JP3192417B2 - Composition for coating chip resistors - Google Patents
Composition for coating chip resistorsInfo
- Publication number
- JP3192417B2 JP3192417B2 JP26716390A JP26716390A JP3192417B2 JP 3192417 B2 JP3192417 B2 JP 3192417B2 JP 26716390 A JP26716390 A JP 26716390A JP 26716390 A JP26716390 A JP 26716390A JP 3192417 B2 JP3192417 B2 JP 3192417B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- composition
- acid resistance
- pbo
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、チップ抵抗器被覆用組成物に関するもので
ある。Description: TECHNICAL FIELD The present invention relates to a composition for coating a chip resistor.
［従来技術とその問題点］ チップ抵抗器は、外部から電気的、化学的、機械的に
保護され必要があり、従来よりこの保護材料としてPbO
−B2O3−SiO2系ガラスが用いられている。[Prior art and its problems] Chip resistors need to be protected from the outside electrically, chemically and mechanically.
-B 2 O 3 -SiO 2 based glass is used.
一般にこの用途のPbO−B2O3−SiO2系ガラスは、軟化
点が700℃以下と低く、低温焼成が可能であるが、抵抗
体の被覆する前後の抵抗値変化率を小さくしたり、エネ
ルギーコストの低減を計るため、より低温で焼成できる
ガラスの開発が望まれている。ところがガラスを低温化
するには、PbOの含有量を増やし、SiO2の含有量を減ら
す必要が生じるため、必然的に耐酸性が低下しやすく、
その結果電極メッキの酸性液によってガラスが変質して
本来の保護機能を果たさなくなるという問題が生じる。Generally PbO-B 2 O 3 -SiO 2 -based glass of this application, the softening point as low as 700 ° C. or less, is susceptible of a low temperature sintered, or reducing the resistance value change rate before and after the coating of the resistor, In order to reduce energy costs, development of a glass that can be fired at a lower temperature has been desired. However, in order to lower the temperature of the glass, it is necessary to increase the content of PbO and reduce the content of SiO 2 , so that the acid resistance inevitably tends to decrease,
As a result, there arises a problem that the glass is deteriorated by the acidic solution of the electrode plating and the original protective function cannot be achieved.
［発明の目的］ 本発明の目的は、低温焼成を可能にするためにガラス
のPbOの含有量を増やしても耐酸性の低下を抑えること
ができるチップ抵抗器被覆用組成物を提供することであ
る。[Object of the Invention] An object of the present invention is to provide a composition for coating a chip resistor, which can suppress a decrease in acid resistance even when the content of PbO in glass is increased in order to enable low-temperature firing. is there.
［発明の構成］ 本発明者は、上記目的を達成するため種々の研究を重
ねた結果、ガラスに対して所定量のTiO2粉末を添加する
ことによって耐酸性を向上することができることを見い
出し、本発明として提案するものである。[Constitution of the Invention] The present inventor has conducted various studies to achieve the above object, and as a result, has found that acid resistance can be improved by adding a predetermined amount of TiO 2 powder to glass. It is proposed as the present invention.
すなわち本発明のチップ抵抗器被覆用組成物は、PbO
を30.0重量％以上含有し、Ｆを含有しないガラス組成物
に対して、TiO2粉末が0.1〜3.5重量％添加されてなるこ
とを特徴とする。That is, the composition for coating a chip resistor of the present invention comprises PbO
TiO 2 powder is added to the glass composition containing 30.0% by weight or more and not containing F, in an amount of 0.1 to 3.5% by weight.
以下に本発明のチップ抵抗器被覆用組成物について詳
細に説明する。Hereinafter, the composition for coating a chip resistor of the present invention will be described in detail.
本発明においてガラス組成物のPbOの含有量を30.0重
量％以上にしたのは、30.0重量％より少ない場合は、ガ
ラスの軟化点が高くなり、低温焼成が困難になりやすい
からである。PbOが30.0重量％より少ないガラスを低温
化しようとすると、B2O3、Na2O、K2O、Li2O等の成分を
多量に含有させれば良いが、一方これらの成分はガラス
の耐酸性を著しく低下させる作用を有しており、このよ
うなガラスにTiO2粉末を添加しても耐酸性を向上すると
いう効果が発揮され難い。In the present invention, the content of PbO in the glass composition is set to 30.0% by weight or more because when the content is less than 30.0% by weight, the softening point of the glass becomes high and low-temperature firing becomes difficult. In order to lower the temperature of glass containing less than 30.0% by weight of PbO, components such as B 2 O 3 , Na 2 O, K 2 O, and Li 2 O may be contained in large amounts. Has the effect of remarkably reducing the acid resistance of the glass, and even if TiO 2 powder is added to such glass, the effect of improving the acid resistance is hardly exhibited.
尚、本発明においては、ガラスにＦが含有されると耐
酸性が低下すると共に環境を汚染するため本質的に含有
しないほうが良い。In the present invention, when F is contained in the glass, the acid resistance is reduced and the environment is polluted.
本発明で用いるPbOを30.0重量％以上含有し、Ｆを含
有しないガラス組成物は、重量％でPbO40.0〜80.0％、B
2O30.5〜20.0％、SiO25.0〜40.0％からなることが好ま
しい。The glass composition containing 30.0% by weight or more of PbO used in the present invention and containing no F contains 40.0 to 80.0% by weight of PbO and B
2 O 3 0.5~20.0%, preferably made of SiO 2 5.0 to 40.0%.
またTiO2粉末の添加量を0.1〜3.5％にしたのは、0.1
％より少ないと上記したTiO2粉末の効果に乏しく、一方
3.5％より多いとガラスの軟化点が上がって低温で焼成
することができなくなるからである。Also, the reason why the addition amount of the TiO 2 powder is set to 0.1 to 3.5% is that
%, The effect of the above TiO 2 powder is poor, while
If it is more than 3.5%, the softening point of the glass increases, and it becomes impossible to fire at a low temperature.
［実施例］ 以下本発明を実施例に基づいてさらに詳細に説明す
る。EXAMPLES Hereinafter, the present invention will be described in more detail based on examples.
次表は、本発明の実施例（試料No.1〜５）及び比較例
（試料No.6〜10）を示すものである。The following table shows Examples (Samples Nos. 1 to 5) and Comparative Examples (Samples Nos. 6 to 10) of the present invention.
表に示した各試料は、以下のように調製した。まず表
に示した酸化物組成になるように原料を調合し、十分に
混合する。各原料は、酸化物、水酸化物、炭酸塩あるい
は硝酸塩の何れでもよいが、微粉砕原料を使用したほう
が溶融しやすい。混合した原料を白金ルボで約1300℃で
溶融した後、水冷ローラーでフィルム状に成型したガラ
スをアルミナボールミルで微粉砕することによってガラ
ス粉末を得、このガラス粉末の軟化点を測定にして表に
示した。 Each sample shown in the table was prepared as follows. First, the raw materials are prepared so as to have the oxide compositions shown in the table, and mixed sufficiently. Each raw material may be any of oxides, hydroxides, carbonates, or nitrates, but melting is easier when finely pulverized raw materials are used. After melting the mixed raw material at about 1300 ° C with a platinum rubo, the glass molded into a film with a water-cooled roller is finely pulverized with an alumina ball mill to obtain a glass powder. Indicated.
さらにこれらのガラス粉末に対して平均粒径が0.5μ
ｍのTiO2粉末を表に示した割合で添加し、両者を均一に
混合することによって各試料を得、これらとα−ターピ
ネオールにエチルセルロースを10％溶解させたビークル
とをスリーロールミルで混練し、ペースト化した。次い
でこのペーストをアルミナ基板上にスクリーン印刷によ
り塗布した後、100〜150℃で乾燥させ、さらに560℃で
焼成し、この焼成物を耐酸性試験に供した。耐酸性の試
験は、25℃の５重量％硫酸水溶液に焼成物を30分間浸漬
し、水洗後ガラス表面を観察して耐酸性を判定した。判
定基準はガラスの表面光沢が初期と殆ど変わらないもの
を優、表面光沢が初期と比べて幾分低下しているものを
良とし、さらにガラスの一部が溶出し、表面に白色の変
質層が生じたり、亀裂や剥離の認められるものを不良と
した。表から明らかなように本発明品である試料No.1〜
５は、いずれも軟化点が553℃以下と低く、且つ良好な
耐酸性を有していたが、一方比較例である試料No.6は、
TiO2粉末が添加されていないため、試料No.10は、ガラ
スにPbF2が添加されているため耐酸性が悪かった。また
試料No.7は、TiO粉末の添加量が7.5％と多いため焼成す
ることができなかった。さらに試料No.8は、PbOの含有
量が25.0％と少ないため軟化点が747℃と高くて焼成す
ることができず、試料No.9は、PbOの含有量が25.0％と
少ないにもかかわらず軟化点が低いが、B2O3を30.0重量
％、Na2Oを10.0重量％と多量に含有するため耐酸性が悪
かった。Furthermore, the average particle size of these glass powders is 0.5μ.
m TiO 2 powder was added at the ratios shown in the table, and the two were uniformly mixed to obtain each sample. These were kneaded with a vehicle having 10% ethyl cellulose dissolved in α-terpineol by a three-roll mill, Pasted. Next, this paste was applied on an alumina substrate by screen printing, dried at 100 to 150 ° C, and fired at 560 ° C, and the fired product was subjected to an acid resistance test. In the acid resistance test, the fired product was immersed in a 5% by weight aqueous sulfuric acid solution at 25 ° C. for 30 minutes, washed with water, and observed on the glass surface to determine the acid resistance. The criterion is excellent if the surface gloss of the glass is almost the same as the initial one, good if the surface gloss is slightly lower than the initial one, and furthermore, part of the glass is eluted and a white deteriorated layer is formed on the surface. Those with cracks or peeling were regarded as defective. As is clear from the table, samples No. 1 to
5 had a softening point as low as 553 ° C. or lower, and had good acid resistance. On the other hand, Sample No. 6, which is a comparative example,
Since no TiO 2 powder was added, Sample No. 10 had poor acid resistance because PbF 2 was added to the glass. Sample No. 7 could not be fired because the added amount of TiO powder was as large as 7.5%. Further, Sample No. 8 has a low PbO content of 25.0% and thus has a high softening point of 747 ° C. and cannot be fired. Sample No. 9 has a low PbO content of 25.0%. not lower the softening point, but a B 2 O 3 30.0 wt%, acid resistance because it contains a large amount and 10.0 wt% of Na 2 O was bad.
［発明の効果］ 以上のように本発明の被覆用組成物は、TiO2粉末が添
加され、且つガラスにＦを含有しないため優れた耐酸性
を有し、PbOの含有量を増やすことによってガラスの低
温化を計っても耐酸性の低下を抑えることが可能であ
り、電極のメッキを伴うチップ抵抗器の保護材料として
好適である。[Effects of the Invention] As described above, the coating composition of the present invention has excellent acid resistance because TiO 2 powder is added and does not contain F in the glass, and the glass content is increased by increasing the content of PbO. It is possible to suppress a decrease in acid resistance even if the temperature is lowered, and it is suitable as a protective material for a chip resistor accompanied by electrode plating.
Claims (1)
を含有しないガラス組成物に対して、TiO2粉末が0.1〜
3.5重量％添加されてなることを特徴とするチップ抵抗
器被覆用組成物。(1) containing at least 30.0% by weight of PbO;
The glass composition containing no, TiO 2 powder is 0.1
A composition for coating a chip resistor, which is added at 3.5% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26716390A JP3192417B2 (en) | 1990-10-03 | 1990-10-03 | Composition for coating chip resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26716390A JP3192417B2 (en) | 1990-10-03 | 1990-10-03 | Composition for coating chip resistors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04144934A JPH04144934A (en) | 1992-05-19 |
| JP3192417B2 true JP3192417B2 (en) | 2001-07-30 |
Family
ID=17440972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26716390A Expired - Fee Related JP3192417B2 (en) | 1990-10-03 | 1990-10-03 | Composition for coating chip resistors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3192417B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3858292B2 (en) * | 1995-11-02 | 2006-12-13 | 日本電気硝子株式会社 | Low expansion crystallized glass decorative composition and decorative low expansion crystallized glass plate |
-
1990
- 1990-10-03 JP JP26716390A patent/JP3192417B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04144934A (en) | 1992-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5159080B2 (en) | Overcoat glass paste and thick film resistance element | |
| KR920004210B1 (en) | Dielectric composition | |
| JPS6035405A (en) | Copper conductor composition | |
| JPH0764588B2 (en) | Glass composition for coating | |
| US4060663A (en) | Electrical resistor glaze composition and resistor | |
| US4175061A (en) | Method of manufacturing resistor paste | |
| GB2038104A (en) | Resistor material resistor made therefrom and method of making the same | |
| US4340508A (en) | Resistance material, resistor and method of making the same | |
| US3560410A (en) | Resistor compositions containing pyrochlore-related oxides and cadmium oxide | |
| US3927238A (en) | Lead-free glaze for high density alumina | |
| US4293838A (en) | Resistance material, resistor and method of making the same | |
| US4139832A (en) | Glass-coated thick film resistor | |
| JP3192417B2 (en) | Composition for coating chip resistors | |
| JP2011079718A (en) | Bismuth-based non-lead glass and composite material | |
| US4536329A (en) | Borosilicate glass compositions | |
| JP2005209744A (en) | Thick film resistor paste, thick film resistor, electronic component | |
| JPS626284B2 (en) | ||
| JP2007227114A (en) | Resistor paste and thick membrane resistor using it | |
| JPH06247742A (en) | Electronic parts | |
| JP2003267750A (en) | Glass composition for coating resistive element | |
| JPH03134905A (en) | Copper paste | |
| JPH03126639A (en) | Glass composition for coating | |
| JP2931450B2 (en) | Conductor paste | |
| JPS63245809A (en) | Finely crushed particle and thick film electronic material composition | |
| JP2002087843A (en) | Low melting point glass |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090525 Year of fee payment: 8 |
|
| LAPS | Cancellation because of no payment of annual fees |