶縁
性樹脂を塗布して絶縁皮膜を形成した後、上記金属フー
プ材を溶融はんだ槽に浸漬することにより、上記チップ
領域の両側部にはんだメッキを施し、しかる後、該金属
フープ材に打ち抜き加工を施して上記チップ領域の周囲
で上記透孔どうしを連結している個所を切断することに
よって達成される。SUMMARY OF THE INVENTION The object of the present invention described above is to provide a metal hoop material by making a hole in the metal hoop material.
Surrounded by multiple through holes for metal substrate of bumper chip
Form a large number of chip areas, then reduce the chip area
Both are insulated from the surface excluding both sides and part of the inner surface of the through hole
After applying a conductive resin to form an insulating film,
The chip is immersed in a bath of molten solder.
Solder plating on both sides of the area, and then the metal
The hoop material is stamped out and around the tip area
This is achieved by cutting the portion connecting the above through holes with each other .
【０００９】[0009]
【００１０】[0010]
【作用】ベース材が金属板で、両側部の電極の間に絶縁
皮膜が介設してあるジャンパーチップは、金属フープ材
を利用して製造することができ、しかも金属フープ材か
ら抜き落とした後に煩雑な折曲加工を施さなくとも完成
品となすことができる。すなわち、上記製造方法におい
て、金属フープ材のチップ領域に対し、フープ供給を行
いながら絶縁皮膜やはんだメッキ層を連続的に形成して
いくことができ、該チップ領域を金属フープ材から抜き
落とした時点で単品のジャンパーチップが得られるの
で、量産性が極めて良好となる。[Function] A jumper chip in which a base material is a metal plate and an insulating film is interposed between electrodes on both sides can be manufactured by using a metal hoop material, and is further dropped from the metal hoop material. The finished product can be completed without complicated bending work. That is, in the above manufacturing method, the insulating film and the solder plating layer can be continuously formed while supplying the hoop to the chip region of the metal hoop material, and the chip region is dropped from the metal hoop material. Since a single jumper chip can be obtained at this point, mass productivity is extremely good.
【００１１】[0011]
【実施例】以下、本発明の実施例を図１乃至図４に基づ
いて説明する。ここで、図１は実施例に係るジャンパー
チップの製造工程図、図２は該ジャンパーチップの完成
品の斜視図、図３は該ジャンパーチップの製造工程の作
業内容を示すフローチャート、図４は該ジャンパーチッ
プの製造過程の絶縁性樹脂塗布工程を示す断面図であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a manufacturing process diagram of the jumper chip according to the embodiment, FIG. 2 is a perspective view of a completed product of the jumper chip, FIG. 3 is a flowchart showing the operation contents of the manufacturing process of the jumper chip, and FIG. It is sectional drawing which shows the insulating resin application process in the manufacturing process of a jumper chip.
【００１２】図２に示すジャンパーチップ１０は、鉄板
の上下両面にニッケルメッキを施してなる直方体形状の
金属基板１１をベース材とし、この金属基板１１の両側
部を除く全表面にエポキシ樹脂等の絶縁性樹脂からなる
絶縁皮膜１２が塗布形成してあるとともに、金属基板１
１の両側部にはんだメッキ層１３が鍍着してあり、この
はんだメッキ層１３を、短絡すべきパターンにはんだ付
けするための電極となしている。すなわち、このジャン
パーチップ１０を図示せぬプリント基板上へ実装する際
には、該プリント基板上でギャップを隔てて対向する一
対のパターンを橋絡する位置にジャンパーチップ１０を
載置して、両側部のはんだメッキ層１３と各パターンと
をはんだ付けする。これにより、該プリント基板の上記
両パターンがジャンパーチップ１０を介して短絡され、
これら両パターン間のギャップ内に位置する他のパター
ンは絶縁皮膜１２と対向することになって不所望なショ
ートが防止できるようになっている。The jumper chip 10 shown in FIG. 2 is based on a rectangular parallelepiped metal substrate 11 formed by applying nickel plating on both upper and lower surfaces of an iron plate, and the entire surface of the metal substrate 11 except for both sides is made of epoxy resin or the like. An insulating film 12 made of an insulating resin is applied and formed, and the metal substrate 1
1 are plated with solder plating layers 13 on both sides, and serve as electrodes for soldering to a pattern to be short-circuited. That is, when mounting the jumper chip 10 on a printed board (not shown), the jumper chip 10 is placed on the printed board at a position bridging a pair of patterns facing each other with a gap therebetween. The solder plating layer 13 of each part is soldered to each pattern. As a result, the two patterns on the printed circuit board are short-circuited via the jumper chip 10,
The other patterns located in the gap between these two patterns face the insulating film 12 so that an undesired short circuit can be prevented.
