JP3191383B2 - Printing plate manufacturing method - Google Patents
Printing plate manufacturing methodInfo
- Publication number
- JP3191383B2 JP3191383B2 JP4369092A JP4369092A JP3191383B2 JP 3191383 B2 JP3191383 B2 JP 3191383B2 JP 4369092 A JP4369092 A JP 4369092A JP 4369092 A JP4369092 A JP 4369092A JP 3191383 B2 JP3191383 B2 JP 3191383B2
- Authority
- JP
- Japan
- Prior art keywords
- printing plate
- resist
- pattern
- exposure
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷版の製造方法に関
し、特にプリント配線板、各種電気素子等の印刷製造に
使用するための、精密印刷に好適な印刷版の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printing plate, and more particularly to a method for manufacturing a printing plate suitable for precision printing for use in printing and manufacturing printed wiring boards and various electric elements.
【０００２】[0002]
【従来の技術】近年、各種電気素子等の製造において従
来のフォトリソグラフィー法よりも安価かつ高能率な製
造方法として印刷法の導入の要望が強まっている。かか
る分野の印刷に用いる印刷版としてはこれまでは従来広
く用いられて来た感光性樹脂法、腐食法等により製造し
たものを用いて来たが、上記分野におけるパターンの微
細化や寸法精度の向上等の要求が高まるにつれて、前記
した方法では解像力の限界のためその様な要求を満たす
ことが困難になっている。2. Description of the Related Art In recent years, there has been an increasing demand for the introduction of a printing method as a manufacturing method that is cheaper and more efficient than conventional photolithography methods in the manufacture of various electric elements and the like. As a printing plate used for printing in such a field, a photosensitive resin method which has been widely used in the past, and a printing plate manufactured by a corrosion method and the like have been used. As the demands for improvement and the like increase, it becomes difficult to satisfy such demands in the above-mentioned method due to the limitation of the resolving power.
【０００３】かかる問題点を解決すべき高精度の印刷版
の製造方法のひとつとして、金属等の導電性基板上にフ
ォトリソグラフィー法によりレジストパターンを形成
し、その基板表面露出部にレジスト膜厚以下の膜厚に金
属めっきを施し、しかる後に前記レジストを除去する方
法が知られている。As one method of manufacturing a high-precision printing plate for solving such a problem, a resist pattern is formed on a conductive substrate such as a metal by a photolithography method, and a resist film having a thickness less than the thickness of the resist is formed on an exposed portion of the substrate surface. A method is known in which a metal plating is applied to the film thickness of the above, and then the resist is removed.
【０００４】[0004]
【発明が解決しようとする課題】上記方法においてフォ
トリソグラフィー法とは具体的には、基板上にレジスト
を均一に塗布し、これにフォトマスクで紫外線等により
密着露光した後現像するというものである。Specifically, the photolithography method in the above method is to apply a resist uniformly on a substrate, and to subject the resist to close contact exposure with a photomask using an ultraviolet ray or the like, followed by development. .
【０００５】しかしながらこの方法では、密着露光の場
合でも基板とレジストとの界面が、フォトマスク表面か
ら少なくともレジストの膜厚の分だけ離れている。従っ
て、光の吸収や散乱のため上記界面に達する光の強度は
弱まっている。そのため、レジストの膜厚と比較して小
面積の露光部分では上記界面付近は露光不足気味となる
ことから、ポジ型であれば当該部分のレジストが現像時
に抜け切らず、またネガ型であれば当該部分のレジスト
が溶失してパターン欠損が生じるという問題点があっ
た。However, in this method, even in the case of close contact exposure, the interface between the substrate and the resist is separated from the photomask surface by at least the thickness of the resist. Therefore, the intensity of light reaching the interface is reduced due to light absorption and scattering. Therefore, in the exposed portion having a small area as compared with the resist film thickness, the vicinity of the interface is likely to be underexposed, so that the resist of the portion does not come off during development if it is a positive type, and if it is a negative type, There has been a problem that the resist in that portion is melted to cause a pattern defect.
【０００６】本発明は上記した問題点に鑑みてなされた
ものであって、微細な画線パターンを欠損することなく
高精度の印刷版を製造する方法を提供しようとするもの
である。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a method of manufacturing a printing plate with high precision without losing a fine image pattern.
【０００７】[0007]
【課題を解決するための手段】本発明の印刷版の製造方
法は、少なくとも凸部を所望する表面が導電性で、裏面
から露光時に表面へパターン転写露光可能なパターン状
露光線遮蔽手段を備えている印刷版基材に、順に以下
（Ａ）（Ｂ）（Ｃ）（Ｄ）の工程を施すことにより上記
の目的を達しようとするものである。 （Ａ）印刷版基材表面にレジストを設ける工程。 （Ｂ）印刷版基材裏面より露光現像しレジストをパター
ン形成する工程。 （Ｃ）該レジストの除去部分に該レジストパターンの膜
厚以下の厚さにめっきを施す工程。 （Ｄ）該レジストパターンを除去する工程。According to the present invention, there is provided a printing plate manufacturing method comprising a pattern-shaped exposure line shielding means which has at least a surface on which a convex portion is desired to be conductive, and which can transfer and expose a pattern from the back surface to the front surface during exposure. The above object is achieved by sequentially performing the following steps (A), (B), (C) and (D) on the printing plate base material. (A) A step of providing a resist on the printing plate substrate surface. (B) A step of patterning the resist by exposing and developing from the back surface of the printing plate substrate. (C) a step of plating the removed portion of the resist to a thickness equal to or less than the thickness of the resist pattern. (D) removing the resist pattern.
【０００８】レジストとしては、製造する印刷版の要求
仕様により任意のものを適用することができる。そのう
ち、レジストがポジレジストである場合と、ネガレジス
トである場合がある。ポジレジストの場合は、パターン
状露光線遮蔽手段を凸部を所望する表面以外に設け、ネ
ガレジストの場合は、パターン状露光線遮蔽手段を凸部
を所望する表面に設けるという違いがある。但し、ネガ
レジストを用いる場合には、パターン状露光線遮蔽手段
として導電性の材質を用いるか、または、レジストの現
像後これを除去する操作が必要である。As the resist, any resist can be used according to the required specifications of the printing plate to be manufactured. The resist may be a positive resist or a negative resist. In the case of a positive resist, there is a difference in that the pattern-like exposure line shielding means is provided on a surface other than the surface where the projection is desired, and in the case of the negative resist, the pattern-like exposure line shielding means is provided on the surface where the projection is desired. However, when a negative resist is used, it is necessary to use a conductive material as the pattern-shaped exposure line shielding means, or to remove the resist after developing the resist.
【０００９】露光線も、紫外線やＸ線その他の放射線が
考えられる。露光線の違いによりパターン状露光線遮蔽
手段となる材料、レジスト等が違う。[0009] Exposure rays may be ultraviolet rays, X-rays or other radiation. The material, resist, and the like that are used as the pattern-like exposure line blocking means differ depending on the difference in the exposure line.
【００１０】パターン状露光線遮蔽手段も、表面自体を
遮蔽膜としても、表面の上に遮蔽膜を設けても可能であ
る。また、遮蔽膜として印刷版基材と別個に設けず、印
刷版基材表面を化学もしくは物理処理により遮蔽化処理
したものでもよい。このうち表面の上に遮蔽膜を設けた
場合、表面が露光線透過性の導電膜である構成が採り得
る。要するに、パターン状露光線遮蔽手段は、裏面露光
によるレジストの露光が正確にできる位置関係にあるこ
とが肝要であり、表面近傍にあれば十分である。このた
め、直接レジストに接しなくとも、透明導電膜等を介し
てレジストと接していても、本発明の目的を達成し得
る。[0010] The pattern-shaped exposure line shielding means can be realized by using the surface itself as a shielding film or providing a shielding film on the surface. Also, the surface of the printing plate substrate may be subjected to a shielding treatment by chemical or physical treatment without being provided separately from the printing plate substrate as a shielding film. When a shielding film is provided on the surface, a configuration in which the surface is a conductive film that transmits light for exposure can be adopted. In short, it is important that the pattern-shaped exposure line shielding means has a positional relationship that allows accurate exposure of the resist by backside exposure, and it is sufficient if it is near the surface. For this reason, the object of the present invention can be achieved without directly contacting the resist or even in contact with the resist via a transparent conductive film or the like.
