JP3193104B2 - Surface protection film - Google Patents
Surface protection filmInfo
- Publication number
- JP3193104B2 JP3193104B2 JP07323092A JP7323092A JP3193104B2 JP 3193104 B2 JP3193104 B2 JP 3193104B2 JP 07323092 A JP07323092 A JP 07323092A JP 7323092 A JP7323092 A JP 7323092A JP 3193104 B2 JP3193104 B2 JP 3193104B2
- Authority
- JP
- Japan
- Prior art keywords
- density polyethylene
- low
- density
- base material
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂板、金属板等の表
面に仮着させて使用する表面保護フイルムに関し、とく
に加熱成型加工される樹脂板に用いて最適な表面保護フ
イルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface protection film which is temporarily attached to the surface of a resin plate, a metal plate or the like, and more particularly to a surface protection film which is optimally used for a resin plate which is subjected to heat molding.
【０００２】[0002]
【従来の技術】表面保護フイルムは、樹脂板、金属板等
（以下樹脂板等という。）の表面に、適度な接着力をも
って仮着され、通常、樹脂板等を加熱成型加工する間
も、粘着されたままで使用され、樹脂板等を最終的に使
用する段階で剥がされる。この表面保護フイルムには、
樹脂板等の運搬や保管時の傷付き防止のための表面保護
の他に、加熱加工時にもよじれたりしないだけの寸法安
定性、ロール状に巻かれている表面保護フイルムを巻き
戻して使用する際にブロッキングを生じない巻戻し性等
の特性が要求される。また、被表面保護材が樹脂板であ
る場合、加熱成型時に樹脂板が軟化するが、樹脂板と表
面保護フイルムとの間に介在していた、あるいはその間
で発生した気泡により、樹脂板表面にクレータ状の凹み
（以下、板傷と呼ぶ）が生じることがある。これは、表
面保護フイルム側の抗力が高すぎるために、軟化した樹
脂板表面側が負けてしまい、上記気泡により板傷が発生
するという現象である。したがって、とくに加熱加工工
程をもつ樹脂板に適用される表面保護フイルムには、上
記寸法安定性、巻戻し性とともに、板傷の発生を防止で
きるだけの軟化、流動化特性が要求される。2. Description of the Related Art A surface protective film is temporarily attached to a surface of a resin plate, a metal plate or the like (hereinafter referred to as a resin plate or the like) with an appropriate adhesive force. It is used while being adhered, and is peeled off at the stage of finally using a resin plate or the like. This surface protection film includes
In addition to surface protection to prevent scratches during transportation and storage of resin plates, etc., it also has dimensional stability to prevent kinks during heat processing, and rewind and use a surface protection film wound in a roll. In such a case, characteristics such as unwinding property that do not cause blocking are required. When the surface-protected material is a resin plate, the resin plate softens during heat molding, but is interposed between the resin plate and the surface protection film, or is generated between the resin plate and the surface of the resin plate. Crater-like depressions (hereinafter referred to as plate scratches) may occur. This is a phenomenon in which the resistance of the surface protective film side is too high, so that the softened resin plate surface side loses, and the bubbles cause plate damage. Therefore, a surface protective film applied to a resin plate having a heat processing step is required to have not only the above-mentioned dimensional stability and unwinding property but also softening and fluidizing properties enough to prevent the occurrence of plate scratches.
【０００３】従来から各種の表面保護フイルムが知られ
ている。たとえば、基材層を高密度ポリエチレンで構成
したもの（特公昭５５−１１９０号公報）、基材層に無
機粒子を含有させたもの（特開昭５５−１６５９７４号
公報）、基材層を低密度ポリエチレンと高密度ポリエチ
レンとのブレンド物から構成したもの（特開昭５４−１
３３５７８号公報）等が知られている。Conventionally, various surface protection films have been known. For example, a base layer composed of high-density polyethylene (Japanese Patent Publication No. 55-1190), a base layer containing inorganic particles (Japanese Patent Application Laid-Open No. 55-165974), Composed of a blend of high density polyethylene and high density polyethylene (JP-A-54-1
No. 33578) is known.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、高密度
ポリエチレン、又は高密度ポリエチレンと低密度ポリエ
チレンとのブレンド物で表面保護フイルムの基材層を構
成する場合、高温加熱時の寸法安定性は得られるもの
の、板傷発生防止効果が不十分である。また、無機粒子
を含有させたものは、表面を適度に粗くして巻戻し時の
耐ブロッキング性は向上できるものの、無機粒子含有は
板傷発生防止とは無関係であるため、十分な板傷発生防
止効果が得られていない。However, when the base layer of the surface protective film is made of high-density polyethylene or a blend of high-density polyethylene and low-density polyethylene, dimensional stability during high-temperature heating can be obtained. However, the effect of preventing the occurrence of plate flaws is insufficient. In addition, those containing inorganic particles can improve the blocking resistance at the time of rewinding by appropriately roughening the surface, but since the inorganic particles are not related to the prevention of the occurrence of sheet scratches, sufficient sheet scratches are generated. The prevention effect has not been obtained.
