JP3233348B2 - On-board power supply and method of manufacturing the same - Google Patents
On-board power supply and method of manufacturing the sameInfo
- Publication number
- JP3233348B2 JP3233348B2 JP36965897A JP36965897A JP3233348B2 JP 3233348 B2 JP3233348 B2 JP 3233348B2 JP 36965897 A JP36965897 A JP 36965897A JP 36965897 A JP36965897 A JP 36965897A JP 3233348 B2 JP3233348 B2 JP 3233348B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- pins
- substrate
- terminal
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Dc-Dc Converters (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】 本発明は、オンボード電源
装置及びその製造方法に係り、特に磁気部品やパワート
ランジスタなどの大型電子部品に対する容積利用率を向
上させることの可能な構造とするともに、組立作業の歩
留りを向上させることのできるオンボード電源装置及び
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an on-board power supply device and a method of manufacturing the same, and more particularly, to a structure capable of improving a volume utilization factor for a large electronic component such as a magnetic component or a power transistor, and an assembling method. The present invention relates to an on-board power supply device capable of improving a work yield and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】 高周波スイッチングを利用したＤＣ−
ＤＣコンバータ等の全部品を金属基板に実装した、いわ
ゆるオンボード電源装置が普及してきており、その性能
はますます発展して、高効率、小型化が進んでいる。そ
の進歩に伴い、小型のオンボード電源装置で数百ワット
出力の大電力出力も実現しつつある。2. Description of the Related Art DC-
2. Description of the Related Art A so-called on-board power supply device in which all components such as a DC converter are mounted on a metal substrate has become widespread, and its performance has been further developed to achieve high efficiency and miniaturization. With the progress, high power output of several hundred watts is being realized by a small on-board power supply.
【０００３】 このオンボード電源装置において、大出
力となると、インダクタや変圧器等の磁気部品の占める
容積とその発生する熱量は大きくなる。したがって、１
枚の金属基板にすべての部品を実装する構造では、容積
利用率と放熱の問題がある。また、金属基板の上方に子
基板を取り付けることも考えられるが、金属基板へ取り
付ける場合には、すべて表面実装によるため、相互接続
の端子を同一平面に保つなどの製造方法に困難な点があ
る。この相互接続の端子については多数となるので、位
置決め精度が大きな問題となる。[0003] In this on-board power supply device, when the output becomes large, the volume occupied by magnetic components such as inductors and transformers and the amount of heat generated thereby increase. Therefore, 1
In a structure in which all components are mounted on a single metal substrate, there are problems of volume utilization and heat radiation. In addition, it is conceivable to attach a child board above the metal board, but when attaching to the metal board, since all are by surface mounting, there are difficulties in the manufacturing method such as keeping the interconnection terminals on the same plane. . Since there are a large number of terminals for this interconnection, positioning accuracy is a major problem.
【０００４】 この問題に関連して、例えば、平成９年
１１月５日付けで発行された実用新案登録公報第２５５
３０８３号に記載されている混成集積回路装置において
は、絶縁層を介して形成された回路を有する金属基板
と、ほぼ中央部を開口部とし前記金属基板から所定間隔
離間して支持されたプリント基板と、このプリント基板
の開口部と対向する金属基板上に形成された回路の所定
位置に配置された発熱量の大きな第１の電子部品と、前
記開口部の周辺に設けられた切り欠き部に一部嵌合する
ようにして前記金属基板上に立設された発熱量の大きな
第２の電子部品と、プリント基板に形成された回路の所
定位置に配置された発熱量の小さな第３の電子部品とを
具備してなる混成集積回路装置が提案されている。[0004] In connection with this problem, for example, Utility Model Registration Publication No. 255 issued on November 5, 1997
In the hybrid integrated circuit device described in No. 3083, a metal substrate having a circuit formed with an insulating layer interposed therebetween, and a printed circuit board supported by a predetermined distance from the metal substrate with an opening at a substantially central portion thereof A first electronic component having a large calorific value disposed at a predetermined position of a circuit formed on a metal substrate facing the opening of the printed board; and a notch provided around the opening. A second electronic component having a large heat value and standing on the metal substrate so as to be partially fitted, and a third electronic component having a small heat value disposed at a predetermined position of a circuit formed on the printed circuit board; A hybrid integrated circuit device including components has been proposed.
