JP3248892B2 - Structure of piezoelectric oscillator - Google Patents
Structure of piezoelectric oscillatorInfo
- Publication number
- JP3248892B2 JP3248892B2 JP22801999A JP22801999A JP3248892B2 JP 3248892 B2 JP3248892 B2 JP 3248892B2 JP 22801999 A JP22801999 A JP 22801999A JP 22801999 A JP22801999 A JP 22801999A JP 3248892 B2 JP3248892 B2 JP 3248892B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating container
- piezoelectric
- package
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、圧電発振器の改良
に関し、特にパッケージ化された圧電振動子の底面に、
発振回路等を構成するＩＣを収容した絶縁容器を接合一
体化した構造の表面実装型の圧電発振器に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a piezoelectric oscillator, and more particularly, to an improvement of a piezoelectric vibrator packaged on a bottom surface thereof.
The present invention relates to a surface mount type piezoelectric oscillator having a structure in which an insulating container accommodating an IC constituting an oscillation circuit or the like is joined and integrated.
【０００２】[0002]
【従来の技術】［第１の従来例］水晶によって代表され
る圧電振動素子を用いた圧電振動子、圧電発振器等の圧
電デバイスは、各種電子機器、とりわけ通信機器におい
ては不可欠の主要パーツとして使用されている。パッケ
ージ化された圧電振動子を、発振回路等を構成するＩＣ
と組み合わせることにより圧電発振器を構築する場合、
コンパクト化を図る為に、図５に示すようにパッケージ
化された圧電振動子１の下面に、内部にＩＣ３を収容し
た絶縁容器２を組み付けた構成が採用される。即ち、圧
電振動子１は、上面に凹陥部５ａを有したセラミック製
パッケージ本体５の内部に設けた段差６上の電極パッド
７上に導電性接着剤８を介して圧電振動素子９を接続し
た構成を備え、電極パッド７は内部導体を介して外部電
極１０と電気的に接続されている。また、パッケージ本
体５の凹陥部は金属蓋１１により気密封止されている。
一方、絶縁容器２はセラミック材料から成り、その上面
が圧電振動子１よりも大面積であり、該上面には凹陥部
１５が形成されている。凹陥部１５の内底面にはＩＣ搭
載用電極１６が形成され、外枠上面には圧電振動子１と
の接続用の上面電極１７が形成されている。両電極１
６、１７間は導体１８により接続されている。ＩＣ搭載
用電極１６上に導電性接着剤、ハンダ等のバインダによ
りＩＣ３を接続した後で、凹陥部１５内には絶縁樹脂１
９を充填することにより、ＩＣ３を保護している。圧電
振動子１を絶縁容器２上に接続する際には、絶縁容器２
上の上面電極１７上に圧電振動子１の底面に設けた外部
電極１０を一対一で対応させた上で、ハンダ２０を用い
て接続固定する。この際、上面電極１７の外側端部が圧
電振動子のパッケージ本体５の外周縁を越えて延在して
いるので、図５(b) に示すようにハンダ２０はフィレッ
ト形状に硬化することができ、高い接合強度を確保する
ことができる。フィレット形状の硬化したハンダ２０
は、接合強度を高めるだけでなく、外部からの目視によ
りハンダのぬれ性の確認を容易にするため、接合の良否
（加熱不足、或は加熱し過ぎ等）を容易に判定すること
が可能となる。2. Description of the Related Art [First prior art] Piezoelectric devices such as a piezoelectric vibrator and a piezoelectric oscillator using a piezoelectric vibrating element represented by quartz are used as indispensable main parts in various electronic devices, especially in communication devices. Have been. An IC that constitutes an oscillation circuit, etc. with a packaged piezoelectric vibrator
When constructing a piezoelectric oscillator by combining with
In order to reduce the size, a configuration is adopted in which an insulating container 2 containing an IC 3 is mounted on the lower surface of a packaged piezoelectric vibrator 1 as shown in FIG. That is, in the piezoelectric vibrator 1, the piezoelectric vibrating element 9 is connected via the conductive adhesive 8 to the electrode pad 7 on the step 6 provided inside the ceramic package body 5 having the concave portion 5a on the upper surface. The electrode pad 7 is electrically connected to the external electrode 10 via the internal conductor. The concave portion of the package body 5 is hermetically sealed with a metal lid 11.
On the other hand, the insulating container 2 is made of a ceramic material, and its upper surface has a larger area than the piezoelectric vibrator 1, and a concave portion 15 is formed on the upper surface. An IC mounting electrode 16 is formed on the inner bottom surface of the recess 15, and an upper surface electrode 17 for connection to the piezoelectric vibrator 1 is formed on the outer frame upper surface. Both electrodes 1
The conductors 6 and 17 are connected by a conductor 18. After connecting the IC 3 to the IC mounting electrode 16 with a binder such as a conductive adhesive or solder, the insulating resin 1 is placed in the recess 15.
