JP3170773B2 - Board assembly equipment - Google Patents
Board assembly equipmentInfo
- Publication number
- JP3170773B2 JP3170773B2 JP10220393A JP10220393A JP3170773B2 JP 3170773 B2 JP3170773 B2 JP 3170773B2 JP 10220393 A JP10220393 A JP 10220393A JP 10220393 A JP10220393 A JP 10220393A JP 3170773 B2 JP3170773 B2 JP 3170773B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealant
- station
- glass substrate
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は基板組立装置に係り、特
に液晶表示パネルのように２枚の基板を極めて接近させ
且つ組立作業中に塵埃を取り込まずに貼り合わすことが
できる基板組立装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate assembling apparatus, and more particularly to a substrate assembling apparatus such as a liquid crystal display panel which can bring two substrates very close together and take in dust without assembling dust during an assembling operation. .
【０００２】[0002]
【従来の技術】従来の液晶表示パネルは透明電極や薄膜
トランジスタアレイを付けた２枚のガラス基板を数μｍ
程度の極めて接近した間隔をもってシール剤で貼り合わ
せ、それによって形成される密閉空間に液晶を封止した
ものである。この液晶表示パネルのシール剤をガラス基
板に設ける手段として、ノズルから基板上に抵抗ペース
トを吐出させつつ基板を移動させることにより所定のパ
ターンを描画させて抵抗パターンを設ける技術を利用す
ることができ、このような従来技術として特開平２−５
２７４２号公報に記載のものがある。また従来の液晶表
示パネルの基板の組立にあたっては、シール剤を設けた
ガラス基板を搬送手段で貼り合わせ作業台に移し、そこ
で手作業で２枚のガラス基板の面方向の位置合わせを行
ってから、スペーサとなる粒子等をシール剤に含ませて
おくことによって数μｍ程度の極めて接近した間隔に２
枚のガラス基板を貼り合わせていた。2. Description of the Related Art A conventional liquid crystal display panel has a structure in which two glass substrates provided with a transparent electrode and a thin film transistor array are several micrometers thick.
The liquid crystal is sealed in a sealed space formed by bonding together with a sealant at a very close interval. As a means for providing a sealant for the liquid crystal display panel on a glass substrate, a technique of drawing a predetermined pattern by moving a substrate while discharging a resistive paste from a nozzle onto the substrate and providing a resistive pattern can be used. Japanese Patent Application Laid-Open No. 2-5 / 1990 discloses such a prior art.
There is one described in Japanese Patent No. 2742. Also, when assembling a substrate of a conventional liquid crystal display panel, a glass substrate provided with a sealant is transferred to a bonding work table by a transport means, and then two glass substrates are manually aligned in the surface direction. In addition, by including particles and the like serving as spacers in the sealant, it is possible to reduce the distance to extremely close intervals of about several micrometers.
Two glass substrates were bonded together.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術の液晶表
示パネルは、微細な透明電極や薄膜トランジスタアレイ
がガラス基板に設けられており、それによって構成され
る画素は極めて小さいものである。したがって組立作業
中にガラス基板上に塵埃が積もって密閉空間に塵埃が取
り込まれると、その塵埃の存在する箇所は画素欠陥とな
り、モノクロ表示パネルでは欠陥部が黒点となり、また
カラー表示パネルでは欠陥部が赤・緑・青のいずれかの
色となって、画面に表示される映像が見にくいものとな
る。この液晶表示パネルのシール剤をガラス基板に設け
る手段として、上記特開平２−５２７４２号公報に記載
のものを利用すると、そこでは基板とノズルが非接触の
状態で抵抗ペーストを吐出させ、基板を移動させて所定
の抵抗パターンを描画させており、ノズルを固定してい
ることによって基板上に塵埃が積りにくいものとなって
いる。しかしながら、ここでは抵抗パターン描画後の基
板の取扱いについては格別言及されていない。また従来
の液晶表示パネルの上記基板の組立にあたっては、シー
ル剤を設けたガラス基板を搬送手段で貼り合わせ作業台
に移し、手作業で２枚のガラス基板の位置合わせを行っ
てから貼り合わせているため、その組立作業中にガラス
基板上に塵埃が積もって、密閉空間に塵埃が取り込まれ
る度合いが非常に高いという問題があった。In the above-mentioned prior art liquid crystal display panel, fine transparent electrodes and a thin film transistor array are provided on a glass substrate, and the pixels formed by the electrodes are extremely small. Therefore, if dust accumulates on the glass substrate during the assembling work and the dust is taken into the enclosed space, the portion where the dust exists becomes a pixel defect, the defective portion becomes a black spot on a monochrome display panel, and the defective portion on a color display panel. Becomes one of the colors red, green, and blue, and the image displayed on the screen becomes difficult to see. As a means for providing a sealant for this liquid crystal display panel on a glass substrate, the one described in Japanese Patent Application Laid-Open No. 2-52742 is used. By moving it, a predetermined resistance pattern is drawn, and since the nozzle is fixed, dust does not easily accumulate on the substrate. However, no special mention is made of the handling of the substrate after drawing the resistance pattern. Also, when assembling the above-mentioned substrate of the conventional liquid crystal display panel, the glass substrate provided with the sealant is transferred to a bonding work table by a transporting means, and the two glass substrates are manually positioned and then bonded. Therefore, there is a problem that dust accumulates on the glass substrate during the assembling work, and the degree of dust being taken into the closed space is extremely high.
【０００４】ここで、シール剤およびスペーサについて
簡単に説明する。Here, the sealant and the spacer will be briefly described.
【０００５】シール剤としては、熱硬化形や紫外線硬化
形の接着性を有する合成樹脂が用いられるが、シール剤
の粘度が低いと、シール剤がガラス基板貼り合わせ時の
加圧力で逃げてしまい、基板間隔が所定の間隔より狭く
なるばかりでなく、予定していない部分までシール剤が
拡がって画面に表示される映像がみにくいものとなる。As the sealant, a thermosetting or ultraviolet-curable synthetic resin having an adhesive property is used. However, if the viscosity of the sealant is low, the sealant escapes due to the pressing force at the time of bonding the glass substrates. In addition, not only the substrate interval becomes narrower than the predetermined interval, but also the sealant spreads to an unplanned portion, so that the image displayed on the screen becomes difficult to see.