【００１３】次に、上記ジャンパーチップ１０の製造方
法について説明する。Next, a method of manufacturing the jumper chip 10 will be described.
【００１４】まず、両面にニッケルメッキを施した金属
フープ材１４を用意し、この金属フープ材１４をリール
スタンド（図示せず）に装着してフープ供給しながら穴
あけ加工を行い、縦１．２ｍｍ、横１．１ｍｍの角孔１
５と、幅０．６ｍｍ、長さ２ｍｍの長孔１６とを、図１
（ａ）に示すような配列で多数穿設する。なお、同図
（ａ）における符号１７は、上記ジャンパーチップ１０
の金属基板１１として利用されるチップ領域で、このチ
ップ領域１７は左右を２つの角孔１５，１５に挟まれ上
下を２つの長孔１６，１６に挟まれている。First, a metal hoop material 14 having nickel plating on both sides is prepared, and the metal hoop material 14 is mounted on a reel stand (not shown) and drilled while supplying a hoop to the metal hoop material. , 1.1 mm square hole 1
5 and a long hole 16 having a width of 0.6 mm and a length of 2 mm are shown in FIG.
Many holes are drilled in the arrangement shown in FIG. Note that the reference numeral 17 in FIG.
The chip region 17 is sandwiched between two rectangular holes 15 on the left and right sides and between two long holes 16 on the upper and lower sides.
【００１５】次いで、この金属フープ材１４に対し、近
接する２つの角孔１５，１５間に位置する幅狭な桟１８
を厚さ方向に０．１ｍｍ程度潰して後述する凸版ローラ
を該角孔１５，１５内へ挿入しやすくし、さらに金属フ
ープ材１４の両面をバリ取り機（図示せず）にて０．０
５ｍｍ程度研削して穴あけ加工時の抜きダレを取り除
き、この後、金属フープ材１４を洗浄して加工油や削り
カスを除去する。Next, a narrow beam 18 located between two adjacent square holes 15, 15 is inserted into the metal hoop material 14.
Is crushed in the thickness direction by about 0.1 mm to facilitate insertion of a relief roller described later into the square holes 15, and both sides of the metal hoop material 14 are removed by a deburring machine (not shown).
Grinding by about 5 mm removes the sagging during drilling, and thereafter, the metal hoop material 14 is washed to remove machining oil and shavings.
【００１６】次なる工程は、凸版印刷方式による絶縁性
樹脂の塗布およびその硬化で、図１（ｂ）に示すよう
に、金属フープ材１４の両面の角孔１５群の列および長
孔１６群の列と、チップ領域１７の端面となる側の各角
孔１５の内面（右内面または左内面）と、各長孔１６の
右内面および左内面とにそれぞれ、絶縁皮膜１２を塗布
形成する。これらの絶縁皮膜１２はローラコーティング
法によって塗布した絶縁性樹脂をＵＶ硬化炉（図示せ
ず）で硬化させて形成したものであり、例えば角孔１５
の内面への塗布作業は、図４に示すように、転写ローラ
１９によって外周面に絶縁性樹脂２０が供給される凸版
ローラ２１の一部を、桟１８を挟んで並設されている２
つの角孔１５，１５内に挿入し、同図の場合は左側の角
孔１５の左上端エッジが凸版ローラ２１の絶縁性樹脂２
０をかき取って、該角孔１５の左内面に絶縁性樹脂２０
が塗布されている。そして、金属フープ材１４を送りな
がらこうして次々と角孔１５の左内面に絶縁性樹脂２０
を塗布したなら、これをそのままＵＶ硬化炉へ送って絶
縁性樹脂２０を硬化させ、絶縁皮膜１２となす。The next step is the application and curing of an insulating resin by letterpress printing, and as shown in FIG. 1B, a row of square holes 15 and a group of long holes 16 on both surfaces of the metal hoop material 14. , The inner surface (the right inner surface or the left inner surface) of each square hole 15 on the side to be the end surface of the chip region 17, and the right inner surface and the left inner surface of each long hole 16 are coated with the insulating film 12. These insulating films 12 are formed by curing an insulating resin applied by a roller coating method in a UV curing furnace (not shown).
