JP3101669B2 - Surface treatment method - Google Patents
Surface treatment methodInfo
- Publication number
- JP3101669B2 JP3101669B2 JP03351552A JP35155291A JP3101669B2 JP 3101669 B2 JP3101669 B2 JP 3101669B2 JP 03351552 A JP03351552 A JP 03351552A JP 35155291 A JP35155291 A JP 35155291A JP 3101669 B2 JP3101669 B2 JP 3101669B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating film
- phosphorus
- layer
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、機械的強度、耐摩耗性
等が要求される部品の製造に好適に採用される表面処理
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment method suitably used for manufacturing parts requiring mechanical strength, wear resistance and the like.
【０００２】[0002]
【従来の技術】従来より、各種機械類などにおいて、耐
摩耗性、潤滑性等を付与する目的でニッケル又はニッケ
ル合金めっき皮膜中に複合材を共析させた複合めっき皮
膜、特に無電解ニッケルめっき皮膜中にポリテトラフル
オロエチレン（ＰＴＦＥ）等のフッ素樹脂粒子を共析さ
せた無電解Ｎｉ−Ｐ複合めっき皮膜を部品表面に形成す
ることが知られている。2. Description of the Related Art Conventionally, a composite plating film obtained by co-depositing a composite material in a nickel or nickel alloy plating film for the purpose of imparting abrasion resistance, lubricity, etc. in various machines and the like, especially electroless nickel plating It is known to form an electroless Ni-P composite plating film in which a fluororesin particle such as polytetrafluoroethylene (PTFE) is co-deposited on the surface of a component.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うなニッケル又はニッケル合金の複合めっき皮膜は、そ
の用途によっては密着性、硬度などの機械的強度の点で
不十分な場合がある。However, such a nickel or nickel alloy composite plating film may be insufficient in mechanical strength such as adhesion and hardness depending on its use.
【０００４】即ち、各種機械の鋼製摺動部材などには、
その表面硬度を高めるために浸炭又は浸炭窒化処理を施
すことがしばしば行われるが、この場合部材表面の浸炭
又は浸炭窒化層とニッケル又はニッケル合金複合めっき
皮膜との密着性が必ずしも十分ではなく、用途によって
は剥離等の不都合を生じる場合がある。In other words, steel sliding members of various machines include:
Carburizing or carbonitriding is often performed to increase the surface hardness, but in this case, the adhesion between the carburized or carbonitrided layer on the member surface and the nickel or nickel alloy composite plating film is not always sufficient, and In some cases, problems such as peeling may occur.
【０００５】また、ニッケル又はニッケル合金めっき皮
膜は、クロムめっき皮膜などに比べて硬度に劣るもので
ある。この場合、Ｎｉ−Ｐめっき皮膜は熱処理を行うこ
とにより、クロムめっき皮膜と同等の硬度を得ることが
可能であるが、複合材としてフッ素樹脂粒子を共析させ
た場合は、このフッ素樹脂粒子の融点が低いため高温で
熱処理することが困難である。A nickel or nickel alloy plating film is inferior in hardness to a chromium plating film or the like. In this case, it is possible to obtain the same hardness as the chromium plating film by performing the heat treatment on the Ni-P plating film. However, when the fluororesin particles are eutectoid as a composite material, Due to the low melting point, it is difficult to perform heat treatment at a high temperature.
【０００６】本発明は、上記事情に鑑みなされたもの
で、表面に浸炭又は浸炭窒化層を有する素材であって
も、十分な硬度及び耐摩耗性を有するめっき皮膜を密着
性よく形成することができる表面処理方法を提供するこ
とを目的とする。The present invention has been made in view of the above circumstances, and it is possible to form a plating film having sufficient hardness and abrasion resistance with good adhesion even with a material having a carburized or carbonitrided layer on its surface. An object of the present invention is to provide a surface treatment method that can be performed.