【０００６】スペーサは、２枚の基板間隔を規制し、適
当な液晶層の厚さを維持するために必要なもので、液晶
パネルが大きくなればなる程必要性が増加する。また、
表示面積が大きくなればなる程均一な液晶層を確保する
ためにスペーサの全面均一散布が要求される。しかしな
がら、従来スペーサの全面均一散布技術は紹介されてい
ない。[0006] The spacer is necessary to regulate the distance between the two substrates and maintain an appropriate thickness of the liquid crystal layer. The necessity increases as the size of the liquid crystal panel increases. Also,
The larger the display area, the more uniform the liquid crystal layer is required in order to secure a more uniform liquid crystal layer. However, a technique for uniformly distributing spacers over the entire surface has not been introduced.
【０００７】本発明の目的は、上記従来技術の問題点を
解決し、液晶表示パネルのように基板にシール剤，スペ
ーサを設けたのち２枚の基板を極めて接近させて貼り合
わせる組立作業中に塵埃を取り込まずに貼り合わすこと
ができ、かつ、２枚の基板の間隔を所望とする正確な寸
法に保って貼り合わせることができる基板組立装置を提
供することにある。An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a sealant and a spacer to a substrate like a liquid crystal display panel, and then to assemble the two substrates very close to each other during an assembling operation. It is an object of the present invention to provide a board assembling apparatus which can be bonded without taking in dust, and which can be bonded while maintaining an interval between two substrates at a desired accurate dimension.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の基板組立装置は、シール剤描画ステーショ
ンと基板貼り合わせステーションとの間を移動可能なテ
ーブルと、上記シール剤描画ステーションに設けられシ
ール剤を吐出する先端が下方を向いたノズルと、上記テ
ーブル上に設けられ第１の基板を搭載する少なくとも直
交方向に移動可能なステージと、上記ノズルからシール
剤を吐出させつつ上記ステージを直交方向に移動させる
ことにより上記第１の基板にシール剤を所望のパターン
で描画させる手段と、上記シール剤描画ステーションと
基板貼り合わせステーションの間に設けた上記第１の基
板上に描画されたシール剤を仮乾燥ないし高粘度する手
段と、上記テーブルが上記基板貼り合わせステーション
に移動されたときに第２の基板を上記ステージに搭載さ
れた上記第１の基板と平行でその上方になるように支持
する手段と、平行に配置された上記第１と第２の両基板
の対向間隔を狭めることにより両基板をシール剤で貼り
合わせる手段とを備えるようにしたものである。In order to achieve the above object, a substrate assembling apparatus according to the present invention comprises a table movable between a sealing agent drawing station and a substrate bonding station; A nozzle provided with a tip facing downward, which discharges a sealant, a stage provided on the table, on which the first substrate is mounted, and which can be moved in at least an orthogonal direction, and the stage which discharges the sealant from the nozzle. Means for drawing a sealant on the first substrate in a desired pattern by moving the sealant in the orthogonal direction, and a means for drawing on the first substrate provided between the sealant drawing station and the substrate bonding station. Means for temporarily drying or increasing the viscosity of the sealing agent, and when the table is moved to the substrate bonding station. Means for supporting the second substrate so as to be parallel to and above the first substrate mounted on the stage, and narrowing the facing distance between the first and second substrates arranged in parallel And means for bonding both substrates with a sealant.
【０００９】さらに、上記目的を達成するため、本発明
は、上記シール剤描画ステーションと基板貼り合わせス
テーションの間に、上記第１の基板上にスペーサを散布
する手段を設けるものである。Further, in order to achieve the above object, the present invention provides a means for spraying spacers on the first substrate between the sealing agent drawing station and the substrate bonding station.
【００１０】[0010]
【作用】上記基板組立装置は、シール剤描画ステーショ
ンで上記ノズルからシール剤を吐出させつつ上記ステー
ジを直交方向に移動させつつ第１の基板にシール剤パタ
ーンを描画する工程で第１の基板の上部に動くものが存
在しないため第１の基板上に塵埃が落下しないし、また
シール剤描画後に第１の基板がステージごと基板貼り合
わせステーションに移動して第２の基板の下方に配置さ
れるため、別の搬送手段が介在されないことと第１の基
板の上部で動くものが存在しないこととによって第１の
基板の移動する工程でも第１の基板上に塵埃が落下しな
いし、さらに両基板の貼り合わせ工程では上下で平行に
配置された両基板の対向間隔を狭めることにより両基板
が貼り合わされるため両基板の間に動くものが存在しな
いことによって第１の基板上に塵埃が落下しない。この
ように組立作業の如何なる工程でも第１の基板上に塵埃
が落下しないため両基板のシール剤による貼り合わせで
形成される空間内に塵埃が取り込まれることがなく、装
置の構成も簡単にできる。The substrate assembling apparatus draws the sealant pattern on the first substrate while moving the stage in the orthogonal direction while discharging the sealant from the nozzle at the sealant drawing station. Dust does not fall on the first substrate because there is no moving object at the top, and the first substrate moves to the substrate bonding station together with the stage after drawing the sealant and is placed below the second substrate. Therefore, dust does not fall on the first substrate even in the step of moving the first substrate due to the absence of another transporting means and the absence of anything moving above the first substrate. In the bonding step, the distance between the two substrates arranged in parallel in the upper and lower directions is reduced, so that the two substrates are bonded to each other. Dust does not fall on the board. As described above, since dust does not fall on the first substrate in any process of the assembling operation, dust is not taken into a space formed by bonding the two substrates with the sealant, and the configuration of the apparatus can be simplified. .
【００１１】また、シール剤描画ステーションと基板貼
り合わせステーションとの間に仮乾燥手段あるいは高粘
度手段があるので、シール剤は高粘度化して整形される
ので、シール剤形状が基板貼り合わせ時に乱れることは
ない。Further, since there is a provisional drying means or a high viscosity means between the sealant drawing station and the substrate bonding station, the sealant is shaped by increasing the viscosity, so that the shape of the sealant is disturbed at the time of bonding the substrates. Never.
【００１２】なお、シール剤は、例えば熱硬化形シール
剤の場合には熱線や赤外線を照射し、紫外線硬化形シー
ル剤の場合には紫外線を照射して仮乾燥させる。The sealant is, for example, irradiated with heat rays or infrared rays in the case of a thermosetting sealant, and is irradiated with ultraviolet rays in the case of an ultraviolet-curable sealant to be temporarily dried.