【００１１】印刷版基材については、印刷版基材自体が
導電性でなくとも、表面に導電膜が設けられていればよ
く、さらに平面的に印刷版基材を見れば、もし電気的に
給電不可能な閉じたパターンが存在しなければ、版とな
る部分だけ導電性であっても十分である。Regarding the printing plate substrate, even if the printing plate substrate itself is not conductive, it is sufficient that a conductive film is provided on the surface. If there is no closed pattern that cannot be supplied with electricity, it is sufficient that only the portion serving as the plate is conductive.
【００１２】印刷版基材表面の導電性を導電膜により実
現した場合、例えばネサ膜、ＩＴＯ膜等が適用でき、塗
布法またはスパッタ蒸着法等により形成される。When the conductivity of the printing plate base material surface is realized by a conductive film, for example, a Nesa film, an ITO film or the like can be applied, and is formed by a coating method or a sputter deposition method.
【００１３】パターン状露光線遮蔽手段を遮光薄膜パタ
ーンにより実現した場合の材質は、露光線が紫外線であ
る場合には、黒色レジスト等の有機物であっても良いが
通例アルミニウム、銀、ニッケル、クロム等の金属が好
ましい。露光線がＸ線である場合には、鉛、白金、タン
タル、タングステン等の重金属を少なくとも含有する材
質が良い。パターニング方法としてはフォトエッチング
法、リフトオフ法、マスク蒸着法、転写法など従来公知
の任意の方法が適用可能である。その膜厚は後に塗布す
るレジストの塗布ムラの防止のため概ね１μｍ以下が好
ましく、金属の場合通例５０〜２００ｎｍ程度が好適で
ある。When the patterned exposure line shielding means is realized by a light-shielding thin film pattern, the material may be an organic substance such as a black resist when the exposure line is ultraviolet rays, but usually aluminum, silver, nickel, chromium. Are preferred. When the exposure line is an X-ray, a material containing at least a heavy metal such as lead, platinum, tantalum, and tungsten is preferable. As the patterning method, any conventionally known method such as a photoetching method, a lift-off method, a mask evaporation method, and a transfer method can be applied. The film thickness is preferably about 1 μm or less to prevent coating unevenness of a resist to be applied later, and in the case of metal, it is usually about 50 to 200 nm.
【００１４】なお、上述の導電膜と遮光薄膜パターンの
積層順序はどちらが印刷版基材側であっても良く、印刷
版基材自体が導電性であれば導電膜はなくてもよい。但
し印刷版基材及び導電膜はすくなくとも露光線に対して
レジストを感光させるに十分な透過性を有する必要があ
る。The order of lamination of the conductive film and the light-shielding thin film pattern may be either on the printing plate base material side or may be omitted if the printing plate base material itself is conductive. However, the printing plate base material and the conductive film need to have at least sufficient transparency to expose the resist to exposure light.
【００１５】レジストを設ける手段としてはスピンコー
ト法、ロールコート法、スプレーコート法、ディップコ
ート法等が適用可能である。As a means for providing a resist, a spin coating method, a roll coating method, a spray coating method, a dip coating method, or the like can be applied.
【００１６】なお、露光工程につき、裏面露光なので真
空密着や見当合わせ等の操作は一切不用である。ただ
し、露光に用いる光は、平行光かそれに近い光であるこ
とが好ましい。In the exposure step, since backside exposure is performed, operations such as vacuum contact and registration are not required at all. However, the light used for exposure is preferably parallel light or light close thereto.
