JP3261841B2 - Multi-type wafer processing equipment - Google Patents
Multi-type wafer processing equipmentInfo
- Publication number
- JP3261841B2 JP3261841B2 JP33106393A JP33106393A JP3261841B2 JP 3261841 B2 JP3261841 B2 JP 3261841B2 JP 33106393 A JP33106393 A JP 33106393A JP 33106393 A JP33106393 A JP 33106393A JP 3261841 B2 JP3261841 B2 JP 3261841B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- vacuum
- transfer robot
- center
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manipulator (AREA)
- Image Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Image Analysis (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はマルチ式ウエ−ハ処理装
置に係り、特にウエ−ハ搬送ロボットのティ−チングを
自動で行うマルチ式ウエ−ハ処理装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-type wafer processing apparatus, and more particularly to a multi-type wafer processing apparatus for automatically teaching a wafer transfer robot.
【０００２】[0002]
【従来の技術】従来、特開平４−１４２２２号公報等に
示されているように搬送ロボットが設けられた搬送室の
周りに複数の処理室を設けた装置では、ウエ−ハ搬送ロ
ボットのティ−チングは、ウエ−ハ搬送ロボット付属の
コントロ−ラによって目視により手動で行っていた。2. Description of the Related Art Conventionally, as disclosed in Japanese Patent Application Laid-Open No. 4-14222, an apparatus provided with a plurality of processing chambers around a transfer chamber provided with a transfer robot has been proposed. The ching was manually performed visually by a controller attached to the wafer transfer robot.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術では、処
理室の数が増す程ティ−チングが複雑になっていき、ま
た、ロボットのウエ−ハ搬送位置を十分に確認出来ない
場合などは、視差によるずれが生じることがあった。つ
まり、ロボットのティ−チングを終えて実際にウエ−ハ
を搬送してみると、目的位置よりずれているということ
が起こり得た。In the above prior art, the teaching becomes more complicated as the number of processing chambers increases, and when the wafer transfer position of the robot cannot be sufficiently confirmed, for example, A shift due to parallax sometimes occurred. In other words, when the wafer was actually conveyed after the teaching of the robot, it could have shifted from the target position.
【０００４】本発明の目的は、ウエ−ハ搬送ロボットの
ティ−チングを短時間で且つ正確に行えるマルチ式ウエ
−ハ処理装置を提供することにある。[0004] It is an object of the present invention to provide a multi-type wafer processing apparatus capable of performing accurate and quick teaching of a wafer transfer robot.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、ウエ−ハの処理をそれぞれに実施可能な複数の真空
処理室と、複数の真空処理室が接続される真空搬送室
と、真空搬送室内に設けられたウエ−ハ搬送ロボット
と、複数の真空処理室にウエ−ハの配置面に対応させて
それぞれ設けたカメラと、それぞれのカメラからの映像
を入力しウエ−ハのずれを算出する制御手段と、ウエ−
ハ搬送ロボットの移動量を調整する制御手段とを設けた
ものである。In order to achieve the above object, a plurality of vacuum processing chambers capable of respectively performing wafer processing, a vacuum transfer chamber to which the plurality of vacuum processing chambers are connected, and a vacuum processing chamber are provided. A wafer transfer robot provided in the transfer chamber, cameras provided in a plurality of vacuum processing chambers corresponding to the wafer placement surfaces, and images from the respective cameras are input to shift the wafer. Control means for calculating;
(C) control means for adjusting the movement amount of the transfer robot.
【０００６】[0006]
【作用】ウエ−ハ搬送目的位置の上部に設けられたカメ
ラで、まず最初にカメラの画像中心がウエ−ハ搬送目的
位置の中心になるように固定する。その後、ウエ−ハ搬
送ロボットによりウエ−ハを搬送し、画像処理によりウ
エ−ハ搬送目的位置中心とウエ−ハ中心との偏差を求
め、補正された座標をロボットのコントロ−ラヘ転送す
る。このことにより、短時間で且つ正確なウエ−ハ搬送
ロボットの自動ティ−チングが行える。The camera provided above the wafer transfer target position is first fixed so that the image center of the camera is located at the center of the wafer transfer target position. Thereafter, the wafer is transferred by the wafer transfer robot, the deviation between the center of the wafer transfer target position and the center of the wafer is determined by image processing, and the corrected coordinates are transferred to the controller of the robot. Thus, the automatic teaching of the wafer transfer robot can be performed in a short time and accurately.