【０００５】本発明は、上記のような従来の表面保護フ
イルムにおける問題点に着目し、良好な寸法安定性、巻
戻し性を有すると同時に、とくに樹脂板に適用された場
合に優れた板傷発生防止効果を奏する表面保護フイルム
を提供することを目的とする。The present invention focuses on the problems of the conventional surface protective film as described above, and has excellent dimensional stability and rewinding property, and at the same time, excellent sheet flaws when applied to a resin plate. An object of the present invention is to provide a surface protection film having an effect of preventing occurrence.
【０００６】[0006]
【課題を解決するための手段】この目的に沿う本発明の
表面保護フイルムは、密度０．９２０ないし０．９３５
ｇ／ｃｍ3 の低密度ポリエチレンを主成分とし、表面粗
さが中心線平均粗さＲａにて０．０８ないし２．００μ
ｍのスエル比１．５以上で溶融押し出しされたフィルム
からなる基材層と、該基材層の片面に積層された粘着層
とからなる。基材層は低密度ポリエチレンが主成分であ
れば、他の成分として、他のポリオレフィン類、オレフ
ィン系共重合物、オレフィン系変成物を含んでいてもよ
い。また、基材層が、低密度ポリエチレンを主成分とす
る混合物で構成されているものであってもよく、たとえ
ば、基材層が、密度０．９２０ｇ／ｃｍ 3 以上０．９３
０ｇ／ｃｍ 3 未満の低密度ポリエチレンと、密度０．９
３０ｇ／ｃｍ 3 以上０．９３５ｇ／ｃｍ 3 以下の低密度
ポリエチレンとの混合物で構成されているものであって
もよい。 According to the present invention, there is provided a surface protective film having a density of 0.920 to 0.935.
g / cm 3 of low-density polyethylene as a main component, and the surface roughness is 0.08 to 2.00 μm in center line average roughness Ra.
Extruded film with swell ratio of 1.5 or more
And a pressure-sensitive adhesive layer laminated on one side of the substrate layer. As long as the base material layer is mainly composed of low-density polyethylene, other components may include other polyolefins, olefin-based copolymers, and olefin-modified products. Further, the base material layer is mainly composed of low-density polyethylene.
May be composed of a mixture of
If the base material layer has a density of 0.920 g / cm 3 or more and 0.93
A low density polyethylene of less than 0 g / cm 3 and a density of 0.9
Low density of 30 g / cm 3 or more and 0.935 g / cm 3 or less
Consisting of a mixture with polyethylene
Is also good.
【０００７】この基材層の表面粗さをポリマーサイドか
ら達成するには、基材層を密度の異なる少なくとも２種
の低密度ポリエチレンで構成するか、あるいは、基材層
の低密度ポリエチレンを（たとえ１種の低密度ポリエチ
レンからなる場合にあっても）、スウェル比１．５以上
の条件で溶融押出することによって達成される。In order to achieve the surface roughness of the substrate layer from the polymer side, the substrate layer is composed of at least two types of low-density polyethylene having different densities, or the low-density polyethylene of the substrate layer is formed by ( Even if it consists of one kind of low-density polyethylene), it is achieved by melt-extruding at a swell ratio of 1.5 or more.
【０００８】本発明の表面保護フイルムは、基材層と、
被保護体の表面に粘着される粘着層との積層構成を有す
る。粘着層の材質は特に限定しないが、耐熱性のあるも
のが好ましい。ここで言う耐熱性とは、被保護体の表面
に貼り込まれた表面保護フイルムが高温下に晒されたと
き、粘着力が昂進せず適度な粘着力を保持する性質のこ
とである。耐熱性とともに、被保護体に対して適度な粘
着力、良好な密着性をもたせるために、とくに、低密度
ポリエチレン、または低密度ポリエチレンと直鎖状低密
度ポリエチレンとの混合物が好ましい。また、粘着層の
粘着性をさらに向上させるために粘着層に０．１ないし
１０重量％の粘着性付与剤を添加してもよい。粘着性付
与剤としては、たとえば、ロジン系樹脂、テルペン系樹
脂、石油系樹脂、オレフィン系ゴム、スチレン−イソプ
レン−スチレン共重合樹脂、スチレン−ブタジエン−ス
チレン共重合樹脂が挙げられる。[0008] The surface protective film of the present invention comprises:
It has a laminated structure with an adhesive layer that is adhered to the surface of the protected object. The material of the adhesive layer is not particularly limited, but a material having heat resistance is preferable. The term “heat resistance” as used herein refers to a property in which, when a surface protective film stuck on the surface of a protected object is exposed to a high temperature, the adhesive strength does not increase and an appropriate adhesive strength is maintained. In order to provide not only heat resistance but also appropriate adhesion and good adhesion to the protected object, low-density polyethylene or a mixture of low-density polyethylene and linear low-density polyethylene is particularly preferable. Further, in order to further improve the adhesiveness of the adhesive layer, 0.1 to 10% by weight of a tackifier may be added to the adhesive layer. Examples of the tackifier include a rosin resin, a terpene resin, a petroleum resin, an olefin rubber, a styrene-isoprene-styrene copolymer resin, and a styrene-butadiene-styrene copolymer resin.