【０００５】 この考案は、消費電力が大きい電子部品
について、有効な放熱手段を保ちつつ、発熱量の小さな
電子部品を発熱量の大きな電子部品と同様の温度保証さ
れた部品を必要としないという効果を奏する。しかしな
がら、相互接続の端子の位置決め精度の問題について
は、言及されていない。[0005] This invention has an effect that, for an electronic component that consumes a large amount of power, an electronic component that generates a small amount of heat does not require a component whose temperature is assured as an electronic component that generates a large amount of heat while maintaining effective heat dissipation means. To play. However, no mention is made of the problem of the positioning accuracy of the interconnection terminals.
【０００６】 本発明は、金属基板にコンバータ回路等
を搭載してなるオンボード電源装置において、その磁気
部品やパワートランジスタ等の大型部品に対する容積利
用率を向上させる実装構造を得るとともに、組み立て作
業の歩留りを向上させることを課題とする。The present invention provides an on-board power supply device in which a converter circuit and the like are mounted on a metal substrate, to obtain a mounting structure for improving the volume utilization rate of large components such as magnetic components and power transistors, and to perform assembly work. It is an object to improve the yield.
【０００７】[0007]
【課題を解決するための手段】 本発明の請求項１は前
記課題を解決するために、複数のピンを備える入力端子
と複数のピンを備える出力端子とを含む端子と、インダ
クタと、制御回路と、主回路とを備えたオンボード電源
装置において、この主回路の電子部品と共に端子のピン
が実装された親基板である金属基板と、この金属基板の
外形の大きさとほぼ等しい大きさの外形を有し、大窓を
囲んでなる額縁部とこの額縁部に圧入された端子のピン
とからなる絶縁材基板と、その絶縁材基板の外形の大き
さとほぼ等しいか又は小さい外形の孫基板であって、イ
ンダクタを挿通させる空間である半窓が明いており、孫
基板の縁部に端子のピンを挿通させてなるプリント基板
と、絶縁材基板の大窓の空間とプリント基板の半窓の空
間が重なり合う空間に対応する金属基板の面にインダク
タを搭載して、そのリード線をプリント基板の額縁部を
通して延びる端子のピンに接続してなることを特徴とす
るオンボード電源装置を提供する。Means for Solving the Problems To solve the above-mentioned problems, a first aspect of the present invention is a terminal including an input terminal having a plurality of pins and an output terminal having a plurality of pins, an inductor, and a control circuit. And an on-board power supply device having a main circuit, a metal substrate which is a parent substrate on which terminal pins are mounted together with electronic components of the main circuit, and an outer shape having a size substantially equal to the size of the outer shape of the metal substrate. An insulating substrate including a frame surrounding the large window and a pin of a terminal pressed into the frame, and a grandchild substrate having an outer shape substantially equal to or smaller than the outer size of the insulating substrate. The half-window, which is a space for inserting the inductor, is clear, and the printed circuit board with the terminal pins inserted through the edge of the grandchild board, the space for the large window on the insulating material board, and the space for the half-window on the printed circuit board Space where The present invention provides an on-board power supply characterized in that an inductor is mounted on a surface of a metal substrate corresponding to the above, and its lead wire is connected to a pin of a terminal extending through a frame portion of the printed circuit board.