【００１７】パターン状露光線遮光手段は、レジストの
膜厚以下の膜厚の金属層を印刷版基材の表面もしくは表
面上にパターン状に設けることで行う場合が通常であ
る。めっき層の材質は、特に問わないが、金属めっきの
便宜及び印刷版としての適性を考慮すると、銅、ニッケ
ル、クロム、鉄等が好ましく、またその複数種を複合ま
たは積層しても良い。最後にレジストを剥離除去すると
印刷版が得られる。その遮光薄膜パターンは後述の実施
例のように残したまま印刷版の完成品としてもよいが、
必要に応じて遮光薄膜パターンを除去してもよい。The pattern-shaped exposure line light shielding means is generally performed by providing a metal layer having a thickness equal to or less than the thickness of the resist on the surface of the printing plate substrate or in a pattern. Although the material of the plating layer is not particularly limited, copper, nickel, chromium, iron, and the like are preferable in consideration of convenience of metal plating and suitability as a printing plate, and a plurality of kinds thereof may be compounded or laminated. Finally, when the resist is removed, a printing plate is obtained. The light-shielding thin film pattern may be a finished product of a printing plate while being left as in the embodiment described later,
If necessary, the light-shielding thin film pattern may be removed.
【００１８】[0018]
【作用】本発明の印刷版の製造方法によれば、印刷版基
材表面にレジストを塗布したのち基板の裏面から露光し
てレジストのパターニングを行うことにより、印刷版基
材表面とレジストとの界面付近のレジストにも充分な露
光線量を照射する事ができる。According to the method of manufacturing a printing plate of the present invention, a resist is applied to the surface of the printing plate substrate and then exposed from the back surface of the substrate to pattern the resist. A sufficient exposure dose can be applied to the resist near the interface.
【００１９】この結果、ポジ型レジストにおいては溶解
性不足によるパターン欠損を防止できる現象がある。こ
れにより原版に忠実な印刷版を製造することができる。As a result, there is a phenomenon in the positive resist that pattern loss due to insufficient solubility can be prevented. Thereby, a printing plate faithful to the original plate can be manufactured.
【００２０】また、ネガ型レジストにおいては硬化不足
によるパターン欠損を防止できる現象がある。これによ
り原版に忠実な印刷版を製造することができる。In the case of a negative resist, there is a phenomenon that pattern loss due to insufficient curing can be prevented. Thereby, a printing plate faithful to the original plate can be manufactured.
【００２１】なお、レジストが露光されない部分は、ポ
ジ型レジストにおいては非溶解性であり、パターンが現
像後も残る。ネガ型レジストにおいては硬化せず、現像
時に洗い流される。The portion where the resist is not exposed is insoluble in the positive resist, and the pattern remains after development. The negative resist does not cure and is washed away during development.
【００２２】露光線が紫外線である場合は、露光線パタ
ーン遮蔽手段は紫外線を不透過にする手段であり、ま
た、レジストは紫外線感応性レジストであるため、露光
時裏面より紫外線を露光すると露光線パターン遮蔽手段
が設けられていない部分の紫外線感応性レジストだけが
光反応を起こし、適切なレジストパターン形成が実行で
きる。When the exposure line is ultraviolet light, the exposure line pattern shielding means is a means for making the ultraviolet light impermeable, and the resist is an ultraviolet-sensitive resist. Only the ultraviolet-sensitive resist in the portion where the pattern shielding means is not provided causes a photoreaction, and an appropriate resist pattern can be formed.
【００２３】露光線がＸ線である場合は、露光線パター
ン遮蔽手段はＸ線を不透過にする手段であり、また、レ
ジストはＸ線感応性レジストであるため、露光時裏面よ
りＸ線を露光すると露光線パターン遮蔽手段が設けられ
ていない部分のＸ線感応性レジストだけが光反応を起こ
し、適切なレジストパターン形成が実行できる。When the exposure line is an X-ray, the exposure line pattern shielding means is a means for making the X-ray opaque, and the resist is an X-ray sensitive resist. Upon exposure, only the X-ray sensitive resist in a portion where the exposure line pattern shielding means is not provided causes a photoreaction, and an appropriate resist pattern can be formed.
【００２４】また、露光線パターン遮蔽手段として遮蔽
膜を用いた場合、遮蔽膜と導電膜とはどちらが上でも実
行できる。When a shielding film is used as the exposure line pattern shielding means, either the shielding film or the conductive film can be used.
【００２５】[0025]
＜実施例＞以下、図面を参照しつつ本発明を詳細に説明
する。図１〜図６は本発明の印刷版の製造方法の一実施
例を工程順に示す断面図である。<Embodiment> Hereinafter, the present invention will be described in detail with reference to the drawings. 1 to 6 are sectional views showing one embodiment of a printing plate manufacturing method of the present invention in the order of steps.
【００２６】表面が平滑に研磨されたガラス製印刷版基
材１表面に、透明性のある膜厚１５０ｎｍのＩＴＯ膜２
を、導電膜としてスパッタ形成した。On a surface of a glass printing plate substrate 1 whose surface is polished smoothly, a transparent ITO film 2 having a thickness of 150 nm
Was formed as a conductive film by sputtering.
【００２７】その上に膜厚２００ｎｍのアルミニウム膜
を蒸着形成し、これにポジ型レジスト（ヘキスト社製Ａ
Ｚ1350）を膜厚１．５μｍに塗布し、マスク露光、専用
現像液（ヘキスト社製ＡＺデベロッパー）にて現像後、
塩酸塩化アンモニウム溶液にて露出したアルミニウム膜
を溶解除去、残存したレジスト膜をアセトンにて溶解除
去する。これにより、パターン状露光遮蔽手段として図
１のようなパターン状アルミ膜３を形成した。An aluminum film having a thickness of 200 nm is formed thereon by evaporation, and a positive resist (A Hoechst A)
Z1350) to a film thickness of 1.5 μm, mask exposure, and development with a dedicated developer (AZ developer manufactured by Hoechst).
The exposed aluminum film is dissolved and removed with an ammonium chloride solution, and the remaining resist film is dissolved and removed with acetone. As a result, a patterned aluminum film 3 as shown in FIG. 1 was formed as a patterned exposure shielding means.
【００２８】次に、ＩＴＯ膜２とパターン状アルミ膜３
とを設けた前記印刷版基材１表面にレジスト４としてポ
ジ型レジスト（ヘキスト社製ＡＺ4903）をスピンコート
法で膜厚２５μｍ塗布した（図２）。Next, the ITO film 2 and the patterned aluminum film 3
A positive resist (AZ4903 manufactured by Hoechst) was applied as a resist 4 on the surface of the printing plate substrate 1 provided with the above by a spin coating method to a film thickness of 25 μm (FIG. 2).
【００２９】しかる後、印刷版基材１の裏面から紫外線
を平行照射して全面露光を行う。（図３）Thereafter, the entire surface of the printing plate substrate 1 is exposed by irradiating the back surface of the printing plate substrate 1 with ultraviolet rays in parallel. (Fig. 3)
【００３０】このレジスト４を専用現像液（ヘキスト社
製ＡＺ400 Ｋデベロッパー）にて現像して、レジストパ
ターンを得た。これに電解めっきを施してレジスト４が
除去された部分にレジスト４の膜厚以下の膜厚のめっき
層５である１５μｍの銅層と５μｍのクロム層を、各々
硫酸銅めっき浴とクロム酸−硫酸浴にて順次設けた（図
５）。最後に苛性ソーダ溶液でレジストを溶解除去して
印刷版６を得た（図６）。この印刷版６の解像力は凸部
で約４μｍ、凹部で約２μｍであった。The resist 4 was developed with a special developing solution (AZ400K developer, Hoechst) to obtain a resist pattern. A 15 μm copper layer and a 5 μm chromium layer, which are plating layers 5 having a thickness equal to or less than the thickness of the resist 4, are applied to a portion where the resist 4 has been removed by electroplating, respectively. They were provided sequentially in a sulfuric acid bath (FIG. 5). Finally, the resist was dissolved and removed with a sodium hydroxide solution to obtain a printing plate 6 (FIG. 6). The resolving power of the printing plate 6 was about 4 μm at the convex portion and about 2 μm at the concave portion.
【００３１】＜比較例＞表面が平滑に研磨された銅板の
表面にポジ型レジスト（ヘキスト社製ＡＺ4903）を膜厚
２５μｍに塗布し、前記実施例で使用したものと同一の
フォトマスクを用いてマスク露光を行い、以下前記実施
例と同一の要領にて印刷版を得た。この印刷版の解像力
は凸部で約８μｍ、凹部で約５μｍであり、それ以下の
寸法のパターンは殆ど欠損した。<Comparative Example> A positive resist (AZ4903 manufactured by Hoechst) was applied to a thickness of 25 μm on the surface of a copper plate whose surface was polished smoothly, and the same photomask as that used in the above example was used. Mask exposure was performed, and a printing plate was obtained in the same manner as in the above example. The resolving power of this printing plate was about 8 μm at the convex part and about 5 μm at the concave part, and the pattern having a size smaller than that was almost lost.
【００３２】[0032]
【発明の効果】以上詳細に説明した様に、本発明の印刷
版の製造方法によれば、微細なパターンにおいても欠損
を生じることがなく、解像力が優れ、原版に忠実な印刷
版を精度良く製造することができる。As described in detail above, according to the printing plate manufacturing method of the present invention, a printing plate which is excellent in resolution and has high resolution and is faithful to the original plate can be produced with high precision even in a fine pattern. Can be manufactured.
【００３３】[0033]
【図１】本発明の一実施例の工程中、レジストを設ける
前の断面図である。FIG. 1 is a cross-sectional view before a resist is provided during a process according to an embodiment of the present invention.
【図２】本発明の一実施例の工程中、レジストを設けた
後の断面図である。FIG. 2 is a cross-sectional view after a resist is provided during a process according to an embodiment of the present invention.
【図３】本発明の一実施例の工程中、露光時の断面図で
ある。FIG. 3 is a cross-sectional view at the time of exposure during a process according to an embodiment of the present invention.
【図４】本発明の一実施例の工程中、現像後の断面図で
ある。FIG. 4 is a cross-sectional view after development during a process according to an embodiment of the present invention.
【図５】本発明の一実施例の工程中、めっき後の断面図
である。FIG. 5 is a cross-sectional view after plating during the steps of one embodiment of the present invention.
【図６】本発明の一実施例の工程完了後の断面図であ
る。FIG. 6 is a cross-sectional view after the process of the embodiment of the present invention is completed.
１…印刷版基材 ２…ＩＴＯ膜 ３…パターン状アルミ膜 ４…レジスト ４１…レジスト露光部 ５…めっき層 ６…印刷版 DESCRIPTION OF SYMBOLS 1 ... Printing plate base material 2 ... ITO film 3 ... Patterned aluminum film 4 ... Resist 41 ... Resist exposure part 5 ... Plating layer 6 ... Printing plate
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B41C 1/00 G03F 7/00 ──────────────────────────────────────────────────続 き Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) B41C 1/00 G03F 7/00
Claims (11)
で、裏面から露光時に表面へパターン転写露光可能なパ
ターン状露光線遮断手段を備えている印刷版基材に、順
に以下（Ａ）（Ｂ）（Ｃ）（Ｄ）の工程を施すことより
なる印刷版の製造方法。 （Ａ）印刷版基材表面にレジストを設ける工程。 （Ｂ）印刷版基材裏面より露光現像しレジストをパター
ン形成する工程。 （Ｃ）該レジストの除去部分に該レジストパターンの膜
厚以下の厚さにめっきを施す工程。 （Ｄ）該レジストパターンを除去する工程。1. A printing plate substrate having a pattern exposure line blocking means having at least a conductive surface having a desired convex portion and capable of transferring and exposing a pattern from the back surface to the front surface during exposure. B) A method for producing a printing plate, comprising the steps of (C) and (D). (A) A step of providing a resist on the printing plate substrate surface. (B) A step of patterning the resist by exposing and developing from the back surface of the printing plate substrate. (C) a step of plating the removed portion of the resist to a thickness equal to or less than the thickness of the resist pattern. (D) removing the resist pattern.
載の印刷版の製造方法。2. The method according to claim 1, wherein the resist is a positive resist.
載の印刷版の製造方法。3. The method according to claim 1, wherein the resist is a negative resist.
遮断手段がパターン状紫外線遮光手段である請求項１か
ら３のいずれか一つに記載の印刷版の製造方法。4. The method according to claim 1, wherein the exposure line is an ultraviolet ray, and the pattern exposure line blocking means is a pattern ultraviolet ray shielding means .
4. The method for producing a printing plate according to any one of 3 .
蔽手段がパターン状Ｘ線遮光手段である請求項１から３
のいずれか一つに記載の印刷版の製造方法。5. The exposure line is an X-ray, claims 1-3 patternwise exposing ray shielding means is a patterned X-ray shielding means
The method for producing a printing plate according to any one of the above.
る請求項１から５のいずれか一つに記載の印刷版の製造
方法。6. The method for producing a printing plate according to claim 1, wherein the pattern exposure line shielding means comprises a shielding film.
のいずれか一つに記載の印刷版の製造方法。7. A printing plate substrate is conductive of claims 1-6
The method for producing a printing plate according to any one of the above.
ら６のいずれか一つに記載の印刷版の製造方法。8. The method according to claim 1, wherein the surface of the printing plate substrate is conductive .
7. The method for producing a printing plate according to any one of 6 .
る請求項８記載の印刷版の製造方法。9. The method for producing a printing plate according to claim 8, wherein the surface of the printing plate base material is a light-transmitting conductive film.
あり、その下にパターン状露光線遮蔽膜が設けられてい
る請求項９記載の印刷版の製造方法。10. The printing plate manufacturing method according to claim 9, wherein the surface of the printing plate base material is an exposure-ray-transmitting conductive film, and a patterned exposure-line shielding film is provided thereunder.
あり、印刷版基材表面上にパターン状露光線遮蔽膜が設
けられている請求項９記載の印刷版の製造方法。11. The method for producing a printing plate according to claim 9, wherein the surface of the printing plate substrate is a light-transmitting conductive film, and a patterned exposure line shielding film is provided on the surface of the printing plate substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369092A JP3191383B2 (en) | 1991-08-22 | 1992-02-28 | Printing plate manufacturing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21107991 | 1991-08-22 | ||
| JP3-211079 | 1991-08-22 | ||
| JP4369092A JP3191383B2 (en) | 1991-08-22 | 1992-02-28 | Printing plate manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05104696A JPH05104696A (en) | 1993-04-27 |
| JP3191383B2 true JP3191383B2 (en) | 2001-07-23 |
Family
ID=26383497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4369092A Expired - Fee Related JP3191383B2 (en) | 1991-08-22 | 1992-02-28 | Printing plate manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3191383B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4591223B2 (en) * | 2005-06-09 | 2010-12-01 | 凸版印刷株式会社 | Versions and how to play them |
| KR102018703B1 (en) * | 2015-05-28 | 2019-09-05 | 주식회사 엘지화학 | Method for manufacturing cliche for offset printing, cliche for offset printing manufactured by method |
-
1992
- 1992-02-28 JP JP4369092A patent/JP3191383B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05104696A (en) | 1993-04-27 |
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