JP3106662B2 - Wiring board test method - Google Patents
Wiring board test methodInfo
- Publication number
- JP3106662B2 JP3106662B2 JP04052051A JP5205192A JP3106662B2 JP 3106662 B2 JP3106662 B2 JP 3106662B2 JP 04052051 A JP04052051 A JP 04052051A JP 5205192 A JP5205192 A JP 5205192A JP 3106662 B2 JP3106662 B2 JP 3106662B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact means
- test
- wiring board
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、端子パターンを設けた
配線基板、例えば、半導体装置等の電子部品を搭載して
なるＩＣカードの電気的特性の試験方法、特に長期間に
わたってＩＣカードの電気的特性を確実に試験できる試
験方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for testing electrical characteristics of a wiring board provided with a terminal pattern, for example, an IC card on which electronic components such as semiconductor devices are mounted, and more particularly to a method for testing the electrical characteristics of an IC card for a long period of time. It relates to a test method that can reliably test the mechanical characteristics.
【０００２】[0002]
【従来の技術】次に、ＩＣカードを試験する際に使用す
る従来の試験治具について図２を参照して説明する。図
２は、従来の試験治具の説明図で、同図(a) 及び同図
(c) は試験治具の要部側断面図、同図(b) は試験治具の
平面図である。2. Description of the Related Art A conventional test jig used for testing an IC card will be described with reference to FIG. FIGS. 2A and 2B are explanatory views of a conventional test jig.
(c) is a side sectional view of a main part of the test jig, and (b) is a plan view of the test jig.
【０００３】従来の試験治具は、同図(a) 及び同図(b)
に示す如く、ＩＣカード31を垂直に挿抜自在に挿入させ
てこのＩＣカード31の端部に設けた櫛状の端子パターン
31aに、樹脂製のハウジング12内に２列状態で列設され
た「く」の状のコンタクト11が接触するコネクタを使用
していた。[0003] Conventional test jigs are shown in Figs. 1 (a) and 1 (b).
As shown in the figure, a comb-shaped terminal pattern provided at an end of the IC card 31 by vertically inserting and removing the IC card 31
For the connector 31a, a connector is used in which the "ku" shaped contacts 11 arranged in two rows in the resin housing 12 come into contact.
【０００４】[0004]
【発明が解決しようとする課題】ところが、従来の試験
治具は、ＩＣカード31を挿抜する際にもその端子パター
ン31a は、コンタクト11に接触していた。However, in the conventional test jig, the terminal pattern 31a is in contact with the contact 11 even when the IC card 31 is inserted or removed.
【０００５】したがって、従来の試験治具を介してＩＣ
カード31の試験を繰り返すとコンタクト11が同図(c) に
示す如く変形し、このコンタクト11と端子パターン31a
との接触が不安定になったり、場合によっては接触が取
れない等の問題があった。[0005] Therefore, ICs can be connected via a conventional test jig.
When the test of the card 31 is repeated, the contact 11 is deformed as shown in FIG.
However, there have been problems such as that the contact with the substrate becomes unstable, and in some cases, the contact cannot be obtained.
【０００６】このため、このような試験治具を使用する
従来の配線基板の試験方法はＩＣカードの電気的特性を
確実に試験できないという欠点があった。本発明は、こ
のような問題を解消するためになされたものであって、
その目的は長期間にわたってＩＣカードの電気的特性を
確実に試験できる試験方法を提供することにある。Therefore, the conventional method of testing a wiring board using such a test jig has a drawback that the electrical characteristics of an IC card cannot be reliably tested. The present invention has been made to solve such a problem,
An object of the present invention is to provide a test method that can reliably test the electrical characteristics of an IC card over a long period of time.
【０００７】[0007]
【課題を解決するための手段】前記目的は、図１に示す
ように、配線基板の端子パターン面に対してコンタクト
を垂直に接触させて試験を行う配線基板の試験方法にお
いて、前記配線基板両面の試験端子のそれぞれに対応す
る前記コンタクトを有する第１、第２の接触手段を備
え、該第１の接触手段を固定し、第２の接触手段を第１
の接触手段に対し平行移動可能に保持するとともに、第
１の接触手段から離れる方向にばね付勢し、第２の接触
手段をばね付勢力に抗して第１の接触手段の方に電磁吸
引力で移動する構造の試験治具を用い、該第１、第２の
接触手段間に配線基板を挿入セットした後、第２の接触
手段を移動して双方のコンタクトを試験端子に接触させ
て電気試験を行い、試験後に電磁吸引力を開放して第２
の接触手段をばね付勢力により原位置に復帰させること
を特徴とする配線基板の試験方法により達成される。Means for Solving the Problems] The object is, as shown in FIG. 1, the contact to the terminal pattern surface of the wiring substrate
To the wiring board test method where the test is performed with the
Corresponding to the test terminals on both sides of the wiring board.
