JP3096512B2 - Surface mount type piezoelectric oscillator - Google Patents
Surface mount type piezoelectric oscillatorInfo
- Publication number
- JP3096512B2 JP3096512B2 JP03359405A JP35940591A JP3096512B2 JP 3096512 B2 JP3096512 B2 JP 3096512B2 JP 03359405 A JP03359405 A JP 03359405A JP 35940591 A JP35940591 A JP 35940591A JP 3096512 B2 JP3096512 B2 JP 3096512B2
- Authority
- JP
- Japan
- Prior art keywords
- bottom member
- terminal
- mount type
- molding material
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装型の圧電発振
器に係わり、特に容器の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type piezoelectric oscillator, and more particularly to an improvement of a container.
【０００２】[0002]
【従来の技術】近時、種々の電子機器では周波数、時間
等の基準として圧電振動子、特に周波数の精度、安定度
に特出した性能を有し、そのわりに価格の安価な水晶振
動子が多用されている。そして水晶振動子を用いる電子
機器では、形状の小型化、高信頼性を達成し、高精度の
周波数を維持するために形状の小型の水晶振動子と半導
体集積回路からなる発振回路を一体に容器に収納した水
晶発振器が大量に製造され使用されている。従来のこの
種の水晶発振器では、たとえばセラミック等の絶縁基板
からなるベースに半導体集積回路からなる発振回路およ
び電極を形成した裸の水晶片を配設し、これらにカバー
をかぶせて真空中で気密に封止するようにしている。こ
のようにすれば水晶片の板面に形成した電極を外気から
遮蔽できるので、容器内を化学的、物理的に長期間、安
定な状態に保つことができ、それによって発振周波数を
長期間、高精度に維持することができる。しかしながら
このような圧電発振器は,発振器から導出したリード線
をプリント基板の板面に形成した導電パターンに半田付
けすることによって、たとえばプリント基板の所定の部
位へ実装するものである。一方、最近の電子機器では、
特に形状が小型で軽量であることが望まれ、また、組立
工程を極力、自動化するための努力がなされている。こ
のためトランジスタ、ＩＣ等の能動素子、抵抗、コンデ
ンサ等の受動素子も表面実装型のものが多用されてい
る。この種の表面実装型の素子は形状も小型にでき、パ
ーツフィーダ等を用いてプリント基板の所定の位置に自
動的に配設することができる。したがってプリント基板
に、全ての部品を配設した後にリフロー炉等を通過させ
て各部品の端子に塗着した半田を溶融して実装すること
により、ほとんど人手を介在させることなく電子機器の
組立を行うことができ著しく生産性を高めることができ
る。このため、水晶発振器も従来多用されている金属容
器に収納してリード端子を導出したものよりも、形状が
小型でしかもリード端子のない表面実装型のものが望ま
れている。2. Description of the Related Art In recent years, various types of electronic devices use piezoelectric vibrators as a standard for frequency, time, and the like, and in particular, have low-cost quartz vibrators, which have special performance in frequency accuracy and stability. It is heavily used. In the case of electronic devices that use crystal oscillators, in order to achieve small size, high reliability, and maintain a high-precision frequency, an oscillation circuit consisting of a small crystal oscillator and a semiconductor integrated circuit is integrated into a container. A large number of crystal oscillators are manufactured and used. In this type of conventional crystal oscillator, for example, an oscillating circuit consisting of a semiconductor integrated circuit and a bare crystal piece on which electrodes are formed are arranged on a base made of an insulating substrate such as ceramics, and these are covered with a cover and hermetically sealed in a vacuum. To be sealed. In this way, the electrodes formed on the plate surface of the crystal blank can be shielded from the outside air, so that the inside of the container can be kept chemically and physically stable for a long period of time, thereby increasing the oscillation frequency for a long period of time. High accuracy can be maintained. However, such a piezoelectric oscillator is mounted on, for example, a predetermined portion of a printed circuit board by soldering a lead wire derived from the oscillator to a conductive pattern formed on a plate surface of the printed circuit board. On the other hand, in recent electronic devices,
Particularly, it is desired that the shape is small and lightweight, and efforts have been made to automate the assembly process as much as possible. For this reason, active elements such as transistors and ICs and passive elements such as resistors and capacitors are also often used in a surface mount type. This type of surface mount type device can be made small in size and can be automatically arranged at a predetermined position on a printed circuit board using a parts feeder or the like. Therefore, after arranging all components on the printed circuit board, the solder applied to the terminals of each component is melted and mounted by passing through a reflow furnace or the like, and assembling of the electronic device can be performed with almost no manual intervention. Can significantly increase productivity. For this reason, a surface mount type crystal oscillator having a smaller size and no lead terminal is desired as compared with a crystal oscillator which is housed in a metal container which has been widely used and a lead terminal is led out.