【０００７】[0007]
【実施例】本発明の一実施例を図１により説明する。FIG. 1 shows an embodiment of the present invention.
【０００８】図１は、本発明のマルチ式ウエ−ハ処理装
置の構成を示す。図において、真空搬送室６の周りに
は、真空処理室８，１１と真空予備室４とがあり、真空
処理室８，１１には、ウエ−ハを処理する際にウエ−ハ
を乗せるための試料台９，１２が、また、真空予備室４
内にはウエ−ハ投入ステ−ション５があり、これらの間
でウエ−ハを搬送する真空搬送ロボット７が真空搬送室
６内にある。また、中心位置マ−ク付ウエ−ハ１４や被
処理ウエ−ハ１７等を収容しているウエ−ハカセットホ
ルダ１と、そこに収容されたウエ−ハを取り出しウエ−
ハ位置を補正するためのウエ−ハ位置ステ−ション３
と、ウエ−ハ投入ステ−ション５の間でウエ−ハを搬送
するための大気搬送ロボット２がある。また、試料台
９，１２の上部には、それぞれカメラ１０，１３が取外
し可能に設けられている。カメラ１０，１３は、画像処
理装置１５へ接続されており、そこで処理されたデ−タ
を転送するために画像処理装置１５とロボットコントロ
−ラ１６が接続されている。FIG. 1 shows the configuration of a multi-type wafer processing apparatus according to the present invention. In the drawing, there are vacuum processing chambers 8 and 11 and a pre-vacuum chamber 4 around a vacuum transfer chamber 6, and the vacuum processing chambers 8 and 11 are used to load a wafer when processing the wafer. Of the vacuum preparatory chamber 4
There is a wafer loading station 5 inside, and a vacuum transfer robot 7 for transferring a wafer between them is located in a vacuum transfer chamber 6. Further, the wafer cassette holder 1 accommodating the wafer 14 having the center position mark, the wafer 17 to be processed, and the like, and the wafer accommodated therein are taken out.
Wafer position station 3 for correcting the c position
And an atmospheric transfer robot 2 for transferring a wafer between the wafer loading stations 5. Cameras 10 and 13 are provided on the sample tables 9 and 12 so that they can be removed. The cameras 10 and 13 are connected to an image processing device 15, and the image processing device 15 and a robot controller 16 are connected to transfer the processed data there.
【０００９】次に、上記のように構成された装置の動作
について説明する。ウエ−ハカセットホルダ１に収容さ
れている中心位置マ−ク付ウエ−ハ１４は、大気搬送ロ
ボット２によって取り出されウエ−ハ位置ステ−ション
３へ運ばれ、そこで中心位置マ−ク付ウエ−ハ１４の位
置補正が行われる。位置補正が行われた中心位置マ−ク
付ウエ−ハ１４は、大気搬送ロボット２によって真空予
備室４内のウエ−ハ投入ステ−ション５へ運ばれる。な
お、この場合の大気搬送ロボット２による搬送は、オリ
フラ合わせ及び中心位置合わせ技術により正しく搬送さ
れるものとする。目的の正しい位置に置かれた中心位置
マ−ク付ウエ−ハ１４を、真空搬送ロボット７は手動で
ティ−チングを行いずれることなく受取り、そこの座標
を原点とする。Next, the operation of the apparatus configured as described above will be described. The wafer 14 with the center position mark accommodated in the wafer cassette holder 1 is taken out by the atmospheric transfer robot 2 and carried to the wafer position station 3, where the wafer with the center position mark is placed. The position correction of (c) is performed. The wafer 14 with the center position mark subjected to the position correction is carried by the atmospheric transfer robot 2 to the wafer loading station 5 in the vacuum preliminary chamber 4. In this case, the transport by the atmospheric transport robot 2 is assumed to be correctly transported by the orientation flat alignment and center alignment techniques. The vacuum transfer robot 7 receives the wafer 14 with the center position mark placed at the intended correct position without manually teaching, and uses the coordinates there as the origin.