【０００９】本発明の表面保護フイルムにおいては、基
材層の主成分は、密度０．９２０ないし０．９３５ｇ／
ｃｍ3 の低密度ポリエチレンとされる。この密度範囲
は、低密度ポリエチレンの中でも比較的高密度領域に属
する。低密度ポリエチレンの中でも比較的低密度のもの
では、十分な寸法安定性、巻戻し性が得られにくい。こ
の密度範囲の低密度ポリエチレンは、高温加熱時に十分
な軟化するので、表面保護フイルムと樹脂板との間に気
泡が発生しても、膨張気泡の体積分を表面保護フイルム
側で吸収したり、表面保護フイルムが流動して気泡を分
散させたりすることができ、板傷の発生を防止すること
ができる。換言すれば、この低密度ポリエチレンは、高
温融解収縮力が小さいので、気泡を樹脂板表面側に強く
押しつけることがなく、樹脂板にはクレータ状の凹みは
発生しない。In the surface protective film of the present invention, the main component of the base material layer has a density of 0.920 to 0.935 g / d.
cm 3 low density polyethylene. This density range belongs to a relatively high-density region among low-density polyethylenes. Among the low-density polyethylenes, those having a relatively low density are difficult to obtain sufficient dimensional stability and unwinding property. Since the low-density polyethylene in this density range is sufficiently softened at the time of high-temperature heating, even if bubbles are generated between the surface protection film and the resin plate, the volume of the expanded bubbles is absorbed by the surface protection film, The surface protection film can flow and disperse bubbles, and can prevent plate scratches. In other words, since the low-density polyethylene has a small high-temperature melting shrinkage force, the low-density polyethylene does not strongly press air bubbles against the surface of the resin plate, and no crater-like dent is generated in the resin plate.
【００１０】そしてこの比較的高密度域の低密度ポリエ
チレンは、優れた耐熱性、高温寸法安定性も併せもつの
で、表面保護フイルムが樹脂板に貼り付けられたまま加
熱成型加工されても、表面保護フイルムがよじれたり、
歪んだり、剥がれたりすることがない。The low-density polyethylene in the relatively high-density region also has excellent heat resistance and high-temperature dimensional stability. The protective film may be twisted,
It does not distort or peel off.
【００１１】しかし単に基材層を上記のような低密度ポ
リエチレンで構成するだけでは、板傷発生防止効果、優
れた寸法安定性は得られるものの、十分な巻戻し性（耐
ブロッキング性）は得られない。本発明では、優れた巻
戻し性も同時に確保するために、基材層の表面粗さが、
中心線平均粗さＲａにて０．０８ないし２．００μｍの
範囲に特定される。つまり、基材層の表面を、適度に大
きく粗らすことにより、ブロッキングしにくい表面が得
られ、巻戻し性が向上される。However, simply forming the base material layer from the above-mentioned low-density polyethylene can provide an effect of preventing plate flaws and excellent dimensional stability, but can provide a sufficient unwinding property (blocking resistance). I can't. In the present invention, in order to simultaneously ensure excellent rewindability, the surface roughness of the base material layer,
The center line average roughness Ra is specified in the range of 0.08 to 2.00 μm. That is, by roughening the surface of the base material layer appropriately and large, a surface that is difficult to block is obtained, and the rewinding property is improved.
【００１２】基材層表面の上記範囲内への粗化は、たと
えば、次の方法によって実現できる。一つ目の方法は、
基材層の低密度ポリエチレンが、密度の異なる少なくと
も２種の低密度ポリエチレンからなる方法である。例え
ば、密度０．９３０ｇ／ｃｍ 3 以上０．９３５ｇ／ｃｍ
3 以下の低密度ポリエチレンと、密度０．９２０ｇ／ｃ
ｍ 3 以上０．９３０ｇ／ｃｍ3 未満の低密度ポリエチレ
ンとすることにより、密度差により溶融押出後冷却固化
時の結晶化速度が異なるので、冷却固化時に自然に凹凸
が形成される。この凹凸は、密度差、冷却速度、溶融温
度、冷却ドラム表面粗度等各種条件によってコントロー
ルされるので、適当な条件を選ぶことにより上記表面粗
さ範囲とすることができる。The roughening of the surface of the base material layer within the above range can be realized by, for example, the following method. The first method is
This is a method in which the low-density polyethylene of the base material layer is composed of at least two types of low-density polyethylene having different densities. For example, a density of 0.930 g / cm 3 or more and 0.935 g / cm 3
Low density polyethylene of 3 or less and density of 0.920 g / c
By using a low-density polyethylene of m 3 or more and less than 0.930 g / cm 3, the crystallization speed at the time of cooling and solidifying after melt extrusion differs depending on the density difference. Since the unevenness is controlled by various conditions such as a density difference, a cooling rate, a melting temperature, and a cooling drum surface roughness, the above surface roughness range can be obtained by selecting appropriate conditions.
