JP3265488B2 - Manufacturing method of force / moment detecting device - Google Patents
Manufacturing method of force / moment detecting deviceInfo
- Publication number
- JP3265488B2 JP3265488B2 JP00401393A JP401393A JP3265488B2 JP 3265488 B2 JP3265488 B2 JP 3265488B2 JP 00401393 A JP00401393 A JP 00401393A JP 401393 A JP401393 A JP 401393A JP 3265488 B2 JP3265488 B2 JP 3265488B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting portion
- single crystal
- crystal substrate
- substrate
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Pressure Sensors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、力・モーメント検出
装置の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a force / moment detecting device.
【０００２】[0002]
【従来の技術】力・モーメント検出装置としては、例え
ば図１３に示すようなものがある。この検出装置は、同
図に示すように、機械的変形により電気抵抗が変化する
４個の検出素子を直線状に備えた単結晶基板２（シリコ
ンチップ）と、中央部をダイヤフラム部９１とした皿状
体９０を有し且つ前記ダイヤフラム部９１の底面中央か
ら突出させた軸部９２を有する起歪体９とから構成され
ており、前記単結晶基板２を皿状体９０の上面中央部に
張設している。2. Description of the Related Art As a force / moment detecting device, for example, there is one as shown in FIG. As shown in the figure, this detection device has a single crystal substrate 2 (silicon chip) linearly provided with four detection elements whose electric resistance changes due to mechanical deformation, and a diaphragm 91 at the center. A strain generating body 9 having a dish-shaped body 90 and having a shaft portion 92 protruding from the center of the bottom surface of the diaphragm portion 91. The single-crystal substrate 2 is placed at the center of the upper surface of the dish-shaped body 90. It is stretched.
【０００３】このものでは、軸部９２に外力が加わる
と、この外力の大きさ及び方向に応じて皿状体９０の上
面と単結晶基板２とが一体的に変形し、単結晶基板２の
変形態様に応じて各検出素子の電気抵抗が変化する。し
たがって、上記検出素子の電気抵抗の変化を電圧変化と
して図１８に示すＦＰＣ９３を介して取出すようにすれ
ば、軸部９２に作用する外力の方向及びその大きさを検
出することができる。In this device, when an external force is applied to the shaft portion 92, the upper surface of the dish-like body 90 and the single crystal substrate 2 are integrally deformed according to the magnitude and direction of the external force. The electric resistance of each detection element changes according to the modification. Therefore, if the change in the electric resistance of the detection element is taken out as a voltage change via the FPC 93 shown in FIG. 18, the direction and magnitude of the external force acting on the shaft 92 can be detected.
【０００４】上記装置は、以下の〜に示すようにし
て製造されている。 図１４に示すようなコバール（住友特殊金属（株）の
製造材料）で構成された丸棒９０’を切削加工して図１
５や図１６に示した起歪体９を製作する。この際、ダイ
ヤフラム部９１の加工には精度が非常に要求される。 上記起歪体９を金メッキする。 図１７に示すように、単結晶基板２を皿状体９０の上
面中央部にダイボンディングする。 図１８に示すように、ＦＰＣ９３を起歪体９の上面側
に取付け、ワイヤーＷをボンディングする。 図１３に示すように、単結晶基板２の表面を覆うべく
保護材Ｈを塗布し、キュアを行った後、同図に示すよう
に、金属キャップＣを溶接すると装置は完成する。The above device is manufactured as shown in the following (1) to (4). A round bar 90 'made of Kovar (manufactured by Sumitomo Special Metals Co., Ltd.) as shown in FIG.
5 and the flexure element 9 shown in FIG. At this time, the processing of the diaphragm portion 91 requires very high precision. The strain body 9 is plated with gold. As shown in FIG. 17, the single crystal substrate 2 is die-bonded to the center of the upper surface of the dish 90. As shown in FIG. 18, the FPC 93 is attached to the upper surface side of the strain body 9 and the wire W is bonded. As shown in FIG. 13, after applying a protective material H so as to cover the surface of the single crystal substrate 2 and performing curing, a metal cap C is welded as shown in FIG. 13 to complete the apparatus.
