JP3217844U - 3D circuit structure - Google Patents

3D circuit structure Download PDF

Info

Publication number
JP3217844U
JP3217844U JP2018002331U JP2018002331U JP3217844U JP 3217844 U JP3217844 U JP 3217844U JP 2018002331 U JP2018002331 U JP 2018002331U JP 2018002331 U JP2018002331 U JP 2018002331U JP 3217844 U JP3217844 U JP 3217844U
Authority
JP
Japan
Prior art keywords
wiring
exposed contact
dimensional
circuit structure
installation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018002331U
Other languages
Japanese (ja)
Inventor
林治宏
張坤全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pin Shine Industrial Co Ltd
Original Assignee
Pin Shine Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pin Shine Industrial Co Ltd filed Critical Pin Shine Industrial Co Ltd
Priority to JP2018002331U priority Critical patent/JP3217844U/en
Application granted granted Critical
Publication of JP3217844U publication Critical patent/JP3217844U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

【課題】絶縁被覆体を用いて導電配線層に防水、防塵、傷つき防止、外れ難く、機密保持及び絶縁の安全基準を満たす機能を持たせ、使用する際の電気的特性を安定させる立体回路構造を提供する。【解決手段】立体回路構造は、立体絶縁基材１と、少なくとも１つの回路パターン部２と、絶縁被覆体３とを備える。前記立体絶縁基材１は、少なくとも１つの配線設置領域１１と、少なくとも１つの露出接点設置領域１２とを有する。前記回路パターン部２は、前記立体絶縁基材１に設けられるとともに、前記配線設置領域１１に設けられた少なくとも１つの配線層２１と、前記配線層２１に接続されるとともに前記露出接点設置領域１２に設けられた少なくとも１つの露出接点２２とを有する。前記絶縁被覆体３は、前記配線設置領域１１及び前記配線層２１を覆う。【選択図】図２An object of the present invention is to provide a three-dimensional circuit structure in which a conductive wiring layer is waterproofed, dustproofed, prevented from being scratched, hardly detached, has a function of satisfying safety standards for confidentiality and insulation, and stabilizes electrical characteristics when used. I will provide a. A three-dimensional circuit structure includes a three-dimensional insulating base material, at least one circuit pattern portion, and an insulating covering. The three-dimensional insulating substrate 1 has at least one wiring installation area 11 and at least one exposed contact installation area 12. The circuit pattern portion 2 is provided on the three-dimensional insulating base material 1, and is connected to the wiring layer 21 and at least one wiring layer 21 provided in the wiring installation region 11 and the exposed contact installation region 12. At least one exposed contact 22. The insulating cover 3 covers the wiring installation region 11 and the wiring layer 21. [Selection] Figure 2

Description

本考案は、立体回路構造に関し、特に、防水、防塵、傷つき防止が可能であり、外れ難く、機密保持及び絶縁の安全基準を満たす立体回路構造に関する。   The present invention relates to a three-dimensional circuit structure, and more particularly, to a three-dimensional circuit structure that can be waterproof, dustproof, and scratch-resistant and that does not easily come off and satisfies safety standards for security and insulation.

電子製品が小型化、軽量化及び多機能化に向かって発展するに従い、電子部品及び回路設計は、立体化に向かって進化しており、立体的に設計することにより、制限された体積下、回路を複雑にし、電子部品の見掛け体積を小さくすることができる上、その元々の機能に悪影響を与えることがない。   As electronic products develop toward miniaturization, weight reduction and multi-functionality, electronic components and circuit design have evolved toward three-dimensionalization, and by designing in three dimensions, under limited volume, The circuit can be complicated, the apparent volume of the electronic component can be reduced, and the original function is not adversely affected.

従来の立体回路の製造方式でよく利用される加工技術には、２成分インジェクション成型（Ｂｉ−ｉｎｊｅｃｔｉｏｎ ｍｏｌｄｉｎｇ）、レーザカット加工、ＩＭＤ（Ｉｎ−Ｍｏｌｄ Ｄｅｃｏｒａｔｉｏｎ）インジェクション成型、グラビア印刷インジェクション成型、熱圧加工成形、現像−エッチングなどが含まれる。一般によく見かけるのはレーザカット加工であるが、その装置は高価であり、ＩＭＤインジェクション成型によく起きる問題として、インク印刷、フィルム変形、プラスチックとフィルムとが結合するなどの問題があった。   The processing techniques often used in conventional 3D circuit manufacturing methods include two-component injection molding (Bi-injection molding), laser cut processing, IMD (In-Mold Detection) injection molding, gravure printing injection molding, and hot-pressure processing. Molding, development-etching and the like are included. In general, laser cut processing is often seen, but the apparatus is expensive, and problems that frequently occur in IMD injection molding include problems such as ink printing, film deformation, and plastic and film bonding.

しかし、立体回路を上述したどの方式で製造したとしても、その金属導電配線は、基板（ｃａｒｒｉｅｒ）表面のみに設けられ、金属導電配線及び基板の外部には如何なる防護設計も施されていなかったため、金属導電配線が露出された状態にあり、手で持ったり後続の製造工程を行ったりするときに、金属導電配線の付着力が低いため、手で持ったり後続の製造工程を行ったりするときに外れてしまうことがあり、立体回路構造を使用するときの電気的特性に悪影響を与えることがあった。また、金属導電配線が露出された状態にあるため、立体回路の配線の機密性を保ったり、絶縁の安全基準を満たしたりすることはできなかった。   However, even if the three-dimensional circuit is manufactured by any of the methods described above, the metal conductive wiring is provided only on the surface of the substrate (carrier), and no protective design has been applied to the outside of the metal conductive wiring and the substrate. When the metal conductive wiring is exposed and held by hand or in the subsequent manufacturing process, the adhesive strength of the metal conductive wiring is low, so when holding by hand or performing the subsequent manufacturing process The electrical characteristics when using the three-dimensional circuit structure may be adversely affected. In addition, since the metal conductive wiring is exposed, the confidentiality of the wiring of the three-dimensional circuit cannot be maintained and the safety standards for insulation cannot be satisfied.

