JP3250642B2 - Power converter for vehicle - Google Patents
Power converter for vehicleInfo
- Publication number
- JP3250642B2 JP3250642B2 JP01458895A JP1458895A JP3250642B2 JP 3250642 B2 JP3250642 B2 JP 3250642B2 JP 01458895 A JP01458895 A JP 01458895A JP 1458895 A JP1458895 A JP 1458895A JP 3250642 B2 JP3250642 B2 JP 3250642B2
- Authority
- JP
- Japan
- Prior art keywords
- phase
- power converter
- vehicle
- heat pipe
- base surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Rectifiers (AREA)
- Inverter Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、車両の床下などに搭
載して用いられる車両搭載用電力変換装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vehicle-mounted power converter used under a floor of a vehicle.
【０００２】[0002]
【従来の技術】３レベル電力変換装置の１相分の回路例
を図３に、またその構成例を図４に示す。なお、図４
（イ）は３レベル電力変換装置を左斜め上から見た斜視
図、（ロ）は同じく右斜め上から見た斜視図である。３
レベル電力変換装置の１相分は例えば図３に示すよう
に、スイッチング素子１〜４とクランプ用ダイオード
５，６とから構成され、第１，第２レベルの２レベルの
他に、その中間の第３のレベルの出力が可能であり、出
力電圧波形歪みが少ないことから、最近は良く用いられ
ている。なお、スイッチング素子１〜４はここでは絶縁
ゲート形バイポーラトランジスタ（ＩＧＢＴ）を用いて
いる。また、参照符号７は各相に設けられるフィルタコ
ンデンサであり、８〜１７は配線導体を示す。2. Description of the Related Art FIG. 3 shows a circuit example for one phase of a three-level power converter, and FIG. 4 shows a configuration example thereof. FIG.
(A) is a perspective view of the three-level power converter as viewed from diagonally upper left, and (B) is a perspective view of the same as viewed from diagonally upper right. 3
For example, as shown in FIG. 3, one phase of the level power converter is composed of switching elements 1 to 4 and clamping diodes 5 and 6, and in addition to the two levels of the first and second levels, an intermediate level therebetween. Since the output of the third level is possible and the distortion of the output voltage waveform is small, it is often used recently. The switching elements 1 to 4 use an insulated gate bipolar transistor (IGBT) here. Reference numeral 7 denotes a filter capacitor provided for each phase, and reference numerals 8 to 17 denote wiring conductors.
【０００３】従来、３レベルの電力変換装置では、２レ
ベルのものと比べて素子数が多くなるため図４（イ）の
如く、ヒートパイプのベース面の第１面に１アーム分の
素子（２個のスイッチング素子と１個のダイオード）を
配置し、図４（ロ）のようにヒートパイプのベース面の
第２面で１アーム分、両面で併せて１相分の素子を搭載
する構成としている。また、車両搭載用インバータで
は、１つの筐体に４個のインバータを収納することがあ
るが、このような場合には、図４に示すような構成のも
のが１２個（４×３相）必要になる。Conventionally, in a three-level power conversion device, the number of elements is larger than that in a two-level power conversion device. Therefore, as shown in FIG. A configuration in which two switching elements and one diode are arranged, and an element for one arm is mounted on the second surface of the base surface of the heat pipe and one phase is combined on both surfaces as shown in FIG. And In a vehicle-mounted inverter, four inverters may be housed in one housing. In such a case, twelve inverters having the configuration shown in FIG. Will be needed.
【０００４】[0004]
【発明が解決しようとする課題】上記のような従来例に
おいては、図４に示すように１組の上，下アームの素子
（上アームの素子１，２および５と、下アームの素子
３，４および６）が、ヒートパイプのベース面の両面に
またがる構成のため、アーム間を接続する配線長（図４
の例では１０，１１，１２および１３，１４，１５の長
さ）が長くなる。その結果、その経路を通る配線のイン
ダクタンスが大きくなり、発生するサージ電圧も大きく
なる。In the above conventional example, as shown in FIG. 4, a pair of upper and lower arm elements (upper arm elements 1, 2 and 5 and lower arm element 3) are used. , 4 and 6) extend over both sides of the base surface of the heat pipe, so that the wiring length connecting the arms (FIG. 4)
In the example of (1), the lengths of 10, 11, 12 and 13, 14, 15) are long. As a result, the inductance of the wiring passing through the path increases, and the generated surge voltage also increases.
