JP3220219B2 - How to drill printed circuit boards - Google Patents
How to drill printed circuit boardsInfo
- Publication number
- JP3220219B2 JP3220219B2 JP09217192A JP9217192A JP3220219B2 JP 3220219 B2 JP3220219 B2 JP 3220219B2 JP 09217192 A JP09217192 A JP 09217192A JP 9217192 A JP9217192 A JP 9217192A JP 3220219 B2 JP3220219 B2 JP 3220219B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- drilling
- drill
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明はプリント基板の穴あけ方
法に係り、特に全自動穴あけ機における穴あけ加工速度
を従来よりも高速で能率良く行える方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for drilling a printed circuit board, and more particularly to a method for making a drilling speed in a fully automatic drilling machine faster and more efficient than before.
【０００２】[0002]
【従来の技術】全自動穴あけ機でプリント基板に穴あけ
加工をする場合、各種穴あけ加工条件として、ドリルの
径、スピンドルの回転数、送り速度、ドリルの寿命、項
No. 、ポストNo. 、ドリル上昇待機位置、ドリル穴あけ
終了位置等を前もって穴あけ機ＮＣ装置メモリー領域に
登録しておき、プリント基板の穴あけの都度必要に応じ
て呼び出し穴あけ加工するようにされている。上記各種
穴あけ加工条件のうち、ドリル上昇待機位置は穴あけ機
で穴あけするプリント基板の総厚みにより決定され、穴
あけ機で加工するプリント基板の最大総厚みに合わせて
前もって登録、設定されている。2. Description of the Related Art When boring a printed circuit board using a fully automatic boring machine, various drilling conditions include a drill diameter, a spindle rotation speed, a feed speed, a drill life, and the like.
The No., post No., drill up standby position, drilling end position, etc., are registered in advance in the drilling machine NC device memory area, and each time a printed circuit board is drilled, a calling hole is drilled as needed. . Among the various drilling processing conditions, the drill rising standby position is determined by the total thickness of the printed circuit board drilled by the drilling machine, and is registered and set in advance according to the maximum total thickness of the printed circuit board drilled by the drilling machine.
【０００３】[0003]
【発明が解決しようとする課題】このため、上記従来に
おいては、全自動穴あけ機で穴あけするプリント基板の
厚みが最大総厚みの場合は良いが、異種プリント基板混
合型の加工スケジュールの場合はプリント基板の重ね枚
数及び板厚に変動があり、ドリル上昇待機位置がプリン
ト基板の総厚みに設定されているので、この厚みよりも
薄いプリント基板に穴あけ加工するとドリルのエアーカ
ット量（無負荷移動量）が長くなることとなり、１穴を
形成するのに余分な時間が掛り、穴あけを高速で能率良
く行えないという問題があった。For this reason, in the prior art described above, it is good if the thickness of the printed circuit board to be drilled by a fully automatic drilling machine is the maximum total thickness, but if the processing schedule of the mixed type of different printed circuit board is used, the printing is not performed. The number of stacked boards and the thickness of the boards vary, and the standby position for ascending the drill is set to the total thickness of the printed circuit boards. ) Becomes longer, and it takes extra time to form one hole, and there is a problem that drilling cannot be performed efficiently at high speed.
【０００４】又、データ集中管理方式で前もってプリン
ト基板の総厚みを加工データとして穴あけ機ＮＣ装置に
転送する場合には、追加データとしてドリル上昇待機位
置データを追加する必要があることと、同じ穴あけパタ
ーンでもプリント基板の重ね枚数等に変更があった場合
は、その都度人手により追加データを修正しなくてはな
らず、データ修正ミス等の問題があった。In the case where the total thickness of a printed circuit board is previously transferred as machining data to a drilling machine NC apparatus in a data centralized management system, it is necessary to add drilling standby position data as additional data, which is the same as drilling. When the number of printed circuit boards overlapped in the pattern is changed, additional data must be manually corrected each time, and there is a problem such as a data correction error.
