JP3147172U - Coil integrated DC / DC converter - Google Patents
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- JP3147172U JP3147172U JP2008007010U JP2008007010U JP3147172U JP 3147172 U JP3147172 U JP 3147172U JP 2008007010 U JP2008007010 U JP 2008007010U JP 2008007010 U JP2008007010 U JP 2008007010U JP 3147172 U JP3147172 U JP 3147172U
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Abstract
【課題】基板への実装作業を円滑に行い得るとともに、放熱性も向上させることができ、さらに小型化にも資することができるコイル一体型のＤＣ／ＤＣコンバータを提供する。
【解決手段】ＩＣチップ２と、外付けのコイル１とを一体化したコイル一体型のＤＣ／ＤＣコンバータであって、コイル１は、相対向して配設されるとともに実装時には基板４にそれぞれ接続される端子部１ａ，１ｂと、両端部が端子部１ａ，１ｂにそれぞれ接続されたコイル導体と、コイル導体を封止するとともに端子部１ａ，１ｂ間に配設された磁気封止部材１ｃと、端子部１ａ，１ｂ間に形成された凹部１ｄとを有する一方、ＩＣチップ２は実装時に基板に接続するための複数の電極２ａ乃至２ｆをその裏面に有して凹部１ｄに嵌め込まれている。
【選択図】 図１Provided is a coil-integrated DC / DC converter capable of smoothly mounting on a substrate, improving heat dissipation, and contributing to downsizing.
A coil-integrated DC / DC converter in which an IC chip 2 and an external coil 1 are integrated. The coils 1 are arranged opposite to each other and mounted on a substrate 4 at the time of mounting. Terminal portions 1a and 1b to be connected, coil conductors whose both ends are connected to the terminal portions 1a and 1b, and a magnetic sealing member 1c that seals the coil conductor and is disposed between the terminal portions 1a and 1b. And the recess 1d formed between the terminal portions 1a and 1b, while the IC chip 2 has a plurality of electrodes 2a to 2f on its back surface for fitting to the substrate during mounting and is fitted in the recess 1d. Yes.
[Selection] Figure 1
Description
本考案はコイル一体型のＤＣ／ＤＣコンバータに関し、特にＤＣ／ＤＣコンバータの本体である電子回路部分が形成されたＩＣチップとこのＩＣチップに対する外付け部品であるコイルとを一体化する場合に適用して有用なものである。 The present invention relates to a coil-integrated DC / DC converter, and is particularly applicable to the case where an IC chip on which an electronic circuit portion that is a main body of a DC / DC converter is formed and a coil that is an external component for the IC chip are integrated. It is useful.
コイル一体型のＤＣ／ＤＣコンバータは、本体となる電子回路部分をモールド部材でモールドして形成したＩＣチップと、このＩＣチップに対する外付け部品であるコイルとを一体化したものである。従来技術に係るこの種のコイル一体型のＤＣ／ＤＣコンバータは、通常ＩＣチップよりもコイルが大きいため、コイル上にＩＣチップを搭載する形で一体化している（特許文献１参照）。 The coil-integrated DC / DC converter is obtained by integrating an IC chip formed by molding an electronic circuit portion as a main body with a molding member and a coil as an external component for the IC chip. Since this type of coil-integrated DC / DC converter according to the prior art usually has a larger coil than an IC chip, the DC / DC converter is integrated by mounting an IC chip on the coil (see Patent Document 1).
この場合、当該ＤＣ／ＤＣコンバータを基板に実装するにはコイルを直接基板に接触させている（特許文献１参照）。このため、コイルの表面には、ＩＣチップから実装基板に向かう配線を形成する必要があり構造が複雑になるという問題がある。また、ＩＣチップはコイルの上面に搭載することになるので、実装基板からの距離が離れてしまう。この結果、ＩＣチップの放熱性にも問題がある。 In this case, in order to mount the DC / DC converter on the substrate, the coil is brought into direct contact with the substrate (see Patent Document 1). For this reason, it is necessary to form a wiring from the IC chip to the mounting substrate on the surface of the coil, and there is a problem that the structure becomes complicated. Further, since the IC chip is mounted on the upper surface of the coil, the distance from the mounting substrate is increased. As a result, there is a problem with the heat dissipation of the IC chip.
一方、インダクタチップの裏面側に電源ＩＣチップの裏面を接着剤で固着するものも提案されている（特許文献２参照）。当該デバイスは、さらにインダクタチップの第２外部電極に形成したボール形状の導電部材の高さと電源ＩＣチップの端子電極に固着した半田の高さを揃えることでプリント基板への固着を確実に行って電源ＩＣチップの金属配線をプリント基板の配線パターンに直接接続している。この結果、良好な熱放散特性を得ている。 On the other hand, there has been proposed one in which the back surface of the power IC chip is fixed to the back surface side of the inductor chip with an adhesive (see Patent Document 2). In this device, the height of the ball-shaped conductive member formed on the second external electrode of the inductor chip and the height of the solder fixed to the terminal electrode of the power supply IC chip are aligned to ensure the fixing to the printed circuit board. The metal wiring of the power supply IC chip is directly connected to the wiring pattern of the printed board. As a result, good heat dissipation characteristics are obtained.