【０００８】 また、請求項２の発明は前記課題を解決
するために、請求項１に記載したオンボード電源装置を
製造する方法であって、金属基板の上面にクリーム半田
を塗布し、そのクリーム半田上に主回路の電子部品を載
せる第一工程と、端子の複数のピンを絶縁材基板に圧入
してそれらの突出長さを揃えると共に、複数の位置決め
ピンを絶縁材基板に圧入する第二工程と、端子のピンと
位置決めピンが圧入された絶縁材基板を金属基板の上面
に載置するとともに、端子のピンと位置決めピンを所定
穴に挿入する第三工程と、クリーム半田を溶着させる第
四工程と、制御回路の電子部品を実装したプリント基板
の各スルーホールに端子のピンを挿通させ、半田付けす
る第五工程と、絶縁材基板の額縁部で囲まれた空間とプ
リント基板の半窓の重なり合う空間に対応する金属基板
の面にインダクタを載置し、そのリード線をプリント基
板に半田付けする第六工程と、からなることを特徴とす
るオンボード電源装置の製造方法を提供する。According to a second aspect of the present invention, there is provided a method for manufacturing an on-board power supply device according to the first aspect, wherein cream solder is applied to an upper surface of a metal substrate, and the cream solder is applied. A first step of mounting electronic components of the main circuit on the solder, and a second step of press-fitting a plurality of pins of the terminal into the insulating material substrate by pressing the plurality of pins into the insulating material substrate and aligning a plurality of positioning pins into the insulating material substrate. A third step of placing the insulating substrate into which the terminal pins and the positioning pins are press-fitted on the upper surface of the metal substrate and inserting the terminal pins and the positioning pins into predetermined holes, and a fourth step of welding cream solder And a fifth step of soldering the terminal pins through each through hole of the printed circuit board on which the electronic components of the control circuit are mounted and soldering, and the space surrounded by the frame portion of the insulating material board and the half window of the printed circuit board. A sixth step of mounting an inductor on a surface of a metal substrate corresponding to the overlapping space and soldering its lead wire to a printed circuit board.
【０００９】[0009]
【発明の実施の形態】 図１は、本発明に係るオンボー
ド電源の構成と組立について説明するための図である。
図１において、１は親基板となる金属基板、２は子基板
となる絶縁材基板、３は孫基板となるプリント基板、４
は主回路であり、そのパワ−トランジスタのような大型
の電子部品は金属基板１上に実装される。ここで製造し
ようとるオンボード電源装置は、入力端子と出力端子と
磁気部品であるインダクタと制御回路と主回路とから構
成される。なお、一般に電源は主スイッチング素子、変
圧器、入出力側の平滑回路などを含んで負荷電流を扱う
主回路と、これを制御する制御回路に大きくは分けられ
ており、このオンボード電源装置も従来に従っている。FIG. 1 is a diagram for explaining the configuration and assembly of an on-board power supply according to the present invention.
In FIG. 1, 1 is a metal substrate serving as a parent substrate, 2 is an insulating material substrate serving as a child substrate, 3 is a printed board serving as a grandchild substrate,
Is a main circuit, and large electronic components such as power transistors are mounted on the metal substrate 1. The on-board power supply device to be manufactured here includes an input terminal, an output terminal, an inductor that is a magnetic component, a control circuit, and a main circuit. In general, the power supply is roughly divided into a main circuit that handles the load current including a main switching element, a transformer, and a smoothing circuit on the input / output side, and a control circuit that controls the load current. Follow the conventional.
【００１０】 金属基板１は、厚みのある金属層１１
と、薄い絶縁層１２と、さらにその上面の導体膜（図示
せず）とからなり、矩形である。この金属基板１の導体
膜上面にコンバータ回路などの主回路４の電子部品が実
装される。また、図１から明らかなように金属基板１の
導体膜上面には入力端子８１や出力端子８２などの端子
８が実装されて、この主回路の全体の入出力接続経路と
なる。この金属基板１の端部の２箇所に図示しない円柱
状のスペーサーが垂直に取り付けられて、このオンボー
ド電源装置の支持体となる。The metal substrate 1 has a thick metal layer 11.
And a thin insulating layer 12 and a conductor film (not shown) on the upper surface thereof, and have a rectangular shape. Electronic components of the main circuit 4 such as a converter circuit are mounted on the upper surface of the conductive film of the metal substrate 1. Also, as is apparent from FIG. 1, terminals 8 such as input terminals 81 and output terminals 82 are mounted on the upper surface of the conductive film of the metal substrate 1, and serve as input / output connection paths for the entire main circuit. A columnar spacer (not shown) is vertically attached to two locations at the end of the metal substrate 1 to serve as a support for the on-board power supply.
