JP3199156B2 - Surface decoration method for resin products - Google Patents

Surface decoration method for resin products

Info

Publication number
JP3199156B2
JP3199156B2 JP28267895A JP28267895A JP3199156B2 JP 3199156 B2 JP3199156 B2 JP 3199156B2 JP 28267895 A JP28267895 A JP 28267895A JP 28267895 A JP28267895 A JP 28267895A JP 3199156 B2 JP3199156 B2 JP 3199156B2
Authority
JP
Japan
Prior art keywords
mold
resin product
plating
plating layer
pattern forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP28267895A
Other languages
Japanese (ja)
Other versions
JPH09123181A (en
Inventor
賢二 西谷
直夫 山崎
孟 杉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP28267895A priority Critical patent/JP3199156B2/en
Publication of JPH09123181A publication Critical patent/JPH09123181A/en
Application granted granted Critical
Publication of JP3199156B2 publication Critical patent/JP3199156B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • ing And Chemical Polishing (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、模様部が細かい凹
凸を有する粗面(シボ面、梨地面)となっている樹脂製
品の表面装飾方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for decorating a surface of a resin product in which a pattern portion has a rough surface (textured surface, matte surface) having fine irregularities.

【0002】[0002]

【従来の技術】上記樹脂製品を成形するための金型製作
方法の従来例を図1を参照して説明する。
2. Description of the Related Art A conventional example of a mold manufacturing method for molding the above resin product will be described with reference to FIG.

【0003】先ず金型3の表面を薬品にて脱脂を行な
い、次いで模様形成部と全く関係のない部分をマスキン
グ材で被覆し保護する1次マスキングを行なう。その後
金型のマスキング材で被覆されていない表面である加工
面の酸化物・油脂被覆を完全除去するため酸処理を行な
った後、レジスト(感光性樹脂)1を前記加工面に塗布
し、次いで加熱乾燥させる。次にパターン形成フィルム
(シボパターンフィルム)2をレジスト1を覆うように
配置し、露光することにより、レジスト1に模様パター
ンを転写する(図1の(a))。その後未露光部を現像
液にて溶解除去し(図1の(b))、露光で硬化し残存
したレジスト1の前記加工面への密着性を高めるため加
熱処理を行なう。次に1次マスキングの補修・補強のた
めの2次マスキングを行なった後、金型表面にエッチン
グ処理を施す(図1の(c))。このエッチング処理に
より、マスキング材及びレジスト1によって覆われてい
ない模様形成部のみに、細かい凹凸を有する粗面が形成
される。次いでパターン形成フィルム2及びマスキング
材を化学的・物理的に除去すると金型表面に前記粗面か
らなる模様形成面(シボ形成面)4が形成される(図1
の(d))。
[0003] First, the surface of the mold 3 is degreased with a chemical, and then a primary masking for covering and protecting a portion completely unrelated to the pattern forming portion with a masking material is performed. Thereafter, an acid treatment is performed to completely remove the oxide / fat coating on the processed surface that is not coated with the masking material of the mold, and then a resist (photosensitive resin) 1 is applied to the processed surface. Heat and dry. Next, a pattern forming film (textured pattern film) 2 is arranged so as to cover the resist 1, and the pattern is transferred to the resist 1 by exposing (FIG. 1 (a)). Thereafter, the unexposed portion is dissolved and removed with a developing solution (FIG. 1B), and a heat treatment is performed to increase the adhesion of the remaining resist 1 hardened by exposure to the processed surface. Next, after performing secondary masking for repair / reinforcement of the primary masking, the die surface is subjected to etching treatment (FIG. 1 (c)). By this etching process, a rough surface having fine irregularities is formed only in the pattern forming portion not covered by the masking material and the resist 1. Next, when the pattern forming film 2 and the masking material are chemically and physically removed, a pattern forming surface (texture forming surface) 4 composed of the rough surface is formed on the die surface (FIG. 1).
(D)).

【0004】必要に応じて模様形成面4の光沢度・表面
粗度をサンドブラスト仕上によって調整することができ
る。なお、特開平6−143293号公報で、金型表面
に金型素材より高硬度のシボ形成層を設け、更にその上
に耐磨耗性被覆層を設ける工法が開示されている。
If necessary, the glossiness and surface roughness of the pattern forming surface 4 can be adjusted by sandblasting. Japanese Patent Application Laid-Open No. Hei 6-143293 discloses a method in which a grain forming layer having a higher hardness than the mold material is provided on the mold surface, and a wear-resistant coating layer is further provided thereon.