【０００５】そのため、従来はサージを吸収するスナバ
回路の容量を大きくして対応しており、スナバ回路が大
型化しコスト高になるという問題がある。また、従来は
１つのヒートパイプで１相分のスイッチング素子を収納
するため、ユニット構成が１相単位となり、車両に搭載
する電力変換装置では、１個の筐体に複数個の電力変換
装置を収納する場合が多く、このような場合にユニット
数が多くなり、装置が大型化するという問題もある。し
たがって、この発明の課題は、電力変換装置の配線のイ
ンダクタンスに起因する上記の弊害を取り除き、小形，
低コスト化を図ることにある。[0005] Therefore, conventionally, the capacity of the snubber circuit for absorbing the surge is increased to cope with the problem, and there is a problem that the snubber circuit becomes large and the cost increases. Conventionally, a single heat pipe accommodates a single-phase switching element, so that the unit configuration is a single-phase unit. In a power converter mounted on a vehicle, a plurality of power converters are provided in one housing. In many cases, the number of units is increased. In such a case, there is a problem that the number of units increases and the size of the apparatus increases. Therefore, an object of the present invention is to eliminate the above-mentioned adverse effects caused by the inductance of the wiring of the power conversion device,
The aim is to reduce costs.
【０００６】[0006]
【課題を解決するための手段】このような課題を解決す
るため、請求項１の発明では、ヒートパイプのベース面
のおもて面に、絶縁形のスイッチング素子とダイオード
とからなり、３レベル動作を行なう車両搭載用電力変換
装置の１相分の構成素子を配置し、前記ベース面のうら
面に前記車両搭載用電力変換装置の１相分の構成素子を
前記おもて面の構成素子と対称となる位置に配置し、当
該ヒートパイプのベース面の両面で２相 分の構成素子を
配置したことを特徴としている。According to the first aspect of the present invention, an insulation type switching element and a diode are provided on a front surface of a base surface of a heat pipe. A component for one phase of a vehicle-mounted power converter that performs an operation is arranged, and a back surface of the base surface is disposed.
The components for one phase of the on-vehicle power converter are
Place it at a position that is symmetrical with the components on the front surface, and
Components for two phases on both sides of the base surface of the heat pipe
It is characterized by being arranged .
【０００７】[0007]
【作用】２相の構成素子を１つのヒートパイプの両面に
取り付けて１台のユニットを構成することにより、車両
に搭載するユニット数を低減し、小形かつ低コスト化を
図る。The two-phase components are mounted on both sides of one heat pipe to constitute one unit, so that the number of units mounted on the vehicle is reduced, and the size and cost are reduced.
【０００８】[0008]
【実施例】図１はこの発明の原理構成例を示す構成図で
ある。同図において、１８ａはスイッチング素子を取り
付けるためのヒートパイプのベース面、１〜４はＩＧＢ
Ｔ、５，６はクランプ用ダイオード、７は各相に設ける
フィルタコンデンサを示す。配線導体８，９は図４の配
線導体８，９と同じ役目を持ち、これらを各相に設ける
フィルタコンデンサのＰ（正極）端子，Ｎ（負極）端子
にそれぞれ接続する。配線導体１６，１７は図４の配線
導体１６，１７と同じ役目を持ち、これらを１相の各ア
ーム素子（１，２，５および３，４，６）に接続する。FIG. 1 is a configuration diagram showing an example of the principle configuration of the present invention. In the figure, 18a is a base surface of a heat pipe for mounting a switching element, and 1-4 are IGBs.