【０００７】[0007]
【課題を解決するための手段及び作用】本発明者は、上
記目的を達成するため鋭意検討を行った結果、素材表面
に複合材を含まないニッケル−リン合金めっき皮膜を形
成し、このニッケル−リン合金めっき皮膜を熱処理して
ニッケルの拡散による素材との密着性向上及びその硬度
の向上を図ると共に、熱処理後のニッケル−リン合金め
っき層上にフッ素樹脂粒子を共析させたニッケル又はニ
ッケル合金複合めっき皮膜を形成することにより、表面
に浸炭又は浸炭窒化層を有する素材であっても、十分な
機械的強度を有し、かつ耐摩耗性に優れためっき皮膜を
密着性よく形成し得ることを見出し、本発明を完成した
ものである。The present inventors have conducted intensive studies to achieve the above object, and as a result, formed a nickel-phosphorus alloy plating film containing no composite material on the surface of the material. Nickel or nickel alloy in which fluorine resin particles are eutectoidally deposited on the nickel-phosphorus alloy plating layer after heat treatment of the phosphorus alloy plating film to improve the adhesion to the material and the hardness by diffusion of nickel, and By forming a composite plating film, it is possible to form a plating film with sufficient mechanical strength and excellent wear resistance with good adhesion even if the material has a carburized or carbonitrided layer on the surface. To complete the present invention.
【０００８】即ち、上記方法によれば、下層のニッケル
−リン合金めっき皮膜が熱処理によって素材と良好に密
着すると共に、十分な高硬度化が図られ、この上にフッ
素樹脂粒子が共析したニッケル又はニッケル合金複合め
っき皮膜を形成することにより、下層のニッケル−リン
合金めっき皮膜とこのニッケル又はニッケル合金複合め
っき皮膜とは十分な密着性が得られるので、十分な密着
性を有するめっき皮膜が得られる。またこの場合、下層
のニッケル−リン合金めっき皮膜層が熱処理によって高
硬度化され、上層のニッケル又はニッケル合金複合めっ
き皮膜が下層の高硬度のニッケル−リン合金めっき皮膜
により支持されているので、めっき皮膜全体の硬度も顕
著に向上するものである。That is, according to the above-mentioned method, the nickel-phosphorus alloy plating film as the lower layer adheres well to the material by heat treatment, and achieves sufficiently high hardness. Alternatively, by forming a nickel alloy composite plating film, sufficient adhesion between the lower nickel-phosphorus alloy plating film and the nickel or nickel alloy composite plating film can be obtained, and a plating film having sufficient adhesion can be obtained. Can be In this case, the lower nickel-phosphorus alloy plating film is hardened by heat treatment, and the upper nickel or nickel alloy composite plating film is supported by the lower high-hardness nickel-phosphorus alloy plating film. The hardness of the entire coating is also significantly improved.
【０００９】従って、本発明は、素材表面にニッケル−
リン合金めっき皮膜を形成し、該ニッケル−リンめっき
皮膜を熱処理した後、この上にニッケル又はニッケル合
金めっき皮膜中にフッ素樹脂粒子が共析した複合めっき
皮膜を形成することを特徴とする表面処理方法を提供す
るものである。Accordingly, the present invention provides a method for producing nickel
Forming a phosphorus alloy plating film, heat-treating the nickel-phosphorus plating film, and then forming a composite plating film on the nickel or nickel alloy plating film in which fluororesin particles are eutectoid. It provides a method.
【００１０】以下、本発明について更に詳しく説明す
る。本発明のニッケルめっき皮膜の形成方法は、図１に
示したように、素材１の表面にニッケル−リン合金めっ
き皮膜層２を形成し、このニッケル−リン合金めっき皮
膜層２を熱処理した後、この上にフッ素樹脂粒子（図示
せず）が均一に共析したニッケル又はニッケル合金複合
めっき皮膜層３を形成するものである。なお、図中４は
ニッケル−リンの素材への拡散層である。Hereinafter, the present invention will be described in more detail. As shown in FIG. 1, the method for forming a nickel plating film according to the present invention comprises forming a nickel-phosphorus alloy plating film layer 2 on the surface of a raw material 1, heating the nickel-phosphorus alloy plating film layer 2, The nickel or nickel alloy composite plating film layer 3 on which fluororesin particles (not shown) are uniformly eutectoid is formed. In the figure, reference numeral 4 denotes a diffusion layer for nickel-phosphorus material.