【００１３】二つ目の方法は、基材層の低密度ポリエチ
レンがスウェル比１．５以上となる条件で溶融押出しさ
れる方法である。この時、基材層を構成する低密度ポリ
エチレンは、前記範囲内の密度の１種の低密度ポリエチ
レンでもよく、密度の異なる２種以上の低密度ポリエチ
レンでもよい。The second method is a method in which the low-density polyethylene of the base material layer is melt-extruded under the condition that the swell ratio is 1.5 or more. At this time, the low-density polyethylene constituting the base layer may be one kind of low-density polyethylene having a density within the above range, or may be two or more kinds of low-density polyethylene having different densities.
【００１４】ここでスウェル比とは、正確な定義は後述
するが、溶融ポリマーがノズル（口金）から吐出される
際のふくらみの程度のことで、溶融ポリマーの吐出の際
の流れ易さの指標となる。スウェル比が大きいと、溶融
ポリマーは流れにくく、ノズルからの吐出時のふくらみ
の程度が大きく、スウェル比が小さいと溶融ポリマーは
流れ易く吐出時のふくらみの程度は小さい。したがっ
て、スウェル比が大きいと、溶融ポリマー吐出時にノズ
ル吐出口の縁によって吐出シートの表面が粗れ易く、逆
にスウェル比が小さいと、吐出シートの表面粗れが小さ
く抑えられ、表面が平滑になる。本発明では、このスウ
ェル比を敢えて大きくとることにより、つまり１．５以
上とすることにより、基材層の表面が強制的に粗化され
る。スウェル比を１．５以上にするには、溶融押出温度
をある値以下に低く抑えればよい。実際に何度以下にコ
ントロールするかは、得られる製品フイルムの表面粗さ
に応じて、すなわち、表面粗さが前述の範囲内に入るよ
うに決めればよい。The swell ratio is a degree of swelling when the molten polymer is discharged from a nozzle (cap), which will be described later in detail, and is an index of the ease of flow when the molten polymer is discharged. Becomes If the swell ratio is large, the molten polymer is difficult to flow, and the degree of swelling at the time of discharge from the nozzle is large. If the swell ratio is small, the molten polymer is easy to flow and the degree of swelling at the time of discharge is small. Therefore, when the swell ratio is large, the surface of the discharge sheet is easily roughened by the edge of the nozzle discharge port at the time of discharging the molten polymer. Conversely, when the swell ratio is small, the surface roughness of the discharge sheet is suppressed small, and the surface becomes smooth. Become. In the present invention, the surface of the base material layer is forcibly roughened by intentionally increasing the swell ratio, that is, by setting it to 1.5 or more. In order to make the swell ratio 1.5 or more, the melt extrusion temperature may be suppressed to a certain value or less. How many times the actual control is performed may be determined according to the surface roughness of the obtained product film, that is, the surface roughness may be determined so as to fall within the above-mentioned range.
【００１５】このように、基材層の表面粗さをＲａ０．
０８〜２．００μｍとすることにより、板傷防止効果、
寸法安定性に加え、優れた巻戻し性（耐ブロッキング
性）が得られる。As described above, the surface roughness of the base material layer is Ra0.
When the thickness is in the range of 08 to 2.00 μm, the effect of preventing plate scratches,
In addition to dimensional stability, excellent rewindability (blocking resistance) is obtained.