First and second contact means having the above contacts.
The first contact means is fixed, and the second contact means is connected to the first contact means.
While holding it parallel to the contact means of
A spring biased away from the first contact means, the second contact means
The means against electromagnetic force toward the first contact means against the spring biasing force.
The first and second test jigs are configured to move by gravity.
After inserting and setting the wiring board between the contact means, the second contact
Move the means so that both contacts are in contact with the test terminals
To conduct an electrical test, release the electromagnetic attraction after the test, and
The contact means is returned to the original position by a spring biasing force .
【０００８】[0008]
【作用】本発明の配線基板の試験方法においては、試験
を行う配線基板を両面から挟むように、それぞれにコン
タクトを有する第１、第２の接触手段を対向させ、固定
した第１の接触手段に対して第２の接触手段を電磁吸
引力で移動して双方のコンタクトを試験端子に接触さ
せ、電磁吸引力を開放してばね付勢力により復帰させる
試験治具を使用して、第１、第２の接触手段間の隙間を
拡げた状態で配線基板を挿入セットし、電磁吸引力によ
り配線基板を挟んで試験を配線基板の電気的特性の試験
を行い、試験後は電磁吸引力を開放して第２の接触手段
をばね付勢力により原位置に復帰させる。 In the test method of the wiring substrate of the present invention, the test
To each other so that the wiring board to perform
The first and second contact means having tact are opposed and fixed.
The second contact means is electromagnetically attracted to the first contact means.
Move by gravity to bring both contacts into contact with the test terminals.
Release the electromagnetic attraction force and return by spring biasing force
Using a test jig, remove the gap between the first and second contact means.
Insert the wiring board in the spread state and set it by electromagnetic attraction.
Test the electrical characteristics of the printed circuit board
After the test, the electromagnetic attraction force is released and the second contact means
Is returned to the original position by the spring biasing force.
【０００９】この試験治具を使用することにより、配線
基板両面の全範囲の試験端子を対象に両面から第１、第
２の接触手段で挟み、双方のコンタクトを電磁吸引力の
１回の動作で接触させて試験するため試験サイクル時間
を短くでき、両面端子パターンに対し回路の入出力端の
試験端子だけでなく、或る回路途中の試験端子に対して
も電圧や信号状態を容易に試験できる。 また、第２の接
触手段の移動動作は電磁吸引力によるため、試験治具は
シンプルで小型化でき、この試験治具を用いれば、電気
以外の特別な設備を要せずに簡単に設置して試験できる
という利点を有する。 そして、配線基板を試験するとき
にのみ接触手段のコンタクトを配線基板の端子パターン
面に対して垂直に接触（触針）させて試験を行い、それ
以外のときには接触手段のコンタクトを離し、離れた状
態で配線基板を第１、第２の接触手段の間に挿抜するた
め、コンタクトは従来のように挿抜時に接触する構造に
比べてり変形することはなく、長期間にわたって配線基
板の電気的特性を確実に試験できることとなる。 By using this test jig , wiring
1st and 2nd test terminals from both sides for the entire range of test terminals on both sides of the board
2 contact means, and both contacts are
Test cycle time for testing by contacting in one operation
Can be shortened, and the input / output
Not only test terminals but also test terminals in the middle of a certain circuit
Can easily test voltage and signal conditions. In addition, the second contact
Since the movement of the touching means is by electromagnetic attraction, the test jig
Simple and miniaturized.
Easy installation and testing without special equipment other than
It has the advantage that. Then, only when testing the wiring board, the contact of the contact means is changed to the terminal pattern of the wiring board .
It was tested by contacting vertically (stylus) to the plane, and in the other cases it away contact contact means, like a distance
In this state, the wiring board is inserted and removed between the first and second contact means.
Therefore, the contact has the same structure as the
As a result, the electrical characteristics of the wiring board can be reliably tested over a long period without any deformation .
【００１０】[0010]
【実施例】以下、本発明の一実施例の配線基板の試験方
法について図１を参照しながら説明する。図１は、本発
明の一実施例における試験治具の説明図で、同図(a) は
試験治具の模式的な平面図、同図(b) は試験治具のＡ−
Ａ線断面図、同図(c) はコンタクトの断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for testing a wiring board according to one embodiment of the present invention will be described with reference to FIG. FIG. 1 is an explanatory view of a test jig according to an embodiment of the present invention. FIG. 1 (a) is a schematic plan view of the test jig, and FIG.
A sectional view along line A, and FIG. 3C is a sectional view of the contact.
【００１１】本発明の一実施例における試験治具は、同
図(a) 及び同図(b) に示すように、平らで滑らかな表面
を有するテーブル21、絶縁物、例えば、プラスチック製
で角棒状をした絶縁ブロック22b の前面から銃弾状の先
端部を突き出してコンタクト22a を点列して構成した第
１及び第２の接触手段22、第１の接触手段22の絶縁ブロ
ック22b の両端に固定された電磁石23、第２の接触手段
22の絶縁ブロック22bの両端に固定された軟鉄製で骰子
状をした軟鉄ブロック24、テーブル21に垂設した係止ピ
ン27に一端を係止するとともに、他端を第２の接触手段
22の背面に連結して電磁石23とともにコンタクト22a の
移動手段を構成するばね25、及びテーブル21の表面に平
行且つ離隔されて固定された一対のガイド26とを含んで
構成したものである。As shown in FIGS. 1 (a) and 1 (b), a test jig according to an embodiment of the present invention comprises a table 21 having a flat and smooth surface, an insulator made of, for example, plastic and a square. First and second contact means 22, which are formed by projecting a bullet-shaped tip from the front surface of a rod-shaped insulating block 22b and arranging contacts 22a, and fixed to both ends of the insulating block 22b of the first contact means 22. Electromagnet 23, second contact means
A soft iron-made dice-shaped soft iron block 24 fixed to both ends of an insulating block 22b of 22 and one end is locked to a locking pin 27 suspended from the table 21 and the other end is connected to a second contact means.
It comprises a spring 25 which is connected to the back of the unit 22 and constitutes a means for moving the contact 22a together with the electromagnet 23, and a pair of guides 26 which are fixed parallel to and separated from the surface of the table 21.
【００１２】第１の接触手段22は、上述したように、そ
の絶縁ブロック22b の両端に電磁石23を固定して、ガイ
ド26間でテーブル21の表面に固定されている。そして、
この固定は、第１の接触手段22のコンタクト22a(以降、
第１のコンタクト22a と呼称する) の点列方向がテーブ
ル21の表面の方向に平行となるとともに、第１のコンタ
クト22a の点列方向がガイド26の軸心と直交するように
して行なわれている。As described above, the first contact means 22 has the electromagnets 23 fixed to both ends of the insulating block 22b, and is fixed to the surface of the table 21 between the guides 26. And
This fixing is performed by the contact 22a of the first contact means 22 (hereinafter, referred to as a contact 22a).
The first row of contacts 22a is parallel to the direction of the surface of the table 21 and the first row of contacts 22a is perpendicular to the axis of the guide 26. I have.
【００１３】また、第２の接触手段22は、如上のよう
に、その絶縁ブロック22b の両端に軟鉄ブロック24を固
定するとともに、この絶縁ブロック22b の背面に一対の
ばね25を連結して、ガイド26間でテーブル21上に載置さ
れている。As described above, the second contact means 22 fixes the soft iron blocks 24 at both ends of the insulating block 22b, and connects a pair of springs 25 to the back surface of the insulating block 22b to form a guide. It is placed on the table 21 between 26.
【００１４】そして、この載置は、第２の接触手段22の
コンタクト22a(以降、第２のコンタクト22a と呼称す
る) の点列方向がテーブル21の表面の方向に平行且つ第
１のコンタクト22a と対向状態となるとともに、第２の
コンタクト22a の点列方向がガイド26の軸心と直交する
ようにして行なわれている。The placement is such that the dot row direction of the contact 22a of the second contact means 22 (hereinafter referred to as the second contact 22a) is parallel to the direction of the surface of the table 21 and the first contact 22a And the second contact 22a is arranged so that the dot row direction is orthogonal to the axis of the guide 26.
【００１５】さらに、ばね25が中立状態且つ電磁石23が
オフ状態にあるときには、互いに対向した第１のコンタ
クト22a の先端と第２のコンタクト22a の先端間の距離
は、配線基板、例えば、ＩＣカード31の板厚より僅かに
広い状態になっている。Further, when the spring 25 is in the neutral state and the electromagnet 23 is in the off state, the distance between the front end of the first contact 22a and the front end of the second contact 22a facing each other is determined by a wiring board, for example, an IC card. It is slightly wider than the thickness of 31.
【００１６】したがって、ばね25が中立状態且つ電磁石
23がオフ状態にある時には、第２の接触手段22は、同図
(a) に示す点線Ｂで示す位置にあるから、ＩＣカード31
は第１のコンタクト22a の先端と第２のコンタクト22a
の先端間に垂直に挿入できることとなる。Therefore, the spring 25 is in the neutral state and the electromagnet
When 23 is in the off state, the second contact means 22
Since the IC card 31 is located at the position indicated by the dotted line B shown in FIG.
Is the tip of the first contact 22a and the second contact 22a
Can be inserted vertically between the tips of the two.
【００１７】この状態で電磁石23をオン状態にすると、
この電磁石23は、第２の接触手段22の絶縁ブロック22b
の両端に固定された軟鉄ブロック24を吸引し、第２の接
触手段22を第１の接触手段22の方向に移動して第１のコ
ンタクト22a の先端と第２のコンタクト22a の先端とを
ＩＣカード31の端子パターン31a に接触させる。When the electromagnet 23 is turned on in this state,
The electromagnet 23 is connected to the insulating block 22b of the second contact means 22.
The second contact means 22 is moved in the direction of the first contact means 22 so that the tip of the first contact 22a and the tip of the second contact 22a are connected to each other. It is brought into contact with the terminal pattern 31a of the card 31.
【００１８】斯くして、このＩＣカード31に搭載された
電気回路（図示せず）は、第１のコンタクト22a 及び第
２のコンタクト22a を介して試験機（図示せず）に接続
することとなる。Thus, an electric circuit (not shown) mounted on the IC card 31 is connected to a tester (not shown) via the first contact 22a and the second contact 22a. Become.
【００１９】試験機による配線基板31に搭載された電気
回路の電気的特性試験終了後に、電磁石23をオフ状態に
すると、第２の接触手段22は、ばね25に引っ張られて初
期位置、すなわち、同図(a) の点線Ｂで示す位置に戻る
こととなる。When the electromagnet 23 is turned off after the electrical characteristics test of the electric circuit mounted on the wiring board 31 by the tester is completed, the second contact means 22 is pulled by the spring 25 to the initial position, that is, The position returns to the position indicated by the dotted line B in FIG.
【００２０】上述したように、本発明の一実施例におけ
る試験治具においては、ＩＣカード31を試験する時にの
み第１及び第２のコンタクト22a を端子パターン31a に
接触させ、それ以外は接触しないようにできるために、
長期間にわたってＩＣカード31の端子パターン31a と安
定な接触を確保できる。As described above, in the test jig according to one embodiment of the present invention, the first and second contacts 22a are brought into contact with the terminal pattern 31a only when the IC card 31 is tested, and the rest is not contacted. To be able to
Stable contact with the terminal pattern 31a of the IC card 31 can be secured for a long period of time.
【００２１】斯くして、本発明の一実施例の配線基板の
試験方法は、長期間にわたって配線基板の電気的特性を
確実に試験できることとなる。なお、本発明の一実施例
の試験治具のコンタクト22a は、同図(c) に示すように
金属製のスリーブ22a1内に収容したばね22a2により銃弾
状の接触ピン22a3が軸心方向に容易に移動できるように
構成されているために、ＩＣカード31の板厚さにむらが
あったり、また若干の反り等があってもコンタクト22a
は端子パターン31a と確実に接触する。Thus, the method for testing a wiring board according to one embodiment of the present invention can reliably test the electrical characteristics of the wiring board for a long period of time. The contact 22a of the test fixture of an embodiment of the present invention, FIG bullet-shaped contact pins 22a 3 is the axis by a spring 22a 2 accommodated in a metal sleeve 22a 1 as shown in (c) The contact 22a can be easily moved in any direction, so that the thickness of the IC card 31 may be uneven or the contact 22a may be slightly warped.
Makes sure contact with the terminal pattern 31a.
【００２２】[0022]
【発明の効果】以上説明したように本発明は、長期間に
わたって配線基板の電気的特性を確実に試験できる配線
基板の試験方法の提供が可能となる。As described above, according to the present invention, it is possible to provide a method for testing a wiring board which can reliably test the electrical characteristics of the wiring board for a long period of time.
【図１】は、本発明の一実施例における試験治具の説明
図、FIG. 1 is an explanatory view of a test jig in one embodiment of the present invention,
【図２】は、従来の試験治具の説明図である。FIG. 2 is an explanatory view of a conventional test jig.
11は、コンタクト、 12は、ハウジング、 21は、テーブル、 22は、接触手段、 22a は、コンタクト、 22b は、絶縁ブロック、 23は、電磁石 (移動手段) 、 24は、軟鉄ブロック、 25は、ばね (移動手段) 、 26は、ガイド、 27は、係止ピン、 31は、ＩＣカード (配線基板) 、 31a は、端子パターンをそれぞれ示す。 11 is a contact, 12 is a housing, 21 is a table, 22 is a contact means, 22a is a contact, 22b is an insulating block, 23 is an electromagnet (moving means), 24 is a soft iron block, 25 is A spring (moving means), 26 is a guide, 27 is a locking pin, 31 is an IC card (wiring board), and 31a is a terminal pattern.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−190878（ＪＰ，Ａ) 特開 平４−2969（ＪＰ，Ａ) 特開 平１−42142（ＪＰ，Ａ) 実開 平１−110384（ＪＰ，Ｕ) 実開 平３−66166（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/66 G01R 31/26 G01R 31/28 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-190878 (JP, A) JP-A-4-2969 (JP, A) JP-A-1-42142 (JP, A) 110384 (JP, U) Hikaru Hei 3-66166 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/66 G01R 31/26 G01R 31/28
Claims (1)
タクトを垂直に接触させて試験を行う配線基板の試験方
法において、 前記配線基板両面の試験端子のそれぞれに対応する前記
コンタクトを有する第１と第２の接触手段を備え、該第
１の接触手段を固定し、該第２の接触手段を該第１の接
触手段に対し平行移動可能に保持するとともに、該第１
の接触手段から離れる方向にばね付勢し、該第２の接触
手段をばね付勢力に抗して第１の接触手段の方に電磁吸
引力で移動する構造の試験治具を用い、 該第１と該第２の接触手段間に配線基板を挿入セットし
た後、該第２の接触手段を移動して双方のコンタクトを
試験端子に接触させて電気試験を行い、試験後に電磁吸
引力を開放して該第２の接触手段をばね付勢力により原
位置に復帰させる、 ことを特徴とする配線基板の試験方法。1. A connector for a terminal pattern surface of a wiring board.
Test method of wiring board to test by contacting tact vertically
In the method, the test substrate corresponding to each of the test terminals on both sides of the wiring board
First and second contact means having contacts;
One contact means is fixed, and the second contact means is connected to the first contact means.
The first contact means is held so as to be movable in parallel with the touch means, and the first
Springs away from the contact means of the second
The means against electromagnetic force toward the first contact means against the spring biasing force.
Inserting and setting a wiring board between the first and second contact means using a test jig having a structure that moves by attractive force
After that, the second contact means is moved to disconnect both contacts.
Conduct an electrical test by contacting the test terminals.
The attractive force is released and the second contact means is released by the spring urging force.
A method for testing a wiring board , comprising returning to a position .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04052051A JP3106662B2 (en) | 1992-03-11 | 1992-03-11 | Wiring board test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04052051A JP3106662B2 (en) | 1992-03-11 | 1992-03-11 | Wiring board test method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05259241A JPH05259241A (en) | 1993-10-08 |
| JP3106662B2 true JP3106662B2 (en) | 2000-11-06 |
Family
ID=12904019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04052051A Expired - Fee Related JP3106662B2 (en) | 1992-03-11 | 1992-03-11 | Wiring board test method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3106662B2 (en) |
-
1992
- 1992-03-11 JP JP04052051A patent/JP3106662B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05259241A (en) | 1993-10-08 |
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