【0005】[0005]

【発明が解決しようとする課題】従来の製作方法で得ら
れた金型表面は、図2に示すように、模様形成面4と、
エッチング処理が施されていない光沢面7の凹凸関係
が、前者が凹で、後者が凸という関係となる。そのた
め、この金型を用いて樹脂成形すると、樹脂製品Aの前
記模様形成面4が転写された模様部(シボ面)6bが凸
面となり、光沢面7bが凹面となる。
As shown in FIG. 2, the mold surface obtained by the conventional manufacturing method has a pattern forming surface 4,
The unevenness relationship of the glossy surface 7 not subjected to the etching treatment is such that the former is concave and the latter is convex. Therefore, when resin molding is performed using this mold, the pattern portion (textured surface) 6b to which the pattern forming surface 4 of the resin product A is transferred becomes a convex surface, and the glossy surface 7b becomes a concave surface.

【0006】樹脂製品の模様部(シボ面)6bが凸面と
なっていると傷付き易く、これを凹面としたい場合が多
いが、上記従来法ではそれが不可能であった。
If the pattern portion (texture surface) 6b of the resin product has a convex surface, it is easily damaged, and it is often desired to make it concave, but this is not possible with the above-mentioned conventional method.

【0007】本発明は上記従来の問題を解決するもの
で、模様部の凹凸が従来のものとは逆の樹脂製品が得ら
れる方法を提供することを目的とする。
An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method for obtaining a resin product in which the unevenness of a pattern portion is opposite to that of a conventional resin product.

【0008】[0008]

【課題を解決するための手段】本願第1発明の樹脂製品
の表面装飾方法は、上記目的を達成するため、エッチン
グ処理を施すことにより金型表面の模様形成部にのみ細
かい凹凸を有する粗面を形成し、次いで前記粗面のみに
メッキ処理を施して、メッキ層の表面がその周囲の面よ
り突出するようにして金型を製造し、この金型を用いて
樹脂製品を成形することを特徴とする。
According to a first aspect of the present invention, there is provided a method for decorating a surface of a resin product, wherein the rough surface having fine irregularities only in a pattern forming portion of a mold surface by performing an etching process to achieve the above object. Then, plating is performed only on the rough surface, a mold is manufactured such that the surface of the plating layer protrudes from the surrounding surface, and a resin product is molded using the mold. Features.

【0009】本願第2発明の樹脂製品の表面装飾方法
は、上記目的を達成するため、エッチング処理を施すこ
とにより金型表面の模様形成部にのみ細かい凹凸を有す
る粗面を形成し、次いで前記粗面のみにメッキ処理を施
して、メッキ層の表面がその周囲の面より突出するよう
にし、更にその後金型表面全体にメッキ処理を施して金
型を製造し、この金型を用いて樹脂製品を成形すること
を特徴とする。
In order to achieve the above object, the surface decoration method for a resin product according to the second invention of the present application forms a rough surface having fine irregularities only on a pattern forming portion of a mold surface by performing an etching process, Apply plating only to the rough surface so that the surface of the plating layer protrudes from the surrounding surface, and then apply plating to the entire surface of the mold to produce a mold. It is characterized by molding the product.

【0010】上記第1発明又は第2発明において、メッ
キ処理に用いるメッキ材料は金型素材より高硬度なもの
であることが好適である。
In the first or second aspect of the present invention, it is preferable that the plating material used in the plating process has a higher hardness than the die material.

【0011】本願の第1発明によれば、金型表面の模様
形成部の細かい凹凸を有する粗面上にのみメッキ処理を
施し、そのメッキ層の厚みを大にして表面がその周囲の
面(一般に光沢面)より突出するようにしており、メッ
キ層は前記細かい凹凸に倣った凹凸をその表面に有する
こととなるので、金型の模様形成部は凸面となる。従っ
てこの金型により成形された樹脂製品の細かい凹凸を有
する粗面状の模様部がその周囲の面より凹陥した状態で
形成される。
According to the first aspect of the present invention, plating is performed only on the rough surface having fine irregularities of the pattern forming portion on the mold surface, the thickness of the plating layer is increased, and the surface becomes the peripheral surface ( (A generally glossy surface), and the plating layer has irregularities on its surface following the fine irregularities, so that the pattern forming portion of the mold has a convex surface. Therefore, the rough surface pattern portion having fine irregularities of the resin product formed by the mold is formed in a state recessed from the surrounding surface.

