JP3210261B2 - Boiling cooling device and manufacturing method thereof - Google Patents
Boiling cooling device and manufacturing method thereofInfo
- Publication number
- JP3210261B2 JP3210261B2 JP32625196A JP32625196A JP3210261B2 JP 3210261 B2 JP3210261 B2 JP 3210261B2 JP 32625196 A JP32625196 A JP 32625196A JP 32625196 A JP32625196 A JP 32625196A JP 3210261 B2 JP3210261 B2 JP 3210261B2
- Authority
- JP
- Japan
- Prior art keywords
- boiling
- refrigerant
- heat transfer
- transfer surface
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電力用半導体素子
等の発熱損失を沸騰部での冷媒の沸騰気化、凝縮部での
冷媒蒸気の凝縮液化にて放熱する沸騰冷却装置及びその
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for radiating heat loss of a power semiconductor device or the like by boiling vaporization of a refrigerant in a boiling portion and condensation and liquefaction of a refrigerant vapor in a condensation portion, and a method of manufacturing the same. .
【０００２】[0002]
【従来の技術】近年、電力用半導体素子は大容量化・高
速化に伴い、発熱損失が増大している。このために、電
力用半導体素子を冷却する沸騰冷却装置の冷却効率を上
げ、発熱損失の増大に対応し、高熱密度冷却対応や冷却
装置の大型化を避けることが重要となってきている。2. Description of the Related Art In recent years, heat dissipation loss of power semiconductor devices has been increasing as capacity and speed have been increased. For this reason, it has become important to increase the cooling efficiency of a boiling cooling device for cooling a power semiconductor element, to cope with an increase in heat generation loss, to cope with high heat density cooling, and to avoid increasing the size of the cooling device.
【０００３】以下、従来の沸騰冷却装置の構造を、図２
１及び図２２を参照して説明する。図２１は正面図、図
２２は図２１のＡ−Ａ断面図である。図２１及び図２２
において、沸騰冷却装置は、内部が中空で低沸点冷媒１
が封入された沸騰部２と、沸騰部２内の中空流路とヘッ
ダータンク３を介して連通し他端が閉塞され、低沸点冷
媒１の蒸気４で満たされる凝縮部５からなる密閉容器で
ある。凝縮部５と凝縮部５の間には、フィン６が取り付
けられている。また、電力用半導体素子７は沸騰部２の
外壁面である受熱部２Ａに取り付けられる。さらに、沸
騰部２内の沸騰伝熱面２Ｂは、平面となっている。[0003] The structure of a conventional boiling cooling device is described below with reference to FIG.
1 and FIG. 21 is a front view, and FIG. 22 is a sectional view taken along line AA of FIG. FIG. 21 and FIG.
, The boiling cooling device has a hollow inside and a low boiling point refrigerant 1
And a condensing section 5 which is in communication with the hollow flow path in the boiling section 2 via the header tank 3 and is closed at the other end and is filled with the vapor 4 of the low boiling point refrigerant 1. is there. Fins 6 are attached between the condensers 5. In addition, the power semiconductor element 7 is attached to a heat receiving section 2 </ b> A which is an outer wall surface of the boiling section 2. Further, the boiling heat transfer surface 2B in the boiling portion 2 is a flat surface.
【０００４】このように構成された沸騰冷却装置におい
ては、電力用半導体素子７の発熱損失は、受熱部２Ａを
経て沸騰部２内の沸騰伝熱面２Ｂまで熱伝導により伝わ
る。沸騰伝熱面２Ｂとこれに接する低沸点冷媒１の温度
が、蒸気相を形成するのに十分な条件のもとで、平面で
ある沸騰伝熱面２Ｂの発泡点より気泡核が発生し、気泡
８に成長し、沸騰伝熱面２Ｂより離脱し、沸騰伝熱面２
Ｂから低沸点冷媒１に発熱損失が伝わる。[0004] In the boiling cooling device thus configured, the heat loss of the power semiconductor element 7 is transmitted by heat conduction to the boiling heat transfer surface 2B in the boiling portion 2 via the heat receiving portion 2A. Under the condition that the temperature of the boiling heat transfer surface 2B and the low-boiling refrigerant 1 in contact with the boiling heat transfer surface 2B are sufficient to form a vapor phase, bubble nuclei are generated from the foaming point of the boiling heat transfer surface 2B, It grows into bubbles 8 and separates from the boiling heat transfer surface 2B to form the boiling heat transfer surface 2B.
The heat loss is transmitted from B to the low boiling point refrigerant 1.
【０００５】離脱した気泡８は、浮力により液面に上昇
し、発熱損失は凝縮部５に運ばれる。凝縮部５に運ばれ
た発熱損失は、フィン６間を通る冷却風により放熱され
る。一方、蒸気４は冷却され凝縮して液化し凝縮液９と
なり沸騰部２に戻るサイクルを繰り返す。以上のように
して、電力用半導体素子７は冷却される。[0005] The separated bubbles 8 rise to the liquid level by buoyancy, and the heat loss is transferred to the condensing section 5. The heat loss carried to the condenser 5 is radiated by the cooling air passing between the fins 6. On the other hand, the cycle in which the steam 4 is cooled and condensed and liquefied to become the condensed liquid 9 and returns to the boiling portion 2 is repeated. As described above, the power semiconductor element 7 is cooled.
【０００６】[0006]
【発明が解決しようとする課題】このとき、沸騰部２内
では低沸点冷媒１から発生した気泡８と凝縮部５から沸
騰部２に戻る凝縮液９が、さらに凝縮部５内では低沸点
冷媒１から発生した蒸気４と凝縮部５から沸騰部２に戻
る凝縮液９が、同一流路内を通るため、沸騰部２内で気
泡８と凝縮液９が干渉し、沸騰伝熱面２Ｂの発泡点より
気泡核が発生し、気泡８に成長し沸騰伝熱面２Ｂより離
脱するというサイクルの効率が悪く、沸騰熱伝達率が小
さい。At this time, the bubbles 8 generated from the low-boiling refrigerant 1 and the condensate 9 returning from the condensing section 5 to the boiling section 2 in the boiling section 2 and the low-boiling refrigerant in the condensing section 5 Since the vapor 4 generated from 1 and the condensed liquid 9 returning from the condensing section 5 to the boiling section 2 pass through the same flow path, the bubbles 8 and the condensed liquid 9 interfere in the boiling section 2 and form the boiling heat transfer surface 2B. The efficiency of the cycle of generating bubble nuclei from the foaming point, growing into bubbles 8 and separating from the boiling heat transfer surface 2B is poor, and the boiling heat transfer coefficient is small.
【０００７】また、沸騰部２内で気泡８と凝縮液９が干
渉し、さらに凝縮部３内で蒸気４と凝縮液９が干渉し液
戻りのムラが発生し、沸騰部２内で冷媒１の枯渇が起こ
る。さらに、沸騰伝熱面２Ｂは平面であるため、沸騰伝
熱面２Ｂでの発泡点が少なく（発泡点密度が小さく）、
気泡８の発生を助長し安定化させることができず、沸騰
熱伝達率が小さい。Further, the bubbles 8 and the condensed liquid 9 interfere with each other in the boiling section 2, and the vapor 4 and the condensed liquid 9 interfere with each other in the condensing section 3, resulting in uneven return of the liquid. Depletion occurs. Further, since the boiling heat transfer surface 2B is a flat surface, the number of foaming points on the boiling heat transfer surface 2B is small (the foaming point density is small).
The generation of bubbles 8 cannot be promoted and stabilized, and the boiling heat transfer coefficient is small.
【０００８】以上のことにより、以下の問題がある。 （１）沸騰伝熱面２Ｂと低沸点冷媒１の温度差が大きく
なる分、凝縮部５の壁面と冷却風の温度差が小さくな
り、フィン６が大型化し沸騰冷却装置が大型化する。 （２）比較的低い熱流束で冷媒１の枯渇によるドライア
ウトが発生し、発熱損失増大に対応できない。 （３）ドライアウトを防ぐためには冷媒１の量を増やす
必要があり、沸騰冷却装置のコストが高くなる。 （４）冷媒１の量を増やすためには沸騰部２の厚みを増
やす必要があり、沸騰冷却装置の重量が増す。 （５）沸騰部２の厚みが大きいので、半導体素子７間の
配線が長くなり、配線の寄生インダクタンスが増加す
る。As described above, there are the following problems. (1) As the temperature difference between the boiling heat transfer surface 2B and the low-boiling-point refrigerant 1 increases, the temperature difference between the wall surface of the condensing section 5 and the cooling air becomes smaller, the fins 6 become larger, and the boiling cooling device becomes larger. (2) Dry-out occurs due to the depletion of the refrigerant 1 at a relatively low heat flux, and it cannot cope with an increase in heat loss. (3) In order to prevent dry-out, it is necessary to increase the amount of the refrigerant 1, which increases the cost of the boiling cooling device. (4) In order to increase the amount of the refrigerant 1, it is necessary to increase the thickness of the boiling portion 2, and the weight of the boiling cooling device increases. (5) Since the thickness of the boiling portion 2 is large, the wiring between the semiconductor elements 7 becomes longer, and the parasitic inductance of the wiring increases.
【０００９】従って、本発明は、上記問題点を鑑み、沸
騰伝熱面と低沸点冷媒の間の沸騰熱伝達を向上させる沸
騰冷却装置を提供する。Accordingly, the present invention has been made in view of the above problems, and provides a boiling cooling device that improves the transfer of boiling heat between a boiling heat transfer surface and a low-boiling refrigerant.
【００１０】[0010]
【００１１】[0011]
【００１２】[0012]
【００１３】[0013]
【００１４】[0014]
【課題を解決するための手段】 上記目的を達成するため
に、 請求項１記載の発明は、沸騰部伝熱面に、ピッチが
０．１２ｍｍ〜１．２ｍｍ，幅が０．０６〜０．６ｍ
ｍ，高さが０．１ｍｍ〜１．０ｍｍの微細なフィンを、
沸騰伝熱面の重力方向及び重力方向と直交する方向に設
けることを特徴とする。 [MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
According to the first aspect of the present invention, the heat transfer surface of the boiling portion has a pitch of 0.12 mm to 1.2 mm and a width of 0.06 to 0.6 m.
m, a fine fin with a height of 0.1 mm to 1.0 mm,
It is characterized in that it is provided in the direction of gravity of the boiling heat transfer surface and in a direction orthogonal to the direction of gravity.
【００１５】更に、請求項２記載の発明は、沸騰部伝熱
面に、ピッチが０．１２ｍｍ〜１．２ｍｍ，幅が０．０
６〜０．６ｍｍ，高さが０．１ｍｍ〜１．０ｍｍの微細
なフィンを、沸騰伝熱面の重力方向に設けることを特徴
とする。Further, according to the second aspect of the present invention, the pitch is 0.12 mm to 1.2 mm and the width is 0.0
Fine fins having a diameter of 6 to 0.6 mm and a height of 0.1 to 1.0 mm are provided in the direction of gravity of the boiling heat transfer surface.
【００１６】また更に、請求項３記載の発明は、沸騰部
伝熱面に、ピッチが０．１２ｍｍ〜１．２ｍｍ，幅が
０．０６〜０．６ｍｍ，高さが０．１ｍｍ〜１．０ｍｍ
の微細なフィンを、沸騰伝熱面の重力方向と直交する方
向に設けることを特徴とする。Further, according to the third aspect of the present invention, the pitch is 0.12 mm to 1.2 mm, the width is 0.06 to 0.6 mm, and the height is 0.1 mm to 1. 0mm
Are provided in a direction orthogonal to the direction of gravity of the boiling heat transfer surface.
【００１７】[0017]
【００１８】[0018]
【００１９】[0019]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。 （第１の実施の形態）図１は本発明の第１の実施の形態
である沸騰冷却装置の正面図、図２は図１のＡ−Ａ断面
図、図３は図１のＢ−Ｂ断面図である。また、図４は本
発明の第１の実施の形態での沸騰曲線である。横軸は低
沸点冷媒１と沸騰伝熱面２Ｂとの温度差である伝熱面過
熱度、縦軸は熱流束である。Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a front view of a boiling cooling apparatus according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. 3 is a line BB of FIG. It is sectional drawing. FIG. 4 is a boiling curve according to the first embodiment of the present invention. The horizontal axis is the heat transfer surface superheat degree, which is the temperature difference between the low boiling point refrigerant 1 and the boiling heat transfer surface 2B, and the vertical axis is the heat flux.
【００２０】図１乃至図３において、沸騰冷却装置は、
内部が中空で低沸点冷媒１が封入された沸騰部２と、沸
騰部２内の中空流路とヘッダータンク３を介して連通し
他端が閉塞され、低沸点冷媒１の蒸気４で満たされる凝
縮部５からなる密閉容器である。凝縮部５と凝縮部５の
間には、フィン６が取り付けられている。また、電力用
半導体素子７は沸騰部２の外壁面である受熱部２Ａに取
り付けられる。In FIGS. 1 to 3, the boiling cooling device comprises:
A boiling portion 2 having a hollow inside and containing a low-boiling refrigerant 1 is communicated with a hollow flow passage in the boiling portion 2 via a header tank 3 and the other end is closed and filled with steam 4 of the low-boiling refrigerant 1. It is a closed container composed of the condenser 5. Fins 6 are attached between the condensers 5. In addition, the power semiconductor element 7 is attached to a heat receiving section 2 </ b> A which is an outer wall surface of the boiling section 2.
【００２１】沸騰部２内には、冷媒１から発生した気泡
８を凝縮部５に導く第１の流路１０と、凝縮部５で液化
した凝縮液９を沸騰部２に戻す第２の流路１１と、第１
及び第２の流路が下部で互いに連通する第１の空間１２
を、電力用半導体素子７が取り付けられる外壁面と平行
に設置した冷媒流路構成部材１３により設け、さらにヘ
ッダータンク３内に、冷媒１から発生した気泡８を凝縮
部５に導く第３の流路１４と、凝縮部５で液化した凝縮
液９を沸騰部５に戻す第４の流路１５を形成する冷媒流
路構成部材１３を設け、第１の流路１０と第３の流路１
４、第２の流路１１と第４の流路１５を連通させる。ま
た、第４の流路１５の断面積は、第２の流路１１より大
きくなっている。In the boiling section 2, a first flow path 10 for guiding bubbles 8 generated from the refrigerant 1 to the condensation section 5 and a second flow for returning the condensed liquid 9 liquefied in the condensation section 5 to the boiling section 2. Road 11 and the first
And the first space 12 in which the second flow path communicates with each other at the bottom
Is provided by a refrigerant flow path constituting member 13 installed in parallel with the outer wall surface on which the power semiconductor element 7 is mounted, and a third flow for guiding bubbles 8 generated from the refrigerant 1 to the condensing section 5 in the header tank 3. A first flow path and a third flow path; a refrigerant flow path forming member for forming a fourth flow path for returning the condensed liquid liquefied in the condensing section to the boiling section;
4. The second flow path 11 and the fourth flow path 15 are communicated. The cross-sectional area of the fourth flow path 15 is larger than that of the second flow path 11.