T, 5 and 6 are clamping diodes, and 7 is a filter capacitor provided for each phase. The wiring conductors 8 and 9 have the same function as the wiring conductors 8 and 9 in FIG. 4 and are connected to the P (positive) terminal and the N (negative) terminal of a filter capacitor provided for each phase. The wiring conductors 16 and 17 have the same function as the wiring conductors 16 and 17 in FIG. 4 and are connected to the one-phase arm elements (1, 2, 5, and 3, 4, 6).
【０００９】１９は図４の配線導体１０，１１，１２に
相当する配線導体で、１相の上下アーム間（ダイオード
５と６）を短い配線長で接続している。また、２０は図
４の配線導体１３，１４，１５に相当する配線導体で、
１相の上下アーム間（ＩＧＢＴ２と３）を短い配線長で
接続している。このように、ダイオード５，６およびＩ
ＧＢＴ２，３をそれぞれ短い配線長で接続するようにし
ているので、配線インダクタンスを小さくすることがで
きる。Reference numeral 19 denotes a wiring conductor corresponding to the wiring conductors 10, 11, and 12 in FIG. 4, and connects the one-phase upper and lower arms (diodes 5 and 6) with a short wiring length. Reference numeral 20 denotes a wiring conductor corresponding to the wiring conductors 13, 14, 15 in FIG.
One-phase upper and lower arms (IGBTs 2 and 3) are connected with a short wiring length. Thus, diodes 5, 6 and I
Since the GBTs 2 and 3 are connected with a short wiring length, the wiring inductance can be reduced.
【００１０】図２にこの発明の実施例を示す。同図
（イ）は左斜め上から見た斜視図、（ロ）は右斜め上か
ら見た斜視図である。これは、１相の構成素子をヒート
パイプのベース面１８ａに、また、１相の構成素子をヒ
ートパイプのベース面１８ｂにそれぞれ構成し、ヒート
パイプのベース面の両面で２相分の構成素子を配置した
ものである。FIG. 2 shows an embodiment of the present invention. FIG. 1A is a perspective view as viewed obliquely from the upper left, and FIG. 2B is a perspective view as viewed obliquely from the upper right. This is because a one-phase component is formed on the base surface 18a of the heat pipe, and a one-phase component is formed on the base surface 18b of the heat pipe. Is arranged.
【００１１】このため、同図（イ）に示す構成と、同図
（ロ）に示す構成とでは、左右対称とされている。つま
り、図４の配置では同図（イ）に示す構成と、同図
（ロ）に示す構成とでは左右対称とならないが、この発
明では左右対称にできるので、構成の差異によって受け
る影響をなくすことができ、電気的，熱的な特性を各相
で均一化することが可能となる。For this reason, the configuration shown in FIG. 1A and the configuration shown in FIG. That is, in the arrangement shown in FIG. 4, the configuration shown in FIG. 4A and the configuration shown in FIG. 4B are not bilaterally symmetric. However, in the present invention, the configuration shown in FIG. It is possible to make the electrical and thermal characteristics uniform in each phase.
【００１２】[0012]
【発明の効果】請求項１の発明によれば、ヒートパイプ
のベース面の両面に１相ずつの計２相の構成素子を配置
したので、ユニットを構成するのに必要なヒートパイプ
の個数を低減でき、小形で低価格とすることができる。
また、両面の各構成を互いに等しくなるように構成すれ
ば、構造の差異による影響を無くすことができ、その結
果、電気的，熱的な特性を各相で均一にすることが可能
となる。According to the first aspect of the present invention, since two-phase components, one for each phase, are arranged on both sides of the base surface of the heat pipe, the number of heat pipes required to configure the unit is reduced. It can be reduced, and it can be small and inexpensive.
In addition, if the respective structures on both surfaces are configured to be equal to each other, it is possible to eliminate the influence of the difference in structure, and as a result, it is possible to make the electrical and thermal characteristics uniform in each phase.
【図１】この発明の原理構成例を示す構成図である。FIG. 1 is a configuration diagram showing an example of the principle configuration of the present invention.
【図２】この発明の実施例を示す構成図である。FIG. 2 is a configuration diagram showing an embodiment of the present invention.