Filling 9 protects the IC 3. When connecting the piezoelectric vibrator 1 on the insulating container 2,
The external electrodes 10 provided on the bottom surface of the piezoelectric vibrator 1 are made to correspond one-to-one on the upper upper electrode 17, and are connected and fixed using the solder 20. At this time, since the outer end of the upper electrode 17 extends beyond the outer peripheral edge of the package body 5 of the piezoelectric vibrator, the solder 20 can be hardened into a fillet shape as shown in FIG. High bonding strength can be ensured. Fillet-shaped hardened solder 20
Is not only to increase the bonding strength, but also to make it easy to check the wettability of the solder by visual inspection from the outside. Become.
【０００３】ところで、図５に示した如く、絶縁容器２
側の面積を大きくすることにより、電極同士をハンダに
より接合したときにフィレット形状の接続状態を実現で
きるが、各種電子機器の小型化に対応して電装部の小型
化が求められている今日では、プリント基板上に電子部
品を高密度実装する要請が強くなっており、図５に示し
た如き大面積の絶縁容器２を使用することが困難になっ
てきている。小型化を図る為には、図６に示すように絶
縁容器２の平面形状を圧電振動子１側に合わせて小型化
したものが提案されて実用化されつつあるが、この場
合、パッケージ本体５底面の外部電極１０と絶縁容器上
面の上面電極１７が共に平坦面であるため、ハンダ量が
僅かでも多過ぎると、加圧した時にハンダが電極を乗り
越えて展開し、隣接する他の電極との間でショートを起
こす虞れがある。この不具合を解消する為に、ハンダの
量を少なくすると、接合強度が低下する。また、上面電
極１７を外部電極１０よりも外側に張り出させることが
できない為、フィレット形状のハンダ固着部を形成する
ことができない。また、ハンダ接合部が加熱不足なの
か、或は加熱過剰なのかを、フィレット部分のぬれ性に
基づいて目視確認することが困難であるという不具合が
ある。ハンダによる接合力が不足する場合には、落下等
の衝撃が加わった時に接合部から剥離が発生する虞れが
ある。このように、圧電振動子を構成するパッケージの
下面に、ＩＣを内蔵した絶縁容器をハンダにより取り付
けることにより構築される圧電発振器にあっては、絶縁
容器の平面積を圧電振動子に合わせてコンパクト化する
と、パッケージ下面の電極と絶縁容器の上面の電極との
間の接合強度が低下したり、ハンダ接合部の接合状態の
良否を目視確認できなくなるという不具合があった。By the way, as shown in FIG.
By increasing the area on the side, it is possible to realize a fillet-shaped connection state when the electrodes are joined by soldering. There is an increasing demand for high-density mounting of electronic components on a printed circuit board, which makes it difficult to use an insulating container 2 having a large area as shown in FIG. In order to reduce the size, as shown in FIG. 6, an insulated container 2 in which the planar shape is reduced in accordance with the piezoelectric vibrator 1 side has been proposed and put into practical use. Since the external electrode 10 on the bottom surface and the upper electrode 17 on the upper surface of the insulating container are both flat surfaces, if the amount of solder is too small, the solder spreads over the electrode when pressurized, and contacts with other adjacent electrodes. There is a possibility that a short circuit may occur between them. If the amount of solder is reduced to solve this problem, the bonding strength is reduced. In addition, since the upper electrode 17 cannot extend beyond the external electrode 10, a fillet-shaped solder fixing portion cannot be formed. Further, there is a problem that it is difficult to visually check whether the solder joint is underheated or overheated based on the wettability of the fillet portion. When the joining force by the solder is insufficient, there is a possibility that peeling may occur from the joining portion when an impact such as a drop is applied. As described above, in a piezoelectric oscillator constructed by attaching an insulating container containing an IC to the lower surface of the package constituting the piezoelectric vibrator by soldering, the plane area of the insulating container is made compact by matching the piezoelectric vibrator. In such a case, there has been a problem that the bonding strength between the electrode on the lower surface of the package and the electrode on the upper surface of the insulating container is reduced, and it is not possible to visually check the bonding state of the solder bonding portion.