【００１１】 絶縁材基板２は、金属基板１とほぼ同じ
大きさのガラスエポキシ材の薄い板で構成されて、大窓
２１が明いており、その周辺には縁部２２がある。縁部
２２には、端子８のピンを挿入する穴が設けられている
が、いずれの穴にも一般のプリント基板のようなスルー
ホールメッキやランドはない。The insulating material substrate 2 is made of a thin plate of glass epoxy material having substantially the same size as the metal substrate 1, has a large window 21, and an edge 22 around the large window 21. The edge portion 22 is provided with holes for inserting pins of the terminals 8, but none of the holes has through-hole plating or lands like a general printed circuit board.
【００１２】 プリント基板３も金属基板１とほぼ同じ
大きさであって、一般のプリント基板のように穴にはス
ルーホールメッキを施してあり、ランドもある。そし
て、プリント基板３には大窓２１よりも小さい半窓３１
が形成されており、半窓３１は大窓２１の大部分と重な
り合っている。また、プリント基板３は半窓３１の回り
の縁部３２とこれらを除く面域である平野部３３とを有
する。The printed board 3 is also substantially the same size as the metal board 1, and through holes are plated with holes like a general printed board, and there are lands. The printed circuit board 3 has a half window 31 smaller than the large window 21.
Are formed, and the half window 31 overlaps most of the large window 21. The printed circuit board 3 has an edge portion 32 around the half window 31 and a plain portion 33 which is a surface area excluding the edge portion 32.
【００１３】 以下工程順に製造方法を説明する。The manufacturing method will be described below in the order of steps.
【００１４】 第一工程として、親基板である金属基板
１の上面にはクリーム半田を塗布し、主回路４の電子部
品を載置する。As a first step, cream solder is applied to the upper surface of the metal substrate 1 as the parent substrate, and the electronic components of the main circuit 4 are mounted.
【００１５】 第二工程として、多数のピンからなる端
子８を子基板である絶縁材基板２に圧入し、これら圧入
した端子８の突出長さを一点鎖線で図示するように均一
にそろえる。また、絶縁材基板２には、位置決めピン８
３、８４を圧入し、端子８の各ピンの突出長さよりも、
わずかに長くする。In the second step, the terminals 8 composed of a large number of pins are press-fitted into the insulating material substrate 2 as a daughter board, and the protruding lengths of the press-fitted terminals 8 are evenly aligned as shown by a dashed line. Further, positioning pins 8 are provided on the insulating material substrate 2.
3, 84, and press-fit the length of each pin of the terminal 8,
Make it slightly longer.
【００１６】 第三工程として、前記のピン圧入した子
基板である絶縁材基板２を金属基板１の上面に載置す
る。このとき、位置決めピン８３、８４を金属基板１の
基準穴１３、１４に挿入する。As a third step, the insulating material substrate 2, which is the child substrate into which the pins are pressed, is placed on the upper surface of the metal substrate 1. At this time, the positioning pins 83 and 84 are inserted into the reference holes 13 and 14 of the metal substrate 1.
【００１７】 第四工程として、クリーム半田を所定の
温度処理によって溶着させる。この溶着工程の後の各半
田箇所について、大窓２１をとおして視認する。As a fourth step, the cream solder is welded by a predetermined temperature treatment. Each solder location after the welding step is visually recognized through the large window 21.
【００１８】 第五工程として、制御回路等を実装した
孫基板となるプリント基板３の各スルーホールに前記ピ
ン８を挿通させ、半田付けする。As a fifth step, the pins 8 are inserted into the through holes of the printed circuit board 3 serving as the grandchild board on which the control circuit and the like are mounted, and soldered.
【００１９】 第六工程として、インダクタ５を、重な
り合った大窓２１と半窓３１の空間を通して露出する、
つまりその空間に対応する金属基板１の面域の一部分
（図の破線で示す１５の位置）に載置し、それらのリー
ド線端末５１、５２をプリント基板３上のランド３６、
３７にそれぞれ半田付けする。_As a sixth step, the inductor 5 is exposed through the space between the large window 21 and the half window 31 that overlap each other.
That is, they are placed on a part of the surface area of the metal substrate 1 corresponding to the space (position 15 shown by the broken line in the figure), and these lead wire terminals 51, 52 are connected to the lands 36,
37, respectively. _
【００２０】 これらの六工程によって、オンボード電
源装置を製造することができる。By these six steps, an on-board power supply device can be manufactured.
【００２１】 そして必要に応じて、入力端子８１と出
力端子８２等の外部引き出し用のピンを残して、長いピ
ンを切断する。なお、各ピン８の長さをあらかじめ所定
の長さに選定しておけば、この切断の作業を省くことも
できる。Then, if necessary, the long pins are cut while leaving the pins for external drawing such as the input terminal 81 and the output terminal 82. If the length of each pin 8 is selected in advance to a predetermined length, the cutting operation can be omitted.
【００２２】 図２は、本発明に係るオンボード電源装
置の実装構造の実施の形態であって、上記の製造方法に
したがって完成したオンボード電源装置の上面図であ
り、図３はその側面図である。図２及び図３において、
図１と同じ符号のものは、それぞれ同じ構成要素に対応
する。このオンボード電源装置の実装構造においては、
金属基板１の両端には、図２に示す円柱形状のスペーサ
ー７が垂直に取り付けられている。これら金属基板１と
図３に示すプラスチックケース９で囲まれた構造物は、
他のプリント等の上に取り付けられるとともに、金属基
板１の裏面には、図示しない冷却フィンが取り付けられ
る。FIG. 2 is an embodiment of the mounting structure of the on-board power supply according to the present invention, and is a top view of the on-board power supply completed according to the above-described manufacturing method, and FIG. 3 is a side view thereof. It is. 2 and 3,
1 have the same reference numerals, respectively, and correspond to the same components. In the mounting structure of this on-board power supply,
At both ends of the metal substrate 1, columnar spacers 7 shown in FIG. The structure surrounded by the metal substrate 1 and the plastic case 9 shown in FIG.
A cooling fin (not shown) is mounted on the back surface of the metal substrate 1 while being mounted on another print or the like.
【００２３】[0023]
【発明の効果】 本発明は、以上述べたような特徴を有
しているので、端子の実装が容易になり、組立作業中の
歩留りも向上する。また、大型部品は熱損損失も大きい
ので、このオンボード電源装置の放熱上の温度分布も平
準化してより小型化と信頼性の向上が望まれる。孫基板
に搭載する回路は比較的小電力部品とすることで、さら
に容積利用率を高めることができる。さらに、多数のピ
ン端子のすべてを１枚の絶縁材基板に挿入し固着してい
るので、各ピン端子を容易に位置精度よく配置実装する
ことができ、また、入出力端子のように端子ピンに外力
が加わる場合、応力が端子基板をとおして全てのピン端
子と金属基板の半田接合部に分散して加わるので、端子
１本あたりの応力は減少し、端子ピンと金属基板との固
着の信頼性が向上するなどの効果がある。The present invention has the above-described features, so that the terminals can be easily mounted and the yield during the assembly operation can be improved. Further, since large parts have large heat loss loss, it is desired that the temperature distribution on the heat radiation of the on-board power supply device be leveled to reduce the size and improve the reliability. The circuit mounted on the grandchild board is made of relatively low power components, so that the volume utilization rate can be further increased. Furthermore, since all of the many pin terminals are inserted into and fixed to one insulating material substrate, each pin terminal can be easily arranged and mounted with high positional accuracy. When an external force is applied, the stress is dispersed and applied to all the solder joints between the pin terminal and the metal substrate through the terminal substrate, so that the stress per terminal decreases, and the reliability of the fixing between the terminal pin and the metal substrate is reduced. This has the effect of improving the performance.
【図１】本発明に係るオンボード電源装置の製造方法の
工程を示す。FIG. 1 shows steps of a method for manufacturing an on-board power supply device according to the present invention.
【図２】本発明に係るオンボード電源装置の実装構造の
実施の形態の上面図を示す。FIG. 2 shows a top view of an embodiment of the mounting structure of the on-board power supply device according to the present invention.
【図３】本発明に係るオンボード電源装置の実装構造の
実施の形態の側面図を示す。FIG. 3 is a side view of the embodiment of the mounting structure of the on-board power supply device according to the present invention.
１…金属基板（親基板） ２…絶縁材基板（子基板） ３…プリント基板（孫基板） ４…主回路 ５…イン
ダクタ ６…制御回路 ７…スペーサー ８…端
子 ９…プラスチックケースDESCRIPTION OF SYMBOLS 1 ... Metal board (parent board) 2 ... Insulation board (child board) 3 ... Printed board (child board) 4 ... Main circuit 5 ... Inductor 6 ... Control circuit 7 ... Spacer 8 ... Terminal 9 ... Plastic case
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H02M 3/00 H05K 1/14 H05K 1/18 H05K 7/14 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H02M 3/00 H05K 1/14 H05K 1/18 H05K 7/14
Claims (2)
を備える出力端子とを含む端子と、インダクタと、制御
回路と、主回路とを備えたオンボード電源装置におい
て、 前記主回路の電子部品と共に前記端子のピンが実装され
た親基板である金属基板と、 この金属基板の外形の大きさとほぼ等しい大きさの外形
を有し、大窓を囲んでなる額縁部とこの額縁部に圧入さ
れた前記端子のピンとからなる絶縁材基板と、 前記絶縁材基板の外形の大きさとほぼ等しいか又は小さ
い外形の孫基板であって、前記インダクタを挿通させる
空間である半窓が明いており、前記孫基板の縁部に前記
端子のピンを挿通させてなるプリント基板と、 前記絶縁材基板の前記大窓の空間と前記プリント基板の
前記半窓の空間が重なり合う空間に対応する前記金属基
板の面に前記インダクタを搭載して、そのリード線を前
記プリント基板の額縁部を通して延びる前記端子のピン
に接続してなることを特徴とするオンボード電源装置。1. An on-board power supply device comprising: a terminal including an input terminal having a plurality of pins and an output terminal having a plurality of pins; an inductor; a control circuit; and a main circuit. A metal substrate as a parent substrate on which the pins of the terminals are mounted together with the components; a frame having an outer shape substantially equal to the size of the outer shape of the metal substrate; a frame surrounding a large window; and press-fitting into the frame. An insulating substrate composed of the pins of the terminal, and a grandchild substrate having an outer shape substantially equal to or smaller than the outer shape of the insulating substrate, and a half window as a space through which the inductor is inserted is clear, A printed board formed by inserting the pins of the terminals through the edge of the grandchild board; and the metal board corresponding to a space in which the space of the large window of the insulating material board and the space of the half window of the printed board overlap. An on-board power supply device, wherein the inductor is mounted on a surface of the printed circuit board, and a lead wire thereof is connected to a pin of the terminal extending through a frame portion of the printed circuit board.
を備える出力端子とを含む端子と、インダクタと、制御
回路と、主回路とを備えたオンボード電源装置におい
て、 前記主回路の電子部品と共に前記端子のピンが実装され
た親基板である金属基板と、 この金属基板の外形の大きさとほぼ等しい大きさの外形
を有し、大窓を囲んでなる額縁部とこの額縁部に圧入さ
れた前記端子のピンとからなる絶縁材基板と、 前記絶縁材基板の外形の大きさとほぼ等しいか又は小さ
い外形の孫基板であって、前記インダクタを挿通させる
空間である半窓が明いており、前記孫基板の縁部に前記
端子のピンを挿通させてなるプリント基板と、 前記絶縁材基板の前記大窓の空間と前記プリント基板の
前記半窓の空間が重なり合う空間に対応する前記金属基
板の面に前記インダクタを搭載して、そのリード線を前
記プリント基板の額縁部を通して延びる前記端子のピン
に接続してなるオンボード電源装置を製造する方法であ
って、 前記金属基板の上面にクリーム半田を塗布し、そのクリ
ーム半田上に前記主回路の電子部品を載せる第一工程
と、 前記端子の複数のピンを前記絶縁材基板に圧入してそれ
らの突出長さを揃えると共に、複数の位置決めピンを前
記絶縁材基板に圧入する第二工程と、 前記端子のピンと前記位置決めピンが圧入された前記絶
縁材基板を前記金属基板の上面に載置するとともに、前
記端子のピンと前記位置決めピンを所定穴に挿入する第
三工程と、 前記クリーム半田を溶着させる第四工程と、 制御回路の電子部品を実装した前記プリント基板の各ス
ルーホールに前記端子のピンを挿通させ、半田付けする
第五工程と、 前記絶縁材基板の額縁部で囲まれた空間と前記プリント
基板の半窓の重なり合う空間に対応する前記金属基板の
面にインダクタを載置し、そのリード線を前記プリント
基板に半田付けする第六工程と、 からなることを特徴とするオンボード電源装置の製造方
法。2. An on-board power supply device comprising: a terminal including an input terminal having a plurality of pins and an output terminal having a plurality of pins; an inductor; a control circuit; and a main circuit. A metal substrate as a parent substrate on which the pins of the terminals are mounted together with the components; a frame having an outer shape substantially equal to the size of the outer shape of the metal substrate; a frame surrounding a large window; and press-fitting into the frame. An insulating substrate composed of the pins of the terminal, and a grandchild substrate having an outer shape substantially equal to or smaller than the outer shape of the insulating substrate, and a half window as a space through which the inductor is inserted is clear, A printed board formed by inserting the pins of the terminals through the edge of the grandchild board; and the metal board corresponding to a space in which the space of the large window of the insulating material board and the space of the half window of the printed board overlap. A method for manufacturing an on-board power supply device, comprising mounting the inductor on a surface of the printed circuit board and connecting a lead wire of the inductor to a pin of the terminal extending through a frame of the printed circuit board. A first step of applying solder and mounting the electronic component of the main circuit on the cream solder; pressing a plurality of pins of the terminal into the insulating material substrate so as to make their protruding lengths uniform; A second step of press-fitting the pins into the insulating substrate; placing the insulating substrate into which the pins of the terminals and the positioning pins are press-fitted on the upper surface of the metal substrate; A third step of inserting the cream solder into a hole, a fourth step of welding the cream solder, and a step of inserting the terminal into each through hole of the printed circuit board on which the electronic component of the control circuit is mounted. A fifth step of inserting and soldering, placing an inductor on the surface of the metal substrate corresponding to the space where the half-window of the printed circuit board overlaps the space surrounded by the frame portion of the insulating material substrate, And a sixth step of soldering the lead wires to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36965897A JP3233348B2 (en) | 1997-12-26 | 1997-12-26 | On-board power supply and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36965897A JP3233348B2 (en) | 1997-12-26 | 1997-12-26 | On-board power supply and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11206108A JPH11206108A (en) | 1999-07-30 |
| JP3233348B2 true JP3233348B2 (en) | 2001-11-26 |
Family
ID=18494997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36965897A Expired - Fee Related JP3233348B2 (en) | 1997-12-26 | 1997-12-26 | On-board power supply and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3233348B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4801603B2 (en) * | 2007-02-20 | 2011-10-26 | Ｔｄｋラムダ株式会社 | Power module |
| JP4922840B2 (en) * | 2007-06-05 | 2012-04-25 | 株式会社日立製作所 | Switching power supply |
-
1997
- 1997-12-26 JP JP36965897A patent/JP3233348B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11206108A (en) | 1999-07-30 |
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