【０００５】本発明は従来の穴あけ加工技術の有するこ
のような問題点に鑑みてなされたものであり、その目的
とするところは穴あけ加工をするプリント基板の厚みに
対応してドリル上昇待機位置を自動的に設定し、エアー
カット時間（無負荷移動時間）を短縮することにより、
穴あけを従来よりも高速で能率良く行えることと、設定
ミスを防止する加工法を提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the conventional drilling technology, and has as its object to set a drill rising standby position corresponding to the thickness of a printed circuit board on which drilling is performed. By automatically setting and shortening the air cut time (no-load travel time),
An object of the present invention is to provide a drilling method capable of performing drilling at a higher speed and more efficiently than before, and a processing method for preventing setting errors.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明の特徴とする点は、プリント基板の全自動穴
あけ機におけるドリルの送りが自動とされ、ドリルが上
昇待機位置から穴あけ終了位置まで下降して、プリント
基板に穴をあけるプリント基板の穴あけ方法において、
全自動穴あけ機の機外に設置されたプリント基板の厚み
測定装置により、プリント基板の厚みを測定した後、穴
あけ機の補助テーブル上に未加工プリント基板が自動的
に搬入され所定位置に取付けられ穴あけ加工が開始され
るまでに、前記厚み測定データを穴あけ機ＮＣ装置のド
リル上昇待機位置を計算する演算部に転送し、ドリルの
上昇待機位置を自動的に再設定し、プリント基板の上部
表面とドリル先端との距離を穴あけ加工に必要な最小量
に設定する点にある。In order to achieve the above object, a feature of the present invention is that a drill is automatically fed in a fully automatic drilling machine for a printed circuit board, and the drill is completed from a rising standby position. In the method of drilling a printed circuit board, which descends to a position and drills a hole in the printed circuit board,
The thickness of the printed circuit board installed outside the automatic drilling machine
Drilling the measuring device after measuring the thickness of the printed circuit board, before drilling is attached to the raw printed circuit board is automatically conveyed to a predetermined position on the drilling machine of the auxiliary table processing is started, the thickness measurement data To the calculation unit for calculating the drill rise standby position of the NC machine, automatically resets the drill rise standby position, and reduces the distance between the upper surface of the printed circuit board and the drill tip to the minimum amount required for drilling. The point to set.
【０００７】[0007]
【作用】プリント基板上部表面とドリル上昇待機位置と
の距離がプリント基板の厚みに対応して自動設定され、
最小量となるので、１穴を形成するのに必要なドリルの
エアーカット時間（無負荷移動時間）が最小となり、穴
あけが従来よりも能率良く行えるとともに、ドリル上昇
待機位置設定ミスがなくなる。[Function] The distance between the upper surface of the printed circuit board and the drill standby position is automatically set according to the thickness of the printed circuit board.
Since the minimum amount is used, the air cut time (no-load moving time) of the drill required to form one hole is minimized, the drilling can be performed more efficiently than in the past, and the mistake of setting the drill raising standby position is eliminated.
【０００８】[0008]
【実施例】以下、本発明の一実施例を従来例と比較しな
がら詳述する。図１はプリント基板の全自動穴あけ機及
び関連の周辺装置を示し、１はスピンドル、２は補助テ
ーブルでベット７上を水平方向に前後動する。９はコラ
ム、８はクロスレールでスピンドル１の左右方向移動を
支持案内する横桁である。１７は穴あけ加工完了済みプ
リント基板である。３は穴あけ加工途中のプリント基板
で補助テーブル２上に取付けられている。４は未加工プ
リント基板で、穴あけ加工途中のプリント基板３の穴あ
け終了後、補助テーブル２上に自動的に搬入、取付けら
れるプリント基板である。６は未加工プリント基板４及
び穴あけ加工完了済みプリント基板１７双方を搬送する
プリント基板搬送コンベヤーである。５は未加工プリン
ト基板４の厚みを測定する厚み測定装置である。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in comparison with a conventional example. FIG. 1 shows a fully automatic drilling machine for printed circuit boards and related peripheral devices, 1 is a spindle, and 2 is an auxiliary table which moves back and forth horizontally on a bed 7 in a horizontal direction. Reference numeral 9 denotes a column, and reference numeral 8 denotes a cross rail which is a cross rail and supports and guides the spindle 1 to move in the left-right direction. Reference numeral 17 denotes a printed circuit board on which drilling has been completed. Reference numeral 3 denotes a printed circuit board being drilled, which is mounted on the auxiliary table 2. Reference numeral 4 denotes an unprocessed printed circuit board, which is automatically carried into and mounted on the auxiliary table 2 after drilling of the printed circuit board 3 in the middle of the drilling process. Reference numeral 6 denotes a printed board transport conveyor that transports both the unprocessed printed board 4 and the printed board 17 on which drilling has been completed. Reference numeral 5 denotes a thickness measuring device for measuring the thickness of the unprocessed printed circuit board 4.