【００１３】スペーサとしては、耐熱性，耐薬品性に優
れ、広い温度範囲で弾性体として挙動する眞球形のプラ
スチック微粒子や、無アルカリガラスを紡糸して所望の
長さに切断した繊維状のものがある。眞球状のものは、
その直径が両基板の貼り合わせ間隙に近いものが用いら
れ、繊維状のものの場合は、散布した時に繊維同志が交
差して重なることもあるが、両基板の貼り合せ時に押圧
すると、加圧力が交差部に集中し、繊維が滑って交差が
解けることが多いので、断面直径が基板貼り合わせ間隙
に近いものが用いられる。[0013] As the spacer, a spherical plastic fine particle which is excellent in heat resistance and chemical resistance and behaves as an elastic body in a wide temperature range, or a fibrous material obtained by spinning non-alkali glass into a desired length. There is. The spherical one is
A fiber whose diameter is close to the gap between the two substrates is used.In the case of a fibrous material, the fibers may intersect and overlap when sprayed. Since the fiber is often concentrated at the intersection and the fiber slips to break the intersection, a fiber having a cross-sectional diameter close to the gap between the substrates is used.
【００１４】スペーサの散布は、スペーサをそのまま散
布する乾式や、揮発性液体中にスペーサを撹拌させてお
いて液体と共に散布する湿式がある。There are two types of spraying the spacer: a dry type in which the spacer is sprayed as it is, and a wet type in which the spacer is stirred in a volatile liquid and sprayed together with the liquid.
【００１５】[0015]
【実施例】以下、本発明の一実施例を図１から図３によ
り説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.
【００１６】図１は本発明による基板組立装置の一実施
例を示す液晶表示パネル組立装置のカバーを外した本体
の正面図である。図１において、液晶表示パネル組立装
置１はシール剤描画ステーションＳ１と、基板貼り合わ
せステーションＳ２との２部分から構成され、この両ス
テーションＳ１，Ｓ２は隣接して並べられている。基台
２の上方に支柱２ａで梁持された架台３があり、基台２
の上面には両ステーションＳ１，Ｓ２に亘るレール７を
備えている。このレール７上をステージ移動テーブル４
がステージ駆動モータ６により、図面上で左右に即ち両
ステーションＳ１，Ｓ２間を移動できるようになってい
る。テーブル４上にはＸＹθステージ５およびその上面
で第１のガラス基板１３を真空吸着などにより支持する
下側吸着テーブル８が載置されている。ここでＸＹθス
テージ５について説明するに、第１のガラス基板１３が
水平に搭載されているとすると、第１のガラス基板１３
を水平にＸ軸・Ｙ軸方向に移動させるとともに、第１の
ガラス基板１３を水平に回転すなわちθ軸移動させるも
のであり、もし第１のガラス基板１３がＸＹ方向に正確
に配置されるならばθ軸移動は不要である。FIG. 1 is a front view of a main body of a liquid crystal display panel assembling apparatus with a cover removed, showing an embodiment of a substrate assembling apparatus according to the present invention. In FIG. 1, the liquid crystal display panel assembling apparatus 1 is composed of a sealing agent drawing station S1 and a substrate bonding station S2, and these stations S1 and S2 are arranged adjacent to each other. Above the base 2, there is a gantry 3 supported by beams 2a.
Is provided with a rail 7 extending to both stations S1 and S2. The stage moving table 4 moves on the rail 7
Can be moved left and right on the drawing, that is, between the stations S1 and S2 by the stage drive motor 6. An XYθ stage 5 and a lower suction table 8 that supports the first glass substrate 13 on the upper surface thereof by vacuum suction or the like are placed on the table 4. Here, the XYθ stage 5 will be described. Assuming that the first glass substrate 13 is mounted horizontally,
Is moved horizontally in the X-axis and Y-axis directions, and the first glass substrate 13 is horizontally rotated, that is, moved in the θ-axis. If the first glass substrate 13 is accurately arranged in the XY directions, In this case, the θ-axis movement is unnecessary.
【００１７】上記レール７と対面するシール剤描画ステ
ーションＳ１部の架台３にはＺ軸駆動モータ９によって
上下に移動するＺ軸移動テーブル１０が設けられてい
る。このテーブル１０には光学式非接触変位計１１とノ
ズルを持つシール剤吐出機１２とが取付けられており、
そのノズル先端は下方の第１のガラス基板１３を向いて
いる。一方の上記レール７と対面する基板貼り合わせス
テーションＳ２部の架台３の上部には、さらに支柱２ｂ
で梁持された架台１８に加圧用駆動機構１７が載置さ
れ、その下方に延びたボールねじ１７ａを介して該駆動
機構１７で架台３の下側に設けられた加圧吸着テーブル
１５を上下に移動するようになっている。A Z-axis moving table 10 that is moved up and down by a Z-axis drive motor 9 is provided on the base 3 of the sealant drawing station S1 facing the rail 7. An optical non-contact displacement meter 11 and a sealant discharger 12 having a nozzle are attached to the table 10.
The tip of the nozzle faces the lower first glass substrate 13. On the upper part of the gantry 3 at the substrate bonding station S2 facing one of the rails 7, a support 2b is further provided.
A pressing drive mechanism 17 is placed on a gantry 18 supported by beams, and the pressing mechanism 15 provided below the gantry 3 is moved up and down by the driving mechanism 17 via a ball screw 17a extending downward. To move to.
【００１８】加圧吸着テーブル１５はその下面に第２の
ガラス基板１４を上記第１のガラス基板１３と平行にな
るように真空吸着などにより水平に吊り下げる形に支持
するようになっている。またこのテーブル１５には２箇
所に孔１５ａ，１５ｂが穿けられており、このテーブル
１５に穿けられた孔１５ａ，１５ｂに対応する架台３の
部署にはＣＣＤ内蔵の画像認識用カメラ１６ａ，１６ｂ
が取付けられている。この両カメラ１６ａ，１６ｂは下
方を向いており、従ってカメラ１６ａ，１６ｂはテーブ
ル１５の両孔１５ａ，１５ｂを通して第２のガラス基板
１４などの下部に存在する物体を確認することができ
る。なおこの液晶表示パネル組立装置には上記した各駆
動部の図示していない制御装置が設けられている。On the lower surface of the pressure suction table 15, a second glass substrate 14 is supported horizontally suspended by vacuum suction or the like so as to be parallel to the first glass substrate 13. The table 15 is provided with holes 15a and 15b at two places. The sections of the gantry 3 corresponding to the holes 15a and 15b formed in the table 15 are provided with image recognition cameras 16a and 16b with a built-in CCD.
