JP3198771B2 - heatsink - Google Patents
heatsinkInfo
- Publication number
- JP3198771B2 JP3198771B2 JP35533593A JP35533593A JP3198771B2 JP 3198771 B2 JP3198771 B2 JP 3198771B2 JP 35533593 A JP35533593 A JP 35533593A JP 35533593 A JP35533593 A JP 35533593A JP 3198771 B2 JP3198771 B2 JP 3198771B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- receiving block
- pipes
- pipe
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は発熱素子に固定されるヒ
ートパイプ式ヒートシンクに関し、特に、低温において
放熱性に優れるヒートシンクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type heat sink fixed to a heating element, and more particularly to a heat sink excellent in heat radiation at low temperatures.
【０００２】[0002]
【従来技術】車両用インバータにスイッチング素子とし
て使用されるＩＣやＬＳＩ等の半導体素子は作動時に発
熱を伴うことから放熱を促すためにヒートシンクに固定
される。2. Description of the Related Art A semiconductor element such as an IC or an LSI used as a switching element in a vehicle inverter generates heat during operation and is fixed to a heat sink to promote heat radiation.
【０００３】図３は、従来のヒートシンクを示し、(A)
は正面図、(B) は正面図のＡ−Ａ部における切断図であ
る。このヒートシンクは、半導体素子（図示せず）が固
定される受熱ブロック１と、銅管より成り、受熱ブロッ
ク１に所定の間隔をおいて複数本並列に挿入され、低融
点金属３によって隙間を充填されることにより固定され
るヒートパイプ２と、ヒートパイプ２の長さ方向に複数
設けられる放熱フィン４と、放熱フィン４の受熱ブロッ
ク１側に設けられた水切板５とを有し、ヒートパイプ２
の先端側には取付板６が固定され、更にヒートパイプ２
の先端には保護キャップ７が取り付けられている。FIG. 3 shows a conventional heat sink, and FIG.
FIG. 2 is a front view, and FIG. 2B is a cutaway view taken along the line AA of the front view. This heat sink is composed of a heat receiving block 1 to which a semiconductor element (not shown) is fixed, and a copper tube. A plurality of heat sinks are inserted in parallel in the heat receiving block 1 at predetermined intervals, and the gap is filled with the low melting point metal 3. The heat pipe 2 includes a heat pipe 2 fixed by the heat pipe 2, a plurality of radiating fins 4 provided in the length direction of the heat pipe 2, and a drain plate 5 provided on the heat receiving block 1 side of the radiating fin 4. 2
A mounting plate 6 is fixed to the front end of the heat pipe 2.
A protective cap 7 is attached to the tip of the.
【０００４】受熱ブロック１に挿入されたヒートパイプ
２の内部には作動液８として純水が内蔵されており、半
導体素子（図示せず）の作動に基づいて発生した熱が伝
達されると作動液８は蒸発・気化することによって管内
を移動する。作動液８の蒸発気体は管壁を介して放熱フ
ィン４に熱を伝達すると凝縮・液化し、受熱ブロック１
側に再び戻る。このような動作を繰り返すことによって
放熱が行われる。[0004] Pure water is contained as a working fluid 8 inside the heat pipe 2 inserted into the heat receiving block 1 and is activated when heat generated based on the operation of a semiconductor element (not shown) is transmitted. The liquid 8 moves in the pipe by evaporating and vaporizing. When the evaporated gas of the working fluid 8 transfers heat to the radiating fins 4 through the pipe wall, it condenses and liquefies, and the heat receiving block 1
Return to the side again. Heat is released by repeating such an operation.
【０００５】作動液８はヒートシンクが使用される状況
における周囲温度に基づいて選択され、０℃以下の周囲
温度で使用される場合には低温気化性にすぐれるフロン
系化合物等の低沸点作動液が内蔵される。The operating fluid 8 is selected based on the ambient temperature in a situation where the heat sink is used. When the operating fluid 8 is used at an ambient temperature of 0 ° C. or less, a low boiling operating fluid such as a fluorocarbon compound excellent in low-temperature vaporization is used. Is built-in.