【０００５】しかしながら、上記力・モーメント検出装
置は、高コストであり、量産性に欠けるという問題があ
る。However, the above-mentioned force / moment detecting device has a problem that it is expensive and lacks mass productivity.
【０００６】[0006]
【発明が解決しようとする課題】そこで、この発明で
は、低コストであり且つ量産性に優れた力・モーメント
検出装置を提供することを課題とする。Accordingly, an object of the present invention is to provide a force / moment detecting device which is inexpensive and excellent in mass productivity.
【０００７】[0007]
【課題を解決するための手段】請求項１記載の発明の力
・モーメント検出装置は、平板状の基板取付部と、前記
基板取付部を囲むべく配列された多数のリードと、前記
基板取付部とリードとを繋ぐ接続部とから成るリードフ
レームが、前記基板取付部にボンデングされる単結晶基
板の熱膨張率に近い熱膨張率を有する金属板から形成さ
れており、前記基板取付部に検出素子を有した単結晶基
板がダイボンディングされていると共に前記検出素子と
リードとをワイヤーボンディングされており、前記接続
部、基板取付部及びリードの内方部分を包囲するキャッ
プがリードフレームに合成樹脂でモールディングして形
成されていると共に、上記した平板状の基板取付部にお
ける単結晶基板と対応する反対側面に、基板取付部を介
して単結晶基板に力を伝達するための軸部を有する起歪
体を合成樹脂でモールディングして形成してある。According to a first aspect of the present invention, there is provided a force / moment detecting apparatus, comprising: a flat board mounting portion; a plurality of leads arranged to surround the board mounting portion; A lead frame formed of a metal plate having a thermal expansion coefficient close to that of the single crystal substrate bonded to the substrate mounting portion, and a lead frame formed of a metal plate having a coefficient of thermal expansion close to that of the single crystal substrate bonded to the substrate mounting portion. A single crystal substrate having an element is die-bonded and the detection element and the lead are wire-bonded, and a cap surrounding the connection part, the substrate mounting part and the inner part of the lead is formed of a synthetic resin on a lead frame. On the other side corresponding to the single crystal substrate in the above-mentioned flat substrate mounting portion, the single crystal substrate is formed via the substrate mounting portion. It is formed by molding a synthetic resin strain body having a shank for transmitting.
【０００８】請求項２記載の発明の力・モーメント検出
装置は、平板状の基板取付部と、前記基板取付部を囲む
べく配列された多数のリードと、前記基板取付部とリー
ドとを繋ぐ接続部とから成るリードフレームが、前記基
板取付部にボンデングされる単結晶基板の熱膨張率に近
い熱膨張率を有する金属板から形成されており、前記基
板取付部に検出素子を有した単結晶基板がダイボンディ
ングされていると共に前記検出素子とリードとをワイヤ
ーボンディングされており、前記接続部、基板取付部及
びリードの内方部分を包囲するキャップがリードフレー
ムに合成樹脂でモールディングして形成されていると共
に、上記した平板状の基板取付部における単結晶基板と
対応する反対側面に、基板取付部を介して単結晶基板に
力を伝達するための金属製の軸部を溶接してある。According to a second aspect of the present invention, there is provided a force / moment detecting device, comprising: a flat board mounting portion; a plurality of leads arranged to surround the board mounting portion; and a connection connecting the board mounting portion and the lead. And a lead frame formed of a metal plate having a coefficient of thermal expansion close to the coefficient of thermal expansion of the single crystal substrate bonded to the substrate mounting portion, and having a detection element in the substrate mounting portion. The substrate is die-bonded and the detection element and the lead are wire-bonded, and the cap surrounding the connection part, the substrate mounting part and the inner part of the lead is formed by molding a lead frame with a synthetic resin. In addition, on the opposite side corresponding to the single crystal substrate in the above-mentioned flat substrate mounting portion, to transmit a force to the single crystal substrate via the substrate mounting portion. It is welded to the shaft portion of the metal.