【０００３】図４は従来の表面実装型の水晶発振器の一
部を切欠して示す側面図である。図中１はセラミック等
の絶縁材からなる基板である。この基板１の板面にはエ
ッチング等で所定の形状の導電パターンを形成し、ここ
に半導体集積回路、水晶振動子等の電子部品２を実装し
て発振回路を構成するようにしている。そして上記基板
１の板面を貫通して端子３を植設して上記導電パターン
に接続し、該端子３を介して外部との電気的接続を図る
ようにしている。また、金属薄板をプレス加工して成形
したカバー４の開口縁部に上記基板１の周縁を半田付け
で固着して保持するようにしている。そして、たとえば
幅の狭い金属薄板を端子３に用い、この基端部を上記基
板１の所定の位置に固着して導電パターンに接続し、先
端部を所定の部位から直角に折り曲げてプリント基板に
実装する実装面３ａとし、この部分に半田メッキ等を施
して図示しないプリント基板等に半田付けすることによ
って表面実装を行うようにしている。しかしてこのよう
な表面実装型の電子部品では電磁誘導による障害（以下
ＥＭＩと称す）防護の観点からは全周を磁性体の金属で
囲むことが望ましく、たとえば図４に示すような圧電発
振器では下面、すなわち実装したプリント基板の板面側
からの電磁誘導に対して無防備である。また基板の下面
の空間は端子の導出のために使用されるだけでほとんど
は未利用のデットスペースになるために全体の形状を小
型化するためには好ましくない。さらに、この種の圧電
発振器は自動組立器を用いて組立を行なうことができる
ように設計する必要があり、一般的にはベースとなる部
材の上に各部材を積み上げる組立方法が好ましい。FIG. 4 is a side view, partially cut away, showing a conventional surface mount type crystal oscillator. In the figure, reference numeral 1 denotes a substrate made of an insulating material such as ceramic. A conductive pattern of a predetermined shape is formed on the plate surface of the substrate 1 by etching or the like, and an electronic component 2 such as a semiconductor integrated circuit and a crystal oscillator is mounted thereon to form an oscillation circuit. A terminal 3 is implanted through the surface of the substrate 1 and is connected to the conductive pattern so as to establish an electrical connection with the outside via the terminal 3. The peripheral edge of the substrate 1 is fixed to the opening edge of the cover 4 formed by pressing a thin metal plate by soldering and held. Then, for example, a thin metal plate having a small width is used for the terminal 3, this base end is fixed to a predetermined position of the substrate 1, connected to the conductive pattern, and the front end is bent at a right angle from a predetermined portion to form a printed circuit board. The mounting surface 3a to be mounted is formed, and the surface mounting is performed by applying a solder plating or the like to this portion and soldering it to a printed board (not shown). Thus, in such a surface mount type electronic component, it is desirable to surround the entire circumference with a magnetic metal from the viewpoint of protection from interference (hereinafter referred to as EMI) due to electromagnetic induction. For example, in a piezoelectric oscillator as shown in FIG. It is defenseless against electromagnetic induction from the lower surface, that is, from the surface of the mounted printed circuit board. In addition, the space on the lower surface of the substrate is used only for lead-out of terminals, and is mostly unused dead space, which is not preferable for reducing the overall shape. Further, it is necessary to design this kind of piezoelectric oscillator so that assembly can be performed using an automatic assembler. In general, an assembly method in which each member is stacked on a base member is preferable.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、ＥＭＩに対
して良好な耐性を得られ、全体の形状の小型化が可能
で、しかも自動組立に適した表面実装型の圧電発振器を
提供することを目的とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a surface mount type piezoelectric oscillator which can obtain good EMI resistance, can be reduced in size as a whole, and is suitable for automatic assembly. It is intended for.