【０００４】［第２の従来例］次に、図７(a) 及び(b)
は上記絶縁容器２の従来構成を示す平面図、及びＡ−Ａ
断面図である。また、図８(a) は図７に示した絶縁容器
内にＩＣを搭載した状態の縦断面図、及び平面図、(b)
は樹脂を充填した状態の断面図及び平面図、(c) は絶縁
容器上に圧電振動子を搭載した状態の一部断面図であ
る。この絶縁容器２の凹陥部１５の内底面にはＩＣ搭載
用電極１６の他に、外部電極２１と接続されたＩＣ搭載
用電極２１ａが露出している。この絶縁容器２内に発振
器用のＩＣ３を組み込む際には、図８(a) に示した如く
各ＩＣ搭載用電極１６、２１ａ上にＩＣ３を載置して両
者間をリフロー等によってハンダ接続した後で、図８
(b) に示したようにエポキシ樹脂（ポンティング剤）１
９を凹陥部１５内に充填することにより気密化する。更
に、図８(c) に示すように絶縁容器上面の上面電極１７
上にハンダ、導電性接着剤等のバインダ２０を用いて圧
電振動子の外部電極１０を接続固定する。しかし、上記
従来の絶縁容器２にあっては、ＩＣ搭載用電極１６と上
面電極１７との間が凹陥部１５内壁に沿って延びる導体
１８によって接続されており、しかも上面電極１７は凹
陥部１５の外周縁１５ａにまで延在している。このた
め、溶融した状態の樹脂１９を凹陥部１５内に充填した
ときに、溶融樹脂の一部１９ａが上面電極１７の上面に
沿って流出展開し、電極の一部を覆った状態で固化する
事態が発生する。上面電極１７の表面の一部が絶縁樹脂
１９ａにより被覆されると、その上にハンダ２０を用い
て圧電振動子５の外部電極１０を接続する際に、接続不
良が発生する。特に、発振器全体の低背化の要請から、
ＩＣ３の高さに対して凹陥部１５を十分に深くすること
ができないため、凹陥部１５内に充填すべき樹脂の量は
僅かな量となる。一方、樹脂１９を充填する手段として
は、インジェクタの如く先端の細い注出口から樹脂を押
し出す形式のものが使用されるが、この充填手段による
注出量には誤差があり、ＩＣ３を収容した容積の小さい
凹陥部１５内に微量の樹脂を充填する場合、誤差によっ
て充填量が規定量よりも少しでも増量すると、増量した
分が上面電極１７を構成する金属表面に沿って展開し、
上記不具合をもたらし易い。[Second Conventional Example] Next, FIGS. 7 (a) and 7 (b)
Is a plan view showing a conventional configuration of the insulating container 2, and AA
It is sectional drawing. FIG. 8A is a longitudinal sectional view and a plan view showing a state where the IC is mounted in the insulating container shown in FIG. 7, and FIG.
1 is a cross-sectional view and a plan view of a state where a resin is filled, and FIG. 2C is a partial cross-sectional view of a state where a piezoelectric vibrator is mounted on an insulating container. On the inner bottom surface of the concave portion 15 of the insulating container 2, in addition to the IC mounting electrode 16, an IC mounting electrode 21a connected to the external electrode 21 is exposed. When the IC 3 for the oscillator is incorporated in the insulating container 2, the IC 3 is mounted on each of the IC mounting electrodes 16 and 21a as shown in FIG. 8 (a), and the two are soldered by reflow or the like. Later, FIG.
Epoxy resin (ponting agent) 1 as shown in (b)
9 is filled in the recess 15 to make it airtight. Further, as shown in FIG.
The external electrode 10 of the piezoelectric vibrator is connected and fixed thereon using a binder 20 such as solder or conductive adhesive. However, in the above-described conventional insulating container 2, the IC mounting electrode 16 and the upper surface electrode 17 are connected by the conductor 18 extending along the inner wall of the concave portion 15, and the upper surface electrode 17 is connected to the concave portion 15 Extends to the outer peripheral edge 15a. For this reason, when the resin 19 in a molten state is filled in the recess 15, a part 19 a of the molten resin flows out and develops along the upper surface of the upper electrode 17, and solidifies while covering a part of the electrode. Things happen. When a part of the surface of the upper electrode 17 is covered with the insulating resin 19a, a connection failure occurs when the external electrode 10 of the piezoelectric vibrator 5 is connected thereto using the solder 20. In particular, due to the demand for lowering the overall oscillator,
Since the depth of the recess 15 cannot be made sufficiently large with respect to the height of the IC 3, the amount of the resin to be filled in the recess 15 is small. On the other hand, as a means for filling the resin 19, a type in which the resin is extruded from a narrow outlet, such as an injector, is used. When a small amount of resin is filled in the recess 15 having a small size, if the filling amount is increased by a small amount even more than a prescribed amount, the increased amount is developed along the metal surface constituting the upper electrode 17,
The above problem is easily caused.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上記に鑑みて
なされたものであり、第１の従来例に対応する本発明は
圧電振動子を構成するパッケージの下面に、ＩＣを内蔵
した絶縁容器をハンダにより取り付けることにより構築
される圧電発振器において、絶縁容器の平面積を圧電振
動子に合わせてコンパクト化したとしても、パッケージ
下面の電極と絶縁容器の上面の電極との間の接合強度が
低下したり、ハンダ接合部の接合状態の良否を目視確認
できなくなるという不具合をなくすることができる圧電
発振器を提供することを目的とする。また、第２の従来
例に対応する本発明は、ＩＣを内蔵する上記絶縁容器内
に樹脂をポッティングする際に、樹脂の一部が絶縁容器
上面の電極表面に展開して固化することにより、絶縁容
器上に搭載される圧電振動子の外部電極との間に接続不
良をもたらすという不具合を解消することを目的として