As shown in FIG. 4, a part of the relief roller 21 to which the insulating resin 20 is supplied to the outer peripheral surface by the transfer roller 19 is arranged side by side with the rail 18 interposed therebetween, as shown in FIG.
In this case, the upper left edge of the square hole 15 on the left side is the insulating resin 2 of the letterpress roller 21 in the case of FIG.
0, and the insulating resin 20
Is applied. Then, while feeding the metal hoop material 14, the insulating resin 20 is sequentially placed on the left inner surface of the square hole 15.
Is applied to a UV curing furnace as it is to cure the insulating resin 20 and form the insulating film 12.
【００１７】また、図４において右側の角孔１５の右上
端エッジが凸版ローラ２１の絶縁性樹脂２０をかき取る
ように設定しておけば、硬化後、該角孔１５の右内面に
絶縁皮膜１２を形成することができ、同様にして各長孔
１６の右内面および左内面にも絶縁皮膜１２を形成する
ことができ、こうして角孔１５および長孔１６の必要個
所に絶縁皮膜１２を形成した後、金属フープ材１４の両
面の必要個所にもそれぞれ、凸版ローラの絶縁性樹脂を
塗布して硬化させることにより絶縁皮膜１２を形成す
る。If the right upper edge of the square hole 15 on the right side in FIG. 4 is set so as to scrape the insulating resin 20 of the letterpress roller 21, an insulating film is formed on the right inner surface of the square hole 15 after curing. 12 can be formed, and similarly, the insulating film 12 can be formed on the right inner surface and the left inner surface of each slot 16. Thus, the insulating film 12 can be formed on the square hole 15 and the required portion of the slot 16. After that, the insulating film 12 is formed by applying and curing the insulating resin of the letterpress roller to the necessary portions on both sides of the metal hoop material 14, respectively.
【００１８】なお、金属フープ材１４の送り方向に沿う
角孔１５の寸法は１．１ｍｍと小さいので、上記凸版ロ
ーラ２１を１つの角孔１５内へ挿入しようとすると内面
への絶縁性樹脂２０の塗布量不足を生じやすいが、本実
施例では予め桟１８を潰しておくことにより、凸版ロー
ラ２１が２つの角孔１５，１５を利用して深く挿入でき
るようになっている。また、穴あけ加工時の抜きダレで
角孔１５や長孔１６のエッジが消失すると、絶縁性樹脂
２０が十分にかき取れずに塗布量不足を起こす虞がある
が、本実施例では上記研削加工により抜きダレが取り除
いてあるので、角孔１５や長孔１６には絶縁性樹脂２０
がかき取りやすいエッジが確保されている。したがっ
て、本実施例では孔内面への絶縁性樹脂２０の塗布量不
足は起こりにくく、十分な厚みの絶縁皮膜１２を確実に
形成することができる。Since the size of the square hole 15 along the feeding direction of the metal hoop material 14 is as small as 1.1 mm, if the letterpress roller 21 is to be inserted into one square hole 15, the insulating resin 20 In this embodiment, the bar 18 is crushed in advance so that the relief roller 21 can be inserted deeply by using the two square holes 15. Also, if the edges of the square holes 15 and the long holes 16 disappear due to the sagging during the drilling process, the insulating resin 20 may not be sufficiently removed and the coating amount may be insufficient. As a result, the square resin 15 is removed from the insulating resin
An edge that is easy to scrape is secured. Therefore, in the present embodiment, an insufficient amount of the insulating resin 20 applied to the inner surface of the hole hardly occurs, and the insulating film 12 having a sufficient thickness can be reliably formed.