【0012】本願の第2発明も、第1発明と同様の理由
で、細かい凹凸を有する粗面がその周囲の面より凹陥し
た状態の模様部を有する樹脂製品を成形することができ
る。その上金型表面全体がメッキ層で覆われるので、金
型表面全体の耐食性、耐磨耗性、光沢性を高めることが
できる。
According to the second invention of the present application, for the same reason as in the first invention, a resin product having a pattern portion in which a rough surface having fine irregularities is depressed from its surrounding surface can be formed. In addition, since the entire surface of the mold is covered with the plating layer, the corrosion resistance, abrasion resistance, and gloss of the entire surface of the mold can be improved.

【0013】[0013]

【発明の実施の形態】本発明の第1実施形態を図3及び
図4を参照しつつ説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS.

【0014】先ず、金型3の表面を薬品にて脱脂を行な
う。次に模様形成部と全く関係のない部分をマスキング
材で被覆し保護する1次マスキングを行なう。この1次
マスキングにおいては、境界線部に樹脂接着テープを貼
着し、その周囲にラッカーを塗布し乾燥させる方法を採
用することが一般的である。
First, the surface of the mold 3 is degreased with a chemical. Next, primary masking for covering and protecting a portion completely unrelated to the pattern forming portion with a masking material is performed. In this primary masking, it is common to employ a method in which a resin adhesive tape is adhered to the boundary line, a lacquer is applied around the adhesive tape, and then dried.

【0015】その後金型3のマスキング材で被覆されて
いない表面である加工面の酸化物・油脂被膜を完全除去
するための酸処理を行なう。次いで感光性樹脂からなる
レジスト1を前記加工面に塗布し、次いで加熱乾燥させ
る。次にパターン形成フィルム(シボパターンフィル
ム)2をレジスト1を覆うように配置し、露光すること
により、レジスト1に模様パターンを転写する(図3の
(a))。その後未露光部を現像液にて溶解除去し(図
3の(b))、露光で硬化し残存したレジスト1の前記
加工面への密着性を高めるため加熱処理を行なう。
Thereafter, an acid treatment is performed to completely remove the oxide / fat coating on the processed surface of the mold 3 which is not covered with the masking material. Next, a resist 1 made of a photosensitive resin is applied to the processed surface, and then dried by heating. Next, a pattern forming film (textured pattern film) 2 is arranged so as to cover the resist 1, and the pattern is transferred to the resist 1 by exposing (FIG. 3A). Thereafter, the unexposed portion is dissolved and removed with a developing solution (FIG. 3B), and a heat treatment is performed to increase the adhesion of the remaining resist 1 hardened by exposure to the processed surface.

【0016】次に1次マスキングの補修・補強のための
2次マスキングを行なった後、金型表面にエッチング処
理を施す(図3の(c))。このエッチング処理によ
り、マスキング材及びレジスト1によって覆われていな
い模様形成部のみに、細かい凹凸を有する粗面4が形成
される。このような状態でメッキ処理を施す(図3の
(d))。メッキ処理に用いるメッキ材料は金型素材よ
り高硬度のものを用い、例えばクロムを用いる。メッキ
層5の厚みは、10〜15μ程度の相当厚いものとし、
メッキ層5の表面6がその周囲の面(光沢面)7より突
出するようにしている。又メッキ層5の厚みはレジスト
1の厚み以下として、模様部の輪郭形状が損なわれない
ようにしている。その後パターン形成フィルム2及びマ
スキング材を化学的・物理的に除去する(図3の
(e))。この結果、メッキ層5は前記細かい凹凸に倣
った凹凸をその表面6に有し、その周囲の光沢面7より
突出することになり、これにより凸面の模様形成部が金
型表面に形成される。
Next, after performing secondary masking for repairing and reinforcing the primary masking, the die surface is subjected to an etching treatment (FIG. 3C). By this etching process, the rough surface 4 having fine irregularities is formed only in the pattern forming portion not covered by the masking material and the resist 1. Plating is performed in such a state (FIG. 3 (d)). As a plating material used for the plating process, a material having a higher hardness than the die material is used, for example, chromium is used. The thickness of the plating layer 5 is set to a considerably large value of about 10 to 15 μ,
The surface 6 of the plating layer 5 is made to protrude from the surrounding surface (glossy surface) 7. The thickness of the plating layer 5 is set to be equal to or less than the thickness of the resist 1 so that the contour of the pattern portion is not damaged. Thereafter, the pattern forming film 2 and the masking material are chemically and physically removed (FIG. 3E). As a result, the plating layer 5 has irregularities on its surface 6 following the fine irregularities and protrudes from the surrounding glossy surface 7, whereby a convex pattern forming portion is formed on the mold surface. .