いる。SUMMARY OF THE INVENTION The present invention has been made in view of the above, and the present invention corresponding to the first prior art is an insulating container having a built-in IC on the lower surface of a package constituting a piezoelectric vibrator. In a piezoelectric oscillator built by soldering, the bonding strength between the electrode on the lower surface of the package and the electrode on the upper surface of the insulating container is reduced even if the plane area of the insulating container is reduced to fit the piezoelectric vibrator. It is an object of the present invention to provide a piezoelectric oscillator that can eliminate the problem that the quality of a soldered joint cannot be visually confirmed. Further, according to the present invention corresponding to the second conventional example, when potting the resin into the insulating container containing the IC, a part of the resin is spread on the electrode surface on the upper surface of the insulating container and solidified, It is an object of the present invention to solve a problem that a connection failure occurs between the piezoelectric vibrator mounted on an insulating container and an external electrode.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するた
め、請求項１の発明は、内部に圧電振動素子を気密封止
すると共に外底面に外部電極を有したパッケージを備え
た圧電振動子と、ＩＣを収容する凹陥部を上面に備える
と共に、該パッケージの上記底面に設けた外部電極と導
電性バインダにより接続される上面電極を外枠上面に備
えた絶縁容器と、を備えた圧電発振器において、上記パ
ッケージ側の外部電極、又は絶縁容器側の上面電極の少
なくともいずれか一方を、パッケージ外底面、或は絶縁
容器の外枠上面に設けた凹所内に配置したことを特徴と
する。請求項２の発明は、上記凹所内に配置した外部電
極又は上面電極の一部に突部を設けたことを特徴とす
る。請求項３の発明は、内部に圧電振動素子を気密封止
すると共に外底面に外部電極を有したパッケージを備え
た圧電振動子と、ＩＣを収容する凹陥部を上面に備える
と共に、該パッケージの上記底面に設けた外部電極と導
電性バインダにより接続される上面電極を外枠上面に備
えた絶縁容器と、を備えた圧電発振器であって、上記絶
縁容器の凹陥部内底面には上記ＩＣを搭載するＩＣ搭載
用電極が形成され、該絶縁容器側の上面電極とＩＣ搭載
用電極とが電気的に接続されたものにおいて、上記絶縁
容器側の上面電極は、絶縁容器上面の凹陥部の外周縁部
から離間した位置に配置されていることを特徴とする。In order to solve the above-mentioned problems, a first aspect of the present invention is to provide a piezoelectric vibrator having a package having a piezoelectric vibrating element hermetically sealed therein and having external electrodes on an outer bottom surface. An insulating container having an upper surface provided with a concave portion for accommodating an IC on the upper surface and an upper electrode connected to the external electrode provided on the lower surface of the package and a conductive binder on an outer frame upper surface. At least one of the package-side external electrode and the insulating container-side upper electrode is arranged in a recess provided on the package outer bottom surface or the upper surface of the outer frame of the insulating container. The invention according to claim 2 is characterized in that a projection is provided on a part of the external electrode or the upper surface electrode arranged in the recess. According to a third aspect of the present invention, there is provided a piezoelectric vibrator having a package in which a piezoelectric vibrating element is hermetically sealed and having an external electrode on an outer bottom surface, and a concave portion for accommodating an IC is provided on an upper surface. A piezoelectric container provided with an external electrode provided on the bottom surface and an upper surface electrode connected to the conductive binder by an upper surface electrode on an upper surface of the outer frame, wherein the IC is mounted on a bottom surface in a concave portion of the insulating container. The IC mounting electrode is formed and the upper electrode on the insulating container side is electrically connected to the IC mounting electrode. The upper electrode on the insulating container side is an outer peripheral edge of a concave portion on the upper surface of the insulating container. It is characterized in that it is arranged at a position separated from the part.
【０００７】[0007]
【発明の実施の形態】以下、本発明を図面に示した実施
の形態により詳細に説明する。図１(a) 及び(b) は第１
の従来例に対応する本発明の一実施形態に係る圧電発振
器の分解斜視図、及び要部拡大断面図であり、図５と同
一部分には同一符号を付して重複した構成の説明は省略
する。この圧電発振器は、水晶振動子１と、図示しない
ＩＣ３を凹陥部１５内に配置した絶縁容器２とを、水晶
振動子１の下面の外部電極（メタライズ部）７と絶縁容
器２の上面の上面電極（メタライズ部）１７とをハンダ
２０により接合することにより一体化させた構成を備え
ている。この実施形態の特徴的な構成は、水晶振動子１
と絶縁容器に夫々設けた電極１０，１７のいずれか一方
を、凹所３０内に配置した点にある。この実施形態で
は、絶縁容器２の外枠上面２ａに設けた凹所３０の内底
面に上面電極１７を配置し、圧電振動子１の底面に設け
た外部電極１０は平坦なパッケージ下面５ｂに無段状に
配置されている。図１(b) に示すように凹所３０内に配
置された上面電極１７と、パッケージ本体５の平坦な外
底面５ｂに配置された電極１０との間には空隙３１が形
成され、この空隙を利用してハンダ２０の充填量を増量
することができる。ハンダ充填量を増やすことにより、
個々の電極１０と１７との間の接合力を高め、衝撃等に
よって接合部が剥離する等の不具合を解消することがで
きる。なお、上記例では、絶縁容器２側の上面電極１７
を凹所３０内に配置したが、パッケージ本体５側の外部
電極１０を凹所内に配置してもよいし、絶縁容器２側の
上面電極１７とパッケージ本体側の外部電極１０双方を
凹所内に配置するようにしてもよい。また、仮に接合時
に圧電振動子１を絶縁容器２に圧接したとしても、凹所
３０内底面と、凹所３０を設けた絶縁容器２の上面２ａ
との間の段差によって、加圧されて展開しようとするハ
ンダがせき止められて、隣接する他の電極とショートす
る虞れがなくなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. FIGS. 1 (a) and (b) show the first