【００１１】上記ニッケル−リン合金めっき皮膜層２の
形成は、電気めっき法で行っても無電解めっき法で行っ
てもよいが、均一な皮膜が得られることから無電解めっ
き法で形成することが好ましい。この場合、リンの含有
量は１〜１２重量％、特に３〜１０％とすることが好ま
しい。なお、このニッケルめっき皮膜層２の厚さは、特
に制限されるものではないが、２〜３０μｍ、特に５〜
２０μｍとすることが好ましく、２μｍ未満では良好な
密着性及び硬度を有するニッケル複合めっき皮膜が得ら
れない場合がある。The nickel-phosphorus alloy plating film layer 2 may be formed by an electroplating method or an electroless plating method. However, the nickel-phosphorus alloy plating film layer 2 is preferably formed by an electroless plating method since a uniform film can be obtained. Is preferred. In this case, the phosphorus content is preferably 1 to 12% by weight, particularly preferably 3 to 10%. The thickness of the nickel plating film layer 2 is not particularly limited, but is 2 to 30 μm, particularly 5 to 30 μm.
The thickness is preferably 20 μm, and if it is less than 2 μm, a nickel composite plating film having good adhesion and hardness may not be obtained.
【００１２】このニッケル−リン合金めっき皮膜２を熱
処理するときの条件は、特に限定されるものではない
が、処理温度１９０〜６００℃、特に２００〜４００℃
で、１０分〜３時間、通常６０分程度熱処理することが
好ましい。この場合、処理温度が１９０℃未満である
と、このニッケルめっき皮膜２と素材１との間に良好な
密着性が得られない場合がある。また、あまり高温であ
ると熱処理雰囲気が酸化性雰囲気の場合皮膜表面が酸化
されてしまい、ニッケル−リン合金めっき皮膜２とニッ
ケル又はニッケル合金複合めっき皮膜層３との間に良好
な密着性が得られない場合がある。The conditions for heat-treating the nickel-phosphorus alloy plating film 2 are not particularly limited, but the treatment temperature is 190-600 ° C., particularly 200-400 ° C.
The heat treatment is preferably performed for 10 minutes to 3 hours, usually about 60 minutes. In this case, if the processing temperature is lower than 190 ° C., good adhesion between the nickel plating film 2 and the material 1 may not be obtained. On the other hand, if the temperature is too high, if the heat treatment atmosphere is an oxidizing atmosphere, the film surface is oxidized, and good adhesion between the nickel-phosphorus alloy plating film 2 and the nickel or nickel alloy composite plating film layer 3 is obtained. May not be possible.
【００１３】この熱処理によってニッケルが素材１に拡
散してニッケル−リン合金めっき皮膜２の素材１に対す
る密着性が向上する。また、ニッケル−リン合金めっき
皮膜２の硬度も顕著に向上させることができる。この場
合、硬度はビッカース硬度Ｈｖとして５００〜１００
０、特に５５０〜８００となるように熱処理することが
好ましい。By this heat treatment, nickel diffuses into the material 1 and the adhesion of the nickel-phosphorus alloy plating film 2 to the material 1 is improved. Further, the hardness of the nickel-phosphorus alloy plating film 2 can be significantly improved. In this case, the hardness is 500 to 100 as Vickers hardness Hv.
Heat treatment is preferably performed so as to be 0, particularly 550 to 800.
【００１４】この熱処理後のニッケル−リン合金めっき
皮膜２上に形成するフッ素樹脂粒子が共析したニッケル
又はニッケル合金複合めっき皮膜層３の形成は、電気め
っき法で行っても無電解めっき法で行ってもよいが、皮
膜の均一性の点から無電解めっき法で行うことが好まし
く、特に無電解Ｎｉ−Ｐ／フッ素樹脂粒子複合めっき皮
膜とすることが好ましい。この場合、リンの含有量は１
〜１２重量％、特に３〜１０％とすることが好ましい。The nickel or nickel alloy composite plating layer 3 on which the fluororesin particles are formed on the nickel-phosphorus alloy plating layer 2 after the heat treatment can be formed by electroplating or electroless plating. Although it may be carried out, it is preferably carried out by an electroless plating method from the viewpoint of the uniformity of the film, and particularly preferably an electroless Ni-P / fluororesin particle composite plating film. In this case, the phosphorus content is 1
The content is preferably set to 12% by weight, particularly preferably 3〜１０10%.
【００１５】このニッケル又はニッケル合金複合めっき
皮膜層３の厚さは、特に制限されるものではないが、２
〜５０μｍ、特に５〜１０μｍとすることが好ましく、
このニッケル又はニッケル合金複合めっき皮膜層３の厚
さが２μｍ未満であると、十分な耐摩耗性、潤滑性が得
られない場合がある。The thickness of the nickel or nickel alloy composite plating layer 3 is not particularly limited.
To 50 μm, particularly preferably 5 to 10 μm,
If the thickness of the nickel or nickel alloy composite plating film layer 3 is less than 2 μm, sufficient wear resistance and lubricity may not be obtained.
【００１６】ここで、このニッケル又はニッケル合金複
合めっき皮膜層３中に共析させるフッ素樹脂粒子として
は、ポリテトラフルオロエチレン（ＰＴＦＥ）、テトラ
フルオロエチレン／ヘキサフルオロプロピレン共重合体
（ＦＥＰ）、テトラフルオロエチレン／パーフルオロア
ルキルビニルエーテル共重合体（ＰＦＡ）などの粒子が
挙げられ、これらの１種又は２種以上を用いることがで
きる。これらフッ素樹脂粒子の共析量は、特に制限され
るものではないが、２〜１０重量％、特に３〜９重量％
とすることが好ましく、フッ素樹脂粒子共析量が２重量
％未満であると、良好な耐摩耗性、潤滑性が得られない
場合があり、一方１０重量％を超えると、皮膜の硬度が
低下する場合がある。The fluororesin particles to be codeposited in the nickel or nickel alloy composite plating film layer 3 include polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), Particles such as a fluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA) can be mentioned, and one or more of these can be used. The amount of eutectoid of these fluororesin particles is not particularly limited, but is 2 to 10% by weight, particularly 3 to 9% by weight.
When the eutectoid content of the fluororesin particles is less than 2% by weight, good abrasion resistance and lubricity may not be obtained. On the other hand, when the amount exceeds 10% by weight, the hardness of the film decreases. May be.
【００１７】なお、このニッケル又はニッケル合金複合
めっき皮膜層３には、上記フッ素樹脂粒子と共に、フッ
化黒鉛、炭化珪素、セラミック、窒化金属、金属酸化物
などの粒子や繊維を共析させることもできる。また、ニ
ッケル又はニッケル合金複合めっき皮膜層３を形成した
後、特にＮｉ−Ｐ複合めっき皮膜の場合は、これを熱処
理することも可能であるが、この場合フッ素樹脂粒子の
融点が低いので、２００〜３５０℃、特に２５０〜３２
０℃程度の比較的低い温度で０．５〜３時間、特に０．
５〜１時間熱処理することが好ましい。The nickel or nickel alloy composite plating layer 3 may be co-deposited with particles of the fluorinated graphite, silicon carbide, ceramic, metal nitride, metal oxide or the like together with the fluororesin particles. it can. After the nickel or nickel alloy composite plating film layer 3 is formed, it is also possible to heat-treat the Ni-P composite plating film, especially in the case of a Ni-P composite plating film. ~ 350 ° C, especially 250 ~ 32
0.5 to 3 hours at a relatively low temperature of about 0 ° C., especially 0.1 to 3 hours.
The heat treatment is preferably performed for 5 to 1 hour.
【００１８】なおまた、上記ニッケル−リン合金めっき
皮膜層２及びニッケル又はニッケル合金複合めっき層３
を形成するめっき浴及びめっき条件は、ニッケル−リン
合金めっきやニッケル又はニッケル合金複合めっきを行
う場合の通常のめっき浴及び条件とすることができる。The nickel-phosphorus alloy plating layer 2 and the nickel or nickel alloy composite plating layer 3
Can be the usual plating baths and conditions for nickel-phosphorus alloy plating or nickel or nickel alloy composite plating.