【００２２】図１乃至図３のように構成された沸騰冷却
装置においては、電力用半導体素子７の発熱損失は、受
熱部２Ａを経て沸騰部２内の沸騰伝熱面２Ｂまで熱伝導
により伝わる。1 to 3, the heat loss of the power semiconductor element 7 is transmitted by heat conduction to the boiling heat transfer surface 2B in the boiling portion 2 via the heat receiving portion 2A. .
【００２３】沸騰伝熱面２Ｂとこれに接する低沸点冷媒
１の温度が、蒸気相を形成するのに十分な条件のもと
で、沸騰伝熱面２Ｂの発泡点より気泡核が発生し、気泡
８に成長し、沸騰伝熱面２Ｂより離脱し、沸騰伝熱面２
Ｂから低沸点冷媒１に発熱損失が伝わる。When the temperature of the boiling heat transfer surface 2B and the temperature of the low-boiling refrigerant 1 in contact with the surface are sufficient to form a vapor phase, bubble nuclei are generated from the bubbling point of the boiling heat transfer surface 2B. It grows into bubbles 8 and separates from the boiling heat transfer surface 2B to form the boiling heat transfer surface 2B.
The heat loss is transmitted from B to the low boiling point refrigerant 1.
【００２４】離脱した気泡８は、第１の流路１０を通り
浮力により液面に上昇し、さらに第３の流路１４を通り
発熱損失は凝縮部５に運ばれる。蒸気４により凝縮部５
に運ばれた発熱損失は、フィン６間を通る冷却風により
放熱される。一方、蒸気４は冷却され凝縮して凝縮液９
となり、第４の流路１５を通り、第２の流路１１を通
り、さらに第１の空間１２を通り、第１の流路１０に戻
るサイクルを繰り返す。The separated bubbles 8 rise to the liquid level by buoyancy through the first flow path 10, and further, the heat loss through the third flow path 14 is transferred to the condenser 5. Condensing part 5 by steam 4
Is carried by the cooling air passing between the fins 6. On the other hand, the steam 4 is cooled and condensed to form a condensate 9
Then, a cycle of returning to the first flow path 10 through the fourth flow path 15, passing through the second flow path 11, and further passing through the first space 12, is repeated.
【００２５】このとき、沸騰部２内の冷媒流路構成用部
材１３は受熱部２Ａに対し平行に設けられているので、
第２の流路１１内では気泡の発生がなく凝縮液９の液戻
りは良好である。また、第４の流路１５の断面積を、第
２の流路１１の断面積より大きくしてあるので、凝縮液
９が第４の流路１５に流れ込みやすくなっている。以上
のようにして、電力用半導体素子７は冷却される。At this time, since the refrigerant flow path forming member 13 in the boiling portion 2 is provided in parallel with the heat receiving portion 2A,
No bubbles are generated in the second flow path 11 and the liquid return of the condensate 9 is good. Further, since the cross-sectional area of the fourth flow path 15 is larger than the cross-sectional area of the second flow path 11, the condensate 9 can easily flow into the fourth flow path 15. As described above, the power semiconductor element 7 is cooled.
【００２６】このとき、沸騰部２内で気泡８と凝縮液９
が干渉することがないので、沸騰伝熱面２Ｂの発泡点よ
り気泡核が発生し、気泡８に成長し沸騰伝熱面２Ｂより
離脱するというサイクルの効率が良く、沸騰熱伝達率が
向上する。沸騰熱伝達率が向上するため、図２に示すよ
うに従来の沸騰冷却装置に比べ、低沸点冷媒１と沸騰伝
熱面２Ｂとの温度差である伝熱面過熱度が小さくなる。At this time, bubbles 8 and condensate 9
Do not interfere with each other, so that the efficiency of the cycle in which bubble nuclei are generated from the foaming point of the boiling heat transfer surface 2B, grow into bubbles 8 and separate from the boiling heat transfer surface 2B is high, and the boiling heat transfer coefficient is improved. . Since the boiling heat transfer coefficient is improved, as shown in FIG. 2, the superheat degree of the heat transfer surface, which is the temperature difference between the low boiling point refrigerant 1 and the boiling heat transfer surface 2B, is smaller than that of the conventional boiling cooling device.
【００２７】さらに、沸騰部２内で気泡８と凝縮液９が
干渉することがないので、液戻りの効率が良く沸騰部２
内で冷媒１の枯渇が防げ、図２に示すように従来の沸騰
冷却装置に比べ、より高い熱流束を放熱できる。Further, since the bubbles 8 and the condensate 9 do not interfere with each other in the boiling section 2, the efficiency of liquid return is high and the boiling section 2
In this case, the depletion of the refrigerant 1 can be prevented, and a higher heat flux can be radiated as compared with the conventional boiling cooling device as shown in FIG.
【００２８】図１乃至図３に示した実施の形態において
は、沸騰熱伝達が向上し、冷却効率が向上するので、沸
騰伝熱面と低沸点冷媒の温度差が減少し、その分凝縮部
外壁面と冷却風の温度差を増大させることができ、フィ
ンを小型化することができ沸騰冷却装置が小型化でき
る。In the embodiment shown in FIGS. 1 to 3, the boiling heat transfer is improved and the cooling efficiency is improved, so that the temperature difference between the boiling heat transfer surface and the low boiling point refrigerant is reduced, and the condensing section is accordingly reduced. The temperature difference between the outer wall surface and the cooling air can be increased, the fins can be downsized, and the boiling cooling device can be downsized.
【００２９】更に、気泡と凝縮液の干渉を防ぎ、液戻り
をスムーズにしドライアウト熱流束を増加させ、発熱損
失増大に対応できる。 （第２の実施の形態）次に、本発明の第２の実施の形態
を図５乃至図８を参照して説明する。図５は本発明の第
２の実施の形態を示す正面図、図６は図５のＡ−Ａ断面
図、図７は図５ののＢ−Ｂ断面図である。図８は、図５
のＣ−Ｃ断面図である。Further, it is possible to prevent interference between the bubbles and the condensed liquid, smoothly return the liquid, increase the dry-out heat flux, and cope with an increase in heat loss. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. 5 is a front view showing a second embodiment of the present invention, FIG. 6 is a sectional view taken along line AA of FIG. 5, and FIG. 7 is a sectional view taken along line BB of FIG. FIG. 8 shows FIG.
It is CC sectional drawing of.