【０００９】全自動穴あけ機でプリント基板に穴あけを
する場合、穴あけ加工中のプリント基板３は穴あけ加工
が終了するとプリント基板自動給排出装置（図示なし）
により穴あけ機の機外に自動的に排出れ、プリント基板
搬送コンベヤー６上に積載されて次工程に搬送される。In the case of making a hole in a printed circuit board by a fully automatic drilling machine, the printed circuit board 3 being punched is automatically printed and unloaded when the drilling is completed.
Is automatically discharged out of the punching machine, loaded on the printed board transport conveyor 6 and transported to the next step.
【００１０】この場合、従来において全自動穴あけ機に
より未加工プリント基板４に穴をあける方法を図２に基
づき説明する。図２において、１はスピンドル、１０は
プレッシャーフートでスピンドル１に沿って上下動す
る。１１は先端ブッシュでプレッシャーフート１０下端
に交換可能に取付けられている。１３は保持リングで該
保持リング１３によりスピンドル１のユニットチャック
にドリル１２が上下方向定位置に取付けられる。１４は
当て板でプリント基板１５の上に設置されてドリル１２
の食い付きを安定させると共にバリの発生を防止する。
１６はプリント基板１５の下に敷く捨て板で、２は全自
動穴あけ機本体の補助テーブルである。In this case, a conventional method for making a hole in the unprocessed printed circuit board 4 by a fully automatic drilling machine will be described with reference to FIG. In FIG. 2, 1 is a spindle and 10 is a pressure foot which moves up and down along the spindle 1. Reference numeral 11 denotes a tip bush which is replaceably attached to the lower end of the pressure foot 10. Reference numeral 13 denotes a holding ring by which the drill 12 is attached to a unit chuck of the spindle 1 at a fixed position in the vertical direction. Reference numeral 14 denotes a backing plate which is installed on the printed circuit board 15 and has a drill 12.
Stabilization and prevent burr.
Numeral 16 denotes a discard plate laid below the printed circuit board 15, and numeral 2 denotes an auxiliary table of a fully automatic drilling machine main body.
【００１１】Ａはドリルの上昇待機位置を示し、Ｃはド
リル１２の穴あけ開始位置で当て板１４上面の位置であ
る。Ｂはドリル１２の穴あけ終了位置、Ｄは先端ブッシ
ュ１１の下端である。そしてＡ〜Ｃ間がドリル１２のエ
アーカット量（無負荷移動量）で、ドリル１２の先端と
当て板１４上面間の距離を示し、Ｃ〜Ｂ間が当て板１
４、プリント基板１５及び捨て板１６に対する正味穴あ
け加工深さで、穴あけ作業時に正味の仕事をする距離で
ある。A indicates a drill standby position, and C indicates a drilling start position of the drill 12 at a position on the upper surface of the backing plate 14. B is a hole ending position of the drill 12, and D is a lower end of the end bush 11. The area between A and C is the amount of air cut (the amount of no-load movement) of the drill 12, the distance between the tip of the drill 12 and the upper surface of the backing plate 14, and the area between C and B is the backing plate 1.
4. The net drilling depth for the printed circuit board 15 and the discard plate 16, and is the distance that the net work is performed during the drilling operation.
【００１２】又、Ａ〜Ｄ間がドリル１２の下端と先端ブ
ッシュ１１の下端間の距離であり、この距離はドリル折
損検知装置との関係である程度必要な距離である。更に
Ｄ〜Ｃ間は先端ブッシュ１１と当て板１４間の距離で補
助テーブル２の移動時、プレッシャーフート１０内のバ
キューム圧力により当て板１４が吸引変形して先端ブッ
シュ１１と接触しない最小距離とされている。The distance between A and D is the distance between the lower end of the drill 12 and the lower end of the tip bush 11, and this distance is a necessary distance to some extent in relation to the drill breakage detecting device. Further, the distance between D and C is a distance between the end bush 11 and the backing plate 14 at the minimum distance at which the backing plate 14 is sucked and deformed by the vacuum pressure in the pressure foot 10 and does not contact the front end bush 11 when the auxiliary table 2 moves. ing.
【００１３】図２（１）は最大厚みのプリント基板１５
を穴あけする場合のドリル１２のエアーカット量（無負
荷移動量）ｌ1 の最適状態を示し、図２（２）は最小厚
みのプリント基板１５に穴をあける場合のエアーカット
量（無負荷移動量）ｌ1 ′の状態を示している。この場
合、穴あけ加工におけるドリル１２の上昇待機位置Ａは
全自動穴あけ機で加工する最大厚みのプリント基板１５
の厚みに前もって設定されており、プリント基板１５の
厚みの大小によって変更しないので図２において次の関
係式が成立する。 プリント基板の厚みの差 Ｔ≫Ｔ′ …(1) ドリルの上下移動量 ｌ1 ＋Ｔ−ｌ4 ＝Ｌ＝ｌ1 ′＋Ｔ′−ｌ4 …(2) エアーカット量 Ｌ−Ｔ＋ｌ4 ＝ｌ1 ≪Ｌ−Ｔ′＋ｌ4 ＝ｌ1 ′…(3) FIG. 2A shows a printed circuit board 15 having a maximum thickness.
The shows the optimal state of the air-cut amount (no-load movement amount) l 1 of the drill 12 in the case of drilling, 2 (2) Air cut in the case a hole in the printed circuit board 15 of the smallest thickness (no load movement (Amount) l 1 ′. In this case, the rising standby position A of the drill 12 in the drilling is a printed circuit board 15 having the maximum thickness to be processed by a fully automatic drilling machine.
Is set in advance, and is not changed by the thickness of the printed circuit board 15, so the following relational expression is established in FIG. Difference in thickness of printed circuit board T≫T '(1) Vertical movement amount of drill l 1 + T-l 4 = L = l 1 ' + T'-l 4 ... (2) Air cut amount L-T + l 4 = l 1 ≪LT-T '+ l 4 = l 1 ' ... (3)
【００１４】ドリル１２の上下移動時間（秒）は最大厚
みプリント基板１５を穴あけする場合穴あけ送り速度を
ｆ1 mm／min 、上昇速度をＦ0 mm／min とすれば ドリル下降時間＝Ｌ÷ｆ1 ＝（ｌ1 ＋Ｔ−ｌ4 ）÷ｆ1 ＝（ｌ1 ＋Ｔ−ｌ4 ）／ｆ1 …(4) ドリル上昇時間＝Ｌ÷Ｆ0 ＝Ｌ／Ｆ0 …(5) 結局、(4)(5)式からドリル１２の上下移動時間（秒）は （ｌ1 ＋Ｔ−ｌ4 ）／ｆ1 ＋Ｌ／Ｆ0 …(6) The vertical movement time (second) of the drill 12 is as follows. When the maximum thickness printed circuit board 15 is drilled, the drilling feed speed is f 1 mm / min, and the ascending speed is F 0 mm / min. 1 = (l 1 + T−l 4 ) ÷ f 1 = (l 1 + T−l 4 ) / f 1 (4) Drill rise time = L ÷ F 0 = L / F 0 (5) Eventually, (4) From the expression (5), the vertical movement time (second) of the drill 12 is (l 1 + T−l 4 ) / f 1 + L / F 0 (6)