そのため、防水、防塵、傷つき防止、外れ難く、機密保持及び絶縁の安全基準を満たし、使用する際の電気的特性を安定させる立体回路構造が求められていた。   Therefore, there has been a demand for a three-dimensional circuit structure that is waterproof, dustproof, prevents scratches, is difficult to come off, satisfies safety standards for confidentiality and insulation, and stabilizes electrical characteristics when used.

本考案の目的は、絶縁被覆体を用いて導電配線層に防水、防塵、傷つき防止、外れ難く、機密保持及び絶縁の安全基準を満たす機能を持たせ、使用する際の電気的特性を安定させる立体回路構造を提供することにある。   The purpose of the present invention is to provide a function that satisfies the safety standards of confidentiality and insulation, and stabilizes the electrical characteristics when used, by using an insulating coating to provide the conductive wiring layer with waterproof, dustproof, scratch-resistant, hard to remove The object is to provide a three-dimensional circuit structure.

上記課題を解決するために、本考案の第１の形態によれば、立体絶縁基材と、少なくとも１つの回路パターン部と、絶縁被覆体と、を備えた立体回路構造であって、前記立体絶縁基材は、少なくとも１つの配線設置領域と、少なくとも１つの露出接点設置領域と、を有し、前記回路パターン部は、前記立体絶縁基材に設けられるとともに、前記配線設置領域に設けられた少なくとも１つの配線層と、前記配線層に接続されるとともに前記露出接点設置領域に設けられた少なくとも１つの露出接点と、を有し、前記絶縁被覆体は、前記配線設置領域及び前記配線層を覆うことを特徴とする立体回路構造が提供される。   In order to solve the above-described problem, according to a first aspect of the present invention, there is provided a three-dimensional circuit structure including a three-dimensional insulating substrate, at least one circuit pattern portion, and an insulating covering, The insulating substrate has at least one wiring installation region and at least one exposed contact installation region, and the circuit pattern portion is provided in the three-dimensional insulating substrate and provided in the wiring installation region. At least one wiring layer; and at least one exposed contact that is connected to the wiring layer and provided in the exposed contact installation area; and the insulating covering includes the wiring installation area and the wiring layer. A three-dimensional circuit structure characterized by covering is provided.

前記立体絶縁基材は、平板状又は湾曲状であることが好ましい。   The three-dimensional insulating base material is preferably flat or curved.

前記配線設置領域は平板状であり、前記配線層は、前記配線設置領域の表面に形成され、前記露出接点設置領域は平板状であり、前記露出接点は、前記露出接点設置領域の表面に設けられることが好ましい。   The wiring installation area is flat, the wiring layer is formed on the surface of the wiring installation area, the exposed contact installation area is flat, and the exposed contact is provided on the surface of the exposed contact installation area. It is preferred that

前記配線設置領域は平板状であり、前記配線層は、前記配線設置領域の表面に形成され、前記露出接点設置領域は、少なくとも２つの露出接点設置溝を有し、前記露出接点は、前記露出接点設置溝に設けられることが好ましい。   The wiring installation area is flat, the wiring layer is formed on a surface of the wiring installation area, the exposed contact installation area has at least two exposed contact installation grooves, and the exposed contact is the exposed It is preferable to be provided in the contact installation groove.

前記配線設置領域は、少なくとも１つの配線設置溝を有し、前記露出接点設置領域は、少なくとも２つの露出接点設置溝を有し、前記配線設置溝は、前記露出接点設置溝に連通し、前記配線層は、前記配線設置溝に形成され、前記露出接点は、前記露出接点設置溝に設けられることが好ましい。   The wiring installation area has at least one wiring installation groove, the exposed contact installation area has at least two exposed contact installation grooves, and the wiring installation groove communicates with the exposed contact installation groove, Preferably, the wiring layer is formed in the wiring installation groove, and the exposed contact is provided in the exposed contact installation groove.

前記配線設置領域は、前記立体絶縁基材の表面に形成され、前記立体絶縁基材は、前記露出接点設置領域を２つ有し、前記配線層が前記配線設置領域に形成されるとともに、前記露出接点設置領域に前記露出接点がそれぞれ配設されると、単一面の前記立体回路構造が形成されることが好ましい。   The wiring installation area is formed on the surface of the three-dimensional insulating base material, the three-dimensional insulating base material has two exposed contact installation areas, the wiring layer is formed in the wiring installation area, and When the exposed contacts are respectively disposed in the exposed contact installation region, it is preferable that the three-dimensional circuit structure having a single surface is formed.

前記立体絶縁基材は、背中合わせの２つの表面に、前記配線設置領域及び前記露出接点設置領域がそれぞれ形成され、前記配線設置領域には、互いに接続された前記配線層がそれぞれ形成されるともに、前記露出接点設置領域に前記露出接点がそれぞれ配設されると、両面の前記立体回路構造が形成されることが好ましい。   In the three-dimensional insulating base material, the wiring installation area and the exposed contact installation area are respectively formed on two surfaces back to back, and the wiring installation area is formed with the wiring layers connected to each other. It is preferable that the three-dimensional circuit structure on both sides is formed when the exposed contacts are respectively disposed in the exposed contact installation area.

