JP3150449B2 - Radiator - Google Patents
RadiatorInfo
- Publication number
- JP3150449B2 JP3150449B2 JP26662192A JP26662192A JP3150449B2 JP 3150449 B2 JP3150449 B2 JP 3150449B2 JP 26662192 A JP26662192 A JP 26662192A JP 26662192 A JP26662192 A JP 26662192A JP 3150449 B2 JP3150449 B2 JP 3150449B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- pipe
- radiating
- radiator
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、トランジスタ、IC等
の半導体素子(発熱体)から発生する熱を放熱するため
の放熱器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for radiating heat generated from semiconductor elements (heating elements) such as transistors and ICs.
【0002】[0002]
【従来の技術】一般に、アルミニウム製の放熱基板の一
面に複数列に亘る放熱フィンを設けると共に、他面にト
ランジスタ、IC等の半導体素子を取り付けるべき平坦
面を設けた放熱器は知られている。この種のものは、半
導体素子から発生する熱を、放熱基板、及び放熱フィン
を通じて大気に放熱するが、従来、その放熱は専ら空気
伝熱により行われている。2. Description of the Related Art Generally, a radiator is known in which a plurality of rows of radiating fins are provided on one surface of an aluminum radiating substrate and a flat surface on which semiconductor elements such as transistors and ICs are mounted on the other surface. . In this type, heat generated from the semiconductor element is radiated to the atmosphere through a radiating substrate and radiating fins, but conventionally, the heat is radiated exclusively by air heat transfer.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、従来の
構成では、例えば、電気自動車におけるモータのコント
ローラ用トランジスタなどを冷却しようとすると、その
雰囲気温度が高いことから、放熱基板自体の温度が高く
なるので、充分な放熱が行われず、熱によってトランジ
スタ(半導体素子)の機能が低下したり、寿命が短くな
ったりするなどの問題がある。However, in the conventional structure, for example, when an attempt is made to cool a transistor for a controller of a motor in an electric vehicle, the temperature of the heat radiation substrate itself becomes high because the ambient temperature is high. However, there is a problem that the function of the transistor (semiconductor element) is degraded by heat and the life is shortened due to insufficient heat radiation.
【0004】これを解決するために、従来、放熱基板の
ベースに冷媒流路を設け、そこに冷媒を流して放熱基板
自体を冷却するようにしたものが提案されている(例え
ば、実開昭55−84452号)。[0004] In order to solve this problem, there has been proposed an arrangement in which a coolant flow path is provided in a base of a radiator board, and a coolant is caused to flow through the base to cool the radiator board itself (for example, see Japanese Utility Model Application Laid-Open No. H07-163,972). 55-84452).
【0005】しかしながら、これによると、冷媒流路の
構造が複雑になるので、製造コストが高くなると共に、
放熱基板のベースは冷却されるが、放熱フィンが冷却さ
れないので、十分な放熱が行われないという問題があ
る。However, according to this, the structure of the refrigerant flow path becomes complicated, so that the manufacturing cost increases and
Although the base of the heat dissipation board is cooled, the heat dissipation fins are not cooled, so that there is a problem that sufficient heat dissipation is not performed.
【0006】そこで、本発明の目的は、上述した従来の
技術が有する問題点を解消し、低コストで、しかも放熱
効果を高めることのできる放熱器を提供することにあ
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a radiator which can solve the above-mentioned problems of the prior art, is low in cost, and can enhance the heat radiation effect.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、アルミニウム製の放熱基板の一面に複数
条に亘る放熱フィン予定部を設け、これら放熱フィン予
定部を削り起こして複数列に亘る放熱フィンを設けると
共に、上記複数条に亘る放熱フィン予定部の間に凹部を
設け、この凹部に冷媒を流すためのパイプを嵌め込み、
上記放熱基板の他面には発熱体を取り付ける平坦面を設
けたことを特徴とするものである。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a heat radiation substrate made of aluminum having a plurality of surfaces.
The heat radiation fins are provided over the ridges.
In addition to providing a plurality of rows of heat dissipating fins by shaving the fixed portion, a concave portion is formed between the plurality of heat dissipating fin scheduled portions.
Provided, fitted with a pipe for flowing the refrigerant into this recess ,
On the other side of the heat dissipation board, set a flat surface to attach a heating element.
It is characterized in that the digits.
【0008】[0008]
【作用】本発明によれば、アルミニウム製の放熱基板を
成形する際に、例えば、放熱基板のいずれかの面にパイ
プキャッチ溝などを設けておき、その後、いずれかの一
面に放熱フィンを設け、最後に、上述のパイプキャッチ
溝内に冷媒を流すためのパイプを嵌め込む。このように
組み立てられた放熱器にあっては、パイプに冷媒を流す
ことにより放熱基板だけでなく、放熱フィンが効率良く
冷却されるので、放熱フィンを通じての放熱効果が高め
られる。According to the present invention, when forming a heat dissipation board made of aluminum, for example, a pipe catch groove or the like is provided on any surface of the heat dissipation board, and then a heat dissipation fin is provided on any one surface. Finally, a pipe for flowing the refrigerant is fitted into the pipe catch groove. In the radiator thus assembled, not only the radiating substrate but also the radiating fins are efficiently cooled by flowing the refrigerant through the pipe, so that the radiating effect through the radiating fins is enhanced.
【0009】[0009]
【実施例】以下、本発明による放熱器の一実施例を図面
を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the radiator according to the present invention will be described below with reference to the drawings.
【0010】図1において、1は純アルミニウム又はア
ルミニウム合金(以下、単にアルミニウムという)製の
押出し型材からなる放熱基板を示している。In FIG. 1, reference numeral 1 denotes a heat-dissipating substrate made of an extruded member made of pure aluminum or an aluminum alloy (hereinafter, simply referred to as aluminum).
【0011】この放熱基板1の一面1aには凹凸が設け
られ、複数条に亘る凸部3は放熱フィン予定部を形成し
ている。この放熱フィン予定部3の間に形成される凹部
5には、長手方向に延びるパイプキャッチ溝7が設けら
れ、このパイプキャッチ溝7は、図2に示すように、そ
の入口が幅wのパイプ圧入部7aになっており、その奥
部がほぼ円弧状のパイプ保持部7bとなっている。The surface 1a of the heat radiating substrate 1 is provided with irregularities, and the convex portions 3 extending over a plurality of lines form heat radiating fin portions. A pipe catch groove 7 extending in the longitudinal direction is provided in the concave portion 5 formed between the heat radiating fin portions 3, and the pipe catch groove 7 has, as shown in FIG. It is a press-fitting portion 7a, and the inner portion is a substantially arc-shaped pipe holding portion 7b.
【0012】この放熱基板1の一面1aには、図3に示
すように、放熱フィン9が設けられるが、この放熱フィ
ン9は、放熱フィン予定部3をほぼ一定のピッチp、一
定の高さhで持って、規則正しく削り起こすことにより
形成される。なお、かかる工法は公知であるので、これ
以上の説明は省略する。As shown in FIG. 3, a heat radiating fin 9 is provided on one surface 1a of the heat radiating substrate 1, and the heat radiating fin 9 has a predetermined pitch p and a constant height. It is formed by holding it at h and shaving it regularly. In addition, since such a construction method is publicly known, further description is omitted.
【0013】また、この実施例によると、図3に示すよ
うに、放熱基板1の他面1bには平坦面が設けられ、こ
の平坦面1bには、トランジスタ、IC等の放熱される
べき半導体素子(発熱体)11が取り付けられる。According to this embodiment, as shown in FIG. 3, a flat surface is provided on the other surface 1b of the heat radiating substrate 1, and a semiconductor such as a transistor or an IC to be radiated heat is provided on the flat surface 1b. An element (heating element) 11 is attached.
【0014】かかる放熱器を組み立てるに際しては、放
熱基板1の放熱フィン予定部3に放熱フィン9を形成し
た後に、図3〜図5に示すように、この放熱フィン9の
列間に設けられるパイプキャッチ溝7内に冷媒を流すた
めのアルミニウム製のパイプ13を嵌め込む。このパイ
プ13は圧入治具(図示せず)等を用いて、パイプキャ
ッチ溝7内に圧入する。このパイプ13の形状は、図示
のように蛇行形としてもよいし、ループ形としてもよい
し、また互いに平行に配置して、その出入口にヘッダを
設ける構成にしてもよい。When assembling such a radiator, a radiating fin 9 is formed on the radiating fin planned portion 3 of the radiating substrate 1, and then a pipe provided between the rows of the radiating fins 9 as shown in FIGS. An aluminum pipe 13 for flowing a coolant is fitted into the catch groove 7. The pipe 13 is press-fitted into the pipe catch groove 7 using a press-fitting jig (not shown) or the like. The shape of the pipe 13 may be a meandering shape as shown in the figure, a loop shape, or a configuration in which the pipes 13 are arranged in parallel with each other and a header is provided at the entrance.
【0015】また、かかる放熱器の組み立て順序に関し
ては、まず、放熱フィン9の列間のパイプキャッチ溝7
内に冷媒を流すためのパイプ13を嵌め込んでおいて、
その後に、放熱基板1の放熱フィン予定部3に、放熱フ
ィン9を形成するようにしても良い。このパイプ13は
銅製であってもよい。Regarding the assembling order of the radiator, first, the pipe catch grooves 7 between the rows of the radiating fins 9 are arranged.
A pipe 13 for flowing a refrigerant is fitted in the inside,
After that, the radiating fins 9 may be formed on the radiating fin portions 3 of the radiating substrate 1. This pipe 13 may be made of copper.
【0016】このように構成すると、発熱体11の発生
する熱は、放熱基板1及び放熱フィン3を通じて空気伝
導により放熱される。With this configuration, the heat generated by the heating element 11 is radiated through the heat dissipation board 1 and the heat dissipation fins 3 by air conduction.
【0017】しかも、この実施例によれば、パイプ13
内を冷媒循環させることにより、この冷媒により、放熱
基板1自体が冷却されるので、仮に、電気自動車におけ
るモータのコントローラ用トランジスタなどを冷却する
ような、雰囲気温度の高い悪条件の下でも、効率の良い
放熱が行われる。したがって、平坦面1bに取り付けら
れる半導体素子11などの寿命を向上させることができ
る。Moreover, according to this embodiment, the pipe 13
By circulating the refrigerant through the inside, the heat radiation substrate 1 itself is cooled by the refrigerant, so that the efficiency can be improved even under a bad condition of high ambient temperature such as cooling a transistor for a controller of a motor in an electric vehicle. Good heat radiation is performed. Therefore, the life of the semiconductor element 11 and the like attached to the flat surface 1b can be improved.
【0018】また、この実施例によると、パイプ13の
取り付け位置が放熱フィン3の列間になっており、パイ
プ13間を冷媒循環させると、放熱基板1だけでなく放
熱フィン3も直接冷却される構成になっているので、従
来のものに比べて、とくに放熱効率を向上させることが
できる。Further, according to this embodiment, the mounting position of the pipes 13 is between the rows of the radiating fins 3. When the refrigerant is circulated between the pipes 13, not only the radiating fins 3 but also the radiating fins 3 are directly cooled. With this configuration, the heat radiation efficiency can be particularly improved as compared with the conventional configuration.
【0019】さらに、この実施例によると、放熱基板1
にパイプ13を溶接するわけではなく、放熱基板1のパ
イプキャッチ溝7内に冷媒を流すためのパイプ13を嵌
め込むだけで組み立てられるので、その製造コストを抑
えることができる。Further, according to this embodiment, the heat dissipation board 1
Since the pipe 13 for flowing the coolant is inserted into the pipe catch groove 7 of the heat dissipation board 1 without fitting the pipe 13 to the heat sink 1, the manufacturing cost can be reduced.
【0020】以上、一実施例に基づいて本発明を説明し
たが、本発明はこれに限定されるものでないことは明ら
かである。Although the present invention has been described based on one embodiment, it is apparent that the present invention is not limited to this.
【0021】例えば、パイプキャッチ溝7であるが、こ
の溝7は、その位置が放熱フィン3の列間であれば、放
熱基板1の平坦面1b側から溝加工する事も可能であ
る。For example, the pipe catch groove 7 can be formed from the flat surface 1b side of the heat radiating substrate 1 if the groove 7 is located between the rows of the heat radiating fins 3.
【0022】[0022]
【発明の効果】以上の説明から明らかなように、本発明
によれば、放熱基板に設けられる放熱フィンの列間に冷
媒を流すためのパイプが設けられるので、パイプに冷媒
を流すことにより、放熱基板だけでなく、放熱フィンも
効率良く冷却されるので、放熱器の放熱効率を向上させ
ることができる。As is apparent from the above description, according to the present invention, a pipe for flowing a refrigerant is provided between rows of radiating fins provided on a radiating substrate. Since not only the heat dissipation board but also the heat dissipation fins are efficiently cooled, the heat dissipation efficiency of the radiator can be improved.
【図1】本発明による放熱基板を示す斜視図である。FIG. 1 is a perspective view showing a heat dissipation board according to the present invention.
【図2】同じくパイプキャッチ溝7を示す斜視図であ
る。FIG. 2 is a perspective view showing a pipe catch groove 7;
【図3】本発明による放熱器の一実施例を示す側面図で
ある。FIG. 3 is a side view showing one embodiment of a radiator according to the present invention.
【図4】同じく平面図である。FIG. 4 is a plan view of the same.
【図5】同じく端面図である。FIG. 5 is also an end view.
1 放熱基板 1a 一面 3 凸部 5 凹部 7 パイプキャッチ溝 9 放熱フィン 11 半導体素子(発熱体) 13 パイプ DESCRIPTION OF SYMBOLS 1 Heat dissipation board 1a One surface 3 Convex part 5 Concave part 7 Pipe catch groove 9 Heat dissipation fin 11 Semiconductor element (heating element) 13 Pipe
Claims (1)
条に亘る放熱フィン予定部を設け、これら放熱フィン予
定部を削り起こして複数列に亘る放熱フィンを設けると
共に、上記複数条に亘る放熱フィン予定部の間に凹部を
設け、この凹部に冷媒を流すためのパイプを嵌め込み、
上記放熱基板の他面には発熱体を取り付ける平坦面を設
けたことを特徴とする放熱器。1. A plurality of aluminum heat radiating substrates are provided on one surface.
The heat radiation fins are provided over the ridges.
In addition to providing a plurality of rows of heat dissipating fins by shaving the fixed portion, a concave portion is formed between the plurality of heat dissipating fin scheduled portions.
Provided, fitted with a pipe for flowing the refrigerant into this recess ,
On the other side of the heat dissipation board, set a flat surface to attach a heating element.
Radiator, characterized in that digit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26662192A JP3150449B2 (en) | 1992-09-09 | 1992-09-09 | Radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26662192A JP3150449B2 (en) | 1992-09-09 | 1992-09-09 | Radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0697337A JPH0697337A (en) | 1994-04-08 |
JP3150449B2 true JP3150449B2 (en) | 2001-03-26 |
Family
ID=17433363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26662192A Expired - Fee Related JP3150449B2 (en) | 1992-09-09 | 1992-09-09 | Radiator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3150449B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015535203A (en) * | 2012-11-07 | 2015-12-10 | ユニバインド リミテッド | Method for binding a bundle of paper sheets, a book or map produced by the method, a bundle of paper sheets, and a method and apparatus for forming the bundle of paper sheets |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4323116B2 (en) * | 2001-07-12 | 2009-09-02 | 株式会社明電舎 | heatsink |
US8091614B2 (en) * | 2006-11-10 | 2012-01-10 | International Business Machines Corporation | Air/fluid cooling system |
-
1992
- 1992-09-09 JP JP26662192A patent/JP3150449B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015535203A (en) * | 2012-11-07 | 2015-12-10 | ユニバインド リミテッド | Method for binding a bundle of paper sheets, a book or map produced by the method, a bundle of paper sheets, and a method and apparatus for forming the bundle of paper sheets |
KR101924680B1 (en) * | 2012-11-07 | 2019-02-20 | 유니바인드 리미티드 | Method for binding a bundle of leaves, a bundle of leaves, method and device for forming such a bundle of leaves |
Also Published As
Publication number | Publication date |
---|---|
JPH0697337A (en) | 1994-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |