JP3192699B2 - Microstrip antenna and method of manufacturing the same - Google Patents
Microstrip antenna and method of manufacturing the sameInfo
- Publication number
- JP3192699B2 JP3192699B2 JP23698591A JP23698591A JP3192699B2 JP 3192699 B2 JP3192699 B2 JP 3192699B2 JP 23698591 A JP23698591 A JP 23698591A JP 23698591 A JP23698591 A JP 23698591A JP 3192699 B2 JP3192699 B2 JP 3192699B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- hole
- ground conductor
- microstrip antenna
- line pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Waveguides (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はマイクロストリップアン
テナ及びその製造方法の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microstrip antenna and an improved method for manufacturing the same.
【０００２】[0002]
【従来技術】航空機や陸上移動車両に搭載し人工衛星を
中継局として通信する通信システムに用いる移動体用ア
ンテナとしては、小型、軽量、薄型等の特徴を有するマ
イクロストリップアンテナが適している。また、上記通
信システムに用いる電波としては偏波追尾の不要な円偏
波が適しており、マイクロストリップアンテナに円偏波
動作させるためには９０°ハイブリッド回路を介し２点
から放射パッチへ給電を行う方法が最も一般的である。2. Description of the Related Art A microstrip antenna having characteristics such as small size, light weight, and thinness is suitable as a mobile antenna used in a communication system mounted on an aircraft or a land mobile vehicle and communicating with an artificial satellite as a relay station. Circularly polarized waves that do not require polarization tracking are suitable as radio waves used in the above communication system. In order to operate a microstrip antenna in circularly polarized waves, power is supplied to radiation patches from two points via a 90 ° hybrid circuit. The most common way is to do it.
【０００３】図３は従来のマイクロストリップアンテナ
の構成を示す断面図であり、第１の誘電体基板１は上下
両面に夫々エッチングによって形成した銅箔等の導体パ
ターンから成る放射パッチ２と第１のアース層３を有
し、第２の誘電体基板５は上下両面に夫々第２のアース
層６と線路パターン７を有する。線路パターン７は例え
ば前記９０°ハイブリッド回路パターンの出力端部であ
る。各誘電体基板１、５には貫通孔１ａ，５ａが夫々厚
さ方向に貫通形成されており、各貫通孔１ａ，５ａが連
通するように両基板１、５を位置決めした上で第１のア
ース導体層３と第２のアース導体層６を導電性接着剤に
て接合した後に各貫通孔１ａ，５ａに給電用ピン８を挿
通しピン８の上下両端部を夫々放射パッチ及び線路パタ
ーン７とハンダ１０によって電気的及び機械的に接続す
る。FIG. 3 is a cross-sectional view showing the structure of a conventional microstrip antenna. A first dielectric substrate 1 has a radiation patch 2 made of a conductor pattern such as a copper foil formed on the upper and lower surfaces by etching, and a first dielectric substrate 1. The second dielectric substrate 5 has a second ground layer 6 and a line pattern 7 on both upper and lower surfaces, respectively. The line pattern 7 is, for example, the output end of the 90 ° hybrid circuit pattern. Through holes 1a and 5a are formed in the respective dielectric substrates 1 and 5 in the thickness direction, respectively. The first and second substrates 1 and 5 are positioned such that the through holes 1a and 5a communicate with each other. After bonding the ground conductor layer 3 and the second ground conductor layer 6 with a conductive adhesive, the power supply pins 8 are inserted into the through holes 1a and 5a, and the upper and lower ends of the pins 8 are respectively radiated patches and line patterns 7. And the solder 10 electrically and mechanically.
【０００４】しかしながら、上記従来構造のマイクロス
トリップアンテナは製造工程が複雑であることに加え
て、航空機に搭載する場合には厳しい環境条件によって
ハンダ部にクラックが発生し易くなり、ハンダ付け作業
に相当の熟練を必要とするという問題がある。また、こ
のことによってコストアップを回避することが困難とな
っていた。However, the microstrip antenna having the conventional structure described above has a complicated manufacturing process, and when mounted on an aircraft, cracks are likely to occur in a solder portion due to severe environmental conditions, which is equivalent to a soldering operation. There is a problem that requires skill. This has made it difficult to avoid cost increases.
【０００５】また、従来構造のマイクロストリップアン
テナをアレーアンテナに適用する場合には製造工数が著
しく増大することが明らかである。It is also apparent that when a microstrip antenna having a conventional structure is applied to an array antenna, the number of manufacturing steps is significantly increased.
【０００６】[0006]
【発明の目的】本発明は、従来２つの誘電体基板を位置
合わせしながら接合した上で給電ピンを挿通してハンダ
接続することによって製造していたマイクロストリップ
アンテナの欠点である製造工程の複雑化、コストアップ
を解消してコスト低減を図ったマイクロストリップアン
テナ及びその製造方法を提供することを目的としてい
る。SUMMARY OF THE INVENTION The present invention has a drawback of a microstrip antenna which has been conventionally manufactured by joining two dielectric substrates while aligning them and then inserting a feed pin and soldering the same. It is an object of the present invention to provide a microstrip antenna in which the cost is reduced by eliminating the increase in cost and cost, and a method for manufacturing the same.
【０００７】[0007]
【発明の概要】上記目的を達成するため請求項１の発明
は、上面に放射パッチを有し下面にアース導体膜を有し
た第１の誘電体基板と、上面にアース導体膜を有し下面
に線路パターンを有した第２の誘電体基板とから成り、
前記各アース導体層同士を互いに接合したマイクロスト
リップアンテナにおいて、前記第１の誘電体基板は、放
射パッチから第１の誘電体基板下面まで貫通する第１の
スルーホールと、該第１のスルーホールの下側開口周縁
に設けた第１のランドとを備え、前記第２の誘電体基板
は、線路パターンから第２の誘電体基板上面まで貫通す
る第２のスルーホールと、該第２のスルーホールの上側
開口周縁に設けた第２のランドとを備え、前記第１の誘
電体基板下面のアース導体層及び第１のスルーホール
を、前記第２の誘電体基板上面のアース導体層及び第２
のスルーホールと夫々整合させて接合した状態で連通状
態にある前記第１及び第２のスルーホール内にハンダが
充填されていることを特徴とする。また、請求項２の発
明は、上面に放射パッチを有し下面にアース導体膜を有
した第１の誘電体基板と、上面にアース導体膜を有し下
面に線路パターンを有した第２の誘電体基板とから成
り、前記夫々のアース導体層同士を互いに接合したマイ
クロストリップアンテナにおいて、前記放射パッチから
第１の誘電体基板下面まで貫通する第１のスルーホール
を形成すると共に、該第１のスルーホールの下側開口周
縁に第１のランドを形成し、前記線路パターンから第２
の誘電体基板上面まで貫通する第２のスルーホールを形
成すると共に、該第２のスルーホールの上側開口周縁に
第２のランドを形成し、前記第１の誘電体基板下面のア
ース導体層及び第１のスルーホールを、前記第２の誘電
体基板上面のアース導体層及び第２のスルーホールと夫
々整合させて接合した状態で連通状態にある前記第１及
び第２のスルーホール内に溶融ハンダを充填してから固
化せしめることを特徴とする。SUMMARY OF THE INVENTION To achieve the above object, a first aspect of the present invention is a first dielectric substrate having a radiation patch on an upper surface and a ground conductor film on a lower surface, and a lower surface having a ground conductor film on an upper surface. And a second dielectric substrate having a line pattern,
In microstrip antenna formed by joining the respective grounding conductor layers to each other to each other, said first dielectric substrate, a first and a through-hole, the first through-hole penetrating from the radiating patch to the first dielectric substrate lower surface A first land provided on the periphery of the lower opening, the second dielectric substrate has a second through hole penetrating from the line pattern to the upper surface of the second dielectric substrate, and the second through hole A second land provided on a peripheral edge of an upper opening of the hole, wherein the ground conductor layer and the first through hole on the lower surface of the first dielectric substrate are connected to the ground conductor layer and the first conductor on the upper surface of the second dielectric substrate. 2
The first and second through holes which are in communication with each other while being aligned with and joined to the through holes are filled with solder. The invention according to claim 2 provides a first dielectric substrate having a radiation patch on the upper surface and a ground conductor film on the lower surface, and a second dielectric substrate having a ground conductor film on the upper surface and a line pattern on the lower surface. In a microstrip antenna comprising a dielectric substrate and joining the respective ground conductor layers to each other, a first through hole penetrating from the radiation patch to the lower surface of the first dielectric substrate is formed, and the first through hole is formed. Forming a first land on the periphery of the lower opening of the through hole;
Forming a second through-hole penetrating to the upper surface of the dielectric substrate, forming a second land around the upper opening of the second through-hole, and a ground conductor layer on the lower surface of the first dielectric substrate; The first through hole is melted into the first and second through holes which are in communication with each other while being aligned and joined to the ground conductor layer and the second through hole on the upper surface of the second dielectric substrate, respectively. It is characterized by solidification after filling with solder.
【０００８】[0008]
【発明の実施例】以下、添付図面に示した実施例に基づ
いて本発明を詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the accompanying drawings.
【０００９】図１及び図２は本発明のマイクロストリッ
プアンテナの製造手順及び完成状態を示す断面図であ
り、上面に放射パッチ２０を有し下面に第１のアース導
体層２１を有した第１の誘電体基板２２に対して、上面
に第２のアース導体層２５を有し下面に中心線路パター
ン２６を有した第２の誘電体基板２７を接合する構成に
おいては上記従来例と変わるところがないが、本発明の
構成は、放射パッチ２０から第１の誘電体基板２２裏面
（アース導体層２１の存在しない領域）まで貫通する貫
通孔２８内壁に薄肉の導体層を蒸着して該貫通孔２８を
第１のスルーホール２９とするとともに第１のスルーホ
ール２９の下側の開口周縁に円形の第１のランド３０を
形成した点と、中心線路パターン２６から第２の誘電体
基板２７上面まで貫通する貫通孔３１を第２のスルーホ
ール３２とするとともに第２のスルーホール３２の上側
の開口周縁に円形の第２のランド３３を形成した点が特
徴的である。FIGS. 1 and 2 are sectional views showing a manufacturing procedure and a completed state of a microstrip antenna according to the present invention. The first embodiment has a radiation patch 20 on an upper surface and a first ground conductor layer 21 on a lower surface. In the structure in which the second dielectric substrate 27 having the second ground conductor layer 25 on the upper surface and the center line pattern 26 on the lower surface is joined to the dielectric substrate 22 described above, there is no difference from the above conventional example. However, according to the configuration of the present invention, a thin conductor layer is deposited on the inner wall of the through hole 28 penetrating from the radiation patch 20 to the back surface of the first dielectric substrate 22 (the area where the ground conductor layer 21 does not exist). Is formed as a first through-hole 29 and a circular first land 30 is formed on the periphery of the lower opening of the first through-hole 29, from the center line pattern 26 to the upper surface of the second dielectric substrate 27. Piercing In that the through-hole 31 to form a second land 33 of the circular upper opening peripheral edge of the second through-hole 32 with a second through hole 32 which is characteristic.
【００１０】更に本発明においては各スルーホール２
９、３２同志が連通する様に位置合わせを行った上で上
記第１の誘電体基板２２下面のアース導体層２１と第２
の誘電体基板２７上面のアース導体層２５とを導電性接
着剤で接合一体化する。この時、各ランド３０、３３同
志も密着状態となっており、この時点で放射パッチ２０
と線路パターン２６とは電気的に導通しているが、図３
に示す様に連通し合ったスルーホール２９、３２内に上
方から溶融ハンダ３５を流し込み固化させることによっ
て強固な接合状態を実現することができる。Further, in the present invention, each through hole 2
After the positions of the conductors 9 and 32 are adjusted so that they communicate with each other, the ground conductor layer 21 on the lower surface of the first dielectric substrate 22 and the second
And the ground conductor layer 25 on the upper surface of the dielectric substrate 27 are joined and integrated with a conductive adhesive. At this time, the lands 30 and 33 are also in close contact with each other.
And the line pattern 26 are electrically conductive, but FIG.
As shown in (1), the molten solder 35 is poured into the through holes 29 and 32 communicating with each other from above, and solidified, thereby realizing a strong bonding state.
【００１１】各ランド３０、３３の形状は必ずしも円形
である必要はなく種々の形状のものを想定することがで
きるが、両ランドをほぼ同じ形状とし接合せしめた際に
密着可能となるようにその肉厚を各アース導体層２１、
２５の肉厚と同等に設定する。The shapes of the lands 30 and 33 are not necessarily circular, and various shapes can be envisaged. However, the lands 30 and 33 have substantially the same shape so that they can be adhered to each other when they are joined. The thickness of each ground conductor layer 21,
The thickness is set to be equal to 25.
【００１２】前記スルーホール２９、３２は、各誘電体
基板２２、２７の両面に導体パターンを蒸着等によって
形成する際に、各基板の所定位置に予め形成しておいた
貫通孔２８、３１内に同時に導体を塗布することによっ
て形成することができるため、製造工程が増大する虞れ
はない。When the conductor patterns are formed on both surfaces of each of the dielectric substrates 22 and 27 by vapor deposition or the like, the through holes 29 and 32 are formed in the through holes 28 and 31 previously formed at predetermined positions of the respective substrates. Can be formed by applying a conductor at the same time, there is no fear that the number of manufacturing steps increases.
【００１３】このように本発明においては連通し合った
スルーホール内に溶融ハンダを流し込み固化させるだけ
で放射パッチと中心線路パターンとの接続が完了するた
め、従来の様にピンを挿通してからハンダ接続を行う必
要がなく、製造工程を簡単化してコストダウンを図ると
ともに、航空機に搭載した場合のように厳しい環境条件
下においてもハンダ接合部が損壊することを防止でき
る。As described above, in the present invention, the connection between the radiating patch and the center line pattern is completed only by pouring and solidifying the molten solder into the communicating through-holes. This eliminates the need for solder connection, simplifies the manufacturing process, reduces costs, and prevents the solder joint from being damaged even under severe environmental conditions such as when mounted on an aircraft.
【００１４】[0014]
【発明の効果】以上のように本発明によれば、従来２つ
の誘電体基板を位置合わせしながら接合した上で給電ピ
ンを挿通してハンダ接続することによって製造していた
マイクロストリップアンテナの欠点である製造工程の複
雑化、コストアップを解消してコスト低減を図ることが
できる。As described above, according to the present invention, the drawbacks of the microstrip antenna conventionally manufactured by joining the two dielectric substrates while aligning them and then inserting the feed pins and soldering them together. It is possible to reduce the cost by complicating the manufacturing process and increasing the cost.
【図１】本発明のマイクロストリップアンテナの製造手
順を示す断面図。FIG. 1 is a sectional view showing a manufacturing procedure of a microstrip antenna according to the present invention.
【図２】図１のマイクロストリップアンテナの完成状態
を示す断面図。FIG. 2 is a sectional view showing a completed state of the microstrip antenna of FIG. 1;
【図３】従来のマイクロストリップアンテナの構成を示
す断面図である。FIG. 3 is a cross-sectional view illustrating a configuration of a conventional microstrip antenna.
２０・・・放射パッチ、２１・・第１のアース導体層、
２２・・・第１の誘電体基板、２５・・・第２のアース
導体層、２６・・・中心線路パターン、２７・・・第２
の誘電体基板、２８・・・貫通孔、２９・・・スルーホ
ール、３０・・・ランド、３１・・・貫通孔、３２・・
・スルーホール、３３・・・円形のランド、３５・・・
溶融ハンダ20 ... radiation patch, 21 ... first ground conductor layer,
22 first dielectric substrate, 25 second ground conductor layer, 26 center line pattern, 27 second
, Through holes, 29 through holes, 30 lands, 31 through holes, 32.
・ Through hole, 33 ・ ・ ・ Circular land, 35 ・ ・ ・
Melting solder
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01Q 13/08 Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01Q 13/08
Claims (2)
体膜を有した第１の誘電体基板と、上面にアース導体膜
を有し下面に線路パターンを有した第２の誘電体基板と
から成り、前記各アース導体層同士を互いに接合したマ
イクロストリップアンテナにおいて、前記第１の誘電体基板は、 放射パッチから第１の誘電体
基板下面まで貫通する第１のスルーホールと、該第１の
スルーホールの下側開口周縁に設けた第１のランドとを
備え、 前記第２の誘電体基板は、 線路パターンから第２の誘電
体基板上面まで貫通する第２のスルーホールと、該第２
のスルーホールの上側開口周縁に設けた第２のランドと
を備え、 前記第１の誘電体基板下面のアース導体層及び第１のス
ルーホールを、前記第２の誘電体基板上面のアース導体
層及び第２のスルーホールと夫々整合させて接合した状
態で連通状態にある前記第１及び第２のスルーホール内
にハンダが充填されている ことを特徴とするマイクロス
トリップアンテナ。A first dielectric substrate having a radiation patch on an upper surface and a ground conductor film on a lower surface; a second dielectric substrate having an earth conductor film on an upper surface and a line pattern on a lower surface; in microstrip antenna comprises, joined the respective grounding conductor layers to each other to each other from the first dielectric substrate, a first through-hole penetrating from the radiating patch to the first dielectric substrate lower surface, said first a first lands provided on the lower side opening edge of the through hole
Wherein the second dielectric substrate, and a second through-hole penetrating from the line pattern to the second dielectric substrate top surface, said second
A second land which is provided in the upper opening edge of the through hole
Wherein the first dielectric substrate lower surface ground conductor layer and the first scan
The through hole is connected to a ground conductor on the upper surface of the second dielectric substrate.
Layer and second through hole aligned and bonded respectively
In the first and second through holes that are in communication with each other
A microstrip antenna characterized by being filled with solder .
体膜を有した第１の誘電体基板と、上面にアース導体膜
を有し下面に線路パターンを有した第２の誘電体基板と
から成り、前記夫々のアース導体層同士を互いに接合し
たマイクロストリップアンテナにおいて、 前記放射パッチから第１の誘電体基板下面まで貫通する
第１のスルーホールを形成すると共に、該第１のスルー
ホールの下側開口周縁に第１のランドを形成し、 前記線路パターンから第２の誘電体基板上面まで貫通す
る第２のスルーホールを形成すると共に、該第２のスル
ーホールの上側開口周縁に第２のランドを形成し、 前記第１の誘電体基板下面のアース導体層及び第１のス
ルーホールを、前記第２の誘電体基板上面のアース導体
層及び第２のスルーホールと夫々整合させて接合した状
態で連通状態にある前記第１及び第２のスルーホール内
に溶融ハンダを充填してから固化せしめることを特徴と
するマイクロストリップアンテナの製造方法。2. A radiation patch on an upper surface and a ground conductor on a lower surface.
A first dielectric substrate having a body film, and a ground conductor film on the top surface
A second dielectric substrate having a line pattern on its lower surface;
And bonding the respective ground conductor layers to each other.
In the microstrip antenna, penetrating from the radiation patch to the lower surface of the first dielectric substrate
A first through hole is formed and the first through hole is formed.
A first land is formed around the lower opening of the hole, and penetrates from the line pattern to the upper surface of the second dielectric substrate.
Forming a second through hole,
Forming a second land on the upper opening periphery of the hole, and connecting the ground conductor layer and the first through hole on the lower surface of the first dielectric substrate to the ground conductor layer and the second conductor on the upper surface of the second dielectric substrate. A method of manufacturing a microstrip antenna, comprising filling molten solder into the first and second through holes which are in communication with each other while being aligned with and joined to the through holes, and then solidifying the molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23698591A JP3192699B2 (en) | 1991-08-23 | 1991-08-23 | Microstrip antenna and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23698591A JP3192699B2 (en) | 1991-08-23 | 1991-08-23 | Microstrip antenna and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0555821A JPH0555821A (en) | 1993-03-05 |
| JP3192699B2 true JP3192699B2 (en) | 2001-07-30 |
Family
ID=17008688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23698591A Expired - Fee Related JP3192699B2 (en) | 1991-08-23 | 1991-08-23 | Microstrip antenna and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3192699B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007055028A1 (en) * | 2005-11-14 | 2007-05-18 | Anritsu Corporation | Rectilinear polarization antenna and radar device using the same |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100286005B1 (en) * | 1997-09-29 | 2001-04-16 | 박태진 | Microstrip dipole antenna array |
| JP3522692B2 (en) * | 1999-04-06 | 2004-04-26 | 三菱電機株式会社 | Balance-unbalance conversion circuit |
| US10038252B2 (en) * | 2014-06-06 | 2018-07-31 | Rockwell Collins, Inc. | Tiling system and method for an array antenna |
| CN109378584B (en) * | 2018-12-04 | 2024-04-16 | 深圳迈睿智能科技有限公司 | Anti-interference antenna and manufacturing method thereof |
| CN113285222B (en) * | 2021-05-21 | 2022-05-17 | 中国电子科技集团公司第二十九研究所 | Multilayer microstrip printed antenna bottom vertical interconnection structure and welding method |
-
1991
- 1991-08-23 JP JP23698591A patent/JP3192699B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007055028A1 (en) * | 2005-11-14 | 2007-05-18 | Anritsu Corporation | Rectilinear polarization antenna and radar device using the same |
| US7623073B2 (en) | 2005-11-14 | 2009-11-24 | Anritsu Corporation | Linearly polarized antenna and radar apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0555821A (en) | 1993-03-05 |
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