【0017】上記のように製作した金型を用いて射出成
形等の樹脂成形法により樹脂製品を成形すると、図4に
示すように、模様部8の細かい凹凸を有する粗面6aが
その周囲の光沢面7aより凹陥した状態にある樹脂製品
Aが得られる。
When a resin product is molded by a resin molding method such as injection molding using the mold manufactured as described above, as shown in FIG. 4, a rough surface 6a having fine irregularities of the pattern portion 8 is formed around the periphery. The resin product A that is recessed from the glossy surface 7a is obtained.

【0018】次に本発明の第2実施形態を図5及び図6
を参照しつつ説明する。
Next, a second embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG.

【0019】第2実施形態は、図5と図3を比較して明
らかなように、第1実施形態と同様の工程を行なった
後、2次メッキ工程が付加されている点に特徴を有して
いる。この2次メッキ工程は、金型表面全体に、金型素
材より高硬度のもの、例えばクロムを用いて、5μ厚程
度の2次メッキ層9を形成するものである(図5の
(f))。この結果図6に示すように、2次メッキ層9
の凸面に前記メッキ層5の細かい凹凸の表面6に倣った
凹凸状の粗面6’が形成され、その凹面に金型表面の光
沢面7に倣った光沢面7’が形成される。
The second embodiment is characterized in that a secondary plating step is added after performing the same steps as the first embodiment, as is apparent from a comparison between FIG. 5 and FIG. are doing. In this secondary plating step, a secondary plating layer 9 having a thickness of about 5 μm is formed on the entire surface of the mold using a material having a higher hardness than the mold material, for example, chromium (FIG. 5 (f)). ). As a result, as shown in FIG.
Is formed on the convex surface of the plating layer 5 to form a rough surface 6 'having an uneven shape following the fine uneven surface 6 of the plating layer 5, and the concave surface thereof is formed with a gloss surface 7' following the gloss surface 7 of the mold surface.

【0020】上記のように製作した金型を用いて樹脂製
品を成形すると、図6に示すように、模様部8の細かい
凹凸を有する粗面6aがその周囲の光沢面7aより凹陥
した状態にある樹脂製品Aが得られる。
When a resin product is molded using the mold manufactured as described above, as shown in FIG. 6, the rough surface 6a having fine irregularities of the pattern portion 8 is recessed from the surrounding glossy surface 7a. A certain resin product A is obtained.

【0021】[0021]

【発明の効果】本願の第1発明によれば、細かい凹凸を
有する粗面状の模様部がその周囲の面より凹陥した状態
でシボ模様などが形成された樹脂製品を成形することが
できる。
According to the first aspect of the present invention, it is possible to mold a resin product on which a grain pattern or the like is formed in a state where a rough surface pattern portion having fine irregularities is depressed from its surrounding surface.

【0022】本願の第2発明によれば、第1発明の効果
と同様の効果を有する上に、金型表面全体がメッキ層で
覆われるので、金型表面全体の耐食性、耐磨耗性、光沢
性を高めることができる。
According to the second invention of the present application, in addition to having the same effect as that of the first invention, since the entire mold surface is covered with the plating layer, the corrosion resistance, abrasion resistance, Glossiness can be increased.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来例を示す工程図と主要工程の概略説明図。FIG. 1 is a process diagram showing a conventional example and a schematic explanatory diagram of main processes.

【図2】従来例における金型表面と樹脂製品を示す断面
図。
FIG. 2 is a sectional view showing a mold surface and a resin product in a conventional example.

【図3】本発明の第1実施形態を示す工程図と主要工程
の概略説明図。
FIG. 3 is a process chart showing a first embodiment of the present invention and a schematic explanatory view of main steps.

【図4】その樹脂製品を示す断面図。FIG. 4 is a sectional view showing the resin product.

【図5】本発明の第2実施形態を示す工程図と主要工程
の概略説明図。
FIG. 5 is a process chart showing a second embodiment of the present invention and a schematic explanatory view of main steps.

