JP3252645B2 - Optical processing machine - Google Patents
Optical processing machineInfo
- Publication number
- JP3252645B2 JP3252645B2 JP08528295A JP8528295A JP3252645B2 JP 3252645 B2 JP3252645 B2 JP 3252645B2 JP 08528295 A JP08528295 A JP 08528295A JP 8528295 A JP8528295 A JP 8528295A JP 3252645 B2 JP3252645 B2 JP 3252645B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- laser
- laser beam
- laser light
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laser Beam Processing (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気部品等の精密加工
用の光加工機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical processing machine for precision processing of electric parts and the like.
【０００２】[0002]
【従来の技術】近年、光エネルギーを利用した光加工機
の進歩が著しく、特に、レーザ発振器の進歩にともなっ
て、電気部品等の精密金属部材の精密接合や精密窄孔・
切断加工に光加工機が多用されている。2. Description of the Related Art In recent years, optical processing machines utilizing optical energy have made remarkable progress, and in particular, with the advancement of laser oscillators, precision joining of precision metal members such as electrical parts and precision porosity / holes.
Optical processing machines are frequently used for cutting.
【０００３】以下に従来の光加工機について説明する。
図５は従来の光加工機の、熱容量が大きく異なる２つの
金属部材の接合への使用例を示すものである。図５にお
いて、１１はレーザ発振器、１２はレーザ伝達ファイバ
ー、１３は出射ユニット、１６，１７は被加工部材で、
ここでは熱容量が約１：２の２つの部材、第１接合端子
１６と第２接合端子１７を糸ハンダ１８を用いてハンダ
付け加工する例を示した。１５は出射ユニット１３から
出射され被加工部材１６，１７に照射されるレーザ光で
ある。[0003] A conventional optical processing machine will be described below.
FIG. 5 shows an example of use of a conventional optical processing machine for joining two metal members having greatly different heat capacities. In FIG. 5, 11 is a laser oscillator, 12 is a laser transmission fiber, 13 is an emission unit, 16 and 17 are workpieces,
Here, an example is shown in which two members having a heat capacity of about 1: 2, the first joint terminal 16 and the second joint terminal 17 are soldered using the thread solder 18. Reference numeral 15 denotes a laser beam emitted from the emission unit 13 and applied to the workpieces 16 and 17.
【０００４】以上のように構成された光加工機につい
て、その動作を説明する。まず、レーザ発振器１１で発
振したレーザ光がレーザ伝達ファイバー１２で出射ユニ
ット１３へ導かれ、出射ユニット１３で集光して出射さ
れる。出射されたレーザ光１５は、被加工部材に照射さ
れこれにより第１接合端子１６と第２接合端子１７がと
もに加熱され、同時に加熱溶融された糸ハンダ１８によ
り接合加工が行われる。[0004] The operation of the optical processing machine configured as described above will be described. First, the laser light oscillated by the laser oscillator 11 is guided to the emission unit 13 by the laser transmission fiber 12, and is condensed and emitted by the emission unit 13. The emitted laser light 15 is applied to the member to be processed, whereby the first joint terminal 16 and the second joint terminal 17 are both heated. At the same time, the joint processing is performed by the heated and melted thread solder 18.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
従来の構成では、第１接合端子１６と第２接合端子１７
の熱容量が大きく異なる場合には、熱容量が小さい第１
接合端子１６の熱容量に適したレーザエネルギーで接合
を行うと、熱容量が大きい第２接合端子１７は溶融不足
となり良好な接合ができない。逆に、第２接合端子１７
の熱容量に適したレーザエネルギーで接合を行うと第１
接合端子１６は焼損し外観を損なうなど、加工安定性や
品質が低下するという問題点を有していた。また、特に
光加工の特徴として、加工部材の光反射率の違いによっ
ても、同様な溶融不足や焼損を生じやすいという問題点
を有していた。However, in the above-mentioned conventional structure, the first joint terminal 16 and the second joint terminal 17 are not provided.
If the heat capacities of the first and second heat exchangers differ greatly,
When joining is performed with laser energy suitable for the heat capacity of the joining terminal 16, the second joining terminal 17 having a large heat capacity is insufficiently melted, and good joining cannot be performed. Conversely, the second joint terminal 17
When joining with laser energy suitable for the heat capacity of
The joint terminal 16 has a problem that the processing stability and quality are deteriorated, for example, the joint terminal 16 is damaged by burning. In addition, as a feature of the optical processing, there is a problem that similar insufficient melting and burning are likely to occur even when the light reflectance of the processed member is different.
【０００６】本発明は上記従来の問題点を解決するもの
で、熱容量あるいは光反射率が大きく異なる２つの被加
工部材の接合・窄孔・切断に使用しても、溶融不足や焼
損を生じることのない、加工安定性がよく外観も優れ
た、高品質加工ができる光加工機を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. Even when the present invention is used for joining, narrowing, or cutting two workpieces having significantly different heat capacities or light reflectances, insufficient melting or burnout occurs. It is an object of the present invention to provide an optical processing machine which is free from defects, has excellent processing stability and excellent appearance, and can perform high quality processing.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明の光加工機は、複数の被加工部材を接合、窄
孔、切断のいずれかをするときに各被加工部材毎にそれ
ぞれ異なった照射エネルギーのレーザ光を照射する複合
エネルギー光照射手段を備え、前記複合エネルギー光照
射手段が、光発生手段と、この光発生手段から出射され
たレーザ光を反射するレーザ光反射用ミラーと、前記レ
ーザ光反射用ミラーで反射されたレーザ光を各被加工部
材上に集光するｆ−θレンズを有している。In order to achieve this object, an optical machining apparatus according to the present invention joins a plurality of members to be processed and forms a plurality of members.