ところが、特許文献２に開示する技術ではインダクタチップと電源ＩＣチップにそれぞれ高さが異なるボール形状の導電部材を付ける必要がある。この結果、両方のボール形状の導電部材の高さを調節するのが面倒なため、実装の際の作業性に難がある。また、コイル一体型のＤＣ／ＤＣコンバータとしては厚さ方向の寸法を縮小することができず、小型化を図る上でも難がある。 However, in the technique disclosed in Patent Document 2, it is necessary to attach ball-shaped conductive members having different heights to the inductor chip and the power supply IC chip. As a result, it is troublesome to adjust the heights of both ball-shaped conductive members, so that the workability during mounting is difficult. In addition, the coil-integrated DC / DC converter cannot be reduced in size in the thickness direction, and is difficult to reduce in size.
本考案は、上記従来技術に鑑み、基板への実装作業を円滑に行い得るとともに、放熱性も向上させることができ、さらに小型化にも資することができるコイル一体型のＤＣ／ＤＣコンバータを提供することを目的とする。 In view of the above-described conventional technology, the present invention provides a coil-integrated DC / DC converter capable of smoothly mounting on a substrate, improving heat dissipation, and contributing to downsizing. The purpose is to do.
上記目的を達成するための本考案の第１の態様は、
ＤＣ／ＤＣコンバータの本体である電子回路部分が形成されているＩＣチップと、このＩＣチップに対する外付け部品であるコイルとを一体化したコイル一体型のＤＣ／ＤＣコンバータであって、
前記コイルは、相対向して配設されるとともに実装時には基板にそれぞれ接続される端子部と、両端部が前記端子部にそれぞれ接続されたコイル導体と、前記コイル導体を封止するとともに前記端子部間に配設された磁気封止部材（フェライト）と、前記端子部間に形成された凹部とを有する一方、
前記ＩＣチップは実装時に基板に接続するための複数の電極をその表面に有して前記凹部に嵌め込まれていることを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
In order to achieve the above object, the first aspect of the present invention provides:
A DC / DC converter integrated with a coil, in which an IC chip on which an electronic circuit part that is a main body of a DC / DC converter is formed and a coil that is an external component for the IC chip are integrated.
The coils are arranged opposite to each other and connected to a substrate at the time of mounting, coil conductors whose both ends are connected to the terminal portions, and the coil conductors are sealed and the terminals While having a magnetic sealing member (ferrite) disposed between the parts, and a recess formed between the terminal parts,
The IC chip is a coil-integrated DC / DC converter characterized in that a plurality of electrodes for connecting to a substrate at the time of mounting are provided on the surface and fitted into the recess.
本考案の第２の態様は、
第１の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記凹部は前記磁気封止部材に形成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The second aspect of the present invention is
In the coil-integrated DC / DC converter described in the first aspect,
The concave portion is formed in the magnetic sealing member, and the coil-integrated DC / DC converter is provided.
本考案の第３の態様は、
第１の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記凹部は前記磁気封止部材の厚さよりも同方向における前記端子部の寸法を長く形成することにより形成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The third aspect of the present invention is
In the coil-integrated DC / DC converter described in the first aspect,
The concave portion is formed by forming a dimension of the terminal portion in the same direction longer than the thickness of the magnetic sealing member, and is a coil-integrated DC / DC converter.
本考案の第４の態様は、
第１の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記ＩＣチップは前記電子回路部分がモールド部材でモールドされており、前記モールド部材の表面には前記電極とともに放熱用の放熱プレートが形成され、さらに前記凹部に嵌め込んだ状態でその表面と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The fourth aspect of the present invention is
In the coil-integrated DC / DC converter described in the first aspect,
In the IC chip, the electronic circuit portion is molded with a mold member, and a heat dissipation plate for heat dissipation is formed on the surface of the mold member together with the electrode, and the surface and the terminal are fitted in the recess. The coil-integrated DC / DC converter is configured so that a surface of the portion in contact with the substrate is flush with the substrate.
本考案の第５の態様は、
第２の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記ＩＣチップは前記電子回路部分がモールド部材でモールドされており、前記モールド部材の表面には前記電極とともに放熱用の放熱プレートが形成され、さらに前記凹部に嵌め込んだ状態でその表面と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The fifth aspect of the present invention is
In the coil-integrated DC / DC converter described in the second aspect,
In the IC chip, the electronic circuit portion is molded with a mold member, and a heat dissipation plate for heat dissipation is formed on the surface of the mold member together with the electrode, and the surface and the terminal are fitted in the recess. The coil-integrated DC / DC converter is configured so that a surface of the portion in contact with the substrate is flush with the substrate.