【０００５】[0005]
【課題を解決するための手段】本発明は、中央部分を底
部として底部の周辺部分を底部に対して直角に折り曲げ
て側部を形成して上面に開口を設けるとともにこの周辺
部分の複数箇所を切り残して底部の板面方向に延出する
複数の端子を形成した金属薄板からなる底部材と、この
底部材の上記端子部にモールドされて底部材から切り離
した端子部を底部材から絶縁して保持するモールド材
と、このモールド材に載置して外部に接続すべき回路を
上記端子部を介して導出され圧電共振子および電子部品
からなる発振回路を実装した絶縁基板と、上記底部材の
開口を閉鎖する金属薄板からなる蓋部材とを具備するこ
とを特徴とするものである。SUMMARY OF THE INVENTION According to the present invention, a central portion is formed as a bottom portion and a peripheral portion of the bottom portion is bent at a right angle to the bottom portion to form a side portion, an opening is provided in an upper surface, and a plurality of portions of the peripheral portion are formed. A bottom member made of a thin metal plate formed with a plurality of terminals extending in the direction of the bottom plate surface, and a terminal portion molded to the terminal portion of the bottom member and separated from the bottom member is insulated from the bottom member. A molding material to be held and held, an insulating substrate having a circuit to be mounted on the molding material and connected to the outside, derived through the terminal portion and mounting an oscillation circuit including a piezoelectric resonator and electronic components, and the bottom member And a lid member made of a thin metal plate for closing the opening.
【０００６】[0006]
【実施例】以下、本発明の一実施例を図１に示す組立斜
視図、図２に示す平面図および図３に示す側面図を参照
して詳細に説明する。図中１１は金属薄板をたとえばプ
レス加工等で成形した底部材で、中央部分の略直方形の
底部１２と、この底部１２の周辺部分から底部１２に対
して直角に折り曲げて一定の高さに立ち上がる側部１３
およびこの周辺部分の複数箇所を切り残して底部の板面
方向へ延出する複数の端子部１４を形成し、上面に開口
を設けている。そして端子部１４はその基端を底部１２
に幅狭の連結部１５を介して連結している。そして１６
は蓋部材で底部材と同様に、たとえば磁性体からなる金
属薄板をプレス加工等で成形し、上記底部材１１の上面
の開口に対応する略直方体の蓋部１７と、この蓋部１５
の外周から立ち下がる側部１８を設けている。そして底
部材１１の側部１３の外壁面と蓋部材１４の側部１６の
内壁面とを互いに嵌合させて容器を形成するようにして
いる。そして、底部材１１の上記端子部１４に、たとえ
ばエポキシ樹脂系のモールド材１９をモールドして、該
モールド材１９を底部材１１に固着させるとともに端子
部１４を底部材１１に保持する。なお端子部１４の基端
は、たとえば下面から突き上げることによって連結部１
５を底部１２から機械的、電気的に切り離し、かつモー
ルド材１９の内側壁に沿って上方へ折り曲げてモールド
材１９の上端部へ延在させるように成形する。そして、
セラミック、ガラスエポキシ等の絶縁基板２０の板面に
所定の形状の導電パターンを形成し、ここにＩＣ（集積
回路）、抵抗、コンデンサ等の電子部品および小型容器
に気密に封止した水晶振動子を実装して発振回路を構成
するようにしている。そしてこの絶縁基板２０の縁部を
上記モールド材１９に載置して、かつ所定の回路をこの
縁部へ導出して、モールド材１９の上端部へ延在する端
子部１４の基端に導電性接着剤、半田等で固着するとと
もに電気的な導通を図るようにしている。そして底部材
１１に蓋部材１６をかぶせて互いに固着して封止する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail below with reference to an assembly perspective view shown in FIG. 1, a plan view shown in FIG. 2, and a side view shown in FIG. In the drawing, reference numeral 11 denotes a bottom member formed by pressing a thin metal plate by, for example, press working, and the like. Standing side 13
Also, a plurality of terminal portions 14 extending in the direction of the bottom plate surface are formed by leaving a plurality of portions of the peripheral portion uncut, and an opening is provided on the upper surface. The terminal 14 is connected to the bottom 12
Through a narrow connecting portion 15. And 16
In the same manner as the bottom member, a thin metal plate made of, for example, a magnetic material is formed by pressing or the like, and a substantially rectangular parallelepiped lid portion 17 corresponding to the opening on the upper surface of the bottom member 11 is formed.
Is provided from the outer periphery of the side. The outer wall surface of the side portion 13 of the bottom member 11 and the inner wall surface of the side portion 16 of the lid member 14 are fitted to each other to form a container. Then, for example, an epoxy resin-based molding material 19 is molded on the terminal portion 14 of the bottom member 11, the molding material 19 is fixed to the bottom member 11, and the terminal portion 14 is held on the bottom member 11. Note that the base end of the terminal portion 14 is pushed up from, for example, the lower surface thereof so that
5 is mechanically and electrically separated from the bottom 12 and is bent upward along the inner wall of the molding material 19 so as to extend to the upper end of the molding material 19. And
A quartz oscillator that has a conductive pattern of a predetermined shape formed on a surface of an insulating substrate 20 made of ceramic, glass epoxy, or the like, and is hermetically sealed in electronic components such as ICs (integrated circuits), resistors, capacitors, and small containers. To form an oscillation circuit. Then, the edge of the insulating substrate 20 is placed on the molding material 19, and a predetermined circuit is led out to the edge, and the base of the terminal portion 14 extending to the upper end of the molding material 19 is electrically connected to the base. They are fixed with a conductive adhesive, solder, or the like, and are electrically connected. Then, the cover member 16 is put on the bottom member 11 and fixed to each other and sealed.
【０００７】このような構成であれば、発振回路を実装
した絶縁基板２０は外周を金属薄板からなる底部材１１
および蓋部材１６で囲まれるために外部からの電磁的な
誘導に対する耐性を向上することができる。そして底部
材１１および蓋部材１６からなる容器の上下面は金属薄
板からなるために、たとえばセラミック等の絶縁材をベ
ースとして用いた容器に比して厚みを薄くすることがで
きる。たとえば、ごく小型の圧電発振器の場合、セラミ
ック製のベースを用いた場合にその厚みは少なくとも１
ｍｍ程度になるが、これに金属薄板を用いた場合は０．
２ｍｍ程度まで少なくすることができ形状の小型化を図
ることができる。また端子１４を保持するモールド材１
９によって発振回路を実装した絶縁基板２０を担持する
ようにしているので、該絶縁基板２０を安定に保持する
ことができ電気的な特性の安定化を図ることができる。
さらに底部材１１の端子１４をモールド材１９をモール
ドし、このモールド材１９に発振回路を実装した絶縁基
板２０を載置して上記端子１４に接続し、さらに底部材
１１の外側に蓋部材１６を嵌装して封止するようにして
いる。したがって各部材を順次に積み上げて組み立てる
ようにしているので組立工程の自動化に適し、安価に大
量生産を行うことが可能である。With such a configuration, the insulating substrate 20 on which the oscillation circuit is mounted has the outer periphery formed of a thin metal plate on the bottom member 11.
In addition, since it is surrounded by the lid member 16, resistance to electromagnetic induction from the outside can be improved. Since the upper and lower surfaces of the container including the bottom member 11 and the lid member 16 are made of a thin metal plate, the thickness can be reduced as compared with a container using an insulating material such as ceramic as a base. For example, in the case of a very small piezoelectric oscillator, when using a ceramic base, the thickness is at least one.
However, when a thin metal plate is used for this, the thickness is about 0.1 mm.
The size can be reduced to about 2 mm, and the size can be reduced. Mold material 1 for holding terminals 14
9 supports the insulating substrate 20 on which the oscillation circuit is mounted, so that the insulating substrate 20 can be stably held and electrical characteristics can be stabilized.
Further, the terminal 14 of the bottom member 11 is molded with a molding material 19, an insulating substrate 20 on which an oscillation circuit is mounted is mounted on the molding material 19, and connected to the terminal 14. Is fitted and sealed. Therefore, since each member is sequentially stacked and assembled, it is suitable for automation of the assembly process, and mass production can be performed at low cost.
【０００８】[0008]
【発明の効果】以上詳述したように本発明によれば、全
体の形状の小型化が可能で、特に自動組立に適し、しか
もＥＭＩに対する耐性も優れた表面実装型の圧電発振器
を提供することができる。As described above in detail, according to the present invention, there is provided a surface mount type piezoelectric oscillator which can be reduced in size as a whole, is particularly suitable for automatic assembly, and has excellent EMI resistance. Can be.
【０００９】[0009]
【図１】本発明の一実施例を示す組立斜視図である。FIG. 1 is an assembled perspective view showing one embodiment of the present invention.
【図２】図１に示す実施例の底部材の平面図である。FIG. 2 is a plan view of a bottom member of the embodiment shown in FIG.
【図３】図１に示す実施例の底部材の側断面図である。FIG. 3 is a side sectional view of a bottom member of the embodiment shown in FIG. 1;
【図４】従来の表面実装型の水晶発振器の一例を示す側
面図である。FIG. 4 is a side view showing an example of a conventional surface mount type crystal oscillator.
１１ 底部材 １２ 底部 １３ 側部 １４ 端子 １５ 連結部 １６ 蓋部材 １９ モールド材 ２０ 絶縁基板 DESCRIPTION OF SYMBOLS 11 Bottom member 12 Bottom part 13 Side part 14 Terminal 15 Connecting part 16 Lid member 19 Molding material 20 Insulating substrate
Claims (1)
部に対して直角に折り曲げて側部を形成して上面に開口
を設けるとともにこの周辺部分の複数箇所を切り残して
底部の板面方向へ延出する複数の端子部を形成した金属
薄板からなる底部材と、 この底部材の上記端子部にモールドされて底部材から切
り離した端子部を底部材から絶縁して保持するモールド
材と、 このモールド材に載置して外部に接続すべき回路を上記
端子部を介して導出され圧電共振子および電子部品から
なる発振回路を実装した絶縁基板と、 上記底部材の開口を閉鎖する金属薄板からなる蓋部材
と、 を具備することを特徴とする表面実装型の圧電発振器。1. A bottom portion having a central portion serving as a bottom portion, a peripheral portion of the bottom portion is bent at a right angle to the bottom portion to form a side portion, an opening is provided in an upper surface, and a plurality of portions of the peripheral portion are left uncut to leave a bottom surface direction. A bottom member formed of a thin metal plate having a plurality of terminal portions extending to the bottom member, and a molding material that is molded to the terminal portion of the bottom member and insulates and holds the terminal portion separated from the bottom member from the bottom member; An insulating substrate on which an oscillation circuit composed of a piezoelectric resonator and an electronic component is derived via a terminal portion and a circuit to be mounted on the molding material and connected to the outside is mounted via the terminal portion; and a thin metal plate for closing an opening of the bottom member. A surface-mount type piezoelectric oscillator comprising: a lid member comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03359405A JP3096512B2 (en) | 1991-12-30 | 1991-12-30 | Surface mount type piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03359405A JP3096512B2 (en) | 1991-12-30 | 1991-12-30 | Surface mount type piezoelectric oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05183339A JPH05183339A (en) | 1993-07-23 |
| JP3096512B2 true JP3096512B2 (en) | 2000-10-10 |
Family
ID=18464343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03359405A Expired - Fee Related JP3096512B2 (en) | 1991-12-30 | 1991-12-30 | Surface mount type piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3096512B2 (en) |
-
1991
- 1991-12-30 JP JP03359405A patent/JP3096512B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05183339A (en) | 1993-07-23 |
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