【００１９】[0019]
【実施例】以下、実施例を示して本発明を具体的に説明
するが、本発明は下記実施例に制限されるものではな
い。表面に浸炭窒化層が形成されたスチール製の素材を
市販の無電解ニッケル−リンめっき液（上村工業（株）
社製ニムデンＳＸ）に浸漬して、その素材表面に厚さ１
０μｍ、リン含有量９％の無電解Ｎｉ−Ｐめっき皮膜を
形成した後、素材ごと加熱炉内に収容し、大気雰囲気
中、３００℃で６０分熱処理した。EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to the following examples. Commercially available electroless nickel-phosphorous plating solution (Uemura Kogyo Co., Ltd.)
Dipped in Nimden SX) and a thickness of 1
After forming an electroless Ni-P plating film having a thickness of 0 μm and a phosphorus content of 9%, the raw materials were placed in a heating furnace and heat-treated at 300 ° C. for 60 minutes in an air atmosphere.
【００２０】この素材を更に市販の無電解ニッケル−リ
ン／フッ素樹脂複合めっき液（上村工業（株）社製ニム
フロン）に浸漬して、上記無電解Ｎｉ−Ｐめっき皮膜上
に厚さ１０μｍ、リン含有量９％、フッ素樹脂粒子（Ｐ
ＴＦＥ）共析量約７重量％の無電解Ｎｉ−Ｐ／ＰＴＦＥ
複合めっき皮膜を形成した後、再び加熱炉内に仕込ん
で、大気雰囲気中、３００℃で６０分間熱処理した。This material is further immersed in a commercially available electroless nickel-phosphorus / fluorine resin composite plating solution (Nimflon manufactured by Uemura Kogyo Co., Ltd.), and a 10 μm thick phosphorous film is formed on the electroless Ni-P plating film. Content of 9%, fluororesin particles (P
TFE) Electroless Ni-P / PTFE with eutectoid amount of about 7% by weight
After forming the composite plating film, it was again charged in a heating furnace and heat-treated at 300 ° C. for 60 minutes in the air atmosphere.
【００２１】得られた無電解Ｎｉ−Ｐ／ＰＴＦＥめっき
皮膜の素材との密着性を下記方法により評価したとこ
ろ、素材表面に直接無電解Ｎｉ−Ｐ／ＰＴＦＥめっき皮
膜を形成した場合に比べて極めて良好な密着性を有する
ことが確認された。また、下記方法により、皮膜全体の
ビッカース硬度を評価したところ、直接無電解Ｎｉ−Ｐ
／ＰＴＦＥめっき皮膜を形成した従来のものに比べてＨ
ｖ３００のものが約Ｈｖ６５０にまで向上することが確
認された。When the adhesion of the obtained electroless Ni-P / PTFE plating film to the material was evaluated by the following method, the adhesion was much higher than when the electroless Ni-P / PTFE plating film was formed directly on the material surface. It was confirmed that it had good adhesion. In addition, when the Vickers hardness of the entire coating was evaluated by the following method, the direct electroless Ni-P
/ PTFE compared to the conventional one with a PTFE plating film formed
It was confirmed that v300 improved to about Hv650.
【００２２】密着性評価方法 ＪＩＳ Ｈ８６１５に準じる折り曲げ試験ビッカース硬度評価方法 ＪＩＳ Ｈ８６１５に準じる微小硬度測定試験 荷重 ５０ｇ、荷重保持時間 １５秒 Adhesion evaluation method Bending test according to JIS H8615 Vickers hardness evaluation method Microhardness measurement test according to JIS H8615 Load 50 g, load holding time 15 seconds
【００２３】[0023]
【発明の効果】以上説明したように、本発明の表面処理
方法によれば、素材の表面に機械的強度が高く、耐摩耗
性に優れためっき皮膜を密着性よく形成することができ
る。As described above, according to the surface treatment method of the present invention, a plating film having high mechanical strength and excellent wear resistance can be formed on the surface of a material with good adhesion.
【図１】本発明の表面処理方法により得られためっき皮
膜を示す断面図である。FIG. 1 is a sectional view showing a plating film obtained by a surface treatment method of the present invention.
１ 素材 ２ ニッケル−リン合金めっき皮膜 ３ ニッケル又はニッケル合金複合めっき皮膜 ４ ニッケル−リン／素材拡散層 Reference Signs List 1 material 2 nickel-phosphorus alloy plating film 3 nickel or nickel alloy composite plating film 4 nickel-phosphorus / material diffusion layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡田 益雄 大阪府守口市梶町３丁目35番23号 株式 会社サミックス内 (72)発明者 松波 秀明 大阪府守口市梶町３丁目35番23号 株式 会社サミックス内 (72)発明者 綾目 正彦 大阪府守口市梶町３丁目35番23号 株式 会社サミックス内 (56)参考文献 特開 平３−68778（ＪＰ，Ａ) 特開 平４−9499（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 18/00 - 18/54 C25D 15/02 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Masuda Okada 3-35-23, Kaji-cho, Moriguchi-shi, Osaka Co., Ltd. Within the company (72) Inventor Hideaki Matsunami 3-35-23, Kaji-cho, Moriguchi-shi, Osaka (72) Inventor Masahiko Ayame 3-35-23, Kaji-cho, Moriguchi-shi, Osaka Co., Ltd. (56) References JP-A-3-68778 (JP, A) JP-A-4-9499 ( JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C23C 18/00-18/54 C25D 15/02
Claims (1)
膜を形成し、該ニッケル−リンめっき皮膜を熱処理した
後、この上にニッケル又はニッケル合金めっき皮膜中に
フッ素樹脂粒子が共析した複合めっき皮膜を形成するこ
とを特徴とする表面処理方法。1. A composite plating film comprising a nickel-phosphorous alloy plating film formed on the surface of a material, a heat treatment of the nickel-phosphorous plating film, and a nickel or nickel alloy plating film on which a fluororesin particle is eutectoidally deposited. A surface treatment method characterized by forming:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03351552A JP3101669B2 (en) | 1991-12-12 | 1991-12-12 | Surface treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03351552A JP3101669B2 (en) | 1991-12-12 | 1991-12-12 | Surface treatment method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05163582A JPH05163582A (en) | 1993-06-29 |
| JP3101669B2 true JP3101669B2 (en) | 2000-10-23 |
Family
ID=18418056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03351552A Expired - Fee Related JP3101669B2 (en) | 1991-12-12 | 1991-12-12 | Surface treatment method |
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| Country | Link |
|---|---|
| JP (1) | JP3101669B2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1128207A3 (en) | 2000-02-21 | 2001-10-10 | Fuji Photo Film Co., Ltd. | Method of and apparatus for manufacturing instant photographic film units |
| GB0215916D0 (en) * | 2002-07-10 | 2002-08-21 | Univ Dundee | Coatings |
| US7302211B2 (en) | 2004-09-17 | 2007-11-27 | Sharp Kabushiki Kaisha | Charging apparatus and image forming apparatus with plated electrode |
| JP4511317B2 (en) * | 2004-11-09 | 2010-07-28 | Ｎｔｎ株式会社 | Resin bearing parts and manufacturing method thereof |
| JP4504325B2 (en) * | 2006-03-20 | 2010-07-14 | シャープ株式会社 | Method for manufacturing charging device and image forming apparatus |
| JP4493616B2 (en) * | 2006-03-20 | 2010-06-30 | シャープ株式会社 | Charging device, manufacturing method thereof, and image forming apparatus |
| US7729639B2 (en) | 2006-03-20 | 2010-06-01 | Sharp Kabushiki Kaisha | Charging apparatus and image forming apparatus |
| JP4522464B2 (en) * | 2008-04-22 | 2010-08-11 | シャープ株式会社 | Charging device and image forming apparatus |
| AT511572B1 (en) * | 2011-06-01 | 2013-02-15 | Ke Kelit Kunststoffwerk Gmbh | COATING INCLUDING NI-P-PTFE IN COMBINATION WITH A POLYMERIC POLYMER |
| CN106958013A (en) * | 2017-03-24 | 2017-07-18 | 东北电力大学 | A kind of Electroless Plating Ni P PTFE composite deposite preparation technologies |
| DE102017222289A1 (en) * | 2017-12-08 | 2019-06-13 | Robert Bosch Gmbh | electric motor |
| JP7135488B2 (en) * | 2018-06-20 | 2022-09-13 | 日本製鉄株式会社 | Press mold for titanium plate and press molding method for titanium plate |
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1991
- 1991-12-12 JP JP03351552A patent/JP3101669B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| JPH05163582A (en) | 1993-06-29 |
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