本考案の第６の態様は、
第３の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記ＩＣチップは前記電子回路部分がモールド部材でモールドされており、前記モールド部材の表面には前記電極とともに放熱用の放熱プレートが形成され、さらに前記凹部に嵌め込んだ状態でその表面と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The sixth aspect of the present invention is
In the coil-integrated DC / DC converter described in the third aspect,
In the IC chip, the electronic circuit portion is molded with a mold member, and a heat dissipation plate for heat dissipation is formed on the surface of the mold member together with the electrode, and the surface and the terminal are fitted in the recess. The coil-integrated DC / DC converter is configured so that a surface of the portion in contact with the substrate is flush with the substrate.
本考案の第７の態様は、
第１の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記ＩＣチップは基板に前記電子回路部分を形成した状態で前記電極にボール形状の導電部材を付着させてなり、前記ボール形状の導電部材の先端と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The seventh aspect of the present invention is
In the coil-integrated DC / DC converter described in the first aspect,
The IC chip is formed by attaching a ball-shaped conductive member to the electrode in a state where the electronic circuit portion is formed on a substrate, and a tip of the ball-shaped conductive member and a surface of the terminal portion in contact with the substrate. A coil integrated DC / DC converter characterized by being configured to be unity.
本考案の第８の態様は、
第２の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記ＩＣチップは基板に前記電子回路部分を形成した状態で前記電極にボール形状の導電部材を付着させてなり、前記基板に実装時に前記ボール形状の導電部材の先端と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The eighth aspect of the present invention is
In the coil-integrated DC / DC converter described in the second aspect,
The IC chip is formed by attaching a ball-shaped conductive member to the electrode in a state where the electronic circuit portion is formed on the substrate, and the tip of the ball-shaped conductive member and the substrate of the terminal portion when mounted on the substrate A DC / DC converter integrated with a coil, characterized in that the surface is in contact with the surface.
本考案の第９の態様は、
第３の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記ＩＣチップは基板に前記電子回路部分を形成した状態で前記電極にボール形状の導電部材を付着させてなり、前記ボール形状の導電部材の先端と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The ninth aspect of the present invention is
In the coil-integrated DC / DC converter described in the third aspect,
The IC chip is formed by attaching a ball-shaped conductive member to the electrode in a state where the electronic circuit portion is formed on a substrate, and a tip of the ball-shaped conductive member and a surface of the terminal portion in contact with the substrate. A coil integrated DC / DC converter characterized by being configured to be unity.
本考案の第１０の態様は、
第２の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記コイル導体はその軸方向が前記端子部間を結ぶ直線に対し直交するように巻回されていることを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The tenth aspect of the present invention is
In the coil-integrated DC / DC converter described in the second aspect,
The coil conductor is a coil-integrated DC / DC converter, wherein the coil conductor is wound so that an axial direction thereof is orthogonal to a straight line connecting the terminal portions.
本考案の第１１の態様は、
第５の態様に記載するコイル一体型のＤＣ／ＤＣコンバータにおいて、
前記コイル導体はその軸方向が前記端子部間を結ぶ直線に対し直交するように巻回されていることを特徴とするコイル一体型のＤＣ／ＤＣコンバータにある。
The eleventh aspect of the present invention is
In the coil-integrated DC / DC converter described in the fifth aspect,
The coil conductor is a coil-integrated DC / DC converter, wherein the coil conductor is wound so that an axial direction thereof is orthogonal to a straight line connecting the terminal portions.
本考案によればＩＣチップをコイルに設けた凹部に嵌め込むことができるので、全体の占有空間を可及的に縮小することができる。ここで、コイルの端子部及びＩＣチップの各電極はそれぞれ直接基板に接続するように構成しているので、コイルとＩＣチップ間の接続は基板の配線パターンを利用して行うことができる。したがって、コイル及びＩＣチップはそれぞれの本質的な機能に関連する構成のみを備えていれば良い。すなわち、コイルとＩＣチップを接続するための配線等を備える必要がなく、その分簡素な構成とすることができる。 According to the present invention, since the IC chip can be fitted into the recess provided in the coil, the entire occupied space can be reduced as much as possible. Here, since the terminal portion of the coil and each electrode of the IC chip are configured to be directly connected to the substrate, the connection between the coil and the IC chip can be made using the wiring pattern of the substrate. Therefore, the coil and the IC chip need only have a configuration related to their essential functions. That is, it is not necessary to provide wiring or the like for connecting the coil and the IC chip, and the configuration can be simplified accordingly.
