JP3111976B2 - Wire bonding apparatus and wire bonding strength measuring method - Google Patents
Wire bonding apparatus and wire bonding strength measuring methodInfo
- Publication number
- JP3111976B2 JP3111976B2 JP10130795A JP13079598A JP3111976B2 JP 3111976 B2 JP3111976 B2 JP 3111976B2 JP 10130795 A JP10130795 A JP 10130795A JP 13079598 A JP13079598 A JP 13079598A JP 3111976 B2 JP3111976 B2 JP 3111976B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- capillary
- wire bonding
- tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Wire Bonding (AREA)
Description
【0001】[0001]
【発明の属する技術分野】この発明は、ワイヤボンディ
ングを行うワイヤボンディング装置およびこのワイヤボ
ンディングしたワイヤの強度を測定するワイヤボンディ
ング強度測定方法に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a wire bonding apparatus for performing wire bonding and a wire bonding strength measuring method for measuring the strength of this wire-bonded wire.
【0002】[0002]
【従来の技術】従来から、例えば大規模集積回路(以
下、LSIという)などの半導体チップのパッドとプリ
ント配線基板(PWB)上の回路パターンやリードフレ
ームなどの接続は、金線などの導電性ワイヤをワイヤボ
ンディングすることにより行っている。一方、このよう
にして実施されたワイヤボンディングの品質を評価する
ために、従来から、ワイヤのプルテスト方法などが採用
されている。このプルテスト方法は、例えば、図3に示
すように、基板1上のLSI3のパッド4とステッチ2
とにワイヤボンディングを行った金線などのワイヤ8
に、テンションゲージ13のフック13aを引っ掛けな
がら、そのワイヤ8を破断するまで引き上げ、その破断
時のテンションゲージ13による測定値から、ワイヤ8
の破断強度および破断箇所を調べるというものである。
また、ベアチップを直接基板にワイヤボンディングする
COB実装においては、ステッチ2の表面状態が接続の
品質(強度)を左右するため、ステッチ2部の接続強度
のチェックが重要である。2. Description of the Related Art Conventionally, connection between a pad of a semiconductor chip such as a large-scale integrated circuit (hereinafter referred to as an LSI) and a circuit pattern or a lead frame on a printed wiring board (PWB) is made of a conductive material such as a gold wire. This is performed by wire bonding the wires. On the other hand, in order to evaluate the quality of the wire bonding performed as described above, a wire pull test method or the like has been conventionally used. In this pull test method, for example, as shown in FIG.
8 such as a gold wire with wire bonding
Then, while hooking the hook 13 a of the tension gauge 13, the wire 8 is pulled up until the wire 8 is broken.
The rupture strength and the rupture location of the specimen were examined.
Further, in COB mounting in which a bare chip is directly wire-bonded to a substrate, it is important to check the connection strength of the stitch 2 because the surface condition of the stitch 2 affects the quality (strength) of the connection.
【0003】ところが、前記のようなテンションゲージ
13によるワイヤボンディング強度測定方法にあって
は、ワイヤ8の長さやLSI自体の厚みなどによって、
フック13aによって引き上げられるワイヤ8のループ
形状が一定でないため、引き上げ強度も一定しない。ま
た、前記ワイヤボンディングが正常に行われていれば、
前記フック13aによる引き上げによって破断する箇所
はワイヤ自身であり、ワイヤ8のステッチ2に対する接
続強度を直接測定することができない。つまり、ワイヤ
ボンディング強度の測定が行えない。However, in the method of measuring wire bonding strength using the tension gauge 13 as described above, the length of the wire 8 or the thickness of the LSI itself depends on the length of the wire 8 and the like.
Since the loop shape of the wire 8 pulled up by the hook 13a is not constant, the pulling strength is not constant. Also, if the wire bonding is performed normally,
The portion that is broken by the lifting by the hook 13a is the wire itself, and the connection strength of the wire 8 to the stitch 2 cannot be directly measured. That is, the measurement of the wire bonding strength cannot be performed.