Is installed. The cameras 16a and 16b are directed downward, so that the cameras 16a and 16b can confirm an object present at the lower portion such as the second glass substrate 14 through the holes 15a and 15b of the table 15. The liquid crystal display panel assembling apparatus is provided with a control unit (not shown) for each of the above-described driving units.
【００１９】図１において、３０はシール剤仮乾燥手
段、４０はスペーサ散布手段で、架台にその下側の吸着
テーブル８上の第１のガラス基板１３に向けて固定され
ている。In FIG. 1, reference numeral 30 denotes a sealant temporary drying means, and reference numeral 40 denotes a spacer dispersing means, which is fixed to a gantry toward the first glass substrate 13 on the suction table 8 therebelow.
【００２０】その具体的構成を図２により説明すると、
シール剤仮乾燥手段３０は、第１のガラス基板１３の幅
方向に伸びた赤外線ランプ３１とフード３２から構成さ
れ、ランプ３１のコード３３は図示していないスイッチ
に接続されている。赤外線ランプ３１はシール剤の種類
に応じて紫外線ランプであっても良い。フード３２は赤
外線の照射範囲を規定する。フード３２の下端は開放さ
れているが、ガラスカバーを配設しても良い。The specific structure will be described with reference to FIG.
The sealant temporary drying means 30 includes an infrared lamp 31 and a hood 32 extending in the width direction of the first glass substrate 13, and a cord 33 of the lamp 31 is connected to a switch (not shown). The infrared lamp 31 may be an ultraviolet lamp depending on the type of the sealant. The hood 32 defines an infrared irradiation range. Although the lower end of the hood 32 is open, a glass cover may be provided.
【００２１】スペーサ散布手段４０は、一例としてプラ
スチック真球スペーサ２８を散布するもので、貯蔵タン
ク４１から配給弁４２を介して配給パイプ４３が基板１
３の幅方向に配設されている。配給パイプ４３には複数
の支パイプ４４があり、支パイプ４４はガラス基板１３
の幅方向に並設されている。支パイプ４４から放出され
るスペーサ２８の落下部にスペーサ受け箱４５が設けら
れている。受け箱４５の幅方向の上縁は波形になってい
る。The spacer spraying means 40 sprays the plastic spherical spacers 28 as an example. The distribution pipe 43 is connected to the substrate 1 from the storage tank 41 via the distribution valve 42.
3 are arranged in the width direction. The distribution pipe 43 has a plurality of support pipes 44, and the support pipes 44 are provided on the glass substrate 13.
Are arranged side by side in the width direction. A spacer receiving box 45 is provided at a falling portion of the spacer 28 discharged from the support pipe 44. The upper edge in the width direction of the receiving box 45 is corrugated.
【００２２】図３は図１の液晶表示パネル組立装置の動
作説明用の概略図である。つぎに図２および図３により
図１の液晶表示パネル組立装置の動作および機能を説明
する。なお図３ではＸＹθステージ５および下側吸着テ
ーブル８を貼り合わせステーションＳ２に移動させた場
合を２点鎖線で示し、その各々に５φ，８φの符号を符
した。FIG. 3 is a schematic diagram for explaining the operation of the liquid crystal display panel assembling apparatus of FIG. Next, the operation and functions of the liquid crystal display panel assembling apparatus of FIG. 1 will be described with reference to FIGS. In FIG. 3, the case where the XYθ stage 5 and the lower suction table 8 are moved to the bonding station S2 is shown by a two-dot chain line, and the symbols of 5φ and 8φ are respectively marked.
【００２３】図３において、初めに貼り合わせステーシ
ョンＳ２にステージ移動テーブル４が基台２上のレール
７上を図１のステージ駆動モータ６により走行される
と、ＸＹθステージ５φ上の下側吸着テーブル８φ上に
アダプタ１４ａを介して第２のガラス基板１４が載置さ
れる。このアダプタ１４ａは第２のガラス基板１４の下
面が下側吸着テーブル８φに接触することを阻止するた
めのもので、第２のガラス基板１４の周縁を支持する額
縁状のものである。ここで両カメラ１６ａ，１６ｂで第
２のガラス基板１４に設けられた図示していない位置合
わせマークを読み取りつつ、第２のガラス基板１４が貼
り合わせステーションＳ２の所定位置に置かれるように
ＸＹθステージ５φを制御する。次いで図１の加圧用駆
動機構１７で加圧吸着テーブル１５を下方に移動させ
て、第２のガラス基板１４を該テーブル１５で水平に吊
り下げる形に吸着支持し、そのまま駆動機構１７で加圧
吸着テーブル１５を介して第２のガラス基板１４を上方
に移動させて待機させ、そしてアダプタ１４ａは除去さ
れる。この動作で塵埃が遊離しても塵埃を避ける必要の
ない第２のガラス基板１４上面に落下するだけで何等の
問題がない。In FIG. 3, when the stage moving table 4 is first moved to the bonding station S2 on the rail 7 on the base 2 by the stage drive motor 6 in FIG. 1, the lower suction table on the XYθ stage 5φ The second glass substrate 14 is placed on 8φ via the adapter 14a. The adapter 14a is for preventing the lower surface of the second glass substrate 14 from coming into contact with the lower suction table 8φ, and has a frame shape for supporting the periphery of the second glass substrate 14. Here, while reading the alignment marks (not shown) provided on the second glass substrate 14 with both cameras 16a and 16b, the XYθ stage is set so that the second glass substrate 14 is placed at a predetermined position of the bonding station S2. 5φ is controlled. Then, the pressure suction table 15 is moved downward by the pressure drive mechanism 17 shown in FIG. 1, and the second glass substrate 14 is sucked and supported by the table 15 so as to be suspended horizontally. The second glass substrate 14 is moved upward through the suction table 15 to stand by, and the adapter 14a is removed. Even if dust is released by this operation, there is no problem simply by falling on the upper surface of the second glass substrate 14 which does not need to avoid the dust.