【０００９】[0009]
【作用】この発明は次の作用を有する。 （請求項１記載の発明の作用）単結晶基板の熱膨張率に
近い熱膨張率を有する金属板がそのまま基板取付部とな
るから、従来の技術に記載したもののように非常に精度
が要求されるダイヤフラム部１１の切削加工が不要とな
り、又、リードフレームのリードがそのまま端子となる
からＦＰＣが不要となり、その結果、コストダウンでき
ると共に量産性が優れたものとなる。 （請求項２記載の発明の作用）上記請求項１記載の発明
の作用を有すると共に、この発明では、樹脂モールドに
より同時にボディとなる部分を複数個形成できるから、
更に、コストダウン化及び量産性の向上が図れる。The present invention has the following functions. (Operation of the Invention of Claim 1) Since a metal plate having a coefficient of thermal expansion close to that of a single crystal substrate serves as a substrate mounting portion as it is, very high precision is required as described in the prior art. This eliminates the need for cutting the diaphragm portion 11, and eliminates the need for an FPC because the lead of the lead frame becomes a terminal as it is. As a result, the cost can be reduced and the mass productivity is excellent. (Function of the Invention of Claim 2) In addition to having the function of the invention of the above-described claim 1, in the present invention, a plurality of portions which become a body at the same time can be formed by resin molding.
Further, cost reduction and improvement in mass productivity can be achieved.
【００１０】[0010]
【実施例】以下、この発明の構成を実施例として示した
図面に従って説明する。この実施例の力・モーメント検
出装置では、起歪体１を、図１〜図３に示すように、裏
面中央部を凹ませて薄肉部１１を形成した皿状部１０
と、前記薄肉部１１の裏面側中央に立設させた軸部１２
と、前記皿状部１０における表面中央部に設けられ且つ
単結晶基板２の熱膨張率に近い熱膨張率を有する金属板
により構成された基板取付部３０とから構成してあり、
前記基板取付部３０上に検出素子を具備させた単結晶基
板２をダイボンディングすると共に、上記皿状部１０に
おける基板取付部３０の外方部分に多数のリード３１を
配置させ、前記単結晶基板２に具備させた検出素子とリ
ード３１とを適正にワイヤーＷをボンディングしてい
る。そして、図１に示すように、単結晶基板２をこれの
回りに小空間Ｋを形成させるようにしてキャップ４で被
蓋してある。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention. In the force / moment detecting device of this embodiment, as shown in FIG. 1 to FIG.
And a shaft portion 12 erected at the center of the back side of the thin portion 11.
And a substrate mounting portion 30 provided at the center of the surface of the dish-shaped portion 10 and formed of a metal plate having a coefficient of thermal expansion close to the coefficient of thermal expansion of the single crystal substrate 2,
The single crystal substrate 2 having the detection element is die-bonded on the substrate mounting portion 30, and a large number of leads 31 are arranged outside the substrate mounting portion 30 in the dish-shaped portion 10. The wire W is appropriately bonded between the detection element provided in 2 and the lead 31. Then, as shown in FIG. 1, the single crystal substrate 2 is covered with a cap 4 so as to form a small space K around the single crystal substrate 2.
【００１１】起歪体１のうち、単結晶基板２を除いた部
分である皿状部１０と軸部１２とは合成樹脂で一体的に
成型してある。基板取付部３０及びリード３１は、コバ
ールや４２アロイ等が使用されている。キャップ４は、
上記した起歪体１を構成する合成樹脂と同様の合成樹脂
で構成されている。The dish-shaped portion 10 and the shaft portion 12 of the strain body 1 excluding the single crystal substrate 2 are integrally formed of synthetic resin. Kovar, 42 alloy, or the like is used for the substrate mounting portion 30 and the lead 31. Cap 4
It is made of the same synthetic resin as the synthetic resin constituting the strain generating element 1 described above.