【0004】一方、これに対して、前記のようなワイヤ
ボンディングの終了後に、図4(a)に示すように、ワ
イヤ8をはさみ14により途中で切断し、さらに、図4
(b)に示すように、ステッチ2側のワイヤ8の一端
を、摘み上げ具15を有するテンションゲージ(図示し
ない)を用いて摘んで、さらに垂直上方向へ引き上げ、
これによってワイヤ8がステッチ2に対して分離すると
きの測定値から、ワイヤボンディング強度を測定する方
法が採用されている。On the other hand, after the completion of the wire bonding as described above, the wire 8 is cut in the middle by scissors 14 as shown in FIG.
As shown in (b), one end of the wire 8 on the side of the stitch 2 is picked up using a tension gauge (not shown) having a pick-up tool 15, and further pulled up vertically.
Thus, a method of measuring the wire bonding strength from the measured value when the wire 8 separates from the stitch 2 is adopted.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、かかる
従来のワイヤボンディング強度測定方法にあっては、ワ
イヤ8を切断するはさみ14や摘み上げ具15を有する
テンションゲージなどを別途準備した上で、これらの切
断や引き上げなどの作業,操作を実行する必要があるほ
か、これらを自動化する場合に、ワイヤ8の切断や引き
上げの位置決めを行う作業工程が繁雑で、長い時間が掛
かるという課題があった。However, in such a conventional wire bonding strength measuring method, a scissor 14 for cutting the wire 8 and a tension gauge having a pick-up tool 15 are separately prepared, and these are used. In addition to the necessity of performing operations and operations such as cutting and pulling up, when automating these operations, there is a problem that the work process of positioning the cutting and pulling up of the wire 8 is complicated and takes a long time.
【0006】この発明は前記課題を解決するものであ
り、ワイヤのループ形状や位置に関係なく信頼性の高い
測定値が得られるとともに、ワイヤボンディング工程の
中でワイヤボンディング強度を非破壊状態で速やかに測
定することができ、さらにワイヤボンディング強度測定
のための時間を別途用意せずに、全てのボンディング対
象についてその測定を効率的に行えるワイヤボンディン
グ装置装置およびワイヤボンディング強度測定方法を提
供することを目的とする。The present invention has been made to solve the above-mentioned problems, and provides a highly reliable measurement value regardless of the loop shape and position of a wire, and rapidly reduces the wire bonding strength in a non-destructive state in a wire bonding process. The present invention provides a wire bonding apparatus and a wire bonding strength measuring method that can efficiently perform the measurement for all bonding targets without separately preparing a time for the wire bonding strength measurement. Aim.
【0007】[0007]
【課題を解決するための手段】前記目的達成のために、
請求項1の発明にかかるワイヤボンディング装置は、第
1のボンディング部および第2のボンディング部上へ、
これらに接合するためのワイヤを案内しながら引き出す
キャピラリと、前記第1のボンディング部に続いて前記
第2のボンディング部上に接合したワイヤを挟んで引き
ちぎるカットクランパとを備えたものにおいて、前記キ
ャピラリおよびカットクランパ間において、前記ワイヤ
をワイヤガイドによりガイドするとともに、該ワイヤガ
イドにガイドされているワイヤのテンションを、ロード
セルにより測定するようにしたものである。To achieve the above object,
The wire bonding apparatus according to the first aspect of the present invention provides a wire bonding apparatus on a first bonding unit and a second bonding unit.
A capillary which is drawn out while guiding a wire to be joined thereto, and a cut clamper which, after the first bonding portion, cuts the wire bonded to the second bonding portion with the wire interposed therebetween and tears off the capillary. And between the cut clamper, the wire is guided by a wire guide, and the tension of the wire guided by the wire guide is measured by a load cell.