【００１６】巻戻し性をより向上するためには、基材層
に無機粒子を含有させることが有効である。無機粒子含
有により、基材層表面に突起が形成され、その分表面粗
さが大きくなって、耐ブロッキング性が向上する。また
無機粒子含有により、表面素地が補強されるので、表面
が削られにくくなり、白粉（削り取られた粉）発生も抑
制される。ただし含有量が多くなりすぎると、逆に表面
が脆くなるおそれがあるので、含有量は５．０重量％以
下とすることが好ましく、含有量が少なすぎると突起形
成効果が薄れるので、含有量は０．１重量％以上とする
ことが好ましい。また、粒径が大きすぎると、突起が高
くなりすぎ、積層される粘着層の表面粗度を悪化させる
ので好ましくない。粘着層としては、良好な密着性を得
るために、その表面は極力平滑な方が好ましい。したが
って、添加される無機粒子の平均粒径は２０μｍ以下と
されることが好ましい。平均粒径の下限値は、突起形成
効果から、０．３μｍ以上とすることが好ましい。In order to further improve the rewinding property, it is effective to include inorganic particles in the base material layer. Due to the inclusion of the inorganic particles, projections are formed on the surface of the base material layer, the surface roughness is increased by that amount, and the blocking resistance is improved. In addition, since the surface substrate is reinforced by the inclusion of the inorganic particles, the surface is hardly shaved, and the generation of white powder (shaved powder) is suppressed. However, if the content is too large, the surface may be brittle. Conversely, the content is preferably set to 5.0% by weight or less. If the content is too small, the effect of forming projections is weakened. Is preferably 0.1% by weight or more. On the other hand, if the particle size is too large, the projections become too high, and the surface roughness of the adhesive layer to be laminated is undesirably deteriorated. The surface of the adhesive layer is preferably as smooth as possible to obtain good adhesion. Therefore, it is preferable that the average particle diameter of the added inorganic particles be 20 μm or less. The lower limit of the average particle diameter is preferably 0.3 μm or more from the viewpoint of the projection formation effect.
【００１７】また、添加される粒子は無機粒子が好まし
いが、基材層を構成するポリマーの融点に比べてその融
点ないし昇華点が格段に低くなければ有機粒子でもよ
い。しかし、融点ないし昇華点が数十℃程度の有機粒子
の添加は、経時変化を起こし易く、かつ、粘着層への転
写による粘着力の低下を招くおそれがあるので好ましく
ない。The particles to be added are preferably inorganic particles, but may be organic particles as long as the melting point or the sublimation point is not much lower than the melting point of the polymer constituting the base material layer. However, the addition of organic particles having a melting point or a sublimation point of about several tens of degrees Celsius is not preferable because it tends to cause a change with time and may cause a decrease in adhesive strength due to transfer to the adhesive layer.
【００１８】なお、本発明の表面保護フイルムでは、基
材層の表面粗さを中心線平均粗さＲａで０．０８ないし
２．００μｍに特定したが、最大粗さＲｔでは、０．４
ないし５．０μｍの範囲とするのが好ましい。In the surface protective film of the present invention, the surface roughness of the base material layer is specified to be 0.08 to 2.00 μm in terms of the center line average roughness Ra, but the maximum roughness Rt is to be 0.48 to 2.00 μm.
To 5.0 μm.
【００１９】本発明の表面保護フイルムにおいては、粘
着層と基材層との積層方法は特に限定しないが、上述の
スウェル比を達成するために、さらには良好な製膜性を
得るために共押出によることが望ましい。積層は、ノズ
ル（口金）内で行っても、上流側のポリマー管やフィル
ター装置で行ってもよい。In the surface protective film of the present invention, the method of laminating the pressure-sensitive adhesive layer and the base material layer is not particularly limited. However, in order to achieve the above-mentioned swell ratio, and further to obtain good film-forming properties, Desirably by extrusion. The lamination may be performed in a nozzle (cap) or in an upstream polymer tube or a filter device.
【００２０】また、基材層を構成する低密度ポリエチレ
ンの粘度は、特に限定しないが、メルトインデックスに
て１ないし１５の範囲内にあることが好ましい。The viscosity of the low-density polyethylene constituting the base material layer is not particularly limited, but is preferably in the range of 1 to 15 in melt index.
【００２１】〔特性の測定方法および効果の評価方法〕
本発明における特性の測定方法および効果の評価方法は
次の通りである。 （１）スウェル比 ノズルから溶融ポリマーを吐出させた時のノズル径に対
する吐出物の径（冷却後に測定）の比をスウェル比と定
義する。後述の実施例、比較例の表においては、これを
ＳＲと略称する。スウェル比の測定は、メルトインデク
サーでメルトインデックスを測定する方法で溶融ポリマ
ーをノズルから吐出させ、冷却固化後の吐出物の径をノ
ギスで測定し、予め判っているノズル径に対する吐出物
の径の比を算出する。[Method of measuring characteristics and method of evaluating effects]
The method for measuring characteristics and the method for evaluating effects in the present invention are as follows. (1) Swell ratio The ratio of the diameter of the discharged material (measured after cooling) to the nozzle diameter when the molten polymer is discharged from the nozzle is defined as the swell ratio. This is abbreviated as SR in the tables of Examples and Comparative Examples described later. The swell ratio is measured by discharging a molten polymer from a nozzle by a method of measuring a melt index with a melt indexer, measuring the diameter of the discharged material after cooling and solidifying with a vernier caliper, and measuring the diameter of the discharged material with respect to a nozzle diameter known in advance. Calculate the ratio of
【００２２】（２）板傷、縮み量、耐ブロッキング性、
弾性率、ヘイズ 板厚２ｍｍの三菱レイヨン製アクリル板（以下ＰＭＭ
Ａ板と呼ぶ。ここでは幅５０ｍｍ、長さ１５０ｍｍに裁
断したもの）に、試料フイルムをゴムロール（３ｋｇ荷
重／５０ｍｍ幅）でごみ、皺の入らないように貼り付け
該フイルムをＰＭＭＡ板と同寸で裁断した後、２３℃の
恒温室に２４時間放置し、以下の熱処理を行う。(2) Sheet flaw, shrinkage, blocking resistance,
Elastic modulus, haze Acrylic board made by Mitsubishi Rayon (hereinafter PMM)
Call it A-plate. Here, the sample film is trashed with a rubber roll (3 kg load / 50 mm width) on a piece cut into a width of 50 mm and a length of 150 mm so as not to be wrinkled. It is left in a constant temperature room at 23 ° C. for 24 hours, and the following heat treatment is performed.