【００１０】真空搬送ロボット７によって中心位置マ−
ク付ウエ−ハ１４は真空搬送室６を通り真空処理室８内
にある試料台９へ運ばれる。そこでカメラ１０の画像中
心を試料台９の中心に固定しておき、ウエ−ハ中心位置
のマ−クと試料台９の中心位置とを画像処理装置１５に
よって処理を行い座標の偏差を求める。求めた座標の偏
差を画像処理装置１５よりロボットコントロ−ラ１６へ
転送する。ロボットコントロ−ラ１６は、座標の偏差分
の補正を行い、真空搬送ロボット７は正しくティ−チン
グされる。また、試料台９の中心位置を原点とし真空処
理室１１においても試料台１２の中心位置とウエ−ハの
中心位置とをカメラ１３によって画像処理することによ
り、真空搬送ロボット７は正しくティ−チングされる。The center position mark is created by the vacuum transfer robot 7.
The wafer 14 is transferred to the sample table 9 in the vacuum processing chamber 8 through the vacuum transfer chamber 6. Therefore, the center of the image of the camera 10 is fixed to the center of the sample table 9, and the mark of the wafer center position and the center position of the sample table 9 are processed by the image processing device 15 to obtain the coordinate deviation. The obtained coordinate deviation is transferred from the image processing device 15 to the robot controller 16. The robot controller 16 corrects the deviation of the coordinates, and the vacuum transfer robot 7 is correctly taught. Also, the center position of the sample table 9 and the center position of the wafer in the vacuum processing chamber 11 are image-processed by the camera 13 in the vacuum processing chamber 11 so that the vacuum transfer robot 7 can correctly teach. Is done.
【００１１】以下同様にして処理室の数だけティ−チン
グを行う。そして、最後の処理室からウエ−ハ投入ステ
−ション５の最初の原点の座標までのティ−チングは、
従来と同様のティ−チングを行う。そして、中心位置マ
−ク付ウエ−ハ１４は大気搬送ロボット２によってウエ
−ハカセットホルダ１に収容し、その後被処理ウエ−ハ
１７を取り出し、通常の処理に移行する。また、通常ウ
エ−ハ処理運転中であっても、中心位置マ−ク付ウエ−
ハ１４をウエ−ハカセットホルダ１にセットするだけ
で、いつでも真空搬送ロボット７のティ−チングが自動
で行える。In the same manner, teaching is performed for the number of processing chambers. The teaching from the last processing chamber to the coordinates of the first origin of the wafer loading station 5 is as follows.
The same teaching as in the related art is performed. Then, the wafer 14 with the center position mark is housed in the wafer cassette holder 1 by the atmospheric transfer robot 2, and thereafter, the wafer 17 to be processed is taken out, and the process proceeds to normal processing. Also, even during the normal wafer processing operation, the wafer with the center position mark is used.
The teaching of the vacuum transfer robot 7 can be automatically performed at any time simply by setting the wafer 14 on the wafer cassette holder 1.
【００１２】これによって、ティ−チング回数が各処理
室１回で済み、短時間で且つ正確なウエ−ハ搬送ロボッ
トの自動ティ−チングが行える。Thus, the number of times of teaching is only one for each processing chamber, and the automatic teaching of the wafer transfer robot can be performed quickly and accurately.