【0008】また、請求項2の発明にかかるワイヤボン
ディング装置は、前記ワイヤガイドを、前記ワイヤに少
なくとも2箇所で接触するように設けられたガイドロー
ラとし、該ガイドローラ側にワイヤを押し付けたときの
そのワイヤのテンションを、ロードセルにより測定する
ようにしたものである。According to a second aspect of the present invention, in the wire bonding apparatus, the wire guide is a guide roller provided so as to contact the wire at at least two places, and the wire is pressed against the guide roller side. Is measured by a load cell.
【0009】また、請求項3の発明にかかるワイヤボン
ディング強度測定方法は、キャピラリから引き出したワ
イヤ端を第1のボンディング部に接合し、続いて、前記
キャピラリから引き出したワイヤの途中を第2のボンデ
ィング部に接合した後、カットクランパによりそのワイ
ヤをクランプした状態で引きちぎる工程の中で、該カッ
トクランパと前記キャピラリとの間の区間で前記ワイヤ
に加わるテンションをロードセルにより測定するように
したものである。According to a third aspect of the present invention, there is provided a wire bonding strength measuring method, wherein a wire end drawn from a capillary is joined to a first bonding portion, and then the middle of the wire drawn from the capillary is connected to a second portion. after bonding to the bonding portion, in the process of tearing whilst clamped the wire by cutting damper, the cut
The tension applied to the wire in a section between the toclamper and the capillary is measured by a load cell.
【0010】[0010]
【発明の実施の形態】以下、この発明の実施の一形態を
図について説明する。図1はこの発明のワイヤボンディ
ング装置を示し、同図において、1は基板、3は基板1
上にエポキシボンドなどにより取り付けられたLSI、
2は基板1上にプリント配線された第2のボンディング
部としてのステッチ、4は第1のボンディング部として
用いられる前記LSI3上のパッド、8はこのパッド4
とステッチ2とを繋ぐ金線などのワイヤである。また、
7はワイヤボンディング装置の主要部となる筒状のキャ
ピラリで、これがワイヤ8を筒内にガイドして引き出し
可能にしている。5はテンションクランパ、6はキャピ
ラリ7の上方において、ワイヤ8を挟んで引きちぎるよ
うにしてカットするカットクランパである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a wire bonding apparatus according to the present invention. In FIG.
LSI mounted on top with epoxy bond,
2 is a stitch as a second bonding portion printed and wired on the substrate 1, 4 is a pad on the LSI 3 used as a first bonding portion, and 8 is a pad 4
And a wire such as a gold wire connecting the stitch 2 and the stitch 2. Also,
Reference numeral 7 denotes a cylindrical capillary which is a main part of the wire bonding apparatus, and guides the wire 8 into the cylinder so that the wire 8 can be pulled out. Reference numeral 5 denotes a tension clamper, and reference numeral 6 denotes a cut clamper that cuts the wire 8 above the capillary 7 so that the wire 8 is torn off.
【0011】また、9は前記ワイヤボンディング装置内
に組み込まれたワイヤボンディングの強度測定部であ
り、これがキャピラリ7およびカットクランパ6間にお
いて、ワイヤ8を2箇所で曲げ変形させることなくスム
ースにガイドするワイヤガイドとしてのガイドローラ1
0,11を有する。また、12はこれらのガイドローラ
10,11間にあって、ワイヤ8をそのガイドローラ1
0,11側に押し付けて、そのワイヤ8のテンションの
変化を、そのワイヤ8に加わる加重の変化として測定す
るロードセルである。このロードセル12もワイヤボン
ディングの前記の強度測定部を構成する。Reference numeral 9 denotes a wire bonding strength measuring unit incorporated in the wire bonding apparatus, which smoothly guides the wire 8 between the capillary 7 and the cut clamper 6 without bending the wire 8 at two places. Guide roller 1 as wire guide
It has 0,11. Reference numeral 12 is located between the guide rollers 10 and 11, and the wire 8 is connected to the guide rollers 1 and 11.
The load cell is pressed against the 0, 11 side to measure a change in the tension of the wire 8 as a change in the weight applied to the wire 8. The load cell 12 also constitutes the above-described strength measuring unit for wire bonding.
【0012】次にワイヤボンディング工程およびワイヤ
ボンディング強度測定を、図2の工程図を参照しながら
説明する。まず、ワイヤボンディング開始時にあたっ
て、テンションクランパ5を閉じ、カットクランパ6を
開き、キャピラリ7をパッド4の直上へ移動させて、そ
のキャピラリ7から突出させたワイヤ8端に、これを放
電等で加熱,溶融する。これにより、図2(a)に示す
ような一定の直径をもったボール8Aが形成される。続
いて、この状態からキャピラリ7を降下させ、そのボー
ル8Aをパッド4に超音波溶接などにより、図2(b)
に示すように接続する。この接続後、キャピラリ7を、
図2(c)に示すように、テンションクランパ5および
カットクランパ6を開いた状態にて、所定の高さまで上
昇させ、さらに、テンションクランパ5を閉じて、この
キャピラリ7からワイヤ8を引き出させながら、このキ
ャピラリ7を図2(d)に示すようなステッチ2の直上
へ移動する。Next, the wire bonding step and the wire bonding strength measurement will be described with reference to the process chart of FIG. First, at the start of wire bonding, the tension clamper 5 is closed, the cut clamper 6 is opened, the capillary 7 is moved directly above the pad 4, and the end of the wire 8 protruding from the capillary 7 is heated by electric discharge or the like. , Melts. Thus, a ball 8A having a constant diameter as shown in FIG. 2A is formed. Subsequently, the capillary 7 is lowered from this state, and the ball 8A is ultrasonically welded to the pad 4 as shown in FIG.
Connect as shown. After this connection, the capillary 7 is
As shown in FIG. 2 (c), the tension clamper 5 and the cut clamper 6 are opened and raised to a predetermined height. Further, the tension clamper 5 is closed and the wire 8 is pulled out from the capillary 7. Then, the capillary 7 is moved right above the stitch 2 as shown in FIG.
【0013】ここで、テンションクランパ5およびカッ
トクランパ6を開いてキャピラリ7を図2(e)に示す
ようにステッチ2上面へ降下させ、所定量だけループ上
に引き出されたワイヤ8の一部をステッチ2に押し当
て、これの上に超音波溶接をする。この溶接が済むと、
再びキャピラリ7をステッチ2上から図2(f)に示す
ように上昇させ、所定の上昇位置でカットクランパ6に
よりワイヤ8を摘んで保持させ、このカットクランパ6
の上昇によってワイヤ8をステッチ2上の接続部分か
ら、図2(g)に示すように引きちぎる。この後、引き
ちぎられたワイヤ8端を、トーチ(t)を利用して放電
等によって加熱,溶融し、図2(h)に示すようにボー
ル8aを形成する。そして、カットクランパ6を開き、
図2(a)〜図2(h)の動作を繰り返して、多数組の
パッド4とステッチ2とを接続していく。Here, the tension clamper 5 and the cut clamper 6 are opened, the capillary 7 is lowered to the upper surface of the stitch 2 as shown in FIG. 2E, and a part of the wire 8 pulled out on the loop by a predetermined amount is removed. Press it against the stitch 2 and do ultrasonic welding on it. Once this welding is done,
The capillary 7 is again raised from above the stitch 2 as shown in FIG. 2 (f), and the wire 8 is pinched and held by the cut clamper 6 at a predetermined raised position.
As a result, the wire 8 is torn off from the connection portion on the stitch 2 as shown in FIG. Thereafter, the end of the torn wire 8 is heated and melted by a discharge or the like using a torch (t) to form a ball 8a as shown in FIG. 2 (h). Then, open the cut clamper 6,
The operations of FIGS. 2A to 2H are repeated to connect a large number of sets of pads 4 and stitches 2.
【0014】一方、前記ワイヤ8をステッチ2上の接続
部分から、図2(g)に示すように引きちぎる動作の中
では、ワイヤ8のテンションが変化する。そこで、この
ワイヤ8のテンションの変化を、図1に示すように、ガ
イドローラ10,11間のワイヤ8に押し当てられてい
るロードセル12により検知することにより、ワイヤ8
のステッチ2に対するワイヤボンディングの強度測定,
評価を行うことができる。つまり、ワイヤボンディング
工程の中で、ボンディング対象のすべてについて、その
ワイヤボンディングの強度測定を非破壊で効率的に測定
することができる。On the other hand, during the operation of tearing the wire 8 from the connection portion on the stitch 2 as shown in FIG. 2 (g), the tension of the wire 8 changes. Therefore, as shown in FIG. 1, the change in the tension of the wire 8 is detected by the load cell 12 pressed against the wire 8 between the guide rollers 10 and 11, so that the wire 8 is changed.
Measurement of wire bonding strength for stitch 2
An assessment can be made. That is, in the wire bonding process, the strength of wire bonding can be measured nondestructively and efficiently for all of the bonding targets.
【0015】なお、前記実施の形態ではプリント基板上
のステッチ2へのワイヤボンディングの場合について説
明したが、半導体パッケージのリードフレームに対する
ワイヤボンディングおよびその強度測定も前記同様に実
施でき、また、ウェッジボンディング装置への適用も任
意である。In the above embodiment, wire bonding to the stitch 2 on the printed circuit board has been described. However, wire bonding to a lead frame of a semiconductor package and measurement of its strength can be performed in the same manner as described above. Application to the device is also optional.
【0016】[0016]
【発明の効果】以上のように、この発明によれば、キャ
ピラリおよびカットクランパ間において、ワイヤをワイ
ヤガイドによりガイドするとともに、該ワイヤガイドに
ガイドされているワイヤのテンションを、ロードセルに
より測定するように構成したので、ワイヤのループ形状
や位置に関係なく信頼性の高い測定値が得られるととも
に、ワイヤを非破壊状態で速やかに測定することがで
き、さらにワイヤボンディング強度測定のための時間を
別途用意せずに、全てのボンディング対象についての測
定を確実に行えるという効果が得られる。As described above, according to the present invention, a wire is guided between a capillary and a cut clamper by a wire guide, and the tension of the wire guided by the wire guide is measured by a load cell. With this configuration, highly reliable measurement values can be obtained regardless of the loop shape and position of the wire, the wire can be measured quickly in a non-destructive state, and the time for measuring the wire bonding strength is separately set. An effect is obtained that the measurement can be reliably performed for all the bonding targets without preparing.
【0017】また、前記キャピラリから引き出したワイ
ヤの途中を第2のボンディング部に接合した後、カット
クランパによりそのワイヤをクランプした状態で引きち
ぎる工程の中で、前記ワイヤに加わるテンションをロー
ドセルにより測定するようにしたので、ワイヤを引きち
ぎる工程ごとに、ボンディング対象の全数について、迅
速かつ効率的に信頼性の高いワイヤボンディングの強度
測定を実施できるという効果が得られる。Further, after joining the wire drawn out of the capillary to the second bonding portion and then tearing the wire in a state where the wire is clamped by a cut clamper, the tension applied to the wire is measured by a load cell. With this configuration, it is possible to obtain the effect that the reliability of the wire bonding strength measurement can be quickly and efficiently measured with respect to the total number of the bonding targets for each wire tearing process.
【図1】 この発明の実施の一形態によるボンディング
装置を示す構成図である。FIG. 1 is a configuration diagram showing a bonding apparatus according to an embodiment of the present invention.
【図2】 この発明によるワイヤボンディングの手順を
示す工程図である。FIG. 2 is a process chart showing a procedure of wire bonding according to the present invention.
【図3】 従来のワイヤのプルテスト方法を示す説明図
である。FIG. 3 is an explanatory diagram showing a conventional wire pull test method.