5 is an exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention corresponding to the conventional example of FIG. 5, and an enlarged cross-sectional view of main parts. The same parts as in FIG. I do. This piezoelectric oscillator includes a quartz oscillator 1 and an insulating container 2 in which an IC 3 (not shown) is arranged in a recess 15, and an external electrode (metallized portion) 7 on the lower surface of the quartz oscillator 1 and an upper surface of the upper surface of the insulating container 2. An electrode (metallized portion) 17 is integrated by bonding with a solder 20. The characteristic configuration of this embodiment is that the quartz oscillator 1
And one of the electrodes 10 and 17 provided in the insulating container, respectively. In this embodiment, the upper electrode 17 is arranged on the inner bottom surface of the recess 30 provided on the upper surface 2a of the outer frame of the insulating container 2, and the external electrode 10 provided on the bottom surface of the piezoelectric vibrator 1 is not provided on the flat lower surface 5b of the package. They are arranged stepwise. As shown in FIG. 1B, a gap 31 is formed between the upper surface electrode 17 arranged in the recess 30 and the electrode 10 arranged on the flat outer bottom surface 5b of the package body 5. The filling amount of the solder 20 can be increased by utilizing the above. By increasing the solder filling,
The bonding force between the individual electrodes 10 and 17 can be increased, and problems such as separation of the bonded portion due to impact or the like can be eliminated. In the above example, the upper surface electrode 17 on the insulating container 2 side is used.
Are arranged in the recess 30, but the external electrode 10 on the package body 5 side may be arranged in the recess, or both the upper surface electrode 17 on the insulating container 2 side and the external electrode 10 on the package body side may be arranged in the recess. It may be arranged. Even if the piezoelectric vibrator 1 is pressed against the insulating container 2 at the time of bonding, the inner bottom surface of the recess 30 and the upper surface 2a of the insulating container 2 provided with the recess 30 are formed.
Due to the step between them, there is no danger that the solder that is being pressed and unfolded will be dammed and short-circuited with another adjacent electrode.
【０００８】次に、図２及び図３は本発明の変形例であ
り、凹所３０の内底面を完全なフラットな面とせずに、
凹所の内底面に少なくとも一つの突部３５を設けた点が
特徴的である。各突部３５の高さは、凹所３０の段差部
の高さｈとほぼ同等、或は少し低めに設定する。図２
(a) の例は、細幅帯状の平面形状を有した突部３５を凹
所３０の内底面に差し渡し配置したものであり、絶縁容
器を構成する材料であるセラミックによって突部３５を
形成し、その表面にメタライズにより電極を被覆するこ
とにより形成する。つまり、突部３５は上面電極１７の
一部を構成している。図３の例は、凹所３０の内底面に
円筒状の突部３５を設けており、突部３５の形成方法
は、図２の突部の場合と同様である。図２(b) は、図２
(a) の突部３５を有した上面電極１７を、圧電振動子１
側の外部電極１０とハンダ２０により接合した場合の構
造を示す断面図であり、このように上面電極１７の一部
に突部３５を形成することにより、ハンダ２０と電極と
の間の接合面積が増大し、接合力が強固になる。二つの
電極１０、１７間の空隙３１の存在により増量してハン
ダの接合力が増大することとあいまって、全体的な接合
力が向上し、圧電振動子と絶縁容器との間の接合力を大
幅に高めることができる。なお、突部３５の形状、個数
等は種々変更可能である。Next, FIGS. 2 and 3 show a modification of the present invention, in which the inner bottom surface of the recess 30 is not completely flat,
It is characteristic that at least one projection 35 is provided on the inner bottom surface of the recess. The height of each projection 35 is set substantially equal to or slightly lower than the height h of the step portion of the recess 30. FIG.
In the example of (a), a protrusion 35 having a narrow band-like planar shape is disposed across the inner bottom surface of the recess 30. The protrusion 35 is formed of ceramic which is a material forming an insulating container. Is formed by coating the surface with an electrode by metallization. That is, the protrusion 35 forms a part of the upper electrode 17. In the example of FIG. 3, a cylindrical protrusion 35 is provided on the inner bottom surface of the recess 30, and the method of forming the protrusion 35 is the same as that of the protrusion of FIG. 2. FIG. 2 (b)
The upper electrode 17 having the projection 35 of FIG.
FIG. 7 is a cross-sectional view showing a structure in a case where the external electrode 10 on the side is joined to the solder 20 by using a solder 20. In this manner, by forming a protrusion 35 on a part of the upper surface electrode 17, a joint area between the solder 20 and the electrode is formed. Increases, and the bonding strength becomes stronger. The presence of the gap 31 between the two electrodes 10 and 17 increases the bonding strength of the solder due to an increase in the amount thereof, thereby improving the overall bonding strength and improving the bonding strength between the piezoelectric vibrator and the insulating container. Can be greatly increased. The shape, the number, and the like of the protrusions 35 can be variously changed.