【００２４】次に下側吸着テーブル８φ上に第１のガラ
ス基板１３を載置し、そして第１のガラス基板１３が貼
り合わせステーションＳ２の所定位置に置かれるように
ＸＹθステージ５φを制御する。ここで第１のガラス基
板１３の位置合わせが終わったら、今度はＸＹθステー
ジ５φをシール剤描画ステーションＳ１に移動させる。
次にシール剤描画ステーションＳ１で、Ｚ軸移動テーブ
ル１０上の光学式非接触変位計１１の出力により図１の
Ｚ軸駆動モータ９を制御して、Ｚ軸移動テーブル１０上
のシール剤吐出機１２のノズル先端と下側吸着テーブル
８上の第１のガラス基板１３上面とのギャップを設定す
る。この動作でギャップ設定のためのシール剤吐出機１
２のノズル移動距離はわずかであり、これによる塵埃の
遊離は殆どない。また塵埃の遊離を極度に嫌う場合に
は、図３中に１点鎖線で示すようにシール剤吐出機１２
のＺ軸移動テーブル１０を含む駆動部を密閉し、その密
閉空間を真空引きすればよい。そしてＸＹθステージ５
を所定の描画パターンに従ってＸＹ方向に移動させつ
つ、シール剤吐出機１２のノズルからシール剤を吐出さ
せて、シール剤の第１のガラス基板１３への塗布を行
う。この描きたいシール剤パターンは図示していない。
また図示していない制御装置で所謂パソコン描画パター
ンを格納記憶させておくことによって、同じ描画パター
ンを何枚もの第１のガラス基板１３への塗布を行うこと
が可能であり、また格納データの変更で各種の描画パタ
ーンを得ることもできる。この動作でシール剤の吐出描
画中に第１のガラス基板１３の上部で動くものが存在し
ないため、第１のガラス基板１３の上面への塵埃の落下
はない。Next, the first glass substrate 13 is placed on the lower suction table 8φ, and the XYθ stage 5φ is controlled so that the first glass substrate 13 is placed at a predetermined position of the bonding station S2. Here, when the alignment of the first glass substrate 13 is completed, the XYθ stage 5φ is moved to the sealant drawing station S1.
Next, at the sealant drawing station S1, the Z-axis drive motor 9 of FIG. 1 is controlled by the output of the optical non-contact displacement meter 11 on the Z-axis move table 10, and the sealant discharging machine on the Z-axis move table 10 is controlled. The gap between the tip of the nozzle 12 and the upper surface of the first glass substrate 13 on the lower suction table 8 is set. With this operation, the sealant discharger 1 for setting the gap is used.
The movement distance of No. 2 nozzle is small, and there is almost no release of dust. When the release of dust is extremely disliked, the sealant discharging device 12 is used as shown by a one-dot chain line in FIG.
The drive unit including the Z-axis moving table 10 may be sealed, and the sealed space may be evacuated. And XYθ stage 5
Is moved in the XY directions according to a predetermined drawing pattern, and the sealant is discharged from the nozzle of the sealant discharger 12 to apply the sealant to the first glass substrate 13. The sealant pattern to be drawn is not shown.
By storing and storing a so-called personal computer drawing pattern by a control device (not shown), it is possible to apply the same drawing pattern to a number of first glass substrates 13 and to change stored data. , Various drawing patterns can be obtained. In this operation, there is no moving object above the first glass substrate 13 during the drawing of the sealant, so that no dust falls on the upper surface of the first glass substrate 13.
【００２５】第１ガラス基板１３が廻送されてくると、
赤外線ランプ３１から赤外線が照射され、ガラス基板１
３上に描画されたシール剤を仮乾燥させて形の乱れを防
ぐ。次に、スペーサ散布手段４０の下に至ると、配給弁
４２が開かれ、配給パイプ４３，各支パイプ４４から受
け箱４５にスペーサ２８が落下される。受け箱４５には
波形上縁４５ａが設けられており、受け箱４５からのス
ペーサの落下個所が支パイプ４４の数より増加されてい
るので、スペーサ２８は基板１３上に波形上縁４５ａよ
り流砂の様にオーバフローして均一に散布される。配給
弁４２を各支パイプ４４に設けておくと、スペーサの受
け箱４５への供給は幅方向で時間差がなくなる。なお、
スペーサは、一例として７μｍの直径を持つプラスチッ
ク微粒子を約１万個１ｃｍ2の割合で散布する。When the first glass substrate 13 is sent around,
Infrared rays are emitted from the infrared lamp 31 and the glass substrate 1
(3) The sealant drawn on the surface is temporarily dried to prevent the shape from being disordered. Next, when reaching below the spacer dispersing means 40, the distribution valve 42 is opened, and the spacer 28 is dropped from the distribution pipe 43 and each support pipe 44 to the receiving box 45. The receiving box 45 is provided with a corrugated upper edge 45a, and the number of places where the spacers fall from the receiving box 45 is larger than the number of the support pipes 44. And it is spread evenly. If the distribution valve 42 is provided in each support pipe 44, the supply of the spacer to the receiving box 45 has no time difference in the width direction. In addition,
As the spacer, for example, approximately 10,000 plastic fine particles having a diameter of 7 μm are sprayed at a rate of 1 cm 2 .
【００２６】ランプ３１のスイッチは、コード３３で基
板１３の上以外の個所に設け、また、配給弁４２は配給
パイプ４３の内部に配設されるので、基板１３上に駆動
部材が無く、シール剤仮乾燥手段３０，スペーサ散布手
段４０が作動しても、基板１３上に塵芥が落下しない。The switch of the lamp 31 is provided at a location other than on the substrate 13 by the cord 33, and the distribution valve 42 is disposed inside the distribution pipe 43. Even if the agent temporary drying means 30 and the spacer spraying means 40 are operated, dust does not fall on the substrate 13.
【００２７】また、図４に示す様に、受け箱４５内に螺
旋状の回転体４６を配設し、受け箱４５の幅方向端に設
けた電動機４６で回転体４６を駆動して、受け箱４５内
でスペーサを移動させ、配給弁４２側の支パイプ４４と
配給パイプ４３の未端側の支パイプ４４から受け箱４５
に供給されるスペーサの時間遅れを補完しても良い。図
５は、受け箱を省略した形のスペーサ散布手段の変形例
を示す。図５において、図４に示したものと同一ないし
相当物には同一符号を付けて説明を省略する。図５に示
す変形例では、配給パイプ４３の支パイプ４４との各連
通孔４３ａにシャッター４９が設けられ、アクチュエー
タ４８で連通孔４３ａをガラス基板１３の廻送に合わせ
て開閉する様にしている。各支パイプ４４の端部４４ａ
は未広形にしてあり、個々の支パイプ４４から散布する
範囲が広域になる様にしてある。As shown in FIG. 4, a helical rotator 46 is provided in a receiving box 45, and the rotator 46 is driven by an electric motor 46 provided at an end in the width direction of the receiving box 45 to receive the rotator 46. The spacer is moved in the box 45, and the receiving box 45 is moved from the supporting pipe 44 on the distribution valve 42 side and the supporting pipe 44 on the end side of the distribution pipe 43.
May be compensated for the time delay of the spacers supplied to the head. FIG. 5 shows a modification of the spacer dispersing means in which the receiving box is omitted. In FIG. 5, the same or corresponding components as those shown in FIG. In the modification shown in FIG. 5, a shutter 49 is provided in each communication hole 43a of the distribution pipe 43 with the supporting pipe 44, and the communication hole 43a is opened and closed by the actuator 48 in accordance with the rotation of the glass substrate 13. . End 44a of each support pipe 44
Are not widened, so that the area to be sprayed from the individual support pipes 44 is widened.
【００２８】図６は受け箱４５の変形例を示している。
受け箱４５は、ガラス基板１３に対して傾斜して配置さ
れ、下端部側の上縁部４５ａが波形になっている。受け
箱４５には、スペーサ２８があふれない程度に供給され
ている。ガラス基板１３が廻送されてくると、受け箱４
５は図示していない震動源より振動が加えられる。する
と、スペーサ２８は自重で受け箱４５内を滑落し、波形
上縁部４５ａ付近のスペーサは押されてオーバフロー
し、ガラス基板１３上に均一に散布される。FIG. 6 shows a modification of the receiving box 45.
The receiving box 45 is arranged to be inclined with respect to the glass substrate 13, and the upper edge 45a on the lower end side has a waveform. The receiving box 45 is supplied to such an extent that the spacer 28 does not overflow. When the glass substrate 13 is sent around, the receiving box 4
In 5, vibration is applied from a vibration source (not shown). Then, the spacer 28 slides down in the receiving box 45 by its own weight, and the spacer near the corrugated upper edge 45 a is pushed and overflows, and is uniformly spread on the glass substrate 13.
【００２９】図５，図６の例は湿式スペーサ散布手段に
も適用することができる。なお、図６の例を湿式スペー
サ散布手段に適用する場合には、受け箱を回動させて波
形上端部４５ａを下降させると、スペーサを含んだ溶液
がオーバーフローする。The examples of FIGS. 5 and 6 can also be applied to a wet spacer spraying means. In the case where the example of FIG. 6 is applied to the wet spacer spraying means, when the receiving box is rotated to lower the upper end 45a of the waveform, the solution containing the spacer overflows.
【００３０】次にＸＹθステージ５は再び貼り合わせス
テーションＳ２に移動されて、初めに第２のガラス基板
１４を抱えた加圧吸着テーブル１５の真下に位置決めさ
れる。この動作でも第１のガラス基板１３はＸＹθステ
ージ５および下側吸着テーブル８ごと第２のガラス基板
１４の下方に配置され、別の搬送手段が介在されないこ
とと、第１のガラス基板１３の上部で動くものが存在し
ないことによって、第１のガラス基板１３の移動に際し
ても第１のガラス基板１３の上面に塵埃が落下しない。
さらに別の搬送手段を必要としないので簡単な装置構成
となっている。Next, the XYθ stage 5 is again moved to the bonding station S2, and is first positioned just below the pressure suction table 15 holding the second glass substrate 14. Also in this operation, the first glass substrate 13 is disposed below the second glass substrate 14 together with the XYθ stage 5 and the lower suction table 8, and no other transporting means is interposed. Because there is no moving object, dust does not fall on the upper surface of the first glass substrate 13 even when the first glass substrate 13 moves.
Since no additional transporting means is required, the configuration is simple.
【００３１】次に両カメラ１６ａ，１６ｂの焦点を第１
のガラス基板１３の図示していない位置合わせマークに
合わせ、両カメラ１６ａ，１６ｂでマークを読み取りな
がらＸＹθステージ５φを駆動制御して、第１のガラス
基板１３と第２のガラス基板１４との凡その位置合わせ
を行う。そして図１の加圧用駆動機構１７で加圧吸着テ
ーブル１５を下方に徐々に移動させて、両カメラ１６
ａ，１６ｂで第２のガラス基板１４の図示していない位
置合わせマークが読み取れるようになったら、ＸＹθス
テージ５φを駆動制御して第１のガラス基板１３と第２
のガラス基板１４との正確な位置合わせを行いつつ、加
圧吸着テーブル１５をさらに徐々に下降させて２枚のガ
ラス基板１３，１４をシール剤で貼り合わせる。Next, the focal points of both cameras 16a and 16b are set to the first position.
The XYθ stage 5φ is drive-controlled while reading the marks with both cameras 16a and 16b in accordance with the alignment marks (not shown) of the glass substrate 13 of FIG. The alignment is performed. Then, the pressure suction table 15 is gradually moved downward by the pressure drive mechanism 17 shown in FIG.
When the alignment marks (not shown) of the second glass substrate 14 can be read at a and 16b, the XYθ stage 5φ is drive-controlled to control the first glass substrate 13 and the second glass substrate 13.
While performing accurate alignment with the glass substrate 14, the pressure suction table 15 is further lowered gradually to bond the two glass substrates 13 and 14 with a sealant.
【００３２】この動作で両ガラス基板１３，１４の貼り
合わせでは、両ガラス基板１３，１４の間に動くものが
存在しないことによって、第１のガラス基板１３の上面
に塵埃が落下しない。In the bonding of the two glass substrates 13 and 14 in this operation, dust does not fall on the upper surface of the first glass substrate 13 because there is no moving object between the two glass substrates 13 and 14.
【００３３】以上のように組立作業の如何なる工程でも
第１のガラス基板１３の上面に塵埃が落下しないため、
両ガラス基板１３，１４のシール剤による貼り合わせで
形成される空間内に塵埃が取り込まれることがない。ま
た以上のシール剤描画工程と、基板貼り合わせ工程と、
そのシール剤描画と基板貼り合わせの両ステーション間
の移動工程とは簡単なシーケンス制御で処理できるの
で、図示していない制御装置により一連の動作をプログ
ラム化してパソコンで制御してもよい。As described above, dust does not fall on the upper surface of the first glass substrate 13 in any process of the assembling operation.
Dust is not taken into the space formed by bonding the two glass substrates 13 and 14 with the sealant. Also, the above sealant drawing step, the substrate bonding step,
Since the moving process between the two stations, that is, drawing of the sealant and bonding of the substrate, can be performed by a simple sequence control, a series of operations may be programmed by a control device (not shown) and controlled by a personal computer.
【００３４】本発明の基板組立装置は以下の態様で実施
できる。The substrate assembling apparatus of the present invention can be implemented in the following modes.
【００３５】第１の態様は、図１のＺ軸移動テーブル１
０に代えてＺ軸移動テーブルをＸＹθステージ５に設
け、シール剤描画ステーションＳ１部の架台３にノズル
を持つシール剤吐出機１２および光学式非接触変位計１
１を直接固定し、該Ｚ軸移動テーブルでシール剤吐出機
１２のノズル先端と下側吸着テーブル８上の第１のガラ
ス基板１３とのギャップを設定するようにしたものであ
る。この態様はシール剤描画ステーションＳ１では下側
吸着テーブル８に載置される第１の基板１３の上方に可
動部が全く存在しないため、第１の基板１３への塵埃の
落下が皆無である。 第２の態様は、図１の基板貼り合
わせステーションＳ２における加圧用駆動機構１７およ
び架台１８を省略し、架台３に第２の基板１４の吸着テ
ーブル１５を直接固定して、Ｚ軸移動テーブルをＸＹθ
ステージ５に設け、該Ｚ軸移動テーブルで第２の基板１
４を上昇させて吸着テーブル１５に吸着固定し、また３
枚の基板１３，１４を貼り合わせるようにしたものであ
る。この態様は基板貼り合わせステーションＳ２では吸
着テーブル１５の上方に可動部が全く存在せず、塵埃の
第１の基板１３への落下が皆無であり、また加圧用駆動
機構１７と架台１８の省略により装置構成が一層簡略化
できる。The first mode is a Z-axis moving table 1 shown in FIG.
0, a Z-axis moving table is provided on the XYθ stage 5, and the sealant discharger 12 and the optical non-contact displacement meter 1 each having a nozzle on the base 3 of the sealant drawing station S1.
1 is directly fixed, and the gap between the tip of the nozzle of the sealant discharger 12 and the first glass substrate 13 on the lower suction table 8 is set by the Z-axis moving table. In this embodiment, since there is no movable portion above the first substrate 13 placed on the lower suction table 8 in the sealant drawing station S1, there is no drop of dust to the first substrate 13. In the second mode, the pressing drive mechanism 17 and the pedestal 18 in the substrate bonding station S2 in FIG. 1 are omitted, and the suction table 15 of the second substrate 14 is directly fixed to the pedestal 3, and the Z-axis moving table is XYθ
The second substrate 1 is provided on the stage 5 and is moved by the Z-axis moving table.
4 is lifted and fixed to the suction table 15 by suction.
The substrates 13 and 14 are bonded together. In this embodiment, there is no movable part above the suction table 15 in the substrate bonding station S2, no dust falls on the first substrate 13, and the pressing drive mechanism 17 and the gantry 18 are omitted. The device configuration can be further simplified.
【００３６】第３の態様は、基板吸着機能をＸＹθステ
ージ５に設けて、下側吸着テーブル８を省略したもので
ある。この態様はステージ移動テーブル４上に乗せられ
る部材が減少して、軽量化によりステージ移動テーブル
４の走行が軽快になる。In the third embodiment, the substrate suction function is provided on the XYθ stage 5, and the lower suction table 8 is omitted. In this mode, the number of members placed on the stage moving table 4 is reduced, and the traveling of the stage moving table 4 becomes lighter due to weight reduction.
【００３７】第４の態様はシール剤仮乾燥手段３０をス
ペーサ散布手段４０の下流側、すなわち基板貼り合わせ
ステーションＳ2側に配置したものである。このような
配置でも、シール剤の仮乾燥は可能である。[0037] The fourth aspect is obtained by placing a sealing agent predrying means 30 downstream of the spacer spraying means 40, i.e. the station S 2 side laminated substrate. Even in such an arrangement, temporary drying of the sealant is possible.
【００３８】[0038]
【発明の効果】以上説明したように、本発明によれば、
液晶表示パネルのように２枚の基板を接近させてシール
剤で貼り合わせる基板組立装置での組立作業中に塵埃を
取り込まずに貼り合わすことができ、かつ、２枚の基板
の間隔を所望とする正確な寸法に保って貼り合わすこと
ができる効果がある。As described above, according to the present invention,
As in a liquid crystal display panel, two substrates can be attached to each other without taking in dust during assembly work with a substrate assembling apparatus in which the two substrates are brought close together and sealed with a sealant. There is an effect that the sheets can be bonded while keeping the exact dimensions.
【図１】本発明による基板組立装置の一実施例を示す液
晶表示パネル組立装置のカバーを外した本体の正面図で
ある。FIG. 1 is a front view of a main body of a liquid crystal display panel assembling apparatus with a cover removed, showing an embodiment of a substrate assembling apparatus according to the present invention.
【図２】図１に示した装置のシール剤仮乾燥手段とスペ
ーサ散布手段の概略構成を示す図である。FIG. 2 is a diagram showing a schematic configuration of a sealant temporary drying unit and a spacer spraying unit of the apparatus shown in FIG. 1;
【図３】図１に示した装置の動作説明用の概略図であ
る。FIG. 3 is a schematic diagram for explaining the operation of the device shown in FIG. 1;
【図４】図２に示したスペーサ散布手段の変形例を示す
図である。FIG. 4 is a view showing a modified example of the spacer dispersing means shown in FIG. 2;
【図５】図２に示したスペーサ散布手段の他の変形例を
示す図である。FIG. 5 is a view showing another modified example of the spacer dispersing means shown in FIG. 2;
【図６】図２に示したスペーサ散布手段のさらに他の変
形例を示す図である。FIG. 6 is a view showing still another modified example of the spacer dispersing means shown in FIG. 2;
【符号の説明】 ４…ステージ移動テーブル、５…ＸＹθステージ、８…
下側吸着テーブル、１０…Ｚ軸移動テーブル、１２…シ
ール剤吐出機、１３…第１のガラス基板、１５…加圧吸
着テーブル、１６ａ，１６ｂ…画像認識用カメラ、２８
…スペーサ、３０…シール剤仮乾燥手段、３１…赤外線
ランプ、４０…スペーサ散布手段、４３…配給パイプ、
４８…アクチュエータ、４９…シャッタ。[Description of Signs] 4 ... Stage moving table, 5 ... XYθ stage, 8 ...