【００１３】[0013]
【発明の効果】本発明によれば、初期設定段階もしくは
通常ウエ−ハ処理運転中であっても、カメラを使い画像
処理を用いることによって、目視による視差がなくなり
各処理室毎に一回のティ−チングを行えば良いので、短
時間で且つ正確なティ−チングを自動で行うことが出来
る。According to the present invention, even in the initial setting stage or during the normal wafer processing operation, by using the camera and performing image processing, the visual parallax is eliminated, and once in each processing chamber. Since teaching may be performed, accurate teaching can be automatically performed in a short time.
【図１】本発明の一実施例であるマルチ式ウエ−ハ処理
装置の構成図である。FIG. 1 is a configuration diagram of a multi-type wafer processing apparatus according to an embodiment of the present invention.
【符号の説明】 １…ウエ−ハカセットホルダ、２…大気搬送ロボット、
３…ウエ−ハ位置ステ−ション、４…真空予備室、５…
ウエ−ハ投入ステ−ション、６…真空搬送室、７…真空
搬送ロボット、８…真空処理室、９…試料台、１０…カ
メラ、１１…真空処理室、１２…試料台、１３…カメ
ラ、１４…中心位置マ−ク付ウエ−ハ、１５…画像処理
装置、１６…ロボットコントロ−ラ、１７…被処理ウエ
−ハ。[Description of symbols] 1 ... wafer cassette holder, 2 ... atmosphere transfer robot,
3 ... wafer position station, 4 ... vacuum spare chamber, 5 ...
Wafer loading station, 6: vacuum transfer chamber, 7: vacuum transfer robot, 8: vacuum processing chamber, 9: sample table, 10: camera, 11: vacuum processing chamber, 12: sample table, 13: camera, 14: Wafer with center position mark, 15: Image processing device, 16: Robot controller, 17: Wafer to be processed.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/68 B25J 9/22 B65G 49/07 H01L 21/02 ──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. 7 , DB name) H01L 21/68 B25J 9/22 B65G 49/07 H01L 21/02
Claims (1)
数の真空処理室と、 前記複数の真空処理室が接続される真空搬送室と、ウエーハカセットホルダからウエーハを取り出し、ウエ
ーハ位置ステーションへウエーハを搬送し、位置補正さ
れたウエーハを真空予備室内のウエーハ投入ステーショ
ンまで搬送する大気搬送ロボットと、 前記真空搬送室内に設けられ、前記ウエーハ投入ステー
ションから前記真空処理室内に設置された試料台へ前記
位置補正されたウエーハを搬送する真空搬送ロボット
と、 前記複数の真空処理室のそれぞれに設けられ、前記試料
台の中心位置に画像中心位置を合わせて固定したカメラ
と、 前記大気搬送ロボット及び前記真空搬送ロボットを制御
し、前記ウエーハカセットホルダに収納された中心位置
マーク付ウエーハを前記ウエーハ位置ステーション及び
ウエーハ投入ステーションを介して前記試料台へ搬送
し、前記試料台中心位置と前記試料台上の前記中心位置
マーク付ウエーハの中心とのずれを前記カメラからの映
像データにより算出し、前記算出結果により上記ずれを
補正するように前記真空搬送ロボットのティーチングを
行う制御手段とを有する ことを特徴とするマルチ式ウエ
ーハ処理装置。1. A plurality of vacuum processing chambers capable of respectively performing wafer processing, a vacuum transfer chamber to which the plurality of vacuum processing chambers are connected, and a wafer taken out from a wafer cassette holder.
Transfers the wafer to the wafer position station and corrects the position.
Wafer loading station in vacuum preparatory chamber
An atmospheric transfer robot for transferring the wafer to the vacuum transfer chamber, and the wafer loading stage provided in the vacuum transfer chamber.
To the sample stage installed in the vacuum processing chamber
Vacuum transfer robot that transfers the position-corrected wafer
And the sample provided in each of the plurality of vacuum processing chambers
Camera fixed with the center of the image aligned with the center of the table
When, controlling the atmospheric transfer robot and the vacuum transfer robot
And the center position stored in the wafer cassette holder.