【００３０】図５乃至図８において、沸騰冷却装置は、
内部が中空で低沸点冷媒１が封入された沸騰部２と、沸
騰部２内の中空流路とヘッダータンク３を介して連通し
他端が閉塞され、低沸点冷媒１の蒸気４で満たされる凝
縮部５からなる密閉容器である。凝縮部５と凝縮部５の
間には、フィン６が取り付けられている。また、電力用
半導体素子７は沸騰部２の外壁面である受熱部２Ａに取
り付けられる。In FIGS. 5 to 8, the boiling cooling device comprises:
A boiling portion 2 having a hollow inside and containing a low-boiling refrigerant 1 is communicated with a hollow flow passage in the boiling portion 2 via a header tank 3 and the other end is closed and filled with steam 4 of the low-boiling refrigerant 1. It is a closed container composed of the condenser 5. Fins 6 are attached between the condensers 5. In addition, the power semiconductor element 7 is attached to a heat receiving section 2 </ b> A which is an outer wall surface of the boiling section 2.
【００３１】沸騰部２内には、冷媒１から発生した気泡
８を凝縮部５に導く第１の流路１０と、凝縮部５で液化
した凝縮液９を沸騰部２に戻す第２の流路１１と、第１
及ぴ第２の流路が下部で互いに連通する第１の空間１２
を、電力用半導体素子７が取り付けられる外壁面と平行
に設置した冷媒流路構成部材１３により設け、さらにヘ
ッダータンク３内に、冷媒１から発生した気泡８を凝縮
部５に導くための第３の流路１４と、凝縮部５で液化し
た凝縮液９を沸騰部５に戻す第４の流路１５を形成する
冷媒流路構成部材１３を設け、第１の流路１０と第３の
流路１４、第２の流路１１と第４の流路１５を連通させ
る。In the boiling section 2, a first flow path 10 for guiding bubbles 8 generated from the refrigerant 1 to the condensing section 5 and a second flow for returning the condensed liquid 9 liquefied in the condensing section 5 to the boiling section 2 Road 11 and the first
And a first space 12 in which the second flow path communicates with each other at the bottom.
Is provided by a refrigerant flow path constituent member 13 installed in parallel with the outer wall surface on which the power semiconductor element 7 is mounted, and further, a third air passage 8 for guiding bubbles 8 generated from the refrigerant 1 to the condenser section 5 in the header tank 3. And a refrigerant flow path constituent member 13 forming a fourth flow path 15 for returning the condensed liquid 9 liquefied in the condensing section 5 to the boiling section 5, and the first flow path 10 and the third flow path The path 14, the second flow path 11 and the fourth flow path 15 are communicated.
【００３２】更に、凝縮部５内には、冷媒１が気化して
発生した蒸気４が液化する第２の空間１６と、冷媒が気
化して発生した蒸気４を第２の空間１６に導く第５の流
路１７と、第２の空間１６で液化した冷媒１を沸騰部２
に戻す第６の流路１８を形成する冷媒流路構成部材１３
を設け、第３の流路１４と第５の流路１７、第４の流路
１５と第６の流路１８を連通させる。Further, in the condensing section 5, a second space 16 in which the vapor 4 generated by vaporizing the refrigerant 1 is liquefied, and a second space 16 in which the vapor 4 generated by vaporizing the refrigerant is introduced into the second space 16 5 and the refrigerant 1 liquefied in the second space 16
Refrigerant flow path forming member 13 forming the sixth flow path 18 returning to
And the third flow path 14 and the fifth flow path 17 and the fourth flow path 15 and the sixth flow path 18 are communicated.
【００３３】冷媒流路構成用の部材１３は金属性の部材
であり、上記沸騰冷却装置は以下の２通りの方法で製作
される。１つの方法は、沸騰部２、ヘッダータンク３、
凝縮部５それぞれに冷媒流路構成用の部材１３をろう付
けした後、沸騰部２とヘッダータンク３をロウ付けし、
さらにヘッダータンク３に凝縮部５をロウ付けするとい
う方法である。The member 13 for forming the refrigerant channel is a metallic member, and the above-mentioned boiling cooling device is manufactured by the following two methods. One method is boiling section 2, header tank 3,
After brazing a member 13 for forming a refrigerant flow path to each of the condensing sections 5, the boiling section 2 and the header tank 3 are brazed,
Further, a method of brazing the condensing section 5 to the header tank 3 is employed.
【００３４】また、もう１つの方法は、冷媒流路１０及
び１１を有する沸騰部２は押出し加工により成型し、ヘ
ッダータンク３、凝縮部５に前記冷媒流路構成用の部材
１３をろう付けした後、沸騰部２とヘッダータンク３を
ロウ付けし、さらにヘッダータンク３に凝縮部５をロウ
付けするという方法である。In another method, the boiling part 2 having the refrigerant flow paths 10 and 11 is formed by extrusion, and the member 13 for forming the refrigerant flow path is brazed to the header tank 3 and the condensing part 5. Thereafter, the boiling part 2 and the header tank 3 are brazed, and the condensing part 5 is further brazed to the header tank 3.
【００３５】図５乃至図８に示したように構成された第
２の実施の形態においては、電力用半導体素子７の発熱
損失は、受熱部２Ａを経て沸騰部２内の沸騰伝熱面２Ｂ
まで熱伝導により伝わる。In the second embodiment configured as shown in FIGS. 5 to 8, the heat loss of the power semiconductor element 7 is reduced by the heat transfer surface 2B in the boiling portion 2 via the heat receiving portion 2A.
It is transmitted by heat conduction up to.
【００３６】そして、沸騰伝熱面２Ｂとこれに接する低
沸点冷媒１の温度が、蒸気相を形成するのに十分な条件
のもとで、沸騰伝熱面２Ｂの発泡点より気泡核が発生
し、気泡８に成長し、沸騰伝熱面２Ｂより離脱し、沸騰
伝熱面２Ｂから低沸点冷媒１に発熱損失が伝わる。Then, under the condition that the temperature of the boiling heat transfer surface 2B and the low boiling point refrigerant 1 in contact therewith are sufficient to form a vapor phase, bubble nuclei are generated from the foaming point of the boiling heat transfer surface 2B. Then, it grows into bubbles 8, separates from the boiling heat transfer surface 2 </ b> B, and the heat loss is transmitted from the boiling heat transfer surface 2 </ b> B to the low boiling point refrigerant 1.
【００３７】離脱した気泡８は、第１の流路１０を通り
浮力により液面に上昇し、さらに第３の流路１４を通
り、第５の流路１７を通り、発熱損失は第２の空間１６
に運ばれる。蒸気４により第２の空間１６に運ばれた発
熱損失は、フィン６間を通る冷却風により放熱される。
一方、蒸気４は冷却され凝縮して凝縮液９となり、第６
の流路１８を通り、第４の流路１５を通り、第２の流路
１１を通り、さらに第１の空間１２を通り第１の流路１
０に戻るサイクルを繰り返す。以上のようにして、電力
用半導体素子７は冷却される。The separated bubbles 8 rise to the liquid level by buoyancy through the first flow path 10, further flow through the third flow path 14, flow through the fifth flow path 17, and generate heat loss in the second flow path 2. Space 16
Transported to The heat loss carried to the second space 16 by the steam 4 is radiated by the cooling air passing between the fins 6.