【００１９】さて、こうして金属フープ材１４の所定個
所に絶縁皮膜１２を塗布形成したなら、これを図示せぬ
溶融はんだ槽へフープ供給して浸漬するというディップ
はんだを行い、図１（ｃ）に示すように、絶縁皮膜１２
に覆われていない金属表面にはんだメッキ層１３を形成
する。かかるディップはんだを行うことにより、金属フ
ープ材１４のチップ領域１７は、長孔１６に隣接してい
る両側部が端面（該長孔１６の内面）を含めてはんだメ
ッキされる。また、スリット状の長孔は溶融はんだの表
面張力による膜形成ではんだが詰まりやすいという難点
があったが、本実施例では幅０．６ｍｍの長孔１６の内
面の一部に予め絶縁皮膜１２が形成してあるので、この
絶縁皮膜１２がはんだレジスト層となって該長孔１６内
には溶融はんだの膜が形成されず、よってディップはん
だ工程後にエアナイフやバキュームノズルを用いて長孔
１６内の余分なはんだを除去する必要はない。つまり、
はんだレジスト層として機能する絶縁皮膜１２を形成し
た金属フープ材１４に対してディップはんだを施せば、
スリット状の長孔１６がはんだで塞がれてしまう虞はな
く、該長孔１６は図１（ｃ）においてチップ領域１７の
端面となる側の上内面および下内面にのみはんだメッキ
層１３が形成される。When the insulating film 12 is applied to a predetermined portion of the metal hoop material 14, dip soldering is performed by supplying the hoop to a molten solder bath (not shown) and immersing the same in FIG. 1 (c). As shown, the insulating film 12
A solder plating layer 13 is formed on a metal surface that is not covered with the solder plating layer. By performing such dip soldering, the chip region 17 of the metal hoop material 14 is solder-plated on both sides adjacent to the long hole 16 including the end face (the inner surface of the long hole 16). In addition, the slit-shaped long hole has a disadvantage that the solder is easily clogged by the film formation due to the surface tension of the molten solder. However, in this embodiment, the insulating film 12 is previously formed on a part of the inner surface of the long hole 16 having a width of 0.6 mm. Is formed, the insulating film 12 becomes a solder resist layer and no molten solder film is formed in the long hole 16. Therefore, after the dip soldering step, the inside of the long hole 16 is formed using an air knife or a vacuum nozzle. There is no need to remove excess solder. That is,
If the metal hoop material 14 on which the insulating film 12 functioning as a solder resist layer is formed is subjected to dip soldering,
There is no possibility that the slit-shaped long hole 16 will be closed by the solder, and the long hole 16 has the solder plating layer 13 only on the upper inner surface and the lower inner surface on the side to be the end surface of the chip region 17 in FIG. It is formed.
【００２０】そして、ディップはんだ後にフラックスを
洗浄をしてから、金属フープ材１４を図示せぬプレス機
へと送って、図１（ｄ）に示すように、チップ領域１７
の周囲で角孔１５と長孔１６とを連結している個所を切
断することにより、金属フープ材１４から単品のジャン
パーチップ１０を抜き落とす。こうして得たジャンパー
チップ１０は、先に図２を参照して説明したように、金
属フープ材１４のチップ領域１７を打ち抜いた直方体形
状の金属基板１１と、該金属基板１１の両端部を除く全
表面に設けた絶縁皮膜１２と、金属基板１１の両端部に
設けた電極としてのはんだメッキ層１３とによって構成
されており、金属フープ材１４から抜き落とした後、そ
のままテーピング包装することができる。Then, after the flux is washed after the dip soldering, the metal hoop material 14 is sent to a press machine (not shown), and as shown in FIG.
A single jumper chip 10 is pulled out of the metal hoop material 14 by cutting a portion connecting the square hole 15 and the long hole 16 around the metal hoop material 14. As described above with reference to FIG. 2, the jumper chip 10 obtained as described above has a rectangular parallelepiped metal substrate 11 formed by punching out the chip region 17 of the metal hoop material 14, and a whole except for both ends of the metal substrate 11. It is composed of an insulating film 12 provided on the surface and a solder plating layer 13 as an electrode provided on both ends of the metal substrate 11, and after being dropped from the metal hoop material 14, can be directly tape-packaged.
【００２１】このように上記実施例では、金属フープ材
１４をフープ供給しながら単品のジャンパーチップ１０
を連続的に生産することができるので、セラミック基板
をベース材とする従来一般のジャンパーチップに比して
材料費や加工費を大幅に低減することができる。しか
も、このジャンパーチップ１０は、金属フープ材１４か
ら抜き落とした後に煩雑な折曲加工を行う必要がないの
で、一辺の寸法が１〜２ｍｍ程度の小さなジャンパーチ
ップでありながら量産性が極めて良好であり、よって大
幅なコストダウンが実現できる。As described above, in the above embodiment, the single jumper chip 10 is supplied while the metal hoop material 14 is supplied to the hoop.
Can be continuously produced, so that material costs and processing costs can be significantly reduced as compared with a conventional general jumper chip using a ceramic substrate as a base material. In addition, since the jumper chip 10 does not need to be subjected to complicated bending after being pulled out from the metal hoop material 14, the mass productivity is extremely good even though it is a small jumper chip having a side size of about 1 to 2 mm. Yes, so significant cost reductions can be realized.
【００２２】なお、上記実施例では、金属フープ材１４
のうちジャンパーチップ１０の電極となる側の透孔を幅
狭な長孔１６とすることで材料の無駄を少なくしている
関係上、この長孔１６の内面にも絶縁皮膜１２が塗布形
成してあるが、該透孔をディップはんだ時に溶融はんだ
が詰まらない程度の幅広に形成しておけば、その内面に
絶縁皮膜（はんだレジスト層）を設ける必要はない。In the above embodiment, the metal hoop material 14 is used.
The insulating film 12 is also applied to the inner surface of the long hole 16 because the through hole on the side serving as the electrode of the jumper chip 10 is made a narrow long hole 16 to reduce waste of material. However, if the through holes are formed wide enough to prevent clogging of the molten solder during dip soldering, there is no need to provide an insulating film (solder resist layer) on the inner surface.
【００２３】[0023]
【発明の効果】以上説明したように、金属フープ材に絶
縁性樹脂を塗布してからはんだメッキを施してチップ領
域を抜き落とすことで、金属基板の両側部の一対の電極
の間に絶縁皮膜が介在するジャンパーチップを得るとい
う本発明によれば、セラミック基板をベース材とする従
来品に比して材料費や加工費が安く、しかも金属フープ
材から抜き落とした後に煩雑な折曲加工を行う必要がな
くて量産性が極めて良好なジャンパーチップが得られ、
大幅なコストダウンが図れるという優れた効果を奏す
る。As described above, the insulating film is applied between the pair of electrodes on both sides of the metal substrate by applying the insulating resin to the metal hoop material and applying the solder plating to drop out the chip area. According to the present invention in which a jumper chip is interposed, the material cost and processing cost are lower than those of a conventional product using a ceramic substrate as a base material, and a complicated bending process is performed after the material is removed from a metal hoop material. A jumper chip with extremely good mass productivity that does not need to be performed can be obtained.
An excellent effect that significant cost reduction can be achieved.
【図１】実施例に係るジャンパーチップの製造工程図で
ある。FIG. 1 is a manufacturing process diagram of a jumper chip according to an embodiment.
【図２】該ジャンパーチップの完成品の斜視図である。FIG. 2 is a perspective view of a completed product of the jumper chip.
【図３】該ジャンパーチップの製造工程の作業内容を示
すフローチャートである。FIG. 3 is a flowchart showing work contents of a manufacturing process of the jumper chip.
【図４】該ジャンパーチップの製造過程の絶縁性樹脂塗
布工程を示す断面図である。FIG. 4 is a cross-sectional view showing an insulating resin coating step in the process of manufacturing the jumper chip.
【図５】従来のジャンパーチップの一例を示す斜視図で
ある。FIG. 5 is a perspective view showing an example of a conventional jumper chip.
【図６】従来のジャンパーチップの他の例を示す斜視図
である。FIG. 6 is a perspective view showing another example of a conventional jumper chip.
１０ ジャンパーチップ １１ 金属基板 １２ 絶縁皮膜 １３ はんだメッキ層（電極） １４ 金属フープ材 １５ 角孔 １６ 長孔 １７ チップ領域 ２０ 絶縁性樹脂 DESCRIPTION OF SYMBOLS 10 Jumper chip 11 Metal substrate 12 Insulating film 13 Solder plating layer (electrode) 14 Metal hoop material 15 Square hole 16 Long hole 17 Chip area 20 Insulating resin
───────────────────────────────────────────────────── フロントページの続き (72)発明者 西川 輝雄 東京都大田区雪谷大塚町１番７号 アル プス電気株式会社内 (56)参考文献 特開 平５−152022（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 43/00 H01R 11/01 H05K 1/11 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Teruo Nishikawa 1-7 Yukitani Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd. (56) References JP-A-5-152022 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H01R 43/00 H01R 11/01 H05K 1/11
Claims (1)
より、ジャンパーチップの金属基板用として複数の透孔
に囲まれたチップ領域を多数形成し、次に、該チップ領
域の少なくとも両側部を除く表面と上記透孔の内面の一
部とに絶縁性樹脂を塗布して絶縁皮膜を形成した後、上
記金属フープ材を溶融はんだ槽に浸漬することにより、
上記チップ領域の両側部にはんだメッキを施し、しかる
後、該金属フープ材に打ち抜き加工を施して上記チップ
領域の周囲で上記透孔どうしを連結している個所を切断
することを特徴とするジャンパーチップの製造方法。1. A metal hoop material is drilled to form a large number of chip regions surrounded by a plurality of through holes for a metal substrate of a jumper chip, and then removing at least both side portions of the chip region. One of the surface and the inner surface of the through hole
After applying an insulating resin to the part and forming an insulating film ,
By immersing the metal hoop material in the molten solder bath,
Jumper characterized by cutting the plated solder on both sides of the chip area, and thereafter, a location where subjected to punching to the metal hoop material connecting the said holes each other around the chip area Chip manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10686892A JP3294312B2 (en) | 1992-04-24 | 1992-04-24 | Manufacturing method of jumper chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10686892A JP3294312B2 (en) | 1992-04-24 | 1992-04-24 | Manufacturing method of jumper chip |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002034117A Division JP3569264B2 (en) | 2002-02-12 | 2002-02-12 | Jumper chip manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH065341A JPH065341A (en) | 1994-01-14 |
| JP3294312B2 true JP3294312B2 (en) | 2002-06-24 |
Family
ID=14444526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10686892A Expired - Fee Related JP3294312B2 (en) | 1992-04-24 | 1992-04-24 | Manufacturing method of jumper chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3294312B2 (en) |
-
1992
- 1992-04-24 JP JP10686892A patent/JP3294312B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH065341A (en) | 1994-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3125518C2 (en) | Method of making a thin wiring assembly - US Pat | |
| US7378937B2 (en) | Chip resistor and method of making the same | |
| US6534726B1 (en) | Module substrate and method of producing the same | |
| JP3859422B2 (en) | Soldering method for leaded electronic components | |
| DE2810054A1 (en) | ELECTRONIC CIRCUIT DEVICE AND METHOD OF MANUFACTURING IT | |
| DE3146796A1 (en) | "ENCLOSURE FOR A SEMICONDUCTOR CHIP WITH INTEGRATED CIRCUIT" | |
| CA2077499C (en) | Pattern structure of a printed circuit board | |
| US5400953A (en) | Method of printing a bonding agent | |
| JP4023971B2 (en) | Chip type semiconductor device | |
| JP3294312B2 (en) | Manufacturing method of jumper chip | |
| JP3569264B2 (en) | Jumper chip manufacturing method | |
| CN1090892C (en) | Method for mfg. of double-side conductive metal foil type circuit board and products thereof | |
| JP3294313B2 (en) | Solder plating method on the inner surface of metal plate hole | |
| JP3041131B2 (en) | Method of applying ink to inner surface of hole of plate material | |
| JPH0564479B2 (en) | ||
| JPH05212852A (en) | Cream solder supplying mechanism | |
| JP3913121B2 (en) | Method for manufacturing a chip resistor having a low resistance value | |
| JPH03283484A (en) | Large current circuit board | |
| JP2606304B2 (en) | Cream solder printing method | |
| JPH0336319B2 (en) | ||
| JPS6259454B2 (en) | ||
| JP3080512B2 (en) | Wiring board for mounting surface mount components and component mounting connection method | |
| JPH0529102A (en) | Electronic part | |
| CH639516A5 (en) | CIRCUIT BOARD ASSEMBLED WITH COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF. | |
| DE19549536C2 (en) | Mfg. printed circuit assembly for construction of sub-assemblies in e.g. microwave electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080405 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090405 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090405 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100405 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110405 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110405 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |