JP3151606U - Heat dissipation structure of communication device housing - Google Patents

Heat dissipation structure of communication device housing Download PDF

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JP3151606U
JP3151606U JP2009001189U JP2009001189U JP3151606U JP 3151606 U JP3151606 U JP 3151606U JP 2009001189 U JP2009001189 U JP 2009001189U JP 2009001189 U JP2009001189 U JP 2009001189U JP 3151606 U JP3151606 U JP 3151606U
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heat
communication device
main body
storage space
radiating
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祖模 黄
祖模 黄
昌謀 黄
昌謀 黄
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奇▲こう▼科技股▲ふん▼有限公司
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Abstract

【課題】良好な放熱効果を備え、伝導効率が向上し、放熱面積が増え、通信信号の品質が安定し、使用寿命が延びる通信機筐体の放熱構造を提供する。 【解決手段】通信機筐体の放熱構造は、納置空間を備えた本体を含む。そのうち、該本体の内部は、少なくとも1つの熱受部211及び少なくとも1つの熱拡散部212に分かれ、第一導熱管ユニット213は前述の納置空間に設置し、該第一導熱管ユニットを該熱受部及び熱拡散部に連接する。該熱受部が吸収した熱を該第一導熱管ユニットからスピーディに該熱拡散部へ伝導して放熱し、本体内部の熱を有効に外に放熱する。【選択図】図2Provided is a heat radiating structure for a communication device casing that has a good heat radiating effect, improves conduction efficiency, increases a heat radiating area, stabilizes the quality of communication signals, and extends the service life. A heat dissipation structure for a communication device casing includes a main body having a storage space. Among them, the inside of the main body is divided into at least one heat receiving portion 211 and at least one heat diffusing portion 212, and the first heat transfer tube unit 213 is installed in the above-described storage space, and the first heat transfer tube unit is connected to the first heat transfer tube unit. It is connected to the heat receiving part and the heat diffusion part. The heat absorbed by the heat receiving portion is quickly conducted from the first heat conducting tube unit to the heat diffusing portion to radiate heat, and the heat inside the main body is effectively radiated to the outside. [Selection] Figure 2

Description

本考案は、通信機筐体に関し、特に導熱管で熱受部上の熱を吸収して熱拡散部へ伝えることにより、迅速に熱を伝導して放熱効果を達成する通信機筐体の放熱構造に係わる。   TECHNICAL FIELD The present invention relates to a communication device case, and in particular, a heat transfer tube absorbs heat from a heat receiving part and transmits it to a heat diffusion part, thereby quickly conducting heat and achieving a heat dissipation effect. Related to the structure.

現在、電子通信設備は、通信機筐体内で稼動するが、これら設備が稼動する時、熱が発生する。通信機筐体は密封された封鎖体で、その材質は一般に金属製で、鋳造の一体成型であるが、現在の鋳造品には限界があり、材質の導熱係数は非常に低い。そのため電子設備で発生した熱が累積して機器筐体の局部に集まり、局部の温度が高くなり放熱されにくくなる。そして電子機器が耐えられる温度を超えた時、これらの電子設備の正常運転と使用寿命に重大な影響を及ぼす。
しかしながら、機器筐体は発熱電子部品から離れた大きなエリア内であるため、その温度は電子設備が接触するエリアから遠いので温度も低い。以上から判るとおり、機器筐体の温度は極めて不均衡で、筐体全体の放熱機能に直接大きく影響する。上述の問題に対して、現在の解決方法は、一般に内部のサイズを大きくするか、もしくは内部材質を改める方法が採用されている。しかし同時に筐体重量が重くなるという問題が発生する。そのため如何にして機器筐体のサイズ及び重量を変えずに放熱機能を高めるかが現在の重要な課題と言える。
Currently, electronic communication facilities operate within a communication device housing, but heat is generated when these facilities operate. The communication device casing is a hermetically sealed body, which is generally made of metal and is integrally formed by casting. However, there is a limit to current cast products, and the heat conductivity coefficient of the material is very low. Therefore, the heat generated in the electronic equipment is accumulated and gathered in the local part of the device casing, and the local temperature becomes high and it is difficult to radiate heat. And when the temperature that can be withstood by electronic equipment is exceeded, it has a serious effect on the normal operation and service life of these electronic equipment.
However, since the device casing is in a large area away from the heat generating electronic components, the temperature is low because the temperature is far from the area where the electronic equipment is in contact. As can be seen from the above, the temperature of the device housing is extremely unbalanced and directly affects the heat dissipation function of the entire housing. In order to solve the above-mentioned problems, a current solution generally adopts a method of increasing the internal size or modifying the internal material. At the same time, however, there is a problem that the weight of the housing becomes heavy. Therefore, it can be said that the current important issue is how to improve the heat dissipation function without changing the size and weight of the device casing.

図1は、公知の通信機筐体構造の分解斜視図である。図1に示すとおり、通信機筐体は一筐体10、一蓋体11、二支持柱12及び実装板13を含む。前述の筐体10は容納空間101及び複数の放熱フィン103を備え、これら放熱フィン103は該筐体10の該容納空間101に相反する表面に設置する。これら支持柱12は、該納置空間101の該筐体10に隣接する一端に設置し、且つそこに相互に実装板13を被せる。前述の蓋体11は実装板13を覆って設置し、蓋体11はちょうど納置空間101内で結合する。   FIG. 1 is an exploded perspective view of a known communication device housing structure. As shown in FIG. 1, the communication device housing includes a housing 10, a lid 11, two support pillars 12, and a mounting plate 13. The above-described housing 10 includes a storage space 101 and a plurality of heat radiation fins 103, and these heat radiation fins 103 are installed on the surface of the housing 10 opposite to the storage space 101. These support pillars 12 are installed at one end of the storage space 101 adjacent to the housing 10 and the mounting plates 13 are covered with each other. The aforementioned lid body 11 is installed so as to cover the mounting board 13, and the lid body 11 is just coupled within the storage space 101.

そのため、通信機筐体内の実装板13が稼動すると、前述の実装板13上の複数の発熱部品131が(例としてチップもしくは中央処理装置(CPU)もしくはその他のIC)演算処理を行う時に非常に高い熱を発生し、更に前述の熱が容納空間101内に堆積してスムーズに熱が発散されない。これは放射式で筐体10へ伝導し、続いて該筐体10上のこれら放熱フィン103を通して外へ拡散して放熱されるだけである。そのため実装板13上の発熱部品131はその他伝導媒体、例として、導熱管もしくは導熱部品・・・等がないため、発熱部品131が発した熱は即座にこれら放熱フィン103へ送られず、通信機筐体内の熱はスムーズに外に拡散されて放熱されないため、発熱部品131が演算処理中にフリーズ現象,もしくは通信信号品質不良を起こしやすく、最悪の場合は発熱部品131を壊し、使用寿命を縮める。   Therefore, when the mounting board 13 in the communication device casing is operated, the plurality of heat generating components 131 on the mounting board 13 (for example, a chip or a central processing unit (CPU) or other IC) is very useful when performing arithmetic processing. High heat is generated, and the above-described heat is accumulated in the storage space 101, so that the heat is not dissipated smoothly. This is conducted radiatively to the housing 10 and then diffused outside through the heat radiation fins 103 on the housing 10 to be dissipated. Therefore, since the heat generating component 131 on the mounting board 13 has no other conductive medium, for example, a heat conducting tube or a heat conducting component, etc., the heat generated by the heat generating component 131 is not immediately sent to the heat radiating fins 103, and communication is performed. The heat inside the machine casing is smoothly diffused outside and is not dissipated, so the heat-generating component 131 is prone to freeze phenomenon or poor communication signal quality during calculation processing. In the worst case, the heat-generating component 131 is destroyed and the service life is shortened. Shrink.

特開2003−209385号公報JP 2003-209385 A

このように従来の通信機筐体の放熱構造は、放熱効果がよくない、依ってフリーズ現象が発生しやすい、更に通信信号の質がよくない、また使用寿命が短く、壊れやすいという問題点があった。   As described above, the heat dissipation structure of the conventional communication device housing has problems that the heat dissipation effect is not good, and therefore, the freeze phenomenon is likely to occur, the quality of the communication signal is not good, the service life is short, and the device is easily broken. there were.

そのため、上述の公知の問題と欠点を以下にして解決するかを、本考案の考案者と業界関連メーカーでは研究を重ねてきた。
本考案の解決しようとする課題は、良好な放熱効果を備え、伝導効率が向上し、放熱面積が増え、通信信号の品質が安定し、使用寿命が延びる通信機筐体の放熱構造を提供することにある。
For this reason, the inventor of the present invention and industry-related manufacturers have repeatedly studied whether the above-mentioned known problems and disadvantages are solved as follows.
The problem to be solved by the present invention is to provide a heat radiating structure for a communication device casing having a good heat radiating effect, improving conduction efficiency, increasing a heat radiating area, stabilizing the quality of communication signals, and extending the service life. There is.

上記課題を解決するために、本考案は、納置空間を備えた本体を含み、そのうち、該本体の内部は、少なくとも1つの熱受部及び少なくとも1つの熱拡散部に分かれ、第一導熱管ユニットは前述の納置空間内に設置し、該第一導熱管ユニットを該熱受部及び熱拡散部に連接する。該熱受部が吸収した熱を該第一導熱管ユニットからスピーディに該熱拡散部へ伝導して放熱し、本体内部の熱を有効に外に放熱することを最も主要な特徴とする。   In order to solve the above-mentioned problems, the present invention includes a main body having a storage space, and the inside of the main body is divided into at least one heat receiving portion and at least one heat diffusion portion, and the first heat conducting tube. The unit is installed in the above-described storage space, and the first heat conducting tube unit is connected to the heat receiving portion and the heat diffusing portion. The main feature is that heat absorbed by the heat receiving portion is quickly conducted from the first heat conducting tube unit to the heat diffusing portion to radiate heat, and heat inside the main body is effectively radiated to the outside.

すなわち、請求項1の考案は、通信機筐体の放熱構造において、本体を含み、該本体内は少なくとも1つの熱受部、少なくとも1つの熱拡散部に分かれ、第一導熱管ユニットは該本体内に設置し、該第一導熱管ユニットを該受熱部及び放熱部に連接して該熱受部が吸収した熱を前記熱拡散部に伝導して放熱することを特徴とする。   That is, the invention of claim 1 is a heat dissipation structure for a communication device housing, including a main body, wherein the main body is divided into at least one heat receiving portion and at least one heat diffusion portion. The first heat conducting tube unit is connected to the heat receiving portion and the heat radiating portion, and the heat absorbed by the heat receiving portion is conducted to the heat diffusing portion and radiated.

請求項2の考案は、請求項1記載の通信機筐体の放熱構造において、前記本体は、納置空間を備えることを特徴とする。
請求項3の考案は、請求項1記載の通信機筐体の放熱構造において、前記熱受部は、少なくとも1つの第一凸体を備え、相対する少なくとも1つの発熱部品と接触してホットエリアを形成することを特徴とする。
請求項4の考案は、請求項3記載の通信機筐体の放熱構造において、前記第一導熱管ユニットは、複数の第一導熱管を備え、これら第一導熱管は第一熱吸収エンド及び第一放熱エンドを備え、該熱吸収エンドは該第一凸体に隣接し、該放熱エンドは該第一凸体から離れることを特徴とする。
請求項5の考案は、請求項1記載の通信機筐体の放熱構造において、前記熱拡散部は、第一放熱部、第二放熱部、第三放熱部、第四放熱部及び第五放熱部を含み、それらが相互に連通してクールエリアを形成し、該第一放熱部は該納置空間の底面に設置して該熱受部方向から離れ、前述の第二、三、四、五放熱部は該納置空間の周囲を相互に環設することを特徴とする。
According to a second aspect of the present invention, in the heat dissipation structure for a communication device casing according to the first aspect, the main body includes a storage space.
The invention of claim 3 is the heat dissipating structure of the communication device housing according to claim 1, wherein the heat receiving portion includes at least one first convex body and is in contact with at least one exothermic component facing the hot area. It is characterized by forming.
The invention of claim 4 is the heat radiating structure of the communication device casing according to claim 3, wherein the first heat transfer tube unit includes a plurality of first heat transfer tubes, and the first heat transfer tubes include a first heat absorption end and a first heat absorption end. A heat dissipation end is provided, the heat absorption end is adjacent to the first convex body, and the heat dissipation end is separated from the first convex body.
The invention of claim 5 is the heat radiating structure of the communication device casing according to claim 1, wherein the heat diffusing portion is a first heat radiating portion, a second heat radiating portion, a third heat radiating portion, a fourth heat radiating portion and a fifth heat radiating portion. Part, they communicate with each other to form a cool area, the first heat radiating part is installed on the bottom surface of the storage space away from the heat receiving part direction, the second, third, fourth, The five heat dissipating parts are characterized in that the surroundings of the storage space are mutually connected.

請求項6の考案は、請求項2もしくは3記載の通信機筐体の放熱構造において、前記納置空間は少なくとも1つの実装板を設置し、該発熱部品は該実装板に設置することを特徴とする。
請求項7の考案は、請求項1記載の通信機筐体の放熱構造において、前記本体内には少なくとも1つの凹槽を備えて該第一導熱管ユニットを納置するのに用い、且つ該凹槽一部分は該第一凸体及び熱受部周囲に隣接し、別一部分は前述の熱拡散部及び該本体の周囲に隣接することを特徴とする。
請求項8の考案は、請求項1記載の通信機筐体の放熱構造において、前記本体外側は複数の放熱フィンを備え、これら放熱フィンは本体の該納置空間に相反する表面に設置することを特徴とする。
請求項9の考案は、請求項2記載の通信機筐体の放熱構造において、前記納置空間は、更に、該本体の納置空間内に設置し、該実装板を支持するのに用いる少なくとも1つの支持部品と、両実装板の間に隣接して設置し、且つ該導熱部品の両側はそれぞれ少なくとも1つの第二凸体を備え前述の実装板上の発熱部品を押さえ、前述のホットエリアを形成する少なくとも1つの導熱部品を含むことを特徴とする。
The invention of claim 6 is characterized in that in the heat dissipation structure of the communication device casing according to claim 2 or 3, the storage space is provided with at least one mounting plate, and the heat generating component is provided on the mounting plate. And
The invention of claim 7 is the heat dissipating structure of the communication device casing according to claim 1, wherein the main body is provided with at least one concave tub and is used to place the first heat conducting tube unit, and A portion of the concave tank is adjacent to the periphery of the first convex body and the heat receiving portion, and another portion is adjacent to the periphery of the heat diffusion portion and the main body.
The invention of claim 8 is the heat dissipating structure of the communication device housing according to claim 1, wherein the outer side of the main body is provided with a plurality of heat dissipating fins, and these heat dissipating fins are installed on the surface opposite to the storage space of the main body. It is characterized by.
The invention of claim 9 is the heat dissipating structure of the communication device housing according to claim 2, wherein the storage space is further installed in the storage space of the main body and used to support the mounting plate. Installed adjacent to one support component and both mounting boards, and both sides of the heat conducting component are each provided with at least one second convex body to hold down the heat generating component on the mounting board and form the hot area described above. Including at least one heat conducting component.

請求項10の考案は、請求項9記載の通信機筐体の放熱構造において、前記導熱部品は、第二導熱管ユニットを含み、該第二導熱管ユニットは複数の第二導熱管を備え、各該第二導熱管は該第二凸体に隣接する第二熱吸収エンド、及び前述の第二凸体から離れる第二放熱エンドを備え、前述の熱吸収エンドは吸收した熱を該放熱エンドから前述の熱拡散部に伝導して放熱することを特徴とする。
請求項11の考案は、請求項1記載の通信機筐体の放熱構造において、前記本体は、蓋体を対応して接続し、該蓋体の一側は該納置空間を相対し、且つ少なくとも1つの第三凸体を備え、該蓋体の別一側は該納置空間に相対し、複数の放熱フィンを設置し、前述の第三凸体は該発熱部品を押さえて突出し、前述のホットエリアを形成することを特徴とする。
請求項12の考案は、請求項11記載の通信機筐体の放熱構造において、前記蓋体は、第三導熱管ユニットを備え、該第三導熱管ユニットは複数の第三導熱管を備え、各該第三導熱管は該第三凸体に隣接する第三熱吸収エンド、及び前述の第三凸体から離れる第三放熱エンドを備え、前述の第三熱吸収エンドは吸收した熱を該第三放熱エンドから、それぞれ該蓋体上の放熱フィン及び/もしくは前述の熱拡散部に伝導して放熱することを特徴とする。
The invention of claim 10 is the heat dissipating structure of the communication device casing according to claim 9, wherein the heat conducting component includes a second heat conducting tube unit, and the second heat conducting tube unit includes a plurality of second heat conducting tubes, Each of the second heat transfer tubes includes a second heat absorption end adjacent to the second convex body and a second heat radiating end separated from the second convex body, and the heat absorption end described above absorbs the absorbed heat. It is characterized in that it conducts heat to the above-mentioned heat diffusion part and dissipates heat.
The invention of claim 11 is the heat dissipating structure of the communication device housing according to claim 1, wherein the main body is correspondingly connected to a lid, and one side of the lid is opposed to the storage space, and At least one third convex body is provided, another side of the lid body is opposed to the storage space, a plurality of heat radiation fins are installed, and the third convex body projects while pressing the heat generating component, The hot area is formed.
The invention of claim 12 is the heat dissipation structure for a communication device housing according to claim 11, wherein the lid includes a third heat transfer tube unit, and the third heat transfer tube unit includes a plurality of third heat transfer tubes, Each of the third heat transfer tubes includes a third heat absorption end adjacent to the third convex body, and a third heat dissipation end separated from the third convex body, and the third heat absorption end includes the absorbed heat. The heat radiation is conducted from the third heat radiating end to the heat radiating fins and / or the above-described heat diffusion portion on the lid, respectively.

本考案の通信機筐体の放熱構造によれば、良好な放熱効果を備え、伝導効率が向上し、放熱面積が増え、通信信号の品質が安定し、使用寿命が延びるという利点がある。   According to the heat dissipation structure of the communication device casing of the present invention, there are advantages that a good heat dissipation effect is provided, the conduction efficiency is improved, the heat dissipation area is increased, the quality of the communication signal is stabilized, and the service life is extended.

公知の通信機筐体構造分解指示図である。It is a well-known communication device housing structure disassembly instruction diagram. 本考案の本体、放熱管及び実装板の分解指示図である。It is a disassembled instruction | indication figure of the main body of this invention, a heat sink, and a mounting board. 本考案の蓋体構造の分解指示図である。It is a decomposition | disassembly instruction | indication figure of the cover body structure of this invention. 本考案の良好な実施例の分解指示図である。It is an exploded view of a preferred embodiment of the present invention. 本考案の良好な実施例の組立指示図である。It is an assembly instruction diagram of a preferred embodiment of the present invention. 本考案の良好な実施例組立の図5A−A線での断面指示図である。FIG. 6 is a cross-sectional view taken along the line 5A-A of the preferred embodiment assembly of the present invention.

上述の問題を解決するため、良好な放熱効果を備えた通信機筐体の放熱構造を提供する事を本考案の主な目的とする。
使用寿命を延ばす通信機筐体の放熱構造を提供することを本考案の次の目的とする。
送受信信号の品質を安定させる通信機筐体の放熱構造を提供することを本考案の更に次の目的とする。
伝導面積を平均化する通信機筐体の放熱構造を提供することを本考案の別の目的とする。
In order to solve the above-described problems, it is a main object of the present invention to provide a heat dissipation structure for a communication device housing having a good heat dissipation effect.
It is a next object of the present invention to provide a heat dissipation structure for a communication device casing that extends the service life.
It is a further object of the present invention to provide a heat dissipating structure for a communication device casing that stabilizes the quality of transmission / reception signals.
Another object of the present invention is to provide a heat dissipation structure for a communication device casing that averages the conductive area.

上述の目的のため、本考案は、一種の通信機筐体の放熱構造を提供し、該通信機筐体の放熱構造は本体を含み、該本体は納置空間を備える。該本体内は少なくとも1つの熱受部、少なくとも1つの熱拡散部に分かれ、第一導熱管ユニットを設置する。前記第一導熱管ユニットは前記納置空間内に配置し、更に該熱受部及び熱拡散部を連接する。更に該第一導熱管ユニットは第一吸熱部及び第一放熱部を備え、該熱受部が吸収した熱を該第一吸熱部から該第一放熱部へ導き、前述の第一放熱部で熱を該熱拡散部へ伝導して放熱するもので、スピーディに放熱し、且つ有効に伝導面積に伝え、通信機筐体に良好な放熱効果を達成する。   For the above-mentioned purpose, the present invention provides a heat dissipation structure of a kind of communication device casing, the heat dissipation structure of the communication device case includes a main body, and the main body includes a storage space. The main body is divided into at least one heat receiving portion and at least one heat diffusing portion, and a first heat conducting tube unit is installed. The first heat conducting tube unit is disposed in the storage space, and further connects the heat receiving portion and the heat diffusing portion. Further, the first heat conducting tube unit includes a first heat absorbing portion and a first heat radiating portion, and the heat absorbed by the heat receiving portion is guided from the first heat absorbing portion to the first heat radiating portion. It conducts heat to the heat diffusing section to dissipate heat, and quickly dissipates heat and effectively transmits it to the conduction area, achieving a good heat dissipating effect on the communication device casing.

本考案の上述目的及びその構造と機能上的特性を図式に基づき、良好な実施例を挙げて説明する。
図2に示すとおり、本考案は一種の通信機筐体の放熱構造であり、本考案の一実施例に於いて、本体2を含む。該本体2は納置空間21及び複数の放熱フィン23を備える。これら放熱フィン23は本体2の該納置空間21に相対する表面に設置し、該本体2内は少なくとも1つの熱受部211、少なくとも1つの熱拡散部212に分かれる。更に第一導熱管ユニット213は前述の納置空間21内に設置し、前述の第一導熱管ユニット213は、熱受部211及び熱拡散部212に連接し、更に該熱受部211が吸収した熱を熱拡散部212に伝えて放熱する。
The above-mentioned object of the present invention and its structural and functional characteristics will be described with reference to a preferred embodiment.
As shown in FIG. 2, the present invention is a kind of communication device casing heat dissipation structure, and includes a main body 2 in one embodiment of the present invention. The main body 2 includes a storage space 21 and a plurality of radiating fins 23. These radiating fins 23 are installed on the surface of the main body 2 facing the storage space 21, and the main body 2 is divided into at least one heat receiving portion 211 and at least one heat diffusing portion 212. Further, the first heat transfer tube unit 213 is installed in the storage space 21, and the first heat transfer tube unit 213 is connected to the heat receiving part 211 and the heat diffusion part 212, and further absorbed by the heat receiving part 211. The generated heat is transmitted to the heat diffusion unit 212 to be radiated.

更に、該第一導熱管ユニット213は複数の第一導熱管2130を備える。各該第一導熱管2130は第一熱吸収エンド2131及び第一放熱エンド2132を備え、更に該第一熱吸収エンド2131が吸収した熱を該第一放熱エンド2132に伝えて放熱する。言い換えれば該第一熱吸収エンド2131は前述の熱受部211が吸収して集めた熱を迅速に前述の第一放熱エンド2132に伝え、該第一放熱エンド2132によって吸収した熱を前述の熱拡散部212及び該本体2上へ広く伝導して放熱する。そのため、該第一導熱管ユニット213を通して熱を該熱拡散部212及び該本体2上へ有効に分散してスピーディに熱を外へ排出し、且つ放熱面積全体及び伝導效率を高め、放熱機能を高める。   Further, the first heat transfer tube unit 213 includes a plurality of first heat transfer tubes 2130. Each of the first heat conducting tubes 2130 includes a first heat absorbing end 2131 and a first heat radiating end 2132, and further transfers the heat absorbed by the first heat absorbing end 2131 to the first heat radiating end 2132 to radiate heat. In other words, the first heat absorbing end 2131 quickly transfers the heat absorbed and collected by the heat receiving portion 211 to the first heat radiating end 2132 and the heat absorbed by the first heat radiating end 2132 is transferred to the heat. The heat is dissipated by being widely conducted on the diffusion part 212 and the main body 2. Therefore, heat is effectively dispersed on the heat diffusing unit 212 and the main body 2 through the first heat conducting tube unit 213, and the heat is expelled to the outside quickly, and the entire heat radiation area and the conduction efficiency are increased, thereby providing a heat radiation function. Increase.

図2、3、4、5、6に示すとおり、前述の熱受部211は、少なくとも1つの第一凸体2111を備える。該第一凸体2111は相対する少なくとも1つの発熱部品41と接触してホットエリア(熱い区域)Hを形成し、前述のホットエリアHは、前述の第一凸体2111によって該発熱部品41が発した熱を吸収し、このエリアは該納置空間21内の比較的高温の熱エリアを形成する。   As shown in FIGS. 2, 3, 4, 5, and 6, the heat receiving unit 211 described above includes at least one first convex body 2111. The first convex body 2111 is in contact with at least one opposing heat-generating component 41 to form a hot area (hot area) H. The generated heat is absorbed, and this area forms a relatively hot heat area in the storage space 21.

前述の熱拡散部212は第一放熱部2121、第二放熱部2122、第三放熱部2123、第四放熱部2124及び第五放熱部2125を含み、更にそれらが相互に連通してクールエリア(冷たい区域)Lを形成する。前述の第一放熱部2121は、該納置空間21の底面の該熱受部211から離れた方向に設置する。前述の第二、三、四、五放熱部2122、2123、2124、2125は該納置空間周囲に相互に環設し、該第二放熱部2122の両側にはそれぞれ該第三放熱部2123及び第五放熱部2125の一側と連接して対応し、前述の第三放熱部2123及び第五放熱部2125の別一側は該第四放熱部2124の両側と相対して連接し、該第二から第五放熱部2122、2123、2124、2125で囲み前述の納置空間21を形成する。   The above-mentioned heat diffusion part 212 includes a first heat radiation part 2121, a second heat radiation part 2122, a third heat radiation part 2123, a fourth heat radiation part 2124, and a fifth heat radiation part 2125, which are further connected to each other to form a cool area ( Cold area) L is formed. The first heat radiating part 2121 is installed in a direction away from the heat receiving part 211 on the bottom surface of the storage space 21. The second, third, fourth, and fifth heat dissipating parts 2122, 2123, 2124, and 2125 are circularly arranged around the storage space, and the third heat dissipating part 2123 and Corresponding to one side of the fifth heat radiating part 2125, the other side of the third heat radiating part 2123 and the fifth heat radiating part 2125 is connected to opposite sides of the fourth heat radiating part 2124, and The storage space 21 described above is formed by being surrounded by the second to fifth heat radiation portions 2122, 2123, 2124, and 2125.

そのうち、前述の第一放熱部2121、第二放熱部2122、第三放熱部2123、第四放熱部2124及び第五放熱部2125は、連接してクールエリアLを形成する。前述のクールエリアLは前述のホットエリアHに遠く、如何なる一発熱部品41とも接触することがないため、このエリアは該納置空間21内で比較的低温の放熱エリアを形成する。   Among them, the first heat radiation part 2121, the second heat radiation part 2122, the third heat radiation part 2123, the fourth heat radiation part 2124 and the fifth heat radiation part 2125 are connected to form a cool area L. The aforementioned cool area L is far from the aforementioned hot area H and does not come into contact with any one heat generating component 41, so this area forms a relatively low temperature heat radiation area in the storage space 21.

前述の本体2内部表面は、少なくとも1つの凹槽214を備え、これら第一導熱管2130を納置するのに用いる。更に該凹槽214の一部分は該第一凸体2111及び熱受部211周囲に隣接し、別一側部分は前述の熱拡散部212及び該本体2周囲に隣接する。簡単に言うと、該凹槽214の一部分は、該第一導熱管2130の第一熱吸収エンド2131に従って該第一凸体2111及び熱受部211周囲に巻き付き、また該凹槽214の別一部分は前述の第一凸体2111から離れ、該第一導熱管2130の第一放熱エンド2132に従って該熱拡散部212及び該本体2に接触して伸びる。更に該納置空間21は少なくとも一実装板4を載せ、且つ該実装板4上には前述の発熱部品41を設置する。   The inner surface of the main body 2 includes at least one concave tank 214 and is used to store these first heat transfer tubes 2130. Further, a part of the concave tank 214 is adjacent to the periphery of the first convex body 2111 and the heat receiving part 211, and another side part is adjacent to the periphery of the heat diffusion part 212 and the main body 2. Briefly, a part of the concave tank 214 is wound around the first convex body 2111 and the heat receiving portion 211 according to the first heat absorption end 2131 of the first heat conducting tube 2130, and another part of the concave tank 214 is provided. Is separated from the first convex body 2111 and extends in contact with the heat diffusion part 212 and the main body 2 according to the first heat radiation end 2132 of the first heat conducting tube 2130. Further, at least one mounting board 4 is placed in the storage space 21, and the aforementioned heat generating component 41 is installed on the mounting board 4.

図4、図6(図5A-A線での断面図)に示すとおり、前述の納置空間21は更に少なくとも1つの支持部品215及び少なくとも1つの導熱部品216を含む。これら支持部品215は該本体2の納置空間21内に設置し、該実装板4を支持するのに用いる。これは一方面では該実装板4を該納置空間21に安定して固定し、別一方面ではこれら支持部品215によって該実装板4が発する熱を該本体2へ送りやすく、本体2が放熱フィン23を通して熱を外へ拡散して放熱する。   As shown in FIGS. 4 and 6 (cross-sectional view taken along the line AA in FIG. 5), the storage space 21 further includes at least one support component 215 and at least one heat conducting component 216. These support parts 215 are installed in the storage space 21 of the main body 2 and used to support the mounting board 4. This is because the mounting plate 4 is stably fixed to the storage space 21 on one side, and the heat generated by the mounting plate 4 is easily sent to the main body 2 by the support parts 215 on the other side, and the main body 2 dissipates heat. The heat is diffused outside through the fins 23 to dissipate heat.

前述の導熱部品216は、隣接する両実装板4の間に設置し、且つその一端は相対する該納置空間21の内側と相互にしっかりと設置される。更に該導熱部品216の両側にはそれぞれ少なくとも1つの第二凸体2162を備え、各該第二凸体2162は各実装板4上の発熱部品41を押さえて伸び、前述のホットエリアHを形成し、且つ該第二凸体2162は前述の各実装板4上の発熱部品41が発する熱を吸収するのに用いる。   The aforementioned heat conducting component 216 is installed between the two adjacent mounting boards 4, and one end of the heat conducting component 216 is firmly installed inside the opposing storage space 21. Furthermore, at least one second convex body 2162 is provided on each side of the heat conducting component 216, and each second convex body 2162 extends by pressing the heat generating component 41 on each mounting board 4 to form the hot area H described above. The second convex body 2162 is used to absorb heat generated by the heat generating component 41 on each mounting board 4 described above.

続いて、該導熱部品216は、更に第二導熱管ユニット2163を含む。該第二導熱管ユニット2163は複数の第二導熱管2164を備え、各該第二導熱管2164は該第二凸体2162に隣接する第二熱吸収エンド2165、及び前述の第二凸体2162から離れた第二放熱エンド2166を備える。前述の第二熱吸収エンド2165は吸收した熱を、該第二放熱エンド2166を通して前述の熱拡散部212へ伝導して放熱し、第二凸体2162が吸收した発熱部品41の熱は該第二熱吸収エンド2165を通して該第二放熱エンド2166へ伝導し、前述の第二放熱エンド2166によって、その熱を前述の熱拡散部212へ伝導し、該熱拡散部212によって放射式に外へ熱を拡散して放熱する以外に、更に該本体2上の放熱フィン23によって放熱を助ける。そのうち前述の主な放熱は第一から第五放熱部2121、2122、2123、2124、2125の放射式での外への拡散であり、外の空気と熱交換して放熱するもので、第二の放熱が該本体2の放熱フィン23による放熱である。   Subsequently, the heat conducting component 216 further includes a second heat conducting tube unit 2163. The second heat transfer tube unit 2163 includes a plurality of second heat transfer tubes 2164, and each second heat transfer tube 2164 has a second heat absorption end 2165 adjacent to the second convex body 2162 and the second convex body 2162 described above. A second heat dissipating end 2166 away from the head. The heat absorbed by the second heat absorbing end 2165 is conducted to the heat diffusing portion 212 through the second heat radiating end 2166 to be radiated, and the heat of the heat generating component 41 absorbed by the second convex body 2162 is the first heat. The heat is transferred to the second heat radiating end 2166 through the two heat absorbing ends 2165, and the heat is transferred to the heat diffusing portion 212 by the second heat radiating end 2166. In addition to radiating and radiating heat, the radiating fins 23 on the main body 2 further assist in radiating heat. Of these, the main heat dissipation described above is diffusion from the first to the fifth heat dissipating parts 2121, 2122, 2123, 2124, 2125, and the heat is dissipated by exchanging heat with the outside air. Is radiated by the radiating fins 23 of the main body 2.

図3、図4に示すとおり、該本体2は更に蓋体5を対応して設置し、該蓋体5の一側は該納置空間21に相対し、且つ少なくとも1つの第三凸体51及び少なくとも1つの第三導熱管ユニット52を備える。前述の蓋体5別一側は該納置空間21に相反し、複数の放熱フィン53を設置する。前述の第三凸体51は該発熱部品41を押さえて伸び、前述のホットエリアHを形成し、さらに実装板4上に対応する発熱部品41が発する熱を吸収するのに用いる。   As shown in FIGS. 3 and 4, the main body 2 is further provided with a corresponding lid body 5, one side of the lid body 5 is opposed to the storage space 21, and at least one third convex body 51. And at least one third heat transfer tube unit 52. The above-mentioned one side of the lid 5 is opposite to the storage space 21 and a plurality of radiating fins 53 are installed. The above-described third convex body 51 extends while pressing the heat generating component 41 to form the above-described hot area H, and is further used to absorb heat generated by the corresponding heat generating component 41 on the mounting board 4.

前述の第三導熱管ユニット52は、複数の第三導熱管520を備える。各該第三導熱管520は該第三凸体51に隣接する第三熱吸収エンド521、及び前述の第三凸体51から離れる第三放熱エンド522を備える。前述の第三熱吸収エンド521は吸收した熱を該第三放熱エンド522から、それぞれ該蓋体5上の放熱フィン53及び熱拡散部212に伝導して放熱し、該第三凸体51で前述の発熱部品41の熱を吸収することによって該第三熱吸収エンド521を通り、熱を該第三放熱エンド522へ伝え、該第三放熱エンド522で吸収した熱をそれぞれ前述の熱拡散部212及び該蓋体5上の放熱フィン53へ伝えて放熱する。   The aforementioned third heat transfer tube unit 52 includes a plurality of third heat transfer tubes 520. Each of the third heat conducting tubes 520 includes a third heat absorbing end 521 adjacent to the third convex body 51 and a third heat radiating end 522 away from the third convex body 51. The aforementioned third heat absorbing end 521 conducts the absorbed heat from the third heat radiating end 522 to the heat radiating fins 53 and the heat diffusing portion 212 on the lid body 5 to dissipate the heat. By absorbing the heat of the heat generating component 41, the heat is transferred to the third heat radiating end 522 through the third heat absorbing end 521, and the heat absorbed by the third heat radiating end 522 is respectively described above. The heat is transmitted to 212 and the heat dissipating fins 53 on the lid 5 to dissipate heat.

次に図4、5、6では以下のとおりに本考案の具体的な実施を説明する。
前述の通信機筐体内の実装板4が稼動すると、前述の実装板4の発熱部品41が高熱を発する。前述の熱受部211の第一凸体2111が前述の一実装板4に対応する発熱部品41で発した熱を吸収する。そして該第一導熱管2130の第一熱吸収エンド2131で熱を該第一放熱エンド2132へ送り、前述の第一放熱エンド2132が吸収した熱を該熱拡散部212(即ち該第一から第五放熱部)へ広く伝導し、前述の熱拡散部212による大きな放熱面積で放射式に外へ放熱し、且つ該本体2上の放熱フィン23によって放熱を助ける。
Next, in FIGS. 4, 5 and 6, a specific implementation of the present invention will be described as follows.
When the mounting board 4 in the above-described communication device casing operates, the heat generating component 41 of the above-described mounting board 4 generates high heat. The first convex body 2111 of the heat receiving portion 211 described above absorbs heat generated by the heat generating component 41 corresponding to the one mounting plate 4 described above. Then, heat is sent to the first heat radiating end 2132 by the first heat absorbing end 2131 of the first heat conducting tube 2130, and the heat absorbed by the first heat radiating end 2132 is transferred to the heat diffusing portion 212 (that is, from the first to the second heat radiating end 2132). The heat radiating section 212 is widely conducted, radiates heat to the outside with a large heat radiating area by the heat diffusing section 212, and assists heat radiation by the radiating fins 23 on the main body 2.

同時に前述の導熱部品216の両側の第二凸体2162は実装板4上に対応する両発熱部品41の熱を吸収し、該第二導熱管2164の第二熱吸収エンド2165で前述の熱を該第二放熱エンド2166へ導き、前述の第二放熱エンド2166は吸収した熱を前述の熱拡散部212へ伝導し、該熱拡散部212によって再び熱を該第一から第五放熱部2121、2122、2123、2124、2125上へ平均して拡散し、放射式に外へ拡散して放熱し、更に該本体2上の放熱フィン23によって放熱を助ける。   At the same time, the second protrusions 2162 on both sides of the heat conducting component 216 absorb the heat of the corresponding heat generating components 41 on the mounting board 4, and the second heat absorbing end 2165 of the second heat conducting tube 2164 absorbs the heat described above. The second heat dissipating end 2166 leads the second heat dissipating end 2166 to the absorbed heat to the heat diffusing unit 212, and the heat diffusing unit 212 again transfers the heat from the first to fifth heat radiating units 2121, 2122, 2123, 2124, and 2125 are diffused on average, radiated outwardly to dissipate heat, and further radiated by the heat dissipating fins 23 on the main body 2.

更に同一時間には該蓋体5の第三凸体51に於いて、別の一実装板4に対応する発熱部品41が発した熱を吸収する。前述の第三導熱管520の第三熱吸収エンド521が前述の熱を該第三放熱エンド522へ導き、前述の第三放熱エンド522では受けた熱を熱拡散部212へ伝送し、該熱拡散部212によって再び熱を該第一から第五放熱部2121、2122、2123、2124、2125上へスピーディに拡散し、放射式に外へ拡散して放熱する。更に該蓋体5上の放熱フィン53によってスピーディな放熱を助ける。これによって、通信機筐体内の実装板4が安定して稼動し、更に通信信号の品質が安定し、更に使用寿命が延び、良好な放熱効果を達成する。
なお、前記導熱管及び/もしくは導熱部品は導熱管もしくは熱拡散板でもよい。
Further, at the same time, the third convex body 51 of the lid 5 absorbs the heat generated by the heat generating component 41 corresponding to another mounting board 4. The third heat absorption end 521 of the third heat transfer tube 520 guides the heat to the third heat radiating end 522, and the third heat radiating end 522 transmits the received heat to the heat diffusing unit 212. The diffusion unit 212 again diffuses heat quickly from the first to the fifth heat radiation units 2121, 2122, 2123, 2124, and 2125, radiates outward and radiates heat. Furthermore, the heat radiation fins 53 on the lid 5 help speedy heat radiation. As a result, the mounting plate 4 in the communication device housing operates stably, further stabilizes the quality of the communication signal, further extends the service life, and achieves a good heat dissipation effect.
The heat conducting tube and / or the heat conducting component may be a heat conducting tube or a heat diffusion plate.

以上のとおり、本考案の良好な実施例であり、本考案上述の方法、形状、構造、装置の変化はすべて本考案の請求範囲に含まれる。   As described above, this is a preferred embodiment of the present invention, and all the changes in the method, shape, structure and apparatus described above are included in the claims of the present invention.

10 筐体
101 納置空間
103 放熱フィン
11 蓋体
12 支持柱
13 実装板
131 発熱部品
2 本体
21 納置空間
211 熱受部
2111 第一凸体
212 熱拡散部
2121 第一放熱部
2122 第二放熱部
2123 第三放熱部
2124 第四放熱部
2125 第五放熱部
213 第一導熱管ユニット
2130 第一導熱管
2131 第一熱吸収エンド
2132 第一放熱エンド
214 凹槽
215 支持部品
216 導熱部品
2162 第二凸体
2163 第二導熱管ユニット
2164 第二導熱管
2165 第二熱吸収エンド
2166 第二放熱エンド
23 放熱フィン
4 実装板
41 発熱部品
5 蓋体
51 第三凸体
52 第三導熱管ユニット
520 第三導熱管
521 第三熱吸収エンド
522 第三放熱エンド
53 放熱フィン
H ホットエリア(熱い区域)
L クールエリア(冷たい区域)
DESCRIPTION OF SYMBOLS 10 Housing | casing 101 Storage space 103 Radiation fin 11 Cover body 12 Support pillar 13 Mounting board 131 Heat-generating component 2 Main body 21 Storage space 211 Heat receiving part 2111 First convex body 212 Thermal diffusion part 2121 First heat radiation part 2122 Second heat radiation Part 2123 third heat radiating part 2124 fourth heat radiating part 2125 fifth heat radiating part 213 first heat conducting pipe unit 2130 first heat conducting pipe 2131 first heat absorbing end 2132 first heat radiating end 214 recessed tank 215 support part 216 heat conducting part 2162 second Convex body 2163 2nd heat transfer tube unit 2164 2nd heat transfer tube 2165 2nd heat absorption end 2166 2nd heat dissipation end 23 Heat dissipation fin 4 Mounting plate 41 Heating component 5 Lid body 51 3rd convex body 52 3rd heat transfer tube unit 520 3rd Heat transfer tube 521 Third heat absorption end 522 Third heat dissipation end 53 Heat dissipation fin H Area (hot area)
L Cool area (cold area)

すなわち、請求項1の考案は、通信機筐体の放熱構造において、本体を含み、該本体内は少なくとも1つの熱受部、少なくとも1つの熱拡散部に分かれ、第一導熱管ユニットは該本体内に設置し、該第一導熱管ユニットを該熱受部及び放熱部に連接して該熱受部が吸収した熱を前記熱拡散部に伝導して放熱することを特徴とする。
That is, the invention of claim 1 is a heat dissipation structure for a communication device housing, including a main body, wherein the main body is divided into at least one heat receiving portion and at least one heat diffusion portion. was placed within the said imparting one heat pipe unit, characterized in that radiated conducted to the heat diffusing portion heat heat receiving portion and connected to said Netsu受 portion and the heat radiating portion is absorbed.

請求項2の考案は、請求項1記載の通信機筐体の放熱構造において、前記本体は、納置空間を備えることを特徴とする。
請求項3の考案は、請求項記載の通信機筐体の放熱構造において、前記熱受部は、少なくとも1つの第一凸体を備え、相対する少なくとも1つの発熱部品と接触してホットエリアを形成することを特徴とする。
請求項4の考案は、請求項3記載の通信機筐体の放熱構造において、前記第一導熱管ユニットは、複数の第一導熱管を備え、これら第一導熱管は第一熱吸収エンド及び第一放熱エンドを備え、該熱吸収エンドは該第一凸体に隣接し、該放熱エンドは該第一凸体から離れることを特徴とする。
請求項5の考案は、請求項記載の通信機筐体の放熱構造において、前記熱拡散部は、第一放熱部、第二放熱部、第三放熱部、第四放熱部及び第五放熱部を含み、それらが相互に連通してクールエリアを形成し、該第一放熱部は該納置空間の底面に設置して該熱受部方向から離れ、前述の第二、三、四、五放熱部は該納置空間の周囲を相互に環設することを特徴とする。
According to a second aspect of the present invention, in the heat dissipation structure for a communication device casing according to the first aspect, the main body includes a storage space.
According to a third aspect of the present invention, in the heat dissipation structure for a communication device casing according to the second aspect , the heat receiving portion includes at least one first convex body and is in contact with at least one exothermic component facing to the hot area. It is characterized by forming.
The invention of claim 4 is the heat radiating structure of the communication device casing according to claim 3, wherein the first heat transfer tube unit includes a plurality of first heat transfer tubes, and the first heat transfer tubes include a first heat absorption end and a first heat absorption end. A heat dissipation end is provided, the heat absorption end is adjacent to the first convex body, and the heat dissipation end is separated from the first convex body.
The invention of claim 5 is the heat radiating structure of the communication device casing according to claim 2 , wherein the heat diffusing part is a first heat radiating part, a second heat radiating part, a third heat radiating part, a fourth heat radiating part and a fifth heat radiating part. Part, they communicate with each other to form a cool area, the first heat radiating part is installed on the bottom surface of the storage space away from the heat receiving part direction, the second, third, fourth, The five heat dissipating parts are characterized in that the surroundings of the storage space are mutually connected.

請求項6の考案は、請求項記載の通信機筐体の放熱構造において、前記納置空間は少なくとも1つの実装板を設置し、該発熱部品は該実装板に設置することを特徴とする。
請求項7の考案は、請求項1記載の通信機筐体の放熱構造において、前記本体内には少なくとも1つの凹槽を備えて該第一導熱管ユニットを納置するのに用い、且つ該凹槽一部分は該第一凸体及び熱受部周囲に隣接し、別一部分は前述の熱拡散部及び該本体の周囲に隣接することを特徴とする。
請求項8の考案は、請求項記載の通信機筐体の放熱構造において、前記本体外側は複数の放熱フィンを備え、これら放熱フィンは本体の該納置空間に相反する表面に設置することを特徴とする。
請求項9の考案は、請求項記載の通信機筐体の放熱構造において、前記納置空間は、更に、該本体の納置空間内に設置し、該実装板を支持するのに用いる少なくとも1つの支持部品と、導熱部品を両実装板の間に隣接して設置し、且つ該導熱部品の両側はそれぞれ少なくとも1つの第二凸体を備え前述の実装板上の発熱部品を押さえ、前述のホットエリアを形成する少なくとも1つの導熱部品を含むことを特徴とする。
The invention according to claim 6 is the heat dissipation structure for the communication device casing according to claim 3 , wherein the storage space is provided with at least one mounting plate, and the heat generating component is provided on the mounting plate. .
The invention of claim 7 is the heat dissipating structure of the communication device casing according to claim 1, wherein the main body is provided with at least one concave tub and is used to place the first heat conducting tube unit, and A portion of the concave tank is adjacent to the periphery of the first convex body and the heat receiving portion, and another portion is adjacent to the periphery of the heat diffusion portion and the main body.
The invention of claim 8 is the heat radiating structure of the communication device housing according to claim 2 , wherein the outer side of the main body is provided with a plurality of heat radiating fins, and these radiating fins are installed on the surface opposite to the storage space of the main body. It is characterized by.
The invention of claim 9 is the heat dissipating structure of the communication device casing according to claim 6 , wherein the storage space is further installed in the storage space of the main body and used to support the mounting plate. and one support part, and located adjacent the heat-conducting component in both mounting plates and both sides of the conductor heat component comprises at least one second protruding member respectively down the heat-generating components on the aforementioned mounting plate, the aforementioned hot It includes at least one heat conducting part forming an area.

請求項10の考案は、請求項9記載の通信機筐体の放熱構造において、前記導熱部品は、第二導熱管ユニットを含み、該第二導熱管ユニットは複数の第二導熱管を備え、各該第二導熱管は該第二凸体に隣接する第二熱吸収エンド、及び前述の第二凸体から離れる第二放熱エンドを備え、前述の熱吸収エンドは吸收した熱を該放熱エンドから前述の熱拡散部に伝導して放熱することを特徴とする。
請求項11の考案は、請求項記載の通信機筐体の放熱構造において、前記本体は、蓋体を対応して接続し、該蓋体の一側は該納置空間を相対し、且つ少なくとも1つの第三凸体を備え、該蓋体の別一側は該納置空間に相対し、複数の放熱フィンを設置し、前述の第三凸体は該発熱部品を押さえて突出し、該発熱部品と接触してホットエリアを形成することを特徴とする。
請求項12の考案は、請求項11記載の通信機筐体の放熱構造において、前記蓋体は、第三導熱管ユニットを備え、該第三導熱管ユニットは複数の第三導熱管を備え、各該第三導熱管は該第三凸体に隣接する第三熱吸収エンド、及び前述の第三凸体から離れる第三放熱エンドを備え、前述の第三熱吸収エンドは吸收した熱を該第三放熱エンドから、それぞれ該蓋体上の放熱フィン及び/もしくは前述の熱拡散部に伝導して放熱することを特徴とする。
The invention of claim 10 is the heat dissipating structure of the communication device casing according to claim 9, wherein the heat conducting component includes a second heat conducting tube unit, and the second heat conducting tube unit includes a plurality of second heat conducting tubes, Each of the second heat transfer tubes includes a second heat absorption end adjacent to the second convex body and a second heat radiating end separated from the second convex body, and the heat absorption end described above absorbs the absorbed heat. It is characterized in that it conducts heat to the above-mentioned heat diffusion part and radiates heat.
The invention of claim 11 is the heat dissipating structure of the housing of the communication device according to claim 2 , wherein the main body is connected to the cover body, one side of the cover body is opposed to the storage space, and comprising at least one third convex member, another one side of the lid body phase against between該納置空, and installing a plurality of radiating fins protrude third convex body described above pressing the heat-generating components, the A hot area is formed in contact with the heat-generating component .
The invention of claim 12 is the heat dissipation structure for a communication device housing according to claim 11, wherein the lid includes a third heat transfer tube unit, and the third heat transfer tube unit includes a plurality of third heat transfer tubes, Each of the third heat transfer tubes includes a third heat absorption end adjacent to the third convex body, and a third heat dissipation end separated from the third convex body, and the third heat absorption end includes the absorbed heat. The heat radiation is conducted from the third heat radiating end to the heat radiating fins and / or the above-described heat diffusion portion on the lid, respectively.

請求項10の考案は、請求項9記載の通信機筐体の放熱構造において、前記導熱部品は、第二導熱管ユニットを含み、該第二導熱管ユニットは複数の第二導熱管を備え、各該第二導熱管は該第二凸体に隣接する第二熱吸収エンド、及び前述の第二凸体から離れる第二放熱エンドを備え、前述の熱吸収エンドは吸收した熱を該放熱エンドから前述の熱拡散部に伝導して放熱することを特徴とする。
請求項11の考案は、請求項2記載の通信機筐体の放熱構造において、前記本体は、蓋体を対応して接続し、該蓋体の一側は該納置空間を相対し、且つ少なくとも1つの第三凸体を備え、該蓋体の別一側は該納置空間に相対し、複数の放熱フィンを設置し、前述の第三凸体は通信機筐体内の実装板に対応する発熱部品を押さえて突出し、該発熱部品と接触してホットエリアを形成することを特徴とする。
請求項12の考案は、請求項11記載の通信機筐体の放熱構造において、前記蓋体は、第三導熱管ユニットを備え、該第三導熱管ユニットは複数の第三導熱管を備え、各該第三導熱管は該第三凸体に隣接する第三熱吸収エンド、及び前述の第三凸体から離れる第三放熱エンドを備え、前述の第三熱吸収エンドは吸收した熱を該第三放熱エンドから、それぞれ該蓋体上の放熱フィン及び/もしくは前述の熱拡散部に伝導して放熱することを特徴とする。
The invention of claim 10 is the heat dissipating structure of the communication device casing according to claim 9, wherein the heat conducting component includes a second heat conducting tube unit, and the second heat conducting tube unit includes a plurality of second heat conducting tubes, Each of the second heat transfer tubes includes a second heat absorption end adjacent to the second convex body and a second heat radiating end separated from the second convex body, and the heat absorption end described above absorbs the absorbed heat. It is characterized in that it conducts heat to the above-mentioned heat diffusion part and dissipates heat.
The invention of claim 11 is the heat dissipating structure of the housing of the communication device according to claim 2, wherein the main body is connected to the cover body, one side of the cover body is opposed to the storage space, and At least one third convex body is provided, another side of the lid body is opposed to the storage space, a plurality of heat radiation fins are installed, and the above-mentioned third convex body corresponds to the mounting plate in the communication device housing The heat generating component is pressed and protruded, and is brought into contact with the heat generating component to form a hot area.
The invention of claim 12 is the heat dissipation structure for a communication device housing according to claim 11, wherein the lid includes a third heat transfer tube unit, and the third heat transfer tube unit includes a plurality of third heat transfer tubes, Each of the third heat transfer tubes includes a third heat absorption end adjacent to the third convex body, and a third heat dissipation end separated from the third convex body, and the third heat absorption end includes the absorbed heat. The heat radiation is conducted from the third heat radiating end to the heat radiating fins and / or the above-described heat diffusion portion on the lid, respectively.

Claims (12)

通信機筐体の放熱構造において、
本体を含み、該本体内は少なくとも1つの熱受部、少なくとも1つの熱拡散部に分かれ、第一導熱管ユニットは該本体内に設置し、該第一導熱管ユニットを前記受熱部及び放熱部に連接して該熱受部が吸収した熱を前記熱拡散部に伝導して放熱することを特徴とする通信機筐体の放熱構造。
In the heat dissipation structure of the communication device housing,
A main body, wherein the main body is divided into at least one heat receiving portion and at least one heat diffusing portion, the first heat conducting tube unit is installed in the main body, and the first heat conducting tube unit is connected to the heat receiving portion and the heat radiating portion. A heat dissipating structure for a communication device casing, wherein heat dissipated by the heat receiving part connected to the heat conducting part is conducted to the heat diffusing part and dissipated.
前記本体は、納置空間を備えることを特徴とする請求項1記載の通信機筐体の放熱構造。   The heat radiating structure for a communication device casing according to claim 1, wherein the main body includes a storage space. 前記熱受部は、少なくとも1つの第一凸体を備え、相対する少なくとも1つの発熱部品と接触してホットエリアを形成することを特徴とする請求項1記載の通信機筐体の放熱構造。   2. The heat radiating structure of a communication device case according to claim 1, wherein the heat receiving portion includes at least one first convex body and forms a hot area by contacting with at least one opposing heat generating component. 前記第一導熱管ユニットは、複数の第一導熱管を備え、これら第一導熱管は第一熱吸収エンド及び第一放熱エンドを備え、該熱吸収エンドは該第一凸体に隣接し、該放熱エンドは該第一凸体から離れることを特徴とする請求項3記載の通信機筐体の放熱構造。   The first heat transfer tube unit includes a plurality of first heat transfer tubes, the first heat transfer tubes include a first heat absorption end and a first heat dissipation end, and the heat absorption end is adjacent to the first convex body, The heat dissipation structure for a communication device casing according to claim 3, wherein the heat dissipation end is separated from the first convex body. 前記熱拡散部は、第一放熱部、第二放熱部、第三放熱部、第四放熱部及び第五放熱部を含み、それらが相互に連通してクールエリアを形成し、該第一放熱部は該納置空間の底面に設置して該熱受部方向から離れ、前述の第二、三、四、五放熱部は該納置空間の周囲を相互に環設することを特徴とする請求項1記載の通信機筐体の放熱構造。   The heat diffusing part includes a first heat radiating part, a second heat radiating part, a third heat radiating part, a fourth heat radiating part, and a fifth heat radiating part, which are in communication with each other to form a cool area. The portion is installed on the bottom surface of the storage space and is away from the heat receiving portion direction, and the second, third, fourth, and fifth heat radiating portions described above are arranged around the storage space. The heat dissipating structure of the communication device casing according to claim 1. 前記納置空間は少なくとも1つの実装板を設置し、該発熱部品は該実装板に設置することを特徴とする請求項2もしくは3記載の通信機筐体の放熱構造。   4. The heat radiating structure for a communication device casing according to claim 2, wherein at least one mounting board is installed in the storage space, and the heat generating component is installed on the mounting board. 前記本体内には少なくとも1つの凹槽を備えて該第一導熱管ユニットを納置するのに用い、且つ該凹槽一部分は該第一凸体及び熱受部周囲に隣接し、別一部分は前述の熱拡散部及び該本体の周囲に隣接することを特徴とする請求項1記載の通信機筐体の放熱構造。   The main body is provided with at least one concave tub and used to place the first heat transfer tube unit, and a part of the concave tub is adjacent to the periphery of the first convex body and the heat receiving part, and another part is 2. The heat dissipating structure for a communication device casing according to claim 1, wherein the heat dissipating portion is adjacent to the heat diffusion portion and the periphery of the main body. 前記本体外側は複数の放熱フィンを備え、これら放熱フィンは本体の該納置空間に相反する表面に設置することを特徴とする請求項1記載の通信機筐体の放熱構造。   The heat radiating structure for a communication device casing according to claim 1, wherein the outer side of the main body includes a plurality of heat radiating fins, and the heat radiating fins are installed on a surface opposite to the storage space of the main body. 前記納置空間は、更に、
該本体の納置空間内に設置し、該実装板を支持するのに用いる少なくとも1つの支持部品と、
両実装板の間に隣接して設置し、且つ該導熱部品の両側はそれぞれ少なくとも1つの第二凸体を備え前述の実装板上の発熱部品を押さえ、前述のホットエリアを形成する少なくとも1つの導熱部品を含むことを特徴とする請求項2記載の通信機筐体の放熱構造。
The storage space further includes
At least one support component installed in the storage space of the main body and used to support the mounting plate;
At least one heat-conducting component that is installed adjacent to both the mounting boards, and that has at least one second protrusion on each side of the heat-conducting component, presses the heat-generating component on the mounting plate, and forms the hot area. The heat dissipating structure for a communication device casing according to claim 2, comprising:
前記導熱部品は、第二導熱管ユニットを含み、該第二導熱管ユニットは複数の第二導熱管を備え、各該第二導熱管は該第二凸体に隣接する第二熱吸収エンド、及び前述の第二凸体から離れる第二放熱エンドを備え、前述の熱吸収エンドは吸收した熱を該放熱エンドから前述の熱拡散部に伝導して放熱することを特徴とする請求項9記載の通信機筐体の放熱構造。   The heat transfer component includes a second heat transfer tube unit, the second heat transfer tube unit includes a plurality of second heat transfer tubes, and each of the second heat transfer tubes is adjacent to the second convex body. And a second heat dissipating end that is separated from the second convex body, wherein the heat absorbing end dissipates the heat absorbed from the heat dissipating end to the heat diffusing portion. Heat dissipating structure of communication equipment housing. 前記本体は、蓋体を対応して接続し、該蓋体の一側は該納置空間を相対し、且つ少なくとも1つの第三凸体を備え、該蓋体の別一側は該納置空間に相対し、複数の放熱フィンを設置し、前述の第三凸体は該発熱部品を押さえて突出し、前述のホットエリアを形成することを特徴とする請求項1記載の通信機筐体の放熱構造。   The main body is connected to a corresponding lid body, one side of the lid body is opposed to the placement space, and includes at least one third convex body, and the other side of the lid body is the placement space. 2. The communication device casing according to claim 1, wherein a plurality of heat radiation fins are installed opposite to the space, and the third convex body protrudes while pressing the heat generating component to form the hot area. Heat dissipation structure. 前記蓋体は、第三導熱管ユニットを備え、該第三導熱管ユニットは複数の第三導熱管を備え、各該第三導熱管は該第三凸体に隣接する第三熱吸収エンド、及び前述の第三凸体から離れる第三放熱エンドを備え、前述の第三熱吸収エンドは吸收した熱を該第三放熱エンドから、それぞれ該蓋体上の放熱フィン及び/もしくは前述の熱拡散部に伝導して放熱することを特徴とする請求項11記載の通信機筐体の放熱構造。   The lid includes a third heat transfer tube unit, the third heat transfer tube unit includes a plurality of third heat transfer tubes, and each third heat transfer tube has a third heat absorption end adjacent to the third convex body, And a third heat dissipating end away from the third convex body, and the third heat absorbing end absorbs the absorbed heat from the third heat dissipating end, respectively, and the heat dissipating fins on the lid and / or the heat dissipating member respectively. The heat dissipating structure for a communication device casing according to claim 11, wherein the heat dissipating heat is conducted to a portion.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7924565B2 (en) * 2009-05-12 2011-04-12 Asia Vital Components Co., Ltd. Heat dissipation structure for communication chassis

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7924565B2 (en) * 2009-05-12 2011-04-12 Asia Vital Components Co., Ltd. Heat dissipation structure for communication chassis

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