【００１５】一方、最小厚みのプリント基板１５を穴あ
けする場合 ドリル下降時間＝Ｌ÷ｆ1 ＝（ｌ1 ′＋Ｔ′−ｌ4 ）÷ｆ1 ＝（ｌ1 ′＋Ｔ′−ｌ4 ）／ｆ1 …(7) ドリル上昇時間＝Ｌ÷Ｆ0 ＝Ｌ／Ｆ0 …(8) 結局、(7)(8)式からドリル１２の上下移動時間（秒）は （ｌ1 ′＋Ｔ′−ｌ4 ）／ｆ1 ＋Ｌ／Ｆ …(9) ここでｌ1 ＋Ｔ＝ｌ1 ′＋Ｔ′であることから(6) 式と
(9) 式は同値となり、穴あけ速度が同じくなるので、最
小厚みのプリント基板１５に対するエアーカット量（無
負荷移動量）が増加した分だけ加工能率が低下すること
となる。On the other hand, when drilling a printed circuit board 15 having the minimum thickness Drill descent time = L ÷ f 1 = (l 1 '+ T'-l 4 ) ÷ f 1 = (l 1 ' + T'-l 4 ) / f 1 ... (7) Drill rise time = L ÷ F 0 = L / F 0 ... (8) Eventually, the vertical movement time (seconds) of the drill 12 from the formulas (7) and (8) is (l 1 ′ + T′−l) 4 ) / f 1 + L / F (9) Since l 1 + T = l 1 ′ + T ′, equation (6)
Equation (9) has the same value, and the drilling speed is the same, so that the processing efficiency is reduced by the increase in the air cut amount (no-load moving amount) for the printed board 15 having the minimum thickness.
【００１６】一方、図３は本発明による実施例を示すも
ので、図３（１）は図２（１）と同様最大厚みのプリン
ト基板１５を穴あけする場合のドリル１２のエアーカッ
ト量（無負荷移動量）ｌ1 の最適状態を示し、図３
（２）は厚み測定装置５により未加工プリント基板４の
厚みを測定し、ドリル１２の上昇待機位置Ａを再セット
した状態を示す。この場合、次の関係式が成立する。 プリント基板の厚みの差 Ｔ≫Ｔ′ …(1) ドリルの上下移動量 ｌ1 ＋Ｔ−ｌ4 ＝Ｌ≫ｌ1 ＋Ｔ′−ｌ4 ＝Ｌ′…(2) ′ エアーカット量 Ｌ−Ｔ＋ｌ4 ＝ｌ1 ＝Ｌ′−Ｔ′＋ｌ4 On the other hand, FIG. 3 shows an embodiment according to the present invention, and FIG. 3 (1) shows an air cut amount of a drill 12 (nothing) when a printed circuit board 15 having a maximum thickness is drilled similarly to FIG. 2 (1). FIG. 3 shows an optimal state of the load transfer amount) l 1 and FIG.
(2) shows a state where the thickness of the unprocessed printed circuit board 4 is measured by the thickness measuring device 5 and the rising standby position A of the drill 12 is reset. In this case, the following relational expression holds. Difference in thickness of printed circuit board T≫T '(1) Vertical movement amount of drill l 1 + T-l 4 = L≫l 1 + T'-l 4 = L' ... (2) 'Air cut amount L-T + l 4 = L 1 = L'-T '+ l 4
【００１７】最小厚みのプリント基板１５を穴あけする
場合、穴あけ送り速度をｆ1 mm／min 、上昇速度をＦ0
mm／min とすれば、図３（２）において ドリル下降時間＝Ｌ′÷ｆ1 ＝（ｌ1 ＋Ｔ′−ｌ4 ）÷ｆ1 ＝（ｌ1 ＋Ｔ′−ｌ4 ）／ｆ1 …(10) ドリル上昇時間＝Ｌ′÷Ｆ0 ＝Ｌ′／Ｆ0 …(11) 結局、(10)(11)式からドリル１２の上下移動時間（秒）
は （ｌ1 ＋Ｔ′−ｌ4 ）／ｆ1 ＋Ｌ′／Ｆ0 …(12) となり、 （ｌ1 ＋Ｔ−ｌ4 ）／ｆ1 ＋Ｌ／Ｆ0 ≫（ｌ1 ＋Ｔ′−
ｌ4 ）／ｆ1 ＋Ｌ′／Ｆ0 プリント基板１５の厚みの減少した分だけドリル１２の
上下移動時間が減少することとなり、加工能率が向上す
る。When drilling a printed circuit board 15 having a minimum thickness, the drilling feed speed is f 1 mm / min, and the rising speed is F 0.