Hole, comprising a composite energy beam irradiation means for irradiating a laser beam irradiation energy different from each for each workpiece when the one of the cutting, the composite energy light irradiation
Light emitting means, and light emitted from the light generating means.
A laser beam reflecting mirror for reflecting the reflected laser beam;
Laser light reflected by the laser light reflection mirror
It has an f-θ lens that focuses light on the material .
【０００８】[0008]
【作用】この構成において、複合エネルギー光照射手段
はエネルギー分布の異なるビームゾーンを持つ光ビーム
を発生して、複数の被加工部材を接合するときに、各被
加工部材毎に異なる照射エネルギーの光を照射する。こ
れによって、各被加工部材毎の熱容量および照射光反射
率に応じて最も適当なエネルギーバランスの光を照射す
ることができる。In this configuration, the composite energy light irradiating means generates light beams having beam zones having different energy distributions and, when joining a plurality of workpieces, emits light beams having different irradiation energies for each workpiece. Is irradiated. Thereby, it is possible to irradiate light having the most appropriate energy balance according to the heat capacity and the irradiation light reflectance of each workpiece.
【０００９】[0009]
（実施例１）以下本発明の第１の実施例について、図面
を参照しながら説明する。(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings.
【００１０】図１において、１はレーザ発振器、３はレ
ーザ光５を被加工部材に集光させる出射ユニット、２は
レーザ発振器が発振したレーザ光５を出射ユニット３に
伝達するレーザ伝達ファイバー、４は出射ユニット内に
配置され、レーザ光を局部的に減衰させる局部減衰フィ
ルターであり、異なった光透過率を持つ２つの部分、す
なわちレーザ透過率が５０％の無色ガラスからなる低透
過率部分４ａと、１００％透過レンズからなる１００％
透過部分４ｂとからなっている。１０は出射ユニット３
および局部減衰フィルター４を冷却する冷却装置であ
る。１６は被加工部材である第１接合端子、１７は同じ
く第２接合端子で、この２つの被加工部材は光反射率が
等しく、第１接合端子１６と第２接合端子１７の熱容量
比は約１：２である。本実施例では、この２つの被加工
部材を糸ハンダ１８を用いてハンダ付け加工したが、ハ
ンダ付け加工を可能にするエネルギーは、第１接合端子
１６が１０Ｗ、第２接合端子１７が２０Ｗであった。な
お、本発明に直接関係しないその他の構成要素について
は図示と説明を省略した。In FIG. 1, 1 is a laser oscillator, 3 is an emission unit for condensing a laser beam 5 on a workpiece, 2 is a laser transmission fiber for transmitting the laser beam 5 oscillated by the laser oscillator to the emission unit 3, 4 Is a local attenuation filter which is disposed in the emission unit and locally attenuates the laser light, and has two portions having different light transmittances, that is, a low transmittance portion 4a made of colorless glass having a laser transmittance of 50%. And a 100% transmission lens
And a transmission portion 4b. 10 is an emission unit 3
And a cooling device for cooling the local attenuation filter 4. Reference numeral 16 denotes a first joint terminal which is a member to be processed, and 17 denotes a second joint terminal. The two members to be processed have the same light reflectance, and the heat capacity ratio between the first joint terminal 16 and the second joint terminal 17 is approximately equal. 1: 2. In the present embodiment, the two workpieces are soldered using the thread solder 18. However, the energy required for the soldering is 10 W for the first joint terminal 16 and 20 W for the second joint terminal 17. there were. Illustration and explanation of other components not directly related to the present invention are omitted.
【００１１】以上のように構成された光加工機につい
て、以下その動作を説明する。まず、レーザ発振器１が
発振したレーザ光５が、ビーム伝達ファイバー２によっ
て出射ユニット３に導かれ、局部減衰フィルター４を通
過して出射される。局部減衰フィルター４は５０％と１
００％の２つの光透過率を持つ同面積の２つの部分４
ａ，４ｂからなるので、レーザ光５は局部減衰フィルタ
ー４を通過するときビームの半分のゾーンのエネルギー
密度が半減する。これにより出射ユニット３から出射さ
れるレーザ光は局部的に１：２の比のエネルギー密度分
布ゾーンをもつレーザ光となり、この２つのゾーンがそ
れぞれ被加工部材である第１接合端子１６と第２接合端
子１７に照射される。The operation of the optical processing machine configured as described above will be described below. First, the laser light 5 oscillated by the laser oscillator 1 is guided to the emission unit 3 by the beam transmission fiber 2 and is emitted through the local attenuation filter 4. Local attenuation filter 4 is 50% and 1
Two portions 4 of the same area having two light transmittances of 00% 4
Since the laser light 5 passes through the local attenuation filter 4, the energy density of the half zone of the beam is reduced by half. As a result, the laser light emitted from the emission unit 3 becomes locally a laser light having an energy density distribution zone having a ratio of 1: 2, and the two zones are respectively a first joint terminal 16 and a second joint terminal 16 which are members to be processed. The light is applied to the joint terminal 17.