【０００９】次に、第２の従来例に対応する本発明の実
施の形態に係る圧電発振器について説明する。図４(a)
及び(b) はこの実施の形態に係る圧電発振器を構成する
絶縁容器の平面図、及びＢ−Ｂ断面図である。なお、図
７、図８に示した従来例の構成を併せて参照し、同一部
分には同一符号を付して説明する。この絶縁容器２は、
図１、図７等に示した絶縁容器と同様に凹陥部１５の内
底面に配線した図示しないＩＣ搭載用電極１６上にＩＣ
３をハンダ等を用いて接続するように構成されている
が、絶縁容器の外枠上面２ａに配置した上面電極１７の
内側端縁１７ａが凹陥部１５の外周縁１５ａから所要幅
Ｌだけ離間した位置から始端している点が異なってい
る。換言すれば、ＩＣ搭載用電極１６と上面電極１７と
は凹陥部１５の内壁面に沿って配置された導体１８を介
して接続されているのではなく、図４(b) の要部縦断面
図に示すようにＩＣ搭載用電極１６の一部を絶縁容器の
肉厚内部に延長した延長部１６ａとし、この延長部１６
ａと、その直上に位置する上面電極１７とを、容器を貫
通する導電材、例えばスルーホール２５を介して導通さ
せている。従って、上面電極１７の内側端縁１７ａと、
凹陥部の外周縁１５ａとの間に位置する幅Ｌの範囲内に
は絶縁容器２の材質であるセラミック等が露出している
こととなる。このように凹陥部の外周縁１５ａと上面電
極１７の内側端縁１７ａとの間が幅Ｌだけ離間している
ため、凹陥部１５内に充填した樹脂１９の量が多少多め
であったとしても、増量した分の樹脂が外周縁１５ａを
乗り越えて電極の内側端縁１７ａに到達することは困難
となる。しかも、幅Ｌ内にはセラミックが露出している
ので、溶融樹脂がセラミック上を上面電極１７に向かっ
てにじみ出す（流出展開し出す）量は、金属上を樹脂が
にじみ出す量に比べて大幅に少なくなる。従って、凹陥
部外周縁１５ａにまで電極の内側端縁１７ａが延在して
いる従来例に比べて溶融樹脂が上面電極１７上に固着す
る虞れが大幅に解消され、圧電振動子１の外部電極７を
上面電極１７上にハンダ接続したときに接続不良が発生
する虞れもなくなる。Next, a description will be given of a piezoelectric oscillator according to an embodiment of the present invention corresponding to the second conventional example. Fig. 4 (a)
FIGS. 3B and 3B are a plan view and a sectional view taken along line BB of an insulating container constituting the piezoelectric oscillator according to this embodiment. FIGS. 7 and 8, the same parts will be described with the same reference numerals. This insulating container 2
The IC is mounted on an IC mounting electrode 16 (not shown) wired on the inner bottom surface of the recess 15 in the same manner as the insulating container shown in FIGS.
3 are connected using solder or the like, but the inner edge 17a of the upper surface electrode 17 arranged on the outer frame upper surface 2a of the insulating container is separated from the outer peripheral edge 15a of the recess 15 by a required width L. The difference is that it starts from the position. In other words, the IC mounting electrode 16 and the upper surface electrode 17 are not connected via the conductor 18 arranged along the inner wall surface of the concave portion 15, but are not shown in the longitudinal section of FIG. As shown in the figure, a part of the IC mounting electrode 16 is formed as an extension 16a extending into the thickness of the insulating container.
a and the upper surface electrode 17 located immediately above it are electrically connected via a conductive material penetrating the container, for example, a through hole 25. Therefore, the inner edge 17a of the upper surface electrode 17 and
Ceramic or the like, which is the material of the insulating container 2, is exposed in the range of the width L located between the outer peripheral edge 15a of the recessed portion. Since the outer peripheral edge 15a of the recess and the inner edge 17a of the upper surface electrode 17 are separated by the width L, even if the amount of the resin 19 filled in the recess 15 is slightly large. It is difficult for the increased amount of resin to cross the outer peripheral edge 15a and reach the inner edge 17a of the electrode. In addition, since the ceramic is exposed within the width L, the amount of the molten resin seeping out of the ceramic toward the upper surface electrode 17 (outflow and development) is significantly larger than the amount of the resin seeping out of the metal. Less. Therefore, compared with the conventional example in which the inner edge 17a of the electrode extends to the outer peripheral edge 15a of the concave portion, the possibility that the molten resin adheres to the upper electrode 17 is largely eliminated, and the outer portion of the piezoelectric vibrator 1 is removed. When the electrode 7 is solder-connected to the upper electrode 17, there is no possibility that a connection failure occurs.
【００１０】[0010]
【発明の効果】以上のように、第１の従来例に対応する
本発明によれば、圧電振動子を構成するパッケージ下面
の外部電極に、ＩＣを内蔵した絶縁容器上面の上面電極
をハンダにより取り付けることにより構築される圧電発
振器において、絶縁容器の平面積を圧電振動子に合わせ
てコンパクト化した場合に、パッケージ下面の電極と絶
縁容器の上面の電極との間の接合強度が低下したり、ハ
ンダ接合部の接合状態の良否を目視確認できなくなると
いう不具合をなくすることができる。つまり、絶縁容器
上面の上面電極上にハンダのフィレットを形成するのに
十分な張り出し面を確保することができない場合であっ
ても、上面電極を凹所内に配置することにより、パッケ
ージ下面との間に空隙を形成し、この空隙内に十分な量
のハンダを保持し、接合力を維持することが可能とな
る。また、第２の従来例に対応する本発明によれば、Ｉ
Ｃを内蔵する上記絶縁容器の凹陥部内に樹脂をポッティ
ングする際に、樹脂の一部が絶縁容器上面の電極表面に
展開して固化することにより、絶縁容器上に搭載される
圧電振動子の外部電極との間に接続不良をもたらすとい
う不具合を解消することができる。即ち、凹陥部の外周
縁と上面電極との間に所要幅のセラミック露出面を設け
たので、樹脂の充填量が多少多めとなったとしても、溶
融樹脂の一部が上面電極側に流出展開することがなくな
る。As described above, according to the present invention corresponding to the first conventional example, the upper electrode on the upper surface of the insulating container containing the IC is soldered to the external electrode on the lower surface of the package constituting the piezoelectric vibrator. In the piezoelectric oscillator constructed by mounting, if the plane area of the insulating container is made compact according to the piezoelectric vibrator, the bonding strength between the electrode on the lower surface of the package and the electrode on the upper surface of the insulating container decreases, It is possible to eliminate the problem that the quality of the bonding state of the solder bonding portion cannot be visually checked. In other words, even if it is not possible to secure a sufficient overhang surface to form a solder fillet on the upper surface electrode on the upper surface of the insulating container, by arranging the upper surface electrode in the recess, the space between the upper surface electrode and the package lower surface can be secured. A gap is formed in the gap, a sufficient amount of solder is held in the gap, and the joining force can be maintained. According to the present invention corresponding to the second conventional example,
When potting the resin into the concave portion of the insulating container containing C, a part of the resin spreads and solidifies on the electrode surface on the upper surface of the insulating container, so that the resin vibrates outside the piezoelectric vibrator mounted on the insulating container. It is possible to eliminate a problem that a connection failure is caused between the electrodes. That is, since the ceramic exposed surface of a required width is provided between the outer peripheral edge of the recess and the upper electrode, even if the filling amount of the resin is slightly larger, a part of the molten resin flows out to the upper electrode side. Will not be done.
【図１】(a) 及び(b) は第１の従来例に対応する本発明
の一実施形態に係る圧電発振器の分解斜視図、及び要部
拡大断面図。FIGS. 1 (a) and 1 (b) are an exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention corresponding to a first conventional example, and an enlarged sectional view of a main part.
【図２】(a) は本発明の実施形態の変形例の要部斜視
図、(b) は接合状態を示す縦断面図。2A is a perspective view of a main part of a modified example of the embodiment of the present invention, and FIG. 2B is a longitudinal sectional view showing a joined state.
【図３】本発明の実施形態の他の変形例の要部斜視図。FIG. 3 is a perspective view of a main part of another modification of the embodiment of the present invention.
【図４】(a) 及び(b) は第２の従来例に対応する本発明
の実施の形態の構成を説明する平面図、及びＢ−Ｂ断面
図。FIGS. 4 (a) and (b) are a plan view and a sectional view taken along line BB illustrating a configuration of an embodiment of the present invention corresponding to a second conventional example.
【図５】(a) 及び(b) は第１の従来例に係る圧電発振器
の全体構成を示す断面図、及び要部拡大図。FIGS. 5A and 5B are a cross-sectional view and an enlarged view of a main part showing an overall configuration of a piezoelectric oscillator according to a first conventional example.
【図６】他の従来例の圧電発振器の構成図。FIG. 6 is a configuration diagram of another conventional piezoelectric oscillator.
【図７】(a) 及び(b) は第２の従来例に係る圧電発振器
に用いる絶縁容器の平面図、及びＡ−Ａ断面図。FIGS. 7A and 7B are a plan view and an AA sectional view of an insulating container used for a piezoelectric oscillator according to a second conventional example.
【図８】(a) (b) 及び(c) は図７の絶縁容器内にＩＣを
組み込み、樹脂を充填する等の手順を示す図。8 (a), 8 (b) and 8 (c) are views showing a procedure of assembling an IC in the insulating container of FIG. 7, filling a resin, and the like.