On the other hand, the steam 4 is cooled and condensed to form a condensed liquid 9,
Through the first flow path 18, through the fourth flow path 15, through the second flow path 11, further through the first space 12.
The cycle of returning to 0 is repeated. As described above, the power semiconductor element 7 is cooled.
【００３８】このとき、第１の実施の形態と同様に、沸
騰部２内で気泡８と凝縮液９が干渉することがないの
で、沸騰熱伝達率が向上し、低沸点冷媒１と沸騰伝熱面
２Ｂとの温度差である伝熱面過熱度が小さくなる。At this time, as in the first embodiment, since the bubbles 8 and the condensate 9 do not interfere with each other in the boiling portion 2, the boiling heat transfer coefficient is improved, and the low-boiling refrigerant 1 and the boiling heat The heat transfer surface superheat degree, which is the temperature difference with the heat surface 2B, is reduced.
【００３９】また、沸騰部２内で気泡８と凝縮液９が干
渉することがなく、さらに凝縮部５内での蒸気４と凝縮
液９の干渉が無くなり液戻りがスムーズになるため、沸
騰部２内での冷媒１の枯渇を防ぐことができる。Further, the bubbles 8 and the condensate 9 do not interfere with each other in the boiling part 2, and the interference between the vapor 4 and the condensate 9 in the condensing part 5 is eliminated and the liquid returns smoothly. 2 can prevent the refrigerant 1 from being depleted.
【００４０】故に、第１の実施の形態に比べ、ドライア
ウト熱流束をさらに増加させることができ、発熱損失増
大に対応できる。 （第３の実施の形態）次に、本発明の第３の実施の形態
を、図９乃至図１２を参照して説明する。Therefore, as compared with the first embodiment, the dry-out heat flux can be further increased, and the heat loss can be increased. (Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIGS.
【００４１】図９は本発明の第３の実施の形態を示す正
面図、図１０は図９のＡ−Ａ断面図、図１１は図９のの
Ｂ−Ｂ断面図である。図１２は、図１０のＣ−Ｃ断面図
である。FIG. 9 is a front view showing a third embodiment of the present invention, FIG. 10 is a sectional view taken along line AA of FIG. 9, and FIG. 11 is a sectional view taken along line BB of FIG. FIG. 12 is a sectional view taken along line CC of FIG.
【００４２】図９乃至図１２において、沸騰冷却装置
は、内部が中空で低沸点冷媒１が封入された沸騰部２
と、沸騰部２内の中空流路とヘッダータンク３を介して
連通し他端が閉塞され、低沸点冷媒１の蒸気４で満たさ
れる凝縮部５からなる密閉容器である。凝縮部５と凝縮
部５の間には、フィン６が取り付けられている。また、
電力用半導体素子７は沸騰部２の外壁面である受熱部２
Ａに取り付けられる。In FIGS. 9 to 12, the boiling cooling device is a boiling part 2 having a hollow interior and a low boiling point refrigerant 1 sealed therein.
And a condensing part 5 which is in communication with the hollow flow path in the boiling part 2 via the header tank 3 and whose other end is closed, and which is filled with the vapor 4 of the low boiling point refrigerant 1. Fins 6 are attached between the condensers 5. Also,
The power semiconductor element 7 includes a heat receiving portion 2 which is an outer wall surface of the boiling portion 2.
A is attached.
【００４３】沸騰部２内の構造は、第２の実施の形態と
同様である。凝縮部５内の構造は、第２の空間１６で液
化した凝縮液９を沸騰部２に戻す複数の第６の流路１８
が、複数の冷媒流路構成用の部材１３により設けられて
いる点を除けば、第２の実施の形態と同様である。沸騰
部２及びヘッダータンク３内の冷媒流路構成部材１３は
金属部材であるが、特に凝縮部５内の冷媒流路構成部材
１３は高熱伝導性の金属部材とする。The structure inside the boiling part 2 is the same as that of the second embodiment. The structure inside the condensing section 5 includes a plurality of sixth flow paths 18 for returning the condensed liquid 9 liquefied in the second space 16 to the boiling section 2.
However, it is the same as the second embodiment except that it is provided by a plurality of members 13 for forming the refrigerant flow path. The refrigerant flow path constituent member 13 in the boiling part 2 and the header tank 3 is a metal member. In particular, the refrigerant flow path constituent member 13 in the condenser part 5 is a metal member having high thermal conductivity.
【００４４】このとき、第１の実施の形態と同様に沸騰
部２内で気泡８と凝縮液９が干渉することがないので、
沸騰熱伝達率が向上し、低沸点冷媒１と沸騰伝熱面２Ｂ
との温度差である伝熱面過熱度が小さくなる。更に、凝
縮部５内に、複数の第６の流路１８を構成する高熱伝導
性の金属部材１３が複数設けられているため、蒸気４が
凝縮する放熱面積が大きく蒸気４と凝縮部５の内壁面の
温度差を、第１の実施の形態に比べ小さくすることがで
きる。At this time, the bubbles 8 and the condensate 9 do not interfere in the boiling portion 2 as in the first embodiment.
Boiling heat transfer coefficient is improved, low boiling point refrigerant 1 and boiling heat transfer surface 2B
And the degree of superheat of the heat transfer surface, which is the temperature difference from Further, since a plurality of high thermal conductive metal members 13 constituting the plurality of sixth flow paths 18 are provided in the condenser 5, the heat radiation area in which the vapor 4 condenses is large, and the vapor 4 and the condenser 5 The temperature difference on the inner wall surface can be made smaller than in the first embodiment.
【００４５】沸騰伝熱面２Ｂと低沸点冷媒１の温度差が
減少し、更に蒸気４と凝縮部５の内壁面の温度差が減少
し、その分凝縮部５の外壁面と冷却風の温度差を増大さ
せることができるので、第１の実施の形態よりもフィン
を小型化することができ沸騰冷却装置が小型化できると
いう極めて有用な効果を奏する。The temperature difference between the boiling heat transfer surface 2B and the low-boiling-point refrigerant 1 is reduced, and the temperature difference between the steam 4 and the inner wall surface of the condenser 5 is further reduced. Since the difference can be increased, there is an extremely useful effect that the fins can be downsized and the boiling cooling device can be downsized compared to the first embodiment.
【００４６】また、沸騰部２内で気泡８と凝縮液９が干
渉することがなく、加えて凝縮部５内での蒸気４と凝縮
液９の干渉が無くなり液戻りがスムーズになるため、沸
騰部２内での冷媒１の枯渇を防ぐことができる。故に、
第１の実施の形態に比べ、ドライアウト熱流束をさらに
増加させることができ、発熱損失増大に対応できる。In addition, the bubbles 8 and the condensate 9 do not interfere with each other in the boiling part 2, and the interference between the vapor 4 and the condensate 9 in the condensing part 5 is eliminated, so that the liquid returns smoothly. The depletion of the refrigerant 1 in the section 2 can be prevented. Therefore,
Compared to the first embodiment, the dry-out heat flux can be further increased, and the heat loss can be increased.