【０００６】[0006]
【発明が解決しようとする課題】しかし、従来のヒート
シンクによれば、ヒートシンクの設置場所の周囲温度が
０℃以下になるとヒートパイプの作動液である純水が凍
結してしまうため、ヒートパイプの熱伝達特性が損なわ
れて受熱ブロックの温度が上昇し、半導体素子が破壊す
ることがある。一方、低温においても蒸発気化性の良い
フロン系化合物は地球の環境に与える影響が大きく使用
が困難になりつつある。従って、本発明の目的は、純水
を作動液として使用しても０℃以下の温度条件において
作動し、かつ放熱性に優れるヒートシンクを提供するこ
とにある。However, according to the conventional heat sink, when the ambient temperature of the place where the heat sink is installed becomes 0 ° C. or lower, pure water which is a working fluid of the heat pipe freezes. The heat transfer characteristic is impaired, the temperature of the heat receiving block rises, and the semiconductor element may be broken. On the other hand, a fluorocarbon compound having good evaporative vaporization even at a low temperature has a large effect on the earth's environment, and is becoming difficult to use. Accordingly, an object of the present invention is to provide a heat sink that operates under a temperature condition of 0 ° C. or less even when pure water is used as a working fluid and has excellent heat dissipation.
【０００７】[0007]
【課題を解決するための手段】本発明に係るヒートシン
クは、冷却を必要とする半導体素子等の発熱素子が固定
される受熱ブロックと、伝達された熱を放熱する放熱装
置と、一端が受熱ブロックに同じ深さに埋設され、他端
が放熱装置を介して放熱する複数のヒートパイプとを有
し、前記ヒートパイプの少なくとも１本は他のヒートパ
イプより長さが短く形成され、他端が前記放熱装置の一
部に熱接続されていることを特徴とするものである。A heat sink according to the present invention comprises a heat receiving block to which a heat generating element such as a semiconductor element requiring cooling is fixed, a heat radiating device for radiating the transmitted heat, and a heat receiving block at one end. A plurality of heat pipes buried at the same depth, the other end of which radiates heat through a heat radiating device, at least one of the heat pipes is formed shorter in length than other heat pipes, and the other end is It is characterized by being thermally connected to a part of the heat dissipation device.
【０００８】本発明によると、半導体素子の作動により
発生した熱を長さの異なるヒートパイプを介して放熱装
置に伝達することにより受熱ブロックの温度上昇を緩和
することができる。According to the present invention, the heat generated by the operation of the semiconductor element is transmitted to the heat radiating device through the heat pipes having different lengths, so that the temperature rise of the heat receiving block can be reduced.
【０００９】[0009]
【発明の実施の態様】以下、本発明のヒートシンクの実
施態様を説明する。従来技術と同一の構成を有する部分
については同一の符号および引用数字を付しているの
で、重複する説明を省略する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the heat sink according to the present invention will be described. Portions having the same configuration as in the related art are denoted by the same reference numerals and reference numerals, and duplicate description will be omitted.
【００１０】図１は本発明に係るヒートシンクの第１の
実施態様を示し、(A) は正面図、(B) は正面図のＡ−Ａ
部における切断図である。このヒートシンクは、受熱ブ
ロック１に所定の間隔をおいて複数本のヒートパイプ
２、９が並列に同じ深さで埋設され、ヒートパイプ２に
対して長さの短いヒートパイプ９が交互に設けられ、ヒ
ートパイプ９の他端は放熱フィン４の一部に熱接続され
ている。図１(B) に示されるように、ヒートパイプ９に
も作動液８としてヒートパイプ２と同様に純水が内蔵さ
れている。FIGS. 1A and 1B show a first embodiment of a heat sink according to the present invention, wherein FIG. 1A is a front view, and FIG.
It is a sectional view in a part. In this heat sink, a plurality of heat pipes 2 and 9 are buried in parallel at the same depth at predetermined intervals in a heat receiving block 1, and heat pipes 9 having a shorter length are provided alternately with respect to the heat pipe 2. The other end of the heat pipe 9 is thermally connected to a part of the radiation fin 4. As shown in FIG. 1 (B), pure water is contained in the heat pipe 9 as the working fluid 8 similarly to the heat pipe 2.