以下、本考案の実施の形態を図面に基づき詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
＜第１の実施の形態＞
図１は本考案の第１の実施の形態に係るコイル一体型のＤＣ／ＤＣコンバータを示す図で、（ａ）がその平面図、（ｂ）がその正面図、（ｃ）がその裏面図、（ｄ）がその側面図である。これらの図に示すように、本形態に係るコイル一体型のＤＣ／ＤＣコンバータＩは外付けコイル１とＩＣチップ２とを一体化したものである。ここで、コイル１は相対向して配設されるとともに実装時には基板４にそれぞれ接続される端子部１ａ，１ｂと、両端部が端子部１ａ，１ｂにそれぞれ接続されたコイル導体（図示せず;以下同じ）と、コイル導体を封止するとともに端子部１ａ，１ｂ間に配設された磁気封止部材（フェライト）１ｃとを有する。ここで、端子部１ａ，１ｂ間には凹部１ｄが形成してある。さらに詳言すると本形態における凹部１ｄは端子部１ａ，１ｂの間で、磁気封止部材１ｃを下方から削り込んで形成してある。かかる切削加工は磁気封止部材１ｃで封止するコイル導体が縦軸型である場合に特に容易に行うことができる。図１中の上下方向の寸法に余裕があり、その分磁気封止部材１ｃの削り代に余裕があるからである。なお、縦軸型とはコイル導体の軸方向が端子部１ａ，１ｂ間を結ぶ直線に対して直交するように巻回されているもの、すなわち垂直軸回りに巻回されているものをいう。これに対し、水平軸回りに巻回されているものを横軸型という。この種のコイル一体型のＤＣ／ＤＣコンバータのコイルとしては横軸型が多く使用されている。横軸型は上下方向の寸法に余裕がない場合が多いので、前述の如く凹部１ｄを、磁気封止部材１ｃを削り込んで形成するのには向いていない。
<First Embodiment>
1A and 1B are views showing a coil-integrated DC / DC converter according to a first embodiment of the present invention. FIG. 1A is a plan view thereof, FIG. 1B is a front view thereof, and FIG. (D) is a side view thereof. As shown in these drawings, the coil-integrated DC / DC converter I according to this embodiment is obtained by integrating an external coil 1 and an IC chip 2. Here, the coil 1 is disposed so as to face each other and at the time of mounting, terminal portions 1a and 1b connected to the substrate 4 respectively, and a coil conductor (not shown) having both ends connected to the terminal portions 1a and 1b, respectively. The same applies hereinafter) and a magnetic sealing member (ferrite) 1c disposed between the terminal portions 1a and 1b while sealing the coil conductor. Here, a recess 1d is formed between the terminal portions 1a and 1b. More specifically, the recess 1d in the present embodiment is formed by cutting the magnetic sealing member 1c from below between the terminal portions 1a and 1b. Such cutting can be performed particularly easily when the coil conductor sealed with the magnetic sealing member 1c is of the vertical axis type. This is because there is a margin in the vertical dimension in FIG. 1, and there is a margin in the machining allowance of the magnetic sealing member 1c. The vertical axis type means that the coil conductor is wound so that the axial direction of the coil conductor is orthogonal to the straight line connecting the terminal portions 1a and 1b, that is, wound around the vertical axis. On the other hand, what is wound around the horizontal axis is called a horizontal axis type. A horizontal axis type is often used as a coil of this type of coil-integrated DC / DC converter. Since the horizontal axis type often has no allowance in the vertical dimension, it is not suitable for forming the recess 1d by cutting the magnetic sealing member 1c as described above.
ＩＣチップ２には当該ＤＣ／ＤＣコンバータＩの本体である電子回路部分が形成されており、実装時に基板に接続するための複数（本形態では６個）の電極２ａ，２ｂ，２ｃ，２ｄ，２ｅ，２ｆ及び放熱用の放熱プレート３をその裏面に有している。また、本形態におけるＩＣチップ２は前記電子回路部分が樹脂のモールド部材でモールドされている。このようにモールドされたＩＣチップ２を凹部１ｄに嵌め込んでコイル１と一体化している。かかる一体化状態では、ＩＣチップ２の裏面と端子部１ａ，１ｂの基板４と接する面とが面一になる。 The IC chip 2 is formed with an electronic circuit portion which is the main body of the DC / DC converter I, and a plurality (six in this embodiment) of electrodes 2a, 2b, 2c, 2d, 2e, 2f and a heat radiation plate 3 for heat radiation are provided on the back surface. Further, in the IC chip 2 in this embodiment, the electronic circuit portion is molded with a resin molding member. The IC chip 2 molded in this way is fitted into the recess 1 d and integrated with the coil 1. In such an integrated state, the back surface of the IC chip 2 and the surface in contact with the substrate 4 of the terminal portions 1a and 1b are flush with each other.
図２は本形態に係るコイル一体型のＤＣ／ＤＣコンバータの組立工程を示す斜視図である。同図（ａ）は磁気封止部材１ｃを削り込んで凹部１ｄを形成した状態のコイル１を示している。かかるコイル１の凹部１ｄに下方から図２（ｂ）に示すＩＣチップ２を嵌め込んで接着剤（図示せず）で仮固定する。この結果図２（ｃ）に示すように、ＩＣチップ２の裏面と端子部１ａ，１ｂの基板４と接する面とが面一になった状態でコイル１とＩＣチップ２とが一体化される。 FIG. 2 is a perspective view showing an assembling process of the coil-integrated DC / DC converter according to this embodiment. FIG. 2A shows the coil 1 in a state where the magnetic sealing member 1c is cut to form a recess 1d. The IC chip 2 shown in FIG. 2B is fitted into the recess 1d of the coil 1 from below and temporarily fixed with an adhesive (not shown). As a result, as shown in FIG. 2C, the coil 1 and the IC chip 2 are integrated with the back surface of the IC chip 2 and the surface of the terminal portions 1a and 1b in contact with the substrate 4 being flush with each other. .
かかる本形態によれば、既存のコイル１の磁気封止部材１ｃを切削して凹部１ｄを形成し、この凹部１ｄにＩＣチップ２を嵌め込んでいるので、当該ＤＣ／ＤＣコンバータの可及的な小型化を実現し得る。また、一体化した状態においては、ＩＣチップ２の裏面の電極２ａ乃至２ｆと端子部１ａ，１ｂの基板４と接する面とが面一になっているので、基板４への実装の際、特別な高さ調整の必要もなく所定の実装作業を容易且つ迅速に行うことができる。さらに、実装時に放熱プレート３を基板４に接触させることができるので、ＩＣチップ２で発生した熱の放熱も良好に行わせることができる。 According to this embodiment, the magnetic sealing member 1c of the existing coil 1 is cut to form the concave portion 1d, and the IC chip 2 is fitted into the concave portion 1d, so that the DC / DC converter is as possible as possible. Miniaturization can be realized. In the integrated state, the electrodes 2a to 2f on the back surface of the IC chip 2 and the surfaces of the terminal portions 1a and 1b that are in contact with the substrate 4 are flush with each other. A predetermined mounting operation can be performed easily and quickly without the need for height adjustment. Furthermore, since the heat radiating plate 3 can be brought into contact with the substrate 4 at the time of mounting, the heat generated in the IC chip 2 can be radiated well.
＜第２の実施の形態＞
図３及び図４は本考案の第２の実施の形態に係るコイル一体型のＤＣ／ＤＣコンバータII，IIIをそのコイル及びＩＣチップを分離した状態で示す斜視図である。これらの図に示すように、コイル１１，１２の各端子部は下方に伸びる脚部（１１ａ，１１ｂ），（１２ａ，１２ｂ）を有しており、これら脚部（１１ａ，１１ｂ），（１２ａ，１２ｂ）間における磁気封止部材１１ｃ，１２ｃの下方の空間が凹部１１ｄ，１２ｄを形成している。すなわち、凹部１１ｄ及び１２ｄは磁気封止部材１１ｃ及び１２ｄの厚さよりも同方向（図中の上下方向）における端子部の寸法を長く形成したものである。
<Second Embodiment>
3 and 4 are perspective views showing the coil integrated DC / DC converters II and III according to the second embodiment of the present invention in a state where the coil and the IC chip are separated. As shown in these drawings, each terminal portion of the coils 11 and 12 has legs (11a, 11b) and (12a and 12b) extending downward, and these legs (11a and 11b) and (12a). , 12b), the space below the magnetic sealing members 11c, 12c forms the recesses 11d, 12d. That is, the recesses 11d and 12d are formed by making the dimensions of the terminal portions in the same direction (vertical direction in the drawing) longer than the thickness of the magnetic sealing members 11c and 12d.
図１に示すものと同一構成のＩＣチップ２は各凹部１１ｄ及び１２ｄに嵌め込んで脚部（１１ａ，１１ｂ），（１２ａ，１２ｂ）間で挟持する。 The IC chip 2 having the same configuration as that shown in FIG. 1 is fitted into the recesses 11d and 12d and sandwiched between the legs (11a, 11b) and (12a, 12b).
かかる本形態においても、一体化した状態においてはＩＣチップ２の裏面の電極２ａ乃至２ｆと端子部１ａ，１ｂの基板４と接する面とが面一になっているので、基板４への実装の際、特別な高さ調整の必要もなく所定の実装作業を容易且つ迅速に行うことができ、また実装時に放熱プレート３を基板４に接触させることができるので、ＩＣチップ２で発生した熱の放熱も良好に行わせることができる。本形態は、磁気封止部材１１ｃ及び１２ｃの下面を切削する必要がないので、このような切削加工が困難な場合、例えば横軸型のコイル導体を用いる場合に適用して効果的なものとなる。 Also in this embodiment, in the integrated state, the electrodes 2a to 2f on the back surface of the IC chip 2 and the surfaces of the terminal portions 1a and 1b in contact with the substrate 4 are flush with each other. At this time, a predetermined mounting operation can be performed easily and quickly without the need for special height adjustment, and since the heat radiating plate 3 can be brought into contact with the substrate 4 at the time of mounting, the heat generated in the IC chip 2 can be reduced. Heat radiation can be performed well. Since this embodiment does not require cutting of the lower surfaces of the magnetic sealing members 11c and 12c, it is effective when applied to the case where such cutting is difficult, for example, when a horizontal axis type coil conductor is used. Become.
＜第３の実施の形態＞
図５は本考案の第３の実施の形態に係るコイル一体型のＤＣ／ＤＣコンバータIVを示す正面図である。同図中図１と同一部分には同一番号を付し、重複する説明は省略する。
<Third Embodiment>
FIG. 5 is a front view showing a coil-integrated DC / DC converter IV according to a third embodiment of the present invention. The same parts in FIG. 1 as those in FIG.
本形態におけるＩＣチップ２２はシリコン基板にＤＣ／ＤＣコンバータの電子回路部分を形成した状態で各電極にボール形状の導電部材５を付着させてある。すなわち、全体をモールド部材でモールドすることなくＤＣ／ＤＣコンバータとしての電子回路部分のみを形成したものである。かかるＩＣチップ２２も図１と同構成のコイル１に形成した凹部１ｄに嵌め込まれている。かくして、基板４に実装した際、導電部材５の先端と端子部１ａ、１ｂの基板４と接する面とが面一になるように構成してある。このように実装時にボール形状の導電部材５の先端と端子部１ａ、１ｂの基板４と接する面とが面一になるように構成するためには、例えば磁気封止部材１ｃに形成する凹部１ｄの切削深さを調整すれば良い。かかる調整により、実装前においては、実装時に基板４に接触する端子部１ａ，１ｂの下面を結ぶ直線よりも導電部材５の先端が若干突出するようにしておく。このときの突出部分で実装時における基板４との電気的な接触を十分なものとすることができる。ここで、ボール形状の導電部材としては、例えば半田ボールを好適に適用し得る。 In this embodiment, the IC chip 22 has a ball-shaped conductive member 5 attached to each electrode in a state where an electronic circuit portion of a DC / DC converter is formed on a silicon substrate. That is, only the electronic circuit portion as a DC / DC converter is formed without molding the whole with a molding member. Such an IC chip 22 is also fitted in a recess 1d formed in the coil 1 having the same configuration as in FIG. Thus, when mounted on the substrate 4, the end of the conductive member 5 and the surface of the terminal portions 1 a and 1 b in contact with the substrate 4 are configured to be flush with each other. In this way, in order to configure the tip of the ball-shaped conductive member 5 and the surface of the terminal portions 1a, 1b in contact with the substrate 4 at the time of mounting to be flush with each other, for example, a recess 1d formed in the magnetic sealing member 1c. What is necessary is just to adjust the cutting depth. By this adjustment, before mounting, the tip of the conductive member 5 is slightly protruded from a straight line connecting the lower surfaces of the terminal portions 1a and 1b that contact the substrate 4 during mounting. The protruding portion at this time can make sufficient electrical contact with the substrate 4 during mounting. Here, as the ball-shaped conductive member, for example, a solder ball can be suitably applied.
かかる本形態においても、既存のコイル１の磁気封止部材１ｃを切削して凹部１ｄを形成し、この凹部１ｄにＩＣチップ２２を嵌め込んでいるので、当該ＤＣ／ＤＣコンバータの可及的な小型化を実現し得る。また、一体化した状態においては、ＩＣチップ２２の各電極に付着する導電部材５と端子部１ａ，１ｂの基板４と接する面とが面一になっているので、基板４への実装の際、特別な高さ調整の必要もなく所定の実装作業を容易且つ迅速に行うことができる。 Also in this embodiment, the magnetic sealing member 1c of the existing coil 1 is cut to form the recess 1d, and the IC chip 22 is fitted into the recess 1d. Miniaturization can be realized. In the integrated state, the conductive member 5 attached to each electrode of the IC chip 22 is flush with the surface of the terminal portions 1a and 1b that are in contact with the substrate 4; The predetermined mounting operation can be easily and quickly performed without the need for special height adjustment.
＜他の実施の形態＞
上記第２の実施の形態に係るコイル一体型のＤＣ／ＤＣコンバータII,IIIにおけるＩＣチップ２はその本体である電子回路部分を樹脂のモールド部材でモールドしたものであるが、かかるＩＣチップ２に替えて上記第３の実施の形態におけるＩＣチップ２２を用いることもできる。
<Other embodiments>
The IC chip 2 in the coil integrated DC / DC converters II and III according to the second embodiment is obtained by molding an electronic circuit portion as a main body with a resin molding member. Instead, the IC chip 22 in the third embodiment can also be used.