【００４７】（第４の実施の形態）次に、本発明の第４
の実施の形態を、図１３乃至図１８を参照して説明す
る。図１３は本発明の第４の実施の形態を示す正面図、
図１４は図１３のＡ−Ａ断面図、図１５は図１３のＢ−
Ｂ断面図である。図１６は、第４の実施の形態に適用さ
れる微細フィンの斜視図である。(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. FIG. 13 is a front view showing a fourth embodiment of the present invention,
14 is a sectional view taken along line AA of FIG. 13, and FIG.
It is B sectional drawing. FIG. 16 is a perspective view of a fine fin applied to the fourth embodiment.
【００４８】図１６は第４の実施の形態におけるフィン
ピッチー伝熱面過熱度特性図であり、横軸はフィンピッ
チ、縦軸は低沸点冷媒１と沸騰伝熱面２Ｂとの温度差で
ある伝熱面過熱度を表す。尚、第４の実施の形態におけ
るフィンのフィン幅は０．０６〜０．６ｍｍ，フィン高
さは０．１〜1.０ｍｍである。FIG. 16 is a fin pitch-heat transfer surface superheat degree characteristic diagram in the fourth embodiment, where the horizontal axis is the fin pitch and the vertical axis is the temperature difference between the low boiling point refrigerant 1 and the boiling heat transfer surface 2B. Indicates the degree of superheat on the heat transfer surface. In the fourth embodiment, the fin has a fin width of 0.06 to 0.6 mm and a fin height of 0.1 to 1.0 mm.
【００４９】図１７は第４の実施の形態における熱流束
一素子間最大温度差特性図であり、横軸は熱流束、縦軸
は電力用半導体素子７間最大温度差である。図１３乃至
図１６において、沸騰冷却装置は、内部が中空で低沸点
冷媒１が封入された沸騰部２と、沸騰部２内の中空流路
とヘッダータンク３を介して連通し他端が閉塞され、低
沸点冷媒１の蒸気４で満たされる凝縮部５からなる密閉
容器である。凝縮部５と凝縮部５の間には、フィン６が
取り付けられている。また、電力用半導体素子７は沸騰
部２の外壁面である受熱部２Ａに取り付けられる。FIG. 17 is a graph showing the heat flux and the maximum temperature difference between the elements in the fourth embodiment. The horizontal axis shows the heat flux and the vertical axis shows the maximum temperature difference between the power semiconductor elements 7. In FIGS. 13 to 16, the boiling cooling device communicates with a boiling portion 2 having a hollow inside and a low boiling point refrigerant 1 sealed therein through a hollow flow passage in the boiling portion 2 via a header tank 3, and the other end is closed. It is a closed container comprising a condenser 5 filled with the vapor 4 of the low-boiling refrigerant 1. Fins 6 are attached between the condensers 5. In addition, the power semiconductor element 7 is attached to a heat receiving section 2 </ b> A which is an outer wall surface of the boiling section 2.
【００５０】沸騰部２内の第１の冷媒流路内の沸騰部伝
熱面２Ｂには、ピッチが０．１２ｍｍ〜１．２ｍｍ，幅
が０．０６〜０．６ｍｍ，高さが０．１ｍｍ〜１．０ｍ
ｍの微細なフィン１９が、沸騰伝熱面の重力方向及び重
力方向と直交する方向に設けられる。その他の沸騰部２
及びヘッダータンク３内の構造は、第１の実施の形態と
同様である。The pitch of the heat transfer surface 2B in the first refrigerant flow path in the boiling portion 2 is 0.12 mm to 1.2 mm, the width is 0.06 to 0.6 mm, and the height is 0.1 mm. 1mm to 1.0m
m fine fins 19 are provided in the direction of gravity of the boiling heat transfer surface and in a direction perpendicular to the direction of gravity. Other boiling part 2
The structure inside the header tank 3 is the same as that of the first embodiment.
【００５１】このとき、第１の実施の形態と同様に沸騰
部２内で気泡８と凝縮液９が干渉することがないので沸
騰熱伝達率が向上する。更に、図１６のフィンピッチー
伝熱面過熱度特性図に示されているように、フィン幅
０．０６〜０．６ｍｍ，フィン高さ０．１〜１．０ｍｍ
のもとでは、フィンピッチが０．１２〜１．２ｍｍのと
きに、沸騰伝熱面２Ｂに設けられた微細なフィン１９に
より、沸騰伝熱面２Ｂでの発泡点密度が高められ、気泡
の発生を助長し安定化させることができ、非常に沸騰熱
伝達率を向上させることができる。故に、図４に示すよ
うに、低沸点冷媒１と沸騰伝熱面２Ｂとの温度蓋である
伝熱面過熱度が第１の実施の形態に比べ小さくなる。そ
の分、凝縮部５の外壁面と冷却風の温度差を増大させる
ことができるので、第１の実施の形態よりもフィンを小
型化することができ沸騰冷却装置が小型化できる。At this time, as in the first embodiment, since the bubbles 8 and the condensate 9 do not interfere in the boiling section 2, the boiling heat transfer coefficient is improved. Further, as shown in the fin pitch-heat transfer surface superheat degree characteristic diagram of FIG. 16, the fin width is 0.06 to 0.6 mm and the fin height is 0.1 to 1.0 mm.
In the case where the fin pitch is 0.12 to 1.2 mm, the fine fins 19 provided on the boiling heat transfer surface 2B increase the foaming point density on the boiling heat transfer surface 2B. Generation can be promoted and stabilized, and the boiling heat transfer coefficient can be greatly improved. Therefore, as shown in FIG. 4, the superheat degree of the heat transfer surface, which is the temperature cover between the low-boiling-point refrigerant 1 and the boiling heat transfer surface 2B, is smaller than in the first embodiment. Accordingly, the temperature difference between the outer wall surface of the condensing section 5 and the cooling air can be increased, so that the fins can be made smaller than in the first embodiment, and the boiling cooling device can be made smaller.
【００５２】さらに、沸騰伝熱面２Ｂに設けられた微細
なフィン１９により、図１８に示すように、従来の沸騰
冷却装置に比べ、受熱部２Ａに取り付けられた電力用半
導体素子７Ａ，７Ｂ，７Ｃ間の温度差を非常に小さくす
ることができ、電力用半導体素子７Ａ，７Ｂ，７Ｃ間の
特性のアンバランスを防ぐことができる。Further, as shown in FIG. 18, power semiconductor elements 7A, 7B, 7A, 7B, 7A, 7B, 7A, 7B, 7A, 7B, 7A, 7B, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A, 7A A temperature difference between the power semiconductor elements 7A, 7B, and 7C can be extremely small, and an imbalance in characteristics between the power semiconductor elements 7A, 7B, and 7C can be prevented.
【００５３】さらに、沸騰部２内で気泡８と凝縮液９が
干渉することがないので、第１の実施の形態と同様に冷
却性能が向上する。 （第５の実施の形態）次に、本発明の第５の実施の形態
を、図１９を参照して説明する。Further, since the bubbles 8 and the condensate 9 do not interfere with each other in the boiling portion 2, the cooling performance is improved as in the first embodiment. (Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIG.