The marked wafer is moved to the wafer position station and
Transfer to the sample stage via wafer loading station
The sample stage center position and the center position on the sample stage
The deviation from the center of the marked wafer is
Calculated from image data,
Teaching of the vacuum transfer robot to compensate
Multi-type wafer processing apparatus characterized by a control means for performing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33106393A JP3261841B2 (en) | 1993-12-27 | 1993-12-27 | Multi-type wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33106393A JP3261841B2 (en) | 1993-12-27 | 1993-12-27 | Multi-type wafer processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07193112A JPH07193112A (en) | 1995-07-28 |
| JP3261841B2 true JP3261841B2 (en) | 2002-03-04 |
Family
ID=18239448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33106393A Expired - Lifetime JP3261841B2 (en) | 1993-12-27 | 1993-12-27 | Multi-type wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3261841B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4576694B2 (en) | 2000-10-11 | 2010-11-10 | 東京エレクトロン株式会社 | Method for aligning transfer position of object processing system and object processing system |
| WO2002047153A1 (en) | 2000-12-08 | 2002-06-13 | Tokyo Electron Limited | Semiconductor processing system and method for transferring workpiece |
| US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
| US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
| KR101015778B1 (en) * | 2003-06-03 | 2011-02-22 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus and method for adjusting a substrate transfer position |
| CN100446210C (en) * | 2005-12-09 | 2008-12-24 | 北京圆合电子技术有限责任公司 | Silicon chip transmitting system with CCD sensor and transmitting method thereof |
| JP7374683B2 (en) * | 2019-09-19 | 2023-11-07 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate transfer device and hand position correction method for the substrate transfer device |
| JP7365924B2 (en) * | 2020-02-13 | 2023-10-20 | 東京エレクトロン株式会社 | teaching method |
-
1993
- 1993-12-27 JP JP33106393A patent/JP3261841B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07193112A (en) | 1995-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7097691B2 (en) | Teaching method | |
| JP3261841B2 (en) | Multi-type wafer processing equipment | |
| EP1387217A3 (en) | Lithography exposure apparatus having an evacuable reticle library coupled to a vacuum chamber | |
| US20200118853A1 (en) | Transport system and transport method | |
| KR102006067B1 (en) | Substrate processing apparatus and alignment method | |
| SG187402A1 (en) | Systems and methods for calibrating end effector alignment in a plasma processing system | |
| SG186664A1 (en) | Systems and methods for dynamic alignment beamcalibration | |
| WO2020008761A1 (en) | Screen-printing device and screen-printing method | |
| WO2004048048A1 (en) | Delivery position-aligning method for transportation system | |
| JPS6346466A (en) | Work alignment device for double-side exposure | |
| CN114952898A (en) | Robot system, device manufacturing apparatus, device manufacturing method, teaching position adjusting method, and computer-readable recording medium | |
| JPH0795639B2 (en) | Automatic position shift correction method on production line | |
| TW202019643A (en) | Robot system and coupling method | |
| JP2016062909A (en) | Substrate transfer system, substrate transfer method, lithography device, and manufacturing method for article | |
| CN111199903A (en) | Suspension type carrying equipment and positioning method for semiconductor wafer box | |
| US20070278191A1 (en) | Method and Apparatus for Automatically Processing Multiple Applications in a Predetermined Order to Affect Multi-application Sequencing | |
| KR102292337B1 (en) | Substrate transport robot automatic teaching apparatus | |
| JP2008286925A (en) | Method for adjusting initial position and posture of exposure mask | |
| JP2572380B2 (en) | LSI inspection handling system | |
| US5583756A (en) | Teaching method and teaching system for a bonding coordinate | |
| KR101478230B1 (en) | Teaching method of apparatus for manufacturing semiconductor | |
| JP2001092523A (en) | Method of teaching robot for carrier | |
| JP2002185189A (en) | Component-mounting machine and its model change work method | |
| JPH0918195A (en) | Part mounter | |
| JPH0471673B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071221 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081221 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081221 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091221 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101221 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101221 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111221 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111221 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121221 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131221 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term |