【図4】 従来のワイヤボンディング強度測定方法を示
す説明図である。FIG. 4 is an explanatory view showing a conventional wire bonding strength measuring method.
1 基板 2 ステッチ(第2のボンディング部) 4 パッド(第1のボンディング部) 6 カットクランパ 7 キャピラリ 8 ワイヤ 10,11 ガイドローラ(ワイヤガイド) 12 ロードセル DESCRIPTION OF SYMBOLS 1 Substrate 2 Stitch (2nd bonding part) 4 Pad (1st bonding part) 6 Cut clamper 7 Capillary 8 Wire 10, 11 Guide roller (wire guide) 12 Load cell
フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01L 21/60 301 H01L 21/60 321 Continuation of the front page (58) Field surveyed (Int. Cl. 7 , DB name) H01L 21/60 301 H01L 21/60 321
Claims (3)
ディング部上へ、これらに接合するためのワイヤを案内
しながら引き出すキャピラリと、 前記第1のボンディング部に続いて前記第2のボンディ
ング部上に接合したワイヤを挟んで引きちぎるカットク
ランパとを備えたワイヤボンディング装置において、 前記キャピラリおよびカットクランパ間において前記ワ
イヤをガイドするワイヤガイドと、 該ワイヤガイドにガイドされているワイヤのテンション
を測定するロードセルとを備えたことを特徴とするワイ
ヤボンディング装置。A capillary for guiding a wire to be bonded to the first bonding portion and the second bonding portion while guiding the wire to the first bonding portion and the second bonding portion; and a second bonding portion following the first bonding portion. A wire bonding apparatus comprising: a cut clamper that sandwiches and tears a wire bonded to a wire; a wire guide that guides the wire between the capillary and the cut clamper; and a load cell that measures a tension of the wire guided by the wire guide. And a wire bonding apparatus.
くとも2箇所で接触するように設けられたガイドローラ
であり、前記ロードセルが前記ガイドローラ側にワイヤ
を押し付けて、そのワイヤのテンションを測定するもの
であることを特徴とする請求項1に記載のワイヤボンデ
ィング装置。2. The apparatus according to claim 1, wherein the wire guide is a guide roller provided so as to come into contact with the wire at at least two places, and the load cell presses the wire against the guide roller and measures the tension of the wire. The wire bonding apparatus according to claim 1, wherein
のボンディング部に接合し、続いて、前記キャピラリか
ら引き出したワイヤの途中を第2のボンディング部に接
合した後、カットクランパによりそのワイヤをクランプ
した状態で引きちぎる工程の中で、該カットクランパと
前記キャピラリとの間の区間で前記ワイヤに加わるテン
ションをロードセルにより測定することを特徴とするワ
イヤボンディング強度測定方法。3. The wire end drawn out of the capillary is connected to a first end.
Then, after joining the middle of the wire drawn from the capillary to the second bonding portion, in the step of tearing the wire in a state where the wire is clamped by the cut clamper,
A wire bonding strength measuring method, wherein a tension applied to the wire in a section between the capillary and the capillary is measured by a load cell.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10130795A JP3111976B2 (en) | 1998-05-13 | 1998-05-13 | Wire bonding apparatus and wire bonding strength measuring method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10130795A JP3111976B2 (en) | 1998-05-13 | 1998-05-13 | Wire bonding apparatus and wire bonding strength measuring method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11330137A JPH11330137A (en) | 1999-11-30 |
JP3111976B2 true JP3111976B2 (en) | 2000-11-27 |
Family
ID=15042884
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Application Number | Title | Priority Date | Filing Date |
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JP10130795A Expired - Fee Related JP3111976B2 (en) | 1998-05-13 | 1998-05-13 | Wire bonding apparatus and wire bonding strength measuring method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3111976B2 (en) |
-
1998
- 1998-05-13 JP JP10130795A patent/JP3111976B2/en not_active Expired - Fee Related
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Publication number | Publication date |
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JPH11330137A (en) | 1999-11-30 |
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