【００５４】図１９は、本発明の第５の実施の形態に用
いられる微細フィンの斜視図である。沸騰部２内の第１
の冷媒流路内の沸騰部伝熱面２Ｂには、ピッチが０．１
２ｍｍ〜１．２ｍｍ，幅が０．０６〜０．６ｍｍ，高さ
が０．１ｍｍ〜１．０ｍｍの微細なフィン１９が、沸騰
伝熱面の重力方向に設けられる。その他の構造は、第４
の実施の形態と同様である。FIG. 19 is a perspective view of a fine fin used in the fifth embodiment of the present invention. The first in the boiling section 2
The pitch is set to 0.1 on the heat transfer surface 2B of the boiling portion in the refrigerant flow path.
Fine fins 19 having a size of 2 mm to 1.2 mm, a width of 0.06 to 0.6 mm, and a height of 0.1 mm to 1.0 mm are provided in the gravity direction of the boiling heat transfer surface. Other structures are
This is the same as the embodiment.
【００５５】このとき、実施の形態とほぼ同程度の作
用、効果が得られる。 （第６の実施の形態）次に、本発明の第６の実施の形態
を、図２０を参照して説明する。At this time, substantially the same operation and effect as those of the embodiment can be obtained. (Sixth Embodiment) Next, a sixth embodiment of the present invention will be described with reference to FIG.
【００５６】図２０は、本発明の第６の実施の形態に適
用される微細フィンの斜視図である。沸騰部２内の第１
の冷媒流路内の沸騰部伝熱面２Ｂには、ピッチが０．１
２ｍｍ〜１．２ｍｍ，幅が０．０６〜０．６ｍｍ，高さ
が０．１ｍｍ〜１．０ｍｍの微細なフィン１９が、沸騰
伝熱面の重力方向と直交する方向に設けられる。その他
の構造は、第４の実施の形態と同様である。従って、第
４の実施とほぼ同程度の作用、効果が得られる。FIG. 20 is a perspective view of a fine fin applied to the sixth embodiment of the present invention. The first in the boiling section 2
The pitch is set to 0.1 on the heat transfer surface 2B of the boiling portion in the refrigerant flow path.
Fine fins 19 having a size of 2 mm to 1.2 mm, a width of 0.06 to 0.6 mm, and a height of 0.1 mm to 1.0 mm are provided in a direction orthogonal to the direction of gravity of the boiling heat transfer surface. Other structures are the same as those of the fourth embodiment. Therefore, substantially the same operation and effect as those of the fourth embodiment can be obtained.
【００５７】[0057]
【発明の効果】以上説明したように、本発明によれば、
沸騰伝熱面と低沸点冷媒の間の沸騰熱伝達を向上させる
ことが可能となる。As described above, according to the present invention,
Boiling heat transfer between the boiling heat transfer surface and the low-boiling refrigerant can be improved.
【図１】 本発明の第１の実施の形態を示す正面図。FIG. 1 is a front view showing a first embodiment of the present invention.
【図２】 図１のＡ−Ａ断面図。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】 図１のＢ一Ｂ断面図。FIG. 3 is a sectional view taken along the line B-B of FIG. 1;
【図４】 本発明の第１の実施の形態における沸騰曲
線。FIG. 4 is a boiling curve according to the first embodiment of the present invention.
【図５】 本発明の第２の実施の形態を示す正面図。FIG. 5 is a front view showing a second embodiment of the present invention.
【図６】 図５のＡ−Ａ断面図。FIG. 6 is a sectional view taken along the line AA of FIG. 5;
【図７】 図５のＢ−Ｂ断面図。FIG. 7 is a sectional view taken along line BB of FIG. 5;
【図８】 図６のＣ−Ｃ断面図。FIG. 8 is a sectional view taken along line CC of FIG. 6;
【図９】 本発明の第３の実施の形態を示す正面図。FIG. 9 is a front view showing a third embodiment of the present invention.
【図10】 図９のＡ一Ａ断面図。FIG. 10 is a sectional view taken along the line AA in FIG. 9.
【図11】 図９のＢ−Ｂ断面図。11 is a sectional view taken along the line BB of FIG. 9;
【図12】 図10のＣ−Ｃ断面図。12 is a sectional view taken along the line CC in FIG.
【図13】 本発明の第４の実施の形態を示す正面図。FIG. 13 is a front view showing a fourth embodiment of the present invention.
【図14】 図13のＡ−Ａ断面図。14 is a sectional view taken along line AA of FIG. 13;
【図15】 図13のＢ−Ｂ断面図。FIG. 15 is a sectional view taken along line BB of FIG. 13;
【図16】 本発明の第４の実施の形態における微細なフ
ィンの斜視図。FIG. 16 is a perspective view of a fine fin according to a fourth embodiment of the present invention.
【図17】 本発明の第４の実施の形態におけるフィンピ
ッチー伝熱面過熱度特性図。FIG. 17 is a fin pitch-heat transfer surface superheat degree characteristic diagram according to the fourth embodiment of the present invention.
【図18】 本発明の第４の実施の形態における熱流束一
素子間最大温度差特性図。FIG. 18 is a graph showing a maximum temperature difference characteristic between heat flux and one element according to the fourth embodiment of the present invention.
【図19】 本発明の第５の実施の形態における微細なフ
ィンの斜視図。FIG. 19 is a perspective view of a fine fin according to a fifth embodiment of the present invention.
【図20】 本発明の第６の実施の形態における微細なフ
ィンの斜視図。FIG. 20 is a perspective view of fine fins according to a sixth embodiment of the present invention.
【図21】 従来の電力用半導体素子用沸騰冷却装置を示
す正面図。FIG. 21 is a front view showing a conventional boiling cooling device for a power semiconductor element.
【図22】 図21のＡ−Ａ断面図。22 is a sectional view taken along the line AA in FIG. 21.