【００１２】この実施例の検出装置は上記の如く構成さ
れており、以下に示す工程により製作できる。第１工程 先ず、単結晶基板２の熱膨張率に近い熱膨張率を有する
金属板（コバール，４２アロイ等）から、図４に示すよ
うな、単結晶基板２が張設される複数の基板取付部３０
とこれらをそれぞれ取囲むべく配列された多数のリード
３１とこれら相互を繋ぐ接続部３２から成るリードフレ
ーム３を製作する。第２工程 次ぎに、図５や図６に示すように、機械的変化により電
気抵抗が変化する検出素子を有した単結晶基板２を上記
した各基板取付部３０に張設し、前記検出素子とリード
３１相互間を適正にワイヤーＷをボンディングする。第３工程 続いて、図７に示すように、表面保護材５を塗布し、キ
ャップ４となる上部側を合成樹脂でモールディングす
る。第４工程 そして、図８に示すように、皿状部１０と軸部１２とな
る下部側を樹脂でモールディングする。The detecting device of this embodiment is configured as described above, and can be manufactured by the following steps. First Step First, as shown in FIG. 4, a plurality of substrates on which the single crystal substrate 2 is stretched from a metal plate (such as Kovar or 42 alloy) having a thermal expansion coefficient close to that of the single crystal substrate 2. Mounting part 30
Then, a lead frame 3 including a plurality of leads 31 arranged so as to surround them and connecting portions 32 connecting these leads to each other is manufactured. Next to the second step , as shown in FIGS. 5 and 6, a single crystal substrate 2 having a detecting element whose electric resistance changes due to a mechanical change is stretched over each of the above-mentioned substrate mounting portions 30, and The wire W is appropriately bonded between the lead and the lead 31. Subsequently to the third step , as shown in FIG. 7, a surface protective material 5 is applied, and the upper side serving as the cap 4 is molded with a synthetic resin. Fourth step Then, as shown in FIG. 8, the lower side of the dish-shaped portion 10 and the shaft portion 12 is molded with resin.
【００１３】尚、この工程におけるモールディングは第
３工程のそれと同時に行うようにしてもよい。第５工程 その後、図９に示すように、リードフレーム３から接続
部３２を分離（二点鎖線ｎを切断）し、リード３１をフ
ォーミングすると、力・モーメント検出装置は完成す
る。The molding in this step may be performed simultaneously with that in the third step. After the fifth step , as shown in FIG. 9, when the connecting portion 32 is separated from the lead frame 3 (the broken line n is cut) and the lead 31 is formed, the force / moment detecting device is completed.
【００１４】尚、上記実施例にかえて、図１０に示すよ
うに、基板取付部３０の下面中央に金属棒６０を溶接
し、この金属棒６０を軸部１２内に位置させたものとす
ることができる。又、上記実施例にかえて、図１１に示
すように、小空間Ｋ内にシリコンゲル、シリコンオイル
を充填したものとすることもできる。Instead of the above-described embodiment, as shown in FIG. 10, a metal rod 60 is welded to the center of the lower surface of the substrate mounting portion 30, and this metal rod 60 is positioned in the shaft portion 12. be able to. Further, instead of the above embodiment, as shown in FIG. 11, the small space K may be filled with silicon gel or silicon oil.
【００１５】更に、上記実施例にかえて、軸部１２全体
を金属で構成させ、図１２に示すように基板取付部３０
の下面中央に溶接したものとすることもできる。そし
て、上記実施例ではＤＩＰタイプの計上の工程を説明し
たが、用途に応じてＰＬＣＣ，ＳＭＤ等の計上に仕上げ
ることも可能である。Further, instead of the above-described embodiment, the entire shaft portion 12 is made of metal, and as shown in FIG.
May be welded to the center of the lower surface. In the above embodiment, the DIP type accounting process has been described, but it is also possible to finish the accounting for PLCC, SMD, etc. according to the application.