【００１２】このように、局部減衰フィルター４の異な
った光透過率を持つ２つの部分４ａと４ｂのそれぞれの
光透過率比とその範囲が、第１接合端子１６と第２接合
端子１７の熱容量比に整合するように構成されているの
で、被加工部材に照射されるレーザ光５は、第１接合端
子１６と第２接合端子１７にそれぞれ照射されるエネル
ギーバランスが適正になるようなエネルギー密度分布ゾ
ーンを持つ光レーザとなり、両接合端子１６，１７が過
不足なく加熱される。As described above, the respective light transmittance ratios and ranges of the two portions 4a and 4b of the local attenuation filter 4 having different light transmittances are determined by the heat capacity of the first joint terminal 16 and the second joint terminal 17. Since the laser beam 5 is irradiated to the member to be processed, the energy density of the laser beam 5 applied to the first joint terminal 16 and the second joint terminal 17 becomes appropriate. An optical laser having a distribution zone is obtained, and both the joint terminals 16 and 17 are heated without excess or shortage.
【００１３】以上のように本実施例によれば、出射ユニ
ット３内に配置され、異なった光透過率を持つ２つの部
分、すなわちレーザ透過率が５０％の無色ガラスからな
る低透過率部分４ａと、１００％透過レンズからなる１
００％透過部分４ｂとからなり、レーザ光５を局部的に
減衰させる局部減衰フィルター４を備えて、レーザ光５
をこの局部減衰フィルター４に通すことにより、エネル
ギー密度分布の異なる２つのビームゾーンを持つレーザ
光として、熱容量と光反射率が異なる２つの被加工部材
からなる被加工物を、溶融不足や焼損を生じることなく
接合することができる。As described above, according to the present embodiment, two portions having different light transmittances, that is, a low transmittance portion 4a made of colorless glass having a laser transmittance of 50% are arranged in the emission unit 3. And a 100% transmission lens
And a local attenuation filter 4 for attenuating the laser light 5 locally.
Is passed through the local attenuation filter 4 so that the laser beam having two beam zones having different energy density distributions is used to convert a workpiece composed of two workpieces having different heat capacities and light reflectivities into insufficient melting or burnout. Bonding can be performed without occurring.
【００１４】（実施例２）以下本発明の第２の実施例に
ついて、図面を参照しながら説明する。(Embodiment 2) A second embodiment of the present invention will be described below with reference to the drawings.
【００１５】図２において、１はレーザ発振器、６はレ
ーザ光分岐装置で、第１レーザ光反射分岐ミラー６ａと
第２レーザ光反射分岐ミラー６ｂとからなり、レーザ発
振器１から出射されたレーザ光５を２本のレーザ光ビー
ム５ａ，５ｂに分岐する。３ａ，３ｂはレーザ光ビーム
５ａ，５ｂを被加工部材に集光させる１組の出射ユニッ
ト、２ａ，２ｂはレーザ光ビーム５ａ，５ｂを出射ユニ
ット３ａ，３ｂに伝達するレーザ伝達ファイバー、１
６，１７は実施例１で用いたものと同じ被加工部材であ
る。In FIG. 2, reference numeral 1 denotes a laser oscillator, and 6 denotes a laser beam splitter, which comprises a first laser beam reflecting / branching mirror 6a and a second laser beam reflecting / branching mirror 6b. 5 is split into two laser light beams 5a and 5b. Reference numerals 3a and 3b denote a set of emission units for condensing the laser light beams 5a and 5b on a workpiece, and 2a and 2b denote laser transmission fibers for transmitting the laser light beams 5a and 5b to the emission units 3a and 3b.
Reference numerals 6 and 17 are the same workpieces used in the first embodiment.
【００１６】以上のように構成された光加工機につい
て、以下その動作を説明する。まず、レーザ発振器１が
発振したレーザ光５は、レーザ光分岐装置６で２本のレ
ーザ光ビーム５ａ，５ｂに分岐され、レーザ伝達ファイ
バー２ａ，２ｂと出射ユニット３ａ，３ｂを経て出射さ
れる。この２本のレーザ光ビーム５ａ，５ｂは、それぞ
れ被加工部材である第１接合端子１６と第２接合端子１
７に照射される。The operation of the optical processing machine configured as described above will be described below. First, the laser light 5 oscillated by the laser oscillator 1 is branched into two laser light beams 5a and 5b by the laser light branching device 6, and emitted through the laser transmission fibers 2a and 2b and the emission units 3a and 3b. The two laser light beams 5a and 5b are respectively supplied to a first joint terminal 16 and a second joint terminal 1 which are members to be processed.
7 is irradiated.
【００１７】このとき、レーザ光分岐装置６の第１レー
ザ光反射分岐ミラー６ａと第２レーザ光反射分岐ミラー
６ｂの反射係数を選択して、２本のレーザ光ビーム５
ａ，５ｂのエネルギー強度を、第１接合端子１６と第２
接合端子１７のそれぞれの熱容量と光反射率に適合する
ように約１：２に調整してあるので、実施例１と同様
に、被加工部材に照射されるレーザ光５は、第１接合端
子１６と第２接合端子１７にそれぞれ照射されるエネル
ギーバランスが適正になるようなエネルギー密度分布ゾ
ーンを持つレーザ光ビーム５ａ，５ｂとなり、両接合端
子１６，１７が過不足なく加熱される。At this time, the reflection coefficients of the first laser light reflecting / branching mirror 6a and the second laser light reflecting / branching mirror 6b of the laser light branching device 6 are selected, and the two laser light beams 5
a, 5b, the first joint terminal 16 and the second
Since the ratio is adjusted to about 1: 2 so as to conform to the heat capacity and the light reflectance of each of the joining terminals 17, the laser beam 5 applied to the workpiece is applied to the first joining terminal in the same manner as in the first embodiment. The laser light beams 5a and 5b have energy density distribution zones so that the energy balance applied to the second and third bonding terminals 17 becomes appropriate, and both the bonding terminals 16 and 17 are heated without excess or shortage.
【００１８】以上のように本実施例によれば、第１レー
ザ光反射分岐ミラー６ａと第２レーザ光反射分岐ミラー
６ｂとからなるレーザ光分岐装置６と、１組の出射ユニ
ット３ａ，３ｂとを備えて、分岐された２本のレーザ光
ビーム５ａ，５ｂのエネルギー強度を調整することによ
り、エネルギー密度分布の異なる２つのビームゾーンを
持つレーザ光として、熱容量と光反射率が異なる２つの
被加工部材からなる被加工物を、溶融不足や焼損を生じ
ることなく接合することができる。As described above, according to the present embodiment, the laser beam splitting device 6 including the first laser beam reflecting splitting mirror 6a and the second laser beam reflecting splitting mirror 6b, and a pair of emission units 3a and 3b. By adjusting the energy intensity of the two split laser light beams 5a and 5b, the two laser beams having two beam zones with different energy density distributions can be used as two laser beams having different heat capacities and different light reflectivities. A workpiece made of a processed member can be joined without causing insufficient melting or burning.
【００１９】（実施例３）以下本発明の第３の実施例に
ついて、図面を参照しながら説明する。Embodiment 3 Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.
【００２０】図３において、１はレーザ発振器、２はレ
ーザ伝達ファイバー、１６，１７は実施例１で使用した
ものと同じ被加工部材である。７は図示を省略した出射
ユニット内に配置したレーザ光５を反射振動させるレー
ザ光振動反射ミラーで、モーターと回転−振動変換機
（いずれも図示せず）によりレーザ光振動反射ミラー軸
７ａを軸として左右に微小回転振動するように構成され
ている。８はレーザ光を集光させるｆ−θレンズであ
る。In FIG. 3, 1 is a laser oscillator, 2 is a laser transmission fiber, and 16 and 17 are the same workpieces used in the first embodiment. Reference numeral 7 denotes a laser beam vibration reflection mirror which reflects and oscillates the laser beam 5 disposed in an emission unit (not shown). The laser beam reflection mirror shaft 7a is driven by a motor and a rotation-vibration converter (neither is shown). It is configured to vibrate minutely to the left and right. Reference numeral 8 denotes an f-θ lens for condensing laser light.
【００２１】以上のように構成された光加工機につい
て、以下その動作を説明する。まず、レーザ発振器１が
発振し、ビーム伝達ファイバー２によって導かれたレー
ザ光５は、出射ユニット内でレーザ光振動反射ミラー７
によって反射され、ｆ−θレンズ８を通過して出射され
る。このときレーザ光振動反射ミラー７を、レーザ光振
動反射ミラー軸７ａを軸として左右に微小回転振動する
と、レーザ光５は図３の５ａ，５ｂに示した範囲に振動
しながらｆ−θレンズ８に入射する。ｆ−θレンズ８で
は異なる部位に入射した光は異なる点に像を結ぶから、
被加工部材である第１接合端子１６と第２接合端子１７
に照射される照射点が微小振動する。このレーザ光振動
反射ミラー７の振動の角速度と振幅を、レーザ光５が第
１接合端子１６の上に照射される時間と第２接合端子１
７の上に照射される時間の比や照射位置を、それぞれの
熱容量と光反射率に適合するように制御してあるので、
被加工部材に照射されるレーザ光５は、第１接合端子１
６と第２接合端子１７にそれぞれエネルギーバランスが
適正になるように照射され、両接合端子１６，１７が過
不足なく加熱される。The operation of the optical processing machine configured as described above will be described below. First, the laser oscillator 1 oscillates, and the laser beam 5 guided by the beam transmission fiber 2 is transmitted to the laser beam oscillation reflection mirror 7 in the emission unit.
And is emitted through the f-θ lens 8. At this time, when the laser light vibration reflection mirror 7 is slightly rotated left and right about the laser light vibration reflection mirror axis 7a as an axis, the laser light 5 vibrates in the range shown by 5a and 5b in FIG. Incident on. In the f-θ lens 8, light incident on different parts forms images at different points,
The first joint terminal 16 and the second joint terminal 17 which are members to be processed
Irradiation point is slightly vibrated. The angular velocity and amplitude of the vibration of the laser light vibration reflecting mirror 7 are determined by the time during which the laser light 5 is irradiated onto the first joint terminal 16 and the second joint terminal 1.
Since the ratio of the time of irradiation on 7 and the irradiation position are controlled so as to conform to the respective heat capacities and light reflectances,
The laser beam 5 applied to the workpiece is applied to the first joint terminal 1.
6 and the second joint terminal 17 are respectively irradiated so that the energy balance becomes appropriate, and both joint terminals 16 and 17 are heated without excess or shortage.
【００２２】なお、レーザ光５の振動周波数が低すぎる
と、レーザ光が照射されていない方の接合端子の温度が
低下し、２つの接合端子１６および１７が素早く、同時
に溶融しにくくなるため、この振動周波数は１００Hz以
上が好ましかった。If the oscillation frequency of the laser beam 5 is too low, the temperature of the joint terminal not irradiated with the laser beam drops, and the two joint terminals 16 and 17 hardly melt quickly and simultaneously. This vibration frequency was preferably 100 Hz or more.
【００２３】以上のように本実施例によれば、左右に微
小振動するレーザ光振動反射ミラー７と、ｆ−θレンズ
８を備えて、レーザ光５をこのレーザ光振動反射ミラー
７で振動反射させることにより、第１接合端子１６と第
２接合端子１７にそれぞれ照射されるエネルギーバラン
スが適正になるように照射時間が設定され、熱容量と光
反射率が異なる２つの被加工部材からなる被加工物を、
溶融不足や焼損を生じることなく接合することができ
る。As described above, according to the present embodiment, the laser light vibration reflecting mirror 7 which slightly vibrates right and left and the f-θ lens 8 are provided, and the laser light 5 is vibrated and reflected by the laser light vibration reflecting mirror 7. Accordingly, the irradiation time is set so that the energy balance applied to each of the first joint terminal 16 and the second joint terminal 17 becomes appropriate, and the work is performed by two work members having different heat capacities and light reflectances. Things,
Joining can be performed without causing insufficient melting or burning.
【００２４】（実施例４）以下本発明の第４の実施例に
ついて、図面を参照しながら説明する。(Embodiment 4) Hereinafter, a fourth embodiment of the present invention will be described with reference to the drawings.
【００２５】図４において、１はレーザ発振器、６は第
１レーザ光反射分岐ミラー６ａ、第２レーザ光反射分岐
ミラー６ｂ、第３レーザ光反射分岐ミラー６ｃからなる
レーザ光分岐装置、９はレーザ光を集光するｆ−θレン
ズで、図示を省略した出射ユニット内に配置されてい
る。５ａは第１レーザ光反射分岐ミラー６ａで分岐した
第１分岐レーザ光、５ｂは第２分岐レーザ光、５ｃは第
３分岐レーザ光で、それぞれ第１ビーム伝達ファイバー
２ａ、第２ビーム伝達ファイバー２ｂ、第３ビーム伝達
ファイバー２ｃによって、ｆ−θレンズ９に導かれる。
このとき、ｆ−θレンズ９に対して、第２分岐レーザ光
５ｂと第３分岐レーザ光５ｃを同一位置に入射し、第１
分岐レーザ光５ａをこれと異なる他の位置に入射する。
５ｄはｆ−θレンズ９により集光され出射される第１出
射レーザ光、５ｅは同じく第２出射レーザ光である。第
１出射レーザ光５ｄは第１接合端子１６の接合部に、第
２出射レーザ光５ｅは第２接合端子１７の接合部に照射
するように構成されている。In FIG. 4, reference numeral 1 denotes a laser oscillator, 6 denotes a laser beam branching device including a first laser beam reflecting / branching mirror 6a, a second laser beam reflecting / branching mirror 6b, and a third laser beam reflecting / branching mirror 6c, and 9 denotes a laser beam. An f-θ lens for condensing light, which is arranged in an emission unit (not shown). Reference numeral 5a denotes a first branch laser beam branched by the first laser beam reflecting / branching mirror 6a, 5b denotes a second branch laser beam, and 5c denotes a third branch laser beam, which are the first beam transmission fiber 2a and the second beam transmission fiber 2b, respectively. , And the third beam transmission fiber 2c to the f-θ lens 9.
At this time, the second branched laser light 5b and the third branched laser light 5c enter the f-θ lens 9 at the same position,
The branched laser light 5a is incident on another different position.
Reference numeral 5d denotes a first emission laser beam condensed and emitted by the f-θ lens 9, and 5e denotes a second emission laser beam. The first emission laser light 5d is configured to irradiate the bonding portion of the first bonding terminal 16, and the second emission laser light 5e is configured to irradiate the bonding portion of the second bonding terminal 17.
【００２６】以上のように構成された光加工機につい
て、以下その動作を説明する。まず、レーザ発振器１が
発振したレーザ光５が、レーザ光分岐装置６により均等
なエネルギーのレーザ光５ａ，５ｂ，５ｃに分岐され、
ビーム伝達ファイバー２ａ，２ｂ，２ｃによりｆ−θレ
ンズ９に入射する。このとき、ｆ−θレンズ９の特性に
より、ｆ−θレンズ９への入射位置が同一である第２分
岐レーザ光５ｂと第３分岐レーザ光５ｃは、入射角度が
異なっていても、ｆ−θレンズ９からは同位置に焦点を
結ぶ一つの第２出射レーザ光５ｅとして出射される。ま
た、ｆ−θレンズ９に対して、第２・第３分岐レーザ光
５ｂ・５ｃの入射位置と異なる位置に入射する第１分岐
レーザ光５ａは、ｆ−θレンズ９からは、第２出射レー
ザ光５ｅと異なった位置に焦点を結ぶ第１出射レーザ光
５ｄとして出射される。なお、第１出射レーザ光５ｄの
焦点距離と第２出射レーザ光５ｅの焦点距離は同一であ
る。この２つの出射レーザ光は、それぞれ第１出射レー
ザ光５ｄは第１接合端子１６の接合部に、第２出射レー
ザ光５ｅは第２接合端子１７の接合部に照射される。The operation of the optical processing machine configured as described above will be described below. First, the laser beam 5 oscillated by the laser oscillator 1 is branched by the laser beam branching device 6 into laser beams 5a, 5b and 5c having equal energy.
The light enters the f-θ lens 9 through the beam transmission fibers 2a, 2b, and 2c. At this time, due to the characteristics of the f-θ lens 9, the second branched laser light 5b and the third branched laser light 5c having the same incident position on the f-θ lens 9 have the f-θ It is emitted from the θ lens 9 as one second emission laser beam 5e focused on the same position. The first branched laser light 5a incident on the f-θ lens 9 at a position different from the incident position of the second / third branched laser light 5b / 5c is output from the f-θ lens 9 by the second emission. It is emitted as first emission laser light 5d that focuses on a position different from the laser light 5e. The focal length of the first emission laser light 5d is the same as the focal length of the second emission laser light 5e. As for these two emitted laser lights, the first emitted laser light 5d is applied to the joint of the first joint terminal 16 and the second emitted laser light 5e is applied to the joint of the second joint terminal 17 respectively.
【００２７】このｆ−θレンズ９によって集光され出射
される第１出射レーザ光５ｄと第２出射レーザ光５ｅの
レーザエネルギー比が、第１接合端子１６と第２接合端
子１７のそれぞれの熱容量と光反射率に適合するよう
１：２に調整してあるので、実施例と同様に被加工部材
に照射されるレーザ光５ｄ，５ｅは、第１接合端子１６
と第２接合端子１７にそれぞれ照射されるエネルギーバ
ランスが適正になるようなエネルギー密度をもつレーザ
光となり、両接合端子１６，１７が過不足なく加熱され
る。The laser energy ratio between the first emitted laser light 5d and the second emitted laser light 5e collected and emitted by the f-θ lens 9 is determined by the heat capacity of each of the first joint terminal 16 and the second joint terminal 17. Is adjusted to 1: 2 so as to conform to the light reflectance, the laser beams 5d and 5e applied to the member to be processed are applied to the first joint terminal 16 in the same manner as in the embodiment.
Thus, the laser light having an energy density such that the energy balance applied to each of the second joint terminals 17 becomes appropriate is heated, and both the joint terminals 16 and 17 are heated without excess or shortage.
【００２８】以上のように本実施例によれば、レーザ光
分岐装置６と、ｆ−θレンズ９を備えて、レーザ光分岐
装置６により分岐した３条の分岐レーザ光５ａ，５ｂ，
５ｃをｆ−θレンズ９を介してレーザエネルギー密度の
異なる２条の出射レーザ光５ｄ，５ｅとすることによ
り、熱容量と光反射率が異なる２つの被加工部材からな
る被加工物を、溶融不足や焼損を生じることなく接合す
ることができる。As described above, according to the present embodiment, the laser beam splitting device 6 and the f-θ lens 9 are provided, and the three branched laser beams 5a, 5b,
5c is made into two emission laser beams 5d and 5e having different laser energy densities through the f-θ lens 9, so that a workpiece made of two workpieces having different heat capacities and light reflectances is not sufficiently melted. And can be joined without causing burnout.
【００２９】なお、第１の実施例において局部減衰フィ
ルターの低透過率部分４ａは、レーザ透過率が５０％の
無色ガラスとし、１００％透過部分４ｂはレーザエネル
ギー１００％透過レンズとしたが、低透過率部分４ａは
色ガラス、レーザビーム反射および吸収コーティング済
みガラス、ビームスピリッターなどとし、１００％透過
部分４ｂは何も配置しない構成としてもよい。また、低
透過率部分４ａのレーザ透過率は、被加工部材１６，１
７の熱容量比によって変更されるもので、レーザ透過率
の異なる低透過率部分４ａをもつ局部減衰フィルターを
交換自在に配置することによって、種々の熱容量や光反
射率を持つ組合せの被加工部材にも最適なエネルギーバ
ランスを得ることができる。また、局部減衰フィルター
４は、出射ユニット内に配置するとしたが、出射ユニッ
ト３の外部に配置して、出射ユニット３から出射したレ
ーザ光５を局部的に減衰しても上記と同様に良好な加工
を行うことができる。In the first embodiment, the low transmittance portion 4a of the local attenuation filter is a colorless glass having a laser transmittance of 50%, and the 100% transmittance portion 4b is a lens having a laser energy of 100%. The transmissive portion 4a may be a colored glass, a glass coated with a laser beam reflection and absorption coating, a beam spiriter, or the like, and the 100% transmissive portion 4b may be configured without any arrangement. Further, the laser transmittance of the low transmittance portion 4a is determined by the workpieces 16, 1
7 by changing the heat capacity ratio, and by arranging a local attenuation filter having a low transmittance portion 4a having a different laser transmittance so as to be exchangeable, a combination of workpieces having various heat capacities and light reflectances can be provided. Can also obtain the optimal energy balance. Further, although the local attenuation filter 4 is arranged inside the emission unit, the same good as described above can be obtained even if the local attenuation filter 4 is arranged outside the emission unit 3 and the laser light 5 emitted from the emission unit 3 is locally attenuated. Processing can be performed.
【００３０】また、第１の実施例においてレーザ光５の
ビーム径が極小となる点では、異なるエネルギー密度を
持つエネルギー分布ゾーンが重なり易いので、被加工部
材である接合端子１６，１７を置く位置を、レーザ光５
の焦点からずらした位置にすることにより、熱容量と光
反射率が異なる２つの接合端子１６，１７へ照射される
レーザ光５の最適なエネルギーバランスを効果的に得る
ことができた。また、冷却装置１０は送風機を図示した
が、出射ユニット３および局部減衰フィルター４に冷却
水を循環させる水冷式とすると一層効果的である。In the first embodiment, at the point where the beam diameter of the laser beam 5 is minimized, the energy distribution zones having different energy densities tend to overlap, so that the positions where the joint terminals 16 and 17 which are the members to be processed are placed. With laser light 5
The optimum energy balance of the laser beam 5 applied to the two bonding terminals 16 and 17 having different heat capacities and light reflectances can be effectively obtained by setting the position shifted from the focal point of the laser beam. Although the cooling device 10 is illustrated as a blower, it is more effective if the cooling device 10 is a water-cooled type in which cooling water is circulated through the emission unit 3 and the local attenuation filter 4.
【００３１】また、第２の実施例では２本のレーザ光ビ
ーム５ａ，５ｂを得るのに、レーザ光分岐装置６を用い
たが、２基のレーザ発振器を用いてもよいことは言うま
でもない。In the second embodiment, the laser beam splitter 6 is used to obtain the two laser beams 5a and 5b. However, it goes without saying that two laser oscillators may be used.
【００３２】また、第３の実施例ではレーザ光を、レー
ザ光振動反射用ミラー７で反射した後ｆ−θレンズ８で
集光するとしたが、ｆ−θレンズ８を通常の集光レンズ
に変え、レーザ光５を集光レンズを通過した後、レーザ
光振動反射用ミラー７で反射して振動する構成としても
よい。また、レーザ光５を振動するのに、レーザ光振動
反射用ミラー７で振動するとしたが、出射ユニットを出
射レーザ光の光軸に直角な振動軸の回りに振動しても同
様な効果が得られる。In the third embodiment, the laser beam is reflected by the laser beam reflecting mirror 7, and then condensed by the f-.theta. Lens 8. However, the f-.theta. Alternatively, after the laser beam 5 passes through the condenser lens, the laser beam 5 may be reflected and vibrated by the laser beam vibration reflecting mirror 7. Although the laser light 5 is oscillated by the laser light vibration reflecting mirror 7, the same effect can be obtained by oscillating the emission unit about an oscillation axis perpendicular to the optical axis of the emitted laser light. Can be
【００３３】なおまた、第４の実施例において、ｆ−θ
レンズ９の２つの異なる部分に入射するレーザ光を、レ
ーザ光分岐装置６を用いて３つの均等なエネルギー密度
のレーザ光５ａ，５ｂ，５ｃに分岐して、第２分岐レー
ザ光５ｂと第３分岐レーザ光５ｃをｆ−θレンズ９の同
一部分に、第１分岐レーザ光５ａをｆ−θレンズ９の他
の部分に入射するとしたが、２つのレーザ発振器１４，
１５を用いて２つの異なるエネルギーのレーザ光５を発
振して、ｆ−θレンズ９のそれぞれ異なる部分に入射さ
せてもよい。また、レーザ光分岐装置を用いて、２つの
エネルギー密度の異なるレーザ光として、２本のビーム
伝達ファイバー２を介してｆ−θレンズ９のそれぞれ異
なる部分に入射させてもよい。In the fourth embodiment, f-θ
The laser beam incident on two different portions of the lens 9 is split into three laser beams 5a, 5b, and 5c having the same energy density by using the laser beam splitter 6, and the second split laser beam 5b and the third It is assumed that the branched laser light 5c is incident on the same part of the f-θ lens 9 and the first branched laser light 5a is incident on the other part of the f-θ lens 9.
The laser beam 5 having two different energies may be oscillated by using the laser beam 15 and incident on different portions of the f-θ lens 9. Alternatively, two laser beams having different energy densities may be incident on different portions of the f-θ lens 9 via the two beam transmission fibers 2 using a laser beam splitter.
【００３４】また、ｆ−θレンズ９は１つとして２つの
位置にレーザ光を入射するとしたが、２つのｆ−θレン
ズを用いてもよい。また、ｆ−θレンズ９は３枚のレン
ズで構成したものを図示したが、これに限定されるもの
でないことは言うまでもない。Also, it is assumed that the laser light is incident on two positions as one f-θ lens 9, but two f-θ lenses may be used. Although the f-θ lens 9 is shown as being composed of three lenses, it is needless to say that the present invention is not limited to this.