前記立体絶縁基材は、前記配線設置領域に連通するチャネル部を有し、前記配線層は、前記チャネル部に設けられて互いに接続された伝導部をそれぞれ有することが好ましい。   It is preferable that the three-dimensional insulating base material has a channel portion communicating with the wiring installation region, and the wiring layer has conductive portions provided in the channel portion and connected to each other.

前記立体絶縁基材は円筒状であり、前記立体絶縁基材と前記絶縁被覆体との間には、層間絶縁層が形成され、前記層間絶縁層は、導体設置溝を有し、前記導体設置溝は、前記配線層に連通した少なくとも１つのチャネル部と、導体と、を有し、前記導体は、前記チャネル部に設けられるとともに、前記配線層に接続された伝導部を有し、前記立体回路構造が円筒状に形成されることが好ましい。   The three-dimensional insulating base material is cylindrical, and an interlayer insulating layer is formed between the three-dimensional insulating base material and the insulating covering. The interlayer insulating layer has a conductor installation groove, and the conductor installation The groove has at least one channel portion communicating with the wiring layer and a conductor, and the conductor has a conductive portion provided in the channel portion and connected to the wiring layer, and The circuit structure is preferably formed in a cylindrical shape.

前記層間絶縁層は、前記露出接点に対応する凹部を有し、前記絶縁被覆体は、前記凹部及び前記露出接点に対応する第１の切欠き部と、前記導体の一端に対応する第２の切欠き部と、を有することが好ましい。   The interlayer insulating layer has a recess corresponding to the exposed contact, and the insulating cover includes a first notch corresponding to the recess and the exposed contact, and a second corresponding to one end of the conductor. It is preferable to have a notch.

本考案の立体回路構造は、絶縁被覆体を用いて導電配線層に防水、防塵、傷つき防止が可能であり、外れ難く、機密保持及び絶縁の安全基準を満たす機能を持たせ、使用する際の電気的特性を安定させる。   The three-dimensional circuit structure of the present invention is waterproof, dustproof, and scratch-proof to the conductive wiring layer using an insulation coating, is difficult to come off, has a function that satisfies the security standards of confidentiality and insulation, Stabilize electrical characteristics.

図１は、本考案の第１実施形態に係る立体回路構造を示す斜視図である。FIG. 1 is a perspective view showing a three-dimensional circuit structure according to a first embodiment of the present invention. 図２は、本考案の第１実施形態に係る立体回路構造を示す分解斜視図である。FIG. 2 is an exploded perspective view showing a three-dimensional circuit structure according to the first embodiment of the present invention. 図３は、本考案の第２実施形態に係る立体回路構造を示す斜視図である。FIG. 3 is a perspective view showing a three-dimensional circuit structure according to the second embodiment of the present invention. 図４は、本考案の第２実施形態に係る立体回路構造を示す分解斜視図である。FIG. 4 is an exploded perspective view showing a three-dimensional circuit structure according to the second embodiment of the present invention. 図５は、本考案の第３実施形態に係る立体回路構造を示す斜視図である。FIG. 5 is a perspective view showing a three-dimensional circuit structure according to the third embodiment of the present invention. 図６は、本考案の第３実施形態に係る立体回路構造を示す分解斜視図である。FIG. 6 is an exploded perspective view showing a three-dimensional circuit structure according to the third embodiment of the present invention. 図７は、本考案の第３実施形態に係る立体回路構造に電子部品を結合した状態を示す斜視図である。FIG. 7 is a perspective view illustrating a state in which electronic components are coupled to the three-dimensional circuit structure according to the third embodiment of the present invention. 図８は、本考案の第４実施形態に係る立体回路構造を示す斜視図である。FIG. 8 is a perspective view showing a three-dimensional circuit structure according to the fourth embodiment of the present invention. 図９は、本考案の第５実施形態に係る立体回路構造を示す斜視図である。FIG. 9 is a perspective view showing a three-dimensional circuit structure according to the fifth embodiment of the present invention. 図１０は、本考案の第５実施形態に係る立体回路構造を示す分解斜視図である。FIG. 10 is an exploded perspective view showing a three-dimensional circuit structure according to the fifth embodiment of the present invention. 図１１は、本考案の第５実施形態に係る立体回路構造を示す別の分解斜視図である。FIG. 11 is another exploded perspective view showing a three-dimensional circuit structure according to the fifth embodiment of the present invention. 図１２は、本考案の第６実施形態に係る立体回路構造を示す斜視図である。FIG. 12 is a perspective view showing a three-dimensional circuit structure according to the sixth embodiment of the present invention. 図１３は、本考案の第６実施形態に係る立体回路構造を示す分解斜視図である。FIG. 13 is an exploded perspective view showing a three-dimensional circuit structure according to the sixth embodiment of the present invention.

以下、本考案の目的、特徴及び効果をより分かりやすくするために、具体的な実施形態について図面に基づいて詳しく説明する。   Hereinafter, in order to make the purpose, features, and effects of the present invention easier to understand, specific embodiments will be described in detail with reference to the drawings.