１ 圧電振動子、２ 絶縁容器、３ ＩＣ、５ パッケ
ージ本体、５ａ 凹陥部、６ 段差、７ 電極パッド、
８ 導電性接着剤、９ 圧電振動素子、１０ 外部電
極、１１ 金属蓋、１５ 凹陥部、１５ａ 外周縁、１
６ ＩＣ搭載用電極、１６ａ 延長部、１７ 上面電
極、１７ａ 内側端縁、１８ 導体、１９ 絶縁樹脂、
２０ ハンダ、２５ スルーホール、３０ 凹所、３１
空隙、３５突部。1 piezoelectric vibrator, 2 insulating container, 3 IC, 5 package body, 5a recess, 6 steps, 7 electrode pad,
Reference Signs List 8 conductive adhesive, 9 piezoelectric vibrating element, 10 external electrode, 11 metal cover, 15 recess, 15a outer peripheral edge, 1
6 IC mounting electrode, 16a extension, 17 top electrode, 17a inner edge, 18 conductor, 19 insulating resin,
20 solder, 25 through hole, 30 recess, 31
Void, 35 protrusions.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H03B 5/32 H03H 9/02 H03H 9/10 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H03B 5/32 H03H 9/02 H03H 9/10
Claims (3)
に外底面に外部電極を有したパッケージを備えた圧電振
動子と、 ＩＣを収容する凹陥部を上面に備えると共に、該パッケ
ージの上記底面に設けた外部電極と導電性バインダによ
り接続される上面電極を外枠上面に備えた絶縁容器と、 を備えた圧電発振器において、 上記パッケージ側の外部電極、又は絶縁容器側の上面電
極の少なくともいずれか一方を、パッケージ外底面、或
は絶縁容器の外枠上面に設けた凹所内に配置したことを
特徴とする圧電発振器の構造。1. A piezoelectric vibrator having a package in which a piezoelectric vibrating element is hermetically sealed therein and having external electrodes on an outer bottom surface, a concave portion for accommodating an IC is provided on an upper surface, and the bottom surface of the package is provided. An insulating container provided on the outer frame upper surface with an upper electrode connected to the external electrode provided on the outer frame by a conductive binder, wherein at least one of the external electrode on the package side or the upper electrode on the insulating container side is provided. A structure of a piezoelectric oscillator, wherein either one of the piezoelectric oscillators is disposed in a recess provided on an outer bottom surface of a package or an upper surface of an outer frame of an insulating container.
電極の一部に突部を設けたことを特徴とする請求項１記
載の圧電発振器の構造。2. The structure of a piezoelectric oscillator according to claim 1, wherein a projection is provided on a part of the external electrode or the upper electrode disposed in the recess.
に上記底面に外部電極を有したパッケージを備えた圧電
振動子と、 ＩＣを収容する凹陥部を上面に備えると共に、該パッケ
ージの外底面に設けた外部電極と導電性バインダにより
接続される上面電極を外枠上面に備えた絶縁容器と、 を備えた圧電発振器であって、 上記絶縁容器の凹陥部内底面には上記ＩＣを搭載するＩ
Ｃ搭載用電極が形成され、該絶縁容器側の上面電極とＩ
Ｃ搭載用電極とが電気的に接続されたものにおいて、 上記絶縁容器側の上面電極は、絶縁容器上面の凹陥部の
外周縁部から離間した位置に配置されていることを特徴
とする圧電発振器の構造。3. A piezoelectric vibrator hermetically sealing a piezoelectric vibrating element therein and having a package having external electrodes on the bottom surface, a concave portion for accommodating an IC on an upper surface, and an outer bottom surface of the package. And an insulating container provided on the outer frame upper surface with an upper electrode connected to the external electrode provided on the outer frame by a conductive binder, wherein the IC is mounted on the inner bottom surface of the concave portion of the insulating container.
C mounting electrode is formed, and the upper surface electrode on the insulating container side and I
A piezoelectric oscillator electrically connected to the C mounting electrode, wherein the upper surface electrode on the side of the insulating container is arranged at a position separated from the outer peripheral edge of the concave portion on the upper surface of the insulating container. Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22801999A JP3248892B2 (en) | 1999-08-11 | 1999-08-11 | Structure of piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22801999A JP3248892B2 (en) | 1999-08-11 | 1999-08-11 | Structure of piezoelectric oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001053546A JP2001053546A (en) | 2001-02-23 |
| JP3248892B2 true JP3248892B2 (en) | 2002-01-21 |
Family
ID=16869930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22801999A Expired - Lifetime JP3248892B2 (en) | 1999-08-11 | 1999-08-11 | Structure of piezoelectric oscillator |
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| Country | Link |
|---|---|
| JP (1) | JP3248892B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359056B1 (en) | 2000-01-27 | 2002-03-19 | Kodak Polychrome Graphics Llc | Printing plate and method to prepare a printing plate |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030055681A (en) * | 2001-12-27 | 2003-07-04 | 삼성전기주식회사 | Teperature compensated crystal oscillator and method for manufacturing the same |
| JP5144060B2 (en) * | 2006-11-30 | 2013-02-13 | 京セラクリスタルデバイス株式会社 | Piezoelectric oscillator and manufacturing method thereof |
| JP5101119B2 (en) * | 2007-01-31 | 2012-12-19 | 京セラクリスタルデバイス株式会社 | Piezoelectric oscillator |
| JP5005371B2 (en) * | 2007-01-31 | 2012-08-22 | 京セラクリスタルデバイス株式会社 | Method for manufacturing piezoelectric oscillator |
| JP5875894B2 (en) * | 2012-02-28 | 2016-03-02 | 京セラクリスタルデバイス株式会社 | Piezoelectric device |
-
1999
- 1999-08-11 JP JP22801999A patent/JP3248892B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359056B1 (en) | 2000-01-27 | 2002-03-19 | Kodak Polychrome Graphics Llc | Printing plate and method to prepare a printing plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001053546A (en) | 2001-02-23 |
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