このように、ＩＣチップ２２と磁気封止部材１１ｃ及び１２ｃとを組み合わせた場合でも第３の実施の形態と同様の作用・効果を得る。 Thus, even when the IC chip 22 and the magnetic sealing members 11c and 12c are combined, the same operation and effect as in the third embodiment are obtained.
本考案は電池で動作する携帯機器の電源を製造・販売する産業分野で利用することができる。 The present invention can be used in an industrial field in which a power source of a portable device operated by a battery is manufactured and sold.
１，１１ コイル
１ａ，１ｂ 端子部
１ｃ，１１ｃ 磁気封止部材
１ｄ，１１ｄ 凹部
２，２２ チップ
２ａ乃至２ｆ 電極
３ 放熱プレート
４ 基板
５ 導電部材
１１ａ乃至１２ｂ 脚部
DESCRIPTION OF SYMBOLS 1,11 Coil 1a, 1b Terminal part 1c, 11c Magnetic sealing member 1d, 11d Recessed part 2,22 Chip 2a thru | or 2f Electrode 3 Heat radiating plate 4 Board | substrate 5 Conductive member 11a thru | or 12b Leg part
Claims (11)
前記コイルは、相対向して配設されるとともに実装時には基板にそれぞれ接続される端子部と、両端部が前記端子部にそれぞれ接続されたコイル導体と、前記コイル導体を封止するとともに前記端子部間に配設された磁気封止部材と、前記端子部間に形成された凹部とを有する一方、
前記ＩＣチップは実装時に基板に接続するための複数の電極をその表面に有して前記凹部に嵌め込まれていることを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 A DC / DC converter integrated with a coil, in which an IC chip on which an electronic circuit part that is a main body of a DC / DC converter is formed and a coil that is an external component for the IC chip are integrated.
The coils are arranged opposite to each other and connected to a substrate at the time of mounting, coil conductors whose both ends are connected to the terminal portions, and the coil conductors are sealed and the terminals While having a magnetic sealing member disposed between the parts, and a recess formed between the terminal parts,
The IC chip has a plurality of electrodes on its surface for connection to a substrate at the time of mounting, and is fitted in the recess, and is a DC / DC converter integrated with a coil.
前記凹部は前記磁気封止部材に形成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 1,
The coil-integrated DC / DC converter, wherein the recess is formed in the magnetic sealing member.
前記凹部は前記磁気封止部材の厚さよりも同方向における前記端子部の寸法を長く形成することにより形成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 1,
The coil-integrated DC / DC converter characterized in that the recess is formed by forming a dimension of the terminal portion in the same direction longer than the thickness of the magnetic sealing member.
前記ＩＣチップは前記電子回路部分がモールド部材でモールドされており、前記モールド部材の表面には前記電極とともに放熱用の放熱プレートが形成され、さらに前記凹部に嵌め込んだ状態でその表面と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 1,
In the IC chip, the electronic circuit portion is molded with a mold member, and a heat dissipation plate for heat dissipation is formed on the surface of the mold member together with the electrode, and the surface and the terminal are fitted in the recess. A coil-integrated DC / DC converter, characterized in that the surface of the part is in contact with the substrate.
前記ＩＣチップは前記電子回路部分がモールド部材でモールドされており、前記モールド部材の表面には前記電極とともに放熱用の放熱プレートが形成され、さらに前記凹部に嵌め込んだ状態でその表面と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 2,
In the IC chip, the electronic circuit portion is molded with a mold member, and a heat dissipation plate for heat dissipation is formed on the surface of the mold member together with the electrode, and the surface and the terminal are fitted in the recess. A coil-integrated DC / DC converter, characterized in that the surface of the part is in contact with the substrate.
前記ＩＣチップは前記電子回路部分がモールド部材でモールドされており、前記モールド部材の表面には前記電極とともに放熱用の放熱プレートが形成され、さらに前記凹部に嵌め込んだ状態でその表面と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 In the coil integrated DC / DC converter according to claim 3,
In the IC chip, the electronic circuit portion is molded with a mold member, and a heat dissipation plate for heat dissipation is formed on the surface of the mold member together with the electrode, and the surface and the terminal are fitted in the recess. A coil-integrated DC / DC converter, characterized in that the surface of the part is in contact with the substrate.
前記ＩＣチップは基板に前記電子回路部分を形成した状態で前記電極にボール形状の導電部材を付着させてなり、前記ボール形状の導電部材の先端と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 1,
The IC chip is formed by attaching a ball-shaped conductive member to the electrode in a state where the electronic circuit portion is formed on a substrate, and a tip of the ball-shaped conductive member and a surface of the terminal portion in contact with the substrate. A coil-integrated DC / DC converter characterized by being configured to be one.