【図6】その金型表面と樹脂製品を示す断面図。FIG. 6 is a sectional view showing the mold surface and a resin product.

【符号の説明】[Explanation of symbols]

1 レジスト 2 パターン形成フィルム 3 金型 4 粗面 5 メッキ層 6 メッキ層の表面 6a 粗面 6’ 粗面 7 光沢面 7a 光沢面 7’ 光沢面 8 模様部 9 メッキ層 A 樹脂製品 DESCRIPTION OF SYMBOLS 1 Resist 2 Pattern forming film 3 Die 4 Rough surface 5 Plating layer 6 Plating layer surface 6a Rough surface 6 'Rough surface 7 Gloss surface 7a Gloss surface 7' Gloss surface 8 Pattern part 9 Plating layer A Resin product

フロントページの続き (72)発明者 杉本 孟 大阪府守口市佐太中町3丁目13番29号 アヤマダイ株式会社内 (56)参考文献 特開 平5−212727(JP,A) 特開 平6−122125(JP,A) (58)調査した分野(Int.Cl.7,DB名) B29C 33/00 - 33/76 B29C 43/36 - 43/42 B29C 45/26 - 45/44 Continuation of front page (72) Inventor Takeshi Sugimoto 3-13-29 Satanakacho, Moriguchi-shi, Osaka Ayamadai Co., Ltd. (56) References JP-A-5-212727 (JP, A) JP-A-6-122125 ( JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) B29C 33/00-33/76 B29C 43/36-43/42 B29C 45/26-45/44

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 エッチング処理を施すことにより金型表
面の模様形成部にのみ細かい凹凸を有する粗面を形成
し、次いで前記粗面のみにメッキ処理を施して、メッキ
層の表面がその周囲の面より突出するようにして金型を
製造し、この金型を用いて樹脂製品を成形することを特
徴とする樹脂製品の表面装飾方法。
A rough surface having fine irregularities is formed only on a pattern forming portion of a mold surface by performing an etching process , and then only the rough surface is subjected to a plating process so that a surface of a plating layer is formed around the rough surface. A method for manufacturing a surface of a resin product, comprising: manufacturing a mold so as to protrude from a surface; and molding the resin product using the mold.
【請求項2】 請求項1記載の表面装飾方法において、
メッキ層の表面がその周囲の面より突出するようにした
後、更にその後金型表面全体にメッキ処理を施して金型
を製造することを特徴とする樹脂製品の表面装飾方法。
2. The surface decoration method according to claim 1, wherein
A method for decorating a surface of a resin product, wherein a surface of a plating layer protrudes from a peripheral surface thereof, and then a plating process is performed on the entire surface of the mold to manufacture a mold.
【請求項3】 メッキ処理に用いるメッキ材料は金型素
材より高硬度のものであることを特徴とする請求項1又
は2記載の樹脂製品の表面装飾方法。
3. The plating material used in the plating process is a mold element.
The surface decoration method for a resin product according to claim 1, wherein the surface decoration is higher in hardness than the material .
JP28267895A 1995-10-31 1995-10-31 Surface decoration method for resin products Expired - Fee Related JP3199156B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28267895A JP3199156B2 (en) 1995-10-31 1995-10-31 Surface decoration method for resin products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28267895A JP3199156B2 (en) 1995-10-31 1995-10-31 Surface decoration method for resin products

Publications (2)

Publication Number Publication Date
JPH09123181A JPH09123181A (en) 1997-05-13
JP3199156B2 true JP3199156B2 (en) 2001-08-13

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JP5941253B2 (en) * 2011-08-22 2016-06-29 株式会社小糸製作所 Vehicle lamp
DE102014201885A1 (en) * 2014-02-03 2015-08-06 Johnson Controls Automotive Electronics Gmbh Cover for at least one display instrument in a vehicle
WO2019188797A1 (en) * 2018-03-27 2019-10-03 富士フイルム株式会社 Method for manufacturing mold having recessed seat pattern, and method for producing pattern sheet
JP7023178B2 (en) * 2018-05-10 2022-02-21 トヨタ紡織株式会社 Molding mold, manufacturing method of interior material for vehicles, and manufacturing method of molding mold
JP7049409B2 (en) * 2020-07-17 2022-04-06 マクセル株式会社 Manufacturing method of mold for plastic working

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