【００２３】試料の熱処理；試料フイルムをＰＭＭＡ
板に貼り付け上記の要領で準備したサンプルを、１６０
℃の熱風オーブン内に無荷重で長さ方向の一端をクリッ
プ止めして吊るして１０分間熱処理して取出し、板傷と
縮み量の評価に使う。Heat treatment of the sample;
A sample prepared by attaching to a plate and preparing
One end in the length direction is clipped and suspended in a hot-air oven at 0 ° C. with no load, heat-treated for 10 minutes, taken out, and used for evaluation of plate flaws and shrinkage.
【００２４】板傷の評価；上記の要領で準備したサ
ンプルにおいて、試料フイルムを剥がして、貼込み面間
に存在した気泡に対応するＰＭＭＡ板表面に発生したク
レータ状の凹み欠点（これを板傷と呼ぶ）の状態を、暗
室内でスポット光を当てて観察する。（判定；◎・・・
板傷無し、○・・・板傷軽度、△・・・板傷少し、×・
・・板傷有り）Evaluation of plate flaws: In the sample prepared in the above manner, the sample film was peeled off, and a crater-shaped dent defect generated on the surface of the PMMA plate corresponding to the air bubbles existing between the pasting surfaces (this is called a plate flaw) ) Is observed in a dark room with a spot light. (Judgment; ◎ ・ ・ ・
No scratch, ○ ・ ・ ・ Mild scratch, △ ・ ・ ・ Slight scratch, × ・
・ ・ Sheet scratches)
【００２５】縮み量の評価；上記の要領で準備した
サンプルにおいて、自由端側の試料フイルムの縮み量を
測定する（単位はｍｍ）。Evaluation of shrinkage: In the sample prepared in the above manner, the shrinkage of the sample film on the free end side is measured (unit: mm).
【００２６】耐ブロッキング性の評価；試料フイルム
２枚を一方の基材層面と他方の粘着層面とを重ね合わせ
３５ｇ／ｃｍ2 の荷重を掛け、温度４０℃、相対湿度８
４％の条件下で２４時間放置した後取出し、引張り試験
機（引張り速度３００ｍｍ／ｍｉｎ）でブロッキング剪
断応力を測定する（単位はｇ／１２ｃｍ2 ）。（判定；
３００以下・・・優◎、３０１〜５００・・・良○、５
０１〜１０００・・・可△、１００１以上・・・不可
×）Evaluation of blocking resistance: Two sample films were superposed on one substrate layer surface and the other adhesive layer surface, a load of 35 g / cm 2 was applied, and the temperature was 40 ° C. and the relative humidity was 8
After leaving it for 24 hours under the condition of 4%, it is taken out, and the blocking shear stress is measured by a tensile tester (tensile speed: 300 mm / min) (unit: g / 12 cm 2 ). (Judgment;
300 or less: excellent ◎, 301 to 500: good ○, 5
01 to 1000: acceptable, 1001 or more: unavailable x)
【００２７】引張り弾性率の評価；引張り試験機（引
張り速度３０ｍｍ／ｍｉｎ）で、試料フイルムの引張り
弾性率を求める（単位はＫｇ／ｍｍ2 ）。Evaluation of Tensile Modulus: The tensile modulus of the sample film is determined by a tensile tester (tensile speed: 30 mm / min) (unit: Kg / mm 2 ).
【００２８】ヘイズの評価；積分球式ヘイズメーター
で試料フイルム一枚のヘイズを求める（単位は％）。Evaluation of haze: The haze of one sample film is determined with an integrating sphere haze meter (unit is%).