（第１実施形態）
図１及び図２を参照する。図１及び図２に示すように、本考案の第１実施形態に係る立体回路構造は、少なくとも立体絶縁基材１と、少なくとも１つの回路パターン部２と、絶縁被覆体３と、から構成される。 (First embodiment)
Please refer to FIG. 1 and FIG. As shown in FIGS. 1 and 2, the three-dimensional circuit structure according to the first embodiment of the present invention includes at least a three-dimensional insulating base material 1, at least one circuit pattern portion 2, and an insulating covering 3. The

立体絶縁基材１は、少なくとも１つの配線設置領域１１と、少なくとも１つの露出接点設置領域１２と、を含む。立体絶縁基材１は、プラスチック、ゴム、熱可塑性ゴム（ｔｈｅｒｍｏ−ｐｌａｓｔｉｃｓ）又はエポキシ樹脂からなっていてもよい。配線設置領域１１は、立体絶縁基材１の表面に形成される。露出接点設置領域１２は、立体絶縁基材１の任意の箇所に形成される。第１実施形態の露出接点設置領域１２は、立体絶縁基材１の端縁に隣り合う箇所に位置する。   The three-dimensional insulating substrate 1 includes at least one wiring installation area 11 and at least one exposed contact installation area 12. The three-dimensional insulating base material 1 may be made of plastic, rubber, thermoplastic rubber (thermo-plastics) or epoxy resin. The wiring installation area 11 is formed on the surface of the three-dimensional insulating base material 1. The exposed contact installation area 12 is formed at an arbitrary location on the three-dimensional insulating base material 1. The exposed contact placement region 12 of the first embodiment is located at a location adjacent to the edge of the three-dimensional insulating base material 1.

回路パターン部２は、立体絶縁基材１に設けられるとともに、配線設置領域１１に設けられた少なくとも１つの配線層２１と、配線層２１に接続されるとともに露出接点設置領域１２に設けられた少なくとも１つの露出接点２２と、を含む。第１実施形態では、回路パターン部２、配線層２１及び２つの露出接点２２を例にとると、配線層２１が露出接点２２と一体成形され、回路パターン部２は、銅、ニッケル、金、スズなどからなっていてもよい。   The circuit pattern portion 2 is provided on the three-dimensional insulating base material 1, and at least one wiring layer 21 provided in the wiring installation region 11, and at least provided in the exposed contact installation region 12 while being connected to the wiring layer 21. One exposed contact 22. In the first embodiment, taking the circuit pattern part 2, the wiring layer 21, and the two exposed contacts 22 as an example, the wiring layer 21 is integrally formed with the exposed contact 22, and the circuit pattern part 2 is made of copper, nickel, gold, It may be made of tin.

絶縁被覆体３は、配線設置領域１１及び配線層２１を覆う。絶縁被覆体３は、プラスチック、ゴム、熱可塑性ゴム又はエポキシ樹脂からなっていてもよい。   The insulating cover 3 covers the wiring installation area 11 and the wiring layer 21. The insulating cover 3 may be made of plastic, rubber, thermoplastic rubber, or epoxy resin.

第１実施形態に係る立体回路構造を製造する際、レーザ、メッキ、或いはレーザ結合化学メッキ方式により配線層２１を配線設置領域１１に形成し、露出接点２２を露出接点設置領域１２にそれぞれ形成した後、絶縁被覆体３により配線設置領域１１及び配線層２１を覆い、露出接点２２を露出した状態にして、立体絶縁基材１の表面上に回路パターン部２が形成され、単一面の立体回路構造が形成され、配線層２１が絶縁被覆体３により覆われ、防水、防塵、傷つき防止が可能であり、外れ難く、機密保持及び絶縁の安全基準を満たすことができる。   When manufacturing the three-dimensional circuit structure according to the first embodiment, the wiring layer 21 is formed in the wiring installation region 11 by the laser, plating, or laser coupled chemical plating method, and the exposed contact 22 is formed in the exposed contact installation region 12, respectively. After that, the wiring installation region 11 and the wiring layer 21 are covered with the insulating covering 3 and the exposed contact 22 is exposed, and the circuit pattern portion 2 is formed on the surface of the three-dimensional insulating base material 1. A structure is formed, and the wiring layer 21 is covered with the insulating cover 3 so that it can be waterproofed, dustproofed and prevented from being damaged, is not easily detached, and can meet safety standards for confidentiality and insulation.

第１実施形態に係る立体回路構造は、実際の必要に応じて立体絶縁基材１を平板状又は湾曲状に形成してもよいが、第１実施形態の立体絶縁基材１は、平板状を例にする。また、配線設置領域１１は平板状である。回路パターン部２の配線層２１は、配線設置領域１１の表面に形成される。露出接点設置領域１２は平板状である。露出接点２２は、露出接点設置領域１２の表面に設けられる。このように、配線層２１及び露出接点２２は、立体絶縁基材１の表面の形状に応じて形成することができる。   In the three-dimensional circuit structure according to the first embodiment, the three-dimensional insulating base material 1 may be formed into a flat plate shape or a curved shape according to actual needs. However, the three-dimensional insulating base material 1 according to the first embodiment has a flat plate shape. Take as an example. Moreover, the wiring installation area | region 11 is flat form. The wiring layer 21 of the circuit pattern unit 2 is formed on the surface of the wiring installation region 11. The exposed contact installation area 12 has a flat plate shape. The exposed contact 22 is provided on the surface of the exposed contact installation area 12. Thus, the wiring layer 21 and the exposed contact 22 can be formed according to the shape of the surface of the three-dimensional insulating substrate 1.

（第２実施形態）
図３及び図４を参照する。図３及び図４に示すように、本考案の第２実施形態に係る立体回路構造は、立体絶縁基材１の配線設置領域１１が平板状である。配線層２１は、配線設置領域１１の表面に形成される。露出接点設置領域１２は、少なくとも２つの露出接点設置溝１２１を有する。露出接点２２は、露出接点設置溝１２１に配設される。露出接点２２を配設した後でも高い付着力を有するため外れ難く、後続の加工作業を容易に行うことができる。 (Second Embodiment)
Please refer to FIG. 3 and FIG. As shown in FIGS. 3 and 4, in the three-dimensional circuit structure according to the second embodiment of the present invention, the wiring installation region 11 of the three-dimensional insulating base material 1 is flat. The wiring layer 21 is formed on the surface of the wiring installation area 11. The exposed contact installation area 12 has at least two exposed contact installation grooves 121. The exposed contact 22 is disposed in the exposed contact installation groove 121. Even after the exposed contact 22 is provided, it has a high adhesive force and is difficult to come off, so that subsequent processing operations can be easily performed.