【図３】従来例を示す回路図である。FIG. 3 is a circuit diagram showing a conventional example.
【図４】従来例を示す構成図である。FIG. 4 is a configuration diagram showing a conventional example.
１〜４…ＩＧＢＴ（絶縁ゲート形バイポーラトランジス
タ）、５，６…ダイオード、７…コンデンサ、８〜１
７，１９，２０…配線導体、１８ａ，１８ｂ…ヒートパ
イプベース面。1-4 IGBT (insulated gate bipolar transistor), 5, 6 diode, 7 capacitor, 8-1
7, 19, 20: wiring conductors, 18a, 18b: heat pipe base surface.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−225548（ＪＰ，Ａ) 特開 平６−327251（ＪＰ，Ａ) 特開 平７−15976（ＪＰ，Ａ) 特開 平６−276741（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H02M 7/48 B60R 16/02 H02M 7/04 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-225548 (JP, A) JP-A-6-327251 (JP, A) JP-A-7-15976 (JP, A) JP-A-6-22576 276741 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H02M 7/48 B60R 16/02 H02M 7/04
Claims (1)
絶縁形のスイッチング素子とダイオードとからなり、３
レベル動作を行なう車両搭載用電力変換装置の１相分の
構成素子を配置し、前記ベース面のうら面に前記車両搭
載用電力変換装置の１相分の構成素子を前記おもて面の
構成素子と対称となる位置に配置し、当該ヒートパイプ
のベース面の両面で２相分の構成素子を配置したことを
特徴とする車両搭載用電力変換装置。1. A heat pipe having a front surface on a base surface,
It consists of an insulating switching element and a diode.
A component for one phase of a power converter mounted on a vehicle that performs a level operation is disposed, and the vehicle mounted on the back surface of the base surface.
The components for one phase of the on-board power converter are
The heat pipe is placed at a position symmetrical to the components.
A power converter mounted on a vehicle , wherein components for two phases are arranged on both sides of a base surface of the power converter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01458895A JP3250642B2 (en) | 1995-01-31 | 1995-01-31 | Power converter for vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01458895A JP3250642B2 (en) | 1995-01-31 | 1995-01-31 | Power converter for vehicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08214561A JPH08214561A (en) | 1996-08-20 |
| JP3250642B2 true JP3250642B2 (en) | 2002-01-28 |
Family
ID=11865336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01458895A Expired - Fee Related JP3250642B2 (en) | 1995-01-31 | 1995-01-31 | Power converter for vehicle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3250642B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9945736B2 (en) | 2003-08-12 | 2018-04-17 | Lam Research Corporation | Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3275132B2 (en) * | 1996-11-27 | 2002-04-15 | 株式会社日立製作所 | Power converter |
| JPH10285950A (en) * | 1997-04-03 | 1998-10-23 | Fuji Electric Co Ltd | Main circuit for three-level power converter |
| JP2001045772A (en) * | 1999-08-03 | 2001-02-16 | Yaskawa Electric Corp | 3-level inverter or pwn cycloconverter |
| JP2003079162A (en) * | 2001-09-03 | 2003-03-14 | Toshiba Transport Eng Inc | Power converter |
| JP4651653B2 (en) * | 2007-10-15 | 2011-03-16 | 三菱電機株式会社 | Power converter |
| JP6206090B2 (en) * | 2013-10-29 | 2017-10-04 | 富士電機株式会社 | 3-level power converter |
| JP6338543B2 (en) * | 2015-03-27 | 2018-06-06 | 株式会社日立製作所 | 3-level power converter |
| US11431239B2 (en) * | 2018-07-25 | 2022-08-30 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Power converter |
| JP7331497B2 (en) * | 2019-06-27 | 2023-08-23 | 富士電機株式会社 | power converter |
-
1995
- 1995-01-31 JP JP01458895A patent/JP3250642B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9945736B2 (en) | 2003-08-12 | 2018-04-17 | Lam Research Corporation | Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08214561A (en) | 1996-08-20 |
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