１・・・低沸点冷媒 ２・・・沸騰部 2A・・・受
熱部 2B・・・沸騰伝熱面 ３・・・ヘッダータンク ４
・・・蒸気 ５・・・凝縮部 ６・・・フィン ７・・・電力用
半導体素子 7A・・・電力用半導体素子 7B・・・電力用半導体素
子 7C・・・電力用半導体素子 ８・・・気泡 ９・・
・凝縮液 10・・・第１の流路 11・・・第２の流路 12・・
・第１の空間 13・・・冷媒流路構成用部材 14・・・第３の流路 15・・・第４の流路 16・・・第２の空間 17・・
・第５の流路 18・・・第６の流路 19・・・微細なフィンDESCRIPTION OF SYMBOLS 1 ... Low boiling point refrigerant 2 ... Boiling part 2A ... Heat receiving part 2B ... Boiling heat transfer surface 3 ... Header tank 4
... Steam 5 ... Condensing part 6 ... Fin 7 ... Power semiconductor element 7A ... Power semiconductor element 7B ... Power semiconductor element 7C ... Power semiconductor element 8 ...・ Bubble 9 ・ ・
・ Condensate 10 ・ ・ ・ First channel 11 ・ ・ ・ Second channel 12 ・ ・
· First space 13 ··· Refrigerant flow path forming member 14 ··· Third flow path 15 ··· Fourth flow path 16 ··· Second space 17 ···
・ Fifth flow path 18 ・ ・ ・ Sixth flow path 19 ・ ・ ・ Fine fins
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−292847（ＪＰ，Ａ) 特開 昭60−119799（ＪＰ，Ａ) 特開 平10−116947（ＪＰ，Ａ) 特開 平６−252300（ＪＰ，Ａ) 実開 昭62−162847（ＪＰ，Ｕ) 実開 昭62−197862（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/34 - 23/473 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-1-292847 (JP, A) JP-A-60-119799 (JP, A) JP-A-10-116947 (JP, A) JP-A-6-119947 252300 (JP, A) Japanese Utility Model Showa 62-162847 (JP, U) Japanese Utility Model Showa 62-197862 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 23/34-23 / 473
Claims (3)
は中空で冷媒が封入されている沸騰部と、この沸騰部内
の中空流路とヘッダータンクを介して連通し他端が閉塞
されている凝縮部からなり、前記被冷却体の発熱損失を
前記沸騰部での冷媒の沸騰気化及び前記凝縮部での冷媒
蒸気の凝縮液化にて放熱する沸騰冷却装置において、前
記沸騰部の伝熱面に、ピッチが０．１２ｍｍ〜１．２ｍ
ｍ，幅が０．０６〜０．６ｍｍ，高さが０．１ｍｍ〜
１．０ｍｍの微細なフィンを、沸騰伝熱面の重力方向及
び重力方向と直交する方向に設けることを特徴とする沸
騰冷却装置。 1. A cooling target is attached to an outer wall, and
Is the boiling part where the refrigerant is enclosed in the hollow, and the inside of this boiling part
Communicates with the hollow flow path through the header tank and the other end is closed
And the heat loss of the object to be cooled
Boiling of refrigerant in the boiling section and refrigerant in the condensing section
In a boiling cooling device that releases heat by condensing and liquefying steam,
The pitch is 0.12mm ~ 1.2m on the heat transfer surface of the boiling part
m, width is 0.06 ~ 0.6mm, height is 0.1mm ~
Fine fins of 1.0mm can be placed in the direction of gravity of the boiling heat transfer surface.
Characterized by being provided in a direction perpendicular to the direction of gravity and gravity.
Soaring cooling device.
は中空で冷媒が封入されている沸騰部と、この沸騰部内
の中空流路とヘッダータンクを介して連通し他端が閉塞
されている凝縮部からなり、前記被冷却体の発熱損失を
前記沸騰部での冷媒の沸騰気化及び前記凝縮部での冷媒
蒸気の凝縮液化にて放熱する沸騰冷却装置において、前
記沸騰部の伝熱面に、ピッチが０．１２ｍｍ〜１．２ｍ
ｍ，幅が０．０６〜０．６ｍｍ，高さが０．１ｍｍ〜
１．０ｍｍの微細なフィンを、沸騰伝熱面の重力方向に
設けることを特徴とする沸騰冷却装置。 2. A cooling target is attached to an outer wall, and
Is the boiling part where the refrigerant is enclosed in the hollow, and the inside of this boiling part
Communicates with the hollow flow path through the header tank and the other end is closed
And the heat loss of the object to be cooled
Boiling of refrigerant in the boiling section and refrigerant in the condensing section
In a boiling cooling device that releases heat by condensing and liquefying steam,
The pitch is 0.12mm ~ 1.2m on the heat transfer surface of the boiling part
m, width is 0.06 ~ 0.6mm, height is 0.1mm ~
1.0mm fine fins are placed in the direction of gravity on the boiling heat transfer surface.
A boiling cooling device, which is provided.
は中空で冷媒が封入されている沸騰部と、この沸騰部内
の中空流路とヘッダータンクを介して連通し他端が閉塞
されている凝縮部からなり、前記被冷却体の発熱損失を
前記沸騰部での冷媒の沸騰気化及び前記凝縮部での冷媒
蒸気の凝縮液化にて放熱する沸騰冷却装置において、前
記沸騰部の伝熱面に、ピッチが０．１２ｍｍ〜１．２ｍ
ｍ，幅が０．０６〜０．６ｍｍ，高さが０．１ｍｍ〜
１．０ｍｍの微細なフィンを、沸騰伝熱面の重力方向と
直交する方向に設けることを特徴とする沸騰冷却装置。 3. A cooling target is attached to an outer wall, and
Is the boiling part where the refrigerant is enclosed in the hollow, and the inside of this boiling part
Communicates with the hollow flow path through the header tank and the other end is closed
And the heat loss of the object to be cooled
Boiling of refrigerant in the boiling section and refrigerant in the condensing section
In a boiling cooling device that releases heat by condensing and liquefying steam,
The pitch is 0.12mm ~ 1.2m on the heat transfer surface of the boiling part
m, width is 0.06 ~ 0.6mm, height is 0.1mm ~
Fine fins of 1.0mm are attached to the gravitational direction of the boiling heat transfer surface.
A boiling cooling device, which is provided in a direction orthogonal to the boiling direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32625196A JP3210261B2 (en) | 1996-12-06 | 1996-12-06 | Boiling cooling device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32625196A JP3210261B2 (en) | 1996-12-06 | 1996-12-06 | Boiling cooling device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10173115A JPH10173115A (en) | 1998-06-26 |
| JP3210261B2 true JP3210261B2 (en) | 2001-09-17 |
Family
ID=18185691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32625196A Expired - Fee Related JP3210261B2 (en) | 1996-12-06 | 1996-12-06 | Boiling cooling device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3210261B2 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3964580B2 (en) | 1999-09-03 | 2007-08-22 | 富士通株式会社 | Cooling unit |
| JP4481512B2 (en) * | 2001-02-01 | 2010-06-16 | 住友精密工業株式会社 | Thermosiphon-type cooler and manufacturing method thereof |
| JP4579269B2 (en) * | 2007-05-25 | 2010-11-10 | トヨタ自動車株式会社 | Cooling system |
| JP2010010204A (en) * | 2008-06-24 | 2010-01-14 | Toyota Industries Corp | Ebullient cooling device |
| JP5092931B2 (en) * | 2008-06-24 | 2012-12-05 | 株式会社豊田自動織機 | Boiling cooler |
| JP2010196912A (en) * | 2009-02-23 | 2010-09-09 | Toyota Industries Corp | Ebullient cooling device |
| JP2010236792A (en) * | 2009-03-31 | 2010-10-21 | Toyota Industries Corp | Ebullient cooling device |
| JP2011108685A (en) * | 2009-11-12 | 2011-06-02 | Toyota Industries Corp | Natural circulation type boiling cooler |
| JP2011174647A (en) * | 2010-02-24 | 2011-09-08 | Showa Denko Kk | Heat pipe type radiator |
| JP2011196632A (en) * | 2010-03-19 | 2011-10-06 | Toyota Industries Corp | Ebullient cooling device |
| JP5447080B2 (en) * | 2010-03-26 | 2014-03-19 | 富士通株式会社 | Semiconductor package and semiconductor device |
| JP5874935B2 (en) * | 2011-05-20 | 2016-03-02 | 日本電気株式会社 | Flat plate cooling device and method of using the same |
| JP6285356B2 (en) * | 2012-07-06 | 2018-02-28 | 治彦 大田 | Boiling cooler |
| CN113008058B (en) * | 2021-03-08 | 2022-05-24 | 华北电力大学 | Photo-thermal seed bubble micro-evaporator |
-
1996
- 1996-12-06 JP JP32625196A patent/JP3210261B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10173115A (en) | 1998-06-26 |
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