【００１１】半導体素子（図示せず）の作動に基づいた
熱が受熱ブロック１に伝達すると、ヒートパイプ２、９
の一端に内蔵された作動液８が蒸発・気化して管内を移
動する。When heat based on the operation of a semiconductor element (not shown) is transmitted to the heat receiving block 1, heat pipes 2, 9
The working fluid 8 contained in one end of the tube evaporates and vaporizes and moves in the pipe.
【００１２】ここで、周囲温度が０℃以下の場合、ヒー
トパイプ２側では熱接触している放熱フィン４が多く放
熱量が大きいので、作動液８の蒸発気体が管内で凍結し
てしまいヒートパイプとして機能しないが、ヒートパイ
プ９はヒートパイプ２に比べて長さが短いため、ヒート
パイプ９側では放熱フィン４が少なく放熱量が低く抑え
られるので、作動液８の蒸発気体は凍結せず、ヒートパ
イプとして機能する。従ってヒートパイプ９による放熱
フィン４への熱伝達が行われ受熱ブロック１の温度上昇
が緩和される。Here, when the ambient temperature is 0 ° C. or less, the heat pipe 2 side has many radiating fins 4 which are in thermal contact with each other and has a large amount of heat radiation. Although the heat pipe 9 does not function as a pipe, the heat pipe 9 has a shorter length than the heat pipe 2, so the heat radiating fins 4 are small on the heat pipe 9 side and the amount of heat radiated is suppressed low. Functions as a heat pipe. Therefore, heat is transmitted to the radiation fins 4 by the heat pipe 9 and the temperature rise of the heat receiving block 1 is reduced.
【００１３】一方、周囲温度が０℃以上の場合は、ヒー
トパイプ２及び９の作動により放熱フィン４へ熱が伝達
されて放熱されるので、受熱ブロック１の温度上昇が緩
和される。On the other hand, when the ambient temperature is equal to or higher than 0 ° C., the heat is transmitted to the radiating fins 4 by the operation of the heat pipes 2 and 9 to dissipate the heat, so that the temperature rise of the heat receiving block 1 is moderated.
【００１４】図２は、第２の実施態様を示し、(A) は正
面図、(B) は正面図のＡ−Ａ部における切断図である。
このようにヒートパイプ２，９を「く」の字状に屈曲さ
せて受熱ブロック１に埋設することによってヒートシン
ク全体をコンパクトに形成することができる。また、ヒ
ートシンクの設置場所に応じてヒートパイプを他の形状
に屈曲させても良い。FIGS. 2A and 2B show a second embodiment, in which FIG. 2A is a front view, and FIG. 2B is a sectional view taken along the line AA of the front view.
By bending the heat pipes 2 and 9 in the shape of a “<” and embedding the heat pipes in the heat receiving block 1 in this manner, the entire heat sink can be formed compact. Further, the heat pipe may be bent to another shape depending on the installation location of the heat sink.
【００１５】上記した各実施態様によれば、ヒートパイ
プに作動液として純水を使用しても０℃以下の周囲温度
において放熱フィンへの熱伝達が行えるので、受熱ブロ
ックの温度上昇を抑えることができ、また、純水を使用
することによって環境を破壊することもなく、かつ安価
に製造することができる。According to each of the above embodiments, even when pure water is used as the working fluid in the heat pipe, heat can be transferred to the radiating fins at an ambient temperature of 0 ° C. or less, so that the temperature rise of the heat receiving block can be suppressed. In addition, the use of pure water does not destroy the environment and can be manufactured at low cost.
【００１６】[0016]
【発明の効果】以上説明した通り、本発明のヒートシン
クによると、冷却を必要とする半導体素子等の発熱素子
が固定される受熱ブロックと、伝達された熱を放熱する
放熱装置と、一端が受熱ブロックに埋設され、他端が放
熱装置を介して放熱する複数のヒートパイプとを有し、
少なくとも１本のヒートパイプが他のヒートパイプより
長さが短く形成されていて、他端が前記放熱装置の一部
に熱接続されているようにしたため、純水を作動液とし
て使用しても０℃以下の温度条件において作動し、かつ
優れた放熱性を付与することができ、半導体素子の熱に
よる破壊を防止できる。As described above, according to the heat sink of the present invention, a heat receiving block to which a heat generating element such as a semiconductor element requiring cooling is fixed, a heat radiating device for radiating the transmitted heat, and one end receiving heat. A plurality of heat pipes buried in the block, the other end of which radiates heat through the heat radiating device,
Since at least one heat pipe is formed shorter in length than the other heat pipes and the other end is thermally connected to a part of the radiator, even if pure water is used as the working fluid, It operates under a temperature condition of 0 ° C. or less and can provide excellent heat dissipation, so that the semiconductor element can be prevented from being damaged by heat.