（第３実施形態）
図５〜図７を参照する。図５〜図７に示すように、本考案の第３実施形態に係る立体回路構造の配線設置領域１１は、少なくとも１つの配線設置溝１１１を有する。露出接点設置領域１２は、少なくとも２つの露出接点設置溝１２１を有する。配線設置溝１１１は、露出接点設置溝１２１と連通する。配線層２１は、配線設置溝１１１に形成される。露出接点２２は、露出接点設置溝１２１に設けられ、配線層２１及び露出接点２２を設けた後も高い付着力を有するため、脱落し難く、後続の加工作業を都合よく行うことができる。 (Third embodiment)
Please refer to FIG. As shown in FIGS. 5 to 7, the wiring installation region 11 of the three-dimensional circuit structure according to the third embodiment of the present invention has at least one wiring installation groove 111. The exposed contact installation area 12 has at least two exposed contact installation grooves 121. The wiring installation groove 111 communicates with the exposed contact installation groove 121. The wiring layer 21 is formed in the wiring installation groove 111. Since the exposed contact 22 is provided in the exposed contact installation groove 121 and has a high adhesive force even after the wiring layer 21 and the exposed contact 22 are provided, the exposed contact is difficult to drop off, and subsequent processing operations can be performed conveniently.

回路パターン部２を立体絶縁基材１に配設した後、必要に応じて配線層２１２を関連した電子部品４に成形し、その後、絶縁被覆体３により配線設置領域１１、配線層２１及び電子部品４を覆うとともに、複数の露出接点２２を介して関連した装置又は電子部品と電気的に接続し（図示せず）、本考案の立体回路構造を幅広く応用することができる。   After the circuit pattern portion 2 is disposed on the three-dimensional insulating base material 1, the wiring layer 212 is formed into an associated electronic component 4 as necessary, and then the wiring coating region 11, the wiring layer 21, and the electronics are formed by the insulating coating 3. The component 4 is covered and electrically connected to an associated device or electronic component (not shown) through a plurality of exposed contacts 22, so that the three-dimensional circuit structure of the present invention can be widely applied.

（第４実施形態）
図８を参照する。図８に示すように、本考案の第４実施形態に係る立体回路構造は、絶縁被覆体３の任意の箇所に１つ又は２つ以上の穿孔３３が形成され、配線層２１の対応する穿孔３３に別の露出接点２２が形成され、露出接点２２が立体絶縁基材１の端縁に隣り合う位置に設けたり、必要に応じて任意の箇所に設けたりすることができる。 (Fourth embodiment)
Please refer to FIG. As shown in FIG. 8, in the three-dimensional circuit structure according to the fourth embodiment of the present invention, one or two or more perforations 33 are formed in any part of the insulating covering 3, and the corresponding perforations of the wiring layer 21 are formed. Another exposed contact 22 is formed at 33, and the exposed contact 22 can be provided at a position adjacent to the edge of the three-dimensional insulating base material 1, or can be provided at an arbitrary position as necessary.

（第５実施形態）
図９〜図１１を参照する。図９〜図１１に示すように、本考案の第５実施形態に係る立体回路構造の立体絶縁基材１ａは、背中合わせの２つの表面に、配線設置領域１１，１１ａ及び露出接点設置領域１２，１２ａがそれぞれ形成される。立体絶縁基材１ａは、配線設置領域１１，１１ａに連通するチャネル部５２を有するとともに、第５実施形態の配線設置領域１１，１１ａは、少なくとも１つの配線設置溝１１１，１１１ａをそれぞれ有する。チャネル部５２は、配線設置溝１１１，１１１ａに連通する。また、露出接点設置領域１２，１２ａは、少なくとも１つの露出接点設置溝１２１，１２１ａをそれぞれ有し、露出接点設置溝１２１，１２１ａが立体絶縁基材１ａの一端縁に隣り合う箇所にそれぞれ位置する。配線設置領域１１，１１ａの配線設置溝１１１，１１１ａ中に配線層２１，２１ａがそれぞれ形成され、複数の露出接点設置溝１２１，１２１ａ中にそれぞれ露出接点２２，２２ａが設けられる。露出接点設置溝１２１，１２１ａ及び露出接点２２，２２ａは、必要に応じて立体絶縁基材１ａの任意の箇所に設けられるが、本考案の位置はこれらだけに限定されず、配線層２１，２１ａは、伝導部２１１，２１１ａによりチャネル部５２を介して接続され、配線層２１，２１ａを導通させた後、絶縁被覆体３により配線設置領域１１，１１ａ及び配線層２１，２１ａを覆い、露出接点２２，２２ａが露出された状態となり、立体絶縁基材１ａが背中合わせの２つの表面に回路パターン部２，２ａが設けられ、これにより両面の立体回路構造を形成する。両面の立体回路構造は、同様に複数の配線層２１，２１ａに電子部品が設置されるとともに、複数の露出接点２２，２２ａを介し、関連した装置又は電子部品と電気的に接続される（図示せず）。 (Fifth embodiment)
Please refer to FIGS. As shown in FIGS. 9 to 11, a three-dimensional insulating base material 1 a having a three-dimensional circuit structure according to a fifth embodiment of the present invention has wiring installation areas 11, 11 a and exposed contact installation areas 12, 12a is formed. The three-dimensional insulating substrate 1a has a channel portion 52 that communicates with the wiring installation areas 11 and 11a, and the wiring installation areas 11 and 11a of the fifth embodiment have at least one wiring installation grooves 111 and 111a, respectively. The channel portion 52 communicates with the wiring installation grooves 111 and 111a. Moreover, the exposed contact installation areas 12 and 12a have at least one exposed contact installation groove 121 and 121a, respectively, and the exposed contact installation grooves 121 and 121a are respectively located at positions adjacent to one end edge of the three-dimensional insulating substrate 1a. . Wiring layers 21 and 21a are formed in the wiring installation grooves 111 and 111a of the wiring installation regions 11 and 11a, respectively, and exposed contacts 22 and 22a are provided in the plurality of exposed contact installation grooves 121 and 121a, respectively. The exposed contact installation grooves 121 and 121a and the exposed contacts 22 and 22a are provided at arbitrary locations on the three-dimensional insulating base 1a as necessary. However, the position of the present invention is not limited to these, and the wiring layers 21 and 21a. Are connected via the channel portion 52 by the conductive portions 211 and 211a, and after making the wiring layers 21 and 21a conductive, the insulating covering 3 covers the wiring installation regions 11 and 11a and the wiring layers 21 and 21a, and is exposed contacts. 22 and 22a are exposed, and circuit pattern portions 2 and 2a are provided on two surfaces of the three-dimensional insulating substrate 1a that are back to back, thereby forming a three-dimensional circuit structure on both sides. In the double-sided three-dimensional circuit structure, electronic components are similarly installed on the plurality of wiring layers 21 and 21a, and are electrically connected to related devices or electronic components via the plurality of exposed contacts 22 and 22a (see FIG. Not shown).

（第６実施形態）
図１２及び図１３を参照する。図１２及び図１３に示すように、本考案の第６実施形態に係る立体回路構造の立体絶縁基材１ｂは、円筒状である。第６実施形態の配線設置領域１１ｂ及び露出接点設置領域１２ｂは、互いに連通する露出接点設置溝１２１ｂ及び配線設置溝１１１ｂを有する（配線設置領域１１ｂ及び露出接点設置領域１２ｂは平面状でもよいが、ここでは図示しない）。配線設置溝１１１ｂは螺旋状であり、回路パターン部２ｂの配線層２１ｂ及び露出接点２２ｂは、配線設置溝１１１ｂ及び露出接点設置溝１２１ｂにそれぞれ設けられ、配線層２１ｂは、配線設置溝１１１ｂに対応するように螺旋状に形成され、立体絶縁基材１ｂと絶縁被覆体３との間には層間絶縁層５が形成されている。層間絶縁層５は、導体設置溝５１を有する。導体設置溝５１は、配線層２１ｂに連通する少なくとも１つのチャネル部５２を有する。導体設置溝５１中には、導体５３が設けられる。導体５３は、銅、ニッケル、金、スズなどからなる。導体５３は、チャネル部５２に設けられるとともに、配線層２１ｂに接続された伝導部５３１を有する。層間絶縁層５は、露出接点２２ｂに対応する凹部５４を有する。絶縁被覆体３は、凹部５４に対応するとともに、露出接点された第１の切欠き部３１と、導体５３の一端に対応する第２の切欠き部３２と、を有する。このように、円筒状の立体回路構造を構成することができる。円筒状の立体回路構造は、同様に回路パターン部２ｂの複数の配線層２１ｂに電子部品を設置し、第１の切欠き部３１及び第２の切欠き部３２を介し、露出接点２２ｂ及び導体５３により、関連した装置又は電子部品と電気的に接続する（図示せず）。 (Sixth embodiment)
Please refer to FIG. 12 and FIG. As shown in FIG.12 and FIG.13, the three-dimensional-insulation base material 1b of the three-dimensional circuit structure based on 6th Embodiment of this invention is cylindrical. The wiring installation area 11b and the exposed contact installation area 12b of the sixth embodiment have an exposed contact installation groove 121b and a wiring installation groove 111b that communicate with each other (the wiring installation area 11b and the exposed contact installation area 12b may be planar, Not shown here). The wiring installation groove 111b is spiral, and the wiring layer 21b and the exposed contact 22b of the circuit pattern portion 2b are provided in the wiring installation groove 111b and the exposed contact installation groove 121b, respectively, and the wiring layer 21b corresponds to the wiring installation groove 111b. Thus, an interlayer insulating layer 5 is formed between the three-dimensional insulating substrate 1b and the insulating cover 3. The interlayer insulating layer 5 has a conductor installation groove 51. The conductor installation groove 51 has at least one channel portion 52 communicating with the wiring layer 21b. A conductor 53 is provided in the conductor installation groove 51. The conductor 53 is made of copper, nickel, gold, tin, or the like. The conductor 53 has a conductive portion 531 provided in the channel portion 52 and connected to the wiring layer 21b. The interlayer insulating layer 5 has a recess 54 corresponding to the exposed contact 22b. The insulating covering 3 has a first cutout portion 31 corresponding to the recessed portion 54 and exposed to contact, and a second cutout portion 32 corresponding to one end of the conductor 53. Thus, a cylindrical three-dimensional circuit structure can be configured. Similarly, in the cylindrical three-dimensional circuit structure, electronic components are installed on the plurality of wiring layers 21b of the circuit pattern portion 2b, and the exposed contact 22b and the conductor are connected via the first cutout portion 31 and the second cutout portion 32. By 53, it electrically connects with an associated apparatus or electronic component (not shown).