【００３５】[0035]
【発明の効果】以上のように本発明は、複数の被加工部
材を接合するときに各被加工部材毎に異なった照射エネ
ルギーの光を照射する複合エネルギー光照射手段を設け
ることにより、熱容量あるいは光反射率が大きく異なる
２つの被加工部材の接合・窄孔・切断に使用しても、溶
融不足や焼損を生じることのない、加工安定性がよく外
観も優れた、高品質加工ができる光加工機を実現するも
のである。As described above, the present invention provides a composite energy light irradiating means for irradiating light of different irradiation energy to each of the workpieces when joining a plurality of workpieces. Even when used for joining, narrowing, and cutting two workpieces with greatly different light reflectivities, it does not cause insufficient melting or burnout, has good processing stability, has excellent appearance, and is capable of high quality processing. It realizes a processing machine.
【図１】本発明の第１の実施例における光加工機の斜視
図FIG. 1 is a perspective view of an optical processing machine according to a first embodiment of the present invention.
【図２】本発明の第２の実施例における光加工機の斜視
図FIG. 2 is a perspective view of an optical processing machine according to a second embodiment of the present invention.
【図３】本発明の第３の実施例における光加工機の斜視
図FIG. 3 is a perspective view of an optical processing machine according to a third embodiment of the present invention.
【図４】本発明の第４の実施例における光加工機の斜視
図FIG. 4 is a perspective view of an optical processing machine according to a fourth embodiment of the present invention.
【図５】従来の光加工機の斜視図FIG. 5 is a perspective view of a conventional optical processing machine.
１ レーザ発振器（光発生手段） ４ 局部減衰フィルター（複合エネルギー光照射手段） ６ レーザ光分岐装置（分岐手段） ７ レーザ光振動反射用ミラー（振動手段） ９ ｆ−θレンズ REFERENCE SIGNS LIST 1 laser oscillator (light generation means) 4 local attenuation filter (complex energy light irradiation means) 6 laser light branching device (branching means) 7 laser light vibration reflection mirror (vibration means) 9 f-θ lens
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平５−57466（ＪＰ，Ａ) 特開 平１−155315（ＪＰ，Ａ) 特開 平３−207593（ＪＰ，Ａ) 実開 昭50−96623（ＪＰ，Ｕ) 特公 昭60−33596（ＪＰ，Ｂ１) 実公 昭50−35064（ＪＰ，Ｙ１) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 26/00 - 26/18 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-57466 (JP, A) JP-A-1-155315 (JP, A) JP-A-3-207593 (JP, A) 96623 (JP, U) Japanese Patent Publication No. 60-33596 (JP, B1) Japanese Utility Model Publication No. 50-35064 (JP, Y1) (58) Fields investigated (Int. Cl. 7 , DB name) B23K 26/00-26 / 18
Claims (4)
いずれかをするときに各被加工部材毎にそれぞれ異なっ
た照射エネルギーのレーザ光を照射する複合エネルギー
光照射手段を備え、前記複合エネルギー光照射手段が、
光発生手段と、この光発生手段から出射されたレーザ光
を反射するレーザ光反射用ミラーと、前記レーザ光反射
用ミラーで反射されたレーザ光を各被加工部材上に集光
するｆ−θレンズを有する光加工機。1. A method for joining , narrowing, and cutting a plurality of workpieces .
When performing any one , comprising a composite energy light irradiating means for irradiating a laser beam of a different irradiation energy for each workpiece to be processed , the composite energy light irradiating means,
Light generating means and laser light emitted from the light generating means
A mirror for reflecting a laser beam,
Of the laser beam reflected by the mirror on the workpiece
Optical processing machine having an f-θ lens .
部材毎に光のエネルギー密度を変える手段を備えた請求
項１記載の光加工機。2. The optical processing machine according to claim 1, wherein the composite energy light irradiating means includes means for changing the energy density of light for each workpiece.
部材毎に光の照射時間を変える手段を備えた請求項１記
載の光加工機。3. The optical processing machine according to claim 1, wherein the composite energy light irradiating means includes means for changing a light irradiation time for each workpiece.
射エネルギーの光を発生する複数の光発生手段である請
求項１記載の光加工機。4. The composite energy light irradiation means according to claim 1 , wherein
The optical working machine according to claim 1, wherein the optical working machine is a plurality of light generating means for generating light having a radiation energy .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08528295A JP3252645B2 (en) | 1995-04-11 | 1995-04-11 | Optical processing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08528295A JP3252645B2 (en) | 1995-04-11 | 1995-04-11 | Optical processing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08281460A JPH08281460A (en) | 1996-10-29 |
| JP3252645B2 true JP3252645B2 (en) | 2002-02-04 |
Family
ID=13854223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08528295A Expired - Fee Related JP3252645B2 (en) | 1995-04-11 | 1995-04-11 | Optical processing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3252645B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4593073B2 (en) * | 2002-12-26 | 2010-12-08 | 株式会社半導体エネルギー研究所 | Laser irradiation device |
| US8303738B2 (en) | 2003-10-03 | 2012-11-06 | Sumitomo Electric Industries, Ltd. | Metal heating apparatus, metal heating method, and light source apparatus |
| JP6246056B2 (en) * | 2014-04-23 | 2017-12-13 | 三菱電機株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| US9916989B2 (en) | 2016-04-15 | 2018-03-13 | Amkor Technology, Inc. | System and method for laser assisted bonding of semiconductor die |
-
1995
- 1995-04-11 JP JP08528295A patent/JP3252645B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08281460A (en) | 1996-10-29 |
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