Lower suction table, 10 ... Z-axis moving table, 12 ... Sealant discharger, 13 ... First glass substrate, 15 ... Pressure suction table, 16a, 16b ... Image recognition camera, 28
... spacer, 30 ... sealing agent temporary drying means, 31 ... infrared lamp, 40 ... spacer spraying means, 43 ... distribution pipe,
48 ... actuator, 49 ... shutter.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 石田 茂 茨城県竜ヶ崎市向陽台五丁目２番 日立 テクノエンジニアリング 株式会社 開 発研究所内 (72)発明者 三階 春夫 茨城県竜ヶ崎市向陽台五丁目２番 日立 テクノエンジニアリング 株式会社 開 発研究所内 (72)発明者 近藤 克己 茨城県日立市久慈町4026番地 株式会社 日立製作所 日立研究所内 (56)参考文献 特開 平２−198417（ＪＰ，Ａ) 特開 平４−271320（ＪＰ，Ａ) 特開 平５−154923（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) G02F 1/13 G02F 1/1339 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Shigeru Ishida 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. Techno Engineering Co., Ltd. Development Laboratory (72) Katsumi Kondo 4026 Kuji-cho, Hitachi City, Ibaraki Prefecture Hitachi, Ltd. Hitachi Research Laboratory (56) References JP-A-2-198417 (JP, A) JP-A-4 -271320 (JP, A) JP-A-5-154923 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) G02F 1/13 G02F 1/1339
Claims (3)
わせステーションとの間を移動可能なテーブルと、上記
シール剤描画ステーションに設けられシール剤を吐出す
る先端が下方を向いたノズルと、上記テーブル上に設け
られ第１の基板を搭載する少なくとも直交方向に移動可
能なステージと、上記ノズルからシール剤を吐出させつ
つ上記ステージを直交方向に移動させることにより上記
第１の基板にシール剤を所望のパターンで描画させる手
段と、上記シール剤描画ステーションと基板貼り合わせ
ステーションとの間に設けた第１の基板上に描画された
シール剤を仮乾燥する手段と、上記テーブルが上記基板
貼り合わせステーションに移動されたときに第２の基板
を上記ステージに搭載された上記第１の基板と平行でそ
の上方になるように支持する手段と、平行に配置された
上記第１と第２の両基板の対向間隔を狭めることにより
両基板をシール剤で貼り合わせる手段とを備えたことを
特徴とする基板組立装置。1. A table movable between a sealant drawing station and a substrate bonding station, a nozzle provided at the sealant drawing station, and having a downwardly directed tip for discharging a sealant, A stage on which the first substrate is mounted and movable in at least the orthogonal direction; and a sealant on the first substrate in a desired pattern by moving the stage in the orthogonal direction while discharging the sealant from the nozzle. Means for drawing, a means for temporarily drying the sealant drawn on the first substrate provided between the sealant drawing station and the substrate bonding station, and the table moving to the substrate bonding station. So that the second substrate is parallel to and above the first substrate mounted on the stage. A substrate assembling apparatus comprising: means for supporting; and means for bonding the first and second substrates, which are arranged in parallel, to each other with a sealant by reducing a facing distance between the first and second substrates.
わせステーションとの間を移動可能なテーブルと、上記
シール剤描画ステーションに設けられシール剤を吐出す
る先端が下方を向いたノズルと、上記テーブル上に設け
られ第１の基板を搭載する少なくとも直交方向に移動可
能なステージと、上記ノズルからシール剤を吐出させつ
つ上記ステージを直交方向に移動させることにより上記
第１の基板にシール剤を所望のパターンで描画させる手
段と、上記シール剤描画ステーションと基板貼り合わせ
ステーションとの間に設けた第１の基板上に描画された
シール剤を高粘度化する手段と、上記テーブルが上記基
板貼り合わせステーションに移動されたときに第２の基
板を上記ステージに搭載された上記第１の基板と平行で
その上方になるように支持する手段と、平行に配置され
た上記第１と第２の両基板の対向間隔を狭めることによ
り両基板をシール剤で貼り合わせる手段とを備えたこと
を特徴とする基板組立装置。2. A table movable between a sealant drawing station and a substrate bonding station, a nozzle provided at the sealant drawing station and having a tip for discharging a sealant facing downward, and A stage on which the first substrate is mounted and movable in at least the orthogonal direction; and a sealant on the first substrate in a desired pattern by moving the stage in the orthogonal direction while discharging the sealant from the nozzle. Means for drawing, a means for increasing the viscosity of the sealant drawn on the first substrate provided between the sealant drawing station and the substrate bonding station, and the table is provided for the substrate bonding station. When moved, the second substrate is parallel to and above the first substrate mounted on the stage. And a means for bonding the first and second substrates, which are arranged in parallel, to each other with a sealant by reducing the facing distance between the first and second substrates.
において、上記シール剤描画ステーションと基板を貼り
合わせステーションとの間に、さらに上記第１の基板上
にスペーサを散布する手段を設けたことを特徴とする基
板組立装置。3. The substrate assembling apparatus according to claim 1, further comprising: means for spraying a spacer on the first substrate between the sealing agent drawing station and the substrate bonding station. A substrate assembling apparatus characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10220393A JP3170773B2 (en) | 1993-04-28 | 1993-04-28 | Board assembly equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10220393A JP3170773B2 (en) | 1993-04-28 | 1993-04-28 | Board assembly equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06313870A JPH06313870A (en) | 1994-11-08 |
| JP3170773B2 true JP3170773B2 (en) | 2001-05-28 |
Family
ID=14321113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10220393A Expired - Fee Related JP3170773B2 (en) | 1993-04-28 | 1993-04-28 | Board assembly equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3170773B2 (en) |
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-
1993
- 1993-04-28 JP JP10220393A patent/JP3170773B2/en not_active Expired - Fee Related
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|---|---|
| JPH06313870A (en) | 1994-11-08 |
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