【００２９】[0029]
実施例１〜７、比較例８〜１２ 基材層の材質を低密度ポリエチレン（ＬＤＰＥ１）、ま
たは密度の異なる２種の低密度ポリエチレン（ＬＤＰＥ
１）および低密度ポリエチレン（ＬＤＰＥ２）からなる
ポリエチレンとし、直径４０ｍｍの押出機（設定温度２
００℃）で溶融し、他方、粘着層を直鎖状低密度ポリエ
チレンとして、直径３５ｍｍの押出機（設定温度２４０
℃）で溶融し、同一のＴダイ（設定温度２１０℃）から
共押出しして、厚さ６０μｍのフイルムを得た。なお、
キャスト条件としては、エアナイフで３０℃の冷却ロー
ルに押し付けて成形した。基材層の組成、特性を表１、
表２に示すように各種変更した結果、本発明で特定した
範囲内にあるものは、板傷、縮み量、耐ブロッキング
性、弾性率、ヘイズ、基材表面粗さの全てが実用範囲に
あり、特に板傷防止特性に極めて優れたものが得られ
た。いずれかの条件が本発明の範囲から外れたもの（比
較例８〜１２）は、上記特性のうち少なくとも一つは満
足できなかった。結果を表１および表２に示す。表中に
おいて、略号の意味は次の通りである。 ＬＤＰＥ：低密度ポリエチレン ＨＤ ：高密度ポリエチレン ＬＬ ：直鎖状低密度ポリエチレン ＭＩ ：メルトインデックス ＳＲ ：スウェル比 なお、基材層に添加された「粒子」は、実施例７では、
平均粒径７μｍの炭酸カルシウム粒子を、その他の例で
は、いずれも平均粒径３μｍのＳｉＯ2 粒子を使った。
添加量は、ポリマー全体を１００部としたときの部数と
して示した。また、比較例８および９で用いた高密度ポ
リエチレンは、密度が０．９６１ｇ／ｃｍ3 、メルトイ
ンデックス８．０のものであった。比較例１０で用いた
直鎖状低密度ポリエチレンは、密度が０．９２０ｇ／ｃ
ｍ3 、メルトインデックス２．０のものであった。Examples 1 to 7 and Comparative Examples 8 to 12 The material of the base layer was low-density polyethylene (LDPE1) or two types of low-density polyethylene (LDPE) having different densities.
1) and a low-density polyethylene (LDPE2) polyethylene and a 40 mm diameter extruder (setting temperature 2)
00 ° C.), while the pressure-sensitive adhesive layer was a linear low-density polyethylene, and was extruded with a 35 mm diameter extruder (setting temperature 240 ° C.).
C.) and co-extruded from the same T-die (a set temperature of 210 ° C.) to obtain a film having a thickness of 60 μm. In addition,
As for the casting conditions, molding was performed by pressing against a cooling roll at 30 ° C. with an air knife. Table 1 shows the composition and properties of the substrate layer.
As a result of various changes as shown in Table 2, those within the range specified in the present invention have plate scratches, shrinkage, blocking resistance, elastic modulus, haze, and substrate surface roughness all within the practical range. In particular, those having extremely excellent sheet flaw prevention properties were obtained. When one of the conditions was out of the range of the present invention (Comparative Examples 8 to 12), at least one of the above characteristics was not satisfied. The results are shown in Tables 1 and 2. In the table, the meanings of the abbreviations are as follows. LDPE: low-density polyethylene HD: high-density polyethylene LL: linear low-density polyethylene MI: melt index SR: swell ratio The “particles” added to the base material layer are described in Example 7.
Calcium carbonate particles having an average particle diameter of 7 μm were used, and in other examples, SiO 2 particles having an average particle diameter of 3 μm were used.
The amount of addition was shown as the number of parts when the whole polymer was taken as 100 parts. The high-density polyethylene used in Comparative Examples 8 and 9 had a density of 0.961 g / cm 3 and a melt index of 8.0. The linear low-density polyethylene used in Comparative Example 10 had a density of 0.920 g / c.
m 3 and a melt index of 2.0.
【００３０】[0030]
【表１】 [Table 1]
【００３１】[0031]
【表２】 [Table 2]
【００３２】[0032]
【発明の効果】以上説明したように、本発明の表面保護
フイルムによるときは、基材層を比較的高密度域の低密
度ポリエチレンで構成するとともにその基材層の表面粗
さを比較的大きな特定の範囲としたので、高温加熱加工
時に被保護体としての樹脂板に板傷が発生することを防
止できるとともに、優れた寸法安定性、巻戻し性を同時
に確保することができる。As described above, when the surface protective film of the present invention is used, the base layer is made of low-density polyethylene in a relatively high-density region and the surface roughness of the base layer is relatively large. Since the specific range is set, it is possible to prevent the resin plate as a protected body from being scratched at the time of high-temperature heating processing, and it is possible to simultaneously secure excellent dimensional stability and rewindability.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭55−165974（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B32B 1/00 - 35/00 C09J 7/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-55-165974 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B32B 1/00-35/00 C09J 7 / 02
Claims (3)
ｍ3 の低密度ポリエチレンを主成分とし、表面粗さが中
心線平均粗さＲａにて０．０８ないし２．００μｍのス
エル比１．５以上で溶融押し出しされたフィルムからな
る基材層と、該基材層の片面に積層された粘着層とから
なる表面保護フィルム。1. Density 0.920 to 0.935 g / c
a main component and low-density polyethylene of m 3, to the 0.08 at the center line average roughness Ra surface roughness of 2.00μm scan
From a film extruded at an L ratio of 1.5 or more.
A surface protection film comprising a base layer and a pressure-sensitive adhesive layer laminated on one side of the base layer.
成分とする混合物で構成されているものである請求項１
記載の表面保護フィルム。 2. The method according to claim 1, wherein the base material layer comprises a low-density polyethylene.
2. A composition comprising a mixture as a component.
The surface protective film according to the above.
3 以上０．９３０ｇ／ｃｍ 3 未満の低密度ポリエチレン
と、密度０．９３０ｇ／ｃｍ 3 以上０．９３５ｇ／ｃｍ
3 以下の低密度ポリエチレンとの混合物で構成されてい
るものである請求項１または２記載の表面保護フィル
ム。 3. The method according to claim 1, wherein the base material layer has a density of 0.920 g / cm.
Low density polyethylene of 3 or more and less than 0.930 g / cm 3
And a density of 0.930 g / cm 3 or more and 0.935 g / cm 3
Consists of a mixture with 3 or less low density polyethylene
The surface protective film according to claim 1 or 2, wherein
M
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07323092A JP3193104B2 (en) | 1992-02-25 | 1992-02-25 | Surface protection film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07323092A JP3193104B2 (en) | 1992-02-25 | 1992-02-25 | Surface protection film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05229082A JPH05229082A (en) | 1993-09-07 |
| JP3193104B2 true JP3193104B2 (en) | 2001-07-30 |
Family
ID=13512176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07323092A Expired - Lifetime JP3193104B2 (en) | 1992-02-25 | 1992-02-25 | Surface protection film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3193104B2 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08192501A (en) * | 1995-01-18 | 1996-07-30 | Asahi Chem Ind Co Ltd | Protective film for synthetic resin panel |
| KR100389402B1 (en) * | 2000-10-16 | 2003-06-27 | 주식회사 엘지이아이 | A cover film for vinyl coated metal |
| EP1340215A2 (en) | 2000-11-06 | 2003-09-03 | Elite Display Systems Inc. | Capacitively switched matrixed el display |
| JP2004323621A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Chem Co Ltd | Adhesive material tape |
| JP4941908B2 (en) * | 2006-03-23 | 2012-05-30 | 東レフィルム加工株式会社 | Surface protection film |
| JP5030461B2 (en) * | 2006-04-03 | 2012-09-19 | グンゼ株式会社 | Base film for surface protection tape used for back grinding of semiconductor wafers |
| TW200800584A (en) * | 2006-04-03 | 2008-01-01 | Gunze Kk | Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape |
| KR100776197B1 (en) * | 2006-06-20 | 2007-11-29 | 주식회사 한진피앤씨 | Glass protection film and manufacturing method of the same |
| JP4745927B2 (en) * | 2006-09-08 | 2011-08-10 | 大倉工業株式会社 | Base film for surface protection film |
| JP2008068564A (en) * | 2006-09-15 | 2008-03-27 | Dainippon Ink & Chem Inc | Surface protecting film |
| JP2008080626A (en) * | 2006-09-27 | 2008-04-10 | Toray Advanced Film Co Ltd | Surface protective film |
| JP5005311B2 (en) * | 2006-10-06 | 2012-08-22 | 積水化学工業株式会社 | Adhesive sheet for coating film protection |
| JP2008102271A (en) | 2006-10-18 | 2008-05-01 | Nitto Denko Corp | Surface protective film and optical film with surface protective film |
| JP5007883B2 (en) * | 2007-08-28 | 2012-08-22 | 株式会社スミロン | Body protection film |
| JP2009255525A (en) * | 2007-12-28 | 2009-11-05 | Japan Polypropylene Corp | Surface protective film |
| JP5581015B2 (en) * | 2008-07-15 | 2014-08-27 | 日本ポリプロ株式会社 | Propylene surface protective film |
| JP2009145899A (en) * | 2009-01-19 | 2009-07-02 | Hitachi Maxell Ltd | Near-infrared absorption filter and winding body thereof |
| JP2011216733A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for wafer processing |
-
1992
- 1992-02-25 JP JP07323092A patent/JP3193104B2/en not_active Expired - Lifetime
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|---|---|
| JPH05229082A (en) | 1993-09-07 |
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