当該分野の技術を熟知するものが理解できるように、本考案の好適な実施形態を前述の通り開示したが、これらは決して本考案を限定するものではない。本考案の主旨と領域を逸脱しない範囲内で各種の変更や修正を加えることができる。従って、本考案の実用新案登録請求の範囲は、このような変更や修正を含めて広く解釈されるべきである。   The preferred embodiments of the present invention have been disclosed as described above so that those skilled in the art can understand them, but these do not limit the present invention in any way. Various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the scope of the utility model registration claim of the present invention should be broadly interpreted including such changes and modifications.

１ 立体絶縁基材
１ａ 立体絶縁基材
１ｂ 立体絶縁基材
２ 回路パターン部
２ａ 回路パターン部
２ｂ 回路パターン部
３ 絶縁被覆体
４ 電子部品
５ 層間絶縁層
１１ 配線設置領域
１１ａ 配線設置領域
１１ｂ 配線設置領域
１２ 露出接点設置領域
１２ａ 露出接点設置領域
１２ｂ 露出接点設置領域
２１ 配線層
２１ａ 配線層
２１ｂ 配線層
２２ 露出接点
２２ａ 露出接点
２２ｂ 露出接点
３１ 第１の切欠き部
３２ 第２の切欠き部
３３ 穿孔
５１ 導体設置溝
５２ チャネル部
５３ 導体
５４ 凹部
１１１ 配線設置溝
１１１ａ 配線設置溝
１１１ｂ 配線設置溝
１２１ 露出接点設置溝
１２１ａ 露出接点設置溝
１２１ｂ 露出接点設置溝
２１１ 伝導部
２１１ａ 伝導部
５３１ 伝導部 DESCRIPTION OF SYMBOLS 1 Three-dimensional insulation base material 1a Three-dimensional insulation base material 1b Three-dimensional insulation base material 2 Circuit pattern part 2a Circuit pattern part 2b Circuit pattern part 3 Insulation coating body 4 Electronic component 5 Interlayer insulation layer 11 Wiring installation area 11a Wiring installation area 11b Wiring installation area 12 Exposed Contact Installation Area 12a Exposed Contact Installation Area 12b Exposed Contact Installation Area 21 Wiring Layer 21a Wiring Layer 21b Wiring Layer 22 Exposed Contact 22a Exposed Contact 22b Exposed Contact 31 First Notch 32 Second Notch 33 Perforation 51 Conductor installation groove 52 Channel part 53 Conductor 54 Recess 111 Wiring installation groove 111a Wiring installation groove 111b Wiring installation groove 121 Exposed contact installation groove 121a Exposed contact installation groove 121b Exposed contact installation groove 211 Conductive part 211a Conductive part 531 Conductive part

Claims (10)

立体絶縁基材と、少なくとも１つの回路パターン部と、絶縁被覆体と、を備えた立体回路構造であって、
前記立体絶縁基材は、少なくとも１つの配線設置領域と、少なくとも１つの露出接点設置領域と、を有し、
前記回路パターン部は、前記立体絶縁基材に設けられるとともに、前記配線設置領域に設けられた少なくとも１つの配線層と、前記配線層に接続されるとともに前記露出接点設置領域に設けられた少なくとも１つの露出接点と、を有し、
前記絶縁被覆体は、前記配線設置領域及び前記配線層を覆うことを特徴とする立体回路構造。 A three-dimensional circuit structure comprising a three-dimensional insulating substrate, at least one circuit pattern portion, and an insulating covering,
The three-dimensional insulating substrate has at least one wiring installation area and at least one exposed contact installation area,
The circuit pattern portion is provided on the three-dimensional insulating substrate, and at least one wiring layer provided in the wiring installation region, and at least one connected to the wiring layer and provided in the exposed contact installation region. Two exposed contacts, and
The three-dimensional circuit structure, wherein the insulating covering covers the wiring installation region and the wiring layer. 前記立体絶縁基材は、平板状又は湾曲状であることを特徴とする請求項１に記載の立体回路構造。   The three-dimensional circuit structure according to claim 1, wherein the three-dimensional insulating substrate is flat or curved. 前記配線設置領域は、平板状であり、
前記配線層は、前記配線設置領域の表面に形成され、
前記露出接点設置領域は平板状であり、
前記露出接点は、前記露出接点設置領域の表面に設けられることを特徴とする請求項１に記載の立体回路構造。 The wiring installation area is flat.
The wiring layer is formed on the surface of the wiring installation area,
The exposed contact installation area is flat.
The three-dimensional circuit structure according to claim 1, wherein the exposed contact is provided on a surface of the exposed contact installation region. 前記配線設置領域は、平板状であり、
前記配線層は、前記配線設置領域の表面に形成され、
前記露出接点設置領域は、少なくとも２つの露出接点設置溝を有し、
前記露出接点は、前記露出接点設置溝に設けられることを特徴とする請求項１に記載の立体回路構造。 The wiring installation area is flat.
The wiring layer is formed on the surface of the wiring installation area,
The exposed contact placement area has at least two exposed contact placement grooves,
The three-dimensional circuit structure according to claim 1, wherein the exposed contact is provided in the exposed contact installation groove. 前記配線設置領域は、少なくとも１つの配線設置溝を有し、
前記露出接点設置領域は、少なくとも２つの露出接点設置溝を有し、
前記配線設置溝は、前記露出接点設置溝に連通し、
前記配線層は、前記配線設置溝に形成され、
前記露出接点は、前記露出接点設置溝に設けられることを特徴とする請求項１に記載の立体回路構造。 The wiring installation area has at least one wiring installation groove,
The exposed contact placement area has at least two exposed contact placement grooves,
The wiring installation groove communicates with the exposed contact installation groove,
The wiring layer is formed in the wiring installation groove,
The three-dimensional circuit structure according to claim 1, wherein the exposed contact is provided in the exposed contact installation groove. 前記配線設置領域は、前記立体絶縁基材の表面に形成され、
前記立体絶縁基材は、前記露出接点設置領域を２つ有し、前記配線層が前記配線設置領域に形成されるとともに、前記露出接点設置領域に前記露出接点がそれぞれ配設されると、単一面の前記立体回路構造が形成されることを特徴とする請求項１に記載の立体回路構造。 The wiring installation area is formed on the surface of the three-dimensional insulating base material,
The three-dimensional insulating base material has two exposed contact installation areas, and when the wiring layer is formed in the wiring installation area and the exposed contacts are disposed in the exposed contact installation area, respectively. The three-dimensional circuit structure according to claim 1, wherein the one-sided three-dimensional circuit structure is formed. 前記立体絶縁基材は、背中合わせの２つの表面に、前記配線設置領域及び前記露出接点設置領域がそれぞれ形成され、前記配線設置領域には、互いに接続された前記配線層がそれぞれ形成されるともに、前記露出接点設置領域に前記露出接点がそれぞれ配設されると、両面の前記立体回路構造が形成されることを特徴とする請求項１に記載の立体回路構造。   In the three-dimensional insulating base material, the wiring installation area and the exposed contact installation area are respectively formed on two surfaces back to back, and the wiring installation area is formed with the wiring layers connected to each other. The three-dimensional circuit structure according to claim 1, wherein the three-dimensional circuit structure on both sides is formed when the exposed contacts are respectively disposed in the exposed contact installation region. 前記立体絶縁基材は、前記配線設置領域に連通するチャネル部を有し、
前記配線層は、前記チャネル部に設けられて互いに接続された伝導部をそれぞれ有することを特徴とする請求項７に記載の立体回路構造。 The three-dimensional insulating substrate has a channel portion communicating with the wiring installation region,
The three-dimensional circuit structure according to claim 7, wherein the wiring layer includes conductive portions provided in the channel portion and connected to each other. 前記立体絶縁基材は、円筒状であり、
前記立体絶縁基材と前記絶縁被覆体との間には、層間絶縁層が形成され、
前記層間絶縁層は、導体設置溝を有し、
前記導体設置溝は、前記配線層に連通した少なくとも１つのチャネル部と、導体と、を有し、
前記導体は、前記チャネル部に設けられるとともに、前記配線層に接続された伝導部を有し、円筒状の前記立体回路構造が形成されることを特徴とする請求項１に記載の立体回路構造。 The three-dimensional insulating substrate is cylindrical,
Between the three-dimensional insulating substrate and the insulating covering, an interlayer insulating layer is formed,
The interlayer insulating layer has a conductor installation groove,
The conductor installation groove has at least one channel portion communicating with the wiring layer, and a conductor,
2. The three-dimensional circuit structure according to claim 1, wherein the conductor is provided in the channel portion and includes a conductive portion connected to the wiring layer, so that the cylindrical three-dimensional circuit structure is formed. . 前記層間絶縁層は、前記露出接点に対応する凹部を有し、
前記絶縁被覆体は、前記凹部及び前記露出接点に対応する第１の切欠き部と、前記導体の一端に対応する第２の切欠き部と、を有することを特徴とする請求項９に記載の立体回路構造。 The interlayer insulating layer has a recess corresponding to the exposed contact,
The said insulation coating | coated body has the 1st notch part corresponding to the said recessed part and the said exposed contact, and the 2nd notch part corresponding to the end of the said conductor, It is characterized by the above-mentioned. 3D circuit structure.
JP2018002331U 2018-06-22 2018-06-22 3D circuit structure Active JP3217844U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018002331U JP3217844U (en) 2018-06-22 2018-06-22 3D circuit structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018002331U JP3217844U (en) 2018-06-22 2018-06-22 3D circuit structure

Publications (1)

Publication Number Publication Date
JP3217844U true JP3217844U (en) 2018-09-06

Family

ID=63444061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018002331U Active JP3217844U (en) 2018-06-22 2018-06-22 3D circuit structure

Country Status (1)

Country Link
JP (1) JP3217844U (en)

Similar Documents

Publication Publication Date Title
TWI685069B (en) Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US7742312B2 (en) Electronic device and method of fabrication of a same
US10861643B2 (en) Wireless charging structure and method for forming the same
TW201043114A (en) Three dimensional antenna
KR20140112325A (en) Electronic device and method for forming thereof
US20130130493A1 (en) Connecting pad producing method
TW200709740A (en) Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same
WO2016181706A1 (en) Electronic circuit module
TW201445374A (en) Sensor substrate
CN103608969B (en) Conducting member and electronic device provided therewith
WO2011134282A1 (en) Antenna device and manufacturing method thereof
US7676918B2 (en) Method for forming a molded circuit board
JP3217844U (en) 3D circuit structure
US11665831B2 (en) Method for manufacturing a circuit board with embedded nickel resistor
TW200927431A (en) A double-molded insert molding product and an electronic device using the double-molded insert molding product
KR20140022420A (en) Structure and structure manufacturing method
WO2014148075A1 (en) Structural body and wireless communication apparatus
US20160105962A1 (en) Flexible substrate and electronic apparatus equipped with same
US11039531B1 (en) System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features
JPH0511498U (en) Electronic component application case
TWM565933U (en) Three-dimensional circuit structure
KR101590080B1 (en) Multi-Layer Substrate And Fabricating Method Thereof
JP2008311544A (en) Method for manufacturing compound multilayer printed-wiring board
US10522533B1 (en) Three-dimensional circuit structure
JP2020006521A (en) Resin molding product and mold for injection molding

Legal Events

Date Code Title Description
R150 Certificate of patent or registration of utility model

Ref document number: 3217844

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250