【００１６】[0016]
【発明の効果】この発明は、上述の如くの構成を有する
ものであるから、次の効果を有する。作用に記載した内
容から、低コストであり且つ量産性に優れた力・モーメ
ント検出装置を提供できた。Since the present invention has the above configuration, it has the following effects. From the contents described in the operation, a low-cost force / moment detecting device excellent in mass productivity can be provided.
【図１】この発明の実施例の力・モーメント検出装置の
断面図。FIG. 1 is a sectional view of a force / moment detecting device according to an embodiment of the present invention.
【図２】図１のＡ−Ａ断面図。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】前記力・モーメント検出装置の側面図。FIG. 3 is a side view of the force / moment detecting device.
【図４】前記力・モーメント検出装置の製作に使用され
るリードフレームの平面図。FIG. 4 is a plan view of a lead frame used for manufacturing the force / moment detecting device.
【図５】前記リードフレームの基板取付部の上面に単結
晶基板をボンディングすると共に前記単結晶基板とリー
ド相互間をワイヤーボンディングした状態を示す平面
図。FIG. 5 is a plan view showing a state where a single crystal substrate is bonded to an upper surface of a substrate mounting portion of the lead frame and wire bonding is performed between the single crystal substrate and the leads.
【図６】前記リードフレームの基板取付部の上面に単結
晶基板をダイボンディングした状態を示す側面図。FIG. 6 is a side view showing a state in which a single crystal substrate is die-bonded to an upper surface of a substrate mounting portion of the lead frame.
【図７】前記単結晶基板等に表面保護材を塗布し、キャ
ップとなる上部側を樹脂でモールディングした状態を示
す断面図。FIG. 7 is a cross-sectional view showing a state in which a surface protective material is applied to the single crystal substrate or the like and an upper side serving as a cap is molded with a resin.
【図８】前記リードフレームに皿状部と軸部となる下部
側を樹脂でモールディングした状態を示す断面図。FIG. 8 is a cross-sectional view showing a state in which a lower portion serving as a dish portion and a shaft portion is molded with resin on the lead frame.
【図９】前記リードフレームにおける接続部の切離し位
置を示す図。FIG. 9 is a view showing a disconnection position of a connection portion in the lead frame.
【図１０】他の形態を示す第１番目の力・モーメント検
出装置の断面図。FIG. 10 is a cross-sectional view of a first force / moment detecting device showing another embodiment.
【図１１】他の形態を示す第２番目の力・モーメント検
出装置の断面図。FIG. 11 is a sectional view of a second force / moment detecting device according to another embodiment.
【図１２】他の形態を示す第３番目の力・モーメント検
出装置の断面図。FIG. 12 is a sectional view of a third force / moment detecting device according to another embodiment.
【図１３】従来の力・モーメント検出装置の断面図。FIG. 13 is a sectional view of a conventional force / moment detecting device.
【図１４】従来の起歪体を形成するための素材を示す
図。FIG. 14 is a view showing a material for forming a conventional flexure element.
【図１５】従来の起歪体の外観斜視図。FIG. 15 is an external perspective view of a conventional flexure element.
【図１６】従来の起歪体の断面図。FIG. 16 is a cross-sectional view of a conventional flexure element.
【図１７】従来の起歪体に単結晶基板をダイボンディン
グした状態を示す断面図。FIG. 17 is a cross-sectional view showing a state where a single crystal substrate is die-bonded to a conventional strain body.
【図１８】従来の力・モーメント検出装置におけるＦＰ
Ｃ、ワイヤー、単結晶基板を示した斜視図。FIG. 18 shows an FP in a conventional force / moment detecting device.
The perspective view which showed C, the wire, and the single crystal substrate.
Ｗ ワイヤー ２ 単結晶基板 ３ リードフレーム ３０ 基板取付部 ３１ リード ３２ 接続部 W wire 2 Single crystal substrate 3 Lead frame 30 Board mounting part 31 Lead 32 Connection part
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) G01L 5/16 H01L 29/84 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) G01L 5/16 H01L 29/84
Claims (2)
を囲むべく配列された多数のリードと、前記基板取付部
とリードとを繋ぐ接続部とから成るリードフレームが、
前記基板取付部にボンデングされる単結晶基板の熱膨張
率に近い熱膨張率を有する金属板から形成されており、
前記基板取付部に検出素子を有した単結晶基板がダイボ
ンディングされていると共に前記検出素子とリードとを
ワイヤーボンディングされており、前記接続部、基板取
付部及びリードの内方部分を包囲するキャップがリード
フレームに合成樹脂でモールディングして形成されてい
ると共に、上記した平板状の基板取付部における単結晶
基板と対応する反対側面に、基板取付部を介して単結晶
基板に力を伝達するための軸部を有する起歪体を合成樹
脂でモールディングして形成してあることを特徴とする
力・モーメント検出装置。1. A lead frame comprising a flat board mounting portion, a number of leads arranged to surround the board mounting portion, and a connecting portion connecting the board mounting portion and the lead,
It is formed of a metal plate having a coefficient of thermal expansion close to the coefficient of thermal expansion of the single crystal substrate bonded to the substrate mounting portion,
A single crystal substrate having a detection element is die-bonded to the substrate mounting portion and the detection element and the lead are wire-bonded, and the cap surrounding the connection portion, the substrate mounting portion, and the inner portion of the lead is provided. Is formed on the lead frame by molding with a synthetic resin, and on the opposite side corresponding to the single crystal substrate in the above-mentioned flat substrate mounting portion, to transmit a force to the single crystal substrate via the substrate mounting portion. A force / moment detecting device characterized in that a strain body having a shaft portion is molded by synthetic resin.
を囲むべく配列された多数のリードと、前記基板取付部
とリードとを繋ぐ接続部とから成るリードフレームが、
前記基板取付部にボンデングされる単結晶基板の熱膨張
率に近い熱膨張率を有する金属板から形成されており、
前記基板取付部に検出素子を有した単結晶基板がダイボ
ンディングされていると共に前記検出素子とリードとを
ワイヤーボンディングされており、前記接続部、基板取
付部及びリードの内方部分を包囲するキャップがリード
フレームに合成樹脂でモールディングして形成されてい
ると共に、上記した平板状の基板取付部における単結晶
基板と対応する反対側面に、基板取付部を介して単結晶
基板に力を伝達するための金属製の軸部を溶接してある
ことを特徴とする力・モーメント検出装置。2. A lead frame comprising a flat board mounting portion, a number of leads arranged to surround the board mounting portion, and a connecting portion connecting the board mounting portion and the lead,
It is formed of a metal plate having a coefficient of thermal expansion close to the coefficient of thermal expansion of the single crystal substrate bonded to the substrate mounting portion,
A single crystal substrate having a detection element is die-bonded to the substrate mounting portion and the detection element and the lead are wire-bonded, and the cap surrounding the connection portion, the substrate mounting portion, and the inner portion of the lead is provided. Is formed on the lead frame by molding with synthetic resin, and on the opposite side corresponding to the single crystal substrate in the above-mentioned flat substrate mounting portion, to transmit a force to the single crystal substrate via the substrate mounting portion. A force / moment detecting device, characterized in that a metal shaft portion is welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00401393A JP3265488B2 (en) | 1993-01-13 | 1993-01-13 | Manufacturing method of force / moment detecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00401393A JP3265488B2 (en) | 1993-01-13 | 1993-01-13 | Manufacturing method of force / moment detecting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06213733A JPH06213733A (en) | 1994-08-05 |
| JP3265488B2 true JP3265488B2 (en) | 2002-03-11 |
Family
ID=11573092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00401393A Expired - Fee Related JP3265488B2 (en) | 1993-01-13 | 1993-01-13 | Manufacturing method of force / moment detecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3265488B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2546625B1 (en) * | 2011-07-12 | 2016-04-13 | Sensata Technologies, Inc. | Force sensor assembly and method for assembling a force sensor assembly |
-
1993
- 1993-01-13 JP JP00401393A patent/JP3265488B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06213733A (en) | 1994-08-05 |
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