if mm / min, 3 (2) drill Fall Time = L '÷ f 1 = ( l 1 + T'-l 4) ÷ f 1 = (l 1 + T'-l 4) / f 1 ... ( 10) Drill rise time = L '÷ F 0 = L' / F 0 (11) Eventually, the vertical movement time (seconds) of the drill 12 from the equations (10) and (11).
Is (l 1 + T'-l 4 ) / f 1 + L '/ F 0 (12), and (l 1 + T-l 4 ) / f 1 + L / F 0 ≫ (l 1 + T'-)
l 4 ) / f 1 + L ′ / F 0 The vertical movement time of the drill 12 is reduced by the reduced thickness of the printed circuit board 15, and the processing efficiency is improved.
【００１８】[0018]
【発明の効果】以上、詳述したように本発明によれば、
プリント基板の厚みを穴あけ加工前に実測し、ドリル１
２の上昇待機位置をエアーカット量（無負荷移動量）が
最小となるように設定変更することにより、エアーカッ
ト時間を短縮できプリント基板の穴あけを従来よりも高
速で能率良く行える。尚、本発明ではプリント基板の厚
み測定装置５を全自動穴あけ機の本機外に取付けてお
り、プリント基板に穴あけを開始するまでにプリント基
板の厚みが測定される。又厚み測定の検出器は接触型及
び無接触型を問わず、プリント基板の厚みが測定可能な
ものであれば良い。As described in detail above, according to the present invention,
Measure the thickness of the printed circuit board before drilling and drill 1
By changing the setting of the ascending standby position 2 so that the air cut amount (no-load moving amount) is minimized, the air cut time can be shortened, and the printed circuit board can be drilled faster and more efficiently than in the past. In the present invention , the thickness measuring device 5 for the printed circuit board is mounted outside the automatic drilling machine .
Thus , the thickness of the printed circuit board is measured before drilling the printed circuit board. Also the detector thickness measurement regardless of contact and contactless, the thickness of the printed circuit board as long as it can measure.
【図１】プリント基板の全自動穴あけ機及び周辺装置を
示す全体図である。FIG. 1 is an overall view showing a fully automatic punching machine for printed circuit boards and peripheral devices.
【図２】従来の作業方法を示す縦側面図である。FIG. 2 is a vertical side view showing a conventional working method.
【図３】本発明の作業方法を示す縦側面図である。FIG. 3 is a vertical side view showing the working method of the present invention.
１ スピンドル ２ 補助テーブル ３ 穴あけ加工途中のプリント基板 ４ 未加工プリント基板 ５ 厚み測定装置 Ａ 上昇待機位置 Ｂ 穴あけ終了位置 Ｃ 穴あけ開始位置 DESCRIPTION OF SYMBOLS 1 Spindle 2 Auxiliary table 3 Printed circuit board in the middle of drilling 4 Unprocessed printed circuit board 5 Thickness measuring device A Ascending standby position B Drilling end position C Drilling start position
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B23B 41/00 B23B 47/18 B26F 1/16 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) B23B 41/00 B23B 47/18 B26F 1/16
Claims (1)
ドリルの送りが自動とされ、ドリルが上昇待機位置から
穴あけ終了位置まで下降して、プリント基板に穴をあけ
るプリント基板の穴あけ方法において、全自動穴あけ機の機外に設置されたプリント基板の厚み
測定装置により、プリント基板の厚みを測定した後、 穴
あけ機の補助テーブル上に未加工プリント基板が自動的
に搬入され所定位置に取付けられ穴あけ加工が開始され
るまでに、前記測定データを穴あけ機ＮＣ装置のドリル
上昇待機位置を計算する演算部に転送し、ドリルの上昇
待機位置を自動的に再設定し、プリント基板の上部表面
とドリル先端との距離を穴あけ加工に必要な最小量に設
定することを特徴とするプリント基板の穴あけ方法。1. A feed drill in full-automatic drilling machines of the printed circuit board is the automatic drill is lowered from a raised standby position to a drilling end position, in drilling method drilling printed circuit board to the printed circuit board, fully automatic The thickness of the printed circuit board installed outside the drilling machine
The measuring device, after measuring the thickness of the printed circuit board, until the raw printed circuit board is attached automatically carried-position drilling on drilling machines of the auxiliary table is started, drilling machines the measurement data Transfers to the calculation unit for calculating the drill rise standby position of the NC unit, automatically resets the drill rise standby position, and sets the distance between the upper surface of the printed circuit board and the drill tip to the minimum amount required for drilling. Drilling method for printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09217192A JP3220219B2 (en) | 1992-03-17 | 1992-03-17 | How to drill printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09217192A JP3220219B2 (en) | 1992-03-17 | 1992-03-17 | How to drill printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05261610A JPH05261610A (en) | 1993-10-12 |
| JP3220219B2 true JP3220219B2 (en) | 2001-10-22 |
Family
ID=14046991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09217192A Expired - Fee Related JP3220219B2 (en) | 1992-03-17 | 1992-03-17 | How to drill printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3220219B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100917612B1 (en) * | 2007-10-17 | 2009-09-17 | 삼성전기주식회사 | Method for machining printed circuit board |
| JP5865753B2 (en) | 2012-03-28 | 2016-02-17 | コマツ産機株式会社 | Combined processing method and combined processing apparatus |
| JP6339428B2 (en) * | 2014-07-04 | 2018-06-06 | ビアメカニクス株式会社 | Drill processing apparatus and drill processing method |
| JP7054587B2 (en) * | 2016-11-25 | 2022-04-14 | ビアメカニクス株式会社 | Drilling equipment and drilling method |
-
1992
- 1992-03-17 JP JP09217192A patent/JP3220219B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05261610A (en) | 1993-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2681732B2 (en) | Method for drilling a drilling machine and a workpiece on the drilling machine | |
| US4865494A (en) | Numerically controlled machine for processing printed circuit boards | |
| JP3220219B2 (en) | How to drill printed circuit boards | |
| JPH07285097A (en) | Device for punching printed circuit board,etc | |
| JPH07171796A (en) | Inner layer pattern position detecting method for multi-layer printed board, drilling method and device therefor | |
| JP3035660B2 (en) | Printed circuit board drilling machine | |
| JP2001139170A (en) | Plate work feeder and plate work boring device provided therewith | |
| CN110062530A (en) | A kind of numerical control drilling machine of processing PCB plate and the cutter replacing method of numerical control drilling machine | |
| JP3375113B2 (en) | Drilling method for printed circuit boards | |
| JP3215572B2 (en) | Spindle rising end setting device when moving processing position in printed circuit board processing device | |
| JP3381864B2 (en) | Printed circuit board drilling machine | |
| JPH0741522B2 (en) | Transfer processing equipment | |
| JP3526966B2 (en) | Drilling equipment for printed circuit boards | |
| EP0506621A2 (en) | A system for measuring, monitoring and comparing the dimensions of panels, suitable in particular for integration into woodworking lines | |
| JP2991380B2 (en) | Processing method and processing device for printed circuit board | |
| JPS63306810A (en) | Printed substrate drill | |
| JPH05228711A (en) | Drilling method for printed board | |
| CN112672502A (en) | PCB (printed circuit board), deep forming processing method thereof and numerical control device | |
| JPH0749166B2 (en) | Machining method and device using the work surface as a reference | |
| JP2901453B2 (en) | Processing method by processing machine such as numerical control router | |
| CN217573203U (en) | Automatic speed control drilling machine for circuit board | |
| JP3284938B2 (en) | Punch press | |
| JPS6117767Y2 (en) | ||
| JPH0319707A (en) | Perforating device for printed circuit board | |
| JP3133596B2 (en) | Component mounting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20010703 |
|
| LAPS | Cancellation because of no payment of annual fees |