前記ＩＣチップは基板に前記電子回路部分を形成した状態で前記電極にボール形状の導電部材を付着させてなり、前記基板に実装時に前記ボール形状の導電部材の先端と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 2,
The IC chip is formed by attaching a ball-shaped conductive member to the electrode in a state where the electronic circuit portion is formed on the substrate, and the tip of the ball-shaped conductive member and the substrate of the terminal portion when mounted on the substrate A coil / integrated DC / DC converter characterized in that the surface in contact with the coil is flush with the surface.
前記ＩＣチップは基板に前記電子回路部分を形成した状態で前記電極にボール形状の導電部材を付着させてなり、前記ボール形状の導電部材の先端と前記端子部の前記基板と接する面とが面一になるように構成したことを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 In the coil integrated DC / DC converter according to claim 3,
The IC chip is formed by attaching a ball-shaped conductive member to the electrode in a state where the electronic circuit portion is formed on a substrate, and a tip of the ball-shaped conductive member and a surface of the terminal portion in contact with the substrate. A coil-integrated DC / DC converter characterized by being configured to be one.
前記コイル導体はその軸方向が前記端子部間を結ぶ直線に対し直交するように巻回されていることを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。 The coil integrated DC / DC converter according to claim 2,
The coil-integrated DC / DC converter, wherein the coil conductor is wound so that an axial direction thereof is orthogonal to a straight line connecting the terminal portions.
前記コイル導体はその軸方向が前記端子部間を結ぶ直線に対し直交するように巻回されていることを特徴とするコイル一体型のＤＣ／ＤＣコンバータ。
The coil-integrated DC / DC converter according to claim 5,
The coil-integrated DC / DC converter, wherein the coil conductor is wound so that an axial direction thereof is orthogonal to a straight line connecting the terminal portions.
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| JP2008007010U JP3147172U (en) | 2008-10-06 | 2008-10-06 | Coil integrated DC / DC converter |
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| JP2008007010U JP3147172U (en) | 2008-10-06 | 2008-10-06 | Coil integrated DC / DC converter |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174980A (en) * | 2011-02-23 | 2012-09-10 | Kyocera Corp | Inductor component and electronic device |
| JP2013098310A (en) * | 2011-10-31 | 2013-05-20 | Kyocera Corp | Inductor component and electronic apparatus |
| JP2015089333A (en) * | 2013-10-28 | 2015-05-07 | インフィネオン テクノロジーズ オーストリア アクチエンゲゼルシャフト | Dc-dc converter assembly with output inductor accommodating power stage attached to circuit board |
| JP2017027970A (en) * | 2015-07-15 | 2017-02-02 | 株式会社村田製作所 | Electronic component |
| US10333407B2 (en) | 2015-05-06 | 2019-06-25 | Infineon Technologies Austria Ag | Power stage packages of a multi-phase DC-DC converter under a coupled inductor |
| US10855178B2 (en) | 2015-05-29 | 2020-12-01 | Infineon Technologies Austria Ag | Discrete power stage transistor dies of a DC-DC converter under an inductor |
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2008
- 2008-10-06 JP JP2008007010U patent/JP3147172U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174980A (en) * | 2011-02-23 | 2012-09-10 | Kyocera Corp | Inductor component and electronic device |
| JP2013098310A (en) * | 2011-10-31 | 2013-05-20 | Kyocera Corp | Inductor component and electronic apparatus |
| JP2015089333A (en) * | 2013-10-28 | 2015-05-07 | インフィネオン テクノロジーズ オーストリア アクチエンゲゼルシャフト | Dc-dc converter assembly with output inductor accommodating power stage attached to circuit board |
| JP2017055652A (en) * | 2013-10-28 | 2017-03-16 | インフィネオン テクノロジーズ オーストリア アクチエンゲゼルシャフト | Dc-dc converter assembly with output inductor accommodating power stage attached to circuit board |
| US9711279B2 (en) | 2013-10-28 | 2017-07-18 | Infineon Technologies Austria Ag | DC-DC converter assembly with an output inductor accommodating a power stage attached to a circuit board |
| US9892851B2 (en) | 2013-10-28 | 2018-02-13 | Infineon Technologies Austria Ag | DC-DC converter assembly, method of manufacturing a DC-DC converter assembly and method of manufacturing an output inductor for a DC-DC converter assembly |
| US10333407B2 (en) | 2015-05-06 | 2019-06-25 | Infineon Technologies Austria Ag | Power stage packages of a multi-phase DC-DC converter under a coupled inductor |
| US10855178B2 (en) | 2015-05-29 | 2020-12-01 | Infineon Technologies Austria Ag | Discrete power stage transistor dies of a DC-DC converter under an inductor |
| US11283356B2 (en) | 2015-05-29 | 2022-03-22 | Infineon Technologies North America Corp. | Method of assembling a DC-DC converter |
| JP2017027970A (en) * | 2015-07-15 | 2017-02-02 | 株式会社村田製作所 | Electronic component |
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