【図１】本発明に係るヒートシンクの第１の実施態様を
示し、(A) は正面図、(B) は正面図のＡ−Ａ部における
切断図である。FIGS. 1A and 1B show a first embodiment of a heat sink according to the present invention, wherein FIG. 1A is a front view, and FIG.
【図２】本発明に係るヒートシンクの第２の実施態様変
を示し、(A) は正面図、(B) は正面図のＡ−Ａ部におけ
る切断図である。FIGS. 2A and 2B show a modification of the second embodiment of the heat sink according to the present invention, wherein FIG. 2A is a front view, and FIG.
【図３】従来のヒートシンクを示し、(A) は正面図、
(B) は正面図のＡ−Ａ部における切断図である。FIG. 3 shows a conventional heat sink, (A) is a front view,
(B) is a cutaway view along the line AA in the front view.
１ 受熱ブロック ２、９ ヒートパイプ ３ 低融点金属 ４ 放熱フィン ５ 水切板 ６ 保護キャップ ７ 取付板 ８ 作動液 DESCRIPTION OF SYMBOLS 1 Heat receiving block 2, 9 Heat pipe 3 Low melting point metal 4 Radiation fin 5 Drain plate 6 Protective cap 7 Mounting plate 8 Hydraulic fluid
フロントページの続き (56)参考文献 特開 昭59−89445（ＪＰ，Ａ) 実開 平５−4495（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) F28D 15/02 H01L 23/427 H05K 7/20 Continuation of the front page (56) References JP-A-59-89445 (JP, A) JP-A-5-4495 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) F28D 15 / 02 H01L 23/427 H05K 7/20
Claims (3)
が固定される受熱ブロックと、伝達された熱を放熱する
放熱装置と、一端が前記受熱ブロックに同じ深さに埋設
され、他端が前記放熱装置を介して放熱する複数のヒー
トパイプとを有し、前記ヒートパイプの少なくとも１本
は他のヒートパイプより長さが短く形成されていて、他
端が前記放熱装置の一部に熱接続されていることを特徴
とするヒートシンク。1. A heat receiving block to which a heat generating element such as a semiconductor element requiring cooling is fixed, a heat radiating device for radiating transmitted heat, and one end is buried in the heat receiving block at the same depth, and the other end is provided. Has a plurality of heat pipes that radiate heat through the heat radiating device, at least one of the heat pipes is formed to be shorter than other heat pipes, and the other end is part of the heat radiating device. A heat sink that is thermally connected.
交互に配置されていることを特徴とする請求項第１項記
載のヒートシンク。2. The heat sink according to claim 1, wherein long heat pipes and short heat pipes are alternately arranged.
埋設されていることを特徴とする請求項１又は２記載の
ヒートシンク。3. The heat sink according to claim 1, wherein each heat pipe is bent and embedded in the heat receiving block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35533593A JP3198771B2 (en) | 1993-12-20 | 1993-12-20 | heatsink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35533593A JP3198771B2 (en) | 1993-12-20 | 1993-12-20 | heatsink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07176660A JPH07176660A (en) | 1995-07-14 |
| JP3198771B2 true JP3198771B2 (en) | 2001-08-13 |
Family
ID=18443343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35533593A Expired - Lifetime JP3198771B2 (en) | 1993-12-20 | 1993-12-20 | heatsink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3198771B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3900830B2 (en) * | 1999-03-19 | 2007-04-04 | 株式会社日立製作所 | Heat pipe type cooling device and power conversion device |
| GB2462098A (en) * | 2008-07-23 | 2010-01-27 | Ryan James Mcglen | Thermal management device comprising heat pipes |
| JP4693924B2 (en) | 2009-09-30 | 2011-06-01 | 株式会社東芝 | Electronics |
-
1993
- 1993-12-20 JP JP35533593A patent/JP3198771B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07176660A (en) | 1995-07-14 |
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